Self-replaceable chip soldering nozzle assembly

Abstract

The present application relates to the field of microelectronic packaging and surface mounting technology, in particular to a chip welding suction nozzle assembly capable of automatic replacement. The chip welding suction nozzle assembly capable of automatic replacement comprises a connecting rod, a suction nozzle piece fixing block and a suction nozzle piece. The connecting rod is provided with a chip suction channel and a suction nozzle piece suction channel; the suction nozzle piece fixing block is installed on the connecting rod and is provided with a ventilation channel communicating with the chip suction channel, and a suction force groove communicating with the suction nozzle piece suction channel and surrounding the ventilation channel is arranged on the suction nozzle piece abutting surface; after the suction nozzle piece suction channel is vacuumized, the suction nozzle piece is adsorbed to the suction nozzle piece abutting surface by the suction force groove, and the vacuum channel of the suction nozzle piece communicates with the ventilation channel. The present application can automatically replace the end suction nozzle piece, can ensure the parallelism of the adsorption surface, can improve the hot-pressing efficiency and can reduce the cost of the suction nozzle.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of microelectronic packaging and surface mounting technology, in particular to a chip welding nozzle assembly capable of automatic replacement. BACKGROUND

[0002] Chip thermal compression bonding machine is a key equipment for chip mounting. It sucks the chip through the vacuum nozzle and precisely mounts it to the designated position of the substrate (such as PCB, glass, wafer, etc.), and then realizes the electrical interconnection and mechanical fixation between the chip and the substrate through the thermal compression process. In this process, the nozzle, as the component that directly contacts and carries the chip, directly affects the precision, quality and efficiency of the mounting.

[0003] In the existing chip thermal compression bonding equipment, the nozzle is usually designed to only adapt to a specific size and shape of chip. When different specifications of chip products need to be replaced on the production line, the operator must stop the machine and manually disassemble the original nozzle from the main shaft of the equipment, and then install another nozzle that matches the new chip. This process is not only tedious, but also causes frequent downtime of the equipment, seriously affecting the overall thermal compression mounting efficiency and capacity of the production line.

[0004] Moreover, after each nozzle replacement, due to manufacturing tolerances and installation errors, there will inevitably be a small degree of parallelism between the suction surface of the new nozzle and the workbench plane. Therefore, the operator must perform a tedious "flatness adjustment" or "Z-axis height calibration" operation to adjust the flatness of the nozzle suction surface and ensure uniform mounting pressure. This calibration process not only wastes time and further reduces the efficiency of the production line, but also requires a high level of technical skill from the operator, introducing the risk of human error that may affect the coplanarity and quality stability of the mounting.

[0005] In addition, to meet the production needs of multiple varieties and small batches, manufacturers must equip one or more dedicated nozzles for each specification of chip. This not only increases the procurement cost and inventory management pressure of nozzles, but also wastes physical resources. At the same time, the storage, identification and retrieval process of a large number of nozzles also increases the complexity and probability of errors in production preparation.

[0006] Therefore, it is urgent to solve the problems existing in the current nozzle when facing the replacement of different specifications of chip products on the production line. SUMMARY

[0007] The technical problem to be solved by the present application is to overcome the defects of the prior art and provide a chip welding nozzle assembly capable of automatic replacement. It can automatically replace the nozzle piece at the end and ensure the parallelism of the suction surface, improve the thermal compression mounting efficiency and reduce the cost of the nozzle.

[0008] In order to solve the above technical problems, the technical scheme of the present application is as follows: a chip welding suction nozzle assembly capable of automatic replacement comprises:

[0009] A connecting rod is provided with a chip suction channel and a suction nozzle piece suction channel.

[0010] A suction nozzle piece fixing block is installed on the connecting rod and is provided with a ventilation channel communicating with the chip suction channel and a suction slot surrounding the ventilation channel on the suction nozzle piece abutting surface.

[0011] A suction nozzle piece is suctioned to the suction nozzle piece abutting surface by the suction slot after the suction nozzle piece suction channel is vacuumized, and the vacuum channel of the suction nozzle piece communicates with the ventilation channel.

[0012] Further, a part of the suction nozzle piece fixing block is sleeved on the connecting rod, and at least one bolt hole is further provided, and a locking bolt is screwed in the bolt hole and abuts against the outer peripheral wall of the connecting rod.

[0013] Further, at least one sealing ring is arranged between the connecting rod and the suction nozzle piece fixing block.

[0014] Further, a communication channel is arranged in the suction nozzle piece fixing block, and the suction slot communicates with the suction nozzle piece suction channel through the communication channel.

[0015] Further, the suction nozzle piece fixing block is provided with at least two positioning pins, and the suction nozzle piece is provided with positioning holes matched with the positioning pins.

[0016] Further, the suction nozzle piece fixing block and the suction nozzle piece are respectively provided with identification holes for camera identification.

[0017] Further, the chip welding suction nozzle assembly capable of automatic replacement further comprises a heating plate, and the heating plate is abutted to the end surface of the suction nozzle piece fixing block away from the suction nozzle piece abutting surface.

[0018] Further, the chip welding suction nozzle assembly capable of automatic replacement further comprises a connecting sleeve, and the connecting sleeve connects the heating plate and is provided with a plurality of heat dissipation holes.

[0019] Further, the chip welding suction nozzle assembly capable of automatic replacement further comprises a heat insulation plate, and the heat insulation plate is installed in the connecting sleeve and is located on the side of the heating plate away from the suction nozzle piece fixing block.

[0020] Further, the openings of the chip suction channel and the suction nozzle piece suction channel away from the suction nozzle piece fixing block are respectively located on the end surface and the peripheral wall of the connecting rod.

[0021] After the above technical scheme is adopted, the present application has the following beneficial effects:

[0022] (1) when replacing different specifications of chip products, the vacuum of the suction nozzle piece adsorption channel is broken through the suction slot, so that the originally adsorbed suction nozzle piece is automatically separated from the suction nozzle piece bonding surface of the suction nozzle piece fixing block under the action of gravity; then the suction nozzle piece adsorption channel is vacuumized, so that the suction nozzle piece bonding surface automatically adsorbs the new suction nozzle piece, so that the automatic replacement of the suction nozzle piece is realized. Compared with manual disassembly and replacement, the replacement efficiency is higher, and the trouble of frequent shutdown of the chip hot pressure welding machine is avoided;

[0023] (2) since the suction nozzle piece is adsorbed on the suction nozzle piece bonding surface of the suction nozzle piece fixing block, the parallelism of the newly replaced suction nozzle piece can be well ensured through surface bonding, the trouble of later adjustment and calibration is avoided, and the stability of the quality of the chip bonding of various specifications is well ensured;

[0024] (3) the suction nozzle piece is a very thin piece, and one suction nozzle piece is provided for each specification of chip, which greatly reduces the waste of physical resources;

[0025] (4) the connection between the suction nozzle piece fixing block and the suction nozzle piece is realized by negative pressure, and this connection mode will not have any adverse effect on the chip adsorbed by the suction nozzle piece, and the firm adsorption of the suction nozzle piece can still be realized under high temperature, and the use reliability is high. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 is a structure diagram of the chip welding suction nozzle assembly of the present application which can be automatically replaced;

[0027] Figure 2 is a sectional view of the chip welding suction nozzle assembly of the present application which can be automatically replaced;

[0028] Figure 3 is a structure diagram of one view of the suction nozzle piece of the present application;

[0029] Figure 4 is a structure diagram of another view of the suction nozzle piece of the present application;

[0030] Figure 5 is a structure diagram of the suction nozzle piece fixing block of the present application;

[0031] Figure 6 is a structure diagram of the suction nozzle piece bonding surface of the suction nozzle piece fixing block of the present application;

[0032] In the figure, 1, connecting rod; 11, chip adsorption channel; 12, suction nozzle piece adsorption channel; 2, suction nozzle piece fixing block; 20, suction nozzle piece fitting surface; 21, ventilation channel; 22, suction slot; 23, bolt hole; 24, communication channel; 3, suction nozzle piece; 31, vacuum channel; 32, positioning hole; 4, sealing ring; 5, positioning pin; 6, identification hole; 7, heating plate; 8, connecting sleeve; 9, heat insulation plate; 10, insulating plate. DETAILED DESCRIPTION

[0033] In order to make the content of the application more easily and clearly understood, the application will be further described in detail below according to specific embodiments and in conjunction with the accompanying drawings.

[0034] As Figures 1 to 6 shown, an automatically replaceable suction nozzle assembly for chip welding comprises:

[0035] The connecting rod 1 is provided with a chip adsorption channel 11 and a suction nozzle piece adsorption channel 12.

[0036] The suction nozzle piece fixing block 2 is installed on the connecting rod 1, which is provided with a ventilation channel 21 communicating with the chip adsorption channel 11, and a suction slot 22 is provided on the suction nozzle piece fitting surface 20 of the suction nozzle piece fixing block 2, which communicates with the suction nozzle piece adsorption channel 12 and surrounds the ventilation channel 21.

[0037] The suction nozzle piece 3 is adsorbed to the suction nozzle piece fitting surface 20 by the suction slot 22 after the suction nozzle piece adsorption channel 12 is vacuumed, and the vacuum channel 31 of the suction nozzle piece 3 communicates with the ventilation channel 21.

[0038] Specifically, the suction nozzle piece adsorption channel 12 and the suction slot 22 jointly form an air path for adsorbing the suction nozzle piece 3, and the chip adsorption channel 11, the ventilation channel 21 and the vacuum channel 31 of the suction nozzle piece 3 jointly form an air path for adsorbing the chip.

[0039] When replacing chip products of different specifications, the vacuum of the suction slot 22 is broken through the suction nozzle piece adsorption channel 12, so that the originally adsorbed suction nozzle piece 3 is automatically separated from the suction nozzle piece fitting surface 20 of the suction nozzle piece fixing block 2 under the action of gravity; then the suction nozzle piece adsorption channel 12 is vacuumed again, so that the suction nozzle piece fitting surface 20 automatically adsorbs the new suction nozzle piece 3, so that the automatic replacement of the suction nozzle piece 3 is realized. Compared with manual disassembly and replacement, the replacement efficiency is higher, and the trouble of frequent shutdown of the chip hot press welding machine is also avoided.

[0040] Moreover, since the suction nozzle piece 3 is adsorbed on the suction nozzle piece fitting surface 20 of the suction nozzle piece fixing block 2, through surface-to-surface fitting, the parallelism of the newly replaced suction nozzle piece 3 can be well ensured, the trouble of later adjustment and calibration is avoided, and the stability of the quality of the chip mounting of various specifications is well ensured.

[0041] Furthermore, the nozzle plate 3 is a very thin plate, for example, 2mm thick. Only one nozzle plate 3 is needed for each type of chip, which greatly reduces the waste of physical resources.

[0042] Finally, this embodiment uses negative pressure to achieve adsorption of the nozzle plate 3, thereby connecting the nozzle plate fixing block 2 and the nozzle plate 3. This connection method will not have any adverse effects on the chip adsorbed by the nozzle plate 3, and it can still achieve firm adsorption of the nozzle plate 3 at high temperatures (such as 200°C or even 400°C required for hot pressing welding), resulting in high reliability.

[0043] In this embodiment, there are multiple ways to achieve the installation between the nozzle plate fixing block 2 and the connecting rod 1. For example, such as Figure 1 and Figure 2 As shown, a portion of the nozzle plate fixing block 2 is fitted onto the connecting rod 1, and at least one bolt hole 23 is provided. A locking bolt is screwed into the bolt hole 23 and abuts against the outer peripheral wall of the connecting rod 1, thus achieving the installation between the nozzle plate fixing block 2 and the connecting rod 1. Preferably, two bolt holes 23 are provided opposite each other in the radial direction of the connecting rod 1. This ensures that the connecting rod 1 is centered within the nozzle plate fixing block 2, better achieving a balanced weight distribution on both sides of the entire nozzle assembly.

[0044] In this embodiment, as Figure 2 As shown, preferably, at least one sealing ring 4 is disposed between the connecting rod 1 and the suction plate fixing block 2. This prevents air leakage and ensures a tight seal. More preferably, as shown... Figure 2 As shown, one of the sealing rings 4 is disposed between the end face of the insertion nozzle plate fixing block 2 of the connecting rod 1 and the nozzle plate fixing block 2. The opening of the chip adsorption channel 11 near the end of the nozzle plate 3 is directly opposite the space enclosed by the sealing ring 4. The sealing ring 4 not only seals the air passage used for adsorbing the chip, but also provides a certain degree of freedom for the insertion depth of the connecting rod 1 through its deformation.

[0045] In this embodiment, as Figure 2 As shown, a connecting channel 24 can be provided within the nozzle plate fixing block 2, and the suction groove 22 is connected to the nozzle plate adsorption channel 12 through the connecting channel 24. Specifically, the peripheral wall of the end of the connecting rod 1 inserted into the nozzle plate fixing block 2 has an opening for the nozzle plate adsorption channel 12. The connecting channel 24 includes a horizontal channel and a vertical channel that are interconnected. The horizontal channel connects to the opening of the nozzle plate adsorption channel 12, and the vertical channel connects to the suction groove 22. The suction groove 22 can have one, two, or three rings, etc. Figure 5 In the structure shown, the suction groove 22 has two interconnected rings arranged from the inside to the outside, which can achieve stable adsorption of the nozzle plate 3.

[0046] In this embodiment, preferably, as follows: Figure 3 andFigure 5 As shown in the drawings, the suction nozzle piece fixing block 2 is provided with at least two positioning pins 5, and the suction nozzle piece 3 is provided with positioning holes 32 matched with the positioning pins 5. In this way, the positioning of the suction nozzle piece 3 can be realized through the cooperation of the positioning pins 5 and the positioning holes 32 in the process of automatically sucking the suction nozzle piece 3, so that the suction nozzle piece 3 is sucked to the expected position of the suction nozzle piece bonding surface 20. Among them, the two positioning pins 5 can be located on one diagonal line of the suction nozzle piece bonding surface 20 of the suction nozzle piece fixing block 2.

[0047] In addition, considering that in the process of automatically sucking the suction nozzle piece 3 by the suction nozzle assembly, the alignment of the suction nozzle piece bonding surface 20 and the suction nozzle piece 3 is realized by automatically calibrating the position by the camera of the chip thermal compression bonding machine, in order to make the chip thermal compression bonding machine better calibrate the position of the suction nozzle piece bonding surface 20 and the suction nozzle piece 3, and better realize the alignment of the suction nozzle piece bonding surface 20 and the suction nozzle piece 3, preferably, as shown in Figure 3 , Figure 5 and Figure 6 , the suction nozzle piece fixing block 2 and the suction nozzle piece 3 are respectively provided with identification holes 6 for the camera to identify. More preferably, the identification holes 6 on the suction nozzle piece fixing block 2 and the suction nozzle piece 3 are aligned with each other.

[0048] In this embodiment, preferably, as shown in Figure 2 , the openings of the chip suction channel 11 and the suction nozzle piece suction channel 12 away from the suction nozzle piece fixing block 2 are respectively located on the end face and the peripheral wall of the connecting rod 1.

[0049] In this way, the components of the chip thermal compression bonding machine respectively communicating with the chip suction channel 11 and the suction nozzle piece suction channel 12 can be more conveniently arranged.

[0050] In some examples, as shown in Figure 1 and Figure 2 , the automatically replaceable suction nozzle assembly for chip bonding further comprises a heating plate 7, and the heating plate 7 is bonded to the end face of the suction nozzle piece fixing block 2 away from the suction nozzle piece bonding surface 20.

[0051] When the electrical interconnection and mechanical fixation between the chip and the substrate are realized by the thermal compression process, the heating plate 7 is heated, and the heat is transmitted to the suction nozzle piece 3 through the suction nozzle piece fixing block 2, so as to realize accurate heat transfer to the chip and the substrate on which the chip is mounted through the suction nozzle piece 3, and realize thermal compression mounting, thereby avoiding the trouble of external substrate heating mechanism.

[0052] In some examples, as shown in Figure 1 and Figure 2 , the automatically replaceable suction nozzle assembly for chip bonding further comprises a connecting sleeve 8, and the connecting sleeve 8 connects the heating plate 7 and is provided with a plurality of heat dissipation holes 81. The connecting sleeve 8 and the heating plate 7 can be crimped, bolted or connected in other ways.

[0053] Specifically, the connecting sleeve 8 is connected to the chip thermal compression bonding machine, that is, the installation of the whole suction nozzle assembly on the chip thermal compression bonding machine is realized, the connecting sleeve 8 is arranged, and convenience is provided for the installation of the suction nozzle assembly on the chip thermal compression bonding machine. In addition, a plurality of heat dissipation holes 81 are arranged on the connecting sleeve 8, so that heat dissipation can be better, and the heat transferred from the heating plate 7 to the chip thermal compression bonding machine is reduced.

[0054] In some examples, as shown in Figure 1 and Figure 2 The replaceable chip bonding suction nozzle assembly further comprises a heat insulation plate 9, which is installed in the connecting sleeve 8 and located on the side of the heating plate 7 away from the suction nozzle sheet fixing block 2.

[0055] Specifically, the heat insulation plate 9 is arranged, and the heat transferred from the heating plate 7 to the chip thermal compression bonding machine can be further reduced.

[0056] In some examples, as shown in Figure 2 An insulating plate 10 is further arranged between the heat insulation plate 9 and the top plate of the connecting sleeve 8.

[0057] Based on the above ideal embodiments according to the present application, through the above description, relevant personnel can make various changes and modifications without deviating from the technical idea of the present application. The technical scope of the present application is not limited to the content in the specification, and must be determined according to the scope of claims.

Claims

1. An automatically replaceable chip soldering nozzle assembly, characterized in that, include: The connecting rod (1) is provided with a chip adsorption channel (11) and a nozzle adsorption channel (12). The nozzle plate fixing block (2) is installed on the connecting rod (1). It is provided with an air passage (21) that connects to the chip adsorption channel (11), and a suction groove (22) that connects to the nozzle plate adsorption channel (12) and surrounds the air passage (21) is provided on its nozzle plate contact surface (20). The suction plate (3) is adsorbed by the suction groove (22) after the suction plate adsorption channel (12) is evacuated and is tightly attached to the suction plate bonding surface (20) in a face-to-face fit, and its vacuum channel (31) is connected to the ventilation channel (21). Heating plate (7), the heating plate (7) is attached to the end face of the nozzle plate fixing block (2) away from the nozzle plate contact surface (20); A portion of the nozzle plate fixing block (2) is fitted onto the connecting rod (1), and the connecting rod passes through the heating plate (7).

2. The automatically replaceable chip soldering nozzle assembly according to claim 1, characterized in that, A portion of the nozzle plate fixing block (2) is fitted onto the connecting rod (1), and at least one bolt hole (23) is provided. The locking bolt is screwed into the bolt hole (23) and abuts against the outer peripheral wall of the connecting rod (1).

3. The automatically replaceable chip soldering nozzle assembly according to claim 2, characterized in that, At least one sealing ring (4) is provided between the connecting rod (1) and the nozzle plate fixing block (2).

4. The automatically replaceable chip soldering nozzle assembly according to claim 1, characterized in that, The nozzle plate fixing block (2) is provided with a connecting channel (24), and the suction groove (22) is connected to the nozzle plate adsorption channel (12) through the connecting channel (24).

5. The automatically replaceable chip soldering nozzle assembly according to claim 1, characterized in that, The nozzle plate fixing block (2) is provided with at least two positioning pins (5), and the nozzle plate (3) is provided with positioning holes (32) that cooperate with the positioning pins (5).

6. The automatically replaceable chip soldering nozzle assembly according to claim 1, characterized in that, The nozzle plate fixing block (2) and the nozzle plate (3) are respectively provided with recognition holes (6) for camera recognition.

7. The automatically replaceable chip soldering nozzle assembly according to claim 1, characterized in that, It also includes a connecting sleeve (8), which is connected to the heating plate (7) and has multiple heat dissipation holes (81).

8. The automatically replaceable chip soldering nozzle assembly according to claim 7, characterized in that, It also includes a heat insulation plate (9), which is installed inside the connecting sleeve (8) and located on the side of the heating plate (7) away from the nozzle plate fixing block (2).

9. The automatically replaceable chip soldering nozzle assembly according to claim 1, characterized in that, The openings of the chip adsorption channel (11) and the nozzle adsorption channel (12) away from the nozzle fixing block (2) are located on the end face and peripheral wall of the connecting rod (1), respectively.

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