Control device adopting regional concept

Abstract

The invention relates to a control device (1) for an electric motor vehicle, comprising a housing (2) which delimits an outer region (3) located outside the housing (2) and an inner region (4, 5, 6) located inside the housing (2), a line (7) being arranged in a first inner region (4) and a filter (8) being arranged in a second inner region (5), a logic board (9), a power board (10) and an inverter (11) are arranged in the third inner region (6), the outer region (3) is isolated from the inner regions (4, 5, 6), and the inner regions (4, 5, 6) are isolated from each other by at least one measure selected from the group consisting of shielding, filtering and spatial isolation.

Description

Technical Field

[0001] This invention relates to a control device for (pure) electric motor vehicles, particularly a high-voltage control device. Background Technology

[0002] With the increasing introduction of electric motor vehicles (EVs), the importance of batteries required to power EVs is also growing. EVs are equipped with batteries that can provide voltages between 400 V and 800 V. Such high voltages are particularly advantageous because they allow for lower currents while maintaining the same power output, which in turn reduces the cable cross-section required for current carrying capacity and thus reduces material requirements.

[0003] However, the problem with higher voltages is that higher available voltages also lead to higher interference. Control units are particularly critical, as they are often major sources of interference in electromechanical systems (especially due to the steep switching edges of inverters installed in control units). Therefore, electromagnetic compatibility (EMC) concepts must typically be developed for high-voltage applications, and especially for high-voltage control units, to meet the stringent EMC requirements of automotive applications.

[0004] The disadvantage of known control devices in the prior art is that they generally cannot meet stringent EMC requirements, or can only meet them with adverse effects on the required installation space and cost. Summary of the Invention

[0005] Therefore, the object of the present invention is to avoid or at least mitigate the disadvantages of the prior art. In particular, it is to provide a control device, especially a high-voltage control device, that is electromagnetically compatible, meets high requirements for installation space, and is cost-effective.

[0006] This objective is achieved by a control device having the features of claim 1. Favorable research forms the subject matter of the dependent claims.

[0007] Therefore, according to the invention, this objective is achieved by: a control device comprising a housing defining an outer region located outside the housing and an inner region located inside the housing, wherein wiring (and optionally an (AC) current sensor (described later)) is arranged in a first inner region, a filter is arranged in a second inner region, and a logic board, a power board, and an inverter are arranged in a third inner region. The outer region is isolated from the inner region, and the inner regions are isolated from each other by at least one measure selected from shielding, filtering, and spatial isolation.

[0008] This means that, in the control device according to the invention, the concept of zones utilizes the principles of filtering, shielding, and spatial isolation or spatially specific arrangement of interference sources and receivers, and combines them to achieve an EMC-robust design. Accordingly, the control device is divided into different zones, and the transition between two zones includes at least one of the three measures: shielding, filtering, or spatial isolation or specific spatial arrangement.

[0009] The advantages of this are that different zones ensure that circuit components such as inverters (power modules) and logic boards (logic PCBs) do not negatively impact each other. Additionally, it ensures that external interference sources do not negatively affect the control unit, and that the control unit does not interfere with external systems. In other words, the zone concept satisfies both the internal and external EMC requirements of the control unit itself.

[0010] According to a preferred embodiment, the transition between the outer region and the first inner region can be shielded and filtered. This means that all interfaces from the control device to the outer region / environment / region outside the control device are filtered and / or shielded. This means that only minimal interference escapes from the control device.

[0011] Preferably, the first internal region can be the outermost internal region (compared to the other internal regions) within the control device. This means that the first internal region spatially isolates / separates the second and third internal regions from the external regions. Specifically, the first internal region can preferably completely surround the second and third internal regions spatially. Preferably, the third internal region can be the innermost internal region (compared to the other internal regions) within the control device.

[0012] According to a preferred embodiment, the transition between the first internal region and the third internal region can be filtered by a filter arranged in the second internal region at the transition point between the first and third internal regions. This means that the first internal region is the area inside the control device housing where all lines leading from the control device have been filtered. Additionally, the first internal region can be partially shielded, for example, to isolate the area of ​​the first internal region adjacent to the logic board from the area adjacent to the inverter. This allows interference from areas with higher interference levels, particularly from the third internal region or from the inverter, to be shielded against or against the logic board. Therefore, interference from the control device is low in the first internal region but higher than in the external regions.

[0013] According to a preferred embodiment, the control device may include a metal shielding portion inside a third internal region that isolates a first sub-region in which a logic board is arranged and a second sub-region in which a power board and an inverter are arranged from each other. By providing distinct areas within the third internal region, interference sources and interference receivers are spatially separated and additionally shielded by the metal shielding portion. This third internal region is highly susceptible to interference due to the arrangement of components with high interference emissions (e.g., inverters), and interference from the logic board and power board in this region has not been filtered or shielded. This reduces interference between the logic board, which acts as both an interference source and a interference receiver, and the power board, which generates more interference than the logic board.

[0014] According to a preferred embodiment, the filter may include a Controller Area Network (CAN) EMC filter, a power supply unit (Power Supply Unit EMC) filter, and / or an RPS temperature filter (RPS + temp EMC filter) used as a filter for a logic board. According to a preferred embodiment, the filter may include a high-voltage AC filter (HV AC EMC filter) and / or a high-voltage DC filter (HV DC EMC filter) used as a filter for a power board and an inverter. In the second internal region, the filter enables a transition from high interference (in the third internal region) to low interference (in the first internal region) for interference emitted or generated by the control device.

[0015] The filter can preferably be placed in a specific spatial location, and is particularly arranged as close as possible to the interface between the control device and the external environment.

[0016] According to another study of the preferred embodiment, the high-voltage AC filter can be directly connected downstream of the inverter. This means that the high-voltage AC filter is specifically positioned so that interference generated in the inverter propagates to the control unit as little as possible.

[0017] According to a preferred embodiment, the control device may include an AC current sensor connected downstream of a high-voltage AC filter and disposed in a first internal region. Because inverter interference is directly filtered by the high-voltage AC filter, the AC current sensor can be placed in the first internal region, minimizing its exposure to inverter interference.

[0018] Preferably, the high-voltage AC filter may include at least one ferrite or nanocrystal core that surrounds all three motor phases in a common-mode manner.

[0019] According to research on preferred embodiments, the controller area network filter, power supply filter, RPS temperature filter, and / or high-voltage AC filter may not be shielded relative to the first and third internal regions. Therefore, additional shielding for the filters can be omitted unless absolutely necessary. This means that the controller area network filter, power supply filter, RPS temperature filter, and / or high-voltage AC filter are arranged in a first sub-region of the second internal region, wherein the filters are spatially specifically placed, i.e., as close as possible to the interface between the control device and the external environment, but are not shielded in additional metallic space.

[0020] According to another study of the preferred embodiment, the high-voltage DC filter connected downstream of the inverter can be metal-shielded for the first internal region and / or the third internal region, particularly a second sub-region of the third internal region. Since the high-voltage DC filter is placed in the region with the greatest interference, an additional metal housing is installed for the control device as metal shielding for the high-voltage DC filter. This means that the high-voltage DC filter is arranged in the second sub-region of the second internal region, where the filter is spatially specifically positioned as close as possible to the interface between the control device and the external environment and additionally shielded in an additional metal space.

[0021] Preferably, the high-voltage DC filter may have or include an X capacitor and a Y capacitor, as well as at least one ferrite or nanocrystal core.

[0022] According to a study of a preferred embodiment, the control device may include a DC current sensor placed between the high-voltage DC filter and the inverter and arranged in a third internal region.

[0023] According to a preferred embodiment, the control device may include a DC connection portion located between the DC current sensor and the inverter and arranged in a third internal region.

[0024] In other words, the present invention relates to a control device divided into multiple regions, which essentially includes the following components: a control device housing, a logic board (logic PCB), an inverter (power module), an AC current sensor, a DC current sensor, an HV DCEMC filter, a power board, various interfaces, and intermediate circuitry. Region 0 / External Region is the region outside the control device. All interfaces between the control device and the environment are filtered and / or shielded. In this region, very little interference escapes from the control device. Region 1 / First Internal Region is the region inside the control device / ECU housing, but all wiring in this region has been filtered. To some extent, this region also shields against interference from regions with higher interference levels (e.g., from the logic board of the power module / inverter). In Region 1, interference from the device is low, but higher than in Region 0. Region 2 / Second Internal Region is the region where the filter is located. Inside region 2, a distinction can be made between the first sub-region / region 2A, where filters are spatially specifically placed (as close as possible to the interface between the control device and the external environment) but not additionally metal-shielded, and the second sub-region / region 2B, where filters are both spatially specifically placed (as close as possible to the interface between the control device and the external environment) and additionally metal-shielded. In region 2, a transition from high to low interference occurs for interference from the control device. Region 3 / the third internal region is where boards with circuit components and circuit devices without boards are placed. Region 3 is highly susceptible to interference and is a "dirty" region where interference from the corresponding circuit boards has not yet been filtered and shielded. On the circuit boards and circuit components, different areas (interference sources and interference receivers) can be defined from each other by spatial isolation. Within region 3, a distinction can be made between the first sub-region / region 3A, where the logic board (acting as both an interference source and a interference receiver) is located in the third internal region, and the second sub-region / region 3B, where the power electronic devices in the third internal region are located and where the inverter is a strong source of interference. Regions 3A and 3B can be isolated from each other by a metal shield.

[0025] Furthermore, this invention relates to a method of implementing the region concept. At the transition between Region 0 / Outer Region and Region 1 / First Inner Region, all interfaces of the control device are filtered to the external environment, and additionally, the control device has a metal housing with a maximum screw pitch of 7 cm at this transition, thus shielding it relative to the external environment. At the transition between Region 1 / First Inner Region (i.e., inside the metal housing) and Region 2 / Second Inner Region, there is no shielding for the circuit board, but the filter region (=Region 2) begins at this transition. When viewed from the inside out, the filter circuitry begins at the transition between Region 2 / Second Inner Region and Region 3 / Third Inner Region. Attached Figure Description

[0026] The invention will now be described with reference to the accompanying drawings. In the drawings: Figure 1 A diagram showing the partition structure of the control device according to the present invention is provided.

[0027] The accompanying drawings are schematic in nature and are intended only to illustrate the invention. The same elements are provided with the same reference numerals. Detailed Implementation

[0028] Figure 1 The structure of the control device 1 according to the present invention is shown. The control device 1 is designed as a high-voltage control device.

[0029] The control device 1 includes a housing 2. The housing 2 defines an outer region 3 located outside the housing 2 and inner regions 4, 5, and 6 located inside the housing. A circuit 7 is arranged in the first inner region 4. The circuit 7 has been filtered; that is, a filter is installed upstream. A filter 8 is arranged in the second inner region 5. A logic board 9 with a microcontroller 9a, a power board 10, and an inverter 11 are arranged in the third inner region 6. Figure 1 In this context, the power module is specifically referred to as inverter 11, although alternatively, the entire area where the power module is located may also be referred to as inverter 11.

[0030] In the control device, the outer region 3 is isolated from the inner regions 4, 5, and 6, and the inner regions 4, 5, and 6 are isolated from each other by at least one measure selected from shielding, filtering, and spatial isolation.

[0031] External region 3 (region 0) is the region outside of control device 1. All interfaces between control device 1 and the environment are filtered and shielded. In this region, very little interference escapes from control device 1.

[0032] The first internal region 4 (region 1) is the region inside the control device 1. All interfaces / lines 7 in this region are filtered and partially additionally shielded. In this region, only low-level interference escapes from the control device 1, but the interference level is higher than that escaping from the external region 3.

[0033] The second internal region 5 (regions 2 or 2A and 2B) is the region where the filter 8 is housed. In the first sub-region 12 of the second internal region 5 (region 2A), the interface or filter 8 is not additionally shielded. In the second sub-region 13 of the second internal region 5 (region 2B), the interface or filter 8 is additionally metal shielded. The second internal region 5 utilizes the principle of specific spatial placement, wherein the filter 8 is placed as close as possible to the interface between the control device 1 and the external environment.

[0034] The "Logic PCB Filter" area 14 is assigned to the first sub-area 12 of the second internal area 5. A power supply filter 15 (power supply EMC filter) and a controller area network filter 16 (CAN EMC filter) are arranged in this area. Transmission is made via the 0-level IF line 17 to the power supply 18 or to the CAN 19.

[0035] The "Logic PCB Filter Sensor" area 20 is assigned to the first sub-area 12 of the second internal area 5. An RPS temperature filter 21 (RPS + temp EMC filter) is arranged in this area. Transmission is made via the 0-level IF line 17 to RPS + temp 22.

[0036] The "HV AC filter" region 23 is assigned to the first sub-region 12 of the second internal region 5. A high-voltage AC filter 24 (HV AC EMC filter) is arranged in this region. Transmission proceeds via the first-stage IF line 25 to the AC current sensor 26 (AC current sensor), and then from there via the zero-stage IF line 17 to the electric drive machine 27 (EM). The AC current sensor 26 is connected downstream of the high-voltage AC filter 24 and is arranged in the first internal region 4.

[0037] The “HV DC filter” area 28 is assigned to the second sub-area 13 of the second internal area 5. A high-voltage DC filter 29 (HV DC EMC filter) is arranged in this area. Transmission is made to the high-voltage power supply unit 30 (HV power supply unit) via the 0-level IF line 17.

[0038] The third internal region 6 (regions 3 or 3A and 3B) is the region where the logic board 9, the power board 10, and the inverter 11 are housed. In the first sub-region 31 of the third internal region 6 (region 3A), the interfaces are not filtered or shielded. In the second sub-region 32 of the third internal region 6 (region 3B), the interfaces are not filtered or shielded. The third internal region 6 utilizes a specific space placement principle, in which the logic board 9 is arranged isolated from the power board 10 and the inverter 11. Furthermore, the first sub-region 31 and the second sub-region 32 are isolated from each other by a metal shield 33. Additionally, the second sub-region 32 of the third internal region 6 (region 3B) utilizes a specific space placement principle, in which the power board 10 is arranged to be isolated from the inverter 11.

[0039] The “Logic PCB Filter” area 14 and the “Logic PCB Filter Sensor” area 20 are arranged in the first sub-area 31 of the third internal area 6 (area 3A). The “HV AC Filter” area 23 and the “HV DC Filter” area 28 are arranged in the second sub-area 32 of the third internal area 6 (area 3B).

[0040] A logic board 9 with a microcontroller (µC) 9a is connected to a power board 10 (power PCB / gate driver) via a first-level IF line 25. The power board 10 is connected to an inverter 11 (power module) via a first-level IF line 25.

[0041] Inverter 11 is connected to high-voltage AC filter 24 via stage 1 IF line 25. Specifically, high-voltage AC filter 24 is directly connected downstream of inverter 11. Inverter 11 is connected via stage 1 IF line 25 to DC connection 33 (DC link) (arranged in the second sub-region 32 of the third internal region 6 (region 3B)). DC connection 33 is connected via stage 1 IF line 25 to DC current sensor 34 (DC current sensor) (arranged in the second sub-region 32 of the third internal region 6 (region 3B)). DC current sensor 34 is connected to high-voltage DC filter 29 via stage 0 IF line 17.

[0042] List of reference numerals 1. Control device 2. Shell 3. External Area 4 First Internal Region 5 Second Internal Region 6. Third Internal Area 7 lines 8 Filters 9 Logic Boards 10 Electricity Board 11 Inverter 12 First Subregion 13 Second Subregion 14 “Logic PCB Filter” area 15 Power Supply Filter 16 Controller Area Network Filter 17 Level 0 IF Line 18 Power supply unit 19 CAN 20 “Logic PCB Filter Sensor” area 21 RPS Temperature Filter 22 RPS + temp 23 “HV AC Filter” area 24 High-voltage AC filter 25 Level 1 IF Line 26 AC current sensor 27 Electric-driven machines 28 “HV DC Filter” area 29 High-voltage DC filter 30 High-voltage power supply device 31 First Subregion 32 Second Subregion 33 Metal shielding part 34 DC Connection Section 35 DC Current Sensor

Claims

1. Control device (1) for an electrically driven motor vehicle, having a housing (2) which delimits an outer region (3) located outside the housing (2) and an inner region (4, 5, 6) located inside the housing (2), wherein In the first inner zone (4) a line (7) is arranged, in the second inner zone (5) a filter (8) is arranged, and in the third inner zone (6) a logic board (9), a power board (10) and an inverter (11) are arranged, characterized in that the outer zone (3) is separated from the inner zones (4, 5, 6) and the inner zones (4, 5, 6) are separated from each other by at least one measure selected from the group consisting of shielding, filtering and spatial separation.

2. The control device (1) according to claim 1, characterized in that The transition between the outer zone (3) and the first inner zone (4) is shielded and filtered.

3. The control device (1) according to claim 1 or 2, characterized in that The transition between the first inner zone (4) and the third inner zone (6) is filtered by the filter (8) arranged in the second inner zone (5).

4. The control device (1 ) according to any one of claims 1 to 3, characterized in that The control device (1) comprises a metal shield (33) inside the third inner zone (6) separating a first sub-zone (31) in which the logic board (9) is arranged from a second sub-zone (32) in which the power board (10) and the inverter (11) are arranged.

5. The control device (1 ) according to any one of claims 1 to 4, characterized in that The filter (8) comprises a controller area network filter (16) serving as a filter (8) for the logic board (9), a power supply filter (15) and / or an RPS temperature filter (21), and / or is characterized in that The filter (8) comprises a high-voltage AC filter (24) and / or a high-voltage DC filter (29) serving as a filter (8) for the power board (10) and the inverter (11).

6. The control device (1) according to claim 5, characterized in that The high-voltage AC filter (24) is directly connected downstream of the inverter (11).

7. The control device (1) according to claim 6, characterized in that The control device (1) comprises an AC current sensor (26) connected downstream of the high-voltage AC filter (24) and arranged in the first inner zone (4).

8. The control device (1) according to any one of claims 5 to 7, characterized in that The high-voltage DC filter (29) connected downstream of the inverter (11) is metal shielded with respect to the first inner zone (4) and / or the third inner zone (6).

9. The control device (1) according to any one of claims 5 to 8, characterized in that The controller area network filter (16), the power supply filter (15), the RPS temperature filter (21) and / or the high-voltage AC filter (24) are not shielded with respect to the first inner zone (4) and the third inner zone (6).

10. The control device (1) according to any one of claims 5 to 9, characterized in that The control device (1) comprises a DC current sensor (35) placed between the high-voltage DC filter (29) and the inverter (11) and arranged in the third inner zone (6).

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