Semiconductor coating equipment with wafer protection mechanism

Abstract

The invention relates to the field of wafer coating, and discloses semiconductor coating equipment with a wafer protection mechanism, the semiconductor coating equipment comprises a cabinet body and a placement mechanism arranged in the cabinet body, the placement mechanism comprises a placement assembly arranged in the cabinet body, a protection cover plate assembly is arranged above the placement assembly, and the wafer protection mechanism is arranged above the protection cover plate assembly. According to the argon gas curtain system, dynamic protection and cleaning of the whole process of a wafer are achieved through the design of an air channel and an inclined air outlet hole, specifically, after argon gas is injected from a fixing column, the argon gas enters a connecting column through a long connecting rod and a short connecting rod, and then the argon gas is injected into the connecting column through the long connecting rod and the short connecting rod; and finally, a conical air curtain surrounding the wafer is formed through a plurality of inclined air outlet holes, cleaning is conducted before film coating, adsorbed tiny dust or particles are effectively removed through inclined air flow, isolation is conducted in the film coating process, a physical barrier is formed through the inclined spraying angle of the air curtain, and after film coating, high-speed flowing of argon accelerates wafer cooling, and meanwhile volatile by-products generated through reaction are taken away.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of wafer coating, and particularly relates to a semiconductor coating equipment with a wafer protection mechanism. BACKGROUND

[0002] In the patent application with the application publication number CN210420147U, the patent application comprises a mounting plate, a base, a first condensing pipe, a cooling box, a refrigerator, a second condensing pipe, a fan, a door body, a vacuumizing joint, a vacuum pump, a coating chamber, an exhaust joint, an air inlet pipe, a water tank, cooling fins and semiconductor refrigeration pieces. The utility model discloses a cooling mechanism can make the gas with lower temperature pass through the first condensing pipe, at this time, the heat in the coating chamber is taken away by the gas with reduced temperature through the first condensing pipe, so that the cooling and temperature reduction effect is achieved, the cooling and temperature reduction effect is better, the time required for temperature reduction of the coating chamber is shortened, and the normal work of the vacuum coating equipment is ensured. The vacuumizing mechanism of the application can remove dust in the extracted air when vacuumizing, so that the dust extracted from the coating equipment is prevented from being scattered around the coating equipment, and the dust-free level of the space where the coating equipment is placed is improved.

[0003] In the above-mentioned patent, the coating equipment has the problems that dust and particles may occur during wafer coating, product yield is reduced, electron beam evaporation material diffuses in disorder, the cavity is polluted, equipment maintenance cost is increased, uneven cooling and byproduct attachment may affect film performance, the traditional fixed protective cover occupies a large space, equipment operation efficiency is reduced, production flexibility and capacity are restricted. SUMMARY

[0004] The application aims to provide a semiconductor coating equipment with a wafer protection mechanism to solve the problems in the background.

[0005] To solve the above-mentioned technical problems, the technical scheme of the application is as follows: a semiconductor coating equipment with a wafer protection mechanism, comprising a cabinet body and a placing mechanism arranged in the cabinet body, the placing mechanism comprises a placing assembly arranged in the cabinet body, a protective cover plate assembly is arranged above the placing assembly, and a connecting assembly is arranged above the protective cover plate assembly. The connecting assembly comprises a connecting long rod fixedly arranged on one side of the cabinet body, a fixed column is fixedly connected to one end of the connecting long rod, a connecting short rod is fixedly connected to the end of the connecting long rod away from the fixed column, a connecting column is fixedly connected to the lower end of the connecting short rod, air channels are arranged in the fixed column, the connecting long rod, the connecting short rod and the connecting column, a driven gear is fixedly connected to the outer side of the connecting short rod, a rotating groove is arranged on the outer side of the connecting column, a plurality of inclined air outlets are arranged below the connecting column, and the air outlets and the air channels are connected in penetration.

[0006] As preferred, the protective cover plate assembly comprises a fixed fan plate arranged outside the connecting column, a first rotating fan plate arranged outside the fixed fan plate, a second rotating fan plate arranged outside the first rotating fan plate, and a third rotating fan plate arranged outside the second rotating fan plate.

[0007] As preferred, the fixed fan plate is fixedly connected below the outside of the connecting column, an L-shaped rubber rod is fixedly connected above one side of the fixed fan plate, a first arc-shaped sliding groove is arranged on the outside of the fixed fan plate, and a sealing rubber pad is arranged above the side of the fixed fan plate away from the L-shaped rubber rod.

[0008] As preferred, the first rotating fan plate is fixedly connected with a first rotating ring on the side close to the connecting column, a second arc-shaped sliding groove is arranged on the outside of the first rotating fan plate, a first connecting short plate is fixedly connected on one side of the first rotating fan plate, a limiting block is fixedly connected on the side of the first connecting short plate toward the fixed fan plate, the limiting block on the side of the first connecting short plate is in sliding connection with the first arc-shaped sliding groove, the first rotating ring is rotatably arranged in the rotating groove, and a sealing rubber pad is arranged above the side of the first rotating fan plate away from the L-shaped rubber rod.

[0009] As preferred, the second rotating fan plate is fixedly connected with a second rotating ring on the side close to the connecting column, the second rotating ring is arranged above the first rotating ring, the second rotating ring is rotatably arranged in the rotating groove, a sealing rubber pad is arranged above the side of the second rotating fan plate away from the L-shaped rubber rod, a third arc-shaped sliding groove is arranged on the outside of the second rotating fan plate, a second connecting short plate is fixedly connected on one side of the second rotating fan plate, a limiting block is fixedly connected on the side of the second connecting short plate, and the limiting block on the side of the second connecting short plate is in sliding connection with the second arc-shaped sliding groove.

[0010] As preferred, the third rotating fan plate is fixedly connected with a third rotating ring on the side close to the connecting column, the third rotating ring is arranged above the second rotating ring, a third connecting short plate is fixedly connected on one side of the third rotating fan plate, a limiting block is fixedly connected on the side of the third connecting short plate, the limiting block on the side of the third connecting short plate is in sliding connection with the third arc-shaped sliding groove, a fixed ring is fixedly connected on the upper end of the third rotating fan plate, a first motor is fixedly arranged inside the fixed ring, a driving gear is fixedly connected on the output end of the first motor, and the driving gear is in meshing connection with a driven gear.

[0011] As preferred, the placing assembly comprises a long rod fixedly arranged inside the cabinet body, two support plates fixedly connected to the upper end of the long rod, a support ring fixedly connected to the upper end of the long rod, a second motor fixedly arranged in the support ring, a connecting ring fixedly connected to the upper ends of the two support plates, a rotating disc rotatably connected inside the connecting ring, a plurality of placing grooves formed in the rotating disc, and the second motor output end fixedly connected to the rotating disc.

[0012] As preferred, the cabinet body is internally arranged with a vacuum pump assembly and an electron beam evaporator.

[0013] Compared with the prior art, the technical scheme of the present application has the following advantages: (1) The cabinet body is internally arranged with a connecting assembly, a protective cover plate assembly and a placing assembly, the argon gas curtain system is designed through the gas channel and the oblique gas outlet holes, so as to realize the dynamic protection and cleaning of the wafer in the whole process, specifically, after the argon gas is injected from the fixed column, it enters the connecting column through the connecting long rod and the connecting short rod, and finally forms a conical gas curtain surrounding the wafer through a plurality of oblique gas outlet holes. This design plays a key role in the three stages of before, during and after coating. Before coating, the oblique gas flow sweeps the wafer surface in the placing groove at a certain pressure, effectively removing the adsorbed dust or particles, avoiding defects during coating, during coating, the physical barrier formed by the oblique injection angle of the gas curtain inhibits the disordered diffusion of the electron beam evaporation material in the vacuum cavity, reduces the pollution of the inner wall of the cavity, and prolongs the equipment maintenance period. After coating, the high-speed flow of argon gas accelerates the cooling of the wafer, and at the same time carries away the volatile by-products generated in the reaction, avoiding their re-attachment. Combined with the uniform rotation of the rotating disc, the gas curtain uniformly covers the whole wafer, the cooling efficiency is improved, and the protective cover plate assembly realizes the efficient use of wafer protection and equipment space through the linkage folding mechanism of multiple fan plates. The traditional fixed protective cover needs to reserve a large opening and closing space, while the folding design of the present application only needs to rotate the third rotating fan plate to completely unfold, reducing the occupied space. For example, when replacing the wafer, the area of the placing groove exposed after the fan plate is folded increases, facilitating the operation of the mechanical hand. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the present application; Figure 2 It is a schematic diagram of the placing mechanism structure of the present application; Figure 3 It is a schematic diagram of the connecting assembly and protective cover plate assembly structure of the present application; Figure 4 It is a schematic diagram of the connecting assembly structure of the present application; Figure 5 It is a schematic diagram of the connecting assembly flip structure of the present application; Figure 6Structure diagram of protective cover plate assembly of the present application; Figure 7 Structure diagram of fixed fan plate and first rotating fan plate of the present application; Figure 8 Structure diagram of first rotating fan plate and second rotating fan plate of the present application; Figure 9 Structure diagram of second rotating fan plate and third rotating fan plate of the present application; Figure 10 Structure diagram of placing assembly of the present application; Figure 11 Structure diagram of part of placing assembly of the present application.

[0015] In the figure: 1, cabinet body; 2, placing mechanism; 21, connecting assembly; 211, connecting long rod; 212, fixed column; 213, connecting short rod; 214, connecting column; 215, air channel; 216, driven gear; 217, rotating groove; 218, air outlet hole; 22, protective cover plate assembly; 221, fixed fan plate; 2211, L-shaped rubber rod; 2212, first arc-shaped sliding groove; 222, first rotating fan plate; 2221, second arc-shaped sliding groove; 2222, first connecting short plate; 2223, first rotating ring; 223, second rotating fan plate; 2231, third arc-shaped sliding groove; 2232, second connecting short plate; 2233, second rotating ring; 224, third rotating fan plate; 2241, third connecting short plate; 2242, third rotating ring; 2243, fixed ring; 2244, first motor; 2245, driving gear; 23, placing assembly; 231, connecting ring; 232, rotating disc; 233, placing groove; 234, long rod; 235, support plate; 236, support ring; 237, second motor; 24, sealing rubber pad. DETAILED DESCRIPTION

[0016] So that the purposes, technical solutions and advantages of the embodiments of the present disclosure are clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below in combination with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without any creative effort fall within the protection scope of the present disclosure.

[0017] Unless otherwise defined, technical terms or scientific terms used in the present disclosure shall have the same meaning as commonly understood by one of ordinary skill in the art to which this present disclosure belongs. The terms "comprising" or "including" or similar words used in the present disclosure intend to encompass the elements or objects listed after such terms, as well as equivalents thereof, without excluding other elements or objects. The terms "connected" or "coupled" or similar words used in the present disclosure do not exclude physical or mechanical connections or couplings, but also include electrical connections or couplings, whether direct or indirect. The terms "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships, and when the absolute positions of the described objects are changed, the relative positional relationships may also be changed accordingly.

[0018] As shown in Figures 1 to 11 The present application provides a semiconductor coating equipment with wafer protection mechanism, which comprises a cabinet body 1 and a placing mechanism 2 arranged in the cabinet body 1. The placing mechanism 2 comprises a placing assembly 23 arranged in the cabinet body 1. A protection cover plate assembly 22 is arranged above the placing assembly 23. A connecting assembly 21 is arranged above the protection cover plate assembly 22. The connecting assembly 21 comprises a connecting long rod 211 fixedly arranged on one side of the cabinet body 1. A fixed column 212 is fixedly connected to one end of the connecting long rod 211. A connecting short rod 213 is fixedly connected to the end of the connecting long rod 211 away from the fixed column 212. A connecting column 214 is fixedly connected to the lower end of the connecting short rod 213. Air channels 215 are arranged in the fixed column 212, the connecting long rod 211, the connecting short rod 213 and the connecting column 214. A driven gear 216 is fixedly connected to the outer side of the connecting short rod 213. A rotating groove 217 is arranged on the outer side of the connecting column 214. A plurality of inclined air outlets 218 are arranged below the connecting column 214. The air outlets 218 are in communication with the air channels 215. A screw thread is arranged on the outer side of the fixed column 212. The fixed column 212 is used to connect an argon gas supply device.

[0019] The protection cover plate assembly 22 comprises a fixed fan plate 221 arranged on the outer side of the connecting column 214. A first rotating fan plate 222 is arranged on the outer side of the fixed fan plate 221. A second rotating fan plate 223 is arranged on the outer side of the first rotating fan plate 222. A third rotating fan plate 224 is arranged on the outer side of the second rotating fan plate 223.

[0020] The fixed fan plate 221 is fixedly connected to the outer side below the connecting column 214. An L-shaped rubber rod 2211 is fixedly connected to the upper side of one side of the fixed fan plate 221. A first arc-shaped sliding groove 2212 is arranged on the outer side of the fixed fan plate 221. A sealing rubber pad 24 is arranged on the upper side of the side of the fixed fan plate 221 away from the L-shaped rubber rod 2211.

[0021] The first rotating fan plate 222 is fixedly connected with a first rotating ring 2223 on one side close to the connecting column 214, and a second arc-shaped sliding groove 2221 is arranged on the outer side of the first rotating fan plate 222. A first connecting short plate 2222 is fixedly connected to one side of the first rotating fan plate 222, and a limiting block is fixedly connected to one side of the first connecting short plate 2222 towards the fixed fan plate 221. The limiting block on one side of the first connecting short plate 2222 is in sliding connection with the first arc-shaped sliding groove 2212. The first rotating ring 2223 is rotatably arranged in the rotating groove 217. A sealing rubber pad 24 is arranged above one side of the first rotating fan plate 222 away from the L-shaped rubber rod 2211.

[0022] The second rotating fan plate 223 is fixedly connected with a second rotating ring 2233 on one side close to the connecting column 214, and the second rotating ring 2233 is arranged above the first rotating ring 2223. The second rotating ring 2233 is rotatably arranged in the rotating groove 217. A sealing rubber pad 24 is arranged above one side of the second rotating fan plate 223 away from the L-shaped rubber rod 2211. A third arc-shaped sliding groove 2231 is arranged on the outer side of the second rotating fan plate 223. A second connecting short plate 2232 is fixedly connected to one side of the second rotating fan plate 223. A limiting block is fixedly connected to one side of the second connecting short plate 2232. The limiting block on one side of the second connecting short plate 2232 is in sliding connection with the second arc-shaped sliding groove 2221.

[0023] The third rotating fan plate 224 is fixedly connected with a third rotating ring 2242 on one side close to the connecting column 214, and the third rotating ring 2242 is arranged above the second rotating ring 2233. A third connecting short plate 2241 is fixedly connected to one side of the third rotating fan plate 224. A limiting block is fixedly connected to one side of the third connecting short plate 2241. The limiting block on one side of the third connecting short plate 2241 is in sliding connection with the third arc-shaped sliding groove 2231. A fixing ring 2243 is fixedly connected to the upper end of the third rotating fan plate 224. A first motor 2244 is fixedly arranged inside the fixing ring 2243. A driving gear 2245 is fixedly connected to the output end of the first motor 2244. The driving gear 2245 is in meshing connection with the driven gear 216. The driving gear 2245 drives the third rotating fan plate 224 to rotate through the meshing with the driven gear 216.

[0024] The placing assembly 23 comprises a long rod 234 fixedly arranged inside the cabinet body 1. Two support plates 235 are fixedly connected to the upper end of the long rod 234. A support ring 236 is fixedly connected to the upper end of the long rod 234. A second motor 237 is fixedly arranged inside the support ring 236. The upper ends of the two support plates 235 are fixedly connected with a connecting ring 231. A rotating disc 232 is rotatably connected inside the connecting ring 231. A plurality of placing grooves 233 are arranged on the rotating disc 232. The rotating disc 232 is rotatably connected above the support ring 236. The output end of the second motor 237 is fixedly connected with the rotating disc 232.

[0025] The fixed fan plate 221, the first rotating fan plate 222, the second rotating fan plate 223 and the third rotating fan plate 224 are in contact with the upper portion of the connecting ring 231, and the L-shaped rubber rod 2211 corresponds to the third rotating fan plate 224.

[0026] The cabinet 1 is internally provided with a vacuum pump assembly and an electron beam evaporator.

[0027] The working principle of the present application is as follows: the wafer is placed in the second rotating fan plate 223 below the fixed fan plate 221, the second rotating fan plate 223 cannot be placed with a wafer, at this time, the output end of the second motor 237 drives the rotating disc 232 to rotate, so that the second rotating fan plate 223 below the fixed fan plate 221 leaks out, after the wafer is placed, the cabinet 1 sealing door is closed, the vacuum pump assembly is started to extract vacuum, so that the internal cabinet 1 reaches the required vacuum degree of electron beam evaporation; When the protective cover plate assembly 22 is in the unfolded state, the fixed fan plate 221, the first rotating fan plate 222, the second rotating fan plate 223 and the third rotating fan plate 224 form a circular protective cover through the cooperation of the arc-shaped sliding groove and the limiting block, covering the wafer in the placement groove 233; The first motor 2244 drives the driving gear 2245, the driving gear 2245 meshes with the driven gear 216, at this time, the driving gear 2245 rotates around the driven gear 216, the driving gear 2245 drives the third rotating ring 2242 in the rotating groove 217 through the first motor 2244, the fixed ring 2243 and the third rotating fan plate 224, when the third rotating fan plate 224 drives the third connecting short plate 2241 to rotate, the third connecting short plate 2241 drives the limiting block to slide to one end of the third arc-shaped sliding groove 2231, then pulls the second rotating fan plate 223 to rotate through the third arc-shaped sliding groove 2231, the second rotating fan plate 223 drives the second rotating ring 2233 to rotate in the rotating groove 217, when the second rotating fan plate 223 drives the second connecting short plate 2232 to rotate, the second connecting short plate 2232 drives the limiting block to slide to one end of the second arc-shaped sliding groove 2221, then pulls the first rotating fan plate 222 to rotate through the second arc-shaped sliding groove 2221, the first rotating fan plate 222 drives the second rotating ring 2233 to rotate in the rotating groove 217, when the first rotating fan plate 222 drives the first connecting short plate 2222 to rotate, the first connecting short plate 2222 drives the limiting block to slide to one end of the first arc-shaped sliding groove 2212, then the first motor 2244 stops, at this time, the fixed fan plate 221, the first rotating fan plate 222, the second rotating fan plate 223 and the third rotating fan plate 224 form a circular protective cover, the sealing rubber pad 24 and the L-shaped rubber rod 2211 arranged between the fixed fan plate 221, the first rotating fan plate 222, the second rotating fan plate 223 and the third rotating fan plate 224 ensure the air tightness when closed; The argon gas supply device injects argon gas into the gas channel 215, which is transported to the connecting column 214 through the connecting long rod 211 and the connecting short rod 213, and finally sprayed out from the oblique gas outlet hole 218 to form a gas curtain isolation. Before coating, the argon gas flow forms a gas curtain to blow off the residual particles on the wafer surface. In the coating process, the oblique gas flow inhibits the diffusion of the evaporated material in the non-target area, reduces the backside contamination. After coating, the gas flow assists in cooling the wafer and removing the reaction byproducts. The second motor 237 drives the rotating disc 232 to rotate, so that the wafer placed in the placing groove 233 rotates at a uniform speed, and the uniform deposition of the electron beam evaporated material is ensured.

[0028] The above embodiments are only exemplary embodiments of the present application and are not used to limit the present application. The protection scope of the present application is defined by the claims. Those skilled in the art can make various modifications or equivalent replacements to the present application within the spirit and protection scope of the present application, and such modifications or equivalent replacements shall also be considered to fall within the protection scope of the present application.

Claims

1. A semiconductor coating apparatus with a wafer protection mechanism, comprising a cabinet (1) and a placement mechanism (2) disposed within the cabinet (1), characterized in that: The placement mechanism (2) includes a placement component (23) disposed inside the cabinet (1), a protective cover assembly (22) disposed above the placement component (23), and a connecting component (21) disposed above the protective cover assembly (22). The connecting assembly (21) includes a connecting long rod (211) fixedly installed on one side inside the cabinet (1). One end of the connecting long rod (211) is fixedly connected to a fixed post (212). The end of the connecting long rod (211) away from the fixed post (212) is fixedly connected to a connecting short rod (213). The lower end of the connecting short rod (213) is fixedly connected to a connecting post (214). Air passages (215) are opened in the fixed post (212), the connecting long rod (211), the connecting short rod (213) and the connecting post (214). A driven gear (216) is fixedly connected to the outside of the connecting short rod (213). A rotating groove (217) is opened on the outside of the connecting post (214). Multiple oblique air outlets (218) are opened below the connecting post (214). The air outlets (218) are connected to the air passages (215).

2. The semiconductor coating equipment with a wafer protection mechanism according to claim 1, characterized in that: The protective cover assembly (22) includes a fixed fan plate (221) disposed outside the connecting column (214), a first rotating fan plate (222) disposed outside the fixed fan plate (221), a second rotating fan plate (223) disposed outside the first rotating fan plate (222), and a third rotating fan plate (224) disposed outside the second rotating fan plate (223).

3. A semiconductor coating apparatus with a wafer protection mechanism according to claim 2, characterized in that: The fixed fan plate (221) is fixedly connected to the lower outer side of the connecting column (214). An L-shaped rubber rod (2211) is fixedly connected to the upper side of one side of the fixed fan plate (221). A first arc-shaped sliding groove (2212) is opened on the outer side of the fixed fan plate (221). A sealing rubber pad (24) is provided on the upper side of the fixed fan plate (221) away from the L-shaped rubber rod (2211).

4. A semiconductor coating apparatus with a wafer protection mechanism according to claim 3, characterized in that: The first rotating fan plate (222) is fixedly connected to a first rotating ring (2223) on the side near the connecting column (214). A second arc-shaped slide groove (2221) is provided on the outer side of the first rotating fan plate (222). A first connecting short plate (2222) is fixedly connected to one side of the first rotating fan plate (222). A limit block is fixedly connected to the side of the first connecting short plate (2222) facing the fixed fan plate (221). The limit block on one side of the first connecting short plate (2222) is slidably connected to the first arc-shaped slide groove (2212). The first rotating ring (2223) is rotatably disposed in the rotating groove (217). A sealing rubber pad (24) is provided above the side of the first rotating fan plate (222) away from the L-shaped rubber rod (2211).

5. A semiconductor coating apparatus with a wafer protection mechanism according to claim 4, characterized in that: The second rotating fan plate (223) is fixedly connected to a second rotating ring (2233) on the side near the connecting column (214). The second rotating ring (2233) is located above the first rotating ring (2223). The second rotating ring (2233) is rotatably located in the rotating groove (217). A sealing rubber pad (24) is provided above the side of the second rotating fan plate (223) away from the L-shaped rubber rod (2211). A third arc-shaped sliding groove (2231) is opened on the outer side of the second rotating fan plate (223). A second connecting short plate (2232) is fixedly connected to one side of the second rotating fan plate (223). A limit block is fixedly connected to one side of the second connecting short plate (2232). The limit block on one side of the second connecting short plate (2232) is slidably connected to the second arc-shaped sliding groove (2221).

6. A semiconductor coating apparatus with a wafer protection mechanism according to claim 5, characterized in that: The third rotating fan plate (224) is fixedly connected to a third rotating ring (2242) on the side near the connecting column (214). The third rotating ring (2242) is located above the second rotating ring (2233). A third connecting short plate (2241) is fixedly connected to one side of the third rotating fan plate (224). A limit block is fixedly connected to one side of the third connecting short plate (2241). The limit block on one side of the third connecting short plate (2241) is slidably connected to the third arc-shaped slide groove (2231). A fixing ring (2243) is fixedly connected to the upper end of the third rotating fan plate (224). A first motor (2244) is fixedly installed inside the fixing ring (2243). A drive gear (2245) is fixedly connected to the output end of the first motor (2244). The drive gear (2245) meshes with the driven gear (216).

7. A semiconductor coating apparatus with a wafer protection mechanism according to claim 1, characterized in that: The placement component (23) includes a long rod (234) fixedly installed inside the cabinet (1). Two support plates (235) are fixedly connected to the upper end of the long rod (234). A support ring (236) is fixedly connected to the upper end of the long rod (234). A second motor (237) is fixedly installed inside the support ring (236). A connecting ring (231) is fixedly connected to the upper end of the two support plates (235). A rotating disk (232) is rotatably connected inside the connecting ring (231). Multiple placement slots (233) are opened on the rotating disk (232). The rotating disk (232) is rotatably connected above the support ring (236). The output end of the second motor (237) is fixedly connected to the rotating disk (232).

8. A semiconductor coating apparatus with a wafer protection mechanism according to claim 1, characterized in that: The cabinet (1) is equipped with a vacuum pump assembly and an electron beam evaporator.

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