Circuit board laser cutting device
By using a combination of positioning posts and elastic clamping rods in the circuit board laser cutting device, the problem of module offset caused by positioning errors during circuit board cutting is solved, achieving high-precision cutting and efficient collection.
Patent Information
- Application Number
- CN202511658098.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-13
- Publication Date
- 2025-12-19
AI Technical Summary
In the existing technology for laser cutting of circuit boards, module position offset and cutting error accumulation caused by fixture positioning errors affect cutting accuracy and module integrity.
The circuit board is precisely positioned using positioning posts through mounting holes. Combined with elastic clamping rods and a telescopic structure, this ensures that the module does not shift position during the cutting process, and the cut module is collected through a receiving box.
It achieves precise positioning during the circuit board cutting process, reduces cutting errors, improves module integrity and cutting efficiency, and simplifies the module collection process.
Smart Images
Figure CN121156533A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of circuit board processing, in particular to a circuit board laser cutting device. BACKGROUND
[0002] In the prior art, when cutting a circuit board by using a laser, a large circuit board is first cut into multiple circuit boards of appropriate size, and then the modules on the surface of the circuit board are cut. When cutting the circuit board, a clamp is usually used to position the circuit board by clamping the edge of the circuit board, and then the circuit board is cut. The edge size of the circuit board will have a certain error (as shown in the accompanying drawings: L is the preset size of the cut circuit board, L1 is the actual size of one side after cutting, and L2 is the actual size of both sides after cutting) each time the circuit board is cut. The error accumulation after multiple cutting will cause the size of the circuit board to deviate (i.e. L2 = L ± 2ΔL, where ΔL is the error value generated by one cutting). Figure 1 When the edge of the circuit board is clamped and positioned by using a clamp, due to the influence of the cutting error of the circuit board, the maximum misalignment between the module on the surface of the circuit board and the preset cutting position will be the same as the cutting error of the circuit board (as shown in the accompanying drawings: the error of the cut circuit board is ΔL, and the dashed line is the preset cutting position and the position of the preset module). Figure 2 The misalignment of the module during laser cutting will easily affect the integrity of the module after cutting, and there will still be errors during laser cutting, which will easily further increase the cutting deviation, thereby easily causing the position of the cut module to deviate greatly or the module to be damaged, affecting the normal installation and work in the future. SUMMARY
[0003] The present application aims to provide a circuit board laser cutting device to solve the problems raised in the background art.
[0004] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a circuit board laser cutting device, comprising a base with a groove on the surface, a plurality of clamping rods provided on the surface of the base corresponding to the position of the groove, a clamping groove provided on the surface of the clamping rod, the clamping rod being used to clamp the circuit board, a plurality of fixed cylinders fixedly connected in the groove, a positioning column with a tapered top elastically and slidably connected in the fixed cylinder, and an installation hole provided on the surface of the module to be cut on the circuit board, the positioning column being capable of positioning the circuit board through the installation hole.
[0005] As a further scheme of the present application, an elastic member is connected between the surface of the base and the clamping rod, the clamping rod being capable of keeping clamping the circuit board when the circuit board is positioned by the positioning column through the elastic member.
[0006] As a further scheme of the present application, the fixing cylinder surface is provided with an opening, and a connecting rod is fixedly connected to the bottom of the positioning column in the same row, a pressure rod is elastically and slidably connected to the groove side wall surface, a plurality of connecting rods extend below the pressure rod, the pressure rod moves up and down to drive the positioning column to move synchronously through the connecting rod, the pressure rod extends to the base surface and is located at the circuit board side, and press blocks are fixedly connected to the two ends of the pressure rod.
[0007] As a further scheme of the present application, the pressure rod surface corresponding to the positions of the clamping rods on both sides is fixedly connected with a limiting rod with a slanted bottom through a fixing plate, the clamping rods on both sides are provided with a limiting groove with a slanted side, the limiting rod is located above the limiting groove, and when the limiting rod moves downward, it can move into the limiting groove and push the clamping rod to move away from the groove side.
[0008] As a further scheme of the present application, a U-shaped sliding groove is formed on the base surface corresponding to the position of the clamping rod, a friction plate is elastically and slidably connected in the sliding groove, the friction plate can limit the movement of the clamping rod when it is attached to the clamping rod, and the friction plate is connected with the surface of the press block.
[0009] As a further scheme of the present application, a receiving box is arranged in the groove, a plurality of through openings are formed on the surface of the receiving box, and the positioning column passes through the through openings.
[0010] As a further scheme of the present application, a plurality of limiting blocks for limiting the receiving box are fixedly connected in the groove, and a limiting opening that penetrates the receiving box is formed on the surface of the receiving box.
[0011] As a further scheme of the present application, a plurality of inclined and telescopic blocking rods are fixedly connected to the surface of the receiving box corresponding to the positions of the through openings, and the extension lines of the blocking rods do not pass through the center positions of the through openings.
[0012] As a further scheme of the present application, the side close to the circuit board of the pressure rod is slanted.
[0013] As a further scheme of the present application, the clamping groove is slanted on both sides of the end close to the pressure rod.
[0014] Compared with the prior art, the present application has the following advantages: In the process of cutting the circuit board by using laser, the positioning column is used to position the circuit board through the mounting hole, the taper at the top of the positioning column cooperates with the mounting hole to accurately position the module, avoids the position deviation of the module caused by the edge error during cutting of the circuit board, and thus affects the accurate cutting of the module. Figure 3In the process of installing the mounting hole, the machining error usually occurs in the diameter of the mounting hole, and the change of the diameter of the mounting hole does not affect the positioning of the positioning column when the positioning column is positioned through the mounting hole, so as to ensure the accurate positioning of the module.
[0015] In the process of positioning the circuit board, the positioning column positions the circuit board through the mounting hole, the edge of the circuit board moves to one side under the pushing of the positioning column, the clamping rod moves synchronously, and the elastic member can be stretched or compressed when the clamping rod moves, so as to adapt to the movement of the circuit board during positioning, and ensure that the module on the surface of the circuit board can be accurately positioned.
[0016] In the process of positioning the circuit board, the pressing block, the pressing rod, the connecting rod and the positioning column are moved downward by pressing the pressing block, the positioning column can be moved to a position below the clamping rod, and then the circuit board can be moved into the clamping groove, after the circuit board is completely moved into the clamping groove, the pressing block is released, the positioning column is moved upward under the action of the spring force, the position of the circuit board is adjusted, the positioning column is moved into the mounting hole to position the circuit board, the positioning column can be moved downward by using the pressing block, the movement of the circuit board is prevented, and the movement and clamping of the circuit board are ensured. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 For cutting a large piece of circuit board into small pieces of circuit board, the schematic diagram of different cutting times of the side edge (M is a large piece of circuit board, and N is a small piece of circuit board in the diagram); Figure 2 For the schematic diagram of the mounting hole offset caused by the edge error of the cut circuit board (ΔL is the error when the edge is cut); Figure 3 For the schematic diagram of the error generated when the mounting hole of the circuit board surface is machined (the dashed line is the original size of the mounting hole); Figure 4 For the schematic diagram of the state change of the module on the circuit board being cut to the last one under the clamping force of the clamping rod when the edge of the circuit board is in an inclined state in the present application; Figure 5 For the schematic diagram of the overall structure of the present application; Figure 6 For Figure 5 For the schematic diagram of the structure at A in the present application; Figure 7 For the schematic diagram of the overall structure of the present application; Figure 8 For the schematic diagram of the connection relationship between the elastic member and the clamping rod in the present application; Figure 9 For the schematic diagram of the connection relationship between the positioning column and the connecting rod in the present application; Figure 10 It is a structural schematic view of the position relationship of the base, positioning column and receiving box in the application; Figure 11 It is a structural schematic view of the inside of the receiving box in the application; Figure 12 It is a structural schematic view of the position relationship of the base, positioning column and clamping rod in the application; Figure 13 It is a structural schematic view of the position relationship of the base and friction plate in the application.
[0018] In the drawings, the components represented by each reference numeral are listed as follows: 1-groove, 2-base, 3-clamping rod, 4-clamping groove, 5-fixing cylinder, 6-positioning column, 7-mounting hole, 8-elastic member, 9-opening, 10-connecting rod, 11-pressing rod, 12-pressing block, 13-fixing plate, 14-limiting rod, 15-limiting groove, 16-slotted guide, 17-friction plate, 18-receiving box, 19-through opening, 20-limiting block, 21-limiting opening, 22-blocking rod. DETAILED DESCRIPTION
[0019] Please refer to Figures 1-13 The application provides a technical solution: a circuit board laser cutting device, comprising a base 2 with a groove 1 opened on the surface, the base 2 is provided with a plurality of clamping rods 3 on the surface corresponding to the position of the groove 1, the surface of the clamping rod 3 is provided with a clamping groove 4, the clamping rod 3 is used for clamping the circuit board, a plurality of fixing cylinders 5 are fixedly connected in the groove 1, a positioning column 6 with a tapered top is elastically and slidably connected in the fixing cylinder 5, a mounting hole 7 is opened on the surface of the circuit board, and the positioning column 6 can position the circuit board through the mounting hole 7. In the process of cutting the circuit board by laser, first, the circuit board needs to be moved to between the plurality of clamping rods 3 through the clamping groove 4, and then the positioning column 6 positions the circuit board through the mounting hole 7 on the surface of the circuit board. When the positioning column 6 positions the circuit board through the mounting hole 7, the taper on the top of the positioning column 6 cooperates with the mounting hole 7 to accurately position the module, so as to avoid the position deviation of the module caused by the edge error when cutting the circuit board, thereby affecting the accurate cutting of the module (as shown in the accompanying drawings). Figure 3 During the machining of the mounting hole 7, the machining error usually occurs on the diameter of the mounting hole 7. When the tapered positioning column 6 is positioned through the mounting hole 7, the change of the diameter of the mounting hole 7 will not affect the positioning of the positioning column 6, thereby ensuring the accurate positioning of the module.
[0020] In the process of positioning the circuit board, the clamping rod 3 can limit the movement of the circuit board when the positioning column 6 moves the circuit board that is deviated, as a further scheme of the application, the surface of the base 2 is connected with the clamping rod 3 through the elastic member 8, and the clamping rod 3 can keep clamping the circuit board when the circuit board is positioned by the positioning column 6 through the elastic member 8. In the process of positioning the circuit board, the clamping rod 3 can limit the movement of the circuit board when the positioning column 6 moves the circuit board that is deviated, as a further scheme of the application, the surface of the base 2 is connected with the clamping rod 3 through the elastic member 8, and the clamping rod 3 can keep clamping the circuit board when the circuit board is positioned by the positioning column 6 through the elastic member 8.
[0021] In the process of positioning the circuit board, the clamping rod 3 can limit the movement of the circuit board when the positioning column 6 moves the circuit board that is deviated, as a further scheme of the application, the surface of the base 2 is connected with the clamping rod 3 through the elastic member 8, and the clamping rod 3 can keep clamping the circuit board when the circuit board is positioned by the positioning column 6 through the elastic member 8. In the process of positioning the circuit board, the clamping rod 3 can limit the movement of the circuit board when the positioning column 6 moves the circuit board that is deviated, as a further scheme of the application, the surface of the base 2 is connected with the clamping rod 3 through the elastic member 8, and the clamping rod 3 can keep clamping the circuit board when the circuit board is positioned by the positioning column 6 through the elastic member 8.
[0022] In the process of positioning the circuit board, the clamping rod 3 can limit the movement of the circuit board when the positioning column 6 moves the circuit board that is deviated, as a further scheme of the application, the surface of the base 2 is connected with the clamping rod 3 through the elastic member 8, and the clamping rod 3 can keep clamping the circuit board when the circuit board is positioned by the positioning column 6 through the elastic member 8. During the positioning of the circuit board, when the pressing block 12 is pressed, the pressing block 12 and the pressing rod 11 move downward, which can drive the fixing plate 13 and the limiting rod 14 to move downward synchronously. After the limiting rod 14 moves downward into the limiting groove 15, it can squeeze the limiting groove 15. By squeezing the limiting groove 15, the limiting rod 14 causes the clamping rod 3 to move away from the groove 1, thereby increasing the distance between the clamping rods 3 on both sides of the groove 1. The circuit board can move into the clamping groove 4 between the clamping rods 3 on both sides without being blocked by the ends of the clamping rods 3, and can keep the clamping rods 3 clamping the circuit board after the pressing block 12 is released.
[0023] During the laser cutting process of the circuit board, when the edge of the circuit board is tilted, the positioning posts 6 are positioned through the mounting holes 7 on the surface module of the circuit board. Multiple positioning posts 6 can keep the entire circuit board fixed. At this time, the clamping groove 4 cannot fit against the edge of the circuit board. When the surface module of the circuit board is gradually cut to the last one (as shown in the attached figure)... Figure 4 As shown), a single positioning post 6 is insufficient to keep the entire circuit board fixed. The circuit board will rotate around the positioning post 6 at the position of the uncut module under the action of the clamping rods 3 on both sides, thus affecting the cutting of the final module. As a further solution of the present invention, a U-shaped groove 16 is provided on the surface of the base 2 corresponding to the position of the clamping rod 3. A friction plate 17 is elastically slidably connected in the groove 16. When the friction plate 17 is in contact with the clamping rod 3, it can restrict the movement of the clamping rod 3. The friction plate 17 is connected to the surface of the pressing block 12. During the laser cutting of the circuit board, when the pressing block 12 moves downward, the friction plate 17 moves downward synchronously, and the clamping rod 3 disengages from the friction plate 17. The clamping rod 3 can then move smoothly to both sides. Subsequently, the circuit board is moved between the clamping rods 3 on both sides. As the pressing block 12 is gradually released, the positioning post 6 moves into the mounting hole 7 to position the circuit board. The positioning post 6 maintains the positioning of the circuit board. Then, the limiting rod 14 moves out of the limiting groove 15 so that the clamping rod 3 can clamp the positioned circuit board. Finally, the friction plate 17 moves upward to fit against the bottom of the clamping rod 3, so that the clamping rod 3 can maintain the clamping state of the circuit board and restrict the movement of the clamping rod 3. This prevents the clamping force of the clamping rod 3 from easily causing the circuit board to rotate when the last module is cut on the surface of the circuit board, thereby affecting the cutting of the last module on the surface of the circuit board and reducing the yield rate of the product.
[0024] During the laser cutting process of the circuit board, the positioning post 6 prevents the module from falling after cutting, which is not convenient for subsequent collection of the cut module. As a further solution of the present invention, a receiving box 18 is provided in the groove 1, and multiple openings 19 are opened on the surface of the receiving box 18, through which the positioning post 6 passes. In the process of laser cutting the circuit board, the positioning column 6 can pass through the through hole 19 to position the circuit board, and the cut module falls directly into the receiving box 18. After cutting is completed, the receiving box 18 is directly taken out to collect the cut module, thereby improving the collection efficiency.
[0025] In the process of laser cutting the circuit board, when the receiving box 18 is sleeved on the surfaces of the plurality of positioning columns 6, the weight of the receiving box 18 is easy to cause the positioning column 6 to deviate, thereby affecting the positioning accuracy of the positioning column 6. As a further scheme of the present application, a plurality of limiting blocks 20 for limiting the receiving box 18 are fixedly connected in the groove 1, and a limiting opening 21 penetrating through the receiving box 18 is formed on the surface of the receiving box 18. In the process of laser cutting the circuit board, when the receiving box 18 is installed, the limiting opening 21 cooperates with the limiting block 20 to limit the receiving box 18, so that the position of the receiving box 18 can be kept the same every time the receiving box 18 is installed, thereby avoiding that the receiving box 18 cannot be limited and the self-weight of the receiving box 18 affects the positioning of the circuit board by the positioning column 6.
[0026] In the process of laser cutting the circuit board, when the diameter of the module is smaller than that of the through hole 19, the cut module is easy to fall from the through hole 19 in the process of taking out the receiving box 18. As a further scheme of the present application, a plurality of obliquely arranged and telescopic blocking rods 22 are fixedly connected on the surface of the receiving box 18 corresponding to the position of the through hole 19, and the extension line of the blocking rod 22 does not pass through the center position of the through hole 19. In the process of laser cutting the circuit board, when the receiving box 18 is taken out after cutting the circuit board, the end of the blocking rod 22 is attached to the surface of the positioning column 6, and then when the positioning column 6 gradually moves out of the position of the through hole 19, the blocking rod 22 is stretched along the positioning column 6 to block the through hole 19, thereby preventing the cut module from falling from the through hole 19. After the obliquely arranged blocking rod 22 is stretched, the middle position of the through hole 19 is exposed, thereby facilitating the positioning column 6 to pass through the through hole 19 again.
[0027] As a further scheme of the present application, the side of the pressing rod 11 close to the circuit board is inclined. In the process of positioning the circuit board, after the pressing block 12 is loosened, when the pressing block 12 and the pressing rod 11 move upward, the inclined surface on the surface of the pressing rod 11 can guide the circuit board to move into the clamping groove 4, thereby ensuring that the circuit board is completely moved into the clamping groove 4.
[0028] As a further scheme of the present application, the upper and lower sides of the end of the clamping groove 4 close to the pressing rod 11 are inclined. In the process of positioning the circuit board, the upper and lower sides of the end of the clamping groove 4 are provided with inclined surfaces to guide the circuit board to move more easily into the clamping groove 4, preventing the circuit board from moving into the clamping groove 4 and not being accurately aligned with the clamping groove 4, and the upper and lower edges of the clamping groove 4 easily blocking the circuit board.
Claims
1. A laser cutting device for circuit board, comprising a base (2) with a groove (1) on the surface, characterized in that: The base (2) surface corresponding to the position of the groove (1) is provided with a plurality of clamping rods (3), the surface of the clamping rod (3) is provided with a clamping groove (4), the clamping rod (3) is used for clamping the circuit board, a plurality of fixed cylinders (5) are fixedly connected in the groove (1), the fixed cylinder (5) is elastically and slidably connected with a positioning column (6) with a tapered top in the fixed cylinder (5), a mounting hole (7) is formed in the surface of the circuit board, and the positioning column (6) can be positioned through the mounting hole (7).
2. The laser cutting apparatus for a circuit board according to claim 1, wherein: The base (2) surface is connected with the elastic member (8) between the clamping rod (3), the clamping rod (3) can keep clamping the circuit board when the clamping rod (3) is positioned by the positioning column (6) through the elastic member (8).
3. The laser cutting apparatus of claim 1, wherein: The surface of the fixed cylinder (5) is provided with an opening (9), the same row of the positioning column (6) bottom is fixedly connected with a connecting rod (10), the side wall surface of the groove (1) is elastically and slidably connected with a pressing rod (11) upward and downward, a plurality of connecting rods (10) extend below the pressing rod (11), the pressing rod (11) moves upward and downward, which can drive the positioning column (6) to move synchronously through the connecting rod (10), the pressing rod (11) extends to the surface of the base (2) and is located on one side of the circuit board, and the pressing rod (11) is fixedly connected with a pressing block (12) at both ends.
4. The laser cutting apparatus for a circuit board according to claim 3, wherein: The surface of the pressing rod (11) corresponding to the position of the clamping rod (3) on both sides is fixedly connected with a limiting rod (14) with an inclined bottom through a fixed plate (13), the clamping rod (3) on both sides is provided with a limiting groove (15) with an inclined side, the limiting rod (14) is above the limiting groove (15), and the limiting rod (14) can move into the limiting groove (15) and push the clamping rod (3) to move away from the groove (1) when the limiting rod (14) moves downward.
5. The laser cutting apparatus of claim 3, wherein: The surface of the base (2) corresponding to the position of the clamping rod (3) is provided with a U-shaped sliding groove (16), the sliding groove (16) is elastically and slidably connected with a friction plate (17) upward and downward, the friction plate (17) can limit the movement of the clamping rod (3) when the friction plate (17) is attached to the clamping rod (3), and the friction plate (17) is connected with the surface of the pressing block (12).
6. The laser cutting apparatus of claim 1, wherein: The groove (1) is provided with a receiving box (18), the surface of the receiving box (18) is provided with a plurality of through openings (19), and the positioning column (6) passes through the through opening (19).
7. The laser cutting apparatus of claim 6, wherein: A plurality of limiting blocks (20) for limiting the receiving box (18) are fixedly connected in the groove (1), and a limiting opening (21) penetrating through the receiving box (18) is formed in the surface of the receiving box (18).
8. The laser cutting apparatus of claim 6, wherein: A plurality of inclined and telescopic blocking rods (22) are fixedly connected to the surface of the receiving box (18) corresponding to the position of the through opening (19), and the extension line of the blocking rod (22) does not pass through the center position of the through opening (19).
9. The laser cutting apparatus of claim 3, wherein: The side of the pressing rod (11) close to the circuit board is inclined.
10. The laser cutting apparatus of claim 3, wherein: The clamping groove (4) is inclined on both sides of one end close to the pressing rod (11).