Chip ejection switching device
By designing a chip ejection switching device, and utilizing the Z-axis lifting mechanism and motor to coordinate the control of the ejector pin mounting base and platform, automatic and rapid replacement and accurate positioning of the ejector pins are achieved. This solves the problems of long equipment downtime and high production costs, improves production efficiency, and reduces chip damage rate.
Patent Information
- Application Number
- CN202511268946.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-06
- Publication Date
- 2025-12-12
AI Technical Summary
Existing chip packaging equipment requires manual replacement of the ejector pins and adjustment of parameters when changing to different types of chips, resulting in long downtime, low production efficiency and increased costs.
Design a chip ejection switching device that uses a Z-axis lifting mechanism, a rotary motor, and a lifting cylinder to control the ejector pin mounting base and ejector pin stage, thereby achieving automatic and rapid replacement and accurate positioning of the ejector pins and avoiding manual adjustment.
Significantly reduces equipment downtime, improves production efficiency, lowers production costs, and prevents chip damage during debugging.
Smart Images

Figure CN121123109A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of chip packaging equipment, and in particular to a chip ejection switching device. Background Technology
[0002] Chip packaging is a crucial step in the back-end processing of the semiconductor industry. Its main purpose is to protect the chip from physical and chemical damage from the external environment, while providing electrical connections, mechanical support, and heat dissipation functions to ensure the stability and reliability of the chip. Packaging involves encasing the chip in protective materials to isolate it from contact with the outside world and prevent damage to the chip from moisture, dust, chemical corrosion, and mechanical impact.
[0003] In the chip packaging process, the chip-to-substrate mounting is particularly critical. The specific chip mounting process is as follows: the pick-up mechanism picks up the wafer from the wafer cassette, corrects the wafer orientation, and then transfers it to the wafer stage; the wafer stage fixes the wafer by vacuum adsorption, completes micron-level positioning with the help of an optical system, and removes impurities from the wafer surface as needed by the linkage cleaning components; then the wafer moves on the wafer stage to the chip pick-up and placement station, where the target chip is lifted by the ejector pins below the chip pick-up and placement station, separating the target chip from the wafer body; then the chip is picked up by the negative pressure of the nozzle on the bonding head, while the substrate is transported to the mounting station by the conveyor mechanism, and the chip is mounted on the substrate after being glued.
[0004] Regarding the aforementioned technologies, due to the differences in size, thickness, material, and surface morphology among different types of chips—for example, microchips need to avoid localized breakage under stress, power chips need to avoid the back heat sink, and irregularly shaped chips need to be matched to prevent center of gravity shift—when the equipment switches to mount different types of chips, it is necessary to stop the machine and manually replace the ejector pins that are compatible with that type of chip, and readjust the parameters. Each replacement and adjustment is time-consuming, resulting in long equipment downtime and reduced production efficiency. Furthermore, the replacement and adjustment of ejector pins rely too heavily on manual experience, requiring continuous verification of the ejector pin's installation position to ensure that the ejector pin can accurately lift the chip without damaging it. On the one hand, during the adjustment process, the chip used for adjustment may be damaged and scrapped, leading to increased production costs. On the other hand, the adjustment also prolongs the equipment downtime and reduces production efficiency. Summary of the Invention
[0005] This application proposes a chip ejection switching device. When it is necessary to replace the ejector pin with one that is compatible with the chip being produced, this device can automatically and quickly replace the ejector pin. After the ejector pin is replaced, the equipment can start production directly without adjusting parameters, which shortens the equipment downtime and avoids chip damage during parameter adjustment, thus reducing production costs.
[0006] This application provides a chip ejection switching device, which adopts the following technical solution: A chip ejection switching device, comprising: Base; At least two ejector pins, each ejector pin comprising a syringe barrel and an ejector core, the ejector core being slidably engaged with the syringe barrel; The ejector pin holder has at least two ejector pin platforms, which are used to hold ejector pins. The movable bracket is movably mounted on the base and is fixedly mounted with a pin mounting seat for engaging the syringe. A rotary motor, mounted on a base, is used to drive different ejector pin carriers to rotate above the ejector pin mounting base; The lifting cylinder, mounted on the base, is used to drive the ejector pin bracket to rise and fall, so that the ejector pin sits on the ejector pin mounting seat or is lifted off the ejector pin mounting seat. The clamping and ejection mechanism is located at the position of the ejector pin mounting seat on the movable bracket. It is used to clamp the ejector pin core and drive the core core to rise and fall. The Z-axis lifting mechanism, located on the base, is used to drive the movable support to lift and lower, so that the ejector pin can detach from the ejector pin platform or fall back onto the ejector pin platform.
[0007] By adopting the above technical solution, when the type of chip being produced changes and the corresponding ejector pin needs to be replaced, the Z-axis lifting mechanism controls the movable bracket to descend, causing the ejector pin mounting seat to descend. The clamping and ejection mechanism releases the ejector core. When the height of the ejector pin mounting seat drops to the same height as the ejector pin stage, the bottom of the ejector pin abuts against the ejector pin mounting seat, and the bottom edge of the ejector pin engages with the ejector pin stage. Subsequently, the lifting cylinder drives the ejector pin bracket to rise, and the rise of the ejector pin bracket drives the ejector pin stage to rise. At this time, the ejector pin on the ejector pin mounting seat disengages from the ejector pin mounting seat, and the ejector pin stage drives the ejector pin to rise above the ejector pin mounting seat. Subsequently, the rotating motor drives the ejector pin bracket to rotate, causing the ejector pin platform to rotate. Another ejector pin platform rotates to above the ejector pin mounting seat. The lifting component drives the ejector pin bracket to descend, causing the ejector pin platform to descend, which in turn causes the ejector pin to descend. When the height of the ejector pin platform is the same as that of the ejector pin mounting seat, the bottom of the ejector pin abuts against the ejector pin mounting seat, and the bottom edge of the ejector pin engages with the ejector pin platform, clamping the ejector core with the clamping mechanism. Then, the Z-axis lifting mechanism controls the movable bracket to rise, causing the ejector pin mounting seat to rise. At this time, the ejector pin on the ejector pin platform disengages from the ejector pin platform. The Z-axis lifting mechanism continues to control the movable bracket to rise until the ejector pin mounting seat rises below the chip pick-and-place station. The clamping and ejecting mechanism drives the ejector core to periodically rise and fall, realizing the function of periodically ejecting the chip from the ejector core.
[0008] In summary, the ejector pins suitable for different chip types can be quickly switched without disassembling the equipment, significantly reducing downtime. At the same time, the coordinated control of the ejector pin mounting base and ejector pin stage by the Z-axis lifting mechanism, rotary motor and lifting motor accurately positions the ejector pin core without manual adjustment, further reducing downtime. Moreover, since no adjustment process is required, the chip will not be damaged by adjustment, reducing production costs.
[0009] Preferably, the ejector pin further includes a base, the syringe is fixed to the base, the ejector pin platform is provided with an installation groove, the outer ring of the base is used to engage with the installation groove, the inner ring of the base is used to abut against the top surface of the ejector pin mounting seat, and the bottom of the ejector core is disposed through the base and the ejector pin platform.
[0010] By adopting the above technical solution, when the height of the ejector plate is the same as that of the ejector mounting base, the outer ring of the ejector base engages with the mounting groove, and the inner ring of the ejector base abuts against the top surface of the ejector mounting base; when the Z-axis lifting mechanism controls the movable bracket to rise, causing the ejector mounting base to rise, the ejector base no longer engages with the mounting groove of the ejector plate, and the ejector detaches from the ejector plate; when the lifting cylinder drives the ejector bracket to rise, and the rise of the ejector bracket drives the ejector plate to rise, the clamping ejector mechanism releases the ejector core, the ejector base no longer abuts against the surface of the ejector mounting base, and the ejector detaches from the ejector mounting base.
[0011] Preferably, the ejector plate has a vacuum hole for detecting whether an ejector pin is installed. The vacuum hole is located on the wall of the mounting groove. When the ejector pin is installed on the ejector plate, the base blocks the vacuum hole.
[0012] By adopting the above technical solution, when the lifting cylinder drives the ejector pin bracket to rise, and the rise of the ejector pin bracket drives the ejector pin stage to rise, so that the ejector pin is separated from the ejector pin mounting seat, if the ejector pin does not separate from the ejector pin mounting seat but separates from the ejector pin stage due to an accident, and the base does not block the vacuum hole, the vacuum system will generate a negative pressure abnormal signal, and the equipment can automatically stop or alarm, so as to avoid the ejector pin occupying the ejector pin mounting seat and making it impossible to replace the chip.
[0013] Preferably, the ejector pin mounting base has an installation hole, the syringe passes through the installation hole and engages with the installation hole, and when the ejector pin is mounted on the ejector pin mounting base, the bottom of the ejector core passes through the installation hole and is clamped and fixed by the clamping ejection mechanism.
[0014] By adopting the above technical solution, when the ejector pin is installed in the ejector pin mounting seat, the ejector pin cylinder passes through the mounting hole and is engaged with the mounting hole, and the bottom of the ejector core passes through the mounting hole and is clamped and fixed by the clamping ejection mechanism. The mounting hole plays a positioning role in the installation of the ejector pin and restricts the horizontal movement of the ejector pin.
[0015] Preferably, the clamping and ejecting mechanism includes a gripper cylinder and a lifting assembly. The lifting assembly is mounted on a movable support, and the cylinder body of the gripper cylinder is slidably mounted on the movable support. The lifting assembly is connected to the gripper cylinder and drives the gripper cylinder to rise and fall. A locking block is fixedly provided at the bottom of the ejector core. The locking block is located below the ejector pin mounting seat, and the gripper of the gripper cylinder engages with the locking block.
[0016] By adopting the above technical solution, when the lifting cylinder drives the ejector pin bracket to descend until the height of the ejector pin platform is the same as that of the ejector pin mounting base, the gripper of the gripper cylinder clamps the locking block at the end of the ejector core; when the Z-axis lifting mechanism drives the ejector pin mounting base to rise below the chip pick-and-place station, the lifting component drives the gripper cylinder to periodically rise and fall, and the periodic rise and fall of the gripper cylinder drives the ejector core to periodically rise and fall, thus realizing the function of periodically ejecting the chip from the ejector core.
[0017] Preferably, the lifting assembly includes a lifting motor and a first linear module mounted on a movable bracket. The rotation shaft of the lifting motor is connected to the input end of the first linear module, and the output end of the first linear module is connected to a gripper cylinder to drive the gripper cylinder to lift and lower.
[0018] By adopting the above technical solution, after the ejector pin mounting base rises below the chip pick-and-place station, the output shaft of the lifting motor rotates, inputting power to the first linear module. The output end of the first linear module drives the gripper cylinder to rise and fall, and the rise and fall of the gripper cylinder drives the ejector core to rise and fall, so that the ejector core can periodically lift the chip.
[0019] Preferably, an elastic element is sleeved on one end of the top core located below the ejector pin mounting seat, one end of the elastic element abuts against the locking block, and the other end of the elastic element abuts against the end of the syringe.
[0020] By adopting the above technical solution, when the device is shut down and the power is cut off, the gripper cylinder does not work. At this time, the elastic element provides a restoring force to the clamping block, so that the top core can maintain its initial state for easy use next time.
[0021] Preferably, it also includes a frame, which is fixed on the base. The Z-axis lifting mechanism includes a drive motor and a second linear module mounted on the frame. The rotation shaft of the drive motor is connected to the input end of the second linear module, and the output end of the second linear module is connected to the movable support to drive the movable support to lift.
[0022] By adopting the above technical solution, the drive motor inputs power to the second linear module, the second linear module drives the movable bracket to rise and fall, and the rise and fall of the movable bracket drives the ejector pin mounting seat to rise and fall.
[0023] Preferably, a transmission belt is wound around the end of the output shaft of the drive motor and the end of the lead screw of the second linear module, and the rotation of the output shaft of the drive motor drives the lead screw of the second linear module to rotate through the transmission belt.
[0024] By adopting the above technical solution, the transmission belt drive can achieve parallel and non-coaxial installation of the motor and the second linear module. For example, the motor can be installed on the side of the frame, which optimizes the overall layout of the device and reduces the space occupied by the device.
[0025] In summary, this application includes at least one of the following beneficial technical effects: 1. When the type of chip being produced changes and a corresponding ejector pin needs to be replaced, the Z-axis lifting mechanism controls the movable support to descend, causing the ejector pin mounting seat to descend. When the height of the ejector pin mounting seat drops to the same height as the ejector pin stage, the clamping ejector mechanism releases the ejector core. At this point, the bottom of the ejector pin abuts against the ejector pin mounting seat, and the bottom edge of the ejector pin engages with the ejector pin stage. Subsequently, the lifting cylinder drives the ejector pin support to rise, which in turn drives the ejector pin stage to rise. The ejector pin stage then carries the ejector pin above the ejector pin mounting seat, where the ejector pin disengages from the mounting seat. Then, the rotation motor drives the ejector pin support to rotate, causing the ejector pin stage to rotate as well. The ejector pin stage, with the ejector pin to be replaced, rotates to above the ejector pin mounting seat. The lifting mechanism then drives the ejector pin support to descend, causing the ejector pin stage to descend, which in turn lowers the ejector pin. When the height of the ejector pin stage drops to the same height as the ejector pin mounting seat... When the platforms are aligned, the bottom of the ejector pin abuts against the ejector pin mounting seat, and the bottom edge of the ejector pin engages with the ejector pin platform, clamping the ejector core. Subsequently, the Z-axis lifting mechanism controls the movable bracket to rise, causing the ejector pin mounting seat to rise. The ejector pin mounting seat, carrying the ejector pin, rises to the working position, and the ejector pin on the ejector pin platform disengages from the platform. The clamping and ejecting mechanism drives the ejector core to periodically rise and fall, realizing the function of periodically ejecting the chip from the ejector core. In summary, ejector pins suitable for different chip types can be quickly switched without disassembling the equipment, significantly reducing downtime. At the same time, through the coordinated control of the Z-axis lifting mechanism, the rotary motor, and the lifting motor on the ejector pin mounting seat and the ejector pin platform, the position of the ejector pin and ejector core is accurately positioned without manual adjustment, further reducing downtime. Moreover, since no adjustment process is required, the chip will not be damaged during adjustment, reducing production costs. 2. When the height of the ejector plate is the same as that of the ejector mounting base, the outer ring of the ejector base engages with the mounting groove, and the inner ring of the ejector base abuts against the top surface of the ejector mounting base; when the Z-axis lifting mechanism controls the movable bracket to rise, causing the ejector mounting base to rise, the ejector base no longer engages with the mounting groove of the ejector plate, and the ejector disengages from the ejector plate; when the lifting cylinder drives the ejector bracket to rise, and the rise of the ejector bracket drives the ejector plate to rise, the clamping ejector mechanism releases the ejector core, the ejector base no longer abuts against the surface of the ejector mounting base, and the ejector disengages from the ejector mounting base. 3. The lifting cylinder drives the ejector pin bracket to rise, and the rise of the ejector pin bracket drives the ejector pin stage to rise, so that the ejector pin is detached from the ejector pin mounting seat. If, due to an accident, the ejector pin does not detach from the ejector pin mounting seat but detaches from the ejector pin stage, and the base does not block the vacuum hole, the vacuum system will generate a negative pressure abnormal signal. The equipment can automatically stop or alarm to avoid the ejector pin occupying the ejector pin mounting seat and making it impossible to replace the chip. Attached Figure Description
[0026] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this application; Figure 2This is a schematic diagram of the structure of the movable bracket, clamping and ejecting mechanism, ejector pin mounting base, ejector pin bracket, ejector pin platform, lifting cylinder and rotating motor in the embodiments of this application; Figure 3 This is a schematic diagram of the structure of the ejector pin bracket, ejector pin platform, lifting cylinder and rotating motor in the embodiments of this application; Figure 4 This is a cross-sectional view of the ejector pin mounted on the ejector pin mounting base in an embodiment of this application; Figure 5 This is a top view of the ejector plate and ejector mounting base in the embodiments of this application; Figure 6 This is a schematic diagram of the clamping and ejection mechanism holding the ejector pin in an embodiment of this application; Figure 7 yes Figure 6 A cross-sectional view along the AA direction.
[0027] Reference numerals: 1. Base; 2. Movable bracket; 3. Ejector pin; 31. Base; 32. Syringe; 33. Ejector core; 4. Clamping and ejection mechanism; 41. Gripper cylinder; 42. Lifting assembly; 421. Lifting motor; 422. First linear module; 5. Z-axis lifting mechanism; 51. Drive motor; 52. Second linear module; 53. Transmission belt; 6. Ejector pin mounting seat; 7. Ejector pin bracket; 8. Rotary motor; 9. Lifting cylinder; 10. Ejector pin platform; 11. Mounting slot; 12. Vacuum hole; 13. Mounting hole; 14. Locking block; 15. Elastic element; 16. Frame. Detailed Implementation
[0028] The following is in conjunction with the appendix Figure 1 -Appendix Figure 7 This application will be described in further detail.
[0029] This application discloses a chip ejection switching device.
[0030] refer to Figure 1 and Figure 2 A chip ejection switching device includes a base 1, a movable support 2, ejector pins 3, a clamping ejection mechanism 4, and a Z-axis lifting mechanism 5. An ejector pin mounting seat 6 is fixedly mounted on the top of the movable support 2 for mounting the ejector pins 3. The Z-axis lifting mechanism 5 is located on the top surface of the base 1 and connected to the movable support 2 to drive the movable support 2 to rise and fall vertically. When the Z-axis lifting mechanism 5 drives the movable support 2 to a preset height, the ejector pin mounting seat 6 reaches its working position, at which point the top of the ejector pin 3 is located at the bottom of the chip to be ejected. Simultaneously, the clamping ejection mechanism 4 is mounted on the movable support 2 and connects to the ejector pins 3 to drive the ejector pins 3 to complete the chip ejection action. Furthermore, when the Z-axis lifting mechanism 5 drives the movable support 2, the clamping ejection mechanism 4 moves synchronously with the movable support 2.
[0031] refer to Figure 1 and Figure 3 The base 1 is also provided with a pin support 7, a rotating motor 8 and a lifting cylinder 9 on its top surface. At least two pin carriers 10 are provided around the pin support 7. The pins 3 placed on the two pin carriers 10 can be selected according to the actual production needs.
[0032] The rotating motor 8 is connected to the ejector pin bracket 7. The rotating motor 8 drives the ejector pin bracket 7 to rotate, so that the ejector pin platform 10, on which the corresponding ejector pin 3 to be replaced is placed, moves to above the ejector pin mounting seat 6. When the ejector pin mounting seat 6 rises to the same height as the ejector pin platform 10, the ejector pin 3 on the ejector pin platform 10 abuts against the top surface of the ejector pin mounting seat 6. The ejector pin mounting seat 6 drives the ejector pin 3 to continue to rise to the working position, and the ejector pin 3 disengages from the ejector pin platform 10.
[0033] The lifting cylinder 9 is mounted on the base 1 and is connected to the rotary motor 8. The lifting cylinder 9 drives the rotary motor 8 to rise and fall. When the Z-axis lifting mechanism 5 drives the ejector pin mounting seat 6 to fall back to the same height as the ejector pin platform 10, the lifting cylinder 9 drives the ejector pin platform 10 to rise. The rise of the ejector pin platform 10 drives the ejector pin 3 to rise and detach from the ejector pin mounting seat 6. The ejector pin platform 10, which holds the corresponding ejector pin 3 to be replaced, rotates to above the ejector pin mounting seat 6.
[0034] refer to Figure 3 In this embodiment of the application, three ejector pins 3 are provided, and three ejector pin platforms 10 are also provided. The three different ejector pins 3 are respectively installed on the three ejector pin platforms 10. The three ejector pin platforms 10 are installed on the ejector pin bracket 7 and are arranged in a circular array. The three ejector pin platforms 10 rotate around the motor rotation shaft.
[0035] When the type of chip being produced changes and the corresponding ejector pin 3 needs to be replaced, the Z-axis lifting mechanism 5 controls the movable support 2 to descend, causing the ejector pin mounting seat 6 to descend. When the height of the ejector pin mounting seat 6 drops to the same height as the ejector pin stage 10, the clamping ejector mechanism 4 releases the ejector core 33. At this time, the bottom of the ejector pin 3 abuts against the ejector pin mounting seat 6, and the bottom edge of the ejector pin 3 is engaged with the ejector pin stage 10. Subsequently, the lifting cylinder 9 drives the ejector pin support 7 to rise, and the rise of the ejector pin support 7 drives the ejector pin stage 10 to rise. The ejector pin stage 10 drives the ejector pin 3 to rise above the ejector pin mounting seat 6, and the ejector pin 3 on the ejector pin mounting seat 6 disengages from the ejector pin mounting seat 6.
[0036] Then, the rotating motor 8 drives the ejector pin bracket 7 to rotate, which in turn drives the ejector pin platform 10 to rotate. The ejector pin platform 10, which holds the corresponding ejector pin 3 to be replaced, rotates to above the ejector pin mounting seat 6. The lifting component drives the ejector pin bracket 7 to descend, which in turn drives the ejector pin platform 10 to descend. The descending of the ejector pin platform 10 causes the ejector pin 3 to descend. When the height of the ejector pin platform 10 drops to the same level as the ejector pin mounting seat 6, the bottom of the ejector pin 3 abuts against the ejector pin mounting seat 6, and the bottom edge of the ejector pin 3 engages with the ejector pin platform 10, clamping the ejector mechanism 4 to hold the ejector core 33.
[0037] Subsequently, the Z-axis lifting mechanism 5 controls the movable bracket 2 to rise, causing the ejector pin mounting seat 6 to rise. The ejector pin mounting seat 6, carrying the ejector pin 3, rises to the working position, and the ejector pin 3 on the ejector pin platform 10 disengages from the ejector pin platform 10. The clamping and ejecting mechanism drives the ejector core 33 to rise and fall periodically, realizing the function of the ejector core 33 periodically ejecting the chip.
[0038] refer to Figure 3 The lifting cylinder 9 is bolted to the base 1, and the rotating motor 8 is bolted to the mounting plate on which the output shaft of the lifting cylinder 9 is mounted. The ejector pin bracket 7 is a circular plate, and the ejector pin bracket 7 is bolted to the rotating shaft of the rotating motor 8. The center of the ejector pin bracket 7 is coaxial with the rotating shaft of the rotating motor 8. One end of the ejector pin platform 10 is bolted to the ejector pin bracket 7, and the other end of the ejector pin platform 10 extends out of the ejector pin bracket 7 and is suspended in the air, leaving more space below the ejector pin platform 10 to facilitate the clamping and ejection mechanism to clamp and eject the ejector core 33.
[0039] In other embodiments, the lifting cylinder 9 can be replaced by an electric push rod, the rotating motor 8 can be replaced by an electric rotating slide, and the ejector pin bracket 7 is bolted to the slide.
[0040] refer to Figure 3 and Figure 4 The ejector pin 3 includes a base 31, a syringe 32, and an ejector core 33. The syringe 32 is a cylinder with both ends through it. The axis of the syringe 32 is perpendicular to the base 31. The syringe 32 passes through the base 31 and is snapped and fixed on the base 31. The ejector core 33 is inserted into the syringe 32 along the axis of the syringe 32 and slides with the syringe 32. Both ends of the ejector core 33 protrude from the syringe 32.
[0041] The ejector plate 10 is a U-shaped plate with an installation groove 11. The outer ring of the base 31 is engaged with the installation groove 11 to install the ejector pin 3 on the ejector plate 10. When the ejector plate 10 and the ejector mounting seat 6 are at the same height, the inner ring of the base 31 abuts against the top surface of the ejector mounting seat 6, and the ejector core 33 penetrates the ejector mounting seat 6. The clamping and ejection mechanism clamps the ejector core 33 and drives the ejector core 33 to rise and fall.
[0042] refer to Figure 3 and Figure 5The ejector plate 10 has a vacuum hole 12 for detecting whether an ejector pin 3 is installed. The vacuum hole 12 is located on the wall of the mounting groove 11. When the ejector pin 3 is installed on the ejector plate 10, the base 31 blocks the vacuum hole 12. When the lifting cylinder 9 drives the ejector pin bracket 7 to rise, the rise of the ejector pin bracket 7 drives the ejector plate 10 to rise, so that the ejector pin 3 is separated from the ejector pin mounting seat 6, if the ejector pin 3 fails to separate from the ejector pin mounting seat 6 due to an accident, the vacuum hole 12 on the ejector plate 10 will not be blocked. The vacuum system will generate a negative pressure abnormality signal, and the equipment will automatically stop or alarm to avoid the ejector pin 3 occupying the ejector pin mounting seat 6 and making it impossible to replace the chip.
[0043] The ejector mounting base 6 is a rectangular plate. The shape and size of the ejector mounting base 6 are adapted to the ejector platform 10. When the ejector mounting base 6 and the ejector platform 10 are at the same height, the ejector mounting base 6 fits perfectly against the inner wall of the mounting groove 11 of the ejector platform 10.
[0044] The ejector pin mounting base 6 has a mounting hole 13 that engages with the syringe 32. When the ejector pin 3 is mounted on the ejector pin mounting base 6, the syringe 32 passes through the mounting hole 13 and engages with the mounting hole 13. The bottom of the ejector core 33 also passes through the mounting hole 13. The clamping ejection mechanism 4 is located below the ejector pin mounting base 6 to clamp and fix the ejector core 33. The mounting hole 13 plays a positioning role for the installation of the ejector pin 3 and restricts the horizontal movement of the ejector pin 3.
[0045] When the Z-axis lifting mechanism 5 controls the movable bracket 2 to rise, causing the ejector pin mounting seat 6 to rise, the ejector pin 3 base 31 is no longer engaged with the mounting groove 11 of the ejector pin platform 10, and the ejector pin 3 disengages from the ejector pin platform 10; when the lifting cylinder 9 drives the ejector pin bracket 7 to rise, the clamping ejector mechanism releases the ejector core 33, the ejector pin bracket 7 rises and drives the ejector pin platform 10 to rise, the ejector pin 3 base 31 no longer abuts against the surface of the ejector pin mounting seat 6, the ejector pin 3 cylinder 32 and ejector core 33 pass through the mounting hole 13 as the ejector pin platform 10 rises, and the ejector pin 3 disengages from the ejector pin mounting seat 6.
[0046] refer to Figure 2 and Figure 6 The clamping and ejection mechanism 4 includes a gripper cylinder 41 and a lifting assembly 42. The gripper cylinder 41 is movably mounted on the movable bracket 2 and located below the ejector pin mounting seat 6. The lifting assembly 42 is connected to the cylinder body of the gripper cylinder 41 and drives the gripper cylinder 41 to rise and fall on the movable bracket 2. The end of the ejector core 33 is bolted with a locking block 14, which is located below the ejector pin mounting seat 6. The gripper of the gripper cylinder 41 engages with the locking block 14 to clamp the locking block 14.
[0047] An elastic element 15 is fitted onto one end of the top core 33 near the gripper cylinder 41. The elastic element 15 is a spring. One end of the elastic element 15 abuts against the locking block 14, and the other end of the elastic element 15 abuts against the syringe 32. When the device is stopped and the power is cut off, the gripper cylinder 41 does not work. At this time, the elastic element 15 provides a restoring force to the locking block 14, so that the top core 33 can maintain its initial state for easy use next time.
[0048] refer to Figure 2 and Figure 7 The lifting assembly 42 includes a lifting motor 421 and a first linear module 422 mounted on the movable bracket 2. The lifting motor 421 is located below the ejector pin mounting seat 6, and the first linear module 422 is located between the lifting motor 421 and the ejector pin mounting seat 6. The rotating shaft of the lifting motor 421 is connected to the input end of the first linear module 422, and the output end of the first linear module 422 is connected to the gripper cylinder 41 to drive the gripper cylinder 41 to lift and lower. In this embodiment, the first linear module 422 adopts a screw drive structure to drive the slide table to lift and lower. The rotating shaft of the lifting motor 421 is coaxially fixed with the screw, and the cylinder body of the gripper cylinder 41 is bolted to the slide table.
[0049] When the lifting cylinder 9 drives the ejector pin bracket 7 to descend until the height of the ejector pin platform 10 is the same as that of the ejector pin mounting base 6, the gripper of the gripper cylinder 41 grips the locking block 14 at the end of the ejector core 33. When the Z-axis lifting mechanism 5 drives the ejector pin mounting base 6 to rise below the chip pick-and-place station, the output shaft of the lifting motor 421 rotates, driving the lead screw of the first linear module 422 to rotate. The lifting motor 421 drives the slide of the first linear module 422 to rise and fall through the lead screw. The rise and fall of the slide drives the gripper cylinder 41 to rise and fall. The rise and fall of the gripper cylinder 41 drives the ejector core 33 to rise and fall, so that the ejector core 33 can periodically lift the chip.
[0050] It also includes a frame 16, which is bolted to the base 1 and is set perpendicular to the base 1. The Z-axis lifting mechanism 5 is installed on the frame 16, and the movable bracket 2 is movably installed on the frame 16.
[0051] refer to Figure 1 The Z-axis lifting mechanism 5 includes a drive motor 51, a second linear module 52, and a transmission belt 53. Both the drive motor 51 and the second linear module 52 are bolted to the frame 16. The second linear module 52 adopts a screw drive structure to drive the slide table to lift. The movable bracket 2 is fixed to the slide table by bolts. The transmission belt 53 is wound around the end of the drive motor 51 rotating shaft and the end of the screw. The rotation of the drive motor 51 rotating shaft drives the screw to rotate through the transmission belt 53. The rotation of the screw drives the slide table to lift. The lifting of the slide table drives the movable bracket 2 to lift, which in turn drives the ejector pin mounting seat 6 to lift.
[0052] The implementation principle of this application embodiment is as follows: When the type of chip produced changes and the corresponding ejector pin 3 needs to be replaced, the Z-axis lifting mechanism 5 controls the movable bracket 2 to descend, causing the ejector pin mounting seat 6 to descend. When the height of the ejector pin mounting seat 6 drops to the same height as the ejector pin stage 10, the gripper cylinder 41 releases the ejector core 33. At this time, the inner ring of the ejector pin 3 base 31 abuts against the top surface of the ejector pin mounting seat 6, and the outer ring of the ejector pin 3 engages with the mounting groove 11 of the ejector pin stage 10. Subsequently, the lifting cylinder 9 drives the ejector pin bracket 7 to rise, and the rise of the ejector pin bracket 7 drives the ejector pin stage 10 to rise. The base 31 no longer abuts against the top surface of the ejector pin mounting seat 6, and the syringe 32 gradually passes through the mounting hole 13 of the ejector pin mounting seat 6 and no longer engages with the mounting hole 13. The ejector pin stage 10 drives the ejector pin 3 to rise above the ejector pin mounting seat 6, and the ejector pin 3 disengages from the ejector pin mounting seat 6.
[0053] Then, the rotating motor 8 drives the ejector pin bracket 7 to rotate, which in turn drives the ejector pin platform 10 to rotate. The ejector pin platform 10, which holds the corresponding ejector pin 3 to be replaced, rotates to above the ejector pin mounting seat 6. The lifting component drives the ejector pin bracket 7 to descend, which in turn drives the ejector pin platform 10 to descend. The descent of the ejector pin platform 10 causes the ejector pin 3 to descend, and the syringe 32 of the ejector pin 3 gradually passes through the mounting hole 13 of the ejector pin mounting seat 6. When the height of the ejector pin platform 10 drops to the same level as the ejector pin mounting seat 6, the inner ring of the ejector pin 3 base 31 abuts against the top surface of the ejector pin mounting seat 6, and the outer ring of the ejector pin 3 engages with the mounting groove 11 of the ejector pin platform 10. The gripper cylinder 41 clamps the ejector core 33.
[0054] Subsequently, the drive motor 51 drives the movable bracket 2 to rise through the second linear module 52, causing the ejector pin mounting seat 6 to rise. The ejector pin mounting seat 6, carrying the ejector pin 3, rises to the working position. At this time, the base 31 of the ejector pin 3 is no longer engaged with the mounting slot 11, and the ejector pin 3 on the ejector pin platform 10 disengages from the ejector pin platform 10. The drive motor 51 continues to control the movable bracket 2 to rise until the ejector pin mounting seat 6 rises below the chip pick-and-place station. The lifting motor 421 drives the gripper cylinder 41 to periodically rise and fall through the first linear module 422. The periodic rise and fall of the gripper cylinder 41 drives the ejector core 33 to periodically rise and fall, realizing the function of periodically ejecting the chip from the ejector core 33.
[0055] In summary, the ejector pins 3 suitable for different chip types can be quickly switched without disassembling the equipment, significantly reducing downtime. At the same time, through the coordinated control of the ejector pin mounting base 6 and ejector pin stage 10 by the Z-axis lifting mechanism 5, the rotary motor 8 and the lifting motor 421, the position of the ejector pin 3 core 33 can be accurately positioned without manual adjustment, further reducing downtime. Moreover, since no adjustment process is required, the chip will not be damaged by adjustment, thus reducing production costs.
[0056] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A chip ejection switching device characterized by comprising: The utility model relates to a kind of needle ejecting mechanism, including: Base (1); At least two needles (3), needle (3) includes needle barrel (32) and top core (33), the top core (33) is slidably matched with needle barrel (32); Needle support (7) is equipped with at least two needle loading platform (10), and needle loading platform (10) is used to place needle (3); Movable support (2) is movably arranged in base (1), and is fixedly provided with needle mounting seat (6) for clamping needle barrel (32); Rotary motor (8) is installed on base (1), for driving different needle loading platform (10) to rotate to the top of needle mounting seat (6); Lifting cylinder (9) is installed on base (1), for driving needle support (7) to lift, so that needle (3) is seated in needle mounting seat (6), or is lifted from needle mounting seat (6) and separates; Clamping and ejecting mechanism (4) is arranged in the position corresponding to needle mounting seat (6) of movable support (2), for clamping the top core (33) of needle (3), and driving the top core (33) to lift; Z-axis lifting mechanism (5) is arranged in base (1), for driving movable support (2) to lift, so that needle (3) separates from needle loading platform (10), or falls back to needle loading platform (10).
2. The chip ejection switching device according to claim 1, characterized by The needle (3) further includes base (31), the needle barrel (32) is fixed to the base (31), the needle loading platform (10) is provided with mounting groove (11), the outer ring of the base (31) is used for clamping mounting groove (11), the inner ring of the base (31) is used for abutting needle mounting seat (6) top surface, the bottom of the top core (33) is arranged through the base (31) and needle loading platform (10).
3. The chip ejection switching device according to claim 2, wherein The needle loading platform (10) is provided with vacuum hole (12) for detecting whether needle (3) is installed, the vacuum hole (12) is located on the groove wall of mounting groove (11), when needle (3) is installed on needle loading platform (10), the base (31) blocks the vacuum hole (12).
4. The chip ejection switching device according to claim 2, wherein The needle mounting seat (6) is provided with mounting hole (13), the needle barrel (32) passes through the mounting hole (13) and is clamped with mounting hole (13), when needle (3) is installed on needle mounting seat (6), the bottom of top core (33) passes through mounting hole (13) and is clamped and fixed by clamping and ejecting mechanism (4).
5. The chip ejection switching device according to claim 4, wherein The clamping and ejecting mechanism (4) includes clamping jaw cylinder (41) and lifting assembly (42), lifting assembly (42) is arranged on movable support (2), the cylinder body of clamping jaw cylinder (41) is slidably arranged on movable support (2), lifting assembly (42) is connected with clamping jaw cylinder (41), and clamping jaw cylinder (41) is lifted and driven;The bottom of the top core (33) is fixedly provided with clamping block (14), clamping block (14) is located below needle mounting seat (6), the clamping jaw of clamping jaw cylinder (41) is clamped with clamping block (14).
6. The chip ejection switching device according to claim 5, wherein The lifting assembly (42) comprises a lifting motor (421) and a first linear module (422) mounted on the movable support (2), the rotating shaft of the lifting motor (421) is connected with the input end of the first linear module (422), and the output end of the first linear module (422) is connected with the clamping jaw cylinder (41) to drive the clamping jaw cylinder (41) to lift.
7. The chip ejection switching device according to claim 5, wherein The top core (33) is sleeved with an elastic element (15) at one end below the needle mounting base (6), one end of the elastic element (15) is abutted with a clamping block (14), and the other end of the elastic element (15) is abutted with the end of the needle cylinder (32).
8. The chip ejection switching device according to claim 1, wherein Further comprising a frame body (16) fixed on the base (1), and the Z-axis lifting mechanism (5) comprises a driving motor (51) and a second linear module (52) mounted on the frame body (16), the rotating shaft of the driving motor (51) is connected with the input end of the second linear module (52), and the output end of the second linear module (52) is connected with the movable support (2) to drive the movable support (2) to lift.
9. The chip ejection switching device according to claim 8, wherein The output shaft end of the driving motor (51) is wound with a transmission belt (53) at the end of the lead screw of the second linear module (52), and the output shaft of the driving motor (51) rotates to drive the lead screw of the second linear module (52) to rotate through the transmission belt (53).