Pluggable CPO optical module packaging structure

Abstract

The invention relates to the technical field of photoelectric co-packaging, and discloses a pluggable CPO optical module packaging structure, which comprises a main substrate, an adaptive structure, an optical module and an optical fiber connector, the adaptive structure comprises a base and a plurality of conductive probes, the base is fixed on the main substrate, the upper part of the base is provided with a positioning groove, the optical module is detachably mounted in the positioning groove, and the optical fiber connector is fixed on the main substrate. A limiting piece is arranged between the base and the optical module; the plurality of conductive probes are inserted into the base and are electrically connected with the main substrate respectively; a first conductive part is convexly arranged on the conductive probe along the direction far away from the main substrate; the optical module comprises a sub-substrate, a laser chip, a PD element and a lens, a plurality of convex balls are arranged on the side, close to the base, of the sub-substrate, and the first conductive part is electrically connected with the convex balls when the optical module is assembled; the laser chip and the PD element are arranged on the sub-substrate and are electrically connected with the sub-substrate, and the lens is arranged on the upper sides of the laser chip and the PD element; the side, away from the sub-substrate, of the lens is provided with a guide part, and the optical fiber connector is inserted into the guide part.

Description

Technical Field

[0001] This invention relates to the field of optoelectronic co-packaging technology, and in particular to a pluggable CPO optical module packaging structure. Background Technology

[0002] Optoelectronic co-packaging technology (abbreviated as "CPO") refers to the integration of optical engines and switching chips or computing chips on the same substrate, which shortens the electrical interconnection distance, significantly reduces power consumption and latency, and improves bandwidth density and signal integrity.

[0003] For example, Chinese invention patent application CN113253401A discloses an integrated packaged optical device and an optical module package containing the optical device. The optical device body includes an optical device substrate and optical device electrical pins. An optical transceiver driver chip, a laser, a photodiode chip, and a first lens module are integrated on the optical device substrate. The laser and photodiode chip transmit electrical signals with the optical device electrical pins through the optical device substrate. The first lens module and the optical device substrate seal the optical transceiver driver chip, laser, and photodiode chip. The first lens module is provided with a first array lens. The optical module package also includes an optical device base, with a fixing strip on the side of the optical device base for fixing the optical device body within the base.

[0004] In existing optical modules, the optical device body is inserted into the optical device base, and the fixing strip can be unlocked to remove the optical device body during replacement. However, the optical device body is designed as a single unit, which cannot meet the requirements for modular disassembly and assembly of fiber arrays, optical modules, and substrates, and makes it difficult to guarantee the reliability of the electrical connection after the optical module and substrate are assembled. Summary of the Invention

[0005] The technical problem to be solved by the present invention is that the existing optical device body is an integral structure, which cannot meet the requirements of modular disassembly and assembly of fiber arrays, optical modules and substrates, and it is difficult to guarantee the reliability of electrical connection after the optical module and substrate are assembled.

[0006] To address the aforementioned technical problems, this invention provides a technical solution for a pluggable CPO optical module packaging structure: The pluggable CPO optical module packaging structure includes a main substrate, an adapter structure, an optical module, and an optical fiber connector. The adapter structure includes a base and multiple conductive probes. The base is fixed on the main substrate. A positioning groove is provided on the upper part of the base. The optical module can be detachably installed in the positioning groove. A limiting member is provided between the base and the optical module. Multiple conductive probes are inserted into the base, and each of the multiple conductive probes is electrically connected to the main substrate; along the direction away from the main substrate, each conductive probe has a first conductive portion protruding out; The optical module includes a sub-substrate, a laser chip, a PD element, and a lens. The sub-substrate has a plurality of protruding balls on the side near the base. When the optical module is assembled, the first conductive part is electrically connected to the protruding balls. The laser chip and the PD element are both disposed on the sub-substrate and electrically connected to the sub-substrate. The lens is mounted on the sub-substrate and is located above the laser chip and the PD element. The lens has a guide portion on the side away from the sub-substrate, and the fiber optic connector is inserted into the guide portion along a direction perpendicular to the surface of the main substrate. The laser chip, the lens, and the transmitting fiber of the fiber optic connector are aligned to form a transmitting optical path, and the receiving fiber of the fiber optic connector, the lens, and the PD element are aligned to form a receiving optical path.

[0007] Furthermore, the optical module also includes an upper housing, which covers the upper side of the sub-substrate. A first hole is formed in the middle of the upper housing, and the first hole is fitted with the lens.

[0008] Furthermore, a second hole is provided on the side of the upper housing, and a third hole is provided on the side wall of the base near the positioning groove. The limiting member is a spring pin, which is installed in the third hole. Along the direction parallel to the surface of the main substrate, the spring pin is inserted into the second hole.

[0009] Furthermore, the upper housing is provided with at least two protrusions on its side, and the upper side of the base is provided with at least two grooves. The at least two grooves are located outside the positioning groove, and the at least two protrusions and the at least two grooves are matched one by one.

[0010] Furthermore, both the base and the upper housing are made of metal. The lower part of the base has multiple through holes, which are evenly distributed on the bottom surface of the base. The conductive probe is inserted into the through hole, and an insulating ring is provided between the conductive probe and the hole wall.

[0011] Furthermore, along a direction parallel to the surface of the main substrate, the upper housing is clearance-fitted with the positioning groove, and the first gap value between the upper housing and the positioning groove is D1; ​​along a direction parallel to the surface of the main substrate, the lens is clearance-fitted with the first hole, and the second gap value between the lens and the first hole is D2, satisfying: 3μm≤D1≤50μm, 3μm≤D2≤50μm.

[0012] Furthermore, a through groove is provided on the side of the lens near the sub-substrate. The through groove extends along the width direction of the sub-substrate. The laser chip and PD element are both housed in the through groove, and the two ends of the through groove are respectively connected to the side wall of the base to form a heat transfer path.

[0013] Furthermore, the laser chip, the PD element, and the lens are all disposed in the middle of the sub-substrate, and the laser chip and the PD element are spaced apart along the width direction of the sub-substrate; the optical module also includes a driver and a cross-group amplifier, the driver and the cross-group amplifier are both disposed on the sub-substrate and electrically connected to the sub-substrate, the driver is spaced apart on one side of the lens, and the cross-group amplifier is spaced apart on the other side of the lens.

[0014] Furthermore, thermally conductive adhesive is applied to the upper side of the driver and the cross-group amplifier, and the side of the upper housing near the sub-substrate is bonded to the thermally conductive adhesive.

[0015] Furthermore, the guide portion is provided in two parts, which are spaced apart along the width direction of the sub-substrate, and the guide portion is a guide post; the fiber optic connector has two sockets on the side near the optical module, which are spaced apart along the width direction of the fiber optic connector, and the two guide posts are inserted into the two sockets one by one.

[0016] Compared with existing technologies, the pluggable CPO optical module packaging structure of this invention has the following advantages: This pluggable CPO optical module packaging structure adopts a design of a main substrate, an adapter structure, an optical module, and an optical fiber connector. The base of the adapter structure is fixed to the main substrate, and multiple conductive probes are inserted into the base, each electrically connected to the main substrate. The optical module is detachably installed in a positioning slot, and a limiting component is provided between the base and the optical module. The optical module, as an independent and detachable unit, is mechanically fixed by the positioning slot and the limiting component. When replacement or upgrade is required, it eliminates the need to replace the entire main substrate; only the optical module needs to be replaced. It also supports replacement with optical modules of different rates or protocols.

[0017] The optical module includes a sub-substrate, a laser chip, a PD element, and a lens. The sub-substrate has multiple protruding balls on the side near the base, and conductive probes with protruding first conductive parts are electrically connected to these protruding balls during optical module assembly. This probe connection provides a shorter electrical signal path, supporting higher data rates. The connection method of conductive probes and protruding balls achieves a pressure-contact vertical electrical connection, ensuring reliable electrical connection between the optical module and the main substrate after assembly. Furthermore, the contact between the protruding balls and the first conductive parts has low friction, facilitating insertion and removal, and improving durability, thus reducing assembly precision requirements.

[0018] Furthermore, both the laser chip and the PD element are located on the sub-substrate and electrically connected to it. Integrating the laser chip and PD element on the sub-substrate close to the main substrate reduces signal transmission loss, delay, and power consumption in the optical module. The lens is mounted on the sub-substrate and located above the laser chip and PD element. A guide portion is provided on the side of the lens away from the sub-substrate to allow the fiber optic connector to be accurately inserted into the lens. The optical alignment of the transmitting and receiving optical paths is completed during the optical module manufacturing stage, ensuring alignment accuracy and stability.

[0019] During field installation, simply insert the fiber optic connector into the guide section of the lens, simplifying the on-site alignment and connection of the fiber optic cable. The adapter structure provides a mechanical and electrical transition interface, ensuring reliable mating between the conductive probe and the convex ball, and between the fiber optic connector and the guide section when the optical module is assembled, meeting the requirements for modular assembly and replacement of various parts. Attached Figure Description

[0020] Figure 1 This is a three-dimensional schematic diagram of the pluggable CPO optical module packaging structure according to an embodiment of the present invention; Figure 2 This is an assembly diagram of the optical module and adapter structure and fiber optic connector according to an embodiment of the present invention; Figure 3 This is an exploded view of the optical module and adapter structure and the fiber optic connector according to an embodiment of the present invention. Figure 4 This is a three-dimensional schematic diagram of the adaptor structure according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the structure of the optical module (excluding the lens and upper housing) according to an embodiment of the present invention; Figure 6 This is a structural schematic diagram of the optical module (excluding the upper housing) according to an embodiment of the present invention; Figure 7 This is a cross-sectional schematic diagram of the pluggable CPO optical module packaging structure according to an embodiment of the present invention; In the diagram: 1. Main substrate; 2. Adaptor structure; 21. Base; 210. Positioning groove; 211. Third hole; 212. Groove; 213. Through hole; 22. Conductive probe; 221. First conductive part; 23. Limiting member; 3. Optical module; 31. Sub-substrate; 311. Protrusion ball; 32. Laser chip; 33. PD element; 34. Lens; 341. Guide part; 342. Through groove; 35. Upper shell; 351. First hole; 352. Second hole; 353. Bump; 36. Driver; 37. Transgroup amplifier; 38. Thermal conductive adhesive; 4. Fiber optic connector; 5. ASIC chip. Detailed Implementation

[0021] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0022] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise" used to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0024] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0025] like Figures 1 to 7 As shown, a pluggable CPO optical module packaging structure according to an embodiment of the present invention includes a main substrate 1, an adapter structure 2, an optical module 3, and an optical fiber connector 4. The adapter structure 2 includes a base 21 and a plurality of conductive probes 22. The base 21 is fixed on the main substrate 1, and a positioning groove 210 is provided on the upper part of the base 21. The optical module 3 is detachably installed in the positioning groove 210. A limiting member 23 is provided between the base 21 and the optical module 3. The plurality of conductive probes 22 are inserted into the base 21, and the plurality of conductive probes 22 are electrically connected to the main substrate 1 respectively. Along the direction away from the main substrate 1, the conductive probes 22 are provided with a first conductive part 221.

[0026] The optical module 3 includes a sub-substrate 31, a laser chip 32, a PD element 33, and a lens 34. The sub-substrate 31 has a plurality of protruding balls 311 on the side near the base 21. When the optical module 3 is assembled, the first conductive part 221 is electrically connected to the protruding balls 311. The laser chip 32 and the PD element 33 are both disposed on the sub-substrate 31 and electrically connected to the sub-substrate 31. The lens 34 is mounted on the sub-substrate 31 and is located above the laser chip 32 and the PD element 33.

[0027] A guide portion 341 is provided on the side of the lens 34 away from the sub-substrate 31. The fiber optic connector 4 is inserted into the guide portion 341 in a direction perpendicular to the surface of the main substrate 1. The laser chip 32, the lens 34 and the transmitting fiber of the fiber optic connector 4 are aligned to form a transmitting optical path. The receiving fiber of the fiber optic connector 4, the lens 34 and the PD element 33 are aligned to form a receiving optical path.

[0028] The pluggable CPO optical module packaging structure adopts a design of main substrate 1, adapter structure 2, optical module 3, and fiber optic connector 4. The base 21 of the adapter structure 2 is fixed to the main substrate 1. Multiple conductive probes 22 are inserted into the base 21 and are electrically connected to the main substrate 1. The optical module 3 is detachably installed in the positioning slot 210, and a limiting member 23 is provided between the base 21 and the optical module 3. The optical module 3, as an independent and detachable unit, is mechanically fixed by the positioning slot 210 and the limiting member 23. When replacement or upgrade is required, it eliminates the need to replace the entire main substrate 1; only the optical module 3 needs to be replaced. It also supports the replacement of optical modules 3 with different rates or protocols.

[0029] The optical module 3 includes a sub-substrate 31, a laser chip 32, a PD element 33, and a lens 34. The sub-substrate 31 has multiple protruding balls 311 on the side near the base 21. A conductive probe 22 protrudes with a first conductive part 221. During assembly, the first conductive part 221 is electrically connected to the protruding balls 311. This probe connection provides a shorter electrical signal path, supporting higher data rates. The connection method of conductive probe 22 + protruding balls 311 achieves a pressure-contact vertical electrical connection, ensuring the reliability of the electrical connection between the optical module 3 and the main substrate 1 after assembly. Furthermore, the contact between the protruding balls 311 and the first conductive part 221 has low friction, facilitating insertion and removal and improving durability, thus reducing assembly precision requirements.

[0030] Furthermore, both the laser chip 32 and the PD element 33 are disposed on and electrically connected to the sub-substrate 31. Integrating the laser chip 32 and the PD element 33 on the sub-substrate 31, which is close to the main substrate 1, reduces signal transmission loss, delay, and power consumption of the optical module 3. The lens 34 is mounted on the sub-substrate 31 and located above the laser chip 32 and the PD element 33. A guide portion 341 is provided on the side of the lens 34 away from the sub-substrate 31 to allow the fiber optic connector 4 to be accurately inserted into the lens 34. The optical alignment of the transmitting and receiving optical paths is completed and solidified during the manufacturing stage of the optical module 3, ensuring alignment accuracy and stability.

[0031] During on-site installation, simply insert the fiber optic connector 4 into the guide portion 341 of the lens 34, simplifying the on-site alignment and connection of the fiber optic cable. The adapter structure 2 provides a mechanical and electrical transition interface, ensuring reliable mating between the conductive probe 22 and the convex ball 311, and between the fiber optic connector 4 and the guide portion 341 when the optical module 3 is assembled in place, thus meeting the requirements for modular assembly and replacement of each component.

[0032] In this embodiment, the optical module 3 further includes an upper housing 35, which covers the upper side of the sub-substrate 31. A first hole 351 is formed in the middle of the upper housing 35, and the first hole 351 is accommodated and fitted with the lens 34. A second hole 352 is formed on the side of the upper housing 35, and a third hole 211 is formed on the side wall of the base 21 near the positioning groove 210. The limiting member 23 is a spring pin, which is installed in the third hole 211. Along the direction parallel to the surface of the main substrate 1, the spring pin is inserted and fitted into the second hole 352.

[0033] The upper housing 35 encapsulates and protects the key chips of the optical module 3, preventing damage from external moisture or stress. The first hole 351 of the upper housing 35 accommodates the lens 34, forming a fitted structure that improves the installation accuracy of the upper housing 35 and the overall integrity of the optical module 3. Furthermore, the limiting member 23 is a spring pin design, providing reliable mechanical restraint between the base 21 and the upper housing 35 after assembly, facilitating easy insertion and removal during assembly.

[0034] The upper housing 35 has at least two protrusions 353 on its side, and the base 21 has at least two grooves 212 on its upper side. The at least two grooves 212 are located outside the positioning groove 210, and the at least two protrusions 353 engage with the at least two grooves 212 one by one. By engaging the protrusions 353 of the upper housing 35 with the grooves 212 of the base 21 one by one, more positioning and mating parts are provided for the assembly process of the optical module 3, thereby ensuring the relative positional accuracy between the upper housing 35 and the base 21.

[0035] As a further preferred embodiment, both the base 21 and the upper housing 35 are made of metal. Metal construction provides high strength and rigidity, excellent thermal conductivity, and good electromagnetic shielding. The positioning slot 210 of the base 21 provides a stable and precise slot for the optical module 3. Furthermore, the high coefficient of thermal expansion of metal allows for a tighter connection between the upper housing 35 and the base 21 when the optical module 3 generates heat during operation. Multiple through holes 213 are evenly distributed on the bottom surface of the base 21. Conductive probes 22 are inserted into the through holes 213, and an insulating ring (not shown in the figure) is provided between the conductive probes 22 and the wall of the through holes 213. This insulating ring provides electrical insulation between the conductive probes 22 and the wall of the through holes 213, ensuring the reliability of vertical signal transmission.

[0036] It should be noted that, along the direction parallel to the surface of the main substrate 1, the upper housing 35 and the positioning groove 210 are in clearance fit, with a first clearance value of D1 between the upper housing 35 and the positioning groove 210; along the direction parallel to the surface of the main substrate 1, the lens 34 and the first hole 351 are in clearance fit, with a second clearance value of D2 between the lens 34 and the first hole 351, satisfying: 3μm≤D1≤50μm, 3μm≤D2≤50μm. The first clearance value D1 between the upper housing 35 and the positioning groove 210, and the second clearance value D2 between the lens 34 and the first hole 351 are both within the range of 3μm to 50μm, ensuring the assembly position accuracy and electrical connection accuracy of the optical module 3, while preventing structural damage or optical path changes that may be caused by internal stress due to thermal expansion and contraction.

[0037] In this embodiment, a through groove 342 is provided on the side of the lens 34 near the sub-substrate 31. The through groove 342 extends along the width direction of the sub-substrate 31. The laser chip 32 and the PD element 33 are both housed in the through groove 342, and the two ends of the through groove 342 are respectively connected to the side wall of the base 21 to form a heat transfer path. The through groove 342 of the lens 34 penetrates through the two opposite side walls of the base 21, so that the heat of the laser chip 32 can be smoothly conducted to the base 21 through the through groove 342, avoiding the continuous accumulation of heat inside the optical module 3 and improving the heat dissipation effect.

[0038] Specifically, the laser chip 32, PD element 33, and lens 34 are all located in the middle of the sub-substrate 31, and the laser chip 32 and PD element 33 are spaced apart along the width direction of the sub-substrate 31. The optical module 3 also includes a driver 36 and a cross-group amplifier 37. The driver 36 and the cross-group amplifier 37 are both located on the sub-substrate 31 and electrically connected to the sub-substrate 31. The driver 36 is spaced apart on one side of the lens 34, and the cross-group amplifier 37 is spaced apart on the other side of the lens 34. This optimizes the layout of the key chips of the optical module 3 and improves the space utilization.

[0039] Thermally conductive adhesive 38 is applied to the upper sides of the driver 36 and the transducer amplifier 37. The upper housing 35 is bonded to the thermally conductive adhesive 38 on the side near the sub-substrate 31. The thermally conductive adhesive 38 effectively conducts heat from the driver 36 and the transducer amplifier 37 upwards to the upper housing 35, thereby ensuring the heat dissipation of the optical module 3. It should be noted that the pluggable CPO optical module packaging structure also includes an ASIC chip 5. The ASIC chip 5 is located on the main substrate 1 and electrically connected to the main substrate 1. As the core of the CPO packaging structure, the ASIC chip 5 is mainly responsible for the data exchange, calculation, and scheduling processing of all optical modules 3.

[0040] In addition, two guide sections 341 are provided, which are spaced apart along the width direction of the sub-substrate 31, and each guide section 341 is a guide post. Two sockets are provided on the side of the fiber optic connector 4 near the optical module 3, and these two sockets are spaced apart along the width direction of the fiber optic connector 4. The two guide posts are inserted into each of the two sockets. For example, if the fiber optic connector 4 is an MPO connector, the alignment accuracy between the fiber array and the lens 34 is ensured by the cooperation of the guide posts with the sockets of the fiber optic connector 4.

[0041] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.

Claims

1. A pluggable CPO optical module packaging structure, characterized in that, The device includes a main substrate, an adapter structure, an optical module, and an optical fiber connector. The adapter structure includes a base and multiple conductive probes. The base is fixed to the main substrate, and a positioning groove is provided on the upper part of the base. The optical module is detachably installed in the positioning groove, and a limiting component is provided between the base and the optical module. Multiple conductive probes are inserted into the base, and each of the multiple conductive probes is electrically connected to the main substrate; along the direction away from the main substrate, each conductive probe has a first conductive portion protruding out; The optical module includes a sub-substrate, a laser chip, a PD element, and a lens. The sub-substrate has a plurality of protruding balls on the side near the base. When the optical module is assembled, the first conductive part is electrically connected to the protruding balls. The laser chip and the PD element are both disposed on the sub-substrate and electrically connected to the sub-substrate. The lens is mounted on the sub-substrate and is located above the laser chip and the PD element. The lens has a guide portion on the side away from the sub-substrate, and the fiber optic connector is inserted into the guide portion along a direction perpendicular to the surface of the main substrate. The laser chip, the lens, and the transmitting fiber of the fiber optic connector are aligned to form a transmitting optical path, and the receiving fiber of the fiber optic connector, the lens, and the PD element are aligned to form a receiving optical path.

2. The pluggable CPO optical module packaging structure according to claim 1, characterized in that, The optical module also includes an upper housing, which covers the upper side of the sub-substrate. A first hole is formed in the middle of the upper housing, and the first hole is fitted with the lens.

3. The pluggable CPO optical module packaging structure according to claim 2, characterized in that, The upper housing has a second hole on its side, and the base has a third hole on its side wall near the positioning groove. The limiting member is a spring pin, which is installed in the third hole. The spring pin is inserted into the second hole along a direction parallel to the surface of the main substrate.

4. The pluggable CPO optical module packaging structure according to claim 2 or 3, characterized in that, The upper housing is provided with at least two protrusions on its side, and the upper side of the base is provided with at least two grooves. The at least two grooves are located outside the positioning groove, and the at least two protrusions and the at least two grooves are matched one by one.

5. The pluggable CPO optical module packaging structure according to claim 2 or 3, characterized in that, Both the base and the upper housing are made of metal. The lower part of the base has multiple through holes, which are evenly distributed on the bottom surface of the base. The conductive probe is inserted into the through hole, and an insulating ring is provided between the conductive probe and the hole wall.

6. The pluggable CPO optical module packaging structure according to claim 2 or 3, characterized in that, Along a direction parallel to the surface of the main substrate, the upper housing is clearance-fitted with the positioning groove, and the first gap value between the upper housing and the positioning groove is D1; ​​along a direction parallel to the surface of the main substrate, the lens is clearance-fitted with the first hole, and the second gap value between the lens and the first hole is D2, satisfying: 3μm≤D1≤50μm, 3μm≤D2≤50μm.

7. The pluggable CPO optical module packaging structure according to claim 2, characterized in that, A through groove is provided on the side of the lens near the sub-substrate. The through groove extends along the width direction of the sub-substrate. The laser chip and PD element are both housed in the through groove, and the two ends of the through groove are respectively connected to the side wall of the base to form a heat transfer path.

8. The pluggable CPO optical module packaging structure according to claim 7, characterized in that, The laser chip, the PD element, and the lens are all disposed in the middle of the sub-substrate, and the laser chip and the PD element are spaced apart along the width direction of the sub-substrate; the optical module also includes a driver and a cross-group amplifier, the driver and the cross-group amplifier are both disposed on the sub-substrate and electrically connected to the sub-substrate, the driver is spaced apart on one side of the lens, and the cross-group amplifier is spaced apart on the other side of the lens.

9. The pluggable CPO optical module packaging structure according to claim 8, characterized in that, The driver and the cross-group amplifier are respectively coated with thermally conductive adhesive on their upper sides, and the upper housing is bonded to the thermally conductive adhesive on the side near the sub-substrate.

10. The pluggable CPO optical module packaging structure according to claim 1, characterized in that, The guide portion is provided in two parts, which are spaced apart along the width direction of the sub-substrate, and the guide portion is a guide post; the fiber optic connector has two sockets on the side near the optical module, which are spaced apart along the width direction of the fiber optic connector, and the two guide posts are inserted into the two sockets one by one.

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