Hot melt adhesive compositions comprising modified styrene block copolymers and articles comprising same

By using specific proportions of unmodified and modified styrene block copolymers, tackifiers, and plasticizers in hot melt adhesive compositions, the problem of insufficient adhesion of hot melt adhesives in disposable absorbent products is solved, achieving stable adhesion and easy removal on a variety of substrates.

CN121127553APending Publication Date: 2025-12-12HB FULLER CO
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Patent Information

Application Number
CN202480031055.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-10-17
Filing Date
2024-05-06
Publication Date
2025-12-12

AI Technical Summary

Technical Problem

Existing hot melt adhesive compositions have difficulty exhibiting good adhesion to various substrates under various conditions in disposable absorbent articles, especially in high humidity environments and on different fabrics, and are difficult to maintain stability and be easy to remove during user activity.

Method used

A hot melt adhesive composition comprising 5% to 40% by weight of unmodified styrene block copolymer, 0.5% to 15% by weight of modified styrene block copolymer, 30% to 65% by weight of tackifier and 10% to 45% by weight of plasticizer, with a wax content of less than 5% by weight, and using a hydrogenated hydrocarbon tackifier to improve adhesion and stability.

Benefits of technology

Provides strong adhesion to a variety of substrates under various conditions, maintaining stability, especially in high humidity environments, and is easy to remove without tearing, suitable for a variety of substrate materials such as cotton and microfiber.

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Abstract

The present invention features a hot melt adhesive composition for disposable absorbent articles comprising 5 to 40 wt% of an unmodified styrenic block copolymer, 0.5 to 30 wt% of a modified styrenic block copolymer, 30 to 65 wt% of a tackifier, and 10 to 45 wt% of a plasticizer, wherein the hot melt adhesive composition comprises less than 5% by weight of wax.
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