Lifting device for semiconductor equipment and use method of lifting device

Abstract

The invention discloses a lifting device for semiconductor equipment, and belongs to the technical field of semiconductor equipment manufacturing, the lifting device comprises a supporting stand column, a rotating mechanism, a supporting cross beam, a transverse moving mechanism, a lifting mechanism and a bearing lifting appliance, the supporting stand column is vertically fixed on a plane, and the rotating mechanism is arranged at the top of the supporting stand column; the rotating mechanism is fixedly connected with the supporting cross beam, the supporting cross beam is slidably connected with the transverse moving mechanism, the lower surface of the transverse moving mechanism is fixedly connected with the lifting structure, and the bearing lifting appliance is fixedly connected below the lifting structure. The rotating mechanism is additionally arranged between the supporting stand column and the supporting cross beam, so that the supporting cross beam can horizontally rotate, height adjustment is achieved through the lifting mechanism, horizontal distance adjustment is achieved through the transverse moving mechanism, and materials can be accurately hoisted through comprehensive use of the rotating mechanism, the lifting mechanism and the transverse moving mechanism; the fundamental problem of adjusting the hoisting direction in a narrow space in the equipment is solved, and unprecedented operation flexibility is provided.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor equipment manufacturing technology, specifically relating to a hoisting device for semiconductor equipment and its usage method. Background Technology

[0002] Semiconductor manufacturing is a cutting-edge field of modern precision industry. Its core equipment, such as etching machines, chemical vapor deposition (CVD), physical vapor deposition (PVD), rapid annealing (RAW), and lithography machines, integrates multiple complex technologies including mechanical, electrical, vacuum, and plasma technologies. These devices contain a large number of high-value, high-precision core modules and components, such as radio frequency power supplies, electrostatic chucks, gas distribution plates, and various components within the vacuum chamber.

[0003] These components are not only complex and expensive, but also have extremely stringent requirements for installation precision, cleanliness, and anti-static properties. Regular preventative maintenance, troubleshooting, and component upgrades are essential parts of the daily operation of semiconductor equipment. This process often requires removing these weighty (typically between 20kg and 200kg) precision components from the equipment or installing them in place.

[0004] Therefore, how to achieve safe, efficient, non-destructive hoisting operations that comply with cleanroom standards in this specific scenario has become a key technical problem that urgently needs to be solved in semiconductor equipment maintenance.

[0005] Currently, the common hoisting or handling methods used in semiconductor equipment maintenance sites mainly include the following two: The first method is purely manual handling, which has drawbacks such as high labor costs, high risk of personal injury, and high risk of equipment damage. The second method involves using general-purpose lifting tools. Some factories may try using common lifting equipment, such as: overhead cranes (manual hoists): using large overhead cranes installed on the workshop ceiling for lifting; manual hoists / chain hoists: temporarily setting up a tripod or simple support frame and using a manual hoist for lifting; and hydraulic pallet trucks / jacks: used to support and lift heavier components.

[0006] The aforementioned existing technical solutions have the following significant drawbacks and limitations, failing to meet the high standards required for semiconductor equipment maintenance. The deficiencies of the existing technology include: Lack of precise positioning capability: Factory overhead cranes and manual hoists are designed for lifting heavy objects, but their positioning accuracy is rough and they cannot complete the docking between precision parts and the base.

[0007] Poor spatial compatibility: Large overhead cranes cannot operate deep inside the equipment. Temporary support frames are often bulky, unstable, and difficult to deploy and position in densely packed factory buildings.

[0008] Functional deficiencies: General-purpose tools lack specialized lifting equipment designed for specific semiconductor components, which may lead to risks during lifting due to uneven force or insecure fixation. General-purpose metal chains or hooks are prone to scratching the surface of components.

[0009] Cleanroom compatibility issues: The metal parts of ordinary lifting equipment are prone to generating dust particles and lack anti-static design, which poses a risk of contaminating the wafer production environment and damaging sensitive electronic components.

[0010] Inconvenient to use: General-purpose tools are not designed for semiconductor equipment maintenance scenarios. They require tedious installation and debugging before each use, which may reduce maintenance efficiency. Summary of the Invention

[0011] In view of the technical problems existing in the prior art, the present invention provides a hoisting device for semiconductor equipment and a method for using the same.

[0012] According to the technical solution of the present invention, in a first aspect, a hoisting device for semiconductor equipment includes: a support column, a rotating mechanism, a supporting beam, a lateral moving mechanism, a lifting mechanism, and a load-bearing hoist. The support column is vertically fixed on a plane. The top of the support column is provided with a rotating mechanism, which is fixedly connected to the supporting beam. The supporting beam is slidably connected to the lateral moving mechanism. The lower surface of the lateral moving mechanism is fixedly connected to the lifting mechanism. A load-bearing hoist is fixedly connected below the lifting mechanism.

[0013] A further improvement of the present invention is that: a mounting base is provided between the bottom perimeter of the supporting column and the ground, and the mounting base is fixedly connected to the equipment.

[0014] A further improvement of the present invention is that the rotating mechanism includes a fixed shaft, a rotating sleeve, and rolling bearings. The fixed shaft is vertically fixed to the top of the support column, the rotating sleeve is sleeved on the outside of the fixed shaft, and rolling bearings are uniformly arranged between the fixed shaft and the rotating sleeve.

[0015] A further improvement of the present invention is that: a groove is provided on the lower surface of the supporting beam, and the lateral moving structure includes a rolling mechanism, which slides within the groove.

[0016] A further improvement of the present invention is that the lifting structure includes an electric hoist and a mounting plate, the mounting plate is fixed below the transverse moving structure, and the lower end face of the mounting plate is fixedly connected to the electric hoist.

[0017] A further improvement of the present invention is that: the bearing lifting device includes a lifting ring, a base, and a plurality of lifting bolts; the lifting ring is fixedly connected to the lifting end of the lifting structure; the lifting ring is fixedly connected to the base; and the base is fixedly connected to a plurality of lifting bolts by a plurality of steel wire ropes.

[0018] A further improvement of the present invention is that: the two ends of the rolling mechanism are respectively provided with a first accordion cover and a second accordion cover, and both the first accordion cover and the second accordion cover are disposed at the bottom of the rolling groove.

[0019] A further improvement of the present invention is that a dustproof protective cover is provided on the outside of the electric hoist.

[0020] A further improvement of the present invention is that the number of lifting bolts is greater than or equal to three.

[0021] According to the technical solution of the present invention, in a second aspect, a method of using a lifting device for semiconductor equipment, the aforementioned lifting device for semiconductor equipment includes the following steps: Step S1: Securely connect the lifting device to the material to be lifted; Step S2: Adjust the angle between the material and the discharge point by pushing the material under the action of the rotating structure; Step S3: Adjust the horizontal distance between the material and the unloading point by pushing the material under the action of the lateral moving mechanism; Step S4: Adjust the vertical height between the material and the unloading point by controlling the height of the lifting mechanism; Step S5: until the material arrives at the unloading point, separate the material from the carrying hoist.

[0022] The above technical solution has the following beneficial technical effects: This invention adds a rotating mechanism between the supporting column and the supporting beam, enabling the supporting beam to rotate horizontally. The lifting mechanism allows for height adjustment, and the lateral movement mechanism allows for horizontal distance adjustment. The combined use of these three mechanisms enables precise material hoisting, solving the fundamental problem of adjusting the hoisting direction within the narrow space inside the equipment and providing unprecedented operational flexibility. Attached Figure Description

[0023] The accompanying drawings are provided to better understand the invention and are not intended to unduly limit the scope of the invention. Wherein: Figure 1 This is a schematic diagram of the structure of a hoisting device for semiconductor equipment according to the present invention; Figure 2 This is a schematic diagram of the cavity in a lifting device for semiconductor equipment according to the present invention; Figure 3 This is a cross-sectional view of the rotating mechanism in a hoisting device for semiconductor equipment according to the present invention; Figure 4 This is a bottom view of the roller groove in a lifting device for semiconductor equipment according to the present invention; Figure 5This is a structural schematic diagram of the lifting mechanism and the supporting lifting device in a semiconductor equipment hoisting device according to the present invention.

[0024] Reference numerals in the attached drawings: 1. Lifting device; 101. Mounting base; 102. Support column; 103. Rotating mechanism; 131. Fixed shaft; 132. Rotating sleeve; 133. Rolling bearing; 104. Support beam; 141. First accordion cover; 142. Second accordion cover; 143. Roller groove; 105. Lateral movement mechanism; 151. Rolling mechanism; 106. Lifting mechanism; 161. Electric hoist; 162. Mounting plate; 163. First pin; 164. Second pin; 165. Dustproof protective cover; 107. Bearing lifting device; 171. Lifting ring; 172. Base; 173. Wire rope; 174. Lifting bolt; 2. Cavity. Detailed Implementation

[0025] The following description, in conjunction with the accompanying drawings, illustrates exemplary embodiments of the present invention, including various details to aid understanding. These details should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the invention. Similarly, for clarity and brevity, descriptions of well-known functions and structures are omitted in the following description.

[0026] Example 1 like Figure 1As shown, a lifting device for semiconductor equipment includes a support column 102, a rotating mechanism 103, a supporting beam 104, a lateral moving mechanism 105, a lifting mechanism 106, and a load-bearing lifting device 107. The support column 102 is vertically arranged, and its bottom is fixed to a base or other plane. The top of the support column 102 is provided with a rotating mechanism 103, which rotates 360° about the axis of the support column 102. The top of the rotating mechanism 103 is provided with a horizontally arranged supporting beam 104. The connection between the rotating mechanism 103 and the supporting beam 104 does not affect the rotation of the rotating mechanism 103. The supporting beam 104... The lower surface of the device is provided with a lateral moving mechanism 105, which is slidably connected to the supporting beam 104. The lower part of the lateral moving mechanism 105 is fixedly connected to the lifting mechanism 106, and the lifting end of the lifting mechanism 106 is fixedly connected to the bearing hoist 106. The supporting column 102 and the supporting beam 104 provide support to prevent tilting during hoisting. The rotating mechanism 103 adjusts the angle between the supporting beam 104 and the lifting point with the supporting column 102 as the axis. The lateral moving mechanism 105 is used to adjust the horizontal distance between the hoisted material and the unloading point, and the lifting mechanism 106 is used to adjust the vertical distance between the hoisted material and the unloading point. This specialized device integrates lifting, moving, and rotating functions, replacing manual labor with mechanical power, significantly reducing labor intensity and safety hazards, and improving the efficiency and safety of maintenance operations.

[0027] Specifically, such as Figure 2 As shown, the hoisting device 1 is installed and fixed on the cavity 2; the cavity 2 must have a certain strength to bear the weight of the hoisting device 1.

[0028] Specifically, both the support column 102 and the support beam 104 are made of standard aluminum alloy profiles, achieving a balance between lightweight and high strength. At the same time, their natural oxide layer has good corrosion resistance and cleanliness.

[0029] Specifically, a mounting base 101 is provided between the bottom perimeter of the supporting column 102 and the ground, and the mounting base 101 is fixedly connected to the equipment. The mounting base 101 is a hollow sleeve, and the bottom of the hollow sleeve is fixedly connected to the ground or other planes. Several reinforcing ribs are evenly provided between the perimeter of the hollow sleeve and the ground, thereby improving the stability of the mounting base 101. The mounting base 101 is welded from 304 stainless steel, ensuring extremely high structural strength, rigidity, and corrosion resistance, and can stably support the entire device and the heavy load. The welding process ensures the integrity and stability of the structure. The equipment fixedly connected to the mounting base 101 is related to the material to be lifted (for example, the material to be lifted is part of the equipment, and the material to be lifted needs to be installed on the equipment, etc.). For example, equipment A includes several materials to be lifted. In this case, the mounting base 101 is fixed to the top or other plane of equipment A. By setting the mounting base 101 on the equipment, the space occupied by the lifting device 1 is reduced, saving space and facilitating use.

[0030] Specifically, such as Figure 3 As shown, the rotating mechanism 103 includes a fixed shaft 131, a rotating sleeve 132, and rolling bearings 133. The fixed shaft 131 is vertically fixed to the top of the support column 102. The rotating sleeve 132 is sleeved on the outer side of the fixed shaft 131. Rolling bearings 133 are evenly distributed between the fixed shaft 131 and the rotating sleeve 132. The fixed shaft 131 is a two-step shaft. The diameter of the first step above the fixed shaft 131 is smaller than that of the second step below. The bottom of the fixed shaft 131 is fixed to the top of the support column 102 by bolts. The fixed shaft 131 is made of high-strength steel and has good stability. The inner diameter of the rotating sleeve 132 is larger than the diameter of the first step and smaller than the diameter of the second step. The rotating sleeve 132 is fixedly connected to the bottom of one end of the support beam 104 by bolts. The rolling bearings 133 are angular contact ball bearings that can withstand both axial and radial loads. The inner ring of the rolling bearing 133 mates with the fixed shaft 131, and the outer ring of the rolling bearing 131 mates with the rotating sleeve 132. The rotating sleeve 132 is a hollow sleeve. Through the rolling function of the rolling bearing 133, the rotating sleeve 132 achieves a low-resistance, smooth relative rotational motion with respect to the fixed shaft 131.

[0031] Specifically, such as Figure 4-5As shown, a groove 143 is formed on the lower surface of the supporting beam 104. The transverse moving structure 105 includes a rolling mechanism 151, which slides within the groove 143. The cross-section of the groove 143 is a square / rectangle with a notch in the center of the bottom surface. The width inside the groove 143 is smaller than the opening width of the groove 143. The rolling structure 151 includes several sets of rollers, with two rollers in each set. The sets of rollers are arranged axially along the supporting beam 104 and are all located within the groove 143. A bracket is provided between the two rollers in each set. The opening width of the groove 143 is smaller than the distance between the two rollers in each set, and the opening width of the groove 143 is larger than the width of the bracket. Several brackets are fixed to a connecting plate, which is located below the groove 143 and is used for fixed connection with the lifting mechanism 106. By setting a groove 143 with an opening smaller than the distance between the two rollers in each group, each group of rollers rolls on both sides of the opening of the groove 143, preventing them from falling out of the opening. The two ends of the rolling mechanism 151 are respectively provided with a first accordion cover 141 and a second accordion cover 142, and both the first accordion cover 141 and the second accordion cover 142 are located at the bottom of the groove 143. The left side of the rolling mechanism 151 is defined as the first accordion cover 141, and the right side is defined as the second accordion cover 142. The left end of the first accordion cover 141 is fixed to the left end of the bottom of the trough 143, the right end of the first accordion cover 141 is fixed to the left end of the connecting plate, the right end of the second accordion cover 142 is fixed to the right end of the bottom of the trough 143, and the left end of the second accordion cover 142 is fixed to the right end of the connecting plate. With the above arrangement, the two accordion covers slide at the bottom of the trough 143 with the lateral moving mechanism 105, preventing particles generated by the movement of the lateral moving mechanism 105 from spreading to the outside.

[0032] Specifically, the lifting structure 106 includes an electric hoist 161 and a mounting plate 162. The mounting plate 162 is fixed below the transverse moving structure 105, and its lower end face is fixedly connected to the electric hoist 161. A plurality of connecting beams are evenly arranged between the mounting plate 162 and the connecting plate, and the lifting structure 106 and the transverse moving structure 105 are fixedly connected by these connecting beams. The mounting plate 162 is connected to the rolling mechanism 151 by first pins 163 (i.e., first pins 163 are set at the intersection of the connecting beams), and the electric hoist 161 is connected to the mounting plate 162 by second pins 164. A dustproof protective cover 165 is fitted over the outside of the electric hoist 161. The dustproof protective cover 165 is a telescopic dustproof protective cover used to wrap the annular chain of the electric hoist 161 to prevent chain debris from falling and contaminating the equipment.

[0033] Specifically, the lifting device 107 includes a lifting ring 171, a base 172, and a plurality of lifting bolts 174. The lifting ring 171 is fixedly connected to the lifting end of the lifting structure, and the lifting ring 171 is fixedly connected to the base 172. The base 172 is fixedly connected to the plurality of lifting bolts 174 by a plurality of steel wire ropes 173. The number of lifting bolts 174 is greater than or equal to three, preferably four, so that they are evenly distributed around the material to be lifted, thereby achieving a stable fixing effect.

[0034] Specifically, a lifting ring 171 is installed on a circular base 172. Four steel wire ropes 173 are installed on the circular base 172; the steel wire ropes 173 are connected to four lifting bolts 174, and corresponding threaded holes are designed on the material to be lifted; Example 2 A method of using a lifting device for semiconductor equipment, as described in Embodiment 1, includes the following steps: Step S1: Securely connect the lifting device 107 to the material to be lifted; Step S2: Adjust the angle between the material and the discharge point by pushing the material under the action of the rotating structure 103; Step S3: Adjust the horizontal distance between the material and the unloading point by pushing the material under the action of the lateral moving mechanism 105; Step S4: Adjust the vertical height between the material and the unloading point by controlling the height of the lifting mechanism 106; Step S5: until the material arrives at the unloading point, separate the material from the carrying hoist 107.

[0035] Specifically, by integrating a quick-detachable rotating mechanism 103, a lateral moving mechanism 104, and a modular cleanroom lifting device into a single integrated design, the problems of easy damage to parts, high operational risks, and inflexible operation in confined spaces caused by the lack of adjustment capabilities in existing lifting technologies are solved. This achieves a fundamental breakthrough in the non-destructive, safe, and efficient lifting of precision parts. It is not only suitable for replacing internal parts in semiconductor equipment but also for maintaining similarly heavy precision modules in other precision manufacturing industries (such as flat panel displays and precision optical equipment) that are difficult to replace manually.

[0036] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0037] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can occur depending on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A hoisting device for semiconductor equipment, characterized in that, The device includes a support column (102), a rotating mechanism (103), a supporting beam (104), a lateral moving mechanism (105), a lifting mechanism (106), and a load-bearing hoist (107). The support column (102) is vertically fixed on a plane. The top of the support column (102) is provided with a rotating mechanism (103). The rotating mechanism (103) is fixedly connected to the supporting beam (104). The supporting beam (104) is slidably connected to the lateral moving mechanism (105). The lower surface of the lateral moving mechanism (105) is fixedly connected to the lifting mechanism (106). The load-bearing hoist (107) is fixedly connected below the lifting mechanism (106).

2. The hoisting device for semiconductor equipment according to claim 1, characterized in that, The bottom of the support column (102) is provided with an installation base (101) between the bottom and the ground, and the installation base (101) is fixedly connected to the equipment.

3. The lifting device for semiconductor equipment according to claim 1, characterized in that, The rotating mechanism (103) includes a fixed shaft (131), a rotating sleeve (132), and a rolling bearing (133). The fixed shaft (131) is vertically fixed to the top of the support column (102). The rotating sleeve (132) is sleeved on the outside of the fixed shaft (131). The rolling bearing (133) is evenly arranged between the fixed shaft (131) and the rotating sleeve (132).

4. The hoisting device for semiconductor equipment according to claim 1, characterized in that, The lower surface of the support beam (104) is provided with a rolling groove (143), and the transverse moving mechanism (105) includes a rolling mechanism (151), which slides in the rolling groove (143).

5. A hoisting device for semiconductor equipment according to claim 1, characterized in that, The lifting mechanism (106) includes an electric hoist (161) and a mounting plate (162). The mounting plate (162) is fixed below the transverse moving mechanism (105), and the lower end face of the mounting plate (162) is fixedly connected to the electric hoist (161).

6. The lifting device for semiconductor equipment according to claim 1, characterized in that, The lifting device (107) includes a lifting ring (171), a base (172), and several lifting bolts (174). The lifting ring (171) is fixedly connected to the lifting end of the lifting mechanism. The lifting ring (171) is fixedly connected to the base (172). The base (172) is fixedly connected to several lifting bolts (174) by several steel wire ropes (173).

7. A hoisting device for semiconductor equipment according to claim 4, characterized in that, The rolling mechanism (151) has a first accordion cover (141) and a second accordion cover (142) at both ends, and both the first accordion cover (141) and the second accordion cover (142) are located at the bottom of the rolling groove (143).

8. A hoisting device for semiconductor equipment according to claim 5, characterized in that, The electric hoist (161) is fitted with a dustproof protective cover (165) on its outer side.

9. A hoisting device for semiconductor equipment according to claim 6, characterized in that, The number of lifting bolts (174) is greater than or equal to three.

10. A method of using a lifting device for semiconductor equipment, based on the lifting device for semiconductor equipment according to any one of claims 1-9, characterized in that, Includes the following steps: Step S1: Securely connect the lifting device (107) to the material to be lifted; Step S2: Adjust the angle between the material and the discharge point by pushing the material under the action of the rotating mechanism (103); Step S3: Adjust the horizontal distance between the material and the unloading point by pushing the material under the action of the lateral moving mechanism (105); Step S4: Adjust the vertical height between the material and the unloading point by controlling the height of the lifting mechanism (106); Step S5, until the material arrives at the unloading point, separate the material from the carrying hoist (107).

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