Loose core reverse film positioning device

Abstract

The invention relates to a loose core reverse film positioning device, and belongs to the technical field of semiconductor bonding. The device comprises a bottom frame, the top surface of the bottom frame is a supporting plane, the supporting plane is provided with a positioning part used for positioning a wafer ring, a pair of horizontal and parallel guide grooves are formed in the two inner sides of the bottom frame, groove openings of the two guide grooves are inwards and oppositely formed, and a film pouring platform capable of linearly reciprocating along the guide grooves is jointly connected into the two guide grooves. The film pouring platform comprises a positioning plate and a set of idler wheels connected with the two sides of the positioning plate, positioning grid lines are arranged on the upper surface of the positioning plate, and the idler wheels are located in the guide grooves and are in rolling guide fit with the guide grooves. The device is simple in structure and low in cost, the wafer ring is supported and positioned through the bottom frame and the positioning part, the positioning grid lines of the positioning film pouring platform are used for reference, small-batch loose core accurate film pouring can be achieved through simple manual operation, the consistency of the positions, the angles and the intervals of loose core film pouring every time is guaranteed, and the follow-up system visual recognition requirement is met.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor die bonding, in particular to a scattered core film-up positioning device. BACKGROUND

[0002] The semiconductor die bonding process is a key step in semiconductor packaging, which fixes the chip on the substrate or lead frame through conductive or insulating glue, and combines mechanical fixation and electrical interconnection functions. Chip picking in the die bonding process is a process of accurately picking the chip from the blue film by visually identifying the chip position, shape and angle. In the actual packaging process, in addition to picking the chip from the wafer with neatly arranged chips, the scattered core on the blue film is also picked up, and the position and angle of the chip after each film-up cannot be guaranteed, which is not conducive to visual identification and affects the picking efficiency.

[0003] Through retrieval, it is found that there are existing devices for chip film-up in the prior art, such as a chip automatic film-up device with publication number CN218024148U, which includes a workbench, an upper feeding mechanical arm, an upper feeding table, a film pressing device, a film pressing table, a lower feeding mechanical arm and a blue film box mounted on the workbench; the upper end of the upper feeding mechanical arm is provided with a suction cup; the lower end of the lower feeding mechanical arm is provided with a mechanical claw, and the blue film box contains a blue film; the film pressing device is installed above the film pressing table through a support, and the upper feeding mechanical arm and the lower feeding mechanical arm are connected with the workbench. This structure is relatively complex, the device structure cost is high, and it is suitable for large-scale chip film-up, but not suitable for small-batch, low-cost scattered core film-up positioning. SUMMARY

[0004] The present application is to overcome the shortcomings in the prior art, and provides a scattered core film-up positioning device suitable for small-batch, low-cost, which can accurately film-up the scattered core in the waffle box on the blue film, and ensure the consistency of the position, angle and spacing of the scattered core film-up each time, meeting the subsequent system visual identification requirements.

[0005] It adopts the following technical solutions: A scattered core film-up positioning device, comprising a chassis frame, the top surface of the chassis frame is a support plane, and a positioning part for wafer ring positioning is arranged on the support plane; the two inner sides of the chassis frame are provided with a pair of horizontal and parallel guide grooves, the grooves of the two guide grooves are oppositely arranged inward, and a film-up platform capable of moving linearly along the guide grooves is connected in the two guide grooves; the film-up platform comprises a positioning plate and a group of rollers connected to the two sides of the positioning plate; the upper surface of the positioning plate is provided with positioning grid lines; and the rollers are located in the guide grooves and form rolling guide cooperation with the guide grooves.

[0006] Further, at least two positioning notches are arranged on the wafer ring, and the positioning part is a positioning needle, which can form positioning cooperation with the positioning notches.

[0007] Further, the bottom frame is a combination of a frame-shaped bottom plate, a frame-shaped lining plate and a frame-shaped cover plate connected in sequence from bottom to top by fasteners, the top surface of the frame-shaped cover plate is the support plane, the inner side edges of the frame-shaped lining plate are all larger than the inner side dimensions of the frame-shaped bottom plate and the frame-shaped cover plate, the upper groove wall of the guide groove is the lower surface of the frame-shaped cover plate, the lower groove wall is the upper surface of the frame-shaped bottom plate, and the groove bottom of the guide groove is the inner side vertical surface of the frame-shaped lining plate.

[0008] Further, the upper surface of the positioning plate is not higher than the support plane of the bottom frame.

[0009] Further, the roller is a bearing with a shaft.

[0010] Further, the line spacing of the positioning grid lines is equal.

[0011] The present application has the following beneficial effects compared with the prior art: The device has the advantages of simple overall structure, low cost, supporting and positioning the wafer ring by the bottom frame and the positioning part, referring to the positioning grid lines of the positioning film pouring platform, and realizing small-batch core scattering and accurate film pouring by simple manual operation, thereby ensuring the consistency of the position, angle and spacing of each core scattering and film pouring and meeting the subsequent system visual recognition requirements. BRIEF DESCRIPTION OF DRAWINGS

[0012] Fig. 1 is a structural schematic view of a core scattering and film pouring positioning device according to an embodiment of the present application; Fig. 2 is a cooperation structure schematic view of a roller and a guide groove according to an embodiment of the present application; Fig. 3 is a positioning grid line schematic view of a film pouring platform according to an embodiment of the present application; Fig. 4 is a schematic view of a wafer ring according to an embodiment of the present application.

[0013] Mark 100, bottom frame; 101, support plane; 102, guide groove; 103, positioning part; 110, frame-shaped bottom plate; 120, frame-shaped lining plate; 130, frame-shaped cover plate; 200, film pouring platform; 201, positioning plate; 202, roller; 203, positioning grid line; 300, wafer ring; 301, positioning notch. DETAILED DESCRIPTION

[0014] To make the present application clearer, the following further describes a core scattering and film pouring positioning device according to the present application with reference to the accompanying drawings, and the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0015] As Figs. 1 to 4As shown, a kind of loose-core inverted membrane positioning device includes a rectangular frame-shaped base frame 100, the top surface of base frame 100 is support plane 101, support plane 101 is used to support wafer ring 300 (wafer ring is the conventional tool in the art), support plane 101 and in length direction one side is equipped with a pair of positioning part 103 for wafer ring 300 positioning, preferably, the side of the wafer ring 300 is equipped with two positioning notches 301, for example V-shaped notch, the positioning part 103 is positioning needle, positioning needle is pin into fixed connection formed on support plane 101, positioning needle and positioning notch 301 are engaged to form positioning cooperation.

[0016] Two inner sides of base frame 100 have a pair of horizontally and parallelly arranged guide slots 102, two guide slots 102 are straight line, and two slot openings are inward and opposite. In two guide slots 102, there is commonly connected inverted membrane platform 200 that can reciprocate along guide slot straight line, and inverted membrane platform 200 includes positioning plate 201 and a group of rollers 202 connected with both sides of positioning plate 201, roller 202 is just small gap engaged in guide slot 102 and forms rolling guide cooperation with guide slot 102. Wherein, roller 202 is rolling bearing with shaft, they can be directly obtained from external adoption as standard parts, bearing outer ring is used as rolling surface matched with guide slot 102, and bearing inner hole passes through support shaft and is connected in corresponding mounting hole of both sides of positioning plate 201 by mechanical interference fit, of course, support shaft can also adopt other conventional fixing forms. Positioning grid line 203 is arranged on the upper surface of positioning plate 201, and the line spacing of positioning grid line 203 is equal.

[0017] In order to flexibly adjust the position of positioning plate 201 after positioning wafer ring 300, the upper surface of positioning plate 201 is not higher than the support plane 101 of base frame 100, for example, 0.2-0.8mm lower than it.

[0018] In some embodiments, in order to facilitate the installation of the rollers 202 in the guide groove 102, the chassis frame 100 is a detachable assembly, which includes a frame-shaped bottom plate 110, a frame-shaped lining plate 120 and a frame-shaped cover plate 130 connected in sequence from bottom to top by fastening screws. The frame-shaped bottom plate 110 is a rectangular frame plate, and a set of threaded holes for connection are arranged on the upper surface thereof. The frame-shaped lining plate 120 is also a rectangular frame plate, and has a thickness slightly larger than the diameter of the bearing. The inner side edge opening size of the frame-shaped lining plate 120 is larger than that of the frame-shaped bottom plate 110, and through holes corresponding to the threaded holes are arranged on the frame-shaped lining plate 120. The frame-shaped cover plate 130 has the same shape as the frame-shaped bottom plate 110, and through holes corresponding to the threaded holes are also arranged on the frame-shaped cover plate 130. The top surface of the frame-shaped cover plate 130 is the support plane 101 of the frame-shaped bottom plate 110. The rollers of the assembled film pouring platform 200 are placed on the frame-shaped bottom plate 110, and then the frame-shaped lining plate 120 and the frame-shaped cover plate 130 are stacked in sequence, and the frame-shaped bottom plate 110, the frame-shaped lining plate 120 and the frame-shaped cover plate 130 are fixedly connected into an integrated chassis frame 100 by screws. The two sides of the chassis frame 100 form the guide groove 102, the upper groove wall of the guide groove 102 is the lower surface of the frame-shaped cover plate 130, the lower groove wall is the upper surface of the frame-shaped bottom plate 110, and the groove bottom of the guide groove 102 is the inner vertical surface of the frame-shaped lining plate 120.

[0019] When using the device, it needs to be used with a blue film. First, place the device on a horizontal workbench, place the 8-inch wafer ring 300 with a blue film on the support plane 101 of the chassis frame 100, and clamp the positioning notch 301 on the wafer ring 300 at the positioning pin position to ensure that the wafer ring 300 does not shake greatly. Then, manually move the adjusting film pouring platform 200 to a suitable position below the wafer ring 300. Then, a piece of transfer blue film of appropriate size is adhered to the upper surface of the scattered core in the waffle box (the scattered cores are neatly placed in the waffle box), and then the blue film with the scattered core is transferred to the blue film on the wafer ring 300. At this time, the scattered core needs to be aligned and pasted through the blue film with reference to the positioning grid line 203 on the surface of the film pouring platform 200 to meet the subsequent system visual recognition requirements. Finally, the transfer blue film is removed. In this process, attention should be paid to the fact that the adhesion of the blue film on the wafer ring 300 should be greater than that of the transfer blue film, or appropriate adhesion pressing force should be used during the operation to prevent the transfer blue film from being difficult to remove and the chips from being stuck.

[0020] When the upper surface of the positioning plate 201 is slightly lower than the support plane 101 of the chassis frame 100, the position of the film pouring platform 200 can be more conveniently adjusted forward and backward when positioning the wafer ring 300, provided that the operation space allows. Of course, the film pouring platform 200 should have a certain movement damping, for example, a sliding bearing with a certain friction resistance can be selected as the roller to prevent slight touching during use of the device from affecting the reference position due to displacement of the film pouring platform 200.

[0021] This device has a simple overall structure and low cost. Through simple operation, it can accurately pour small batches of loose cores into molds, ensuring the consistency of position, angle and spacing of each core pour, and meeting the visual recognition requirements of the subsequent system.

[0022] The above embodiments of the present invention are merely examples for clearly illustrating the present invention and are not intended to limit the implementation of the present invention. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. However, obvious variations or modifications derived from the essential spirit of the present invention still fall within the protection scope of the present invention.

Claims

1. A core casting positioning device, comprising a base frame (100), characterized in that: The top surface of the base frame (100) is a support plane (101). The support plane (101) is provided with a positioning part (103) for positioning the wafer ring (300). The two inner sides of the base frame (100) have a pair of horizontal and parallel guide grooves (102). The openings of the two guide grooves (102) are arranged inward and opposite to each other. A casting platform (200) that can move back and forth along the guide groove is connected in the two guide grooves (102). The casting platform (200) includes a positioning plate (201) and a set of rollers (202) connected to both sides of the positioning plate (201). The upper surface of the positioning plate (201) is provided with positioning grid lines (203). The rollers (202) are located in the guide grooves (102) and form a rolling guide cooperation with the guide grooves (102).

2. The core-turning positioning device according to claim 1, characterized in that: The wafer ring (300) is provided with at least two positioning notches (301), and the positioning part (103) is a positioning pin. The positioning pin and the positioning notch (301) can be engaged to form a positioning fit.

3. The core-turning positioning device according to claim 1, characterized in that: The base frame (100) is an assembly, including a frame-shaped base plate (110), a frame-shaped liner plate (120), and a frame-shaped cover plate (130) connected sequentially from bottom to top by fasteners. The top surface of the frame-shaped cover plate (130) is the support plane (101). The inner edge dimensions of the frame-shaped liner plate (120) are all larger than the inner dimensions of the frame-shaped base plate (110) and the frame-shaped cover plate (130). The upper groove wall of the guide groove (102) is the lower surface of the frame-shaped cover plate (130), and the lower groove wall is the upper surface of the frame-shaped base plate (110). The bottom of the guide groove (102) is the inner vertical surface of the frame-shaped liner plate (120).

4. The core-turning positioning device according to claim 1, characterized in that: The upper surface of the positioning plate (201) is not higher than the support plane (101) of the base frame (100).

5. The core-turning positioning device according to claim 1, characterized in that: The roller (202) is a bearing with a shaft.

6. The core-turning positioning device according to claim 1, characterized in that: The spacing between the positioning grid lines (203) is equal.

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