Mark automatic placing method and device, equipment, storage medium and program product
By using an automated marking placement method, marking feature information is obtained and placement areas are divided in the photolithography pattern, solving the problems of low efficiency and errors in the design and placement of photolithographic markings, and achieving efficient and low-cost marking placement.
Patent Information
- Application Number
- CN202410751716.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-12
- Publication Date
- 2025-12-12
Smart Images
Figure CN121115411A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of semiconductor manufacturing technology, and in particular to a method, apparatus, device, storage medium, and program product for automatic label placement. Background Technology
[0002] The design and placement of lithographic alignment marks and overlay marks are crucial aspects of lithography process control. For example, an integrated circuit product typically requires multiple lithographic layers, and each layer usually needs numerous marks for lithographic alignment and process monitoring. Therefore, accurately and efficiently placing these marks on the layout is of great significance for lithography research and development as well as integrated circuit manufacturing. Summary of the Invention
[0003] Based on this, the present disclosure provides a method, apparatus, device, storage medium, and program product for automatic placement of markers, which can not only realize the automatic placement of markers on the layout, which is beneficial to improve efficiency and reduce costs, but also facilitate the placement and updating of markers, while minimizing the risk of marker placement errors.
[0004] To achieve the above objectives, in a first aspect, some embodiments of this disclosure provide a method for automatic placement of markers, including the following steps.
[0005] Obtain the mark feature information table of the marks to be placed in the photolithography layer.
[0006] Based on the marker feature information table, the placement area of the marker to be placed is divided in the photolithography pattern.
[0007] Obtain the absolute placement position information of the marker to be placed in the photolithography pattern, and establish a marker placement information table based on the absolute placement position information.
[0008] In response to lithography requirements, the markers to be placed are automatically placed in the lithography pattern corresponding to the target lithography layer according to the marker placement information table.
[0009] In some embodiments of this disclosure, before obtaining the mark feature information table of the marks to be placed in the photolithography layer, the automatic mark placement method further includes: obtaining the photolithography pattern and process flow according to the integrated circuit design.
[0010] Accordingly, the number of photolithography layers and the mark feature information table of the marks to be placed in each photolithography layer are determined according to the photolithography pattern and the process flow.
[0011] In some embodiments of this disclosure, the marker feature information table includes: marker type, and / or, marker relative position information.
[0012] In some embodiments of this disclosure, the marking type includes at least one of alignment markings, overlay error measurement markings, and critical dimension measurement markings.
[0013] In some embodiments of this disclosure, the number of photolithography layers is multiple. Before dividing the placement area of the markers to be placed in the photolithography pattern based on the marker feature information table, the automatic marker placement method further includes: arranging the relative placement order of the multiple markers to be placed corresponding to each photolithography layer in terms of their spatial occupancy positions according to marker placement rules.
[0014] Accordingly, the marker placement information table also includes the placement order of the markers to be placed.
[0015] In some embodiments of this disclosure, the step of automatically placing the marker to be placed in the photolithography pattern corresponding to the target photolithography layer according to the marker placement information table in response to photolithography requirements includes: automatically capturing the GDS file of the photolithography pattern and the absolute placement position information of the marker to be placed in the marker placement information table through software or script in response to photolithography requirements, and automatically placing the marker to be placed in the GDS file.
[0016] In some embodiments of this disclosure, the automatic marker placement method further includes: generating a marker placement report showing the placement of the markers to be placed on the photolithography pattern; and establishing automatic measurement rules for the markers to be placed based on the marker placement report.
[0017] Secondly, some embodiments of this disclosure also provide an automatic marker placement device for implementing the automatic marker placement method described in the above embodiments. The automatic marker placement device includes: an acquisition module, a processing module, and a marker placement module. The acquisition module is configured to: acquire a marker feature information table of markers to be placed in a photolithography layer; and, after the processing module divides the placement area of the markers to be placed in the photolithography pattern based on the marker feature information table, acquire the absolute placement position information of the markers to be placed in the photolithography pattern. The processing module is connected to the acquisition module and is configured to: divide the placement area of the markers to be placed in the photolithography pattern based on the marker feature information table; and, after the acquisition module acquires the absolute placement position information of the markers to be placed in the photolithography pattern, establish a marker placement information table based on the absolute placement position information. The marker placement module is connected to the processing module and is configured to: automatically place the markers to be placed in the photolithography pattern corresponding to the target photolithography layer according to the marker placement information table, in response to photolithography requirements.
[0018] Thirdly, embodiments of this disclosure also provide a computer device. The computer device includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program to implement the method steps described in any of the embodiments of the first aspect.
[0019] Fourthly, embodiments of this disclosure also provide a computer-readable storage medium. The computer-readable storage medium stores a computer program thereon, which, when executed by a processor, implements the method steps described in any of the embodiments of the first aspect.
[0020] Fifthly, embodiments of this disclosure also provide a program product having a computer program stored thereon, which, when executed by a processor, implements the steps of the methods described in any of the embodiments of the first aspect.
[0021] The embodiments disclosed herein may have, or at least have, the following advantages:
[0022] In this embodiment of the disclosure, after obtaining the marker feature information table of the markers to be placed in the photolithography layer, the placement area of the markers to be placed can be divided in the photolithography layout based on the marker feature information table to obtain the absolute placement position information of the markers to be placed in the photolithography layout. Thus, after establishing the marker placement information table based on the absolute placement position information of the markers to be placed, the markers to be placed can be automatically placed in the photolithography layout corresponding to the target photolithography layer in response to photolithography requirements. This not only enables automatic placement of markers in the layout, avoiding the occupation of manpower, improving efficiency and reducing costs, but also facilitates the updating of marker placement, while minimizing the risk of marker placement errors.
[0023] Details of one or more embodiments of this disclosure are set forth in the following drawings and description. Other features, objects, and advantages of this disclosure will become apparent from the specification, drawings, and claims. Attached Figure Description
[0024] To more clearly illustrate the technical solutions in the embodiments or conventional technologies of this disclosure, the accompanying drawings used in the description of the embodiments or conventional technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0025] Figure 1 This is a flowchart illustrating an automatic marker placement method provided in some embodiments;
[0026] Figure 2 This is a flowchart illustrating another automatic marker placement method provided in some embodiments;
[0027] Figure 3 This is a flowchart illustrating yet another method for automatically placing markers provided in some embodiments;
[0028] Figure 4 This is a flowchart illustrating yet another method for automatically placing markers provided in some embodiments;
[0029] Figure 5 This is a schematic diagram of a marker feature information table provided in some embodiments;
[0030] Figure 6 This is a schematic diagram of a photolithographic pattern after dividing the placement area of the marker to be placed in step S200, as provided in some embodiments;
[0031] Figure 7 This is a schematic diagram of a marker placement information table provided in some embodiments;
[0032] Figure 8 This is a schematic diagram of a GDS file for a photolithography pattern provided in some embodiments;
[0033] Figure 9 This is a structural block diagram of an automatic marker placement device provided in some embodiments;
[0034] Figure 10 This is an internal structural diagram of a computer device provided in some embodiments. Detailed Implementation
[0035] To facilitate understanding of this disclosure, a more complete description will now be given with reference to the accompanying drawings, in which preferred embodiments of the present disclosure are shown. However, this disclosure may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure.
[0037] It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this invention, the first element, component, area, layer, or portion discussed below may be referred to as the second element, component, area, layer, or portion.
[0038] It should be understood that when one element is considered to be "connected" to another element, it can be directly connected to the other element or connected to the other element through an intermediary element. Furthermore, in the following embodiments, "connection" should be understood as "electrical connection," "communication connection," etc., if there is a transmission of electrical signals or data between the connected objects.
[0039] It should be understood that the singular forms of “a,” “an,” and “the” can also include the plural forms unless the context clearly indicates otherwise. It should also be understood that terms such as “comprising,” “including,” or “having” specify the presence of the stated feature, whole, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.
[0040] In semiconductor manufacturing, photolithography plays a central role and is the most important process step in integrated circuit production. For example, the fabrication of integrated circuit products (such as semiconductor chips) typically involves multiple layers, and the fabrication of each layer requires pattern definition to form specific structures, such as contact holes or metal traces. These specific pattern definitions are usually achieved through photolithography, a process that uses a photomask to transfer the design layout.
[0041] Currently, the design and placement of lithographic alignment marks and overlay marks are crucial aspects of lithography process control. However, the cycle from mark design to mark placement, mark inspection, and mark modification is lengthy, time-consuming, labor-intensive, and consumes significant human resources. Therefore, accurately and efficiently placing marks on the layout is of great importance to lithography research and development and integrated circuit manufacturing.
[0042] Based on this, the present disclosure provides a method, apparatus, device, storage medium, and program product for automatic placement of markers, which can not only realize the automatic placement of markers on the layout, which is beneficial to improve efficiency and reduce costs, but also facilitate the placement and updating of markers, while minimizing the risk of marker placement errors.
[0043] Please see Figure 1 This disclosure provides an automatic label placement method in some embodiments, including the following steps S100 to S400.
[0044] S100, Obtain the mark feature information table of the marks to be placed in the photolithography layer.
[0045] S200, based on the marker feature information table, divides the placement area of the marker to be placed in the photolithography pattern.
[0046] S300: Obtain the absolute placement position information of the marker to be placed on the photolithography pattern, and establish a marker placement information table based on the absolute placement position information.
[0047] S400, in response to lithography requirements, automatically places the markers to be placed in the lithography pattern corresponding to the target lithography layer according to the marker placement information table.
[0048] In this embodiment of the disclosure, after obtaining the marker feature information table of the markers to be placed in the photolithography layer, the placement area of the markers to be placed can be divided in the photolithography layout based on the marker feature information table to obtain the absolute placement position information of the markers to be placed in the photolithography layout. Thus, after establishing the marker placement information table based on the absolute placement position information of the markers to be placed, the markers to be placed can be automatically placed in the photolithography layout corresponding to the target photolithography layer in response to photolithography requirements. This not only enables automatic placement of markers in the layout, avoiding the occupation of manpower, improving efficiency and reducing costs, but also facilitates the updating of marker placement, while minimizing the risk of marker placement errors.
[0049] Please see Figure 2 In some embodiments of this disclosure, before step S100 obtains the mark feature information table of the marks to be placed in the photolithography layer, the automatic mark placement method further includes step S050.
[0050] S050, Obtain the photolithography layout and process flow based on the integrated circuit design.
[0051] Accordingly, the number of photolithography layers and the mark feature information table of the marks to be placed in each photolithography layer can be determined according to the photolithography pattern and process flow.
[0052] It should be added that, in some embodiments of this disclosure, the mark feature information table of the marks to be placed in each photolithographic layer includes: mark type, and / or, mark relative position information.
[0053] In some embodiments of this disclosure, the mark types for the marks to be placed in each photolithographic layer include at least one of alignment marks, overlay error measurement marks, and critical dimension measurement marks.
[0054] Please see Figure 3 In some embodiments of this disclosure, the number of photolithography layers is multiple. Before step S200, which divides the placement area of the markers to be placed in the photolithography pattern based on the marker feature information table, the automatic marker placement method further includes the following step S150.
[0055] S150, according to the marking placement rules, arrange the relative placement order of multiple markings to be placed on each photolithography layer in terms of their spatial positions.
[0056] Accordingly, the marker placement information table also includes the placement order of the markers to be placed.
[0057] It is worth mentioning that, in some embodiments of this disclosure, step S400, in response to lithography requirements, automatically places the marker to be placed in the lithography pattern corresponding to the target lithography layer according to the marker placement information table, including: in response to lithography requirements, automatically capturing the GDS file of the lithography pattern and the absolute placement position information of the marker to be placed in the marker placement information table through software or script, and automatically placing the marker to be placed into the GDS file.
[0058] Here, the GDS (Graphics Design System) file is primarily used to describe the comprehensive physical geometry of an integrated circuit (IC). It contains detailed information on all layers (e.g., polysilicon layers, various metal layers, and vias), as well as the precise shape and location of elements on these layers (e.g., lines and polygons). Furthermore, GDS files typically do not include logic-to-physical mapping information; that is, logic-to-physical mapping is usually performed at an earlier stage of the design process. Therefore, after completing the logic-to-physical mapping and all necessary Design Rule Checks (DRC) and placement / circuit layout, the final step is to... Figure 1 Only after a consistency check (LVS) is performed can the lithography pattern be exported as a GDS.
[0059] Please see Figure 4 In some embodiments of this disclosure, the automatic marker placement method further includes the following steps S500 and S600.
[0060] S500 generates a marker placement report showing the placement of markers on the photolithography pattern.
[0061] S600 establishes automatic measurement rules for markers to be placed based on the marker placement report.
[0062] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.
[0063] To more clearly illustrate the automatic marker placement method provided in the embodiments of this disclosure, the following is combined with... Figures 5-8 An example of an automatic marker placement method has been described in detail, but the specific implementation of the automatic marker placement method is not limited thereto.
[0064] In step S050, the photolithography pattern and process flow based on the integrated circuit design are obtained.
[0065] Here, different integrated circuits correspond to different photolithography patterns and / or process flows.
[0066] In step S100, the mark feature information table of the marks to be placed in the photolithography layer is obtained.
[0067] Here, the number of photolithographic layers and the mark feature information table for the marks to be placed in each photolithographic layer can be determined based on the photolithographic layout and process flow. The mark feature information table is used to characterize the relevant information between the marks to be placed and the photolithographic layers, and may include at least: mark type, and / or, mark relative position information. For example, the mark type of the marks to be placed in each photolithographic layer may be at least one of: alignment mark (AL), overlay error measurement mark (OVL), and critical dimension measurement mark (CD bar). The mark relative position information can be recorded sequentially by the photolithographic layer number and mark number corresponding to the mark.
[0068] Figure 5 An example of a labeled feature information table is provided. Figure 5 The example provided illustrates a 12-layer lithography system with some layers having the same placement markers. The 12 lithography layers have eight different placement markers, named Mark1 through Mark8. For instance, the first lithography layer (Layer 1) has a first marker Mark1 and a second marker Mark2, the second lithography layer (Layer 2) has a third marker Mark3, the third lithography layer (Layer 3) has a first marker Mark1, and so on. Furthermore, it can be understood that knowing the name of the placement marker allows for the corresponding knowledge of its type and relative position.
[0069] In step S150, according to the mark placement rules, the relative placement order of the multiple marks to be placed corresponding to each photolithography layer in terms of their spatial positions is arranged.
[0070] Here, the placement rules for the markers can be matched with the preset photolithography process. The relative placement order of each marker to be placed in space corresponding to each photolithography layer can be executed sequentially according to the number of photolithography layers and the arrangement number of the markers to be placed in the aforementioned marker feature information table.
[0071] In step S200, the placement area of the markers to be placed is divided in the photolithography pattern based on the marker feature information table.
[0072] Figure 6 An illustrative photolithographic pattern is provided after dividing the placement area of the markers to be placed. Figure 6 In the lithography pattern, the array area is the chip area, and the cleaving area or frame area of the lithography pattern can be used to place various markers to be placed. Figure 6 The types of markers to be placed include: first vertical alignment marker AL_v1, second vertical alignment marker AL_v2, first horizontal alignment marker AL_h1, second horizontal alignment marker AL_h2, first overlay error measurement markers OVL_b1 and OVL_b2, second overlay error measurement markers OVL_t1 and OVL_t2, and critical dimension measurement marker CD bar. Taking this as an example, the specific placement area, i.e., the placement position, of each marker is divided in the cutting area of the photolithography pattern by Kerf.
[0073] In step S300, the absolute placement position information of the marker to be placed on the photolithography pattern is obtained, and a marker placement information table is established based on the absolute placement position information.
[0074] Optionally, the marker placement information table may also include the placement order of the markers to be placed.
[0075] match Figure 5 The table showing the marked feature information is shown below. Figure 7 An example of a label placement information table is provided. Figure 7 The number of the corresponding photolithography layers and the sequence number of each marker to be placed can be calculated using software or scripts to obtain the absolute placement information of each marker, such as the X and Y coordinates.
[0076] In step S400, in response to the photolithography requirements, the markers to be placed are automatically placed in the photolithography pattern corresponding to the target photolithography layer according to the marker placement information table.
[0077] For example, in response to lithography requirements, software or scripts automatically capture the GDS file of the lithography layout and the absolute placement information of the corresponding marker to be placed in the marker placement information table, and automatically place the marker to be placed into the GDS file.
[0078] Figure 8 An example is provided of a GDS file corresponding to the photolithography pattern of the target photolithography layer. According to the mark placement information table obtained in step S400, the mark to be placed can be automatically placed in the GDS file according to the absolute placement position information of the mark to be placed.
[0079] In step S500, a mark placement report is generated showing the placement of the marks to be placed on the photolithography pattern.
[0080] In step S600, an automatic measurement rule for the markers to be placed is established based on the marker placement report.
[0081] Therefore, the automatic marker placement method provided in this disclosure can save costs and greatly improve the efficiency of marker placement, marker inspection, and marker modification.
[0082] Based on the same inventive concept, this disclosure also provides an automatic marker placement device for implementing the automatic marker placement method described above. The solution provided by this automatic marker placement device is similar to the solution described in the above method; therefore, the specific limitations in one or more embodiments of the automatic marker placement device provided below can be found in the relevant limitations of the automatic marker placement method described above, and will not be repeated here.
[0083] Please see Figure 9 The automatic marker placement device provided in this embodiment includes an acquisition module, a processing module, and a marker placement module. The acquisition module is configured to: acquire a marker feature information table of markers to be placed in the photolithography layer; and, after the processing module divides the placement area of the markers to be placed in the photolithography pattern based on the marker feature information table, acquire the absolute placement position information of the markers to be placed in the photolithography pattern. The processing module is connected to the acquisition module and is configured to: divide the placement area of the markers to be placed in the photolithography pattern based on the marker feature information table; and, after the acquisition module acquires the absolute placement position information of the markers to be placed in the photolithography pattern, establish a marker placement information table based on the absolute placement position information. The marker placement module is connected to the processing module and is configured to: automatically place the markers to be placed in the photolithography pattern corresponding to the target photolithography layer according to the marker placement information table, in response to photolithography requirements.
[0084] In some embodiments of this disclosure, the acquisition module is further configured to acquire a photolithographic layout and process flow based on the integrated circuit design. Accordingly, the number of photolithographic layers and the mark feature information table of the marks to be placed in each photolithographic layer are determined based on the photolithographic layout and process flow.
[0085] For example, the tag feature information table includes: tag type, and / or, tag relative position information.
[0086] For example, the marking types include at least one of: alignment markings, overlay error measurement markings, and critical dimension measurement markings.
[0087] In some embodiments of this disclosure, the processing module is further configured to: arrange the relative placement order of the spatial positions of multiple markers to be placed corresponding to each photolithographic layer according to the marker placement rules. Accordingly, the marker placement information table also includes the aforementioned placement order of the markers to be placed.
[0088] In some embodiments of this disclosure, the marker placement module is further configured to: in response to lithography requirements, automatically capture the absolute placement position information of the marker to be placed in the GDS file of the lithography pattern and the marker placement information table through software or script, and automatically place the marker to be placed in the GDS file.
[0089] In some embodiments of this disclosure, the processing module is further configured to: generate a marker placement report of the markers to be placed in the photolithography pattern, and establish automatic measurement rules for the markers to be placed based on the marker placement report.
[0090] In the automatic label placement apparatus provided in some of the above embodiments, the term "module" and the like used in this specification can be used to refer to computer-related entities, hardware, firmware, combinations of hardware and software, software, or software in execution. For example, a "module" can be, but is not limited to, a process running on a processor, a processor, an object, an executable file, an execution thread, a program, and / or a computer. For example, a "module" can be executed from various computer-readable media on which various data structures are stored. Furthermore, in the above embodiments provided in this disclosure, it should be understood that the disclosed "modules" can be implemented in other ways. For example, the modules described above are merely illustrative. For example, the division of modules is merely a logical functional division, and in actual implementation, there may be other division methods, such as multiple modules can be combined or integrated into another module, or some features can be ignored or not executed. The described interconnections can be through some interfaces, indirect coupling or communication connections between modules, and can be electrical, mechanical, or other forms. The modules described separately may or may not be physically separated. Some or all of the modules can be selected to achieve the purpose of the embodiments of this disclosure according to actual needs.
[0091] In some embodiments, this disclosure also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps of the automatic tag placement method involved in the above embodiments.
[0092] For example, the computer device may be a terminal, and its internal structure diagram may be as follows: Figure 10 As shown.
[0093] The computer device includes a processor, memory, input / output interfaces, a communication interface, a display unit, and an input device. The processor, memory, and input / output interfaces are connected via a system bus, and the communication interface, display unit, and input device are also connected to the system bus via the input / output interfaces. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The input / output interfaces are used for exchanging information between the processor and external devices. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, mobile cellular networks, NFC (Near Field Communication), or other technologies. When the computer program is executed by the processor, it implements the aforementioned automatic tag placement method. The display unit is used to form a visually visible image and can be a display screen, a projection device, or a virtual reality imaging device. The display screen can be an LCD screen or an e-ink screen. The input device of the computer device can be a touch layer covering the display screen, or buttons, trackballs, or touchpads set on the casing of the computer device, or external keyboards, touchpads, or mice, etc.
[0094] Those skilled in the art will understand that Figure 10 The structure shown is merely a block diagram of a portion of the structure related to the present disclosure and does not constitute a limitation on the computer device to which the present disclosure is applied. A specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.
[0095] In some embodiments, this disclosure also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the automatic tag placement method involved in the above embodiments.
[0096] In some embodiments, this disclosure also provides a program product having a computer program stored thereon, which, when executed by a processor, implements the steps of the automatic tag placement method involved in the above embodiments.
[0097] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, databases, or other media used in the embodiments provided in this disclosure can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this disclosure may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this disclosure may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.
[0098] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0099] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the scope of protection of this disclosure. Therefore, the scope of protection of this patent should be determined by the appended claims.
Claims
1. A method for automatically placing markers, characterized in that, include: Obtain the mark feature information table of the marks to be placed in the photolithography layer; Based on the marker feature information table, the placement area of the marker to be placed is divided in the photolithography pattern; Obtain the absolute placement position information of the marker to be placed in the photolithography pattern, and establish a marker placement information table based on the absolute placement position information; In response to lithography requirements, the markers to be placed are automatically placed in the lithography pattern corresponding to the target lithography layer according to the marker placement information table.
2. The automatic marker placement method according to claim 1, characterized in that, Before obtaining the marker feature information table of the markers to be placed in the photolithography layer, the automatic marker placement method further includes: Obtain the photolithography pattern and process flow based on the integrated circuit design; The number of photolithography layers and the mark feature information table of the marks to be placed in each photolithography layer are determined according to the photolithography pattern and the process flow.
3. The automatic marker placement method according to claim 2, characterized in that, The marker feature information table includes: marker type, and / or, marker relative position information; The marking types include at least one of alignment markings, overlay error measurement markings, and critical dimension measurement markings.
4. The automatic marker placement method according to claim 1, characterized in that, The number of photolithography layers is multiple; before dividing the placement area of the markers to be placed in the photolithography pattern based on the marker feature information table, the automatic marker placement method further includes: According to the marking placement rules, arrange the relative placement order of the multiple markings to be placed corresponding to each photolithographic layer in terms of their spatial positions; The marker placement information table also includes the placement order of the markers to be placed.
5. The automatic marker placement method according to claim 1, characterized in that, The step of automatically placing the markers to be placed in the photolithography pattern corresponding to the target photolithography layer according to the marker placement information table, in response to photolithography requirements, includes: In response to lithography requirements, the software or script automatically captures the GDS file of the lithography pattern and the absolute placement information of the marker to be placed in the marker placement information table, and automatically places the marker to be placed into the GDS file.
6. The automatic marker placement method according to any one of claims 1 to 5, characterized in that, Also includes: Generate a mark placement report showing the placement of the mark to be placed in the photolithography pattern; Based on the marker placement report, establish automatic measurement rules for the markers to be placed.
7. An automatic marker placement device, characterized in that, include: The module consists of an acquisition module, a processing module, and a marker placement module; among which, The acquisition module is configured to: acquire a mark feature information table of the mark to be placed in the photolithography layer, and after the processing module divides the placement area of the mark to be placed in the photolithography pattern based on the mark feature information table, acquire the absolute placement position information of the mark to be placed in the photolithography pattern. The processing module is connected to the acquisition module and is configured to: divide the placement area of the marker to be placed in the photolithography pattern based on the marker feature information table, and after the acquisition module acquires the absolute placement position information of the marker to be placed in the photolithography pattern, establish a marker placement information table based on the absolute placement position information. The marker placement module is connected to the processing module and is configured to: in response to lithography requirements, automatically place the marker to be placed in the lithography pattern corresponding to the target lithography layer according to the marker placement information table.
8. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method as described in any one of claims 1 to 6.
9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method as described in any one of claims 1 to 6.
10. A program product having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method as described in any one of claims 1 to 6.