Additive manufacturing lattice-shaped laminated structure chip radiator

Abstract

The invention discloses an additive manufacturing lattice laminated structure chip radiator, and relates to the technical field of electronic component heat dissipation, and the radiator comprises a heat dissipation substrate which is arranged at the bottommost part of the radiator and is in contact with a heating chip; the heat conduction plate is arranged above the heat dissipation substrate; the lattice area is arranged above the heat dissipation substrate and / or the heat conduction plate; the heat pipe group is embedded into the cavities in the heat dissipation substrate and the heat conduction plate and is fixed through brazing; the heat dissipation substrate, the heat conduction plate and the lattice area are of an alloy additive manufacturing integrally-formed structure. The technical problems that an existing radiator is insufficient in heat dissipation area, large in heat resistance, high in overall weight and difficult to meet the requirements of a high-power chip for efficient and light-weight heat dissipation due to the fact that the machining mode is limited are solved, the integrated lattice laminated structure is formed through additive manufacturing, the heat pipe heat conduction and the wall thickness gradual change design are combined, and the heat dissipation efficiency is improved. The technical effects that efficient heat transfer is achieved, the heat dissipation intensity is enhanced, and the lightweight requirement is met are achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic component heat dissipation, and particularly relates to a chip heat sink with a lattice-shaped laminated structure manufactured by additive manufacturing. BACKGROUND

[0002] With the continuous increase of chip power consumption and integration, the heat generated by the chip during operation increases sharply. In order to ensure the stability and service life of the chip, efficient heat dissipation devices must be relied on to dissipate heat in time. At present, common chip heat sinks mainly include two types of continuous die splicing heat sinks and CNC machining heat sinks.

[0003] Among them, the continuous die splicing heat sink is usually formed by splicing aluminum sheets, and holes are opened on the heat dissipation base to pass through the heat pipe, and are fixed by tight fitting or brazing. This type of heat sink has certain heat dissipation efficiency, but due to the need for continuous stamping die processing, the manufacturing order quantity requirement is high, resulting in high cost; at the same time, the thickness of the spliced metal sheet is thin, and the structural strength is insufficient, which is easily deformed in the process of use due to collision or handling, limiting the actual application range.

[0004] Another type of heat sink is a CNC machining heat sink, which forms straight teeth, louver or needle rib fin structures on aluminum or copper blanks by mechanical processing, and brazes heat pipes or heat plates at the base position to achieve temperature equalization. Although this type of heat sink has good heat dissipation performance and structural strength, the thickness, density and height of the fins are limited due to the limited processing method, resulting in insufficient overall air contact area; in addition, even if the heat pipe or heat plate is welded at the bottom, there is still a large thermal resistance in the process of heat transfer from the base to the top of the fin, which limits the further improvement of the heat dissipation capacity. At the same time, the overall weight of the CNC machining heat sink is large, which is not conducive to use in space and weight limited occasions.

[0005] In summary, the existing heat sink has deficiencies in structural complexity, manufacturing cost, heat transfer efficiency and lightweight. SUMMARY

[0006] The present application provides a chip heat sink with a lattice-shaped laminated structure manufactured by additive manufacturing, which is used to solve the technical problem that the existing heat sink has insufficient heat dissipation area, large thermal resistance and high overall weight due to the limited processing method, which makes it difficult to meet the demand of high-power chips for efficient and lightweight heat dissipation.

[0007] The application provides a lattice-shaped stacked structure chip radiator manufactured by additive manufacturing, comprising: a heat dissipation base arranged at the bottom of the radiator and in contact with a heat-generating chip; a heat conduction plate arranged above the heat dissipation base; a lattice area arranged above the heat dissipation base and / or the heat conduction plate for heat dissipation through convection with cooling fluid; and a heat pipe group embedded in the cavity of the heat dissipation base and the heat conduction plate and fixed by brazing; wherein the heat dissipation base, the heat conduction plate and the lattice area are integrally formed by alloy additive manufacturing.

[0008] Preferably, the heat conduction plate and the lattice area are alternately stacked to form a multi-layer tower structure.

[0009] Preferably, the multi-layer tower structure can be stacked to a maximum of four layers according to the heat generation.

[0010] Preferably, the heat pipe group is connected downward to the heat dissipation base from four sides of the radiator.

[0011] Preferably, the heat pipe group is a U-shaped bending structure, having a bending section with a circular cross section in the middle and a first flat section and a second flat section with rectangular cross sections at both ends.

[0012] Preferably, the cross-sectional dimensions of the first flat section and the second flat section match the corresponding mounting interfaces of the heat dissipation base and the heat conduction plate.

[0013] Preferably, the heat dissipation base is a rectangular structure with four corners having four through holes for fixation, and a recess for embedding the heat pipe group is processed at the bottom, and the heat pipe directly contacts the heat-generating chip through the recess to absorb heat.

[0014] Preferably, the heat conduction plate is a cross-shaped flat plate structure, and a plurality of straight cavities with rectangular cross sections are arranged in one direction for inserting the flattened heat pipe.

[0015] Preferably, the lattice area is a periodic additive manufacturing structure.

[0016] Preferably, the thickness of the adjacent lattice walls of the lattice area gradually decreases along the height direction, and the thickness of the walls close to the heat dissipation base and the heat conduction plate is greater than that of the walls away from them.

[0017] The one or more technical solutions provided in the application have at least the following technical effects or advantages:

[0018] The embodiment of the application provides a chip radiator of an additive manufacturing lattice-shaped laminated structure, which comprises: a heat dissipation base arranged at the bottom of the radiator and in contact with a heat generating chip; a heat conduction plate arranged above the heat dissipation base; a lattice area arranged above the heat dissipation base and / or the heat conduction plate and used for dissipating heat through convection with cooling fluid; and a heat pipe group embedded in cavities in the heat dissipation base and the heat conduction plate and fixed through brazing. The heat dissipation base, the heat conduction plate and the lattice area are integrally formed through alloy additive manufacturing. The technical problem that the existing radiator has insufficient heat dissipation area, large thermal resistance and high overall weight due to limited processing mode and is difficult to meet the demand of high-power chips for high-efficiency and lightweight heat dissipation is solved. The integrated lattice laminated structure is formed through additive manufacturing, heat conduction of the heat pipe and wall thickness gradient design, and the technical effects of efficient heat transfer, enhanced heat dissipation strength and consideration of lightweight demand are realized. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 A schematic diagram of the overall appearance of the chip radiator of the additive manufacturing lattice-shaped laminated structure provided by the application is provided.

[0020] Figure 2 A three-view drawing and an axonometric drawing of the chip radiator of the additive manufacturing lattice-shaped laminated structure provided by the application are provided.

[0021] Figure 3 A schematic diagram of the heat dissipation base of the chip radiator of the additive manufacturing lattice-shaped laminated structure provided by the application is provided.

[0022] Figure 4 A schematic diagram of the heat conduction plate of the chip radiator of the additive manufacturing lattice-shaped laminated structure provided by the application is provided.

[0023] Figure 5 A schematic diagram of the heat pipe of the chip radiator of the additive manufacturing lattice-shaped laminated structure provided by the application is provided.

[0024] Figure 6 A schematic diagram of the laminated structure of the chip radiator of the additive manufacturing lattice-shaped laminated structure provided by the application is provided.

[0025] Figure 7 A schematic diagram of the lattice structure of the chip radiator of the additive manufacturing lattice-shaped laminated structure provided by the application is provided.

[0026] Figure 8 A schematic diagram of the density distribution of the lattice area of the chip radiator of the additive manufacturing lattice-shaped laminated structure provided by the application is provided.

[0027] Explanation of reference numerals: 1 - heat dissipation base, 101 - groove, 2 - heat conduction plate, 201 - straight cavity, 3 - lattice area, 4 - heat pipe group, 401 - curved section, 402 - first straight section, 403 - first straight section. DETAILED DESCRIPTION

[0028] To make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a number of ways beyond the specific embodiments described and should not be limited to these specific embodiments. Indeed, the present application covers all functional modifications and alterations of the present application that come within the scope of the appended claims.

[0029] It should be noted that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. Where, when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements can also be present. The terms "vertical", "horizontal", "left", "right" and similar expressions as used herein are for illustrative purposes only and do not indicate the only orientation of the present application.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the embodiments of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The use of the terms "and / or" includes a combination of one or more of the associated listed items.

[0031] In order to make the objectives, technical solutions and advantages of the present application more apparent, the technical solutions in the present application will be described clearly and completely below with reference to the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without any creative effort fall within the scope of protection of the present application.

[0032] As shown in the embodiments, such as Figure 1 and Figure 2 The present application patent is composed of a heat dissipation base (1), a heat conduction plate (2), a lattice area (3) and a heat pipe group (4), wherein the heat dissipation base (1), the heat conduction plate (2) and the lattice area (3) are integrally formed by additive manufacturing of an aluminum alloy or a copper alloy, and the heat pipe group (4) is embedded in the corresponding cavities inside the heat dissipation base (1) and the heat conduction plate (2) and is formed by brazing.

[0033] Specifically, the chip heat sink of the present application is composed of a heat dissipation base (1), a heat conduction plate (2), a lattice area (3) and a heat pipe group (4). Among them, the heat dissipation base (1), the heat conduction plate (2) and the lattice area (3) are integrally formed by additive manufacturing process. Among them, additive manufacturing refers to the use of layer-by-layer accumulation forming method to directly build complex three-dimensional structure without traditional mold, so as to realize the integration of different parts in the manufacturing stage. This process not only reduces the additional thermal resistance caused by traditional splicing or welding, but also improves the overall strength and heat dissipation efficiency of the structure. The heat dissipation base (1) is the lowermost component of the heat sink, which is used to directly contact with the heat generating chip and conduct the primary heat; the heat conduction plate (2) is arranged above the heat dissipation base (1) to form a transversely distributed heat conduction channel; the lattice area (3) is a periodic stacked three-dimensional space network structure with high specific surface area and low flow resistance, which can significantly improve the convective heat transfer efficiency in the airflow or liquid cooling environment; and the heat pipe group (4) is designed as an embedded structure, that is, the heat pipe is inserted into the cavity preformed in the heat dissipation base (1) and the heat conduction plate (2), and the heat pipe is tightly combined with the cavity by brazing forming, so as to ensure that the heat can be quickly and reliably conducted from the chip to the upper layer area of the heat dissipation structure.

[0034] As shown in Figure 3 , the heat dissipation base (1) is of rectangular structure, four corners of which are provided with four through holes for fixation, and the bottom is processed with a recess (101) in which the heat pipe group (4) can be embedded, and the heat pipe can directly contact the heat generating chip for heat extraction.

[0035] Optionally, the heat dissipation base (1) is designed in overall rectangular structure, and four corners thereof are respectively provided with through holes for fixation. The through hole refers to the mounting hole penetrating through the thickness direction of the heat dissipation base, which is used to cooperate with screws, bolts or other fasteners, so that the heat sink can be stably fixed on the target chip or circuit substrate, thereby ensuring the close contact and reliability of the heat dissipation path. Further, a plurality of recesses (101) are formed on the bottom of the heat dissipation base (1), and the size and shape of the recesses are matched with the outer shape of the heat pipe group (4), so as to realize embedded installation. Through this design, the heat pipe can be tightly embedded in the inside of the heat dissipation base (1), and the surface of the heat pipe is in contact with the recess, thereby reducing the contact thermal resistance. It is particularly worth noting that the recess layout enables the heat pipe to directly contact the heat generating chip after installation, so as to immediately conduct the heat generated during the operation of the chip to the heat pipe, and then diffuse to the heat conduction plate (2) and the lattice area (3) through the heat pipe. This direct contact type heat extraction method can significantly reduce the heat transfer path compared with the traditional structure relying on the intermediate transition layer, improve the overall heat dissipation efficiency, and ensure the temperature control stability of the chip under high power working condition.

[0036] As shown in Figure 4As shown, the heat-conducting plate (2) is a cross-shaped flat plate structure, and a plurality of straight cavities (201) with rectangular cross sections are arranged along one side direction for inserting flattened heat pipes. The heat pipe group (4) can be inserted into the heat dissipation base (1) and the heat-conducting plate (2) at the same time, and then tin paste is applied for brazing to ensure reliable heat transfer.

[0037] It should be understood that the heat-conducting plate (2) adopts a cross-shaped flat plate structure, and the design feature is that it can realize multi-directional heat diffusion in a limited space. The cross-shaped flat plate structure is to make the overall profile of the heat-conducting plate present a cross layout, thereby forming a plurality of heat dissipation channels in the horizontal direction, so that the heat generated by the chip can be more uniformly transmitted to the surrounding, avoiding local overheating. Further, a plurality of straight cavities (201) are arranged on one side direction of the heat-conducting plate (2), and the cross section of the straight cavities is rectangular. The function of the straight cavities (201) is to provide installation channels for the flat sections of the heat pipe group (4), especially for the heat pipes that have been flattened, so that the heat pipes can be embedded in the heat-conducting plate in a surface contact manner.

[0038] In this embodiment, one end of the heat pipe group (4) is inserted into the groove (101) at the bottom of the heat dissipation base (1), and the other end is inserted into the straight cavity (201) of the heat-conducting plate (2) at the same time. During installation, tin paste is applied at the contact interface between the heat pipe and the base, and fixed by brazing process. Brazing refers to using a solder with a lower melting point than the base material to melt and fill the gap under heating conditions, so that the heat pipe and the heat dissipation base (1) and the heat-conducting plate (2) are reliably metallurgically combined. Through this process, not only the mechanical stability can be ensured, but also the interfacial thermal resistance in heat conduction is effectively reduced, so as to ensure that the heat generated by the chip can be quickly and reliably transmitted to the heat-conducting plate (2) and the lattice area (3) thereon. This design makes the heat sink of the present application have higher efficiency in the heat transfer path.

[0039] As shown in Figure 5 The heat pipe group (4) is a U-shaped bending structure, the bending section is in the middle, the cross section (401) is circular, and the first flat section (402) and the second flat section (403) at both ends are flattened, the cross section is rectangular, the size is consistent with the corresponding installation interface of the heat dissipation base (1) and the heat-conducting plate (2), and accurate embedding is ensured.

[0040] Specifically, the heat pipe group (4) adopts a U-shaped bending structure. The U-shaped bending structure means that the heat pipe as a whole forms a bending section in the middle, and the two ends extend into straight sections that are basically parallel, so that it can realize compact layout in a limited space, while considering the extensibility and heat transfer efficiency of the heat dissipation path. Specifically, the bending section (401) of the heat pipe group (4) is located in the middle part, and the cross section of the bending section is circular, which is conducive to maintaining the smoothness of fluid circulation and avoiding unnecessary flow resistance in the bending area.

[0041] At both ends of the bending section, a first flat section (402) and a second flat section (403) are respectively arranged. The two flat sections are processed by flattening process, so that the cross section is changed from the original circular to rectangular. Among them, the flattening process refers to plastic deformation processing of the end of the heat pipe under the premise of not damaging the capillary structure inside the heat pipe and the circulation of the working medium, so that the cross section is closely fitted with the mounting cavity. The advantage of rectangular cross section design is that it can form surface contact with the groove (101) of the heat dissipation base (1) and the straight cavity (201) of the heat conduction plate (2), instead of point contact or line contact, thereby significantly reducing the interface thermal resistance and improving the heat transfer efficiency.

[0042] Further, the size of the first flat section (402) and the second flat section (403) is completely consistent with the corresponding mounting interface of the heat dissipation base (1) and the heat conduction plate (2), which can ensure that the heat pipe can be accurately embedded during assembly, and form a stable and reliable connection after brazing fixation. Through the structure design, the heat pipe not only can efficiently absorb the heat of the heat generating chip, but also can quickly transfer the heat to the upper heat conduction plate (2) and the lattice area (3), so as to realize the efficient operation of the overall heat dissipation system.

[0043] As shown in Figure 6 , the basic position relationship of the patent of the application is that the heat dissipation base (1) is at the bottom and contacts the heat generating chip, the heat dissipation base (1) is adjacent to the first lattice area (3), and the heat conduction plate (2) and the lattice area (3) form a single layer combination, which can be stacked up to four layers of tower structure, and the corresponding heat pipe group (4) is connected to the heat dissipation base (1) from the four sides of the heat sink; therefore, as shown in Figure 1 and Figure 2 , it is the first basic configuration of the patent of the application, and the single layer heat conduction plate structure, if the heat generating capacity of the chip is large, it can be stacked up to four layers of tower structure.

[0044] In a possible embodiment of the present application, the overall structural relationship of the heat sink of the present application is that the heat dissipation base (1) is arranged at the bottom, and the lower surface thereof directly contacts the heat generating chip to complete the primary acquisition and conduction of heat. Above the heat dissipation base (1), a layer of lattice area (3) is arranged first, which forms high-efficiency convective heat exchange with the external cooling medium through the periodic space structure. Further, the heat conduction plate (2) and another layer of lattice area (3) are sequentially stacked above the lattice area (3), and the two constitute a basic single layer combination unit. The single layer combination unit can be repeatedly stacked according to the heat generating demand of the chip, and up to four layers of tower structure can be formed. The tower structure is a composite form of the heat dissipation base as the core, the heat conduction plate and the lattice area stacked layer by layer upwards, which is similar to the vertical stacking mode of multi-layer tower, and the advantage thereof lies in that the heat dissipation capacity can be flexibly adjusted according to the heat power.

[0045] In this structure, the heat pipe group (4) extends downward from the four sides of the heat sink and is connected to the heat dissipation base (1), forming a through-type heat conduction path with the heat conduction plate (2) and the lattice area (3). Through this arrangement, heat can be conducted from the chip to the heat dissipation base (1), and then effectively dispersed to the heat conduction plate (2) and the lattice area (3) above through the heat pipe group (4), achieving rapid and uniform transmission. Thus, Figure 1 and Figure 2 The structure shown in the figure can be regarded as the first basic configuration of the present application, that is, the combination of a single-layer heat conduction plate and a lattice area; when the heat generated by the chip is large, the overall structure can be expanded to a maximum of four layers by stacking multiple layers of units, thereby significantly improving the overall heat management capability of the heat sink.

[0046] As shown in Figure 7 , the lattice area (3) is an additive manufacturing lattice periodic structure, and a TPMS lattice can typically be used. Such a lattice is a triply periodic minimal surface that can divide space into mutually penetrating subspaces, forming complex channels with high surface area and low flow resistance. The flow of air within the lattice significantly provides Reynolds number, further optimizing the convective heat dissipation effect.

[0047] Specifically, the lattice area (3) adopts a periodic lattice structure formed by an additive manufacturing process. The periodic lattice structure refers to a grid-shaped geometric body periodically arranged by repeating basic units in three-dimensional space, which has regularity, continuity and controllable porosity, and can significantly improve the heat dissipation surface area while ensuring mechanical support strength. Typically, the present embodiment preferably uses a TPMS (Triply Periodic Minimal Surface) lattice. This structure belongs to a class of mathematically periodic and minimally curved surface systems, which can form mutually penetrating subspaces in space.

[0048] Moreover, the TPMS lattice has the advantages that its complex channel network can provide a specific surface area much higher than that of a conventional fin structure under the same volume condition, and due to the natural continuity between the curved surfaces, it can maintain a low flow resistance. When cooling air or other cooling fluids flow through the lattice area (3), the fluid path is constantly disturbed and divided, thereby significantly increasing the local flow rate and turbulent effect, resulting in a significant increase in Reynolds number. Reynolds number is an important dimensionless parameter that describes the flow state of a fluid, and its increase generally means that the fluid changes from laminar flow to turbulent flow, accompanied by stronger convective heat transfer capability. Therefore, by introducing the TPMS structure in the lattice area (3), the present application can achieve excellent heat transfer performance in a limited volume, thereby further optimizing the overall heat dissipation effect.

[0049] As shown in Figure 8To optimize the heat transfer thermal resistance from the heat dissipation base (1) and the heat conduction plate (2) to the lattice area (3), the wall thickness of the adjacent lattices in the lattice area (3) gradually decreases from large to small, and the wall thickness of the lattices near the heat dissipation base (1) and the heat conduction plate (2) is large.

[0050] Optionally, to further optimize the heat transfer thermal resistance in the process of transferring heat from the heat dissipation base (1) and the heat conduction plate (2) to the lattice area (3), the application introduces a wall thickness gradient feature in the geometric design of the lattice area (3). Specifically, the wall thickness of the adjacent unit cells in the lattice area (3) is not constant, but gradually decreases along the height direction, that is, the wall thickness of the lattices near the heat dissipation base (1) and the heat conduction plate (2) is large, and the wall thickness of the lattices far away from the above positions is relatively small.

[0051] The advantage of this gradient design is that the thicker lattice wall near the heat source side can provide a larger heat conduction cross-sectional area, reduce the local heat conduction resistance, so that heat can be efficiently conducted from the heat dissipation base (1) and the heat conduction plate (2) to the inside of the lattice area (3); and the thinner lattice wall located away from the heat source side is beneficial to expand the porosity of the lattice area, further increase the flow space of the cooling fluid, reduce the flow resistance, and improve the convective heat transfer efficiency. Through this gradually decreasing wall thickness from large to small, the application can effectively realize the comprehensive optimization of the heat conduction performance and the convection performance in the three-dimensional space, not only can improve the overall heat management capability of the heat sink, but also can meet the needs of lightweight and structural strength.

[0052] In summary, the structure provided by the embodiment of the application has at least the following technical effects or advantages:

[0053] The lattice-shaped stacked structure chip heat sink provided by the embodiment of the application first realizes low diffusion thermal resistance from the chip to the heat dissipation fin based on the dispersed output of the multi-layer heat conduction plate of the heat pipe heat conduction, and obtains a high convective heat dissipation coefficient by using a periodically stacked lattice structure with a high surface area instead of a conventional fin; secondly, by using the feature that the wall thickness of a single lattice can be adjusted under the support of the additive manufacturing process, the material filling degree (i.e. the wall thickness of the lattice) at the corresponding position can be adjusted according to the global heat flux of the heat sink, a gradually changing gradient in the three-dimensional space is formed, and the optimal distribution of the heat sink material can be realized; and thirdly, based on the additive manufacturing process, a complex heat sink shape can be formed without opening a mold for manufacturing, and the cost advantage is obtained in small-batch product manufacturing compared with the continuous mold splicing heat sink; in addition, the lattice structure itself also has supporting capability, and the overall strength of the heat sink is better than that of the continuous mold splicing heat sink.

[0054] Although the preferred embodiments of the application have been described, those skilled in the art can make additional changes and modifications to these embodiments once they know the basic creative concept.

[0055] Obviously, various modifications and changes can be made to the application without departing from the spirit and scope of the application. Accordingly, it is intended that all such modifications and changes be included within the scope of the application as defined in the following claims.

Claims

1. A chip heat sink with an additively manufactured lattice-like stacked structure, characterized in that, include: The heat dissipation base is located at the bottom of the heat sink and in contact with the heat-generating chip. A heat-conducting plate is disposed above the heat dissipation base; A lattice region, disposed above the heat dissipation substrate and / or the heat-conducting plate, is used to dissipate heat through convection with the cooling fluid; The heat pipe assembly is embedded in the cavity within the heat dissipation substrate and the heat conduction plate, and is fixed by brazing. The heat dissipation substrate, the heat-conducting plate, and the lattice region are integrally formed structures using alloy additive manufacturing.

2. The additively manufactured lattice-like multilayer chip heat sink as described in claim 1, characterized in that, The heat-conducting plates and the lattice regions are stacked alternately to form a multi-layered tower structure.

3. The additively manufactured lattice-like multilayer chip heat sink as described in claim 2, characterized in that, The multi-layer tower structure can be stacked up to four layers depending on the heat generated.

4. The additively manufactured lattice-like multilayer chip heat sink as described in claim 1, characterized in that, The heat pipe assembly connects downwards from the four sides of the radiator to the heat dissipation base.

5. The additively manufactured lattice-like multilayer chip heat sink as described in claim 4, characterized in that, The heat pipe assembly has a U-shaped bending structure, with a curved section having a circular cross-section in the middle and a first straight section and a second straight section having rectangular cross-sections at both ends.

6. The additively manufactured lattice-like multilayer chip heat sink as described in claim 5, characterized in that, The cross-sectional dimensions of the first straight section and the second straight section are matched with the corresponding mounting interfaces of the heat dissipation base and the heat-conducting plate.

7. The additively manufactured lattice-like multilayer chip heat sink as described in claim 4, characterized in that, The heat dissipation base has a rectangular structure with four through holes at the four corners for fixing. The bottom is machined with a groove for embedding the heat pipe assembly. The heat pipes directly contact the heat-generating chip through the groove to extract heat.

8. The additively manufactured lattice-like multilayer chip heat sink as described in claim 1, characterized in that, The heat-conducting plate has a cross-shaped flat plate structure, and multiple rectangular straight cavities are provided on one side for inserting flattened heat pipes.

9. The additively manufactured lattice-like multilayer chip heat sink as described in claim 1, characterized in that, The lattice region is a periodic additive manufacturing structure.

10. The additively manufactured lattice-like multilayer chip heat sink as described in claim 9, characterized in that, The wall thickness of adjacent lattice regions in the lattice region gradually decreases from large to small along the height direction, wherein the wall thickness near the heat dissipation substrate and heat conduction plate is greater than the wall thickness at a distance away.

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