A probe alignment detection platform

Abstract

The application discloses a kind of probe alignment detection platform, to provide a kind of simple structure, can realize continuous feeding detection, and can accurately identify the probe alignment detection platform of test point position on the workpiece to be detected, material incoming angle and probe position by visual positioning mechanism.This application includes bearing module and probe module, the bearing module includes rotating module, plum blossom turntable and product fixture, the lower end middle part of plum blossom turntable is connected with the movable end of rotating module, and several product fixtures are respectively arranged on the corresponding support end of plum blossom turntable upper surface, the product on the product fixture of plum blossom turntable lower needle position is matched with the probe end of probe module.This application is applied to the technical field of product testing.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of product testing, and particularly relates to a probe alignment detection platform. BACKGROUND

[0002] With the rapid development of electronic, semiconductor, optoelectronic and other industries, products are evolving towards miniaturization, integration and high complexity. Semiconductor products are often used in power generation engineering management or other new energy engineering technology research and experimental development engineering and technology research and experimental development. In the semiconductor field, wafer size is continuously increasing, and the size of pins and solder points on chips is continuously decreasing, with the pitch decreasing from millimeter level to micron level or even sub-micron level. In the optoelectronic and display field, the pixel density of OLED / TFT-LCD panels continues to increase, and the size of LED chips decreases from millimeter level to micron level. In the PCB and electronic packaging field, the line width and pitch of high-density interconnection PCBs have been reduced to below 50 μm, and the pitch of solder points of BGA, CSP and other packaging forms is extremely small. For small-sized materials, especially in the semiconductor industry, such as small die or other semiconductor chip production and detection equipment, detection precision and speed directly determine the production precision and efficiency of the entire equipment.

[0003] Current probe alignment detection is mainly divided into two types: traditional manual alignment detection and semi-automatic mechanical alignment detection. The overall precision of traditional manual alignment detection is low, which needs to rely on the experience and naked eye observation of the operator, and cannot meet the detection needs of micron and sub-micron test points. Moreover, a single station can only complete tens of alignment per hour, and the efficiency is low. The positioning accuracy of semi-automatic mechanical alignment detection is limited, mainly relying on mechanical positioning (such as positioning pins and reference holes), and the precision depends on the machining tolerance. For products without fixed reference or prone to deformation, such as special-shaped devices and flexible substrates (such as flexible OLED), it is difficult to achieve accurate alignment, and the application range is limited. Moreover, manual intervention is still needed. If a probe alignment detection platform with simple structure, continuous feeding detection, and accurate identification of test point position on the workpiece to be detected, material incoming angle and probe position through a visual positioning mechanism can be designed, the above problems can be solved. SUMMARY

[0004] The technical problem to be solved by the present application is to overcome the shortcomings of the prior art, and to provide a probe alignment detection platform with simple structure, continuous feeding detection, and accurate identification of test point position on the workpiece to be detected, material incoming angle and probe position through a visual positioning mechanism.

[0005] The technical scheme adopted by the present application is: the present application comprises a bearing module and a probe module, the bearing module comprises a rotating module, a plum blossom turntable and a product fixture, the lower middle part of the plum blossom turntable is connected with the movable end of the rotating module, a plurality of product fixtures are arranged on the corresponding support end of the upper end face of the plum blossom turntable, and the probe end of the probe module is matched with the product on the product fixture at the lower needle position of the plum blossom turntable.

[0006] Further, the probe module comprises a base, a multi-axis alignment table, an annular support plate and a plurality of probe modules, the base is arranged on one side of the bearing module, the multi-axis alignment table is arranged on the upper end face of the base, the annular support plate is connected with the movable end of the multi-axis alignment table, and a plurality of groups of the probe modules are arranged on one side of the annular support plate and matched with the products on the product fixtures.

[0007] Further, the probe module comprises an adjusting table, a probe support arm, a probe plate and a probe, the support end of the probe support arm is connected with the annular support plate through the adjusting table, the probe plate is connected with the other end of the probe support arm, and the probe is connected with the end part of the probe plate.

[0008] Further, the upper end face of the probe plate is provided with a probe adjusting block, and the probe is matched with the probe plate through the probe adjusting block.

[0009] Further, the adjusting table comprises an X-axis adjusting block, a Y-axis adjusting block and a Z-axis adjusting block, the Y-axis adjusting block is connected with the movable end of the X-axis adjusting block, the Z-axis adjusting block is connected with the movable end of the Y-axis adjusting block, and the probe support arm is connected with the movable end of the Z-axis adjusting block.

[0010] Further, a visual positioning module is arranged between the bearing module and the probe module, the visual positioning module comprises a visual positioning support, a visual positioning camera and a light source, the visual positioning camera is arranged on the upper end of the visual positioning support and matched with the product fixture at the lower needle position of the plum blossom turntable.

[0011] Further, the plum blossom turntable is provided with a plurality of suction nozzles, and the plurality of suction nozzles are matched with the corresponding product fixtures.

[0012] Further, a buffer spring is arranged between the support end and the lifting end of the multi-axis alignment table.

[0013] The beneficial effects of this invention are as follows: This application, through a visual positioning mechanism combined with advanced image algorithms, can achieve micron-level or even sub-micron-level position recognition accuracy and precise angle recognition. The carrier is placed on a high-precision DDR motor turntable, achieving material control accuracy of ±0.001°. The positioning accuracy of the UVW alignment platform is less than 1 micron, and the voice coil module can achieve force control accuracy of ±0.1g. Ultimately, the alignment error is controlled within ±2μm. The voice coil module's force control accuracy of ±0.1g effectively addresses material inlet angle deviations, far exceeding the accuracy of traditional manual and semi-automatic alignment. This meets the inspection needs of micron-level process products in semiconductor, optoelectronic, and other fields, realizing a transition from "manual intervention" to "fully automatic alignment." The transformation of the rotary carrier mechanism enables continuous feeding and inspection, reducing the alignment time of a single device from minutes in traditional manual methods to seconds or even milliseconds. It can complete the alignment inspection of hundreds to thousands of devices per hour, greatly improving production efficiency and adapting to large-scale mass production scenarios. The vision positioning mechanism can identify test points and incoming angles on different types and sizes of workpieces to be inspected. The carrier adopts vacuum adsorption, which can adapt to various sizes of chips. The rotary carrier mechanism, combined with high-precision angle control, can effectively cope with incoming angle deviations. Whether it is a regular chip or a flexible substrate, it can achieve accurate alignment, solving the problem of poor adaptability of traditional semi-automatic alignment. Moreover, the overall module is standardized, which can quickly switch between different products and different production needs, meeting the production compatibility of different sizes and types of products. Attached Figure Description

[0014] Figure 1 This is a perspective view of the present invention;

[0015] Figure 2 This is a three-dimensional view of the supporting module;

[0016] Figure 3 This is a three-dimensional view of the probe module;

[0017] Figure 4 This is a three-dimensional view of the probe module;

[0018] Figure 5 This is a stereoscopic view of the visual positioning module. Detailed Implementation

[0019] like Figures 1 to 4As shown, in this embodiment, the present invention includes a support module 1 and a probe module 2. The support module 1 includes a rotating module 11, a swivel turntable 12, and a product fixture 13. The lower center of the swivel turntable 12 is connected to the movable end of the rotating module 11. Several product fixtures 13 are respectively disposed at corresponding support ends on the upper surface of the swivel turntable 12. The probe end of the probe module 2 cooperates with the product on the product fixture 13 at the lower needle position of the swivel turntable 12. Therefore, the support module 1 adopts a layered and specialized structure. The bottom layer is a DDR motor base plate, used to mount and fix the DDR motor on the structural plane. Above the base plate is a high-precision DDR motor, supporting 360° rotation and providing high precision. A turntable is fixed on the motor, and the turntable is divided into eight stations. Each station is equipped with a uniform carrier. The plane of the carrier on the eight stations is measured by a dial indicator to confirm that the carriers on the eight stations are at the same height. This is used as the Z-axis height reference of the probe automatic alignment detection platform. The probe module 2 is aligned with the product on the product fixture 13 and realizes the needle conduction test. The structure is simple and the detection efficiency is higher.

[0020] like Figure 1 and Figure 3 As shown, in this embodiment, the probe module 2 includes a base 3, a multi-axis alignment stage 4, an annular support plate 5, and several probe modules 6. The base 3 is disposed on one side of the bearing module 1, the multi-axis alignment stage 4 is disposed on the upper surface of the base 3, the annular support plate 5 is connected to the movable end of the multi-axis alignment stage 4, and several sets of probe modules 6 are disposed on one side of the annular support plate 5 and cooperate with the product on the product fixture 13. Thus, the probe module 2 also adopts a layered and specialized structure. The bottom layer is the UVW alignment platform, which allows all probes on the entire probe mechanism to be adjusted in the X-axis direction, Y-axis position, and Z-axis direction. It also allows for angle adjustment centered on the material, maintaining relatively high freedom and accuracy. Furthermore, it enables control of the downward pressure of the probes during detection, minimizing damage to the material and ensuring consistent detection.

[0021] like Figure 4 As shown, in this embodiment, the probe module 6 includes an adjustment platform 61, a probe support arm 62, a probe plate 63, and a probe 64. The support end of the probe support arm 62 is connected to the annular support plate 5 via the adjustment platform 61. The probe plate 63 is connected to the other end of the probe support arm 62, and the probe 64 is connected to the end of the probe plate 63. Therefore, the probe 64 is designed to be laterally bent, and it possesses a certain degree of elasticity, preventing overpressure during the downward pressing process.

[0022] like Figure 4As shown, in this embodiment, a probe adjustment block 65 is provided on the upper surface of the probe plate 63, and the probe 64 cooperates with the probe plate 63 through the probe adjustment block 65. Therefore, the probe adjustment block 65 can adjust the extension distance of the probe 64 to better adapt to products of different specifications and sizes for probe pressure testing.

[0023] like Figure 4 As shown, in this embodiment, the adjustment stage 61 includes an X-axis adjustment block 611, a Y-axis adjustment block 612, and a Z-axis adjustment block 613. The Y-axis adjustment block 612 is connected to the movable end of the X-axis adjustment block 611, and the Z-axis adjustment block 613 is connected to the movable end of the Y-axis adjustment block 612. The probe support arm 62 is connected to the movable end of the Z-axis adjustment block 613. Therefore, the adjustment stage 61 can make minor adjustments to a single probe along the X, Y, and Z axes to accommodate differences in test points for different materials. This three-dimensional fine-tuning mechanism is only adjusted when changing materials or probes. During mass production, the three-dimensional fine-tuning mechanism is locked and no longer changed.

[0024] like Figure 1 and Figure 5 As shown, in this embodiment, a visual positioning module 7 is provided between the carrier module 1 and the probe module 2. The visual positioning module 7 includes a visual positioning bracket 71, a visual positioning camera 72, and a light source 73. The visual positioning camera 72 is located on the upper end of the visual positioning bracket 71 and cooperates with the product fixture 13 at the lower needle position of the gyroscopic turntable 12. Therefore, the visual positioning module 7 consists of a camera base plate, a camera stand plate, adjusting screws, and the camera. Its structure is relatively simple, but its reliability and applicability are high. The adjusting camera base plate is mechanically fixed in the installation position, and the camera height is adjusted by manually rotating the adjusting screws, ensuring that the carrier on the turntable working position is within the field of view, the focus is accurate, and the captured material image is clear.

[0025] like Figure 2 As shown, in this embodiment, the plum blossom turntable 12 is provided with a plurality of suction nozzles 8, which cooperate with the corresponding product fixtures 13. Therefore, the plurality of suction nozzles 8 can stably adsorb the product onto the product fixtures 13.

[0026] like Figure 1 As shown, in this embodiment, a buffer spring 9 is provided between the support end and the lifting end of the multi-axis alignment stage 4. Therefore, the buffer spring 9 provides a buffering effect during the lifting and lowering process of the multi-axis alignment stage 4.

[0027] The working principle of this invention is as follows: During operation, the workpiece to be inspected is first placed on the product fixture 13 at the loading position and fixed. The rotating turntable 12 then transports the workpiece to the inspection station. Next, the central processing unit controls the vision positioning module 7 to begin operation. The vision positioning module 7 captures images of the workpiece, identifies the position information of the test point and the material inlet angle, and transmits this information to the central processing unit. The central processing unit processes the acquired position information of the test point and probe, as well as the inlet angle information, using an image algorithm module to calculate the positional deviation and the required angular deviation. Then, based on the calculated deviation, the central processing unit controls the motion control mechanism to drive the probe mechanism through the multi-axis alignment stage 4 to achieve high-precision translation and rotation adjustment, allowing the probe to gradually approach and accurately align with the test point. During the alignment process, the vision positioning module 7 monitors the position and angle of the probe and test point in real time and feeds this information back to the central processing unit. The central processing unit makes real-time adjustments based on the feedback information to ensure appropriate alignment accuracy, angle, and contact force. After alignment, the probe 64 contacts the test point to perform the detection. The detection information is displayed through the human-machine interface. After the detection is completed, all components are reset, and the gyroscopic turntable 12 rotates one station angle. By repeating the above steps, multi-directional alignment and needle insertion detection of the product can be achieved.

[0028] Although the embodiments of the present invention are described with reference to actual solutions, they do not constitute a limitation on the meaning of the present invention. Modifications to the embodiments and combinations with other solutions based on this specification will be obvious to those skilled in the art.

Claims

1. A probe alignment detection platform, comprising a carrier module (1) and a probe module (2), characterized in that: The bearing module (1) comprises a rotating module (11), a plum blossom turntable (12) and a product fixture (13), the plum blossom turntable (12) is connected with the movable end of the rotating module (11) at the middle of the lower end, a plurality of product fixtures (13) are arranged on the corresponding supporting end of the upper end face of the plum blossom turntable (12), and the probe end of the probe module (2) is matched with the product on the product fixture (13) at the lower needle position of the plum blossom turntable (12).

2. The probe alignment detection platform of claim 1, wherein: The upper end face of the probe plate (63) is provided with a probe adjusting block (65), and the probe (64) is matched with the probe plate (63) through the probe adjusting block (65).

3. The probe alignment detection platform of claim 1, wherein: The visual positioning module (7) comprises a visual positioning support (71), a visual positioning camera (72) and a light source (73), the visual positioning camera (72) is arranged on the upper end of the visual positioning support (71) and matched with the product fixture (13) at the lower needle position of the plum blossom turntable (12).

4. The probe alignment detection platform of claim 1, wherein: The plum blossom turntable (12) is provided with a plurality of suction nozzles (8), and a plurality of suction nozzles (8) are matched with the corresponding product fixture (13).

5. The probe alignment detection platform of claim 1, wherein: The buffer spring (9) is arranged between the supporting end and the lifting end of the multi-axis alignment table (4).

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