Machining tool maintenance robot

Abstract

The invention relates to a machining tool maintenance robot. Apparatus and methods for processing tool maintenance in a semiconductor manufacturing plant are disclosed. In some embodiments, a robot includes a robot arm and a turntable that rotates relative to the robot arm. The turntable holds at least one batch bin of wafer cassettes storing semiconductor wafers, and the robotic arm includes an end effector operable to manipulate the batch bin. Thus, the robot handles wafer batch boxes to improve semiconductor manufacturer throughput by automating conventional manually performed unloading and loading processes. For example, the robot may transport a wafer batch box to a point of use, remove the wafer cassette from the batch box, load the wafer cassette into a tool at the point of use, remove the wafer cassette from the tool after processing, reload the wafer cassette into the batch box, and transport the wafer cassette to a next point of use.

Description

TECHNICAL FIELD

[0001] The disclosed technology relates generally to semiconductor processing, and more particularly, to a robot for maintaining processing tools of a semiconductor wafer fab. BACKGROUND

[0002] Robots are often multi-functional manipulators that are reprogrammable, typically designed to move by programmed motions to perform various tasks or functions. Robots can be physically anchored manipulators (e.g., industrial robotic arms) or mobile robots that navigate an environment automatically or semi-automatically (e.g., using legs, wheels, or traction-based mechanisms). Robots can utilize sensors to help accomplish tasks without colliding with obstacles and / or getting stuck or trapped.

[0003] Some robots have articulated arms that can perform various tasks through motorized joints of the arm. Such arms can have a device at the end of the arm called an end effector that can be moved around an environment by the operating arm. Examples of end effectors include grippers, such as jaws, claws, or mechanical fingers.

[0004] Robots are used in various industries, including, for example, manufacturing, warehousing logistics, transportation, hazardous environments, exploration, and healthcare. SUMMARY

[0005] Apparatuses and methods for processing tool maintenance in a semiconductor fab are disclosed. In certain embodiments, a robot includes a robotic arm and a turret that rotates relative to the robotic arm. The turret holds at least one batch box that stores wafer cassettes of semiconductor wafers, and the robotic arm includes an end effector operable to manipulate the batch box. Thus, the robot manipulates wafer batch boxes to improve semiconductor fab throughput by automating the unload and load processes that are conventionally performed manually. For example, the robot can transport a wafer batch box to a point of use, remove wafer cassettes from the batch box, load the wafer cassettes into a tool at the point of use, remove the wafer cassettes from the tool after processing, reload the wafer cassettes into the batch box, and transport the batch box to a next point of use. Thus, the robot enables one or more humans to be completely removed from processing tool maintenance in a semiconductor fab, such as a conventional semiconductor fab for 6 inch / 8 inch wafers.

[0006] In one aspect, a robot for processing tool maintenance in a semiconductor fab is disclosed. The robot includes a robotic arm and a turret configured to rotate relative to the robotic arm. The turret is configured to hold at least one batch box that stores wafer cassettes of semiconductor wafers, and the robotic arm includes an end effector configured to manipulate the at least one batch box.

[0007] In another aspect, a method for maintaining machining tools in a semiconductor manufacturing plant is disclosed. The method includes controlling the rotation of a robot's turntable relative to the robot's robotic arm, the turntable holding at least one batch box of wafer cassettes storing semiconductor wafers. The method further includes controlling the position of the robotic arm relative to the at least one batch box and manipulating the at least one batch box using the robot's end effector. Attached Figure Description

[0008] FIG. 1A This is a perspective view of a robot according to one embodiment.

[0009] FIG. 1B yes FIG. 1A A perspective view of a part of a robot, including a turntable and a robotic arm on a base.

[0010] FIG. 1C It's concentrated on the robot's box opener. FIG. 1A A perspective view of the robot.

[0011] FIG. 1D It is concentrated on the closed batch boxes on the turntable. FIG. 1A A perspective view of the robot.

[0012] FIG. 1E It is concentrated on the open batch boxes on the turntable. FIG. 1A A perspective view of the robot.

[0013] FIG. 1F yes FIG. 1A A top-down view of the robot.

[0014] FIG. 1G yes FIG. 1A A top view of the robot, omitting the robotic arm, with the turntable rotated to the first position.

[0015] FIG. 1H yes FIG. 1A A top view of the robot, omitting the robotic arm, with the turntable rotated to the second position.

[0016] FIG. 1I It's concentrated on the robot's box opener. FIG. 1A A side view of the robot.

[0017] FIG. 2A This is a side view of a robot detached from its base according to another embodiment.

[0018] FIG. 2B yes FIG. 2A A perspective view of the robot.

[0019] FIG. 2C yes FIG. 2AA perspective view of the robot, with its outer shell cover open.

[0020] FIG. 2D yes FIG. 2A A side view of the robot, with the outer shell cover removed.

[0021] FIG. 2E It is concentrated on the closed batch boxes on the robot's turntable. FIG. 2A A perspective view of the robot.

[0022] FIG. 2F It is concentrated on the open batch boxes on the robot's turntable. FIG. 2A A perspective view of the robot.

[0023] FIG. 2G It is attached to the mobile base. FIG. 2A A side view of the robot.

[0024] FIG. 3A This is a front perspective view of an end effector according to one embodiment.

[0025] FIG. 3B yes FIG. 3A Rear perspective view of the end effector.

[0026] FIG. 3C It is for handover with sealed batch boxes. FIG. 3A A side view of the end effector.

[0027] FIG. 3D yes FIG. 3A Side view of the end effector and open batch box.

[0028] FIG. 3E This is a perspective view of an example of a wafer cassette used in batch boxes. Detailed Implementation

[0029] The following detailed description of embodiments presents various descriptions of specific embodiments of the invention. However, the invention can be implemented in many different ways. In this description, reference is made to the accompanying drawings. It should be understood that the elements depicted in the drawings are not necessarily drawn to scale. Furthermore, it should be understood that some embodiments may include more elements than depicted in the drawings and / or a subset of the elements depicted in the drawings. Additionally, some embodiments may combine any suitable combination of features from two or more drawings.

[0030] Some traditional processing tools used in semiconductor wafer manufacturing are incompatible with modern automated material handling systems (AMHS) used in semiconductor processing. For example, some processing tools used to handle 6-inch (150 mm) and / or 8-inch (200 mm) silicon wafers are incompatible with AMHS.

[0031] The goal is to fully automate the maintenance of traditional machining tools and the manual handling of wafers. For example, automating maintenance in this way allows for the removal of personnel from the machining tool maintenance process, thereby eliminating human variability and / or high labor costs.

[0032] Apparatus and methods for maintaining machining tools in semiconductor manufacturing plants are disclosed. In some embodiments, a robot (such as an automated mobile robot (AMR)) includes a robotic arm and a turntable that rotates relative to the robotic arm. The turntable holds at least one batch box of wafer cassettes storing semiconductor wafers, and the robotic arm includes an end effector operable to manipulate the batch box.

[0033] Therefore, robots handle wafer batch boxes to improve semiconductor manufacturing plant throughput by automating the conventionally manually performed unloading and loading processes. For example, a robot can transport wafer batch boxes to a point of use, remove wafer casks from the batch box, load the wafer casks into a tool at the point of use, remove the wafer casks from the tool after processing, reload the wafer casks into the batch box, and transport the batch box to the next point of use.

[0034] Therefore, robots enable one or more people to be completely removed from tooling maintenance in semiconductor manufacturing plants (such as traditional semiconductor manufacturing plants for 6-inch / 8-inch wafers).

[0035] In some implementations, the robotic arm operates in conjunction with an end effector that operates without actuation. For example, the end effector can be completely passive or stationary. This, in turn, reduces cost, particle generation, points of failure, and / or programming complexity. Such an end effector can be implemented to manipulate both batch bins and wafer casks stored within them.

[0036] For example, a passive end effector can be used to move a batch box, unlock / lock a batch box, remove a wafer cassette from a batch box, load a wafer cassette into a processing tool, remove a wafer cassette from a processing tool, insert a wafer cassette into a batch box, and / or otherwise interact with the batch box and wafer cassette.

[0037] In some implementations, the robotic arm is a 6-axis articulated robotic arm operating on six free axes, while a turntable provides a seventh free axis. While the 6-axis articulated robotic arm itself offers highly controllable movement, the turntable eliminates several additional movements of the robotic arm without increasing the robot's overall footprint. In contrast, conventional robots require additional movement steps, which can impact throughput, cost, and / or ease of integration into semiconductor manufacturing plants.

[0038] Therefore, the turntable provides additional axes of motion to reduce the total movement of the robotic arm. Furthermore, the turntable allows the robotic arm to interact with multiple batch boxes, enabling the same robot to simultaneously transport and maintain multiple batches of wafers. For example, two or more batch boxes can be stored on the turntable, and the turntable can rotate a specific batch box to the desired position for interaction with the robotic arm.

[0039] In some implementations, the base for the robotic arm passes through the center of the turntable, thereby positioning the robotic arm above and around the turntable in a configuration similar to that of an excavator. Therefore, the turntable can rotate relative to the robotic arm and the base to place the batch box in the desired position.

[0040] The robot may further include a box opener, such as a box-opening suction arm, for opening batch boxes. For example, the box opener may be securely attached to a base or other desired location on the robot, and a turntable may rotate a specific batch box to align it with the box opener. Once the batch box is unlocked by the robotic arm and opened by the box opener, the robotic arm can interact with the wafer cassette stored therein.

[0041] In some implementations, the robotic arm and turntable are part of the application layer of a fully customizable robot. For example, the application layer can add additional motion axes, robotic arms, sensors, and / or other automated or semi-automated functions. Furthermore, the application layer can be compatible with various implementations of the robotic arm, sensors, or other components, thus providing modularity and flexibility.

[0042] Application layers, for example, can be mounted on the robot's housing, which in turn can be attached to any desired base. For ease of widespread deployment, the application layer can be implemented completely independently of the housing and / or base. In one example, the robot includes a mobile base, such as a modular all-wheeled base providing both stability and mobility. In another example, the robot is mounted on a workbench for stationary tool maintenance. Therefore, the robot can be highly modular.

[0043] FIGS. 1A-1I Various views of a robot 50 according to one embodiment are depicted. The robot 50 includes a robotic arm 1, a robotic arm base 2, a turntable 3, a housing 4, and a movable base 5. An end effector 11 is attached to the end of the robotic arm 1. Additionally, a box opener (in this example, corresponding to a box-opening suction arm 15) is attached to the robotic arm base 2.

[0044] In the illustrated embodiment, the housing 4 is positioned above the mobile base 5, and the application layer of the components is positioned above the housing 4. Therefore, the robot 50 typically comprises three layers of components: (i) the mobile base 5 for navigating the robot 50 around its surroundings; (ii) the housing 4 for housing various electrical and mechanical components used to control the operation of the robot 50; and (iii) the application layer for interacting with the batch bin 41, wafer cassettes stored in the batch bin 41, processing tools, and / or other objects in the surrounding environment.

[0045] In this embodiment, the application layer includes a robotic arm 1, a robotic arm base 2, a turntable 3, and an unpacking suction arm 15. However, the application layer of the robot 50 can be adapted to the specific functions or function sets that the robot 50 is implemented to perform. For example, the application layer is fully customizable to add additional motion axes, sensors, and / or other desired functions.

[0046] FIGS. 1A-1I The mobile base 5 includes wheels 38 for moving the robot 50 around its environment. However, the robot 50 can be implemented using other motion-based structures, such as pedals, legs, and / or other structures. Furthermore, the teachings of this document apply to robots that are physically constrained in one or more dimensions, such as robots mounted in a suitable location or configured to operate along tracks or rails. Therefore, the robot can be implemented according to the needs of a specific application.

[0047] Continue to refer to FIGS. 1A-1I In this example, robot 50 is mobile and thus acts as an automated mobile robot (AMR). Therefore, robot 50 is able to navigate around the semiconductor manufacturing plant to maintain the processing tools used to process semiconductor wafers stored in wafer cassettes in batch bin 41.

[0048] For example, a robot can transport batch bin 41 to the point of use, remove the wafer cassette from batch bin 41, and load the wafer cassette into a tool at the point of use. This tool can, for example, correspond to any semiconductor processing equipment used for sequential or parallel processing of one or more wafer cassettes. Examples of tools include, but are not limited to, lithography machines, wafer thinning equipment, deposition chambers, diffusion furnaces, etchers, and / or testing equipment. After processing by the tool, robot 50 can remove the wafer cassette from the tool and reload it into batch bin 41 for transport to the next point of use.

[0049] In the illustrated embodiment, robot 50 includes a robotic arm 1 that functions as a mechanical manipulator. An end effector 11 is attached to the end of the robotic arm 1 (e.g., to a tool flange), and the robotic arm 1 is configured to move with multiple degrees of freedom, thereby allowing the end effector 11 to interact with objects in the environment. The robotic arm 1 can be implemented using various components coupled via couplings to allow the robotic arm 1 to pivot about the couplings. In the illustrated example, the robotic arm 1 is a 6-axis articulated robotic arm.

[0050] In this embodiment, the end effector 11 is completely passive. Therefore, the end effector 11 is entirely passive or stationary, and does not include an actuated gripper or suction mechanism. By implementing the end effector 11 as completely passive, particle generation is reduced, thereby reducing semiconductor wafer contamination and improving casting yield. Furthermore, including a passive end effector can reduce costs, decrease the number of points of failure, and / or reduce programming complexity.

[0051] Continue to refer to FIGS. 1A-1I The robotic arm 1 is attached to the robotic arm base 2. In some embodiments, the robotic arm 1 is fitted into a recess in the robotic arm base 2 and secured in any suitable manner (such as using locking pins or bolts 16). However, other embodiments are possible.

[0052] In the illustrated embodiment, the robotic arm base 2 passes through an opening 17 at the center of the turntable 3. In this example, the robotic arm base 2 is securely attached to the housing 4. In addition to structurally supporting the robotic arm 1, the robotic arm base 2 can also be used for other functions, such as carrying cables (e.g., for power and / or data) between the housing 4 and the robotic arm 1.

[0053] Turntable 3 rotates relative to other fixed components (such as the robotic arm base 2 and housing 4). Therefore, turntable 3 provides additional axes of freedom to help robotic arm 1 interact with objects with fewer movements or maneuvers. Furthermore, turntable 3 increases the number of axes for movement without increasing the robot's overall footprint. For example, when used in conjunction with a 6-axis articulated robotic arm 1, turntable 3 provides a seventh axis of freedom. The turntable is also referred to herein as a rotary rack or batch rotary rack.

[0054] Continue to refer to FIGS. 1A-1IThe turntable 3 is implemented with various batch box holders 18 for securing the batch boxes 41. In this example, the turntable 3 includes four batch box holders 18 that are radially symmetrical with respect to the center of the turntable 3. The robotic arm 1 uses an end effector 11 to insert or remove each batch box 41 into or from its corresponding batch box holder 18. The batch box holders 18 help to hold the batch boxes 41 securely as the robot 50 navigates around the environment and / or as the turntable 3 rotates. In this example, each of the batch box holders 18 includes four corner segments for securing the bottom of each batch box 41 at each of the four corners. However, other implementations are possible.

[0055] Each of the batch boxes 41 can hold a wafer cassette for transporting wafers. The batch boxes 41 can be locked or unlocked by manipulating the end effector 11 with the robotic arm 1. Locking the batch boxes 41 helps secure the wafer cassette during transport, while the batch boxes 41 can be unlocked to allow a particular batch box to be opened, so that the wafer cassette can be inserted, removed, or otherwise interacted with.

[0056] In the illustrated embodiment, the unpacking suction arm 15 is attached to the robotic arm base 2. The unpacking suction arm 15 includes a suction mechanism 19 for applying a suction force to the lid of the batch box. This suction force allows the batch box 41 to be opened by actuation of the suction arm 15. Therefore, the turntable 3 can be used to rotate a specific batch box within the batch box 41 to align it with the suction mechanism 19, which applies a suction force to the lid of the batch box. Thereafter, the suction arm 15 is actuated, and the box is opened.

[0057] For example, FIG. 1D The image depicts batch box 41 after the opening suction arm 15 is radially aligned with batch box 41 on turntable 3. FIG. 1D In this process, the end effector 11 has been used to unlock the batch box 41, and the suction mechanism 19 has engaged with the lid of the batch box. Subsequently, as... FIG. 1E As shown, the suction mechanism 19 can apply suction force, and the suction arm 15 is actuated to open the batch box 41.

[0058] Once opened, robotic arm 1 can be used to insert or remove wafer cassettes from the opened batch bin, or otherwise interact with the wafers stored in batch bin 41.

[0059] therefore, FIGS. 1A-1IThe robot 50 is adapted to navigate around a semiconductor manufacturing plant to maintain various processing tools as needed. The robot 50 can be used to load wafer cassettes into or outside the processing tools. These wafer cassettes are stored in batch bins 41, which can be inserted into or removed from corresponding holders 18 on the robot 50's turntable 3. Therefore, the robot 50 can be used to fully automate the maintenance of processing tools, eliminating the need for traditionally manually driven processes and allowing for the removal of personnel from the processing tool maintenance workflow.

[0060] The housing 4 houses various mechanical and electrical components 21 used to control the robot 50. Examples of components 21 include motors, pumps, and / or gearboxes for controlling various components of the robot 4. For example, components 21 can be used to controllably rotate the turntable 3, selectively activate the suction mechanism 19, and / or activate the unpacking suction arm 15 as needed. Examples of components 21 further include power supplies, batteries / chargers, sensors, and / or circuit boards, including electronic circuitry systems for processing data (e.g., sensor data) and controlling the robot 50.

[0061] Examples of sensors include vision / image sensors (e.g., cameras, time-of-flight sensors, scanning light detection and ranging (LiDAR) sensors and / or scanning laser detection and ranging (LADAR) sensors), inertial sensors (e.g., inertial measurement units or IMUs), force sensors, and / or kinematic sensors. Such sensors may be integrated into the housing 4 or positioned on the robot 50 as needed, and communicate with the electronic circuitry using wired, wireless, optical, and / or other communication links. In some embodiments, precision sensors are used to control the rotation of the turntable 3 with precise angular phase, velocity, and / or acceleration.

[0062] Furthermore, the mechanical and electrical components 21 can be implemented using a computing system for processing sensor data to control various operations of the robot 50. For example, the computing system may include memory hardware that operates in conjunction with data processing hardware to perform various functions (such as processing sensor data, controlling the robotic arm 1, rotating the turntable 3, controlling the mobile base 5) to navigate the robot 50 around the semiconductor manufacturing plant, and / or perform any other required functions of the robot 50.

[0063] This type of memory hardware stores instructions that, when executed by data, cause the data processing hardware to perform various operations. These instructions (also known as computer programs, software, software applications, or code) can be implemented using high-level programs and / or object-oriented programming languages, and / or assembly / machine languages.

[0064] Data processing hardware may include one or more central processing units (CPUs), configurable computing units (e.g., field-programmable gate arrays or FPGAs), digital signal processors (DSPs), neural processing units (NPUs), application-specific integrated circuits (ASICs), and / or any other hardware processing components. Memory hardware stores information non-transitorily within the computing system. Memory hardware may include computer-readable media, volatile memory cells, and / or non-volatile memory cells. Memory hardware may include physical means for temporarily or permanently storing programs (e.g., instruction sequences) or data (e.g., program state information) for use by the computing system. Examples of non-volatile memory include, but are not limited to, flash memory and read-only memory (ROM) / programmable read-only memory (PROM) / erasable programmable read-only memory (EPROM) / electrically erasable programmable read-only memory (EEPROM) (e.g., commonly used for firmware, such as bootloaders). Examples of volatile memory include, but are not limited to, random access memory (RAM), dynamic random access memory (DRAM), static random access memory (SRAM), phase-change memory (PCM), and magnetic disks or magnetic tapes.

[0065] FIGS. 2A-2G Various views of a robot 100 according to one embodiment are depicted. The robot 100 includes a robotic arm 51, a robotic arm base 52, a turntable 53 (including a batch box holder 58), a housing 54, and a movable base 5. An end effector 61 is attached to the end of the robotic arm 51. Additionally, an unpacking suction arm 15 is attached to the robotic arm base 52.

[0066] FIGS. 2A-2G Robot 100 is similar to FIGS. 1A-1I Robot 50, except that robot 100 is implemented using variations of components of robot 50. The robots disclosed herein are highly modular and / or configurable, and therefore can be implemented as needed with different application layers, bases, and / or housings. Relative to FIGS. 1A-1I Robot 50, FIGS. 2A-2G The robot 100 further includes additional sensors and components.

[0067] For example, robot 100 includes a wireless charger 59 attached to a cover 58 of housing 54. Additionally, it includes a three-dimensional (3D) time-of-flight sensor 57 for advanced obstacle avoidance. Furthermore, it includes one or more lidar safety scanners 56 to help prevent accidental collisions between robot 100 and other objects or people.

[0068] Robot 100 also includes an end effector 61, which will now be referred to FIGS. 3A-3D This end effector will be discussed in detail.

[0069] FIG. 3AThis is the front perspective view of the end effector 61. FIG. 3B yes FIG. 3A Rear perspective view of the end effector 61. FIG. 3C It is for handover with sealed batch boxes. FIG. 3A Side view of the end effector 61. FIG. 3D yes FIG. 3A Side view of the end effector 61 and the open batch box.

[0070] refer to FIGS. 3A-3D The end effector 61 includes a base 71, an offset link 77, a connector 78, a first arm 72a / 73a / 74a, a second arm 72b / 73b / 74b, a cartridge joint 79, an upper unlocking finger 75, and a lower unlocking finger 76.

[0071] In the illustrated embodiment, connector 78 is used to connect to the end effector of a robotic arm, such as the tool flange of a 6-axis articulated robotic arm. Connector 78 is biased from the base 71 of end effector 61 via bias link 77. Including bias link 77 helps provide additional clearance and maneuverability to facilitate interaction between end effector 61 and batch box 41. For example, bias link 77 provides sufficient passage for operation within a compact work package.

[0072] like FIGS. 3A-3D As shown, the end effector 61 includes two arms for providing secure batch box retention and / or for use with a wafer cassette (e.g., FIG. 3E The wafer cassette 210 is connected to the cassette interface. Each arm includes a first extension 72a / 72b extending away from the base 71, an angled portion 73a / 73b for lifting the arm relative to the base 71, and a second extension 74a / 74b extending away from the angled portion. This arm configuration facilitates the manipulation of batch boxes and / or wafer cassettes.

[0073] In the illustrated embodiment, unlocking fingers 75 / 76 are included for unlocking the batch box (e.g., releasing one or more batch box latches).

[0074] exist FIG. 3C and FIG. 3D In the figures, end effector 61 is depicted manipulating batch box 41, which includes a base 42, a cover 43, and one or more batch box latches 83. End effector 61 can unlock or pick up batch box 41. Thereafter, batch box 41 can be opened (e.g., via a robot's box opener), after which end effector 61 can interact with the wafer cassette stored inside. For clarity of the figures, FIGS. 3A-3D The wafer cassette is not shown. The end effector 61 can also be used to load the wafer cassette back into the batch box 41, which can then be closed (and in some embodiments, locked) for transport.

[0075] FIG. 3E This is a perspective view of an example of a wafer cassette 210 used for batch box 41. (See image.) FIG. 3E As shown, wafer cassette 210 holds semiconductor wafers 211, such as 6-inch or 8-inch wafers. Wafer cassettes are also referred to herein as work-in-process (WIP). Although only one example of a wafer cassette is shown, the batch box described herein can store various types of wafer cassettes.

[0076] in conclusion

[0077] The preceding description may refer to elements or features as “connected” or “coupled” together. As used herein, unless explicitly stated otherwise, “connected” means that one element / feature is directly or indirectly connected to another element / feature, and not necessarily mechanically connected. Similarly, unless explicitly stated otherwise, “coupled” means that one element / feature is directly or indirectly coupled to another element / feature, and not necessarily mechanically coupled. Therefore, although the various schematic diagrams shown in the figures depict example arrangements of elements and assemblies, additional intermediate elements, devices, features, or assemblies may be present in actual embodiments (assuming that the function of the depicted circuit is not adversely affected).

[0078] Although certain embodiments have been described, these embodiments are presented by way of example only and are not intended to limit the scope of this disclosure. In fact, the novel devices, methods, and systems described herein can be implemented in various other forms; furthermore, various omissions, substitutions, and changes can be made to the form of the methods and systems described herein without departing from the spirit of this disclosure. For example, although the disclosed embodiments are presented with a given arrangement, alternative embodiments may perform similar functions with different components and / or circuit topologies, and some elements may be deleted, moved, added, subdivided, combined, and / or modified. Each of these elements can be implemented in various different ways. Any suitable combination of elements and actions of the various embodiments described above can be combined to provide further embodiments. Therefore, the scope of the invention is defined only by the appended claims.

[0079] Although the claims presented herein are filed with the USPTO in a single dependent form, it should be understood that any claim may depend on any prior claim of the same type unless it is clearly not technically feasible.

Claims

1. A robot for maintaining machining tools in a semiconductor manufacturing plant, the robot comprising: robotic arm; as well as A turntable configured to rotate relative to the robotic arm, wherein the turntable is configured to hold at least one batch box of wafer cassettes storing semiconductor wafers. The robotic arm includes an end effector configured to manipulate the at least one batch box.

2. The robot of claim 1, wherein the robotic arm is a 6-axis articulated robotic arm with 6 free axes, and the turntable is operable to rotate to provide a 7th free axis.

3. The robot of claim 1, wherein the end effector is completely passive.

4. The robot of claim 3, wherein the end effector comprises a pair of arms configured to hand over to the at least one batch box.

5. The robot of claim 4, wherein the pair of arms includes one or more non-latch fingers configured to unlock the at least one batch box.

6. The robot of claim 4, wherein the pair of arms are connected via a base, and wherein the end effector further comprises one or more joints attached to the base and operable to engage with the wafer cassette.

7. The robot of claim 4, wherein the pair of arms are connected by a base, and wherein the end effector further includes an offset link connecting the base to the end of the robotic arm.

8. The robot of claim 1, wherein the robotic arm is attached to a base that lifts the robotic arm onto the turntable.

9. The robot of claim 8, wherein the base passes through the center of the turntable, such that the robotic arm is centered on the turntable.

10. The robot of claim 1, further comprising a box opener configured to open the lid of the at least one batch box.

11. The robot of claim 10, wherein the box opener includes a suction mechanism configured to apply a suction force to the lid and an arm configured to actuate to open the lid.

12. The robot of claim 1, further comprising a housing supporting the turntable and including one or more components configured to control rotation of the turntable and multiple movements of the robotic arm.

13. The robot of claim 1, further comprising a mobile base operable to navigate the robot to a point of use associated with at least one semiconductor processing tool.

14. The robot of claim 1, further comprising at least one of a time-of-flight sensor or a lidar sensor, configured to detect one or more obstacles in the robot's environment.

15. The robot of claim 1, further comprising a plurality of batch box holders arranged on the turntable, each batch box holder configured to hold a particular batch box.

16. A method for maintaining machining tools in a semiconductor manufacturing plant, the method comprising: The rotation of a robot's turntable relative to the robot's robotic arm is controlled, and the turntable holds at least one batch box of wafer cassettes storing semiconductor wafers. Control the position of the robotic arm relative to the at least one batch box; as well as The robot's end effector is used to manipulate the at least one batch box.

17. The method of claim 16, wherein the end effector is completely passive, the method further comprising using a pair of arms of the end effector to hand over the end effector to the at least one batch box.

18. The method of claim 17, further comprising unlocking the at least one batch box using one or more latching fingers of the pair of arms.

19. The method of claim 17, further comprising manipulating the wafer cassette using the end effector.

20. The method of claim 16, further comprising using the robot's box opener to open the lid of the at least one batch box.

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