A positioning device for wafer precision marking equipment

Abstract

The application discloses a positioning device for wafer precision marking equipment and relates to the technical field of wafer processing and production. The positioning device for wafer precision marking equipment comprises a base frame, the top of the base frame is fixedly connected with a fixed frame, a suction slot is formed in the fixed frame, a main circular plate and a circular frame for adjusting the position of a wafer are arranged in the base frame, a main clamping rod and a position stop plate for pushing the wafer to the marking position are arranged in the fixed frame, a No.1 clamping block for providing power for the main clamping rod is arranged in the fixed frame, and the wafer is pressed downward when the processed wafer stays on the upper surface of the rubber suction cup, so that the edge of the processed wafer that cannot be attached to the rubber suction cup due to warping is in contact with the rubber surface. At this time, the gas in the rubber suction cup is sucked away through the suction slot through the suction mechanism, so that the processed wafer is stably attached to the surface of each rubber suction cup.

Description

Technical Field

[0001] This invention relates to the field of wafer processing and manufacturing technology, specifically to a positioning device for precision wafer marking equipment. Background Technology

[0002] Precision wafer marking equipment is a high-precision processing device used in semiconductor manufacturing. It is mainly used to make permanent marks on the surface of wafers, such as laser marking or mechanical engraving, to identify key information such as product model, batch number, and QR code. Its role is to achieve accurate traceability and quality management of wafers. Through high-resolution, non-contact marking technology, it ensures clear marking without damaging the wafer structure. At the same time, it meets the semiconductor industry's needs for marking small sizes and complex patterns, thereby improving the controllability of the production process, reducing the error rate, and supporting the entire process of subsequent packaging, testing, and supply chain management.

[0003] An automated transport system precisely positions the wafers to the marking station, and a vision positioning system identifies the alignment marks on the wafers to ensure the accuracy of the marking position. Then, according to the preset marking content, the equipment uses laser or mechanical etching to make high-precision marks on the wafer surface. During the process, a real-time feedback system controls the energy, focal length, and speed to avoid thermal damage or physical stress affecting the wafer performance. After marking is completed, the equipment performs a second optical inspection to verify the marking quality and ensure that the clarity and contrast meet industry standards. The wafers are then transferred to the next process.

[0004] During the marking process, negative pressure is often generated on the lower surface of the wafer through the air intake to fix the wafer in the processing position. However, wafers often have edge warping issues, which can cause the air intake to not fit properly with the wafer surface, resulting in air leakage. This prevents the negative pressure from being generated on the lower surface of the wafer, thus reducing the wafer positioning effect and causing the wafer to slip during the marking process. Summary of the Invention

[0005] Technical problems to be solved

[0006] To address the shortcomings of existing technologies, this invention provides a positioning device for precision wafer marking equipment, which solves the problem of poor wafer positioning effect mentioned in the background art.

[0007] Technical solution

[0008] To achieve the above objectives, the present invention provides the following technical solution: a positioning device for a precision wafer marking equipment, comprising a base frame, a fixed frame fixedly connected to the top of the base frame, a suction groove inside the fixed frame, a main circular plate for adjusting the wafer position inside the base frame, a plurality of circular frames arranged in a ring array at the upper end of the main circular plate, a main clamping rod and a stop plate for pushing the wafer to the marking position inside the fixed frame, a first clamping block and a round-headed sliding shaft for providing power to the main clamping rod according to the different positions of the wafer at the top of the fixed frame inside the fixed frame, and a swing block and a lower pressure plate for pressing the top of the wafer to make the wafer fit more closely to the surface of the suction cup inside the fixed frame.

[0009] Preferably, the base frame has a main body groove inside, the main body circular plate is slidably connected to the inside of the main body groove, the fixed frame has multiple lifting grooves arranged in a ring array inside, the circular frame is slidably connected to the inside of the lifting groove, the inner shaft is slidably connected to the inside of the circular frame, the inner shaft is fixedly connected to the main body circular plate, a locking groove is opened inside one end of the circular frame, a locking plate is slidably connected to the inside of the locking groove, the locking plate is fixedly connected to the inner shaft, a processing groove is opened on the upper surface of the fixed frame, a rubber suction cup is fixedly connected to the lower inner wall of the processing groove, the rubber suction cup is connected to the suction groove, the circular frame extends into the processing groove, and a processing wafer is placed on the upper surface of the circular frame.

[0010] Preferably, a first groove is formed on the inner wall of the lifting groove at the end away from the fixed frame, and a first locking block is slidably connected to the inside of the first groove. The first locking block is fixedly connected to the circular frame. A second groove is formed on the inner wall of the first groove, and a second locking block is slidably connected to the inside of the second groove. A first spring is fixedly connected to the inside of the second groove, and the first spring is fixedly connected to the second locking block.

[0011] Preferably, the fixed frame has multiple transverse sliding grooves arranged in a circular array inside, and the transverse sliding grooves are connected to the first groove. The main body locking rod is slidably connected inside the transverse sliding groove, and a fourth spring is fixedly connected inside the transverse sliding groove. The main body locking rod is fixedly connected to the fourth spring, and an adjusting slide plate is fixedly connected to one side of the main body locking rod. A guide groove is formed on the inner wall of the transverse sliding groove, and a guide block is slidably connected inside the guide groove. The guide block is fixedly connected to the adjusting slide plate, and an adjustment groove is formed on the surface of the adjusting slide plate. The side of the circular frame has... The device has an extension groove, inside which an extension slide rod is slidably connected. The extension slide rod is fixedly connected to an inner shaft. A round-headed slide shaft is slidably connected to the inside of one end of the extension slide rod. A second spring is fixedly connected to the inside of one end of the extension slide rod. The second spring is fixedly connected to the extension slide rod. The round-headed slide shaft extends into the inside of the adjustment groove. A first positioning rod is slidably connected to the inside of one end of the main body locking rod. The first positioning rod is T-shaped. A stop plate is fixedly connected to the end of the first positioning rod near the wafer being processed. A third spring is fixedly connected between the main body locking rod and the stop plate.

[0012] Preferably, the adjustment groove is divided into a positioning groove and a restoration groove. The depth of the positioning groove is greater than the depth of the restoration groove. The positioning groove is a bent groove and includes two staggered vertical grooves. The two vertical grooves in the positioning groove are connected by an inclined groove. The restoration groove is a vertical groove and the adjustment groove is connected to the main groove.

[0013] Preferably, the fixed frame has multiple slots numbered 3 arranged in a circular array inside. A main pull rod is slidably connected inside each slot number 3. A locking block number 3 is fixedly connected to the side of the main pull rod away from the processed wafer. A power sliding groove is formed on the inner wall of the side of slot number 3 away from the processed wafer. A power sliding shaft is slidably connected inside the power sliding groove. A slot number 4 is formed at the end of the power sliding shaft away from the processed wafer. A spring number 6 is fixedly connected inside the power sliding groove. The spring number 6 is fixedly connected to the power sliding shaft. A locking block number 4 is slidably connected inside the slot number 4. The lower part of the locking block number 4 near the main pull rod is set with an inclined surface. A spring number 5 is fixedly connected inside the slot number 4. The locking block number 4 is fixedly connected to the spring number 5. A recovery locking block is fixedly connected to the inner wall of slot number 3. The top of the recovery locking block near the power sliding shaft is set with an inclined surface.

[0014] Preferably, the fourth card block extends into the interior of the third slot, the fourth card block is located on the sliding path of the third card block, the restoration card block is located on the sliding path of the fourth card block, the thickness of the third card block and the restoration card block is not greater than half the thickness of the fourth card block, and the restoration card block is not located on the sliding path of the third card block.

[0015] Preferably, the surface of the fixed frame has multiple swing grooves arranged in a circular array. The swing grooves are connected to the power slide grooves. A fixed retaining shaft is fixedly connected inside the swing groove. One end of the swing block is rotatably connected to the end of the power slide shaft away from the No. 6 spring. The surface of the swing block has a pressing groove. The fixed retaining shaft is inserted through the inside of the pressing groove. The pressing groove is divided into a vertical groove and an inclined groove. A top block is fixedly connected to the end of the swing block away from the power slide shaft. A No. 2 retaining rod is slidably connected inside the top block near the wafer being processed. The pressing plate is fixedly connected to the surface of the end of the No. 2 retaining rod away from the top block. A No. 7 spring is fixedly connected between the pressing plate and the top block.

[0016] Beneficial effects

[0017] The positioning device for wafer precision marking equipment provided by this invention has the following beneficial effects:

[0018] 1. As the circular frame slides downwards, the second locking block restricts the first locking block, thus preventing the circular frame from sliding further. The adjusting slide moves the main locking rod closer to the wafer being processed. During the process of the main locking rod moving closer to the wafer, the four-way abutment plates ensure that the wafer is located in the center of the processing groove, thereby improving the accuracy of subsequent processing.

[0019] 2. When the positioned wafer rests on the upper surface of the rubber chuck, the second positioning lever changes from being far from the wafer's processing position to being directly above the edge of the wafer. The pressure plate directly above the edge of the wafer slides vertically downward along the vertical groove of the pressure groove under the action of the swing block, thereby pressing down on the edge of the wafer. This causes the edge of the wafer, which could not adhere to the rubber chuck due to warping, to come into contact with the rubber surface. At this time, the air suction mechanism removes the gas inside the rubber chuck through the suction groove, thus ensuring that the wafer is stably attached to the surface of each rubber chuck.

[0020] 3. The wafer is centered during the oscillating block alignment process and is immediately clamped after positioning. It has the core advantages of fast response, high-precision positioning and stable processing. It eliminates the risk of wafer re-offset due to reset deviation during operation and external vibration during the lifting process after positioning. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0022] Figure 2 This is a schematic diagram of the internal structure of the base frame of the present invention;

[0023] Figure 3This is a schematic diagram of the internal structure of the fixed frame of the present invention;

[0024] Figure 4 This is a schematic diagram of the internal structure of the transverse groove of the present invention;

[0025] Figure 5 This is a schematic diagram of the front view structure of the base frame of the present invention;

[0026] Figure 6 This is a schematic diagram of the internal structure of the No. 3 slot of the present invention;

[0027] Figure 7 This is a schematic diagram of the swing block connection structure of the present invention.

[0028] The labels in the diagram represent:

[0029] 1. Base frame; 11. Fixing frame; 12. Suction groove; 2. Main body groove; 21. Main body circular plate; 22. Lifting groove; 23. Inner shaft; 24. Circular frame; 25. Locking groove; 26. Locking plate; 27. Machining groove; 28. Rubber suction cup; 29. ​​Machining wafer; 3. Groove No. 1; 31. Locking block No. 1; 32. Groove No. 2; 33. Spring No. 1; 34. Locking block No. 2; 4. Horizontal slide groove; 41. Main body locking rod; 42. Adjusting slide plate; 43. Positioning slide groove; 44. Extension groove; 45. Extension slide rod; 46. Round head slide shaft; 47. No. 2 48. Spring; 49. No. 1 locking rod; 410. No. 3 spring; 411. Abutment plate; 412. No. 4 spring; 413. Guide groove; 414. Guide block; 5. No. 3 groove; 51. Main pull rod; 52. No. 3 locking block; 53. Power slide groove; 54. Power slide shaft; 55. No. 4 groove; 56. No. 4 locking block; 57. No. 5 spring; 58. No. 6 spring; 59. Restoration locking block; 6. Swing groove; 61. Fixed locking shaft; 62. Swing block; 63. Lower pressure groove; 64. Top block; 65. No. 2 locking rod; 66. No. 7 spring; 67. Lower pressure plate. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] refer to Figures 1 to 7A positioning device for a precision wafer marking machine according to a preferred embodiment of the present invention will be described in detail below, including a base frame 1, a fixing frame 11 fixedly connected to the top of the base frame 1, a suction groove 12 opened inside the fixing frame 11, a main circular plate 21 for adjusting the position of the wafer arranged inside the base frame 1, a plurality of circular frames 24 arranged in a ring array at the upper end of the main circular plate 21, a main clamping rod 41 and a stop plate 410 for pushing the wafer to the marking position arranged inside the fixing frame 11, a first clamping block 31 and a round-headed sliding shaft 46 for providing power to the main clamping rod 41 according to the different positions of the wafer at the top of the fixing frame 11, and a swing block 62 and a lower pressure plate 67 for pressing the top of the wafer to make the wafer fit more closely to the surface of the suction cup.

[0032] like Figure 2 and Figure 3 In the middle, the base frame 1 has a main body groove 2 inside, the main body circular plate 21 is slidably connected to the inside of the main body groove 2, the main body groove 2 is fixedly connected to the inside of the main body groove 2, the main body circular plate 21 is fixedly connected to the output shaft of the electric telescopic rod, the fixed frame 11 has multiple lifting grooves 22 arranged in a ring array inside, the circular frame 24 is slidably connected to the inside of the lifting grooves 22, the inner shaft 23 is slidably connected to the inside of the circular frame 24, the inner shaft 23 is fixedly connected to the main body circular plate 21, the circular frame 24 has a locking groove 25 inside one end, the locking groove 25 has a locking plate 26 slidably connected to the inside of the locking groove 25, the locking plate 26 is fixedly connected to the inner shaft 23, and the upper surface of the fixed frame 11 has a machining groove 2. 7. A rubber suction cup 28 is fixedly connected to the lower inner wall of the processing tank 27. The rubber suction cup 28 is connected to the suction groove 12. The circular frame 24 extends into the processing tank 27. The processing wafer 29 is placed on the upper surface of the circular frame 24. When the processing wafer 29 is placed on the upper surface of the circular frame 24 by the mechanical claw, and the surface of the processing wafer 29 needs to be marked, the output shaft of the electric telescopic rod drives the main circular plate 21 to slide down, thereby driving the inner shaft 23 to slide down. The circular frame 24 loses the support of the inner shaft 23 and slides down with the inner shaft 23 under its own weight and the pressure of the processing wafer 29, thereby driving the processing wafer 29 to slide down until it is in contact with the surface of the rubber suction cup 28.

[0033] like Figure 3 and Figure 4In the middle, the inner wall of the lifting groove 22 away from the fixed frame 11 has a groove 3. The first locking block 31 is slidably connected to the inside of the first groove 3. The first locking block 31 is fixedly connected to the circular frame 24. The inner wall of the first groove 3 has a second groove 32. The second locking block 34 is slidably connected to the inside of the second groove 32. The first spring 33 is fixedly connected to the inside of the second groove 32. The first spring 33 is fixedly connected to the second locking block 34. When the circular frame 24 slides down, it drives the first locking block 31 to slide down. The first locking block 31 comes into contact with the second locking block 34, and then the second locking block 34 restricts the first locking block 31, thereby restricting the circular frame 24 and preventing the circular frame 24 from continuing to slide.

[0034] The fixed frame 11 has multiple transverse sliding grooves 4 arranged in a circular array inside. Each transverse sliding groove 4 is connected to the adjacent first groove 3. The main body locking rod 41 is slidably connected inside the transverse sliding groove 4. A fourth spring 411 is fixedly connected inside the transverse sliding groove 4. The main body locking rod 41 is fixedly connected to the fourth spring 411. An adjusting slide plate 42 is fixedly connected to one side of the main body locking rod 41. A guide groove 412 is formed on the inner wall of the transverse sliding groove 4. A guide block 413 is slidably connected inside the guide groove 412. The guide block 413 is fixedly connected to the adjusting slide plate 42. An adjustment sliding groove 43 is formed on the surface of the adjusting slide plate 42. The adjustment sliding groove 43 is divided into a positioning groove and a restoring groove. The depth of the positioning groove of the adjustment sliding groove 43 is greater than the depth of the restoring groove. The positioning groove is a bent groove. The positioning groove includes two staggered vertical grooves connected by an inclined groove. The restoration groove is a vertical groove. The adjustment slide 43 is connected to the main groove 2, meaning that the lower ends of both the positioning groove and the restoration groove are open, and their bottoms are connected to the main groove 2. An extension groove 44 is provided on the side of the circular frame 24. An extension slide rod 45 is slidably connected inside the extension groove 44. The extension slide rod 45 is fixedly connected to the inner shaft 23. A round-headed slide shaft 46 is slidably connected to one end of the extension slide rod 45. A second spring 47 is fixedly connected to one end of the extension slide rod 45. The round-headed slide shaft 46 is slidably connected to the extension slide rod 45. The depth of the arc-shaped portion of the round-headed slide shaft 46 is less than that of the positioning groove 43. The depth of the round-headed sliding shaft 46 extends into the interior of the adjusting slide groove 43. The circular frame 24 cannot slide downward with the inner shaft 23. The processed wafer 29 remains above the fixed frame 11 under the support of the circular frame 24. The inner shaft 23 continues to slide downward, driving the round-headed sliding shaft 46 downward through the extended sliding rod 45. This provides a thrust to the inner wall of the positioning groove 43, and then drives the main clamping rod 41 to move closer to the processed wafer 29 through the adjusting slide plate 42. A first clamping rod 48 is slidably connected inside one end of the main clamping rod 41. The first clamping rod 48 is T-shaped. The abutment plate 410 is fixedly connected to the end of the first clamping rod 48 near the processed wafer 29. A third spring 49 is fixedly connected between the main clamping rod 41 and the abutment plate 410. The third spring 49 is sleeved on a As the main clamping rod 41 moves closer to the processing wafer 29 on the first clamping rod 48, the four-way abutment plates 410 ensure that the processing wafer 29 is centered in the processing groove 27. To prevent the abutment plates 410 from excessively pressing on the processing wafer 29 and causing damage, when the processing wafer 29 is centered in the processing groove 27, the main clamping rod 41 continues to move closer to the processing wafer 29. The processing wafer 29 provides a constraint to the surface of the abutment plates 410, and the main clamping rod 41 slides along the surface of the first clamping rod 48. The third spring 49 provides a buffering effect, thus preventing excessive pressure on the processing wafer 29. As the inner shaft 23 continues to slide down, the round-headed sliding shaft 46 disengages from the interior of the adjusting slide groove 43 under the drive of the inner shaft 23.Furthermore, driven by the inner shaft 23, the positioning plate 26 contacts the inner wall below the positioning slot 25. The inner shaft 23 continues to slide downwards, causing the circular frame 24 to move downwards synchronously. The circular frame 24 then moves the first locking block 31 downwards, causing it to exert a pushing force on the circular surface of the second locking block 34, causing the second locking block 34 to retract into the interior of the second slot 32. The circular frame 24, no longer restrained by the second locking block 34, continues to slide downwards, while the processed wafer 29 remains on the upper surface of the rubber chuck 28.

[0035] like Figure 6 and Figure 7 In the fixed frame 11, multiple slots 5 are arranged in a circular array inside. A main pull rod 51 is slidably connected inside slot 5. A locking block 52 is fixedly connected to one side of the main pull rod 51. A power slide groove 53 is formed on the inner wall of slot 5. A power slide shaft 54 ​​is slidably connected inside the power slide groove 53. A slot 55 is formed at the end of the power slide shaft 54 ​​away from the processed wafer 29. A spring 58 is fixedly connected inside the power slide groove 53 and is fixedly connected to the power slide shaft 54. A locking block 56 is slidably connected inside slot 55. The lower part of the locking block 56 near the main pull rod 51 is set as an inclined surface. A spring 57 is fixedly connected inside slot 55. The locking block 56 is fixedly connected to the spring 57. A recovery locking block is fixedly connected to the inner wall of slot 5. 59. The top of the restoration block 59 is set as an inclined surface near the power sliding shaft 54. The fourth block 56 extends into the interior of the third slot 5. The fourth block 56 is located on the sliding path of the third block 52. The restoration block 59 is located on the sliding path of the fourth block 56. The thickness of the third block 52 and the restoration block 59 is not greater than half the thickness of the fourth block 56. The restoration block 59 is not located on the sliding path of the third block 52. When the main circular plate 21 drives the processed wafer 29 to slide downward through the circular frame 24, the main circular plate 21 drives the third block 52 to slide downward through the main pull rod 51. When the processed wafer 29 is positioned above the fixed frame 11 under the support of the circular frame 24, the third block 52 contacts the fourth block 56, thereby driving the main pull rod 51 to slide downward synchronously.

[0036] The surface of the fixed frame 11 has multiple swing grooves 6 arranged in a circular array. The swing grooves 6 are connected to the power slide 53. A fixed shaft 61 is fixedly connected inside the swing groove 6. One end of the swing block 62 is rotatably connected to the end of the power slide 54 away from the No. 6 spring 58. The surface of the swing block 62 has a pressing groove 63. The fixed shaft 61 is inserted through and inserted into the inside of the pressing groove 63. The pressing groove 63 is slidably connected to the fixed shaft 61. The pressing groove 63 is divided into a vertical groove and an inclined groove. A top block 64 is fixedly connected to the end of the moving block 62 away from the power sliding shaft 54. A second locking rod 65 is slidably connected inside the top block 64 near the processing wafer 29. A lower pressure plate 67 is fixedly connected to the surface of the second locking rod 65 away from the top block 64. A seventh spring 66 is fixedly connected between the lower pressure plate 67 and the top block 64. The main pull rod 51 slides downward to give a downward pulling force to one end of the swing block 62. Under the restriction of the fixed locking shaft 61, the swing block 62 moves along the lower pressure groove 63. The inner wall of the inclined groove gradually swings towards the processing wafer 29, thereby straightening the tilted second positioning rod 65 until the fixed clamping shaft 61 is located inside the vertical groove of the pressure groove 63. At this time, the second positioning rod 65 changes from being far away from the processing position of the processing wafer 29 to being directly above the edge of the processing wafer 29. The circular frame 24 continues to slide downward without the limitation of the second clamping block 34. When the positioned processing wafer 29 stops on the upper surface of the rubber chuck 28, the pressure plate 67 located directly above the edge of the processing wafer 29 slides vertically downward along the vertical groove of the pressure groove 63 under the drive of the swing block 62, thereby pressing down on the edge of the processing wafer 29. This causes the edge of the processing wafer 29, which cannot adhere to the rubber chuck 28 due to warping, to contact the rubber surface. At this time, the air suction mechanism removes the gas inside the rubber chuck 28 through the suction groove 12, thereby making the processing wafer 29 stably adhere to the surface of each rubber chuck 28.

[0037] The following is the complete working process and working principle of the above embodiment: An electric telescopic rod is fixedly connected inside the main body groove 2. The main body circular plate 21 is fixedly connected to the output shaft of the electric telescopic rod. When the processing wafer 29 is placed on the upper surface of the circular frame 24 by the mechanical claw, and the surface of the processing wafer 29 needs to be marked, the output shaft of the electric telescopic rod drives the main body circular plate 21 to slide downward, thereby driving the inner shaft 23 to slide downward. The circular frame 24 loses the support of the inner shaft 23 and slides downward with the inner shaft 23 under its own weight and the pressure of the processing wafer 29, thereby driving the processing wafer 29 to slide downward until it is in contact with the surface of the rubber suction cup 28.

[0038] As the circular frame 24 slides downward, it causes the first locking block 31 to slide downward. The first locking block 31 comes into contact with the second locking block 34, which then restricts the first locking block 31, thereby restricting the circular frame 24 and preventing it from sliding further. The circular frame 24 cannot slide downward with the inner shaft 23. The processed wafer 29 remains above the fixed frame 11 with the support of the circular frame 24. The inner shaft 23 continues to slide downward, and the extended slide rod 45 drives the round-headed slide shaft 46 to slide downward. This provides a thrust to the inner wall of the positioning groove 43, and the adjusting slide plate 42 drives the main locking rod 41 to move closer to the processed wafer 29.

[0039] As the main clamping lever 41 moves closer to the wafer 29, the four-way contact plates 410 ensure that the wafer 29 is centered in the processing groove 27. To prevent the contact plates 410 from excessively pressing and damaging the wafer 29, the main clamping lever 41 continues to move closer to the wafer 29 when it is centered in the processing groove 27. The wafer 29 then provides a constraint to the surface of the contact plates 410. The main clamping lever 41 slides along the surface of the first clamping lever 48, and the third spring 49 provides a buffering effect, thus preventing excessive pressure during processing. As the inner shaft 23 continues to slide down, the round-headed sliding shaft 46 disengages from the interior of the adjusting slide groove 43 under the drive of the inner shaft 23, and the positioning plate 26 contacts the inner wall below the positioning groove 25 under the drive of the inner shaft 23. The inner shaft 23 continues to slide down, causing the circular frame 24 to move down synchronously. The circular frame 24 causes the first locking block 31 to move down, so that the first locking block 31 gives a pushing force to the circular surface of the second locking block 34, causing the second locking block 34 to retract into the interior of the second groove 32. The circular frame 24 continues to slide down without the limit of the second locking block 34, and at this time the processed wafer 29 stops on the upper surface of the rubber chuck 28.

[0040] As the main circular plate 21 slides downward through the circular frame 24, the main circular plate 21 drives the third locking block 52 to slide downward through the main pull rod 51. When the processed wafer 29 is positioned above the fixed frame 11 under the support of the circular frame 24, the third locking block 52 contacts the fourth locking block 56, thereby driving the main pull rod 51 to slide downward synchronously.

[0041] The main pull rod 51 slides downward, giving one end of the swing block 62 a downward pulling force. Under the restriction of the fixed clamping shaft 61, the swing block 62 gradually swings along the inner wall of the inclined groove of the pressing groove 63 towards the processing wafer 29, thereby straightening the tilted second clamping rod 65 until the fixed clamping shaft 61 is located inside the vertical groove of the pressing groove 63. At this time, the second clamping rod 65 changes from being away from the processing wafer 29 to being directly above the edge of the processing wafer 29. The circular frame 24 continues to slide downward without the restriction of the second clamping block 34, and the positioning is completed. When the processed wafer 29 rests on the upper surface of the rubber chuck 28, the pressure plate 67 located directly above the edge of the processed wafer 29 slides vertically downward along the vertical groove of the pressure groove 63 under the drive of the swing block 62, thereby pressing down on the edge of the processed wafer 29. This causes the edge of the processed wafer 29, which cannot adhere to the rubber chuck 28 due to warping, to come into contact with the rubber surface. At this time, the air suction mechanism removes the gas inside the rubber chuck 28 through the suction groove 12, thereby ensuring that the processed wafer 29 is stably adhered to the surface of each rubber chuck 28 at each position.

[0042] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A positioning device for a precision wafer marking machine, comprising a base frame (1), wherein a fixing frame (11) is fixedly connected to the top of the base frame (1), and a suction groove (12) is provided inside the fixing frame (11), characterized in that: The inside of the base frame (1) is provided with a main circular plate (21) for adjusting the position of the wafer, the upper end of the main circular plate (21) is provided with a plurality of circular frames (24) in an annular array, the inside of the fixed frame (11) is provided with a main clamping rod (41) and a stop plate (410) for pushing the wafer to the marking position, the inside of the fixed frame (11) is provided with a No. 1 clamping block (31) and a round head sliding shaft (46) for providing power to the main clamping rod (41) according to the different positions of the wafer on the top of the fixed frame (11), the inside of the fixed frame (11) is provided with a swing block (62) and a lower pressing plate (67) for pressing the top of the wafer to make the wafer more closely adhere to the surface of the suction cup; The inside of the base frame (1) is provided with a main circular plate (21) for adjusting the position of the wafer, the upper end of the main circular plate (21) is provided with a plurality of circular frames (24) in an annular array, the inside of the fixed frame (11) is provided with a main clamping rod (41) and a stop plate (410) for pushing the wafer to the marking position, the inside of the fixed frame (11) is provided with a No. 1 clamping block (31) and a round head sliding shaft (46) for providing power to the main clamping rod (41) according to the different positions of the wafer on the top of the fixed frame (11), the inside of the fixed frame (11) is provided with a swing block (62) and a lower pressing plate (67) for pressing the top of the wafer to make the wafer more closely adhere to the surface of the suction cup; 2. The positioning device for wafer precision marking equipment according to claim 1, characterized in that: The inside of the base frame (1) is provided with a main circular plate (21) for adjusting the position of the wafer, the upper end of the main circular plate (21) is provided with a plurality of circular frames (24) in an annular array, the inside of the fixed frame (11) is provided with a main clamping rod (41) and a stop plate (410) for pushing the wafer to the marking position, the inside of the fixed frame (11) is provided with a No. 1 clamping block (31) and a round head sliding shaft (46) for providing power to the main clamping rod (41) according to the different positions of the wafer on the top of the fixed frame (11), the inside of the fixed frame (11) is provided with a swing block (62) and a lower pressing plate (67) for pressing the top of the wafer to make the wafer more closely adhere to the surface of the suction cup; The inside of the base frame (1) is provided with a main circular plate (21) for adjusting the position of the wafer, the upper end of the main circular plate (21) is provided with a plurality of circular frames (24) in an annular array, the inside of the fixed frame (11) is provided with a main clamping rod (41) and a stop plate (410) for pushing the wafer to the marking position, the inside of the fixed frame (11) is provided with a No. 1 clamping block (31) and a round head sliding shaft (46) for providing power to the main clamping rod (41) according to the different positions of the wafer on the top of the fixed frame (11), the inside of the fixed frame (11) is provided with a swing block (62) and a lower pressing plate (67) for pressing the top of the wafer to make the wafer more closely adhere to the surface of the suction cup; 3. The positioning device for wafer precision marking equipment according to claim 2, characterized in that: The inside of the fixed frame (11) is annularly arranged with a plurality of transverse sliding grooves (4), the transverse sliding grooves (4) are communicated with a first groove (3), the main clamping rod (41) is slidably connected in the inside of the transverse sliding groove (4), the inside of the transverse sliding groove (4) is fixedly connected with a fourth spring (411), the main clamping rod (41) is fixedly connected with the fourth spring (411), one side of the main clamping rod (41) is fixedly connected with an adjusting sliding plate (42), the inner wall of the transverse sliding groove (4) is provided with a guide groove (412), the inside of the guide groove (412) is slidably connected with a guide block (413), the guide block (413) is fixedly connected with the adjusting sliding plate (42), the surface of the adjusting sliding plate (42) is provided with a position adjusting sliding groove (43), the side surface of the circular frame (24) is provided with an extension groove (44), the inside of the extension groove (44) is slidably connected with an extension sliding rod (45), the extension sliding rod (45) is fixedly connected with the inner shaft (23), a circular head sliding shaft (46) is slidably connected in one end of the inside of the extension sliding rod (45), one end of the inside of the extension sliding rod (45) is fixedly connected with a second spring (47), the second spring (47) is fixedly connected with the extension sliding rod (45), the circular head sliding shaft (46) extends into the inside of the position adjusting sliding groove (43), one end of the inside of the main clamping rod (41) is slidably connected with a first clamping rod (48), the first clamping rod (48) is T-shaped, a position adjusting plate (410) is fixedly connected with one end of the first clamping rod (48) close to the processing wafer (29), and the main clamping rod (41) and the position adjusting plate (410) are fixedly connected with a third spring (49).

4. The positioning device for wafer precision marking equipment according to claim 3, characterized in that: The position adjusting sliding groove (43) is divided into a positioning groove and a recovery groove, the depth of the positioning groove of the position adjusting sliding groove (43) is greater than the depth of the recovery groove, the positioning groove of the position adjusting sliding groove (43) is a bent groove, the positioning groove of the position adjusting sliding groove (43) comprises two staggered vertical grooves, the two vertical grooves in the positioning groove of the position adjusting sliding groove (43) are communicated through an inclined groove, the recovery groove of the position adjusting sliding groove (43) is a vertical groove, and the position adjusting sliding groove (43) is communicated with the main groove (2).

5. The positioning device for wafer precision marking equipment according to claim 1, characterized in that: The inside of the fixed frame (11) is annularly arranged with a plurality of No. 3 grooves (5), the inside of the No. 3 groove (5) is slidably connected with a main body pull rod (51), the side of the main body pull rod (51) away from the processing wafer (29) is fixedly connected with a No. 3 clamping block (52), the inside wall of the side of the No. 3 groove (5) away from the processing wafer (29) is arranged with a power sliding groove (53), the inside of the power sliding groove (53) is slidably connected with a power sliding shaft (54), the end of the power sliding shaft (54) away from the processing wafer (29) is arranged with a No. 4 groove (55), the inside of the power sliding groove (53) is fixedly connected with a No. 6 spring (58), the No. 6 spring (58) is fixedly connected between the power sliding shaft (54), the inside of the No. 4 groove (55) is slidably connected with a No. 4 clamping block (56), the side of the No. 4 clamping block (56) close to the main body pull rod (51) is arranged as an inclined surface, the inside of the No. 4 groove (55) is fixedly connected with a No. 5 spring (57), the No. 4 clamping block (56) is fixedly connected with the No. 5 spring (57), the inner wall of the No. 3 groove (5) is fixedly connected with a recovery clamping block (59), the top of the recovery clamping block (59) is arranged as an inclined surface close to the side of the power sliding shaft (54).

6. The positioning device for wafer precision marking equipment according to claim 5, characterized in that: The No. 4 clamping block (56) extends to the inside of the No. 3 groove (5), the No. 4 clamping block (56) is located on the sliding path of the No. 3 clamping block (52), the recovery clamping block (59) is located on the sliding path of the No. 4 clamping block (56), the thickness of the No. 3 clamping block (52) and the recovery clamping block (59) is not greater than half the thickness of the No. 4 clamping block (56), and the recovery clamping block (59) is not located on the sliding path of the No. 3 clamping block (52).

7. The positioning device for wafer precision marking equipment according to claim 5, characterized in that: The surface of the fixed frame (11) is annularly arranged with a plurality of swing grooves (6), the swing groove (6) is communicated with the power sliding groove (53), the inside of the swing groove (6) is fixedly connected with a fixed clamping shaft (61), one end of the swing block (62) is rotatably connected to the end of the power sliding shaft (54) away from the No. 6 spring (58), the surface of the swing block (62) is arranged with a pressing groove (63), the fixed clamping shaft (61) penetrates and is inserted into the inside of the pressing groove (63), the pressing groove (63) is divided into a vertical groove and an inclined groove, the end of the swing block (62) away from the power sliding shaft (54) is fixedly connected with a top block (64), the inside of the end of the top block (64) close to the processing wafer (29) is slidably connected with a No. 2 clamping rod (65), a pressing plate (67) is fixedly connected to the surface of the end of the No. 2 clamping rod (65) away from the top block (64), the pressing plate (67) and the top block (64) are fixedly connected with a No. 7 spring (66).

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