Memory chip based on 3D structure, processing equipment and processing technology thereof
By employing interconnect components and transmission conductors in the design of 3D structure memory chips, the problems of signal delay and heat dissipation are solved, the storage density and sensitivity of memory chips are improved, and efficient signal transmission and heat dissipation are achieved.
Patent Information
- Application Number
- CN202511144277.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-15
- Publication Date
- 2025-12-09
AI Technical Summary
In existing 3D stacked packaging methods, signal transmission delay between chips leads to a decrease in the sensitivity of memory chips, and the storage density of planar memory cells is close to the upper limit.
The memory chip design adopts a 3D structure, utilizes interconnect components to achieve high-density bonding between chip layers, reduces signal transmission delay by connecting vias and filling the transmission conductors in the vias, and accelerates heat dissipation through a metal thermal conductive layer and microchannels.
It improves the storage density and sensitivity of memory chips, while also enhancing heat dissipation, connection stability between chip layers, and signal transmission efficiency.
Smart Images
Figure CN121099618A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor technology, and in particular to a memory chip based on a 3D structure, processing equipment and processing technology thereof. Background Technology
[0002] With the rise and development of artificial intelligence (AI), big data, the Internet of Things (IoT), mobile devices and communications, and cloud storage, the demand for storage capacity is growing exponentially. Through improvements in process technology, circuit design, programming algorithms, and manufacturing processes, planar memory cells have been scaled down to smaller sizes. However, as the feature size of memory cells approaches its lower limit, planar processes and manufacturing technologies become challenging and costly. Ultimately, this leads to the storage density of planar memory cells approaching its upper limit.
[0003] 3D stacked packaging can overcome the density limitations of planar memory cells. 3D stacked packaging refers to stacking and packaging at least two layers of chips, thus integrating more semiconductor chips in a smaller space. Using a 3D stacked approach to package memory chips allows for greater storage capacity in a smaller volume.
[0004] However, with the existing three-dimensional stacked packaging method, the chips stacked together are mostly connected by wires, which can easily lead to signal delays when different chips transmit signals, thus affecting the sensitivity of the storage chip during use. Summary of the Invention
[0005] In order to minimize signal delay during the use of the memory chip and thus improve its sensitivity, this application provides a memory chip based on a 3D structure, a processing device and a processing technology thereof.
[0006] This application provides a memory chip based on a 3D structure, a processing equipment, and a processing technology thereof, adopting the following technical solution: A 3D-structured memory chip includes a substrate on which a plurality of stacked chip layers are disposed. An interconnect component is disposed between two adjacent chip layers. A connection via is disposed in common along the stacking direction of the plurality of chip layers. A filling via is disposed on the substrate. The filling via and the connection via have the same diameter and are coaxially disposed. A transmission conductor is disposed in common in the connection via and the filling via.
[0007] By employing the above technical solutions, interconnect components facilitate high-density bonding connections between chips, thereby increasing the storage density of memory chips; transmission conductors help minimize signal transmission delays between different chip layers, thus improving the sensitivity of memory chips during use; and a substrate helps to support and carry multiple chip layers.
[0008] In one specific implementation, the interconnect component includes metal pads and an insulating medium, the metal pads being disposed on the chip layer, and the insulating medium being spaced apart on the chip layer and attached to both sides of the metal pads.
[0009] By adopting the above technical solution, the tight bonding between the insulating media helps to achieve the initial bonding between two adjacent chip layers, thereby helping to achieve the initial connection between two adjacent chip layers; the use of metal pads helps to achieve the permanent bonding between two adjacent chip layers during the thermal annealing process, thereby helping to achieve the permanent connection between two adjacent chip layers.
[0010] In one specific implementation, the surface of the chip layer is provided with a metal thermally conductive layer for accelerating the internal heat dissipation rate, and both the metal pads and the insulating medium are disposed on the metal thermally conductive layer.
[0011] By adopting the above technical solution, the use of a metal thermal conductive layer helps to accelerate the heat dissipation speed inside several stacked chip layers, thereby helping to improve the heat dissipation effect of the memory chip during use.
[0012] In one specific implementation, the insulating medium is provided with microchannels for enhancing heat dissipation, the microchannels being arranged along the length of the insulating medium and penetrating the insulating medium.
[0013] By adopting the above technical solution, the use of microchannels helps to further accelerate the heat dissipation speed inside several stacked chip layers, thereby helping to further improve the heat dissipation effect of memory chips during use.
[0014] A processing device for memory chips, used for processing the aforementioned 3D-structure-based memory chips, includes a processing chassis. A first feeding platform is movably disposed on the inner bottom wall of the processing chassis, and a feeding assembly is disposed on the first feeding platform. An electric cylinder is disposed on the top wall of the processing chassis, and the piston rod of the electric cylinder extends downward. A second feeding platform is disposed on the piston rod of the electric cylinder, and a feeding groove is disposed on the second feeding platform. A vacuum suction cup is disposed in the feeding groove. A robotic arm is disposed inside the processing chassis.
[0015] By adopting the above technical solutions, a robotic arm helps to pick up and place the chip layer onto the first feeding platform and the substrate onto the second feeding platform; a feeding assembly helps to provide elastic support for the raw materials placed on the first feeding platform; and a vacuum suction cup helps to adsorb and position the raw materials placed on the second feeding platform.
[0016] In one specific implementation scheme, a linear guide rail is provided on the inner bottom wall of the processing machine housing, a slider is provided on the linear guide rail, a mounting seat is provided on the slider, the first feeding platform is provided on the mounting seat, and columns are symmetrically arranged on both sides of the linear guide rail in the width direction inside the processing machine housing. Each column is fitted with a bushing, and a guide plate is provided on the bushing. The guide plate is fixedly connected to the piston rod of the electric cylinder, and a linkage component for driving the mounting seat to move horizontally is provided on the guide plate.
[0017] By adopting the above technical solutions, the guide rail and slider help guide the movement trajectory of the mounting base, thereby helping to guide the movement trajectory of the first unloading platform; the guide plate, in conjunction with the column and bushing, helps guide the piston rod of the electric cylinder, thereby helping to improve the accuracy of the movement position of the second unloading platform; the linkage component helps to drive the mounting base to move horizontally while the piston rod of the electric cylinder moves vertically, thereby helping to drive the first unloading platform to move horizontally synchronously.
[0018] In one specific implementation scheme, the linkage assembly includes a transmission rod, an abutment plate, a shaped plate, an abutment wheel, and a plug-in rod. The shaped plate is rotatably mounted on the inner bottom wall of the processing machine housing. The abutment wheel is rotatably mounted on one end of the shaped plate. One end of the transmission rod is connected to the guide plate. The abutment plate is located at the end of the transmission rod away from the guide plate and abuts against the abutment wheel. An oblong hole is provided on the shaped plate. The plug-in rod is mounted on the mounting base and inserted into the oblong hole.
[0019] By adopting the above technical solution, when the piston rod of the electric cylinder moves, the transmission rod helps to drive the abutment plate to move synchronously, which in turn helps to drive the irregular plate to rotate through the abutment wheel, and further helps to drive the mounting base and the first unloading platform to move horizontally through the insertion rod.
[0020] In one specific implementation, the feeding assembly includes a feeding plate, a connecting rod, and a piston. A sealed chamber is provided inside the first feeding platform. The piston is disposed inside the sealed chamber, and the circumferential sidewall of the piston slides against the circumferential inner wall of the sealed chamber. One end of the connecting rod is connected to the piston, and the other end of the connecting rod extends through the first feeding platform. The feeding plate is disposed at the end of the connecting rod away from the piston, and a material-catching groove is provided on the feeding plate. A plurality of insertion posts are provided on the feeding plate. The ends of the insertion posts away from the feeding plate are slidably inserted into the first feeding platform. An elastic support is sleeved on the insertion post. One end of the elastic support abuts against the first feeding platform, and the other end of the elastic support abuts against the feeding plate.
[0021] By adopting the above technical solution, the piston helps to provide elastic support for the feeding plate through the connecting rod, thereby helping to provide elastic support for the raw materials placed on the first feeding platform; the plug-in rod in conjunction with the elastic support helps to provide elastic support for the feeding plate, thereby helping to improve the stability of the feeding plate when it moves in the vertical direction.
[0022] A fabrication process for memory chips, based on the aforementioned fabrication equipment for memory chips, includes the following steps: Step 1: The robotic arm picks up the substrate and places it into the feeding slot. At the same time, the vacuum suction cup is used to adsorb and position the substrate. Then, the robotic arm picks up a chip layer and places it into the clamping slot on the first feeding stage. After that, the electric cylinder drives the second feeding stage and the substrate to move downward. With the cooperation of the linkage components, the first feeding stage and the chip layer move horizontally to directly below the substrate, so that the chip layer and the substrate are in close contact and thus the chip layer and the substrate are initially bonded. Step 2: After Step 1 is completed, the electric cylinder drives the substrate and the chip layer initially connected to the substrate to move upward synchronously. At the same time, with the cooperation of the linkage component, the first feeding stage moves horizontally to the initial position. The robotic arm picks up the next chip layer and places it into the slot on the first feeding stage. Then, the electric cylinder drives the second feeding stage to move downward. With the cooperation of the linkage component, the first feeding stage and the chip layer move horizontally to directly below the second feeding stage, so that the two chip layers are pressed tightly together. Then, with the action of the interconnect component, the two chip layers are initially bonded. Step 3: After completing Step 2, repeat the steps in Step 2 until all chip layers have been initially bonded. Step 4: After step 3 is completed, the substrate and several preliminarily bonded chip layers are placed in a heating annealing device for heat annealing treatment, thereby permanently bonding the chip layers together. Step 5: After step 4 is completed, electroplating is used to fill the inside of the through holes and connection vias with transmission conductors, thereby completing the processing of the memory chip.
[0023] In one specific implementation scheme, in step one, while the electric cylinder drives the second feeding platform and the substrate to move downward, the guide plate drives the transmission rod and the abutment plate to move downward synchronously, thereby driving the irregular plate to rotate through the abutment wheel, and then driving the mounting base and the first feeding platform to move horizontally to directly below the second feeding platform through the insertion rod.
[0024] In summary, this application includes at least one of the following beneficial technical effects: 1. By connecting vias, filling vias, and transmission conductors, this application helps to minimize the delay in signal transmission between different chip layers, thereby improving the sensitivity of the memory chip during use; 2. This application utilizes interconnect components, which facilitate high-density bonding connections between chips, thereby increasing the storage density of memory chips; 3. This application utilizes a metal thermal conductive layer and microchannels. The metal thermal conductive layer helps to accelerate the heat dissipation speed within several stacked chip layers, thereby improving the heat dissipation effect of the memory chip during use. The microchannels further help to accelerate the heat dissipation speed within several stacked chip layers, thereby further improving the heat dissipation effect of the memory chip during use. Attached Figure Description
[0025] Figure 1 This is a schematic diagram of the overall structure of the memory chip in the embodiments of this application.
[0026] Figure 2 This is a schematic diagram of the overall structure of the processing equipment in the embodiments of this application.
[0027] Figure 3 This is a schematic diagram illustrating the specific structure of the feeding assembly.
[0028] Figure 4 It is a schematic diagram illustrating the specific structure of the linkage components.
[0029] Figure 5 It is a sectional view showing the specific internal structure of the mounting base.
[0030] Explanation of reference numerals in the attached drawings: 1. Substrate; 2. Chip layer; 3. Interconnect component; 31. Metal pad; 32. Insulating medium; 4. Connecting via; 5. Filler via; 6. Transmission conductor; 7. Metal thermally conductive layer; 8. Microchannel; 9. Processing chassis; 10. First unloading stage; 11. Unloading assembly; 111. Unloading plate; 112. Connecting rod; 113. Piston; 12. Electric cylinder; 13. Second unloading stage; 14. Unloading groove; 15. Vacuum suction cup; 16. Robotic arm; 17. Linear guide; 18. Slider; 19. Mounting base; 20. 21. Column; 22. Bushing; 23. Guide plate; 24. Linkage assembly; 25. Transmission rod; 26. Abutment plate; 27. Irregular plate; 28. Abutment wheel; 29. Insertion rod; 20. Waist-shaped hole; 20. Sealed chamber; 21. Material slot; 22. Insertion column; 23. Elastic top support; 24. Movable groove; 35. Movable plate; 36. Mounting groove; 37. Rotating shaft; 38. Rotating plate; 39. Spiral spring; 40. Abutment groove; 41. Insertion interface; 42. Insertion hole; 43. Limiting baffle; 44. Insertion plate; 45. Insertion rod. Detailed Implementation
[0031] The present application will be further described in detail below with reference to the accompanying drawings.
[0032] This application discloses a memory chip based on a 3D structure, referring to... Figure 1 The system includes a substrate 1, on which several chip layers 2 are stacked and mounted. Interconnect components 3 are disposed between adjacent chip layers 2. The interconnect components 3 include metal pads 31 and insulating media 32. A metal thermally conductive layer 7 is fixed to the surface of the chip layer 2. The metal pads 31 are mounted on the surface of the metal thermally conductive layer 7. The insulating media 32 are spaced apart on the surface of the metal thermally conductive layer 7. The insulating media 32 are located on opposite sides of the metal pads 31 and are in contact with the sidewalls of the metal pads 31. Each insulating media 32 has a microchannel 8 extending through it along its own length direction.
[0033] Reference Figure 1 In the manufacturing process of memory chips, the tight bonding between the insulating media 32 helps to achieve the initial bonding between two adjacent chip layers 2, thereby helping to achieve the initial connection between two adjacent chip layers 2; the metal pads 31 help to achieve the permanent bonding between two adjacent chip layers 2 during the thermal annealing process, thereby helping to achieve the permanent connection between two adjacent chip layers 2; the cooperation of the metal pads 31 and the insulating media 32 helps to achieve high-density bonding connections between multiple chip layers 2, thereby helping to increase the storage density of the memory chip, and thus helping to increase the storage capacity of the memory chip.
[0034] Reference Figure 1During the use of the memory chip, the metal thermal conductive layer 7 helps to accelerate the heat dissipation speed inside the stacked chip layers 2, thereby helping to improve the heat dissipation effect of the memory chip during use; the microchannel 8 helps to further accelerate the heat dissipation speed inside the stacked chip layers 2, thereby helping to further improve the heat dissipation effect of the memory chip during use.
[0035] Reference Figure 1 A filling via 5 is formed on the substrate 1. Several chip layers 2 are connected by through-holes 4 along the stacking direction. The through-holes 4 and filling vias 5 are coaxially aligned and have the same diameter. Both the through-holes 4 and filling vias 5 are filled with a transmission conductor 6, which, in this embodiment, is copper. During the use of the memory chip, the transmission conductor 6 helps to minimize the signal transmission delay between different chip layers 2, thereby improving the sensitivity of the memory chip during use.
[0036] This application also discloses a processing apparatus for processing the above-mentioned memory chip, referring to... Figure 2 and Figure 3 The system includes a processing housing 9, on which a linear guide rail 17 is fixedly mounted. A slider 18 is slidably engaged with the linear guide rail 17. A mounting base 19 is fixedly mounted on the slider 18. A first unloading platform 10 is fixedly mounted on the mounting base 19. An unloading assembly 11 is provided on the first unloading platform 10. A robotic arm 16 is fixedly mounted on one side of the linear guide rail 17 on the inner bottom wall of the processing housing 9.
[0037] Reference Figure 3 The feeding assembly 11 includes a feeding plate 111, a piston 113, and multiple connecting rods 112. The first feeding platform 10 has a sealed chamber 25 inside. The piston 113 is vertically mounted in the sealed chamber 25, and the circumferential sidewall of the piston 113 slides against the circumferential inner wall of the sealed chamber 25. The bottom ends of the multiple connecting rods 112 are fixedly connected to the top surface of the piston 113, and the top ends of the multiple connecting rods 112 extend through the first feeding platform 10 and are fixedly connected to the bottom surface of the feeding plate 111. A material clamping groove 26 is provided on the top surface of the feeding plate 111. A plurality of plug-in posts 27 are fixedly installed at intervals on the bottom circumference of the feeding plate 111. The bottom ends of the plug-in posts 27 are slidably inserted into the first feeding platform 10, and each plug-in post 27 is fitted with an elastic support member 28. In this embodiment, the elastic support member 28 is a flexible sleeve. The bottom end of the flexible sleeve abuts against the top surface of the first feeding platform 10, and the top end of the flexible sleeve abuts against the bottom surface of the feeding plate 111.
[0038] Reference Figure 2 and Figure 3An electric cylinder 12 is fixedly installed on the inner top wall of the processing machine box 9. The piston rod of the electric cylinder 12 extends downward. The bottom end of the piston rod of the electric cylinder 12 is fixedly connected to a second feeding platform 13. A feeding groove 14 is opened on the bottom surface of the second feeding platform 13. A vacuum suction cup 15 is fixedly installed inside the feeding groove 14.
[0039] Reference Figure 2 and Figure 3 Inside the machining housing 9, columns 20 are symmetrically installed on both sides of the linear guide rail 17 in the width direction. Each column 20 is slidably fitted with a bushing 21. A horizontally arranged guide plate 22 is installed on both bushings 21. The guide plate 22 is fixedly connected to the piston rod of the electric cylinder 12. Two sets of linkage components 23 are symmetrically arranged on the guide plate 22.
[0040] Reference Figure 3 and Figure 4 The linkage component 23 includes a transmission rod 231, an abutment plate 232, a shaped plate 233, an abutment wheel 234, and a plug rod 235. The shaped plate 233 is rotatably mounted on the inner bottom wall of the processing machine housing 9, and a helical spring is provided on the rotating shaft 34 of the shaped plate 233. The abutment wheel 234 is rotatably mounted on one end of the shaped plate 233. The top end of the transmission rod 231 is fixedly connected to the guide plate 22, and the abutment plate 232 is fixed to the bottom end of the transmission rod 231. The abutment wheel 234 abuts against the bottom surface of the abutment plate 232. An oblong hole 24 is provided on the shaped plate 233. A movable groove 29 is provided horizontally on the side wall of the mounting base 19. A movable plate 30 is movably engaged in the mounting groove 33. One end of the plug rod 235 is fixedly connected to the movable plate 30, and the end of the plug rod 235 away from the movable plate 30 is inserted into the oblong hole 24.
[0041] Reference Figure 4 and Figure 5 The movable plate 30 has a mounting groove 33 at one end near the irregular plate 233. A rotating shaft 34 is fixedly installed in the mounting groove 33, and a rotating plate 35 is rotatably installed on the rotating shaft 34. A spiral spring 36 is also installed on the rotating shaft 34 and is fixedly connected to the rotating plate 35. The mounting base 19 has an abutment groove 37 and an insertion interface 38 communicating with the abutment groove 37. An insertion hole 39 is opened on the side wall of the mounting base 19 away from the insertion interface 38 and is communicating with the movable groove 29. Two sets of limiting baffles 40 are fixed at intervals along the length of the linear guide rail 17 on the inner bottom wall of the processing machine housing 9. The two sets of limiting baffles 40 are located on both sides of the mounting base 19. An insertion plate 41 is fixed on the set of limiting baffles 40 near the insertion interface 38, and an insertion rod 42 is fixed on the set of limiting baffles 40 near the insertion hole 39.
[0042] This application also discloses a processing technology for processing the memory chip using the aforementioned processing equipment, the process comprising the following steps: Step 1: The robotic arm 16 picks up the substrate 1 and places it into the feeding slot 14. At the same time, the vacuum chuck 15 is connected to the external vacuum pumping device. The vacuum chuck 15 adsorbs and positions the substrate 1 inside the feeding slot 14. Then, the robotic arm 16 picks up a pre-processed chip layer 2 and places it into the holding slot 26. The electric cylinder 12 is activated, and the piston rod of the electric cylinder 12 extends, driving the second feeding platform 13 and the substrate 1 to move downward. At the same time, the piston rod drives the transmission rod 231 and the abutment plate 232 to move downward synchronously through the guide plate 22. This causes the abutment wheel 234 to drive the irregular plate 233 to rotate, and then the insertion rod 235 drives the movable plate 30, the mounting base 19 and the first feeding platform 10 to move horizontally along the length of the slide rail towards the direct below of the second feeding platform 13.
[0043] When the first feeding platform 10 moves horizontally to directly below the second feeding platform 13, the substrate 1 on the second feeding platform 13 aligns with the chip layer 2 on the first feeding platform 10, which helps to make the chip layer 2 and the substrate 1 fit tightly together, thereby enabling the chip layer 2 and the substrate 1 to be initially bonded together.
[0044] When the first feeding platform 10 moves horizontally to directly below the second feeding platform 13, the plug plate 41 is inserted into the abutment groove 37 through the plug interface 38, thereby squeezing out the rotating plate 35 that is abutting inside the abutment groove 37, so that the rotating plate 35 is located inside the mounting groove 33. This helps the movable plate 30 to move a short distance within the movable groove 29, thereby helping to minimize the transmission of vibrations generated when the mounting base 19 is stopped to the guide plate 22 through the plug rod 235, the irregular plate 233, the abutment plate 232 and the transmission rod 231, thus helping to improve the stability of the second feeding platform 13.
[0045] Step 2: Start the electric cylinder 12. The piston rod of the electric cylinder 12 retracts, causing the substrate 1 and the chip layer 2 initially connected to the substrate 1 to move upward synchronously. At the same time, the piston rod drives the transmission rod 231 and the abutment plate 232 to move upward synchronously through the guide plate 22. Thus, the elastic force of the helical spring drives the irregular plate 233 to rotate. Then, through the insertion rod 235, the movable plate 30, the mounting base 19 and the first feeding platform 10 move horizontally along the length of the slide rail in a direction away from the second feeding platform 13, so as to facilitate the placement of the next chip layer 2 on the first feeding platform 10.
[0046] When the mounting base 19 is stopped by a set of limiting baffles 40 near the insertion hole 39, the insertion rod 42 is inserted into the movable groove 29 through the insertion hole 39, pressing against the movable plate 30, thereby aligning the mounting groove 33 with the abutment groove 37, and causing the rotating plate 35 to rotate into the abutment groove 37 under the elastic force of the spiral spring 36 and press against the groove wall of the abutment groove 37, thus fixing the movable plate 30 inside the movable groove 29.
[0047] When the mounting base 19 is stopped by a set of limiting baffles 40 near the insertion hole 39, the robotic arm 16 picks up the next chip layer 2 after preliminary processing and places it into the material slot 26. The electric cylinder 12 is activated, and the piston rod of the electric cylinder 12 extends, driving the second feeding platform 13 and the substrate 1 to move downward. At the same time, the piston rod drives the transmission rod 231 and the abutment plate 232 to move downward synchronously through the guide plate 22, thereby driving the irregular plate 233 to rotate through the abutment wheel 234. Then, through the insertion rod 235, the movable plate 30, the mounting base 19 and the first feeding platform 10 move horizontally along the length of the slide rail towards the direct below of the second feeding platform 13.
[0048] When the first feeding platform 10 moves horizontally to directly below the second feeding platform 13, the chip layer 2 on the second feeding platform 13 aligns with the chip layer 2 on the first feeding platform 10, which helps to make the two chip layers 2 fit together tightly, thereby enabling the two chip layers 2 to be initially bonded together.
[0049] Step 3: Repeat the steps in Step 2 until all chip layers 2 have been initially bonded.
[0050] Step 4: After step 3 is completed, the substrate 1 and several preliminarily bonded chip layers 2 are placed in a heating annealing device for thermal annealing treatment, thereby permanently bonding the several chip layers 2 together.
[0051] Step 5: After step 4 is completed, the transmission conductor 6 is filled into the filling hole 5 and the connecting through hole 4 using an electroplating process, thereby completing the processing of the memory chip.
[0052] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A memory chip based on a 3D structure, characterized in that: The device includes a substrate (1), on which a plurality of stacked chip layers (2) are disposed. An interconnect component (3) is disposed between two adjacent chip layers (2). A connection via (4) is disposed together along the stacking direction of the plurality of chip layers (2). A filling via (5) is disposed on the substrate (1). The filling via (5) and the connection via (4) have the same diameter and are coaxially disposed. A transmission conductor (6) is disposed together in the connection via (4) and the filling via (5).
2. A memory chip based on a 3D structure according to claim 1, characterized in that: The interconnect component (3) includes a metal pad (31) and an insulating medium (32). The metal pad (31) is disposed on the chip layer (2), and the insulating medium (32) is disposed at intervals on the chip layer (2) and attached to both sides of the metal pad (31).
3. A memory chip based on a 3D structure according to claim 2, characterized in that: The surface of the chip layer (2) is provided with a metal thermal conductive layer (7) for accelerating the internal heat dissipation speed, and the metal pad (31) and the insulating medium (32) are both disposed on the metal thermal conductive layer (7).
4. A memory chip based on a 3D structure according to claim 2, characterized in that: The insulating medium (32) is provided with microchannels (8) for enhancing heat dissipation. The microchannels (8) are arranged along the length of the insulating medium (32) and penetrate the insulating medium (32).
5. A processing apparatus for memory chips, used for processing a 3D-structure-based memory chip as described in any one of claims 1-4, characterized in that: The machine includes a processing housing (9), on which a first feeding platform (10) is movably disposed on the inner bottom wall of the processing housing (9), and a feeding assembly (11) is disposed on the first feeding platform (10). An electric cylinder (12) is disposed on the top wall of the processing housing (9), and the piston rod of the electric cylinder (12) extends downward. A second feeding platform (13) is disposed on the piston rod of the electric cylinder (12), and a feeding groove (14) is disposed on the second feeding platform (13). A vacuum suction cup (15) is disposed in the feeding groove (14), and a robotic arm (16) is disposed inside the processing housing.
6. The processing equipment for memory chips according to claim 5, characterized in that: A linear guide rail (17) is provided on the inner bottom wall of the processing machine housing (9). A slider (18) is provided on the linear guide rail (17). A mounting seat (19) is provided on the slider (18). The first feeding platform (10) is provided on the mounting seat (19). Columns (20) are symmetrically arranged on both sides of the linear guide rail (17) in the width direction inside the processing machine housing (9). Each column (20) is fitted with a bushing (21). A guide plate (22) is provided on the bushing (21). The guide plate (22) is fixedly connected to the piston rod of the electric cylinder (12). A linkage component (23) for driving the mounting seat (19) to move horizontally is provided on the guide plate (22).
7. The processing equipment for memory chips according to claim 6, characterized in that: The linkage component (23) includes a transmission rod (231), an abutment plate (232), a shaped plate (233), an abutment wheel (234), and a plug rod (235). The shaped plate (233) is rotatably mounted on the inner bottom wall of the processing machine housing (9). The abutment wheel (234) is rotatably mounted on one end of the shaped plate (233). One end of the transmission rod (231) is connected to the guide plate (22). The abutment plate (232) is located at the end of the transmission rod (231) away from the guide plate (22), and the abutment plate (232) abuts against the abutment wheel (234). The shaped plate (233) has an oblong hole (24). The plug rod (235) is mounted on the mounting base (19) and is inserted into the oblong hole (24).
8. The processing equipment for memory chips according to claim 5, characterized in that: The feeding assembly (11) includes a feeding plate (111), a connecting rod (112), and a piston (113). A sealed chamber (25) is provided inside the first feeding platform (10). The piston (113) is disposed within the sealed chamber (25), and the circumferential sidewall of the piston (113) slides against the circumferential inner wall of the sealed chamber (25). One end of the connecting rod (112) is connected to the piston (113), and the other end of the connecting rod (112) extends through the first feeding platform (10). The feeding plate (111) is disposed within the first feeding platform (10). The connecting rod (112) is located away from the piston (113) at one end, and the feeding plate (111) is provided with a material clamping groove (26); the feeding plate (111) is provided with a plurality of insertion posts (27), the insertion post (27) is slidably inserted into the first feeding platform (10) at one end away from the feeding plate (111), and an elastic support member (28) is sleeved on the insertion post (27), one end of the elastic support member (28) abuts against the first feeding platform (10), and the other end of the elastic support member (28) abuts against the feeding plate (111).
9. A processing technology for memory chips, based on the processing equipment for memory chips according to any one of claims 5-8, characterized in that: The process includes the following steps: Step 1: Use a robotic arm (16) to pick up the substrate (1) and place it into the feeding tray (14). At the same time, use a vacuum suction cup (15) to adsorb and position the substrate (1). Then, use the robotic arm (16) to pick up a chip layer (2) and place it into the slot (26) on the first feeding platform (10). Then, use an electric cylinder (12) to drive the second feeding platform (13) and the substrate (1) to move downward. With the cooperation of the linkage component (23), the first feeding platform (10) and the chip layer (2) move horizontally to directly below the substrate (1), so that the chip layer (2) and the substrate (1) are pressed together, and the chip layer (2) and the substrate (1) are initially bonded. Step 2: After step 1 is completed, the electric cylinder (12) drives the substrate (1) and the chip layer (2) initially connected to the substrate (1) to move upward synchronously. At the same time, with the cooperation of the linkage component (23), the first feeding platform (10) moves horizontally to the initial position. The robotic arm (16) grabs the next chip layer (2) and places it into the slot (26) on the first feeding platform (10). Then, the electric cylinder (12) drives the second feeding platform (13) to move downward. With the cooperation of the linkage component (23), the first feeding platform (10) and the chip layer (2) move horizontally to directly below the second feeding platform (13), so that the two chip layers (2) are pressed together. Then, with the action of the interconnect component (3), the two chip layers (2) are initially bonded. Step 3: After completing Step 2, repeat the steps in Step 2 until all chip layers (2) are initially bonded; Step 4: After step 3 is completed, the substrate (1) and several preliminarily bonded chip layers (2) are placed in a heating annealing device for heat annealing treatment, so that the several chip layers (2) are permanently bonded together. Step 5: After step 4 is completed, the transmission conductor (6) is filled into the filling hole (5) and the connecting through hole (4) by electroplating process, thereby completing the processing of the memory chip.
10. A fabrication process for a memory chip according to claim 9, characterized in that: In step one, while the electric cylinder (12) drives the second feeding platform (13) and the substrate (1) to move downward, the guide plate (22) drives the transmission rod (231) and the abutment plate (232) to move downward synchronously, thereby driving the irregular plate (233) to rotate through the abutment wheel (234), and then driving the mounting base (19) and the first feeding platform (10) to move horizontally to directly below the second feeding platform (13) through the plug rod (235).