Packaging mold for semiconductor production

Abstract

The invention discloses a packaging mold for semiconductor production, and relates to the technical field of packaging molds, the packaging mold comprises a device body, the device body is fixedly connected with a side plate, the surface of the side plate is fixedly connected with a console, the device body is provided with a supporting plate, the top surface of the supporting plate is fixedly connected with a lower mold base, and the lower mold base is fixedly connected with an upper mold. A partition strip is fixedly connected to the interior of the lower die base. The device further comprises a lifting assembly, a packaging assembly and a film sealing assembly, the lifting assembly is arranged on the device body for cooperative use, the packaging assembly is arranged on the supporting plate for cooperative use, and the film sealing assembly is arranged on the side plate for cooperative use. The packaging device is reasonable in structure, the whole carrying plate is moved upwards through the lifting assembly, and then the packaging assembly and the film sealing assembly are used for conveniently conducting film sealing work on the integrated circuit board in the partition strip.

Description

Technical Field

[0001] This invention relates to the field of packaging mold technology, and in particular to a packaging mold for semiconductor production. Background Technology

[0002] An integrated circuit (IC) is a method of miniaturizing circuits (mainly including semiconductor devices, but also passive components). Using specific processes, transistors, resistors, capacitors, inductors, and other components required for a circuit, along with interconnecting wiring, are fabricated on one or several small pieces of semiconductor wafers or dielectric substrates, and then packaged in a casing to form a miniature structure with the required circuit function. All components are structurally integrated into a whole, representing a significant step forward in the miniaturization, low power consumption, intelligence, and high reliability of electronic components.

[0003] Chinese Invention Patent Publication No. CN116142555A discloses a loading workbench for semiconductor molding compound, comprising a frame; a filter frame, horizontally mounted on the frame and used to support a collection box and packaging molds; a guiding cavity, located below the filter frame and collecting powder falling from the filter frame; a powder bucket, located below the guiding cavity and receiving powder flowing from the guiding cavity; and a powder cleaning mechanism, mounted on the filter frame and used to clean the powder from the filter frame and the guiding cavity into the powder bucket. This invention solves the problem in existing technologies where powder easily spills onto the workbench, causing inconvenience for manual operation and affecting the working environment. While the aforementioned patent addresses the issue of a large amount of powder generated during semiconductor processing through a powder cleaning mechanism, existing semiconductors also include integrated circuit boards. In the encapsulation of these circuit boards, current encapsulation methods rely on robotic arms to pick up the integrated circuit boards and use upper and lower molds for encapsulation. These upper and lower molds are mostly controlled separately, making operation very cumbersome. Summary of the Invention

[0004] The purpose of this application is to provide a packaging mold for semiconductor production, which realizes the upward movement of the entire carrier board by lifting components, and then facilitates the sealing of the integrated circuit board inside the partition strip by packaging components and sealing components.

[0005] To achieve the above objectives, this application provides the following technical solution: a packaging mold for semiconductor production, comprising a device body, a side plate fixedly connected to the device body, a control console fixedly connected to the surface of the side plate, a tray provided on the device body, a lower mold base fixedly connected to the top surface of the tray, and a partition strip fixedly connected inside the lower mold base; further comprising a lifting component, a packaging component, and a sealing component, wherein the lifting component is disposed on the device body for cooperative use, the packaging component is disposed on the tray for cooperative use, and the sealing component is disposed on the side plate for cooperative use.

[0006] Preferably, the lifting assembly includes a base fixedly mounted on the device body, a crossbar rotatably connected to the base, arm plates fixedly connected to both ends of the crossbar, and a pulley fixedly connected to the other end of the arm plate.

[0007] Preferably, a sleeve is fixedly connected to the middle position of the crossbar, and a pair of linkage plates are fixedly connected to the sleeve. The pair of linkage plates are provided with sliding grooves, and a sliding rod is slidably connected inside the sliding grooves. The sliding rod is fixedly connected to a telescopic cylinder, and the other end of the telescopic cylinder is rotatably connected to a docking seat. The bottom end of the docking seat is fixedly connected to the main body of the device.

[0008] Preferably, a carrying plate is provided at the top of the base, guide plates are fixedly connected to both sides of the carrying plate, the guide plates are slidably connected to the positioning rod, the bottom end of the positioning rod is fixedly connected to the base plate, the base plate is fixedly installed on the device body, a collar is fixedly connected to the top of the positioning rod, a first spring is sleeved on the positioning rod, and clamping plates are fixedly connected to both sides of the carrying plate. Guide grooves are opened on the clamping plates, and the pulleys are slidably connected inside the guide grooves.

[0009] Preferably, the packaging assembly includes a tray fixedly mounted on the carrier plate, a pair of first bearings fixedly connected to both sides of the tray, a rod rotatably connected to the pair of first bearings, retaining rings fixedly connected to both ends of the rod, and a second spring sleeved on the rod, with both ends of the second spring fixedly connected to one side of the first bearing and one side of the retaining ring, respectively.

[0010] Preferably, a pair of first limiting plates are fixedly connected to the rod body, and a limiting roller is rotatably connected to the other end of the pair of first limiting plates. A pair of second bearings are fixedly connected to the bottom surface of the support plate, and a first take-up roller is rotatably connected between the pair of second bearings. One end of the first take-up roller is fixedly connected to the output end of the first motor, and the first motor is fixedly mounted on the second bearing.

[0011] Preferably, the sealing assembly includes a bracket fixedly connected to the middle position of one side of the carrier plate, a first toothed plate fixedly connected to the bracket, a gear meshing on the first toothed plate, the gear being rotatably connected to a third shaft seat, and the third shaft seat being fixedly connected to the side plate.

[0012] Preferably, the gear has a second toothed plate meshing with it, the top end of the second toothed plate is fixedly connected to a docking frame, the other end of the docking frame is fixedly connected to a top plate, and the bottom surface of the top plate is fixedly connected to an upper mold base.

[0013] Preferably, hinge seats are fixedly connected to both sides of the top end of the top plate, and second limiting plates are fixedly connected to both ends of the hinge seats. A second take-up roller is rotatably connected to the second limiting plate, one end of the second take-up roller is fixedly connected to the output end of the second motor, and the second motor is fixedly mounted on the second limiting plate.

[0014] Preferably, a pair of insert rods are fixedly connected to the top of the top plate, a top ring is fixedly connected to the top of the pair of insert rods, a third spring is sleeved on the insert rod, the insert rod is slidably connected to the bracket, and the other end of the bracket is fixedly connected to the side plate.

[0015] In summary, the present invention has the following beneficial effects: The present invention has a reasonable structure. When it is necessary to move the carrying plate upward, the telescopic cylinder pushes the slide rod, and then the slide rod slides inside the slide groove, causing the sleeve on the linkage plate to drive the crossbar to rotate. The two ends of the crossbar are fixedly connected to the arm plate. The rotation of the crossbar drives the pulley on the arm plate to slide inside the guide groove, thereby facilitating the upward movement of the carrying plate. The movement of the carrying plate causes the guide plate to slide on the positioning rod, increasing the stability of the movement of the carrying plate.

[0016] In this invention, the integrated circuit board to be packaged is placed inside the partition strip. A pair of first take-up rollers are provided, one of which has a packaging film wound on it. The packaging film is attached to the limiting roller through the top of the partition strip and fixedly connected to the other first take-up roller. After the packaging film is packaged, the first motor is used to make the first take-up rollers wind up the packaging film.

[0017] In this invention, when the carrier plate moves upward, the movement of the carrier plate causes the first toothed plate on the bracket to drive the gear to rotate. The rotation of the gear drives the second toothed plate to move. The second toothed plate drives the top plate to move downward through the docking frame. An upper mold base is fixedly connected to the bottom surface of the top plate. The upward movement of the carrier plate and the downward movement of the upper mold base facilitate the encapsulation of the integrated circuit board inside the partition strip. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the three-dimensional structure of the device body; Figure 2 This is a side view of the three-dimensional structure of the device body; Figure 3 This is a three-dimensional structural diagram of the device body viewed from below. Figure 4 This is a schematic diagram of the three-dimensional structure of the carrier plate; Figure 5 A schematic diagram of the three-dimensional structure of the carrier plate viewed from below; Figure 6 This is a schematic diagram of the three-dimensional structure of the pallet; Figure 7 This is a schematic diagram of the three-dimensional structure of the top plate.

[0020] In the diagram: 1. Device body; 101. Side plate; 102. Control console; 103. Support plate; 104. Lower mold base; 105. Partition strip; 2. Base; 201. Crossbar; 202. Arm plate; 203. Pulley; 204. Sleeve; 205. Linkage plate; 206. Slide groove; 207. Slide rod; 208. Telescopic cylinder; 209. Docking seat; 3. Loading plate; 301. Guide plate; 302. Positioning rod; 303. Base plate; 304. Collar; 305. First spring; 306. Clamping plate; 307. Guide groove; 4. First shaft seat; 401. Rod 402. Body; 403. Snap ring; 404. Second spring; 405. First limiting plate; 406. Limiting roller; 407. Second shaft seat; 408. First take-up roller; 409. First motor; 500. Bracket; 501. First toothed plate; 502. Gear; 503. Third shaft seat; 504. Second toothed plate; 505. Connecting frame; 506. Top plate; 507. Upper mold base; 508. Hinge seat; 509. Second limiting plate; 510. Second take-up roller; 511. Second motor; 512. Insert rod; 513. Top ring; 514. Third spring; 515. Bracket. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Example: Reference Figure 1 - Figure 7 The illustrated packaging mold for semiconductor production includes a device body 1, a side plate 101 fixedly connected to the device body 1, a control console 102 fixedly connected to the surface of the side plate 101, a tray 103 provided on the device body 1, a lower mold base 104 fixedly connected to the top surface of the tray 103, and a partition strip 105 fixedly connected inside the lower mold base 104; it also includes a lifting component, a packaging component, and a sealing component. The lifting component is disposed on the device body 1 for use, the packaging component is disposed on the tray 103 for use, and the sealing component is disposed on the side plate 101 for use.

[0023] Specifically, it should be noted that the control console 102, the first motor 408, and the second motor 511 are electrically connected by wires. The specific details of their connection are based on existing technology and will not be elaborated on here. When packaging the integrated circuit board, the integrated circuit board is placed inside the partition strip 105. At this time, the partition strip 105 is lined with a packaging film, and the heating and packaging work is carried out by the downward pressure of the top plate 506.

[0024] In one embodiment of this invention, the lifting assembly includes a base 2 fixedly mounted on the device body 1. A crossbar 201 is rotatably connected to the base 2. Arm plates 202 are fixedly connected to both ends of the crossbar 201, and a pulley 203 is fixedly connected to the other end of the arm plates 202. A sleeve 204 is fixedly connected to the middle of the crossbar 201. A pair of linkage plates 205 are fixedly connected to the sleeve 204. A sliding groove 206 is provided on the pair of linkage plates 205. A sliding rod 207 is slidably connected inside the sliding groove 206. The sliding rod 207 is fixedly connected to a telescopic cylinder 208, and the other end of the telescopic cylinder 208 is rotatably connected to a docking seat 2. On the 09, the bottom end of the docking seat 209 is fixedly connected to the device body 1. The top position of the base 2 is provided with a carrying plate 3. The two sides of the carrying plate 3 are fixedly connected with guide plates 301. The guide plates 301 are slidably connected to the positioning rod 302. The bottom end of the positioning rod 302 is fixedly connected to the base plate 303. The base plate 303 is fixedly installed on the device body 1. The top end of the positioning rod 302 is fixedly connected with a collar 304. A first spring 305 is sleeved on the positioning rod 302. The two sides of the carrying plate 3 are fixedly connected with clamping plates 306. The clamping plates 306 are provided with guide grooves 307. The inside of the guide grooves 307 is slidably connected with pulleys 203.

[0025] Specifically, when the loading plate 3 needs to be moved upward, the telescopic cylinder 208 pushes the slide rod 207, and then the slide rod 207 slides inside the slide groove 206, causing the sleeve 204 on the linkage plate 205 to drive the crossbar 201 to rotate. The two ends of the crossbar 201 are fixedly connected to the arm plate 202. The rotation of the crossbar 201 drives the pulley 203 on the arm plate 202 to slide inside the guide groove 307, thereby facilitating the upward movement of the loading plate 3. The movement of the loading plate 3 causes the guide plate 301 to slide on the positioning rod 302, increasing the stability of the movement of the loading plate 3.

[0026] As one embodiment of this invention, the packaging assembly includes a tray 103 fixedly mounted on a carrier plate 3. A pair of first bearing seats 4 are fixedly connected to both sides of the tray 103. A rod 401 is rotatably connected to the pair of first bearing seats 4. A retaining ring 402 is fixedly connected to both ends of the rod 401. A second spring 403 is sleeved on the rod 401. The two ends of the second spring 403 are fixedly connected to one side of the first bearing seat 4 and one side of the retaining ring 402, respectively. A pair of first limiting plates 404 are fixedly connected to the rod 401. A limiting roller 405 is rotatably connected to the other end of the pair of first limiting plates 404. A pair of second bearing seats 406 are fixedly connected to the bottom surface of the tray 103. A first take-up roller 407 is rotatably connected between the pair of second bearing seats 406. One end of the first take-up roller 407 is fixedly connected to the output end of a first motor 408. The first motor 408 is fixedly mounted on the second bearing seats 406.

[0027] Specifically, the integrated circuit board to be packaged is placed inside the partition strip 105. A pair of first take-up rollers 407 are provided. One of the first take-up rollers 407 has a packaging film wound on it. The packaging film is attached to the limiting roller 405 through the top of the partition strip 105 and fixedly connected to the other first take-up roller 407. After the packaging film is packaged, the first take-up roller 407 is wound up by the operation of the first motor 408.

[0028] In one embodiment of this invention, the sealing assembly includes a bracket 5 fixedly connected to the middle of one side of the carrier plate 3. A first toothed plate 501 is fixedly connected to the bracket 5, and a gear 502 meshes with the first toothed plate 501. The gear 502 is rotatably connected to a third shaft seat 503, which is fixedly connected to the side plate 101. A second toothed plate 504 meshes with the gear 502. A docking frame 505 is fixedly connected to the top end of the second toothed plate 504, and the other end of the docking frame 505 is fixedly connected to a top plate 506. An upper mold base 507 is fixedly connected to the bottom surface of the top plate 506. The top ends of the top plate 506 are connected to both sides of the mold base 507. A hinge seat 508 is fixedly connected to the position. A second limiting plate 509 is fixedly connected to both ends of the hinge seat 508. A second take-up roller 510 is rotatably connected to the second limiting plate 509. One end of the second take-up roller 510 is fixedly connected to the output end of the second motor 511. The second motor 511 is fixedly installed on the second limiting plate 509. A pair of insert rods 512 are fixedly connected to the top end of the top plate 506. A top ring 513 is fixedly connected to the top end of the pair of insert rods 512. A third spring 514 is sleeved on the insert rods 512. The insert rods 512 are slidably connected to the bracket 515. The other end of the bracket 515 is fixedly connected to the side plate 101.

[0029] Specifically, when the carrier plate 3 moves upward, the movement of the carrier plate 3 causes the first toothed plate 501 on the bracket 5 to drive the gear 502 to rotate. The rotation of the gear 502 drives the second toothed plate 504 to move. The second toothed plate 504 drives the top plate 506 to move downward as a whole through the docking frame 505. An upper mold base 507 is fixedly connected to the bottom surface of the top plate 506. The upward movement of the carrier plate 3 and the downward movement of the upper mold base 507 facilitate the encapsulation of the integrated circuit board inside the partition strip 105.

[0030] The working principle of this invention is as follows: When it is necessary to move the carrying plate 3 upward, the telescopic cylinder 208 pushes the sliding rod 207, and then the sliding rod 207 slides inside the sliding groove 206, so that the sleeve 204 on the linkage plate 205 drives the crossbar 201 to rotate. The two ends of the crossbar 201 are fixedly connected to the arm plate 202. The rotation of the crossbar 201 drives the pulley 203 on the arm plate 202 to slide inside the guide groove 307, thereby facilitating the upward movement of the carrying plate 3. The movement of the carrying plate 3 causes the guide plate 301 to slide on the positioning rod 302, increasing the stability of the movement of the carrying plate 3. The integrated circuit board to be packaged is placed inside the partition strip 105. A pair of first take-up rollers 407 are provided. One of the first take-up rollers 407 has a packaging film wound on it. The packaging film is attached to the limiting roller 405 through the top of the partition strip 105 and fixedly connected to the other first take-up roller 407. After the packaging film is packaged, the first take-up roller 407 is wound up by the operation of the first motor 408. When the carrier plate 3 moves upward, the movement of the carrier plate 3 causes the first toothed plate 501 on the bracket 5 to drive the gear 502 to rotate. The rotation of the gear 502 drives the second toothed plate 504 to move. The second toothed plate 504 drives the top plate 506 to move downward through the docking frame 505. The upper mold base 507 is fixedly connected to the bottom surface of the top plate 506. The upward movement of the carrier plate 3 and the downward movement of the upper mold base 507 facilitate the encapsulation of the integrated circuit board inside the partition strip 105.

[0031] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A packaging mold for semiconductor manufacturing, characterized in that, include: The device body (1) has a side plate (101) fixedly connected to it, a control console (102) fixedly connected to the surface of the side plate (101), a support plate (103) provided on the device body (1), a lower mold base (104) fixedly connected to the top surface of the support plate (103), and a partition strip (105) fixedly connected inside the lower mold base (104). It also includes a lifting assembly, a packaging assembly and a sealing assembly. The lifting assembly is disposed on the device body (1) for use, the packaging assembly is disposed on the pallet (103) for use, and the sealing assembly is disposed on the side plate (101) for use.

2. A packaging mold for semiconductor production according to claim 1, characterized in that: The lifting assembly includes a base (2) fixedly installed on the device body (1), a crossbar (201) rotatably connected to the base (2), arm plates (202) fixedly connected to both ends of the crossbar (201), and a pulley (203) fixedly connected to the other end of the arm plate (202).

3. A packaging mold for semiconductor production according to claim 2, characterized in that: A sleeve (204) is fixedly connected to the middle of the crossbar (201). A pair of linkage plates (205) are fixedly connected to the sleeve (204). A sliding groove (206) is provided on the pair of linkage plates (205). A sliding rod (207) is slidably connected inside the sliding groove (206). The sliding rod (207) is fixedly connected to the telescopic cylinder (208). The other end of the telescopic cylinder (208) is rotatably connected to the docking seat (209). The bottom end of the docking seat (209) is fixedly connected to the device body (1).

4. A packaging mold for semiconductor production according to claim 3, characterized in that: A carrying plate (3) is provided at the top of the base (2). Guide plates (301) are fixedly connected to both sides of the carrying plate (3). The guide plates (301) are slidably connected to the positioning rod (302). The bottom end of the positioning rod (302) is fixedly connected to the base plate (303). The base plate (303) is fixedly installed on the device body (1). A collar (304) is fixedly connected to the top of the positioning rod (302). A first spring (305) is sleeved on the positioning rod (302). A clamping plate (306) is fixedly connected to both sides of the carrying plate (3). A guide groove (307) is opened on the clamping plate (306). The pulley (203) is slidably connected inside the guide groove (307).

5. A packaging mold for semiconductor production according to claim 4, characterized in that: The packaging assembly includes a tray (103) fixedly mounted on the carrier plate (3). A pair of first bearings (4) are fixedly connected to both sides of the tray (103). A rod (401) is rotatably connected to the pair of first bearings (4). A retaining ring (402) is fixedly connected to both ends of the rod (401). A second spring (403) is sleeved on the rod (401). The two ends of the second spring (403) are fixedly connected to one side of the first bearing (4) and one side of the retaining ring (402), respectively.

6. A packaging mold for semiconductor production according to claim 5, characterized in that: A pair of first limiting plates (404) are fixedly connected to the rod body (401). The other end of the pair of first limiting plates (404) is rotatably connected to a limiting roller (405). A pair of second bearings (406) are fixedly connected to the bottom surface of the support plate (103). A first take-up roller (407) is rotatably connected between the pair of second bearings (406). One end of the first take-up roller (407) is fixedly connected to the output end of the first motor (408). The first motor (408) is fixedly installed on the second bearing (406).

7. A packaging mold for semiconductor production according to claim 4, characterized in that: The sealing assembly includes a bracket (5) fixedly connected to the middle of one side of the carrier plate (3). A first toothed plate (501) is fixedly connected to the bracket (5). A gear (502) meshes on the first toothed plate (501). The gear (502) is rotatably connected to a third shaft seat (503). The third shaft seat (503) is fixedly connected to the side plate (101).

8. A packaging mold for semiconductor production according to claim 7, characterized in that: The gear (502) is meshed with a second toothed plate (504), and a docking frame (505) is fixedly connected to the top of the second toothed plate (504). The other end of the docking frame (505) is fixedly connected to the top plate (506), and an upper mold base (507) is fixedly connected to the bottom surface of the top plate (506).

9. A packaging mold for semiconductor production according to claim 8, characterized in that: The top plate (506) has hinge seats (508) fixedly connected to both sides of the top end. The hinge seats (508) have second limiting plates (509) fixedly connected to both ends. The second limiting plates (509) have a second take-up roller (510) rotatably connected to the second limiting plates (509). One end of the second take-up roller (510) is fixedly connected to the output end of the second motor (511). The second motor (511) is fixedly installed on the second limiting plates (509).

10. A packaging mold for semiconductor production according to claim 9, characterized in that: A pair of insert rods (512) are fixedly connected to the top of the top plate (506), and a top ring (513) is fixedly connected to the top of the pair of insert rods (512). A third spring (514) is sleeved on the insert rod (512). The insert rod (512) is slidably connected to the bracket (515), and the other end of the bracket (515) is fixedly connected to the side plate (101).

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