High-viscosity UV curing adhesive with high adaptability

Abstract

The invention discloses a high-adaptability high-viscosity UV curing adhesive, the UV curing adhesive comprises an outer layer composite network and an inner layer polymerization network, the inner layer polymerization network is a polymerization network formed by an acrylate prepolymer, an acrylate monomer, a first initiator and a plasticizer under an ultraviolet catalysis condition, the outer layer composite network comprises the inner layer polymerization network, and the inner layer polymerization network comprises a second initiator and a second initiator. The outer-layer composite network further comprises a thermal cross-linked network formed by modified resin, a second cross-linking agent and a curing agent under a thermocatalytic condition. The photocuring component and the thermocuring component are added into the curing adhesive, a double-network structure is formed under different catalytic conditions, the thermocuring component is modified, so that the thermocuring component has a thermotaxis moving characteristic, a layered distribution composite network structure is further formed, and the surface layer of the cured adhesive has a high-strength characteristic; and meanwhile, the inner layer and the outer layer also have good toughness, so that the curing adhesive can balance the requirements of strength and toughness, and further can be used for connecting or packaging substrates bearing variable loads.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of curing glue, in particular to high-viscosity UV curing glue with high adaptability. BACKGROUND

[0002] The UV curing technology is a new type of green, energy-saving and rapid curing technology, and the UV curing glue is a kind of adhesive which can be quickly cured through ultraviolet irradiation to achieve the purposes of bonding, sealing and fixing. The existing UV curing glue is mainly formed into a single polymer network to achieve the purpose of glue curing. However, the single polymer network is difficult to meet the requirements of strength and toughness at the same time, so that the use of the curing glue has great limitations.

[0003] The patent document CN106497499B discloses a kind of UV curing optical glue, comprising the following components: polyurethane acrylic prepolymer, active diluent, photoinitiator;The polyurethane acrylic prepolymer is prepared from hyperbranched polyester polyol, diisocyanate, acrylate compound, and then the problems of improving the gloss, refractive index and light transmittance of the curing glue are solved. However, the above-mentioned patent does not consider how to improve the strength and toughness of the curing glue, which limits the application range and use effect of the curing glue. SUMMARY

[0004] The purpose of the present application is to provide a kind of high-viscosity UV curing glue with high adaptability to solve the problems raised in the above background.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a kind of high-viscosity UV curing glue with high adaptability, the UV curing glue includes; Outer layer composite network and inner layer polymerization network; The inner layer polymerization network is a polymerization network formed by acrylate prepolymer, acrylate monomer, first initiator and plasticizer under the catalysis of ultraviolet light The outer layer composite network includes the inner layer polymerization network, and the outer layer composite network further includes a modified resin, a second crosslinking agent and a curing agent to form a thermal crosslinking network under the catalysis of heat.

[0006] Preferably, the preparation of the modified resin includes selecting at least two kinds of monomer resins and mixing them in proportion to obtain a mixed resin matrix. The mixed resin matrix is subjected to heat modification treatment.

[0007] Preferably, the monomer resins in the mixed resin matrix include polyester resin and polyurethane resin, and the mixed mass percentage of the polyester resin and the polyurethane resin in the mixed resin matrix is (40%~60%): (30%~50%).

[0008] Preferably, the heat-modification treatment of the mixed resin matrix includes, Styrene was added to the mixed resin matrix and stirred thoroughly to obtain a uniformly mixed matrix, wherein the mass percentage of styrene in the mixed matrix was (15% to 30%). Add a modified initiator and a modified crosslinking agent to the mixed base material, wherein the mass percentage of the modified initiator in the mixed base material is (0.5% to 3%) and the mass percentage of the modified crosslinking agent is (1% to 3%). Under normal pressure conditions, the temperature is heated to 60℃~90℃ and maintained for 2h~4h to modify the mixed resin matrix and obtain the modified resin. The modified initiator is at least one of benzoyl peroxide and azobisisobutyronitrile, and the modified crosslinking agent is at least one of divinylbenzene and chlorine trifluoride.

[0009] Preferably, the heat-modification treatment of the mixed resin matrix includes, After adding cyclopentene or cycloheptene to the mixed resin matrix and stirring thoroughly, a uniformly mixed matrix is ​​obtained, and the mass percentage of cyclopentene or cycloheptene in the mixed matrix is ​​(15% to 30%). Add a modified initiator and a modified crosslinking agent to the mixed base material, wherein the mass percentage of the modified initiator in the mixed base material is (0.5% to 3%) and the mass percentage of the modified crosslinking agent is (1% to 3%). Under normal pressure conditions, the temperature is heated to 60℃~90℃ and maintained for 2h~4h to modify the mixed resin matrix and obtain the modified resin. The modified initiator is at least one of benzoyl peroxide and azobisisobutyronitrile, and the modified crosslinking agent is at least one of divinylbenzene and chlorine trifluoride.

[0010] Preferably, the first initiator is a photoinitiator, which includes at least one of 3-methyl-4-phenylbenzophenone, ethyl 2,4,6-trimethylbenzoylphenylphosphonate, and 1-hydroxycyclohexylphenyl ketone. Plasticizers include at least one of diethylhexyl benzoate, acrylate plasticizers, and polyester plasticizers; The second crosslinking agent includes at least one of chlorine trifluoride and vinyltriethoxysilane; The curing agent includes at least one of methyl ethyl ketone peroxide, polyamide curing agents, diaminodiphenylmethane, and diphenyl diisocyanate.

[0011] Preferably, the UV-curable adhesive further includes a leveling agent, a synergistic wetting agent, and a UV absorber; Leveling agents include at least one of dimethyl silicone oil, polydimethylsiloxane, and organosilicon leveling agents; Synergistic wetting agents include at least one of alcohol-based wetting agents and phosphate ester-based wetting agents; Ultraviolet absorbers include at least one of hydroxystyrene-ketone ultraviolet absorbers and dibenzothiophene ultraviolet absorbers.

[0012] Preferably, the UV-curable adhesive further includes a connecting microsphere structure; The preparation of the connecting microspheres includes mixing styrene monomer, potassium persulfate, sodium dodecylbenzenesulfonate and deionized water, stirring evenly, and reacting at 70℃~85℃ for 2~4h to obtain connecting microspheres with a particle size of 1~8μm. Microspheres, acrylic acid, phenyl dimethyl ketone and ethanol were mixed and stirred evenly, and then irradiated under ultraviolet light with a wavelength of 365 nm for 10 to 25 minutes to obtain the first modified microspheres. The first modified microspheres and epoxy acrylate solution were mixed and stirred evenly, and reacted at 60℃~85℃ for 1~3h to obtain the connected microspheres.

[0013] A method for preparing a highly adaptable high-viscosity UV-curable adhesive, comprising mixing acrylate prepolymer, acrylate monomer, first initiator, plasticizer, modified resin, second crosslinking agent, curing agent, leveling agent, synergistic wetting agent, UV absorber and connecting microsphere structure in a mass ratio of (20-30):(10-20):(2-5):(3-6):(15-25):(1-3):(3-5):(0.5-2):(0.5-2):(0.5-2):(5-10), stirring and mixing uniformly at 20-35℃, 300-600rpm under inert gas protection, and obtaining the UV-curable adhesive after vacuum degassing and degassing.

[0014] A method for using a highly adaptable high-viscosity UV-curable adhesive includes coating or dripping the UV-curable adhesive onto the surface of a substrate to be bonded, fixed, or encapsulated; first, performing a heat curing treatment on the outer side of the UV-curable adhesive at a temperature of 40°C to 55°C, causing the heat-modified resin to move towards the surface of the cured adhesive; then, performing a heat curing treatment at a temperature of 65°C to 85°C, causing the modified resin to form a thermally cross-linked network structure on the surface of the cured adhesive; and finally, using ultraviolet light to irradiate the curing agent, causing the acrylate prepolymer and acrylate monomer to form a polymer network on the surface and inside of the cured adhesive under the initiation of a first initiator.

[0015] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention adds photocurable and thermocurable components to a cured adhesive, enabling the adhesive to generate a polymer network under UV catalysis and a three-dimensional cross-linked network under thermocatalysis. This dual-network structure enhances the strength of the cured adhesive. Modification of the thermocurable component imparts thermotropic migration properties, causing the modified resin to migrate to the surface of the cured adhesive at a first thermocatalytic temperature. At a second thermocatalytic temperature, the thermocurable component forms a cross-linked network on the surface of the cured adhesive. UV photocatalysis further facilitates the formation of a polymer network from the uniformly distributed photocatalytic components within the cured adhesive. This layered distribution of the network structure results in a surface layer with high strength while maintaining good toughness in both the inner and outer layers. This balances the strength and toughness requirements of the cured adhesive, making it suitable for connecting or encapsulating substrates subjected to varying loads.

[0016] 2. By using a connecting microsphere structure, the present invention connects the crosslinking network and the polymer network to form an interactive connection of two-component networks, which is beneficial to improving the strength of the cured adhesive and the stability of the curing effect.

[0017] 3. The present invention improves the bonding effect between the cured adhesive and the surface of polar or non-polar substrate by using a synergistic wetting agent, thereby increasing the viscosity of the cured adhesive. Detailed Implementation

[0018] The technical solution of the present invention will be clearly and completely described below with reference to specific embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Example 1

[0019] A highly adaptable high-viscosity UV-curable adhesive and its corresponding preparation method are as follows: Acrylic ester prepolymer, acrylate monomer, first initiator, plasticizer, modified resin, second crosslinking agent, curing agent, leveling agent, synergistic wetting agent, ultraviolet absorber and connecting microsphere structure are mixed in a weight ratio of 20:10:4:5:20:2:4:2:2:1:7. The mixture is stirred and mixed evenly at 20-35℃, 300-600rpm and under inert gas protection. After vacuum degassing and degassing, a UV-curable adhesive is obtained. The first initiator in the UV-curable adhesive is 3-methyl-4-phenylbenzophenone, the plasticizer is diethylhexylbenzoate, the second crosslinking agent is vinyltriethoxysilane, the curing agent is diphenyl diisocyanate, the leveling agent is polydimethylsiloxane, the synergistic wetting agent is a phosphate ester wetting agent (e.g., dioctyl phenyl phosphate), and the ultraviolet absorber is a hydroxystyrene ketone ultraviolet absorber (e.g., 4-hydroxybenzophenone). The modified resin was prepared by uniformly mixing polyester resin and polyurethane resin at a mass percentage of 60%:40%, then adding styrene to the mixed resin matrix and stirring until homogeneous. Benzoyl peroxide and divinylbenzene were then added and stirred, and the mixture was maintained at 70℃~80℃ for 3 hours to modify the mixed resin matrix, resulting in the modified resin. The mass percentages of styrene, benzoyl peroxide, and divinylbenzene in the mixed matrix were 18%, 2%, and 1.5%, respectively. Polyester and polyurethane resins are used as resin matrices to give the mixed base material high strength and high toughness. By using styrene to modify the mixed resin matrix, the modified resin has thermal properties, which can form a three-dimensional cross-linked network on the surface of the cured adhesive, thereby improving the surface strength and wear resistance of the cured adhesive. The methods for preparing the connecting microspheres include: Styrene monomer, potassium persulfate, sodium dodecylbenzenesulfonate and deionized water were mixed, and the mass percentages of styrene monomer, potassium persulfate and sodium dodecylbenzenesulfonate in the mixed solution were 20%, 0.3% and 1.5% respectively. The mixture was stirred evenly and reacted at 75°C for 2-4 hours to obtain microspheres with a connecting particle size of 5 μm. Microspheres, acrylic acid, phenyl dimethyl ketone and ethanol were mixed, and the mass percentages of microspheres, acrylic acid and phenyl dimethyl ketone in the mixed solution were 40%, 8% and 1% respectively. The mixture was stirred evenly and irradiated under ultraviolet light with a wavelength of 365 nm for 15 min to obtain the first modified microspheres. The first modified microspheres and epoxy acrylate solution were mixed, and the mass percentage of the first modified microspheres in the resulting solution was 25%. The mixture was stirred evenly and reacted at 70°C for 2 hours to obtain the connected microspheres. The method of using UV-curable adhesives involves coating or dripping the UV-curable adhesive onto the surface of the substrate to be bonded, fixed, or encapsulated. First, heat-curing is performed on the outer side of the UV-curable adhesive at a temperature of 40°C to 50°C, causing the heat-modified resin to move towards the surface of the cured adhesive. Then, heat-curing is performed at a temperature of 75°C to 80°C, causing the modified resin to form a thermally cross-linked network structure on the surface of the cured adhesive. Afterward, the curing agent is irradiated with ultraviolet light, causing the acrylate prepolymer and acrylate monomer to form a polymer network on the surface and inside of the cured adhesive under the initiation of the first initiator, thus connecting or encapsulating the substrate. Example 2

[0020] A highly adaptable high-viscosity UV-curable adhesive and its corresponding preparation method are as follows: Acrylic ester prepolymer, acrylate monomer, first initiator, plasticizer, modified resin, second crosslinking agent, curing agent, leveling agent, synergistic wetting agent, ultraviolet absorber and connecting microsphere structure are mixed in a weight ratio of 20:10:4:5:20:2:4:2:2:1:7. The mixture is stirred and mixed evenly at 20-35℃, 300-600rpm and under inert gas protection. After vacuum degassing and degassing, a UV-curable adhesive is obtained. The first initiator in the UV-curable adhesive is 3-methyl-4-phenylbenzophenone, the plasticizer is diethylhexylbenzoate, the second crosslinking agent is vinyltriethoxysilane, the curing agent is diphenyl diisocyanate, the leveling agent is polydimethylsiloxane, the synergistic wetting agent is a phosphate ester wetting agent (e.g., dioctyl phenyl phosphate), and the ultraviolet absorber is a hydroxystyrene ketone ultraviolet absorber (e.g., 4-hydroxybenzophenone). The methods for preparing the connecting microspheres include: Styrene monomer, potassium persulfate, sodium dodecylbenzenesulfonate and deionized water were mixed, and the mass percentages of styrene monomer, potassium persulfate and sodium dodecylbenzenesulfonate in the mixed solution were 20%, 0.3% and 1.5% respectively. The mixture was stirred evenly and reacted at 75°C for 2-4 hours to obtain microspheres with a connecting particle size of 5 μm. Microspheres, acrylic acid, phenyl dimethyl ketone and ethanol were mixed, and the mass percentages of microspheres, acrylic acid and phenyl dimethyl ketone in the mixed solution were 40%, 8% and 1% respectively. The mixture was stirred evenly and irradiated under ultraviolet light with a wavelength of 365 nm for 15 min to obtain the first modified microspheres. The first modified microspheres and epoxy acrylate solution were mixed, and the mass percentage of the first modified microspheres in the resulting solution was 25%. The mixture was stirred evenly and reacted at 70°C for 2 hours to obtain the connected microspheres. The difference between Example 2 and Example 1 lies in the preparation of the modified resin. The preparation method of the modified resin in Example 2 is as follows: After adding cyclopentene to the mixed resin matrix, the mixture was stirred thoroughly to obtain a uniformly mixed matrix with a mass ratio of 20% for cyclopentene. Benzoyl peroxide and divinylbenzene are added to the mixed base material, with benzoyl peroxide accounting for 2% by mass and divinylbenzene accounting for 1.5% by mass. Under normal pressure conditions, the temperature is heated to 70℃~80℃ and maintained for 3h to modify the mixed resin matrix, thereby obtaining the modified resin. The modified initiator is at least one of benzoyl peroxide and azobisisobutyronitrile, and the modified crosslinking agent is at least one of divinylbenzene and chlorine trifluoride. The method of using UV-curable adhesives involves coating or dripping the UV-curable adhesive onto the surface of the substrate to be bonded, fixed, or encapsulated. First, heat-curing is performed on the outer side of the UV-curable adhesive at a temperature of 40°C to 50°C, causing the heat-modified resin to move towards the surface of the cured adhesive. Then, heat-curing is performed at a temperature of 75°C to 80°C, causing the modified resin to form a thermally cross-linked network structure on the surface of the cured adhesive. Afterward, the curing agent is irradiated with ultraviolet light, causing the acrylate prepolymer and acrylate monomer to form a polymer network on the surface and inside of the cured adhesive under the initiation of the first initiator, thus connecting or encapsulating the substrate. Example 3

[0021] A highly adaptable high-viscosity UV-curable adhesive and its corresponding preparation method are as follows: Acrylic ester prepolymer, acrylic ester monomer, first initiator, plasticizer, leveling agent, synergistic wetting agent and ultraviolet absorber are mixed in a weight ratio of 20:10:4:5:2:2:1 and stirred evenly at 20-35℃, 300-600rpm under inert gas protection. After vacuum degassing and degassing, a UV-curable adhesive is obtained. Compared to Example 1, Example 3 differs in that it does not contain modified resin, second crosslinking agent, curing agent, or connecting microsphere structure; The method of using the UV curing adhesive includes coating or dripping the UV curing adhesive onto the surface of the substrate to be bonded, fixed or encapsulated, and then using ultraviolet light to irradiate the curing agent, so that the acrylate prepolymer and acrylate monomer form a polymer network under the initiation of the first initiator, thereby connecting or encapsulating the substrate. Example 4

[0022] A highly adaptable high-viscosity UV-curable adhesive and its corresponding preparation method are as follows: Acrylic ester prepolymer, acrylate monomer, first initiator, plasticizer, modified resin, second crosslinking agent, curing agent, leveling agent, synergistic wetting agent, ultraviolet absorber and connecting microsphere structure are mixed in a weight ratio of 20:10:4:5:20:2:4:2:2:1:7. The mixture is stirred and mixed evenly at 20-35℃, 300-600rpm and under inert gas protection. After vacuum degassing and degassing, a UV-curable adhesive is obtained. Compared with Example 1, the difference in Example 3 lies in the preparation method of the modified resin as follows: polyester resin and polyurethane resin are mixed evenly at a mass percentage of 60%:40%, then divinylbenzene is added to the mixed resin matrix and stirred. The mixture is maintained at 70℃~80℃ for 3 hours to modify the mixed resin matrix and obtain the modified resin. The mass percentage of divinylbenzene in the mixed matrix is ​​1.5%. The method of using the UV curing adhesive includes coating or dripping the UV curing adhesive onto the surface of the substrate to be bonded, fixed or encapsulated, first performing heat curing treatment on the curing adhesive at a temperature of 75℃~80℃ to form a thermal cross-linked network structure in the curing adhesive, and then using ultraviolet light to irradiate the curing agent to form a polymer network of acrylate prepolymer and acrylate monomer under the initiation of the first initiator, thereby connecting or encapsulating the substrate. Example 5

[0023] A highly adaptable high-viscosity UV-curable adhesive and its corresponding preparation method are as follows: Acrylic ester prepolymer, acrylate monomer, first initiator, plasticizer, modified resin, second crosslinking agent, curing agent, leveling agent, synergistic wetting agent, and ultraviolet absorber are mixed in a weight ratio of 20:10:4:5:20:2:4:2:2:1. The mixture is stirred and mixed evenly at 20-35℃, 300-600rpm, and under inert gas protection. After vacuum degassing and degassing, a UV-curable adhesive is obtained. Compared with Example 1, the difference in Example 3 is that the UV-curable adhesive does not contain a connecting microsphere structure in its preparation; The method of using UV-curable adhesives involves coating or dripping the UV-curable adhesive onto the surface of the substrate to be bonded, fixed, or encapsulated. First, heat-curing is performed on the outer side of the UV-curable adhesive at a temperature of 40°C to 50°C, causing the heat-modified resin to move towards the surface of the cured adhesive. Then, heat-curing is performed at a temperature of 75°C to 80°C, causing the modified resin to form a thermally cross-linked network structure on the surface of the cured adhesive. Afterward, the curing agent is irradiated with ultraviolet light, causing the acrylate prepolymer and acrylate monomer to form a polymer network on the surface and inside of the cured adhesive under the initiation of the first initiator, thus connecting or encapsulating the substrate. Example 6

[0024] A highly adaptable high-viscosity curing adhesive and its corresponding preparation method are as follows: Plasticizer, modified resin, second crosslinking agent, curing agent, leveling agent and synergistic wetting agent are mixed in a weight ratio of 5:20:2:4:2:2. The mixture is stirred and mixed evenly at 20-35℃, 300-600rpm and under inert gas protection. After vacuum degassing and degassing, the cured adhesive is obtained. The method of using the curing adhesive includes coating or dripping the UV curing adhesive onto the surface of the substrate to be bonded, fixed, or encapsulated, and then performing a heat curing treatment on the curing adhesive at a temperature of 75℃~80℃ to form a thermal cross-linked network structure within the curing adhesive, thereby connecting or encapsulating the substrate.

[0025] Performance testing was conducted on the cured adhesives prepared in Examples 1 to 6 above. The test methods are as follows: Take an equal amount of curing adhesive and cure it under the corresponding conditions. Cut the cured sample into standard dumbbell-shaped specimens and test the tensile strength and elongation at break of the specimens. Two standard aluminum sheets were bonded together with equal amounts of cured adhesive and subjected to peel and shear strength tests. The test results are shown in the table below: Performance test results table

[0026] The test results show that by adding both photocurable and thermocurable components to the cured adhesive, a polymer network can be generated under UV catalysis, and a three-dimensional cross-linked network can be formed under thermocatalysis. This dual-network structure enhances the strength of the cured adhesive. Modification of the thermocurable component imparts thermotropic migration properties, causing the modified resin to migrate to the surface of the cured adhesive at the first thermocatalytic temperature. At the second thermocatalytic temperature, the thermocurable component forms a cross-linked network on the surface of the cured adhesive. UV photocatalysis allows the uniformly distributed photocatalytic components in the cured adhesive to generate a polymer network. This layered distribution of the network structure results in a high-strength surface layer after curing, while the inner and outer layers also possess good toughness. This balances the strength and toughness requirements, enabling the cured adhesive to be used for bonding or encapsulating substrates subjected to varying loads. Furthermore, the use of connecting microspheres to link the cross-linked and polymeric networks creates an interactive connection between the two-component networks, which further improves the strength and stability of the cured adhesive.

[0027] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within the present invention.

Claims

1. A highly adaptable, high-viscosity UV-curable adhesive, characterized in that, The UV-curable adhesive comprises: an outer composite network and an inner polymeric network; The inner polymeric network is a polymeric network formed by acrylate prepolymer, acrylate monomer, first initiator and plasticizer under ultraviolet catalytic conditions; The outer composite network includes an inner polymer network and also includes a thermally crosslinked network formed by the modified resin, the second crosslinking agent, and the curing agent under thermocatalytic conditions.

2. The highly adaptable high-viscosity UV-curable adhesive according to claim 1, characterized in that: The preparation of the modified resin includes selecting at least two monomeric resins and mixing them in a certain proportion to obtain a mixed resin matrix; The mixed resin matrix was subjected to thermal modification treatment.

3. The highly adaptable high-viscosity UV-curable adhesive according to claim 2, characterized in that: The monomer resins in the mixed resin matrix include polyester resin and polyurethane resin, and the mass percentage of the mixed polyester resin and polyurethane resin in the mixed resin matrix is ​​(40%~60%):(30%~50%).

4. The highly adaptable high-viscosity UV-curable adhesive according to claim 3, characterized in that: The heat-modification treatment of the mixed resin matrix includes... After adding styrene to the mixed resin matrix, the mixture is stirred thoroughly to obtain a uniformly mixed matrix, and the mass percentage of styrene in the mixed matrix is ​​(15% to 30%). Add a modified initiator and a modified crosslinking agent to the mixed base material, wherein the mass percentage of the modified initiator in the mixed base material is (0.5% to 3%) and the mass percentage of the modified crosslinking agent is (1% to 3%). Under normal pressure conditions, the temperature is heated to 60℃~90℃ and maintained for 2h~4h to modify the mixed resin matrix and obtain the modified resin. The modified initiator is at least one of benzoyl peroxide and azobisisobutyronitrile, and the modified crosslinking agent is at least one of divinylbenzene and chlorine trifluoride.

5. The highly adaptable high-viscosity UV-curable adhesive according to claim 3, characterized in that: The heat-modification treatment of the mixed resin matrix includes... After adding cyclopentene or cycloheptene to the mixed resin matrix and stirring thoroughly, a uniformly mixed matrix is ​​obtained, and the mass percentage of cyclopentene or cycloheptene in the mixed matrix is ​​(15% to 30%). Add a modified initiator and a modified crosslinking agent to the mixed base material, wherein the mass percentage of the modified initiator in the mixed base material is (0.5% to 3%) and the mass percentage of the modified crosslinking agent is (1% to 3%). Under normal pressure conditions, the temperature is heated to 60℃~90℃ and maintained for 2h~4h to modify the mixed resin matrix and obtain the modified resin. The modified initiator is at least one of benzoyl peroxide and azobisisobutyronitrile, and the modified crosslinking agent is at least one of divinylbenzene and chlorine trifluoride.

6. The highly adaptable high-viscosity UV-curable adhesive according to claim 4, characterized in that: The first initiator is a photoinitiator, which includes at least one of 3-methyl-4-phenylbenzophenone, ethyl 2,4,6-trimethylbenzoylphenylphosphonate, and 1-hydroxycyclohexylphenyl ketone. Plasticizers include at least one of diethylhexyl benzoate, acrylate plasticizers, and polyester plasticizers; The second crosslinking agent includes at least one of chlorine trifluoride and vinyltriethoxysilane; The curing agent includes at least one of methyl ethyl ketone peroxide, polyamide curing agents, diaminodiphenylmethane, and diphenyl diisocyanate.

7. The highly adaptable high-viscosity UV-curable adhesive according to claim 6, characterized in that: The UV-curable adhesive also includes leveling agents, synergistic wetting agents, and ultraviolet absorbers; Leveling agents include at least one of dimethyl silicone oil, polydimethylsiloxane, and organosilicon leveling agents; Synergistic wetting agents include at least one of alcohol-based wetting agents and phosphate ester-based wetting agents; Ultraviolet absorbers include at least one of hydroxystyrene-ketone ultraviolet absorbers and dibenzothiophene ultraviolet absorbers.

8. The highly adaptable high-viscosity UV-curable adhesive according to claim 7, characterized in that: The UV-curable adhesive also includes a connecting microsphere structure; The preparation of the connecting microspheres includes mixing styrene monomer, potassium persulfate, sodium dodecylbenzenesulfonate and deionized water, stirring evenly, and reacting at 70℃~85℃ for 2~4h to obtain connecting microspheres with a particle size of 1~8μm. Microspheres, acrylic acid, phenyl dimethyl ketone and ethanol were mixed and stirred evenly, and then irradiated under ultraviolet light with a wavelength of 365 nm for 10 to 25 minutes to obtain the first modified microspheres. The first modified microspheres and epoxy acrylate solution were mixed and stirred evenly, and reacted at 60℃~85℃ for 1~3h to obtain the connected microspheres.

9. A method for preparing a highly adaptable high-viscosity UV-curable adhesive, used to prepare the highly adaptable high-viscosity UV-curable adhesive as described in claim 8, characterized in that, The method for preparing the UV-curable adhesive includes mixing acrylate prepolymer, acrylate monomer, first initiator, plasticizer, modified resin, second crosslinking agent, curing agent, leveling agent, synergistic wetting agent, ultraviolet absorber and connecting microsphere structure in a weight ratio of (20-30):(10-20):(2-5):(3-6):(15-25):(1-3):(3-5):(0.5-2):(0.5-2):(5-10), stirring and mixing evenly at 20-35℃, 300-600rpm under inert gas protection, and obtaining the UV-curable adhesive after vacuum degassing and degassing.

10. A method for using a highly adaptable high-viscosity UV-curable adhesive, applicable to the highly adaptable high-viscosity UV-curable adhesive as described in claim 9, characterized in that, The method of using this UV-curable adhesive includes coating or dripping the UV-curable adhesive onto the surface of the substrate to be bonded, fixed, or encapsulated. First, heat curing is performed on the outer side of the UV-curable adhesive at a temperature of 40°C to 55°C, causing the heat-modified resin to move towards the surface of the cured adhesive. Then, heat curing is performed at a temperature of 65°C to 85°C, causing the modified resin to form a thermal cross-linked network structure on the surface of the cured adhesive. Afterward, the curing agent is irradiated with ultraviolet light, causing the acrylate prepolymer and acrylate monomer to form a polymer network on the surface and inside of the cured adhesive under the initiation of the first initiator.

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