Copper ingot dynamic equilibrium crystallization device and method

Abstract

The invention discloses a copper ingot dynamic equilibrium crystallization device and method, and belongs to the technical field of copper ingot production. The device comprises a crystallization wheel and a steel belt, the crystallization wheel is divided into N independent temperature control areas along the circumference, and the number of the areas is determined according to the diameter; each area is provided with a multi-dimensional cooling system comprising an inner core, edge and interface cooling unit, and a fixed temperature monitoring frame and a dynamic balance controller are matched, so that the temperature difference between adjacent areas can be maintained to be less than or equal to 55 DEG C, and the radial temperature gradient of a single area is maintained to be less than or equal to 40 DEG C / cm. According to the method, the crystallization process is optimized by dividing three stages of temperature zones, adjusting the position of a cooling unit in real time and combining dynamic temperature compensation, grain regulation and control and an emergency intervention strategy. According to the invention, accurate temperature control is realized, the cooling pertinence and the monitoring comprehensiveness are improved, the copper ingot crystallization quality and the production stability are guaranteed, and the rate of finished products is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of copper ingot production, more particularly to a copper ingot dynamic balance crystallization device and method. BACKGROUND

[0002] In the process of copper ingot production, the crystallization link plays a crucial role in the quality of copper ingot. Currently, the existing copper ingot crystallization device is relatively extensive in temperature control, and it is difficult to achieve precise temperature control of different areas of the crystallization wheel. Due to the inability to accurately regulate the temperature of each area of the crystallization wheel, copper ingot is prone to uneven temperature distribution during crystallization. This uneven temperature can cause cracks in the copper ingot, affecting its physical and mechanical properties, and may also lead to coarse grains, reducing the quality of the copper ingot.

[0003] In addition, the existing cooling system design is not reasonable, usually adopting a single cooling method, which cannot meet the specific cooling needs of different parts of the copper ingot. For example, the cooling needs of the inner core, the edge and the contact surface with the steel belt are different, and a single cooling system cannot meet these differentiated needs, further reducing the crystallization quality of the copper ingot. Moreover, the existing temperature monitoring means is not comprehensive and accurate, and cannot obtain key information such as the temperature field and solid-liquid interface temperature of the copper ingot during crystallization in real time and accurately, resulting in the inability to adjust the cooling parameters in a timely manner, affecting the stability of the crystallization process and the quality of the copper ingot. SUMMARY

[0004] The purpose of the present application is to provide a copper ingot dynamic balance crystallization device and method, which realizes the dynamic balance of copper ingot crystallization through precise control of the temperature field and dynamic adjustment of the cooling system during crystallization, thereby obtaining copper ingot with uniform structure and excellent performance.

[0005] The technical solution adopted by the present application is as follows: a copper ingot dynamic balance crystallization device, comprising a crystallization wheel and a steel belt wrapped around the outer periphery of the crystallization wheel, the crystallization wheel is divided into N independent temperature control areas along the circumference, the number of areas N satisfies: N = 4-6 when the diameter of the crystallization wheel D ≤ 2.4m, and N = 8-12 when D > 2.4m;

[0006] Each area is equipped with a multi-dimensional cooling system, which includes:

[0007] Inner core cooling unit: the nozzle is directed to the center of the copper ingot at an inclination angle of 15°-30°;

[0008] Edge cooling unit: the nozzle covers the outer edge of the copper ingot at an inclination angle of 45°-60°;

[0009] Interface cooling unit: the nozzle acts vertically on the contact surface of the steel belt;

[0010] The fixed temperature monitoring frame is suspended along the radial direction of the crystallization wheel, and comprises: an infrared thermal imager array scanning the temperature field of the outer surface of the steel strip; and an embedded thermocouple array penetrating the steel strip to monitor the temperature of the solid-liquid interface of the copper ingot.

[0011] The dynamic balance controller cooperatively adjusts the cooling parameters based on the temperature and solidification shell thickness data to maintain a temperature difference between adjacent regions of ≤55℃ and a single region radial temperature gradient of ≤40℃ / cm.

[0012] Preferably, the boundaries of the independent temperature control regions are offset by 20-30mm from the waist line of the trapezoidal cross section of the mold cavity of the crystallization wheel, and the region width satisfies: the high temperature region accounts for 30-40% of the total width of the crystallization wheel circumference; the medium temperature region accounts for 40-50%; and the low temperature region accounts for 20-30%.

[0013] Preferably, the cooling medium of the multi-dimensional cooling system is water, and the flow control satisfies:

[0014] The flow of the inner core cooling unit is 80-150L / min;

[0015] The functional relationship between the flow Q of the interface cooling unit and the linear speed v of the steel strip is: Q=50×(1+0.1v)L / min.

[0016] Preferably, the fixed temperature monitoring frame comprises:

[0017] The first layer: a non-contact infrared sensor array, 50mm±5mm from the surface of the steel strip;

[0018] The second layer: a spring-pressing contact thermocouple, with a measurement pressure of 0.5-0.8MPa;

[0019] The third layer: an ultrasonic thickness gauge for real-time monitoring of the solidification shell thickness, which contains a coupling agent automatic supply module.

[0020] Preferably, the dynamic balance controller performs gradient temperature control: the pouring zone maintains a copper ingot surface temperature of 1080℃±15℃; the solidification zone controls a temperature gradient of 15-30℃ / cm; and the switching gradient of the cooling intensity of adjacent regions is ≤55%.

[0021] A dynamic balance crystallization method for copper ingots, realized based on any of the above devices, comprising:

[0022] Step S1: dividing the crystallization wheel into three temperature zones along the circumference: a first zone

[0023] 1150℃-1050℃, a second zone 1050℃-950℃, and a third zone 950℃-880℃;

[0024] Step S2: adjusting the temperature of each zone according to the formula ΔL=k×(T actual -T target) × v real-time adjustment of cooling unit position, where ΔL is the displacement, k is the coefficient, and the value range is 0.05-0.1, T actual is the actual measured temperature of the temperature zone corresponding to the crystallizing wheel, T target is the target temperature of the temperature zone, and v is the strip line speed.

[0025] Step S3: When the solidification shell growth rate deviation ≥ 20%, adjust the cooling unit parameters.

[0026] Preferably, in step S2: the interfacial cooling unit is preferentially adjusted when the zone temperature difference > 35℃; the inner core cooling unit is preferentially adjusted when the radial gradient > 20℃ / cm; and the compensation response time ≤ 0.3 seconds.

[0027] Preferably, in step S1, the dynamic temperature compensation includes:

[0028] When the pouring copper liquid temperature > 1150℃:

[0029] T target = T base + 0.8 × (T pour - 1150).

[0030] where T base is the original target temperature reference value of the temperature zone corresponding to the crystallizing wheel, T pour is the actual pouring copper liquid temperature.

[0031] When the strip line speed fluctuation > ± 55%:

[0032] The interfacial cooling unit flow where Q0 is the initial cooling flow when the strip line speed is the reference value V0, V is the actual line speed of the current strip, and V0 is the reference value of the strip line speed.

[0033] Preferably, in step S3, the grain control includes: when the solidification shell grows too fast: reduce the interfacial cooling intensity by 15%-20% and increase the inner core nozzle inclination angle by 5°-8°; when the solidification shell grows too slowly: increase the edge cooling flow by 20%-30% and decrease the inclination angle by 3°-5°.

[0034] Preferably, an emergency intervention strategy is set:

[0035] When the solidification shell thickness mutation rate ≥ 50% / s:

[0036] a) Turn off the interfacial cooling unit in the high temperature zone;

[0037] b) Start the edge cooling unit full flow injection;

[0038] c) Synchronously reduce the crystallizing wheel speed by 30%-40%;

[0039] Intervention duration t = (δ max -δ actual ) / (0.1×v); where δ max δ is the maximum safe thickness of the solidified shell. actual The actual solidified shell thickness detected so far, 0.1 is a coefficient, and v is the linear velocity of the steel strip.

[0040] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0041] 1. This invention divides the crystallizing wheel into multiple independent temperature control zones and determines a reasonable number of zones based on the diameter of the crystallizing wheel, thereby achieving precise temperature control at different locations on the crystallizing wheel. This effectively solves the problem of inaccurate temperature control in existing devices and avoids quality problems such as copper ingot cracks and coarse grains caused by uneven temperature.

[0042] 2. The multi-dimensional cooling system of this invention is designed to meet the different cooling needs of the inner core, edge, and contact surface with the steel strip of the copper ingot. Different nozzle tilt angles and flow control are used to improve cooling efficiency and the specificity of cooling, thereby further ensuring the crystallization quality of the copper ingot.

[0043] 3. The fixed temperature monitoring frame of this invention uses an infrared thermal imager array, an embedded thermocouple array, and an ultrasonic thickness gauge, which can comprehensively and accurately monitor the temperature field of the outer surface of the steel strip, the solid-liquid interface temperature of the copper ingot, and the thickness of the solidified shell in real time. This provides accurate data support for the dynamic balance controller to adjust the cooling parameters and ensures the stability of the crystallization process.

[0044] 4. The dynamic balance controller of this invention adjusts cooling parameters in a coordinated manner based on temperature data, maintaining the temperature difference between adjacent areas and the radial temperature gradient of a single area within a reasonable range, while performing gradient temperature control, further improving the crystallization quality of copper ingots.

[0045] 5. The dynamic temperature compensation, grain control, and emergency intervention strategies in the crystallization method enable the crystallization process to be flexibly adjusted according to the actual situation, cope with various abnormal situations, ensure the continuity and stability of copper ingot production, and improve the yield and quality of copper ingots. Attached Figure Description

[0046] The present invention will be described by way of example and with reference to the accompanying drawings, wherein:

[0047] Fig. 1 This is a schematic diagram of the main structure of the present invention;

[0048] Fig. 2 This is a schematic diagram of the left-side structure of the present invention;

[0049] Fig. 3 This is a diagram showing the division of the independent temperature control zone in this invention.

[0050] The markings in the diagram are: 1-crystallizing wheel, 2-inner core cooling unit, 3-interface cooling unit, 4-edge cooling unit, 5-fixed temperature monitoring frame, 6-steel strip, 7-nozzle. Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0052] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0053] In one embodiment of the present invention, such as Figs. 1-3 As shown, this embodiment provides a dynamic equilibrium crystallization device for copper ingots, including a crystallization wheel 1 and a steel strip 6 covering the outer circumference of the crystallization wheel 1. The crystallization wheel 1 is divided into N independent temperature control zones along its circumference. The number of zones N satisfies the following conditions: when the diameter D of the crystallization wheel 1 is ≤ 2.4m, N = 4-6; when D > 2.4m, N = 8-12.

[0054] Each area is equipped with a multi-dimensional cooling system, including:

[0055] Inner core cooling unit 2: The nozzles are pointed at the center of the copper ingot at an angle of 15°–30°;

[0056] Edge cooling unit 4: Nozzles cover the outer edge of the copper ingot at an angle of 45°–60°;

[0057] Interface cooling unit 3: The nozzle acts perpendicularly on the contact surface of the steel strip 6;

[0058] The fixed temperature monitoring frame 5 is suspended radially along the crystallizing wheel 1 and includes: an infrared thermal imager array scanning the temperature field of the outer surface of the steel strip 6; and an embedded thermocouple array penetrating the steel strip 6 to monitor the solid-liquid interface temperature of the copper ingot.

[0059] The dynamic balance controller adjusts the cooling parameters in a coordinated manner based on temperature and solidified shell thickness data to maintain the temperature difference between adjacent areas ≤55℃ and the radial temperature gradient of a single area ≤40℃ / cm.

[0060] In one embodiment of the present invention, the boundary of the independent temperature control zone is offset by 20mm-30mm from the waistline of the trapezoidal cross section of the crystallizing wheel 1, and the zone width satisfies the following: the high temperature zone occupies 30%-40% of the total circumference width of the crystallizing wheel 1; the medium temperature zone occupies 40%-50%; and the low temperature zone occupies 20%-30%.

[0061] In one embodiment of the present invention, the cooling medium of the multidimensional cooling system is water, and the flow rate control satisfies the following: the flow rate of the inner core cooling unit 2 is 80-150 L / min; the functional relationship between the flow rate Q of the interface cooling unit 3 and the linear velocity v of the steel strip 6 is: Q = 50 × (1 + 0.1v) L / min. For example, when the linear velocity v of the steel strip is 0, Q = 50 × (1 + 0) = 50 L / min, which is the basic cooling flow rate of the interface cooling unit when the steel strip is stationary; when the steel strip moves v > 0, the flow rate increases linearly with the increase of v: for every 1 unit increase in v, the flow rate Q increases by 50 × 0.1 = 5 L / min.

[0062] In one embodiment of the present invention, the fixed temperature monitoring frame 5 includes:

[0063] First layer: Non-contact infrared sensor array, 50mm ± 5mm from the surface of steel strip 6;

[0064] Second layer: Spring-pressurized contact thermocouple, measuring pressure 0.5-0.8MPa;

[0065] The third layer: An ultrasonic thickness gauge monitors the thickness of the solidified shell in real time. This ultrasonic thickness gauge includes an automatic coupling agent supply module. The rolling probe of this ultrasonic thickness gauge has a diameter... v is the linear velocity of the steel belt, f is the ultrasonic frequency of the probe (f≥10MHz). The higher the frequency, the higher the measurement accuracy. η≥0.92 is the synchronization coefficient (efficiency), which represents the synchronicity of the contact between the rolling wheel and the steel belt. Simply put: the faster the steel belt speed and the higher the ultrasonic frequency, the smaller the diameter of the rolling wheel needs to be; the higher the synchronization coefficient, the more precise the diameter design.

[0066] The coupling agent circulation system uses water-based gel as the material for the coupling agent. Water-based gel has the characteristics of good fluidity, non-corrosiveness to steel strip, and easy cleaning, making it suitable for metal sheet production lines. The flow rate is 0.5 mL / s. The amount of coupling agent supplied per unit time needs to balance "filling gaps" and "no waste / no accumulation"—too low a flow rate may lead to insufficient coupling (weak signal), while too high a flow rate may drip and contaminate the equipment or affect the steel strip drying process. 0.5 mL / s is a typical optimized value for continuous steel strip movement scenarios.

[0067] The probe features a recessed mounting structure, protruding 2mm from the support bracket. This ensures stable contact between the probe and the steel strip surface, preventing probe detachment due to slight vibrations or surface unevenness of the steel strip, thus ensuring measurement continuity. The probe's roller protrudes 2mm beyond the mounting bracket (the structure that secures the probe). As the steel strip passes, the probe is "slightly compressed" (similar to spring pressure) by the support of the steel strip, maintaining close contact with the steel strip surface. Simultaneously, the 2mm protrusion accommodates minor undulations on the steel strip surface (such as 0.1-1mm unevenness), preventing collisions between the support bracket and the steel strip.

[0068] In one embodiment of the present invention, the dynamic balance controller performs gradient temperature control: the surface temperature of the copper ingot is maintained at 1080℃±15℃ in the casting zone; the temperature gradient in the solidification zone is controlled at 15-30℃ / cm; and the cooling intensity switching gradient between adjacent zones is ≤55%.

[0069] A method for dynamic equilibrium crystallization of copper ingots, implemented based on any of the above-mentioned devices, includes:

[0070] Step S1: Divide the crystallizing wheel 1 into three temperature zones along its circumference: Zone 1: 1150℃

[0071] -1050℃, Level 2 zone 1050℃-950℃, Level 3 zone 950℃-880℃;

[0072] Step S2: Using the formula ΔL=k×(T) actual -T target The position of the cooling unit is adjusted in real time by ΔL × v, where ΔL is the displacement, k is a coefficient ranging from 0.05 to 0.1, and T is the displacement value. actual T represents the actual measured temperature of the temperature zone corresponding to crystallizing wheel 1. target Here, v represents the target temperature for this temperature zone, and v is the linear velocity of the steel strip. This formula calculates the deviation between the actual temperature of the crystallizing wheel and the target temperature in real time, combines this with the linear velocity of the steel strip, and then converts it into the displacement of the cooling unit through a coefficient k, thereby achieving dynamic adjustment of the cooling position. Its core purpose is to maintain the stability of each temperature zone of the crystallizing wheel by precisely adjusting the cooling intensity, ensuring that the solidified shell of the copper ingot grows at the expected rate, and ultimately achieving dynamic equilibrium crystallization of the copper ingot.

[0073] Step S3: When the solidified shell growth rate deviation is ≥20%, adjust the cooling unit parameters. Preferably, in step S2:

[0074] When the regional temperature difference is >35℃, the interface cooling unit 3 should be adjusted first.

[0075] When the radial gradient is >20℃ / cm, the inner core cooling unit 2 should be adjusted first.

[0076] The compensation response time is ≤0.3 seconds.

[0077] Furthermore, the dynamic temperature compensation in step S1 includes:

[0078] When the temperature of the poured copper liquid is >1150℃:

[0079] T target =T base +0.8×(T pour -1150);

[0080] In the formula, T base The original target temperature reference value, T, refers to the temperature zone corresponding to crystallizing wheel 1. pour This represents the actual temperature of the poured copper liquid, and 0.8 is a coefficient. Its function is to dynamically match the heat input: when the pouring temperature is too high, by increasing the target temperature, the actual cooling capacity of the cooling unit is reduced, preventing excessively rapid solidification shell growth or localized overheating due to excessive temperature differences. It also protects equipment and process stability: preventing the cooling unit from experiencing excessive thermal stress due to overcooling, while ensuring that the solidification behavior of the copper ingot at high temperatures meets expectations.

[0081] When the linear velocity fluctuation of the steel strip is >±55%:

[0082] Interface cooling unit 3 flow rate In the formula, Q0 is the initial cooling flow rate when the linear velocity of steel strip 6 is the reference value V0, V is the current actual linear velocity of steel strip 6, and V0 is the reference value of the linear velocity of steel strip 6. Its function is to dynamically balance cooling intensity: when the linear velocity fluctuates, adjusting the cooling flow rate ensures that the effective cooling time of the copper ingot in each temperature zone of the crystallizing wheel remains stable, avoiding uncontrolled growth rate of the solidified shell due to velocity changes. It also suppresses temperature fluctuations: for example, when the linear velocity suddenly increases, increasing the cooling flow rate can prevent the copper ingot from overheating due to shortened residence time; conversely, when the linear velocity decreases, reducing the flow rate can avoid the risk of brittleness caused by overcooling.

[0083] Furthermore, grain control in step S3 includes: when the solidified shell grows too fast: reducing the interface cooling intensity by 15%-20% and increasing the inclination angle of the inner core nozzle by 5°-8°;

[0084] When the solidified shell grows too slowly: increase the edge cooling flow rate by 20%-30% and reduce the tilt angle by 3°-5°.

[0085] Furthermore, establish emergency intervention strategies:

[0086] When the abrupt change rate of solidified shell thickness is ≥50% / s:

[0087] a) Cut off the interface cooling unit 3 in the high-temperature zone;

[0088] b) Activate edge cooling unit 4 for full-flow injection;

[0089] c) Simultaneously reduce the rotational speed of crystallizing wheel 1 by 30%-40%;

[0090] Intervention duration t = (δ max -δ actual ) / (0.1×v); where δ max δ is the maximum safe thickness of the solidified shell. actual The actual solidified shell thickness currently detected is represented by 0.1, which is a coefficient, and v is the linear velocity of the steel strip. This formula achieves precise control of emergency intervention measures by quantifying the relationship between solidified shell thickness deviation and recovery capacity.

[0091] Application Example 1

[0092] This application example provides a dynamic equilibrium crystallization device for copper ingots, with a crystallization wheel diameter of 2m.

[0093] The crystallizing wheel 1 is divided into 5 independent temperature-controlled zones along its circumference. Each zone is equipped with a multi-dimensional cooling system. The nozzle 7 of the inner core cooling unit 2 is tilted at 20° towards the center of the copper ingot, with a flow rate of 100 L / min. The nozzle 7 of the edge cooling unit 4 covers the outer edge of the copper ingot at a 50° angle. The nozzle of the interface cooling unit 3 acts perpendicularly on the contact surface of the steel strip 6, and its flow rate Q is a function of the linear velocity v of the steel strip, which is Q = 50 × (1 + 0.1v) L / min.

[0094] The fixed temperature monitoring frame 5 is suspended radially along the crystallizing wheel. The first layer is a non-contact infrared sensor array 50mm away from the surface of the steel strip 6; the second layer is a spring-pressurized contact thermocouple with a measuring pressure of 0.6MPa; and the third layer is an ultrasonic thickness gauge that monitors the thickness of the solidified shell in real time.

[0095] The dynamic balance controller performs gradient temperature control: the surface temperature of the copper ingot is maintained at 1080℃ in the casting zone; the temperature gradient in the solidification zone is controlled at 20℃ / cm; and the cooling intensity of adjacent zones is switched at a gradient of 50%.

[0096] The boundary of the independent temperature control zone is offset by 25mm from the waistline of the trapezoidal cross-section of the crystallizing wheel cavity. The zone width satisfies the following requirements: the high-temperature zone accounts for 35% of the total circumference width of the crystallizing wheel; the medium-temperature zone accounts for 45%; and the low-temperature zone accounts for 20%.

[0097] The method for dynamic equilibrium crystallization of copper ingots based on the above-mentioned apparatus includes the following steps:

[0098] Step S1: Divide the crystallizing wheel into three temperature zones along its circumference: Zone 1: 1150℃-1050℃, Zone 2: 1050℃-950℃, Zone 3: 950℃-880℃.

[0099] Step S2: Using the formula ΔL=0.08×(T) actual -T targetThe cooling unit position is adjusted in real time. When the regional temperature difference is >35℃, the interface cooling unit 3 is adjusted first; when the radial gradient is >20℃ / cm, the inner core cooling unit 2 is adjusted first; the compensation response time is 0.2 seconds. Dynamic temperature compensation: When the temperature of the poured copper liquid is >1150℃, T target =T base +0.8×(T pour -1150); When the strip linear speed fluctuation is >±55%, the flow rate of the interface cooling unit.

[0100] Step S3: When the solidified shell growth rate deviation is ≥20%, grain control is performed. If the solidified shell grows too fast, the interface cooling intensity is reduced by 18% and the inner core nozzle tilt angle is increased by 6°; if the solidified shell grows too slowly, the edge cooling flow rate is increased by 25% and the tilt angle is decreased by 4°.

[0101] Emergency intervention strategy: When the solidified shell thickness abrupt change rate is ≥50% / s, a) cut off the interface cooling unit in the high-temperature zone (3); b) start the edge cooling unit (4) for full-flow injection; c) simultaneously reduce the crystallizing wheel speed by 35%; intervention duration t=(δ max -δ actual ) / (0.1×v). Application Example 2

[0102] This application example provides a dynamic equilibrium crystallization device for copper ingots, with a crystallization wheel diameter of 3m.

[0103] The crystallizing wheel 1 is divided into 10 independent temperature-controlled zones along its circumference. Each zone is equipped with a multi-dimensional cooling system. The nozzle 7 of the inner core cooling unit 2 is tilted at 25° towards the center of the copper ingot, with a flow rate of 120 L / min. The nozzle 7 of the edge cooling unit 4 covers the outer edge of the copper ingot at a 55° angle. The nozzle of the interface cooling unit 3 acts perpendicularly on the contact surface of the steel strip 6, and its flow rate Q is a function of the linear velocity v of the steel strip, which is Q = 50 × (1 + 0.1v) L / min.

[0104] The fixed temperature monitoring frame 5 is suspended radially along the crystallizing wheel. The first layer is a non-contact infrared sensor array 52mm away from the surface of the steel strip 6; the second layer is a spring-pressurized contact thermocouple with a measuring pressure of 0.7MPa; and the third layer is an ultrasonic thickness gauge that monitors the thickness of the solidified shell in real time.

[0105] The dynamic balance controller performs gradient temperature control: the surface temperature of the copper ingot is maintained at 1090℃ in the casting zone; the temperature gradient in the solidification zone is controlled at 25℃ / cm; and the cooling intensity switching gradient between adjacent zones is 52%.

[0106] The boundary of the independent temperature control zone is offset by 28mm from the waistline of the trapezoidal section of the crystallizing wheel cavity. The zone width satisfies the following requirements: the high-temperature zone accounts for 38% of the total circumference width of the crystallizing wheel; the medium-temperature zone accounts for 42%; and the low-temperature zone accounts for 20%.

[0107] The method for dynamic equilibrium crystallization of copper ingots based on the above-mentioned apparatus includes the following steps:

[0108] Step S1: Divide the crystallizing wheel into three temperature zones along its circumference: Zone 1: 1150℃-1050℃, Zone 2: 1050℃-950℃, Zone 3: 950℃-880℃.

[0109] Step S2: Using the formula ΔL=0.09×(T) actual -T target The cooling unit position is adjusted in real time. When the regional temperature difference is >35℃, the interface cooling unit 3 is adjusted first; when the radial gradient is >20℃ / cm, the inner core cooling unit 2 is adjusted first; the compensation response time is 0.25 seconds.

[0110] Dynamic temperature compensation: When the temperature of the poured copper liquid is >1150℃, T target =T base +0.8×(T pour -1150); When the strip linear speed fluctuation is >±55%, the flow rate of the interface cooling unit.

[0111] Step S3: When the solidified shell growth rate deviation is ≥20%, grain control is performed. If the solidified shell grows too fast, the interface cooling intensity is reduced by 19% and the inner core nozzle tilt angle is increased by 7°; if the solidified shell grows too slowly, the edge cooling flow rate is increased by 28% and the tilt angle is decreased by 4°.

[0112] Emergency intervention strategy: When the solidified shell thickness abrupt change rate is ≥50% / s, a) cut off the interface cooling unit 3 in the high-temperature zone; b) activate the full-flow injection of the edge cooling unit 4; c) simultaneously reduce the crystallizing wheel speed by 38%; intervention duration t=(δ max -δ actual ) / (0.1×v).

[0113] The above are merely preferred embodiments of the present invention and do not limit the patent scope of the present invention. Any equivalent structural transformations made under the concept of the present invention using the description and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A dynamic equilibrium crystallization device for copper ingots, comprising a crystallizing wheel (1) and a steel strip (6) covering the outer periphery of the crystallizing wheel, characterized in that: The crystallizing wheel (1) is divided into N independent temperature control zones along its circumference. The number of zones N satisfies the following conditions: when the diameter of the crystallizing wheel D ≤ 2.4 m, N = 4-6; when D > 2.4 m, N = 8-12. Each area is equipped with a multi-dimensional cooling system, including: Inner core cooling unit (2): Nozzle (7) is pointed at the center of copper ingot at an angle of 15°–30°; Edge cooling unit (4): Nozzles (7) cover the outer edge of the copper ingot at an angle of 45°–60°; Interface cooling unit (3): The nozzle acts perpendicularly on the contact surface of the steel strip (6); A fixed temperature monitoring frame (5) is suspended radially along the crystallizing wheel and includes: an infrared thermal imager array scanning the temperature field of the outer surface of the steel strip (6); and an embedded thermocouple array penetrating the steel strip (6) to monitor the solid-liquid interface temperature of the copper ingot. The dynamic balance controller adjusts the cooling parameters in a coordinated manner based on temperature and solidified shell thickness data to maintain the temperature difference between adjacent areas ≤55℃ and the radial temperature gradient of a single area ≤40℃ / cm.

2. The apparatus according to claim 1, characterized in that: The boundary of the independent temperature control zone is offset from the waistline of the trapezoidal cross-section of the crystallizing wheel cavity by 20mm-30mm, and the zone width satisfies: The high-temperature zone occupies 30%-40% of the total circumference width of the crystallizing wheel; Medium temperature zone accounts for 40%-50%; The low-temperature zone accounts for 20%-30%.

3. The apparatus according to claim 1, characterized in that: The cooling medium of the multi-dimensional cooling system is water, and the flow control satisfies the following: The flow rate of the inner core cooling unit (2) is 80-150 L / min; The functional relationship between the flow rate Q of the interface cooling unit (3) and the linear velocity v of the steel strip is: Q = 50 × (1 + 0.1v) L / min.

4. The apparatus according to claim 1, characterized in that: The fixed temperature monitoring frame (5) includes: First layer: Non-contact infrared sensor array, 50mm ± 5mm from the surface of steel strip (6); Second layer: Spring-pressurized contact thermocouple, measuring pressure 0.5-0.8MPa; The third layer: An ultrasonic thickness gauge monitors the thickness of the solidified shell in real time. This ultrasonic thickness gauge includes an automatic coupling agent supply module.

5. The apparatus according to claim 1, characterized in that: The dynamic balance controller performs gradient temperature control: The surface temperature of the copper ingot is maintained at 1080℃±15℃ in the casting zone; The temperature gradient in the solidification zone should be controlled at 15-30℃ / cm. The cooling intensity switching gradient between adjacent areas is ≤55%.

6. A method for dynamic equilibrium crystallization of copper ingots, implemented based on the apparatus of any one of claims 1-5, characterized in that... include: Step S1: Divide the crystallizing wheel into three temperature zones along its circumference: Zone 1: 1150℃ -1050℃, Level 2 zone 1050℃-950℃, Level 3 zone 950℃-880℃; Step S2: Using the formula ΔL=k×(T) actual -T target The position of the cooling unit is adjusted in real time by ΔL × v, where ΔL is the displacement, k is a coefficient ranging from 0.05 to 0.1, and T is the displacement value. actual T represents the actual measured temperature of the temperature zone corresponding to the crystallizing wheel. target Here, v represents the target temperature for this temperature range, and v represents the linear velocity of the steel strip. Step S3: When the solidified shell growth rate deviation is ≥20%, adjust the cooling unit parameters.

7. The method according to claim 6, characterized in that... In step S2: When the temperature difference between regions is greater than 35°C, the interface cooling unit (3) should be adjusted first. When the radial gradient is >20℃ / cm, the inner core cooling unit should be adjusted first (2); The compensation response time is ≤0.3 seconds.

8. The method according to claim 6, characterized in that... The dynamic temperature compensation in step S1 includes: When the temperature of the poured copper liquid is >1150℃: T target =T base +0.8×(T pour -1150); In the formula, T base The original target temperature reference value (T) for the temperature zone corresponding to the crystallizing wheel. pour It is the actual temperature of the poured copper liquid; When the steel strip speed fluctuation is >±55%: Interface cooling unit flow rate In the formula, Q0 is the initial cooling flow rate when the strip linear velocity is the reference value V0, V is the current actual strip linear velocity, and V0 is the reference value of the strip linear velocity.

9. The method according to claim 6, characterized in that... Grain control in step S3 includes: when the solidified shell grows too fast: reduce the interface cooling intensity by 15%-20% and increase the inclination angle of the inner core nozzle by 5°-8°; When the solidified shell grows too slowly: increase the edge cooling flow rate by 20%-30% and reduce the tilt angle by 3°-5°.

10. The method according to claim 6, characterized in that... Set up emergency intervention strategies: When the abrupt change rate of solidified shell thickness is ≥50% / s: a) Cut off the interface cooling unit (3) in the high-temperature zone; b) Activate the edge cooling unit (4) for full-flow injection; c) Simultaneously reduce the crystallizing wheel speed by 30%-40%; Intervention duration t = (δ max -δ actual ) / (0.1×v); where δ max δ is the maximum safe thickness of the solidified shell. actual The actual solidified shell thickness detected so far, 0.1 is a coefficient, and v is the linear velocity of the steel strip.

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