Photovoltaic micro-inverter heat dissipation structure capable of automatically adjusting heat dissipation power and heat dissipation method thereof

Abstract

The present application relates to photovoltaic micro-inverter structure technical field, especially to a kind of automatically regulated photovoltaic micro-inverter heat dissipation structure and heat dissipation method of heat dissipation power.It includes a kind of automatically regulated photovoltaic micro-inverter heat dissipation structure, including heat dissipation shell, PCB board assembly being arranged in heat dissipation shell interior, and two groups of air flow efficiency adjustment components are installed in the inside of heat dissipation shell.The present application is by according to temperature sensor collection photovoltaic micro-inverter internal temperature information, adjustment sealing band, the transformation between the position of fine mesh filter and coarse mesh filter, for switching sealing area, primary heat dissipation area and secondary heat dissipation area, to automatically regulate the heat dissipation power in equipment interior, to realize that photovoltaic micro-inverter can be according to internal temperature condition, while dustproof, self-regulation equipment overall heat dissipation efficiency, better protect the long-term operation of photovoltaic micro-inverter.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of photovoltaic micro-inverter structure, and particularly relates to a photovoltaic micro-inverter heat dissipation structure capable of automatically adjusting heat dissipation power and a heat dissipation method thereof. BACKGROUND

[0002] The photovoltaic micro-inverter is born from the demand of the distributed photovoltaic system - the traditional centralized inverter is large in size, complex to install, and cannot adapt to the distributed scenario of 'independent power generation of each component'. The micro-inverter is directly integrated in a single photovoltaic component (power is usually 500-2000W), and the MPPT technology is used to improve the power generation efficiency of the single component, but the design characteristics of high power density (power / volume ratio > 500W / in3) lead to high heat concentration.

[0003] Therefore, in the design process of the micro-inverter, heat management is the core problem to ensure the long-term reliable operation of the product. For a high-protection-grade sealed device, the heat generated by the internal heating elements of the device can only be conducted to the external environment through the shell natural heat dissipation, and for a device with good heat dissipation effect, a large number of heat dissipation holes are formed on the surface of the device to ensure air circulation, which leads to a low protection grade of the photovoltaic micro-inverter heat dissipation structure. Both have certain advantages and defects, and therefore a photovoltaic micro-inverter heat dissipation structure capable of automatically adjusting heat dissipation power is proposed. SUMMARY

[0004] The present application aims at the problems in the background art, and proposes a photovoltaic micro-inverter heat dissipation structure capable of automatically adjusting heat dissipation power and a heat dissipation method thereof.

[0005] The technical scheme of the present application is a photovoltaic micro-inverter heat dissipation structure capable of automatically adjusting heat dissipation power, which comprises a heat dissipation shell, a PCB plate assembly arranged in the heat dissipation shell, and two groups of air flow efficiency adjusting assemblies arranged on the two sides of the heat dissipation shell.

[0006] The air flow efficiency adjusting assembly comprises a first hollow roller frame fixedly arranged on one side of the heat dissipation shell, a second hollow roller frame fixedly arranged on the other side of the heat dissipation shell, and a rotating roller rotatably arranged in the first hollow roller frame and the second hollow roller frame. One group of the rotating rollers is wound with a coarse mesh filter screen, and the other group of the rotating rollers is wound with a fine mesh filter screen. A sealing belt is fixedly arranged between the fine mesh filter screen and the coarse mesh filter screen. A plurality of small filter screen holes are formed in the fine mesh filter screen, and a plurality of large filter screen holes are formed in the coarse mesh filter screen. The hole diameter of the large filter screen hole is larger than that of the small filter screen hole.

[0007] Optionally, a plurality of PCBA heat generating chips are fixedly installed on the outer side of the PCB board assembly, and a heat conduction plate is fixedly installed in the interior of the heat dissipation shell.

[0008] Optionally, a fin plate assembly is arranged on the outer side of the heat dissipation shell, and the heat generated by the PCBA heat generating chip can be conducted to the fin plate assembly on the outer side of the heat dissipation shell and then dissipated to the air.

[0009] Optionally, the heat dissipation boss is of a concave-convex structure, and the upper surface of the heat dissipation boss is at the same height as the packaging surface of the PCBA heat generating chip.

[0010] Optionally, the fin plate assembly comprises a plurality of fins arranged in a matrix along the width direction of the front face of the heat dissipation shell, and a heat dissipation wing plate is arranged on one side of the heat dissipation shell, and a reinforcing rib is fixedly installed at the bottom of the heat dissipation wing plate and faces the side of the heat dissipation shell.

[0011] Optionally, the PCB board assembly comprises a PCB board, bolt holes are arranged at the four corners of the PCB board, and holes matching the bolt holes are arranged on the inner wall of the heat dissipation shell at the four corners, and the PCB board is fixedly installed in the interior of the heat dissipation shell through the bolt.

[0012] Optionally, positioning blocks are arranged around the interior of the heat dissipation shell, positioning grooves matching the positioning blocks are arranged around the PCB board, and power lines and data lines are fixedly installed at the two ends of the heat dissipation shell.

[0013] Optionally, the airflow efficiency adjusting assembly further comprises a transverse positioning frame fixedly installed on the first hollow roller frame and extending to one side of the heat dissipation shell, a cleaning brush mounting frame is slidingly installed in the interior of the transverse positioning frame, a spring is fixedly installed between the cleaning brush mounting frame and the transverse positioning frame, a dust collecting groove frame is inserted into one side of the heat dissipation shell, the dust collecting groove frame extends to one end of the interior of the heat dissipation shell and is arranged in a sealed state with the first hollow roller frame and the second hollow roller frame, and a plurality of limiting clamping plates are fixedly installed on the inner wall of the heat dissipation shell.

[0014] Optionally, a heat dissipation assembly is installed between the heat conduction plate and the heat dissipation shell.

[0015] The heat dissipation assembly comprises a plurality of heat dissipation bosses fixedly installed on the positioning frame on the inner wall of the heat dissipation shell, a motor frame is fixedly installed on one side of the positioning frame, and a heat dissipation fan is fixedly installed on the output end of the motor frame.

[0016] In another aspect, the application provides a heat dissipation method of a photovoltaic micro-inverter capable of automatically adjusting heat dissipation power, comprising the following steps:

[0017] S1, the heat generated by the operation of the PCBA heat generating chip is transferred to the heat dissipation boss, and the heat is conducted to the heat dissipation fins and heat dissipation wings on the front of the heat dissipation shell through the heat dissipation boss and the heat dissipation shell. At the same time, heat will be transferred from the heat dissipation fins and heat dissipation wings with higher temperature to the surrounding air with lower temperature. The air will flow through the gap between the heat dissipation fins and the heat dissipation wings under the action of natural convection or forced convection, and take away the heat of the heat dissipation fins and the heat dissipation wings.

[0018] S2, when the PCBA heat generating chip generates a large amount of heat, the temperature sensor controls the rotation roller to adjust the position transformation between the sealing belt, the fine mesh filter screen and the coarse mesh filter screen and the heat dissipation fins through the communication protocol, so as to switch the sealing area, the first level heat dissipation area and the second level heat dissipation area, and then automatically adjust the heat dissipation power inside the equipment.

[0019] S3, the second motor mounted in the motor frame drives the heat dissipation fan to rotate along the positioning frame, guides the hot air flow conducted by the heat dissipation boss and the PCBA heat generating chip to the outside, causes the heat dissipation shell and the external air to generate a pressure difference, and then the large amount of airflow in the heat dissipation shell rapidly passes through the heat dissipation fins and the external air to form a secondary conversion effect.

[0020] In summary, the present application includes at least one of the following beneficial technical effects:

[0021] 1. According to the temperature sensor collecting the internal temperature information of the photovoltaic micro inverter, adjusting the position transformation between the sealing belt, the fine mesh filter screen and the coarse mesh filter screen, so as to switch the sealing area, the first level heat dissipation area and the second level heat dissipation area, and then automatically adjust the heat dissipation power inside the equipment, so as to realize that the photovoltaic micro inverter can adjust the overall heat dissipation efficiency of the equipment according to the internal temperature condition while preventing dust, and better protect the long-term operation of the photovoltaic micro inverter.

[0022] 2. The dust inside the coarse mesh filter screen or the fine mesh filter screen is cleaned by the cleaning brush mounting frame and falls into the dust collecting groove frame by gravity, so that the worker can clean the dust accumulated in the dust collecting groove frame in a month or more, thereby reducing the workload of the worker, improving the use efficiency of the filter screen and the circulation efficiency of the airflow inside the equipment.

[0023] 3. The fin plate assembly outside the heat dissipation shell increases the contact area between the heat dissipation shell and the surrounding air. According to the heat transfer principle, heat will be transferred from the heat dissipation shell with higher temperature to the surrounding air with lower temperature. The heat is dissipated into the air through the natural convection or forced convection of the air, so as to realize the heat dissipation of the micro inverter, ensure that the internal elements work normally in the appropriate temperature range, and avoid damage due to overheating. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is a structural schematic view of a heat dissipation structure of a photovoltaic micro-inverter.

[0025] Figure 2 It is a structural schematic view of a PCB assembly of the application.

[0026] Figure 3 It is a structural schematic view of a heat dissipation assembly of the application.

[0027] Figure 4 It is a structural schematic view of a sealing belt of the application.

[0028] Figure 5 It is a structural schematic view of a coarse hole filter screen of the application.

[0029] Figure 6 It is a structural schematic view of a heat dissipation fin of the application. Figure 5 It is an enlarged view of the A part in the middle.

[0030] Figure 7 It is a structural schematic view of a positioning frame of the application. Figure 5 It is an enlarged view of the B part in the middle.

[0031] Figure 8 It is a structural schematic view of a positioning frame of the application.

[0032] Figure 9 It is an enlarged view of the C part in the middle. Figure 8

[0033] Figure 10 It is a structural schematic view of a heat dissipation fin of the application.

[0034] Figure 11 It is a structural schematic view of a coarse hole filter screen of the application.

[0035] Figure 12 It is a schematic view of airflow distribution of the application.

[0036] The drawing label: 1, heat dissipation shell; 2, PCB assembly; 201, PCB; 202, positioning groove; 203, bolt hole; 3, PCBA heat chip; 4, heat dissipation boss; 5, fin assembly; 501, heat dissipation fin; 502, heat dissipation wing plate; 503, reinforcing rib; 6, power line; 7, data line; 8, airflow efficiency adjusting assembly; 801, first hollow roller frame; 802, rotating roller; 803, sealing belt; 804, fine hole filter screen; 805, coarse hole filter screen; 806, large filter screen hole; 807, second hollow roller frame; 808, small filter screen hole; 809, dust collection groove frame; 810, transverse positioning frame; 811, spring; 812, cleaning brush mounting frame; 9, heat dissipation assembly; 901, positioning frame; 902, heat dissipation fan; 903, motor frame; 10, heat conduction plate; 11, limiting clamping plate. DETAILED DESCRIPTION

[0037] ​The technical solutions of the present application will be further described in detail below in combination with the drawings and specific embodiments.

[0038] The components of the embodiments of the present application generally described and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but merely represents selected embodiments of the present application.

[0039] Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present application.

[0040] In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0041] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0042] As Figures 1-2 shown, the present application proposes a photovoltaic micro-inverter heat dissipation structure for automatically adjusting heat dissipation power, which comprises a heat dissipation shell 1, a PCB assembly 2 arranged inside the heat dissipation shell 1, a plurality of PCBA heat generating chips 3 fixedly installed on the outer side of the PCB assembly 2, a heat conduction plate 10 fixedly installed inside the heat dissipation shell 1, a heat dissipation boss 4 fixedly installed on one side of the heat conduction plate 10 and adapted to the plurality of PCBA heat generating chips 3, and a fin plate assembly 5 arranged on the outer side of the heat dissipation shell 1. The heat generated by the PCBA heat generating chip 3 can be conducted to the fin plate assembly 5 on the outer side of the heat dissipation shell 1 through the heat dissipation boss 4 and then dissipated to the air.

[0043] As an implementation, the heat dissipation shell 1 is the basic frame of the entire heat dissipation structure, and the heat dissipation shell 1 is provided with a cover in the upper and lower positions, and only the cover as the top cover part is drawn in the application, and the heat dissipation shell 1 provides mounting space for other components, protects internal elements, and builds a heat dissipation channel. The PCB assembly 2 is a mounting carrier of electronic elements, mainly used for carrying and connecting various electronic components, and realizing circuit functions.

[0044] It is worth noting that a plurality of PCBA heat generating chips 3 are arranged on the PCB assembly 2, and the PCBA heat generating chips 3 are the main source of heat generated during the operation of the micro inverter. In the running process, heat is generated due to current passing through and electronic element working. At the same time, in the interior of the heat dissipation shell 1, the heat dissipation boss 4 is in direct contact with the PCBA heat generating chip 3, and the heat dissipation boss 4 is a key transition component for conducting heat from the PCBA heat generating chip 3 to the outside of the heat dissipation shell 1.

[0045] Further, when the micro inverter works, the PCBA heat generating chip 3 on the PCB assembly 2 will generate a large amount of heat. Since the heat dissipation boss 4 is in direct contact with the packaging bottom of the PCBA heat generating chip 3, heat will be transferred from the PCBA heat generating chip 3 to the heat dissipation boss 4 through heat conduction. The heat dissipation boss 4, as a heat conduction bridge, further transmits heat to the heat dissipation shell 1. The fin assembly 5 on the outside of the heat dissipation shell 1 increases the contact area of the heat dissipation shell 1 and the surrounding air. According to the principle of heat transfer, heat will be transferred from the heat dissipation shell 1 with a higher temperature to the surrounding air with a lower temperature, and the heat will be dissipated into the air through natural or forced convection of air, thereby realizing heat dissipation of the micro inverter, ensuring that the internal elements work normally in an appropriate temperature range, and avoiding damage due to overheating.

[0046] In combination with FIG. 1, Figure 1 As shown in FIG. 1, the heat dissipation boss 4 has a concave-convex structure, and the upper surface of the heat dissipation boss 4 is at the same height as the packaging surface of the PCBA heat generating chip 3.

[0047] Specifically, the heat dissipation boss 4 has a concave-convex structure. The concave-convex structure is not a simple plane, but has a high-low undulating shape. The surface area of the heat dissipation boss 4 is increased, and compared with the ordinary plane structure, the larger surface area can provide more heat exchange area under the same volume, which helps to improve the heat dissipation efficiency.

[0048] The upper surface of the heat dissipation boss 4 is consistent with the packaging surface height of the PCBA heat generating chip 3. It represents that the vertical distance between each position of the upper surface of the heat dissipation boss 4 and the packaging surface of the PCBA heat generating chip 3 is equal, and the heat-conducting silicone grease is filled in the middle, so that the heat dissipation boss 4 can realize uniform and good contact with the packaging surface of the PCBA heat generating chip 3, and ensure that the heat can be efficiently transmitted from the PCBA heat generating chip 3 to the heat dissipation boss 4.

[0049] When the PCBA heat generating chip 3 works and generates heat, because the upper surface of the heat dissipation boss 4 is consistent with the packaging surface height of the PCBA heat generating chip 3, the two can be closely attached. According to the heat conduction principle, heat will be quickly transmitted from the packaging surface of the PCBA heat generating chip 3 with higher temperature to the heat dissipation boss 4 through the contact interface, thereby avoiding the accumulation of heat due to poor local contact and ensuring the smoothness of heat transmission.

[0050] And after the heat is transmitted to the heat dissipation boss 4, it will conduct inside the heat dissipation boss 4. Because the heat dissipation boss 4 adopts concave-convex structure, the internal heat distribution will be more uniform, and the concave-convex structure increases the contact area with the surrounding air. Under the action of natural convection or forced convection, the heat on the surface of the heat dissipation boss 4 will be more quickly dissipated to the surrounding air, thereby realizing effective heat dissipation, maintaining the working temperature of the PCBA heat generating chip 3 within a reasonable range, and ensuring the stable operation of the micro inverter.

[0051] It is explained here that a large amount of heat-conducting silicone grease is filled between the heat dissipation boss 4 and the PCBA heat generating chip 3.

[0052] In combination with the figures shown in Figure 1 , Figure 2 and Figure 4 , the fin plate assembly 5 includes a plurality of heat dissipation fins 501 arranged in a matrix along the width direction of the front surface of the heat dissipation shell 1, and a heat dissipation wing plate 502 is arranged on one side of the heat dissipation shell 1. The bottom of the heat dissipation wing plate 502 is fixedly installed with a reinforcing rib 503 towards the side surface of the heat dissipation shell 1.

[0053] Specifically, the heat dissipation fins 501 are located on the front surface of the heat dissipation shell 1, and these heat dissipation fins 501 are arranged in a matrix along the width direction of the heat dissipation shell 1. The matrix arrangement of these heat dissipation fins 501 means that the heat dissipation fins 501 are arranged in multiple rows and multiple columns according to the equal spacing rule in the width direction, forming a regular heat dissipation fin 501 array, which can fully utilize the space on the front surface of the heat dissipation shell 1 and increase the heat dissipation area.

[0054] The heat dissipation fin 502 is disposed on one side of the heat dissipation shell 1, extending from the side of the heat dissipation shell 1, increasing the contact area between the heat dissipation shell 1 and the air. At the same time, the heat dissipation fin 502 is usually a plate-shaped structure with a certain thickness and length. Its shape may vary depending on the actual design requirements, but the overall purpose is to enhance the heat dissipation effect.

[0055] When the microinverter is operating, the internal PCB board assembly 2 generates heat, which is conducted through the heat sink 1 to the heat sink 501 on the front of the heat sink 1. Because the heat sink 501 is arranged in a matrix, the contact area between the heat sink 501 and the surrounding air is greatly increased. According to the principle of heat transfer, heat is transferred from the hotter heat sink 501 to the cooler surrounding air. Under the action of natural convection or forced convection, the air continuously flows through the gaps between the heat sink 501, carrying away the heat from the heat sink 501, thus achieving a heat dissipation effect.

[0056] The heat dissipation fins 502 also receive heat conducted from the heat dissipation housing 1. Located on one side of the housing 1, they further increase the heat dissipation area. As air flows, it comes into contact with the surface of the heat dissipation fins 502, transferring heat from the fins 502 into the air. The heat dissipation fins 502 can work in conjunction with the heat sink 501 to increase the heat dissipation area from different directions and angles, improving heat dissipation efficiency and ensuring that the heat inside the micro-inverter can be dissipated in a timely manner, maintaining the normal operating temperature of the equipment.

[0057] Combination Figure 2 , Figure 3 and Figure 4 As shown, the bottom of the heat dissipation fin plate 502 is fixedly installed with a reinforcing rib 503 against the side of the heat dissipation shell 1.

[0058] Specifically, the reinforcing rib 503 is attached to the bottom of the heat dissipation fin 502 and the side of the heat dissipation shell 1. It is a component used to enhance structural strength, generally in the form of a strip or a raised structure with a certain shape. The material of the reinforcing rib 503 is usually the same as or similar to that of the heat dissipation fin 502 and the heat dissipation shell 1 to ensure the stability and consistency of the overall structure. Its quantity, size, and arrangement are designed according to factors such as the size of the heat dissipation fin 502, the force it bears, and the heat dissipation requirements.

[0059] Meanwhile, the reinforcing ribs 503 are arranged on the bottom of the heat dissipation wings 502 and the side of the heat dissipation shell 1, which can effectively enhance the connection strength between the heat dissipation wings 502 and the heat dissipation shell 1. During the working process of the micro inverter, the heat dissipation wings 502 may be subjected to external forces such as vibration and impact. Due to the extended structure of the heat dissipation wings 502, the heat dissipation wings 502 are relatively easy to deform or be damaged. The reinforcing ribs 503 increase the rigidity and stability of the reinforcing ribs 503, which can resist these external forces and prevent the heat dissipation wings 502 from deforming, such as bending and twisting, so as to ensure that the heat dissipation wings 502 can continuously and stably play a heat dissipation role, and at the same time, ensure the reliability and durability of the entire heat dissipation structure.

[0060] In combination with Figure 1 , Figure 2 and Figure 4 , it can be seen that the PCB assembly 2 includes a PCB 201, and bolt holes 203 are arranged at the four corners of the PCB 201. Holes matching the bolt holes 203 are arranged on the inner wall of the heat dissipation shell 1 at the four corners, and the PCB 201 is fixedly installed in the heat dissipation shell 1 by bolts.

[0061] Specifically, the PCB assembly 2 is a mounting carrier of electronic components in the micro inverter, which is used to realize the connection and function of the circuit. Positioning grooves 202 are arranged at the four corners of the PCB assembly 2, which are key structures for fixing the heat dissipation shell 1. It ensures that the bolts can smoothly pass through and achieve reliable fixation.

[0062] At the four corners inside the heat dissipation shell 1, holes matching the positioning grooves 202 on the PCB assembly 2 are arranged. The positions, sizes and shapes of these holes correspond to the positioning grooves 202, so that the bolts can pass through the positioning grooves 202 of the PCB assembly 2 and the holes inside the heat dissipation shell 1 at the same time, and fix the PCB assembly 2 inside the heat dissipation shell 1. The bolts firmly fix the PCB assembly 2 inside the heat dissipation shell 1 through the positioning grooves 202.

[0063] In combination with Figure 1 , Figure 2 , Figure 3 and Figure 4 , it can be seen that positioning protrusions are arranged around the inside of the heat dissipation shell 1, and positioning grooves 202 matching the positioning protrusions are arranged around the PCB 201.

[0064] Specifically, positioning protrusions are arranged around the inside of the heat dissipation shell 1. These positioning protrusions are generally structures that protrude inward from the inner wall of the heat dissipation shell 1. The shape, size, and position of the positioning protrusions are carefully designed to ensure accurate fitting with the PCB board 201 on the PCB board assembly 2. The number of positioning protrusions generally corresponds to the number of PCB boards 201 around the PCB board assembly 2. A common layout is to arrange a certain number of positioning protrusions on each of the four edges inside the heat dissipation shell 1 to achieve all-around positioning.

[0065] The PCB board 201 is a groove structure formed on the edge of the PCB board assembly 2 through specific processes such as cutting or etching. The size and shape of the PCB board 201 are adapted to the positioning protrusions. When the PCB board assembly 2 is installed inside the heat dissipation shell 1, the positioning protrusions can be perfectly embedded in the PCB board 201, playing a role in positioning and fixing.

[0066] When installing the PCB board assembly 2 inside the heat dissipation shell 1, the operator places the PCB board assembly 2 close to the heat dissipation shell 1, making the PCB boards 201 around the PCB board assembly 2 correspond one-to-one with the positioning protrusions around the inside of the heat dissipation shell 1. Then, the PCB board assembly 2 is slowly placed inside the heat dissipation shell 1, and the positioning protrusions gradually embed into the PCB board 201. Because the size and shape of the positioning protrusions and the PCB board 201 match each other, this embedding process can ensure the accurate position of the PCB board 201 inside the heat dissipation shell 1, avoiding the PCB board assembly 2 from being offset or tilted during installation.

[0067] In combination with Figure 1 , Figure 2 , Figure 3 and Figure 4 , the power cord 6 and the data cord 7 are fixedly installed at both ends of the heat dissipation shell 1.

[0068] Specifically, the power cord 6 is arranged at one end of the heat dissipation shell 1. The power cord interface is generally a hole or a connection structure with a specific shape and size, which may contain metal contacts or terminal inside. Its design conforms to relevant electrical standards and specifications to ensure safe and reliable connection with the power cord 6. The power cord interface is used to connect the external power cord 6, introducing the power of the external power source into the micro-inverter, providing power support for the operation of the inverter.

[0069] The data line 7 is arranged at the other end of the heat dissipation shell 1, and the power line 6 is arranged at the two ends of the heat dissipation shell 1 respectively. The data line interface is also a connecting component with a specific structure and size, usually including a plurality of metal pins or slots for transmitting data signals. The interface type may be different according to different communication protocols and data transmission requirements. The data line interface is used to connect the external data line 7, so as to realize data communication between the micro inverter and external equipment, so as to monitor, control and interact data of the working state of the micro inverter.

[0070] In combination Figures 3-9 As shown in the figure, the heat dissipation shell 1 is made of aluminum material by one-piece die casting.

[0071] Specifically, the aluminum material has good thermal conductivity, light weight and certain strength, and is very suitable for manufacturing electronic equipment shells that need to dissipate heat and have certain weight requirements. Further, the one-piece die casting process makes the heat dissipation shell 1 a whole structure without gaps connected by welding, splicing and other methods, and has higher integrity and stability.

[0072] Then a closed or semi-closed space is formed inside the heat dissipation shell 1 for accommodating various electronic components and parts. The size and layout of the internal space are carefully designed to ensure that there is enough space between the components for heat dissipation, electrical connection and mechanical fixation.

[0073] As an embodiment, as shown in the figure Figures 3 to 9 , Figure 11 As shown in the figure, two groups of airflow efficiency adjusting assemblies 8 are installed on the inside of the heat dissipation shell 1. The airflow efficiency adjusting assembly 8 includes a first hollow roller frame 801 fixedly installed on one side of the inside of the heat dissipation shell 1, and a second hollow roller frame 807 fixedly installed on the other side of the inside of the heat dissipation shell 1. The inside of the first hollow roller frame 801 and the inside of the second hollow roller frame 807 are rotatably installed with a rotating roller 802. The number of the rotating rollers 802 is two groups. One group of rotating rollers 802 is wound with a coarse mesh filter screen 805 inside, and the other group of rotating rollers 802 is wound with a fine mesh filter screen 804 inside. The fine mesh filter screen 804 and the coarse mesh filter screen 805 are fixedly installed with a sealing belt 803 therebetween. The inside of the fine mesh filter screen 804 is provided with a plurality of small filter screen holes 808, and the inside of the coarse mesh filter screen 805 is provided with a plurality of large filter screen holes 806. The hole diameter of the large filter screen holes 806 is larger than the hole diameter of the small filter screen holes 808. The length of the fine mesh filter screen 804, the sealing belt 803 and the coarse mesh filter screen 805 is consistent. The distance of the rotation of the fine mesh filter screen 804, the sealing belt 803 and the coarse mesh filter screen 805 driven by the PLC program setting of the rotating roller 802 is set, so that the fine mesh filter screen 804, the sealing belt 803 and the coarse mesh filter screen 805 can be rotated to the specified position.

[0074] Specifically, the inside of the heat dissipation boss 4 is equipped with a temperature sensor, which can set three levels according to the specific temperature of the PCBA heat chip 3, and the three levels are designed as normal temperature, secondary temperature and tertiary temperature respectively. The temperature sensor controls the first motor for controlling the rotation of the rotating roller 802 through the communication protocol, and the first motor is fixedly installed on the inner wall of the heat dissipation shell 1. When the photovoltaic micro-inverter is at normal temperature, the sealing belt 803 is located directly above the heat dissipation fins 501, and the air gap between the heat dissipation fins 501 is sealed by the sealing belt 803. The outside air cannot enter the inner wall of the heat dissipation shell 1. At this time, the photovoltaic micro-inverter mainly relies on the fin assembly 5 for heat dissipation. If the temperature sensor detects that the temperature inside the heat dissipation shell 1 is secondary temperature, at this time Figure 8 , the first motor drives the rotating roller 802 to rotate counterclockwise, and the sealing belt 803 moves towards the direction of the first hollow roller frame 801, so that the sealing belt 803 is collected in the inside of the first hollow roller frame 801. At this time, the fine mesh screen 804 replaces the sealing belt 803 to come directly above the heat dissipation fins 501, and the fine mesh screen 804 blocks the large particles of dust from entering the inside of the photovoltaic micro-inverter while quickly passing the internal airflow to the outside of the photovoltaic micro-inverter, thereby improving the heat dissipation power. If the temperature sensor detects that the temperature inside the heat dissipation shell 1 is tertiary temperature, the first motor drives the rotating roller 802 to rotate clockwise, and the sealing belt 803 moves towards the direction of the second hollow roller frame 807. The sealing belt 803 is collected in the inside of the second hollow roller frame 807. At this time, the coarse mesh screen 805 replaces the sealing belt 803 to come directly above the heat dissipation fins 501. Since the aperture of the large filter screen hole 806 is larger than that of the small filter screen hole 808, the efficiency of the small filter screen hole 808 in conducting airflow is greater than that of the large filter screen hole 806. Therefore, the heat dissipation power is improved synchronously, so that the photovoltaic micro-inverter can adjust the overall heat dissipation efficiency of the equipment according to the internal temperature condition while preventing dust, and better protect the long-term operation of the photovoltaic micro-inverter.

[0075] And the heat-conducting plate 10 and the heat-dissipation shell 1 are mounted with a heat-dissipation assembly 9, the heat-dissipation assembly 9 comprises a plurality of positioning racks 901 fixedly installed on the inner wall of the heat-dissipation shell 1, the positioning racks 901 are fixedly installed with motor racks 903 on the side towards the heat-dissipation boss 4, the output end of the motor rack 903 is fixedly installed with a heat-dissipation fan 902, the auxiliary heat-dissipation assembly 9 adopts a plastic or aluminum alloy impeller, so that the running noise is less than 40 dB, at the same time, on the basis of the passive heat-dissipation of the fin assembly 5, a micro fan mechanism is increased, the heat-dissipation fan 902 driven by the second motor inside the motor rack 903 rotates along the positioning rack 901, the heat flow conducted by the PCBA heat chip 3 and the heat-dissipation boss 4 is guided to the outside, the diameter of the micro fan mechanism is 20-50 mm, the rotating speed is 5000-20000 rpm, and then the heat around the PCBA heat chip 3 and the heat-dissipation boss 4 is accelerated to dissipate through forced convection, the heat-conducting silica gel filled between the heat-dissipation boss 4 and the PCBA heat chip is prevented from rapid aging, the overall heat inside the heat-dissipation shell 1 is quickly dissipated, at the same time, the change of the heat-dissipation area cooperates with the airflow efficiency adjustment assembly 8 to accelerate the conduction of the airflow and the heat stress accumulated on the surface of the heat-dissipation fin 501, so as to prolong the service life of the equipment assembly.

[0076] It is explained that the area where the motor rack 903 is located does not completely cover the space flow range of the heat-dissipation fin 501, according to the Figure 12 It is explained that the area where the motor rack 903 is located does not completely cover the space flow range of the heat-dissipation fin 501, according to the

[0077] It is explained that the area where the motor rack 903 is located does not completely cover the space flow range of the heat-dissipation fin 501, according to the Figures 6 to 10As shown, the airflow efficiency adjusting assembly 8 further comprises a transverse positioning frame 810 fixedly installed on the first hollow roller frame 801 extending to one side of the heat dissipation shell 1, a cleaning brush mounting frame 812 is slidingly installed inside the transverse positioning frame 810, and a spring 811 is fixedly installed between the cleaning brush mounting frame 812 and the transverse positioning frame 810. A dust collection groove frame 809 is inserted on one side of the heat dissipation shell 1 and inserted inside the transverse positioning frame 810. One end of the dust collection groove frame 809 extending to the inside of the heat dissipation shell 1 is arranged in a sealed state with the first hollow roller frame 801 and the second hollow roller frame 807. The sealing band 803, the fine-pore filter screen 804, and the coarse-pore filter screen 805 are prone to accumulate a certain amount of dust during the airflow conversion process, which will affect the heat dissipation effect of the fine-pore filter screen 804 and the coarse-pore filter screen 805. If the staff needs to clean the inside of the equipment frequently, it will increase the workload of the staff. Therefore, when the sealing band 803, the fine-pore filter screen 804, and the coarse-pore filter screen 805 slide along the rotating roller 802, the coarse-pore filter screen 805 and the fine-pore filter screen 804 will come into contact with the brush mounted on the cleaning brush mounting frame 812. Then the brush is adjusted to the appropriate position along the transverse positioning frame 810 by the spring 811 according to the pressure of the coarse-pore filter screen 805 or the fine-pore filter screen 804. No matter the rotating roller 802 drives the coarse-pore filter screen 805 to rotate forward or reversely, the dust inside the coarse-pore filter screen 805 or the fine-pore filter screen 804 is brushed down by the cleaning brush mounting frame 812 and falls to the dust collection groove frame 809 or the position below the side of the spring 811 away from the dust collection groove frame 809 by gravity. A certain amount of dust-absorbing cotton is installed inside the dust collection groove frame 809. After the dust-absorbing cotton absorbs the dust, it can prevent the dust from returning to the fine-pore filter screen 804 or the coarse-pore filter screen 805, and it can also collect more dust. The upper surface of the coarse-pore filter screen 805 is attached to the side of the first hollow roller frame 801 away from the heat dissipation shell 1, further reducing the dust on the outer wall of the coarse-pore filter screen 805 falling inside the equipment. Therefore, the staff can clean the dust accumulated in the dust collection groove frame 809 for a month or more, thereby reducing the workload of the staff and improving the use efficiency of the filter screen and the airflow circulation efficiency inside the equipment.

[0078] A plurality of limiting clamping plates 11 are fixedly installed on the inner wall of the heat dissipation shell 1. Under the limiting of the limiting clamping plates 11, the fine-pore filter screen 804, the sealing band 803, and the coarse-pore filter screen 805 slide in a manner of being attached directly above the auxiliary heat dissipation fins 501.

[0079] In order to ensure that the photovoltaic micro-inverter is in a sealed state under normal conditions, the sealing band 803 and the heat dissipation shell 1 form a closed and attached state, thereby preventing dust from entering the inside of the equipment and preventing dust from interfering with the electronic components inside the heat dissipation shell 1.

[0080] In another aspect, the application provides a heat dissipation method of a photovoltaic micro-inverter with automatically adjusted heat dissipation power, comprising the following steps:

[0081] S1, the heat generated by the PCBA heat chip 3 is transferred to the heat dissipation boss 4, and the heat is conducted to the heat dissipation fins 501 and the heat dissipation wing plates 502 on the front of the heat dissipation shell 1 through the heat dissipation boss 4 and the heat dissipation shell 1, at the same time, the heat will be transferred from the heat dissipation fins 501 and the heat dissipation wing plates 502 with higher temperature to the surrounding air with lower temperature, and the air will flow through the gap between the heat dissipation fins 501 and the heat dissipation wing plates 502 under the action of natural convection or forced convection, and take away the heat of the heat dissipation fins 501 and the heat dissipation wing plates 502;

[0082] S2, when the PCBA heat chip 3 generates a large amount of heat, the temperature sensor controls the rotating roller 802 to adjust the transformation of the position between the sealing belt 803, the fine mesh filter screen 804, the coarse mesh filter screen 805 and the heat dissipation fins 501 through the communication protocol, for switching the sealing area, the first-level heat dissipation area and the second-level heat dissipation area, and automatically adjusting the heat dissipation power inside the equipment;

[0083] S3, the second motor mounted in the motor frame 903 drives the heat dissipation fan 902 to rotate along the positioning frame 901, guides the hot air flow conducted by the heat dissipation boss 4 and the PCBA heat chip 3 to the outside, causes the heat dissipation shell 1 and the external air to generate an air pressure difference, and then the large amount of airflow in the heat dissipation shell 1 rapidly passes through the heat dissipation fins 501 and the external air to form the action of secondary conversion.

[0084] The above specific embodiments are only several optional embodiments of the application, and based on the technical solutions of the application and the related inspiration of the above embodiments, the person skilled in the art can make some modifications to the above specific embodiments.

Claims

1. A photovoltaic micro-inverter heat dissipation structure with automatically adjustable heat dissipation power, comprising a heat dissipation shell (1) and a PCB board assembly (2) disposed inside the heat dissipation shell (1), characterized in that, Two sets of airflow efficiency adjustment components (8) are installed on both sides of the interior of the heat dissipation shell (1). The airflow efficiency adjustment component (8) includes a first hollow roller frame (801) fixedly installed on one side inside the heat dissipation shell (1), and a second hollow roller frame (807) fixedly installed on the other side inside the heat dissipation shell (1). Both the first hollow roller frame (801) and the second hollow roller frame (807) have rotating rollers (802) rotatably installed inside. There are two sets of rotating rollers (802). One set of rotating rollers (802) has a coarse-pore filter screen (805) wound inside, and the other set of rotating rollers (802) has a fine-pore filter screen (804) wound inside. A sealing strip (803) is fixedly installed between the fine-pore filter screen (804) and the coarse-pore filter screen (805). The fine-pore filter screen (804) has multiple small filter holes (808) inside, and the coarse-pore filter screen (805) has multiple large filter holes (806) inside. The diameter of the large filter holes (806) is larger than the diameter of the small filter holes (808).

2. The photovoltaic micro-inverter heat dissipation structure with automatically adjustable heat dissipation power according to claim 1, characterized in that, Multiple PCBA heating chips (3) are fixedly installed on the outside of the PCB board assembly (2), and a heat-conducting plate (10) is fixedly installed inside the heat dissipation shell (1). A heat dissipation boss (4) adapted to the multiple PCBA heating chips (3) is fixedly installed on one side of the heat-conducting plate (10).

3. The photovoltaic micro-inverter heat dissipation structure with automatically adjustable heat dissipation power according to claim 2, characterized in that, The heat dissipation shell (1) is provided with a fin assembly (5) on the outside. The heat generated by the PCBA heating chip (3) can be conducted through the heat dissipation boss (4) to the fin assembly (5) on the outside of the heat dissipation shell (1) and then dissipated into the air.

4. The photovoltaic micro-inverter heat dissipation structure with automatically adjustable heat dissipation power according to claim 3, characterized in that, The heat dissipation boss (4) has a concave-convex structure, and the vertical distance between each position on the upper surface of the heat dissipation boss (4) and the packaging surface of the PCBA heat-generating chip (3) is equal.

5. The photovoltaic micro-inverter heat dissipation structure with automatically adjustable heat dissipation power according to claim 4, characterized in that, The fin assembly (5) includes a plurality of heat sinks (501) arranged in a matrix along the width direction on the front side of the heat sink housing (1). A heat sink fin (502) is provided on one side of the heat sink housing (1). A reinforcing rib (503) is fixedly installed at the bottom of the heat sink fin (502) and at the side facing the heat sink housing (1).

6. The photovoltaic micro-inverter heat dissipation structure with automatically adjustable heat dissipation power according to claim 5, characterized in that, The PCB board assembly (2) includes a PCB board (201), and bolt holes (203) are provided at the four corners of the PCB board (201). Holes matching the bolt holes (203) are opened on the inner wall of the heat dissipation shell (1) at the four corners. The PCB board (201) is fixedly installed inside the heat dissipation shell (1) by bolts.

7. The photovoltaic micro-inverter heat dissipation structure with automatically adjustable heat dissipation power according to claim 6, characterized in that, The heat dissipation shell (1) has positioning protrusions around its interior, and the PCB board (201) has positioning grooves (202) around its perimeter that match the positioning protrusions. Power cords (6) and data cords (7) are fixedly installed at both ends of the heat dissipation shell (1).

8. The photovoltaic micro-inverter heat dissipation structure with automatically adjustable heat dissipation power according to claim 7, characterized in that, The airflow efficiency adjustment component (8) further includes a transverse positioning frame (810) fixedly installed on the side of the first hollow roller frame (801) extending to the heat dissipation shell (1). A cleaning brush mounting frame (812) is slidably installed inside the transverse positioning frame (810). A spring (811) is fixedly installed between the cleaning brush mounting frame (812) and the transverse positioning frame (810). A dust collection trough frame (809) is inserted into one side of the heat dissipation shell (1). The dust collection trough frame (809) is inserted into the transverse positioning frame (810). One end of the dust collection trough frame (809) extending into the heat dissipation shell (1) is sealed to the first hollow roller frame (801) and the second hollow roller frame (807). A plurality of limiting plates (11) are fixedly installed on the inner wall of the heat dissipation shell (1).

9. The photovoltaic micro-inverter heat dissipation structure with automatically adjustable heat dissipation power according to claim 8, characterized in that, A heat dissipation assembly (9) is installed between the heat-conducting plate (10) and the heat dissipation shell (1). The heat dissipation assembly (9) includes multiple positioning frames (901) fixedly installed on the inner wall of the heat dissipation shell (1). A motor frame (903) is fixedly installed on the side of the positioning frame (901) facing the heat dissipation boss (4). A cooling fan (902) is fixedly installed at the output end of the motor frame (903).

10. A heat dissipation method for a photovoltaic microinverter with automatically adjustable heat dissipation power, using the photovoltaic microinverter heat dissipation structure with automatically adjustable heat dissipation power as described in claim 9, characterized in that, Includes the following steps: S1. The heat generated by the PCBA heat-generating chip (3) is transferred to the heat dissipation boss (4). The heat is conducted through the heat dissipation boss (4) and the heat dissipation shell (1) to the heat dissipation fins (501) and heat dissipation wing plates (502) on the front of the heat dissipation shell (1). Under the action of natural convection or forced convection, the air will continuously flow through the gap between the heat dissipation fins (501) and heat dissipation wing plates (502), and carry away the heat of the heat dissipation fins (501) and heat dissipation wing plates (502). S2. When the PCBA heating chip (3) generates a lot of heat, the temperature sensor controls the rotating roller (802) through the communication protocol to adjust the position of the sealing strip (803), fine pore filter (804), coarse pore filter (805) and heat sink (501) to switch the sealing area, primary heat dissipation area and secondary heat dissipation area, thereby automatically adjusting the heat dissipation power inside the equipment. S3. The second motor mounted inside the motor frame (903) drives the cooling fan (902) to rotate along the positioning frame (901), guiding the hot airflow conducted by the heat dissipation boss (4) and the PCBA heating chip (3) to the outside, causing a pressure difference between the heat dissipation shell (1) and the outside air. Then, a large amount of airflow inside the heat dissipation shell (1) rapidly passes through the heat sink (501) and forms a secondary conversion with the outside air.

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