Reliability evaluation method, device, storage medium and program product

Abstract

The application relates to the technical field of component reliability, in particular to a reliability evaluation method, equipment, a storage medium and a program product. The method comprises the following steps: obtaining first inspection results of performing initial performance state inspection on composite bonding points in multiple to-be-tested components; when the number of initial qualified composite bonding points reaches a first number according to the first inspection results, outputting first detection parameters corresponding to the initial qualified composite bonding points; obtaining second inspection results output after performing re-performance state inspection on the initial qualified composite bonding points after temperature treatment; if the difference between the first detection parameters and second detection parameters is less than a preset difference value, and the second number exceeds a preset number, determining that the reliability detection of the multiple to-be-tested components is passed. Through the above method, the reliability of the components can be evaluated, so that the performance failure of the electrical appliances in the process of using the components can be reduced.

Description

Technical Field

[0001] This application relates to the field of component reliability technology, specifically to a reliability evaluation method, device, storage medium, and program product. Background Technology

[0002] System-in-package (SiP) is an advanced chip packaging technology that integrates multiple integrated circuits and other electronic components into a single package to increase functional density and reduce manufacturing costs. For example, a phased array antenna multi-functional transceiver integrates a multi-functional amplitude and phase chip, a driver chip, a power amplifier, chip capacitors, and other components. The internal structure of a phased array antenna multi-functional transceiver is shown below. Figure 1 As shown.

[0003] Despite the rapid development of SiP technology, it still faces multiple technical challenges in moving towards higher integration levels, such as high-density interconnects, heterogeneous integration, thermal design, and electromagnetic shielding. In terms of high-density interconnects, various interconnect technologies are typically used within the same package, including wire bonding, flip-chip bonding, and through-silicon vias (TSVs).

[0004] Due to the limited internal space of SiP packaged devices, secondary bonding (i.e., composite bonding) is increasingly being performed on the same bonding area. However, there is currently no comprehensive reliability evaluation method for composite bonding points. This makes it impossible to determine whether the composite bonding points in components are qualified. If components containing unqualified composite bonding points are used in operation and production, there is a high probability that electrical performance failures will occur due to the failure of the composite bonding point connection. Summary of the Invention

[0005] This application provides a reliability evaluation method, device, storage medium, and program product that can evaluate the reliability of components to reduce electrical performance failures during component use.

[0006] In a first aspect, embodiments of this application provide a reliability evaluation method, the method comprising:

[0007] Obtain the first inspection results of the initial performance status check of the composite bonding points in multiple components under test;

[0008] When the number of initially qualified composite bonding points reaches a first quantity based on the first inspection result, the first detection parameter corresponding to the initially qualified composite bonding point is output.

[0009] After obtaining the temperature processing of the initially qualified composite bonding points, a second inspection result is output after performing a second performance status check. The second inspection result includes the second detection parameter corresponding to the second performance status check of the initially qualified composite bonding points, and the second number of composite bonding points that are qualified again.

[0010] If the difference between the first detection parameter and the second detection parameter is less than a preset difference, and the second quantity exceeds a preset quantity, then the reliability test of the plurality of components under test is determined to be passed.

[0011] In one possible implementation, the initial performance status check and the subsequent performance status check include some or all of the visual inspection, electrical testing, and tensile testing.

[0012] The appearance inspection is used to detect whether the composite bonding point meets the preset appearance standard.

[0013] The electrical test is used to detect whether the resistance value between multiple composite bonding points connected by leads is within a preset resistance range.

[0014] The tensile test is used to detect whether the bonding strength corresponding to the composite bonding point is not less than the preset bonding strength.

[0015] In one possible implementation, the initial performance status check and the subsequent performance status check include electrical testing;

[0016] Determining the difference between the first detection parameter and the second detection parameter includes:

[0017] The average first resistance is obtained based on the first resistance value corresponding to each initially qualified composite bonding point in the output.

[0018] Based on each initially qualified composite bond point, the performance status of the corresponding second resistance value is checked again to obtain the average value of the second resistance.

[0019] Determine the difference between the average value of the first resistor and the average value of the second resistor.

[0020] In one possible implementation, the initial performance status check and the subsequent performance status check include a tensile test;

[0021] Determining the difference between the first detection parameter and the second detection parameter includes:

[0022] The average value of the first bond strength is obtained based on the first bond strength corresponding to each initially qualified composite bond point in the output.

[0023] Based on each initially qualified composite bond point, the performance status of the corresponding second bond strength is checked again to obtain the second bond strength;

[0024] Determine the difference between the first bond strength and the second bond strength.

[0025] In one possible implementation, the method further includes:

[0026] The composite bonding points that pass the retest are then subjected to a cross-sectional inspection.

[0027] If the difference between the first bond strength and the second bond strength is less than a preset difference, the second quantity exceeds a preset quantity, and the composite bond point inspection of the cross-section is passed, then the reliability test of the plurality of components under test is determined to be passed.

[0028] In one possible implementation, obtaining the first inspection result of the initial performance status check of the composite bonding points in the multiple components under test includes:

[0029] The first inspection result of the initial performance status check of the first number of composite bonding points among the plurality of components under test is obtained, and the result determination is triggered.

[0030] When it is determined that there are unqualified composite bonding points based on the first inspection result, the first inspection result of the first performance status inspection is performed on the corresponding number of composite bonding points according to the number of unqualified composite bonding points, and the result judgment is triggered until the number of initially qualified composite bonding points reaches the first quantity.

[0031] In one possible implementation, the method further includes:

[0032] If all composite bonding points of the plurality of components under test have completed the initial performance status check, and the number of qualified composite bonding points does not reach a first number, then the reliability test of the plurality of components under test is determined to be unsuccessful.

[0033] Secondly, embodiments of this application provide a reliability evaluation device, the device comprising:

[0034] The module for obtaining the first inspection result is used to obtain the first inspection result of the initial performance status inspection of the composite bonding points in multiple components under test.

[0035] The output module is used to output the first detection parameter corresponding to the first qualified composite bonding point when the number of initially qualified composite bonding points reaches a first number based on the first inspection result.

[0036] The module for obtaining the second inspection result is used to perform a second performance status check on the initially qualified composite bonding points after temperature processing, and output the second inspection result. The second inspection result includes the second detection parameter corresponding to the second performance status check of the initially qualified composite bonding points, and the second number of composite bonding points that are qualified again.

[0037] The evaluation module is used to determine that the reliability test of the plurality of components under test has passed when the difference between the first detection parameter and the second detection parameter is less than a preset difference and the second quantity exceeds a preset quantity.

[0038] Thirdly, embodiments of this application provide an electronic device, the device comprising:

[0039] At least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor to enable the at least one processor to perform the method of the first aspect described above.

[0040] Fourthly, embodiments of this application provide a computer storage medium storing a computer program for causing a computer to perform the method described in the first aspect above.

[0041] Fifthly, embodiments of this application provide a computer program product for causing a computer to perform the method described in the first aspect above.

[0042] This application proposes a reliability evaluation method for components. The method mainly evaluates the reliability of composite bonding points by performing two performance checks and comparing the results of the two checks. This evaluation method provides a clear evaluation process, can obtain more accurate evaluation results, and can reduce the occurrence of electrical faults during the use of components. Attached Figure Description

[0043] Figure 1 A schematic diagram of the internal structure of a multifunctional transceiver device for a phased array antenna provided in this application embodiment;

[0044] Figure 2 A schematic diagram of a composite bonding point provided in an embodiment of this application;

[0045] Figure 3 This is a schematic diagram illustrating an application scenario of a reliability evaluation method provided in an embodiment of this application.

[0046] Figure 4This is a schematic diagram of a reliability evaluation method provided in an embodiment of this application;

[0047] Figure 5 A schematic diagram of a cross-sectional inspection location provided in an embodiment of this application;

[0048] Figure 6 This is a schematic diagram of the composite bond point bonding interface morphology provided in an embodiment of this application;

[0049] Figure 7 A schematic diagram of a reliability evaluation device provided in an embodiment of this application;

[0050] Figure 8 This is a schematic diagram of an electronic device provided in an embodiment of this application. Detailed Implementation

[0051] The principles and spirit of this application will now be described with reference to several exemplary embodiments. It should be understood that these embodiments are provided merely to enable those skilled in the art to better understand and implement this application, and are not intended to limit the scope of this application in any way. Rather, these embodiments are provided to make this disclosure more thorough and complete, and to fully convey the scope of this disclosure to those skilled in the art.

[0052] Those skilled in the art will recognize that embodiments of this application can be implemented as a system, apparatus, method, or computer program product. Therefore, this disclosure can be specifically implemented in the following forms: entirely hardware, entirely software (including firmware, resident software, microcode, etc.), or a combination of hardware and software.

[0053] In this article, it is important to understand that any number of elements in the accompanying figures is for illustrative purposes and not for limitation, and any naming is for distinction only and has no limiting meaning.

[0054] The following describes some of the concepts involved in the embodiments of this application.

[0055] Composite bonding points: In the fields of electronic packaging, semiconductor manufacturing, and microelectronic assembly, composite bonding points refer to functional areas formed through combinations of multiple materials, structural designs, or bonding processes, used to achieve electrical connections, mechanical fixation, or thermal conduction between chips and external circuits. Their core characteristic is "compositeness"—that is, breaking through the limitations of traditional single materials / processes, and meeting the complex application requirements of high reliability, high density, and high power through multi-component synergy. The compositeness of composite bonding points can be manifested in: material compositeness, structural compositeness, and process compositeness. Composite bonding points are like... Figure 2 As shown.

[0056] Composite bonding region: The specific area where composite bonding points are located can be called composite bonding region. Composite bonding region is not a single "point", but a specific area in chip, substrate or packaging structure that is specially planned to arrange multiple composite bonding points and realize coordinated functions such as "electrical connection, mechanical fixation and thermal management".

[0057] Bonding types: The bonding types of composite bonding points are a diverse classification system derived from their "compositeness" and based on material properties, connection principles, and processing methods. For example, bonding types can include adhesive bonding, metallization bonding, interlayer bonding of composite materials, coating bonding, etc.

[0058] The second bonding step is a core step in the wire bonding process, widely used in semiconductor packaging (such as electrical connections between chips and substrates, and between chips and lead frames). It is one of the key operations for realizing "chip signal / power output". Essentially, it is the process of connecting the other end of the bonding wire to an external carrier (such as substrate pads or lead frames) after the chip-side connection is completed by the "first bonding". The two bonding steps together form a conductive path between the "chip and external carrier".

[0059] Wire tail: In the wire bonding process, after the bonding wire completes the bonding operation, a small section of excess metal wire remains at the bonding point; this is called the tail. For example, when using positive solder bonding, there is usually a tail at the bonding point on the chip. Its length is generally strictly regulated, such as typically not exceeding twice the diameter of the bonding wire.

[0060] Non-public active metal areas: "Active metal areas" are regions on a chip that contain active devices (such as transistors, which provide functions such as rectification, switching, and amplification) and have metallized wiring on their surface. "Non-public" refers to areas that are not specifically designed for bonding as common connection areas. For example, bonding pads on a chip are common active metal areas, while metal wiring areas used for internal circuit connections between active devices within the chip are non-public active metal areas.

[0061] Unpassivated: Glass passivation is a common surface protection process in semiconductor device manufacturing. It involves growing or coating a thin glass film on the chip surface to protect it from contamination, oxidation, and reduce surface leakage. "Unpassivated" means that the relevant metal areas are not covered with this protective glass film.

[0062] The following describes in detail, with reference to the accompanying drawings, a reliability evaluation method according to an embodiment of this application.

[0063] like Figure 3 The illustration shows an application scenario of a reliability evaluation method provided in this application embodiment. This application scenario includes a server 301 and at least one testing device (such as...). Figure 3The test devices shown are 302_1, 302_2, ..., 302_N. Server 301 is used to obtain test results about the component under test from at least one test device. At least one test device is used to perform performance status checks on the component under test and send the obtained check results to server 301.

[0064] Among them, server 301 can be an independently deployed physical server or a server cluster or distributed system composed of multiple physical servers. It can also be a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, content delivery networks (CDN), and big data and artificial intelligence platforms. This application embodiment does not make specific limitations.

[0065] In addressing the problem that existing technologies lack comprehensive reliability evaluation methods for composite bond points, leading to a higher probability of electrical performance failures due to composite bond point connection failures, this application provides a reliability evaluation method, such as... Figure 4 As shown, the specific process includes:

[0066] S401: Obtain the first inspection result of the initial performance status check of the composite bonding points in multiple components under test.

[0067] For example, for a phased array antenna multi-functional transceiver device, which includes components such as a multi-functional amplitude and phase chip, a driver chip, a power amplifier, and chip capacitors, in order to ensure the normal operation of the phased array antenna multi-functional transceiver device, it is necessary to ensure that the reliability test of each component passes. In the embodiments of this application, the reliability of the components is reflected by evaluating the reliability of each composite bonding point in the components.

[0068] After obtaining multiple components under test (DUTs), the initial performance status check of the composite bonding points in each DUT needs to be performed. This initial performance status check includes at least one of the following:

[0069] (1) Visual inspection.

[0070] Visual inspection is used to check whether the composite bonding points meet preset appearance standards.

[0071] Specifically, a microscope can be used to magnify the composite bonding points to be evaluated, for example, by 30 to 60 times. After magnification, the composite bonding points are visually inspected. If the following conditions are found, the composite bonding points are deemed unqualified.

[0072] 1) Peeling and flaking occur in the bonding area.

[0073] "Peeling and flaking in the composite bonding area" is a typical problem of material or structural bonding failure, which is common in scenarios that require multi-layer / multi-component bonding through bonding processes (such as electronic packaging, composite material components, semiconductor devices, coating-substrate bonding, etc.).

[0074] Different materials exhibit different peeling phenomena. For example: if it is an adhesive bond (such as epoxy or acrylic adhesive bonding metal / plastic / ceramic): peeling is often accompanied by cracking of the adhesive layer or "adhesive-matrix interface separation"; if it is a metallization bond (such as gold-aluminum or copper-copper bonding in semiconductor chips): peeling may be caused by embrittlement of intermetallic compounds or interface oxidation; if it is an interlayer bond of composite materials (such as carbon fiber / resin-based composite materials): peeling is often "interlayer delamination", which is related to the strength of the resin matrix or the wettability of the interface; if it is a coating bond (such as thin film coating or electroplating): peeling is due to insufficient adhesion between the coating and the matrix, manifested as "whole piece peeling" or "fragmented peeling".

[0075] 2) The contact area of ​​the second bonding at the composite bonding point is less than 75% of the area of ​​the underlying bonding layer.

[0076] Taking the common wire bonding process as an example, a first bonding point is usually formed at the chip electrode or other locations, and then a second bonding point is formed on other parts of the substrate or other locations using bonding wires. If, after bonding, the area of ​​the second bonding point in contact with the substrate is less than 75% of the area of ​​the first bonding point in contact with the chip, it indicates that the visual inspection fails.

[0077] 3) The composite bonding points are bonded by multiple metallic materials.

[0078] Different metals / materials (such as gold and aluminum, copper and nickel, metal and ceramics) exhibit observable "differential characteristics" under a microscope. These characteristics are key to distinguishing between "bonding of the same material" and "composite bonding of different materials": Color / grayscale differences: Different materials have different reflectivities of light (e.g., gold is bright yellow, aluminum is silvery white, and copper is rose red), which will show obvious "color / grayscale boundaries" in optical microscopes or secondary electron images; Compositional differences: Different materials have completely different elemental compositions, and the types of elements can be directly detected by energy dispersive spectroscopy to confirm the existence of two or more different materials; Structure / morphology differences: Different materials have different hardness and plasticity, and after bonding, they are prone to forming "differentiated deformation characteristics" (e.g., hard materials deform less, soft materials deform more), or forming a "transition layer" at the interface (e.g., intermetallic compounds formed by the bonding of different metals have different morphologies from the materials on both sides).

[0079] Whether a composite bonding point contains multiple metallic materials can be determined by visual inspection or energy dispersive spectroscopy (EDS) analysis. This application does not impose specific limitations on this method.

[0080] 4) For composite bonding points on a chip, the bonding area within the bonding region is less than 50% of the total area of ​​the bonding region.

[0081] The core concept is that within the "bonding target area" specified in the design, the area where an effective metallurgical bond (or reliable physical connection) is actually formed is less than 50% of the total area of ​​the target area, and the remaining part is the "unbonded area" (such as voids, gaps, and non-contact areas).

[0082] The “bonding area” is a specific region pre-designed in chip bonding design to achieve a reliable connection. The “bonding area” is not the visual “bonding point coverage area”, but the area that actually achieves a “reliable connection” (for metal bonding, it is the area that forms a “metallurgical bond”; for adhesive bonding, it is the area where the adhesive layer is fully wetted by the substrate).

[0083] 5) The bonding wire tail extends to or contacts any non-public, un-glass-passivated active metal region.

[0084] 6) The length of the tail wire in the bonding area exceeds twice the wire diameter, or the length of the packaged wire exceeds four times the wire diameter.

[0085] The values ​​of "75%", "50%", "2 times", and "4 times" mentioned above are based on experience. This means that the performance of composite bonding points that do not meet these values ​​is poor. These values ​​can be adjusted according to changes in the operating environment of the components. This application does not impose specific limitations on these values.

[0086] Among the judgment conditions 1) to 6) above, there are conditions that cannot be determined by visual inspection alone, such as 2), 4), and 6). Therefore, when making judgments such as 2), 4), and 6), an image of the composite bonding point can be taken using a scanning electron microscope, and then the image processing can be used to determine whether it meets the requirements of 2), 4), and 6).

[0087] For example, regarding 2) above, after obtaining the image of the composite bonding point, a pre-trained recognition model can be used to identify the second bonding portion and the lower bonding portion within the composite bonding point. Then, the numerical relationship between the contact area of ​​the second bonding and the area of ​​the lower bonding can be calculated. 4) and 6) above can also be achieved using similar methods, which will not be elaborated upon here.

[0088] (2) Electrical test.

[0089] Electrical testing is used to detect whether the resistance value between multiple composite bonding points with lead connections is within a preset resistance range.

[0090] Specifically, a DC resistance value tester can be used to measure the resistance value between the composite bonding points connected by leads. It should be noted that since these composite bonding points may be used for other tests in the future, when using the DC resistance value tester for the composite bonding points, the composite bonding points and the leads should not be damaged.

[0091] When the measured resistance value is not within the preset resistance range, it indicates that the electrical test of the composite bonding point is unqualified.

[0092] In another possible implementation, during the operation of the component, the voltage or current between the composite bonding points can also be detected, and whether it is qualified can be judged according to the measured voltage or current. Regarding this, the embodiments of the present application do not make specific limitations.

[0093] (3) Tensile test.

[0094] The tensile test is used to detect whether the bonding strength corresponding to the composite bonding point is not less than the preset bonding strength.

[0095] Specifically, place the hook of the tensile test equipment below the highest point of the lead arc, apply a tensile force in the vertical direction of the hook until the lead is broken, and record the tensile force value and the fracture mode at the time of fracture. When the tensile force value at the time of fracture meets Table 1 below, and the separation mode is "the lead breaks at the necking point", the tensile test is qualified, and other situations are unqualified. "The lead breaks at the necking point" means that the lead (such as the chip bonding lead) breaks at the "necking point" where its own diameter becomes smaller and the cross-section shrinks, which is a typical phenomenon of lead failure and is common in scenarios such as chip packaging.

[0096] Table 1

[0097]

[0098] For example, for an aluminum wire with a diameter of 18 microns, after testing, its bonding strength is 0.016, which is not less than the minimum bonding strength of 0.015, indicating that the tensile force value of the aluminum wire at the time of fracture meets Table 1.

[0099] In another possible implementation, in addition to the above "destructive" tensile test, a "non-destructive" tensile test can also be carried out.

[0100] Specifically, the process of the "non-destructive" tensile test is as follows: place the hook of the tensile test equipment below the highest point of the lead arc, apply a tensile force in the vertical direction of the hook until the tensile force value reaches the preset value shown in Table 2 below, then stop applying the tensile force, and then record the failure situation of the lead. When the lead shows deformation, fracture or cracking at the composite bonding point, etc., the lead is determined to be failed, that is, unqualified.

[0101] Table 2

[0102]

[0103] In the embodiments of this application, the initial performance status check may include some or all of the above-mentioned appearance inspection, electrical testing and tensile testing. In order to ensure the comprehensiveness and accuracy of the reliability evaluation, all tests may be performed. In this regard, the embodiments of this application do not make specific limitations.

[0104] It should be noted that when determining to conduct a "destructive" tensile test, it should be performed last to avoid affecting the testing process. The tensile testing equipment can output the bond strength of the composite bond points during the tensile test. The equipment can also directly output whether the "non-destructive" and "destructive" tensile tests are qualified.

[0105] S402: When the number of initially qualified composite bonding points reaches a first quantity based on the first inspection result, output the first detection parameter corresponding to the initially qualified composite bonding points.

[0106] The aforementioned first inspection result includes determining the number of initially qualified composite bonding points and the first detection parameter corresponding to the initially qualified composite bonding points. The first detection parameter is different for different tests. For example, for electrical tests, the corresponding first parameter can be the average resistance value, and for tensile tests, the corresponding first parameter can be the average bond strength value. This application embodiment does not impose specific limitations.

[0107] During testing, all composite bond points can undergo visual inspection, electrical testing, and tensile testing to obtain the first inspection results for each composite bond point. Based on these results, it can be determined whether the initial number of qualified composite bond points has reached a first quantity. Alternatively, a first quantity of composite bond points can be randomly selected for initial performance status checks. After obtaining the first inspection results, a result determination is triggered. If unqualified composite bond points are determined based on the first inspection results, a corresponding number of unqualified composite bond points are selected for initial performance status checks, and the first inspection results are obtained again, triggering a result determination until the initial number of qualified composite bond points reaches the first quantity. This application does not specifically limit the specific testing process.

[0108] Specifically, taking the visual inspection, electrical testing, and tensile testing of composite bonds and points as an example, the testing sequence is: visual inspection, electrical testing, "non-destructive" tensile testing, and "destructive" tensile testing. The testing procedure includes the following two methods.

[0109] (1) Test all composite bonding sites.

[0110] All composite bonding points are visually inspected. If the number of composite bonding points that pass the visual inspection is not less than the first quantity, an electrical test is performed. If the number of composite bonding points that pass the electrical test is not less than the first quantity, a tensile test is performed.

[0111] Because the leads may break or deform during tensile testing, they are grouped before the tensile test to avoid affecting subsequent performance checks.

[0112] Specifically, for example, the number of composite bonding points that pass the visual inspection and electrical test is 60, and these 60 composite bonding points are divided into 3 groups of 20 each.

[0113] The first group does not undergo tensile testing, the second group undergoes "non-destructive" tensile testing, and the third group undergoes "destructive" tensile testing. Then, the number of composite bonding points in the second and third groups is counted. If the number of composite bonding points in the second and third groups meets the requirements (e.g., both are 15), the subsequent steps are performed. If the requirements are not met, the reliability test of the multiple components under test is deemed to have failed.

[0114] (2) Select the first number of composite bonding sites for testing.

[0115] Taking a quantity of 45 as an example, 45 composite bond points are randomly selected from multiple components under test for visual inspection. If any are found to be defective, the same number of defective composite bond points are selected again for visual inspection (e.g., if 10 are defective, 10 are selected again for visual inspection), until all are qualified. Then, these 45 composite bond points that passed the visual inspection are subjected to electrical testing. Similar to the visual inspection, any defective points are replaced until all 45 composite bond points pass the electrical test. After the electrical test, a tensile test is performed. Similar to the "tensile test" in "testing all composite bond points" above, the 45 composite bond points that passed the electrical test need to be grouped. For example, they can be divided into 3 groups of 15 each.

[0116] The first group does not undergo tensile testing, the second group undergoes "non-destructive" tensile testing, and the third group undergoes "destructive" tensile testing. Since both the second and third groups have 15 composite bond points, if any fails during the composite bond point testing of the second or third group, the number of failed points is increased to 15 until the second group has 15 composite bond points that pass the "non-destructive" tensile test and the third group has 15 composite bond points that pass the "destructive" tensile test.

[0117] If the above requirements are met (i.e., 15 in each of the second, third, and fourth groups), the subsequent process continues; if the above requirements are not met, it is determined that multiple components under test have failed the reliability evaluation.

[0118] S403: After obtaining the temperature of the initially qualified composite bonding point, perform a second performance status check and output the second check result.

[0119] After the above S402, a first number of initially qualified composite bonding points are obtained, and then the initially qualified composite bonding points are subjected to temperature treatment.

[0120] In one possible implementation, the temperature treatment can be to place the test component containing the initially qualified composite bonding point into a high-temperature test chamber for high-temperature storage experiment. The test temperature and test time can be set, for example, the test temperature can be set to 150°C and the test time to 1000h. Nitrogen gas is purged into the test chamber for protection. This application does not make specific limitations.

[0121] After the initially qualified composite bonding points are subjected to temperature treatment, a second performance status check is performed. This second performance status check can be completely identical to or partially identical to the initial performance status check. For example, the initial performance status check includes visual inspection, electrical testing, and tensile testing, while the second performance status check may include visual inspection, electrical testing, and tensile testing, or it may include only electrical testing and tensile testing. This application does not specifically limit the scope of the second performance status check.

[0122] After performing a second performance status check on the composite bond points that have undergone temperature treatment, a second test result is obtained. The second test result includes the second test parameters corresponding to the second performance status check, and the second number of composite bond points that pass the second test.

[0123] Different tests require different second detection parameters. For example, there is no corresponding second detection parameter for visual inspection, but for electrical testing, the second detection parameter can be the average resistance value; for tensile testing, the second detection parameter can be the average bond strength value.

[0124] In one possible implementation, the average first resistance value corresponding to the initial electrical test is determined by the following method:

[0125] The first average resistance is obtained based on the first resistance value corresponding to each initially qualified composite bonding point in the output.

[0126] The average value of the second resistance corresponding to the second electrical test is determined using the following method:

[0127] Based on each initially qualified composite bonding point, the performance status is checked again to obtain the corresponding second resistance value, and the average second resistance value is obtained.

[0128] The mean value of the first bond strength corresponding to the initial electrical test was determined using the following method:

[0129] The average value of the first bond strength is obtained based on the first bond strength corresponding to each initially qualified composite bond point in the output.

[0130] The mean value of the second bond strength corresponding to the second electrical test was determined using the following method:

[0131] The second bond strength is obtained by checking the performance status of each initially qualified composite bond point again.

[0132] S404: If the difference between the first detection parameter and the second detection parameter is less than a preset difference, and the second quantity exceeds a preset quantity, then the reliability test of the plurality of components under test is determined to be passed.

[0133] Based on the processes S401 to S403 above, at least one first detection parameter and at least one second detection parameter can be obtained. When calculating the difference, the difference between the first detection parameter and the second detection parameter of the same type is calculated. For example, the difference between the average first resistance and the average second resistance corresponding to the electrical test is calculated, and / or the difference between the average first bond strength and the average second bond strength corresponding to the tensile test is calculated. The above-mentioned preset difference can be 10% of the first detection parameter, and this embodiment of the application does not specifically limit it.

[0134] In addition to ensuring that the test parameters match after the two performance status checks, it is also necessary to ensure that the number of qualified composite bonding points after the second performance status check exceeds the preset number before the reliability test of the multiple components under test can be determined to have passed.

[0135] The following example illustrates the process of evaluating the reliability of components under test, with the initial performance status check sequence being visual inspection, electrical testing, and tensile testing, and the subsequent performance status check sequence being electrical testing and tensile testing.

[0136] Step 1: Select composite bonding points from multiple components under test. The selection criteria can meet the following conditions: 1) Determine the initial number based on the total number of composite bonding points, such as 45; 2) Select more than 3 composite bonding points for each type of integrated circuit; 3) Select more than 1 composite bonding point for each type of diode, transistor, chip capacitor, chip resistor, etc.; 4) There are more than 5 composite bonding points connected to the component lead frame.

[0137] Step 2: Perform an initial performance status check. First, conduct a visual inspection. If any defects are found, replenish them according to the number of defects until the first number of composite bonding points are qualified. The qualification conditions for the visual inspection are as described in the implementation method of S401 above, and will not be repeated here.

[0138] After visual inspection, electrical testing is performed. If any defects are found, the remaining defects are replenished until the first number of composite bonding points are qualified. The qualification conditions for electrical testing are as described in the above-mentioned S401 implementation method, and will not be repeated here.

[0139] After the electrical tests are passed, the initial number of composite bond points are grouped. For example, 45 composite bond points are divided into 3 groups of 15 each. The first group does not undergo tensile testing, the second group undergoes a non-destructive tensile test, and the third group undergoes a destructive tensile test. If any composite bond points fail the non-destructive or destructive tensile tests, the remaining points are replaced until the number of points passing both the non-destructive and destructive tensile tests reaches 15.

[0140] The third step involves temperature treatment of the first group of composite bond points that were not subjected to tensile testing, and the second group of composite bond points that underwent "non-destructive" tensile testing, followed by another performance status check. Since the third group of composite bond points has been damaged and cannot be re-checked for performance status, temperature treatment is not required for these third group of composite bond points.

[0141] Step 4: Perform electrical tests on the composite bonding points of the first and second groups in Step 3, and calculate the average resistance of the composite bonding points of the first and second groups, as well as the average resistance of the composite bonding points of the first and second groups before temperature treatment.

[0142] If there are any unqualified composite bonding points in step four, the reliability test of the component under test is determined to be unsuccessful. If all are qualified, it is determined whether the difference between the average values ​​of the two resistors is less than the preset resistance. For example, if the difference is less than 10% of the average resistance obtained in the initial electrical test, if it is not less than 10%, it indicates that the reliability test of the component under test has failed; if it is less than 10%, proceed to step five.

[0143] Step 5: Perform a destructive tensile test on the composite bonding points of the first group in Step 4, and calculate the average bond strength of the first group of composite bonding points, as well as the average bond strength of the third group of composite bonding points after the destructive tensile test before temperature treatment. To ensure the rationality of the experiment, the lead diameter and material of the composite bonding points in the first and third groups were made the same during the grouping in Step 2. In the embodiments of this application, it is assumed that different composite bonding points with the same lead diameter and the same material will have the same tensile test results.

[0144] If there are unqualified composite bonding points after the "destructive" tensile test on the composite bonding points of the first group, it indicates that the reliability test of the device under test fails; if all the composite bonding points of the first group pass the "destructive" tensile test, then determine whether the difference between the two average bonding strengths is less than the preset bonding strength. For example, this difference is not less than 10% of the average bonding strength obtained from the first "destructive" tensile test. If it is not less, it indicates that the reliability test of the device under test fails; if it is less, then proceed to the sixth step.

[0145] Sixth step: Conduct a "non-destructive" tensile test on the composite points of the second group in the fourth step, and calculate the average bonding strength of the composite bonding points of the second group, as well as the average bonding strength of the composite bonding points of the second group after the "non-destructive" tensile test before temperature treatment.

[0146] If there are unqualified composite bonding points after the "non-destructive" tensile test on the composite bonding points of the second group, it indicates that the reliability test of the device under test fails; if all the composite bonding points of the second group pass the "non-destructive" tensile test, then determine whether the difference between the two average bonding strengths is less than the preset bonding strength. For example, this difference is not less than 10% of the average bonding strength obtained from the first "non-destructive" tensile test. If it is not less, it indicates that the reliability test of the device under test fails; if it is less, then proceed to the seventh step.

[0147] Seventh step: Conduct a cross-section inspection on the first group of composite bonds that passed the "destructive" tensile test in the fifth step, and the second group of composite bonding points that passed the "non-destructive" tensile test in the sixth step.

[0148] Specifically, a metallurgical microscope or a scanning electron microscope can be used to observe the interfacial bonding situation of the composite bonding points. The bonding interfaces between the two bonding points of all samples and the bonding between the first bonding point and the composite bonding area are good, without defects such as gaps and voids, and the test results are qualified. The cross-section inspection positions are as Figure 5 shown, the morphological diagram of the bonding interface of the composite bonding points is as Figure 6 shown, there is no gap at the composite connection, and it can be determined as qualified. If it is determined that the cross-section inspection is qualified, it is determined that the reliability tests of multiple devices under test pass; if there are composite bonding points with unqualified cross-section inspections, it is determined that the reliability tests of multiple devices under test pass.

[0149] The embodiment of the present application proposes a reliability evaluation method for components, mainly by evaluating through the detection of composite bonding points. This evaluation method comprehensively considers the detection results of multiple aspects, making the obtained evaluation indicators more comprehensive and the obtained evaluation results more accurate, thereby reducing the occurrence of electrical failure phenomena during the use of components.

[0150] Based on the same inventive concept, embodiments of this application provide a reliability evaluation device, such as... Figure 7 As shown, the device includes:

[0151] The module 701 for obtaining the first inspection result is used to obtain the first inspection result of the initial performance status inspection of the composite bonding points in multiple components under test.

[0152] The output module 702 is used to output the first detection parameter corresponding to the first qualified composite bonding point when the number of initially qualified composite bonding points reaches a first number based on the first inspection result.

[0153] The module 703 for obtaining the second inspection result is used to perform a second performance status check on the initially qualified composite bonding points after temperature processing and output the second inspection result. The second inspection result includes the second detection parameter corresponding to the second performance status check of the initially qualified composite bonding points and the second number of composite bonding points that are qualified again.

[0154] The evaluation module 704 is used to determine that the reliability test of the plurality of components under test has passed when the difference between the first detection parameter and the second detection parameter is less than a preset difference and the second quantity exceeds a preset quantity.

[0155] In one possible real-time mode, the device further includes a module for determining inspection items, for determining that the initial performance status check and the subsequent performance status check include some or all of the visual inspection, electrical testing and tensile testing;

[0156] The appearance inspection is used to detect whether the composite bonding point meets the preset appearance standard.

[0157] The electrical test is used to detect whether the resistance value between multiple composite bonding points connected by leads is within a preset resistance range.

[0158] The tensile test is used to detect whether the bonding strength corresponding to the composite bonding point is not less than the preset bonding strength.

[0159] In one possible implementation, the initial performance status check and the subsequent performance status check include electrical testing;

[0160] Evaluation module 704 is used for:

[0161] The average first resistance is obtained based on the first resistance value corresponding to each initially qualified composite bonding point in the output.

[0162] Based on each initially qualified composite bond point, the performance status of the corresponding second resistance value is checked again to obtain the average value of the second resistance.

[0163] Determine the difference between the average value of the first resistor and the average value of the second resistor.

[0164] In one possible implementation, the initial performance status check and the subsequent performance status check include a tensile test;

[0165] Evaluation module 704 is used for:

[0166] The average value of the first bond strength is obtained based on the first bond strength corresponding to each initially qualified composite bond point in the output.

[0167] Based on each initially qualified composite bond point, the performance status of the corresponding second bond strength is checked again to obtain the second bond strength;

[0168] Determine the difference between the first bond strength and the second bond strength.

[0169] In one possible implementation, the evaluation module 704 is used for:

[0170] The composite bonding points that pass the retest are then subjected to a cross-sectional inspection.

[0171] If the difference between the first bond strength and the second bond strength is less than a preset difference, the second quantity exceeds a preset quantity, and the composite bond point inspection of the cross-section is passed, then the reliability test of the plurality of components under test is determined to be passed.

[0172] In one possible implementation, the module 701 for obtaining the first inspection result is used to:

[0173] The first inspection result of the initial performance status check of the first number of composite bonding points among the plurality of components under test is obtained, and the result determination is triggered.

[0174] When it is determined that there are unqualified composite bonding points based on the first inspection result, the first inspection result of the first performance status inspection is performed on the corresponding number of composite bonding points according to the number of unqualified composite bonding points, and the result judgment is triggered until the number of initially qualified composite bonding points reaches the first quantity.

[0175] In one possible implementation, the evaluation module 704 is used for:

[0176] If all composite bonding points of the plurality of components under test have completed the initial performance status check, and the number of qualified composite bonding points does not reach a first number, then the reliability test of the plurality of components under test is determined to be unsuccessful.

[0177] Based on the same inventive concept, this application provides another electronic device, the device including at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, the instructions being executed by the at least one processor to enable the at least one processor to perform any of the reliability evaluation methods in the above embodiments.

[0178] The following reference Figure 8 To describe an electronic device 80 according to this embodiment of the present application. Figure 8 The electronic device 80 shown is merely an example and should not impose any limitations on the functionality and scope of use of the embodiments of this application.

[0179] like Figure 8 As shown, the electronic device 80 is presented in the form of a general-purpose electronic device. The components of the electronic device 80 may include, but are not limited to: at least one processor 81, at least one memory 82, and a bus 83 connecting different system components (including memory 82 and processor 81).

[0180] The processor 81 is used to read and execute instructions from the memory 82, so that the at least one processor can execute the reliability evaluation method provided in the above embodiments.

[0181] Bus 83 represents one or more of several bus structures, including a memory bus or memory controller, peripheral bus, processor, or a local bus using any of the various bus structures.

[0182] The memory 82 may include a readable medium in the form of volatile memory, such as random access memory (RAM) 821 and / or cache memory 822, and may further include read-only memory (ROM) 823.

[0183] The memory 82 may also include a program / utility 825 having a set (at least one) of program modules 824, including but not limited to: an operating system, one or more application programs, other program modules, and program data, each or some combination of these examples may include an implementation of a network environment.

[0184] Electronic device 80 can also communicate with one or more external devices 84 (e.g., keyboard, pointing device, etc.), and with one or more devices that enable a user to interact with electronic device 80, and / or with any device that enables electronic device 80 to communicate with one or more other electronic devices (e.g., router, modem, etc.). This communication can be performed via input / output (I / O) interface 85. Furthermore, electronic device 80 can also communicate with one or more networks (e.g., local area network (LAN), wide area network (WAN), and / or public networks, such as the Internet) via network adapter 86. As shown, network adapter 86 communicates with other modules used in electronic device 80 via bus 83. It should be understood that, although not shown in the figures, other hardware and / or software modules can be used in conjunction with electronic device 80, including but not limited to: microcode, device drivers, redundant processors, external disk drive arrays, RAID systems, tape drives, and data backup storage systems.

[0185] In some possible implementations, various aspects of the reliability evaluation method provided in this application can also be implemented in the form of a program product, which includes program code that, when the program product is run on a computer device, causes the computer device to perform the steps of a reliability evaluation method according to various exemplary embodiments of this application as described above.

[0186] In addition, this application also provides a computer-readable storage medium storing a computer program for causing a computer to perform the method described in any of the above embodiments.

[0187] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0188] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0189] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0190] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A reliability evaluation method characterized by comprising: The method comprises: obtaining first inspection results of first quantity of composite bonding points in a plurality of to-be-tested components respectively performing initial performance state inspection, and triggering result determination; when it is determined that there are unqualified composite bonding points according to the first inspection results, selecting a corresponding number of composite bonding points according to the number of unqualified composite bonding points to perform initial performance state inspection, and triggering result determination until the number of initially qualified composite bonding points reaches the first quantity, and outputting first detection parameters corresponding to the initially qualified composite bonding points; obtaining second inspection results output after the initially qualified composite bonding points are respectively subjected to re-performance state inspection after temperature treatment, the second inspection results comprising second detection parameters corresponding to re-performance state inspection of the initially qualified composite bonding points, and a second quantity of re-qualified composite bonding points; if the difference between the first detection parameters and the second detection parameters is less than a preset difference value, and the second quantity exceeds a preset quantity, it is determined that the reliability detection of the plurality of to-be-tested components is passed; wherein the detection sequence of the initial performance state inspection is appearance inspection, electrical test, non-destructive tensile test, and destructive tensile test, before the non-destructive tensile test, the plurality of composite bonding points to be detected are grouped, and the non-destructive tensile test and the destructive tensile test are performed on the composite bonding points in different groups respectively.

2. The method of claim 1, wherein, The re-performance state inspection comprises part or all of appearance inspection, electrical test and tensile test; wherein the appearance inspection is used to detect whether the composite bonding points meet a preset appearance standard; the electrical test is used to detect whether the resistance values between the plurality of composite bonding points connected by leads are within a preset resistance range; the tensile test is used to detect whether the bonding strength corresponding to the composite bonding points is not less than a preset bonding strength.

3. The method of claim 2, wherein, The initial performance state inspection and the re-performance state inspection comprise electrical test; determining the difference between the first detection parameters and the second detection parameters comprises: obtaining a first resistance average value based on the first resistance value corresponding to each of the initially qualified composite bonding points output; obtaining a second resistance average value based on the second resistance value corresponding to each of the initially qualified composite bonding points performing re-performance state inspection; determining the difference between the first resistance average value and the second resistance average value.

4. The method of claim 2, wherein, The initial performance state inspection and the re-performance state inspection comprise tensile test; determining the difference between the first detection parameters and the second detection parameters comprises: obtaining a first bonding strength average value based on the first bonding strength corresponding to each of the initially qualified composite bonding points output; obtaining a second bonding strength based on the second bonding strength corresponding to each of the initially qualified composite bonding points performing re-performance state inspection; determining the difference between the first bonding strength and the second bonding strength.

5. The method of claim 4, wherein, The method further comprises: determining to perform cross-section inspection on the re-qualified composite bonding points; If a difference between the first bonding strength and the second bonding strength is less than a preset difference, the second number exceeds a preset number, and the requalified composite bonding point inspection by the cross-section inspection is passed, it is determined that the reliability detection of the plurality of DUTs is passed.

6. The method of claim 1, wherein, Also included are: If all composite bonding points in the plurality of DUTs complete the initial performance state inspection, and the number of qualified composite bonding points does not reach a first number, it is determined that the reliability detection of the plurality of DUTs is not passed.

7. An electronic device, comprising: The device includes: at least one processor; and a memory connected to the at least one processor in communication; wherein the memory stores instructions executed by the at least one processor, and the instructions are executed by the at least one processor to cause the at least one processor to perform the method of any one of claims 1-6.

8. A computer storage medium, characterized in that The computer storage medium stores a computer program, and the computer program is used to cause a computer to perform the method of any one of claims 1-6.

9. A computer program product, characterised in that, The computer program product is used to cause a computer to perform the method of any one of claims 1-6.

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