Thermal management assembly and thermal management control method

Abstract

The thermal management assembly comprises a first valve coil, a second valve coil, a control panel and a vehicle control unit, the control panel comprises a control chip, a first driver and a second driver, the first end of the first driver is electrically connected with the first valve coil, the second end of the first driver is electrically connected with the control chip, and the second end of the second driver is electrically connected with the control chip. The first end of the second driver is electrically connected with the second valve coil, and the second end of the second driver is electrically connected with the control chip; the whole vehicle controller is electrically connected with the control chip; the control panel and the vehicle control unit are integrated together, and the first valve coil and the second valve coil are arranged in a scattered mode. According to the heat management assembly, the first valve coil and the second valve coil are arranged in a scattered mode, small installation spaces are reserved for the first valve coil and the second valve coil in the whole vehicle, and therefore the heat management assembly is installed flexibly. The invention further discloses a thermal management control method.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat exchange, in particular to a heat management assembly and a heat management control method. BACKGROUND

[0002] In the related art, the heat management assembly includes a valve coil assembly, a control board and a vehicle controller, the valve coil assembly includes a first valve coil and a second valve coil, the first valve coil and the second valve coil are integrated together, the control board includes a control chip, a first driver and a second driver, a first end of the first driver is electrically connected with the first valve coil, a second end of the first driver is electrically connected with the control chip, a first end of the second driver is electrically connected with the second valve coil, and a second end of the second driver is electrically connected with the control chip, and the vehicle controller is electrically connected with the control chip. Since the valve coil assembly, the control board and the vehicle controller are integrated together, the overall volume of the heat management assembly is large, so it is difficult to reserve a large installation space for the heat management assembly in the vehicle. SUMMARY

[0003] The inventor finds that another reason for the heat management assembly requiring a large installation space is that the first valve coil and the second valve coil are integrated together, so that the overall volume of the valve coil assembly is large, and it is difficult to reserve a large installation space for the valve coil assembly in the vehicle, thereby making it difficult to reserve a large installation space for the heat management assembly in the vehicle.

[0004] The purpose of the present application is to provide a heat management assembly that is flexible to install.

[0005] In order to achieve the above purpose, the following technical solutions are adopted in the present application:

[0006] On the one hand, a heat management assembly is provided, which includes a first valve coil, a second valve coil, a control board and a vehicle controller, the control board includes a control chip, a first driver and a second driver, a first end of the first driver is electrically connected with the first valve coil, a second end of the first driver is electrically connected with the control chip, a first end of the second driver is electrically connected with the second valve coil, and a second end of the second driver is electrically connected with the control chip, the vehicle controller is electrically connected with the control chip, the control board and the vehicle controller are integrated together, and the first valve coil and the second valve coil are dispersedly arranged.

[0007] In the present application, the first valve coil and the second valve coil are dispersedly arranged, a small installation space is reserved for the first valve coil and the second valve coil respectively in the vehicle, so that the installation of the heat management assembly is more flexible.

[0008] In another aspect, a thermal management control method is provided, comprising the steps of: sending a first control signal and a second control signal from a vehicle controller to a control chip; sending a first driving signal from the control chip to a first driver according to the first control signal, and sending a second driving signal from the control chip to a second driver according to the second control signal; driving a first valve coil to operate according to the first driving signal by the first driver, and driving a second valve coil to operate according to the second driving signal by the second driver, wherein the first valve coil and the second valve coil are dispersedly arranged.

[0009] In the present application, the first valve coil and the second valve coil are dispersedly arranged, so that the vehicle controller can control the first valve coil and the second valve coil at different positions to operate. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 is a block diagram of an embodiment of the thermal management assembly of the present application;

[0011] Figure 2 is a block diagram of another embodiment of the thermal management assembly of the present application;

[0012] Figure 3 is a flow chart of an embodiment of the thermal management control method of the present application;

[0013] Figure 4 is a flow chart of another embodiment of the thermal management control method of the present application;

[0014] Figure 5 is a flow chart of still another embodiment of the thermal management control method of the present application. DETAILED DESCRIPTION

[0015] The exemplary embodiments will be described in detail herein with reference to the attached drawings. The description of the exemplary embodiments is intended to apply to various alternative embodiments as well. The following description is not limited to the exemplary embodiments, but rather, is applicable to any apparatus and method within the scope of the present application. Furthermore, the exemplary embodiments are described herein with reference to the accompanying drawings, in which like or similar elements are referred to with like reference numerals throughout the various figures.

[0016] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0017] It should be understood that the use of "first", "second", and "third" words in the specification and claims of the present application do not indicate any order, number or importance, but are only used to distinguish different components. Similarly, "one" or "a" and similar words do not indicate a quantity limitation, but indicate the presence of at least one; "multiple" indicates a quantity of two or more. Unless otherwise indicated, "front", "back", "lower" and / or "upper" and similar words are for ease of description only and are not limited to a position or spatial orientation. "Include" or "contain" and similar words mean that the elements or objects appearing before "include" or "contain" cover the elements or objects listed after "include" or "contain" and their equivalents, and do not exclude other elements or objects.

[0018] The heat management assembly of the example embodiment of the present application will be described in detail below with reference to the accompanying drawings. The features in the following embodiments and implementations can be supplemented or combined with each other without conflict.

[0019] The whole vehicle heat management system is mainly used to manage cold and heat in general, so as to meet the demand for cold and heat in the whole vehicle range, such as the cooling / heating demand of the cabin space, the cooling demand of the motor, the heating / cooling demand of the battery, etc. Part of the cold / heat is supplied by means such as running the refrigerant circulation loop, starting the heater, and the cooling liquid itself carrying cold, etc. Part of the heat is obtained by means such as recovering the cold / heat of other parts. Part of the components in the whole vehicle heat management system are integrated to form a heat management assembly. It can be understood that the components of the heat management assembly and their positions can be adjusted according to actual needs in the present application, as long as the function of the components is not affected.

[0020] According to a specific embodiment of the heat management assembly of the present application, as shown in Figure 1 and Figure 2 The heat management assembly 1000 includes a first valve coil 100, a second valve coil 200, a control board 300 and a whole vehicle controller 400.

[0021] The first valve coil 100 is an expansion valve coil or a throttle valve coil, and the second valve coil 200 is an expansion valve coil or a throttle valve coil. When current passes through the first valve coil 100 or the second valve coil 200, a magnetic field is generated, which attracts or repels the iron core in the magnetic field, causing the iron core to move, thereby causing the piston or diaphragm connected to the iron core to move, and finally realizing the opening or closing of the valve.

[0022] The control board 300 comprises a control chip 310, a first driver 320 and a second driver 330, the control chip 310 is configured to transmit a driving signal to the first driver 320 and the second driver 330, a first end of the first driver 320 is electrically connected with the first valve coil 100, a second end of the first driver 320 is electrically connected with the control chip 310, the first driver 320 is configured to drive the first valve coil 100 to operate according to the first driving signal of the control chip 310, a first end of the second driver 330 is electrically connected with the second valve coil 200, a second end of the second driver 330 is electrically connected with the control chip 310, the second driver 330 is configured to drive the second valve coil 200 to operate according to the second driving signal of the control chip 310. For example, the control chip 310 is a single-chip microcomputer, and optionally, the category of the single-chip microcomputer is 32Bit MCU ASIL-B, the model is S32K148 series, RH850 series or S32G series.

[0023] For example, the control board 300 is two circuit boards, one of which is used to set the control chip 310, and the other integrates the first driver 320 and the second driver 330, of course, the number of circuit boards in the integrated device 400 can also be greater than two, and the application is not limited to this. Optionally, the control board 300 is one circuit board, that is, the control chip 310, the first driver 320 and the second driver 330 are arranged on the same circuit board, and the control board 300 integrates the control chip 310 for controlling the first valve coil 100 and the second valve coil 200, the first driver 320 for driving the first valve coil 100 and the second driver 330 for driving the second valve coil 200.

[0024] The vehicle control unit 400 is electrically connected with the control chip 310. The vehicle control unit 400 can be a thermal management controller (TMC), and the TMC adopts a more refined optimization algorithm and a modular design when processing a complex thermal management loop and diversified working condition requirements, so as to meet the high-precision thermal management control requirements.

[0025] The first valve coil 100 and the second valve coil 200 are distributed separately. This allows the first valve coil 100 and the second valve coil 200 to be placed in different locations within the vehicle. Smaller installation spaces are reserved for each of the first valve coil 100 and the second valve coil 200 within the vehicle, making the installation of the thermal management component 1000 more flexible. Furthermore, the first valve coil 100 and the second valve coil 200 can be controlled separately. This integrates the control chip used to control the first valve coil 100 and the control chip used to control the second valve coil 200 into one chip, reducing multiple control chips to a single control chip 310. The functions of multiple control chips are performed by this single chip 310, reducing the number of control chips and communication circuits and lowering the cost of the thermal management component 1000.

[0026] In some embodiments, the thermal management component 1000 includes, but is not limited to, a first valve coil 100 and a second valve coil 200. The thermal management component 1000 may also include at least three valve coils, and the type of valve coil is not limited. Each valve coil has a corresponding driver, and each driver is connected to the control chip 310. For example, as... Figure 1 and Figure 2 As shown, the thermal management component 1000 also includes a third valve coil 600 and a fourth valve coil 700, and the control board 300 also includes a third driver 340 and a fourth driver 350. The first end of the third driver 340 is electrically connected to the third valve coil 600, and the second end of the third driver 340 is electrically connected to the control chip 310. The first end of the fourth driver 350 is electrically connected to the fourth valve coil 700, and the second end of the fourth driver 350 is electrically connected to the control chip 310.

[0027] The first driver 320 is connected to the first valve coil 100 via a wire, and the second driver 330 is connected to the second valve coil 200 via a wire. The control chip 310 is communicatively connected to the vehicle controller 400. For example, the first driver 320 and the first valve coil 100 can be connected via a hard wire (HW), and the second driver 330 and the second valve coil 200 can be connected via a hard wire. This hard wire connection method is relatively simple and does not require communication devices to be installed in the first valve coil 100 and the second valve coil 200, thus enabling signal transmission between the first driver 320 and the first valve coil 100, as well as between the second driver 330 and the second valve coil 200.

[0028] The thermal management component 1000 also includes a sensor 500, which is connected to the control chip 310 via a wire. The control chip 310 is used to receive signals from the sensor 500 and transmit the signals from the sensor 500 to the vehicle controller 400.

[0029] For example, sensor 500 is a temperature sensor configured to detect the battery's inlet water temperature and transmit this data to control chip 310. Control chip 310 receives the battery's inlet water temperature data from the temperature sensor and transmits it to vehicle controller 400. Vehicle controller 400 monitors the battery's operating status by monitoring the inlet and / or outlet water temperatures, thereby adjusting the battery thermal management device's operation to reduce energy consumption. When vehicle controller 400 detects that the battery's inlet and / or outlet water temperatures exceed a preset safe temperature range, it can also issue an alarm promptly, facilitating troubleshooting by maintenance personnel.

[0030] For example, sensor 500 can be an interior temperature sensor, an exterior temperature sensor, an evaporation temperature sensor, an air duct sensor, a temperature and pressure sensor, a defrost sensor, a sunlight sensor, a humidity sensor, or a heater temperature sensor. Sensor 500 is configured to detect environmental parameters and transmit this data to control chip 310. Control chip 310 receives the environmental parameter data and transmits it to vehicle controller 400. Vehicle controller 400 monitors changes in environmental parameters to assess the comfort level of the in-vehicle environment. This allows for timely adjustment of the in-vehicle environment by controlling the thermal management device, achieving precise control and reducing energy consumption. Sensor 500 can be single or multiple, and the number and type of sensor 500 can be changed according to the actual thermal management needs of the vehicle.

[0031] In some embodiments, the sensor 500 is connected to the vehicle controller 400 via a wire, meaning the sensing signal from the sensor 500 is directly transmitted to the vehicle controller 400 via the wire, without going through the control chip 31. This connection method is relatively simple and allows signal transmission without going through the control chip 31. For example, the sensor 500 and the vehicle controller 400 can be connected via a hard wire.

[0032] The control chip 310 communicates with the vehicle controller 400 via a Local Interconnect Network (LIN) or a Controller Area Network (CAN). CAN communication is a serial communication protocol where data is transmitted in message form. Each CAN message includes a start bit, identifier, data length code, data field, and checksum, enabling high-speed, reliable, and flexible data transmission. LIN communication, through master-slave communication, frame format, and point-to-point connections, enables low-cost, low-speed communication.

[0033] like Figure 3 As shown, this application also provides a thermal management control method, which includes the following steps:

[0034] S100, the vehicle controller 400 sends a first control signal and a second control signal to the control chip 310;

[0035] S200, the control chip 310 sends a first drive signal to the first driver 320 according to the first control signal, and the control chip 310 sends a second drive signal to the second driver 330 according to the second control signal;

[0036] S300, the first driver 320 drives the first valve coil 100 to operate according to the first drive signal, and the second driver 330 drives the second valve coil 200 to operate according to the second drive signal.

[0037] In steps S100 to S300, the first valve coil 100 and the second valve coil 200 are dispersedly arranged, so that the vehicle controller 400 can control the valve coils at different positions to operate. The first control signal and the second control signal are transmitted through local Internet or controller area network, and the first drive signal and the second drive signal are transmitted through copper wires on the circuit board.

[0038] As shown in Figure 4 , the thermal management control method further comprises the following steps:

[0039] S400, the control chip 310 receives a sensing signal of the sensor 500, and the control chip 310 sends the sensing signal to the vehicle controller 400.

[0040] In step S400, the sensing signal is transmitted to the vehicle controller 400 through the control chip 310. The sensing signal is transmitted between the control chip 310 and the sensor 500 through hard-wire, and the sensing signal is transmitted between the control chip 310 and the vehicle controller 400 through local Internet or controller area network.

[0041] As shown in Figure 5 , the thermal management control method further comprises the following steps:

[0042] S500, the sensing signal of the sensor 500 is sent to the vehicle controller 400 through the wire, and the vehicle controller 400 controls the operation of the sensor 500.

[0043] In step S500, the sensing signal of the sensor 500 is directly sent to the vehicle controller 400 through the wire without transmitting the sensing signal through the control chip 310. For example, the sensing signal of the sensor 500 is directly sent to the vehicle controller 400 through the hard-wire.

[0044] The "connection" between two components in the present application can be direct connection or connection through a pipeline. The two components can be connected only by a pipeline or can be connected by a pipeline and a valve device or other components.

[0045] The above is only the preferred embodiment of the present application, and does not limit the present application in any form. Although the present application has been disclosed as the above preferred embodiment, it is not intended to limit the present application. Any person skilled in the art can make some changes or modifications to the above disclosed technical content without departing from the scope of the technical solution of the present application to obtain equivalent embodiments with equivalent changes. Any simple modification, equivalent change and modification of the above technical solution according to the technical essence of the present application, which does not depart from the content of the technical solution of the present application, still belongs to the scope of the technical solution of the present application.

Claims

1. A thermal management assembly, characterized by, The application relates to a valve coil control system for a vehicle air conditioner, which comprises a first valve coil, a second valve coil, a control board and a vehicle controller, wherein the control board comprises a control chip, a first driver and a second driver, the first end of the first driver is electrically connected with the first valve coil, the second end of the first driver is electrically connected with the control chip, the first end of the second driver is electrically connected with the second valve coil, the second end of the second driver is electrically connected with the control chip, the vehicle controller is electrically connected with the control chip, and the control board and the vehicle controller are integrated together, and the first valve coil and the second valve coil are dispersedly arranged. The control chip, the first driver and the second driver are arranged on the same circuit board. The first driver is connected with the first valve coil through an electric wire, the second driver is connected with the second valve coil through an electric wire, and the control chip is communicatively connected with the vehicle controller.

2. The thermal management assembly of claim 1, wherein, The control chip is used for receiving signals of the sensor and transmitting the signals to the vehicle controller.

3. The thermal management assembly of claim 1, wherein, The sensor is connected with the vehicle controller through an electric wire, and the vehicle controller is used for receiving signals of the sensor.

4. The thermal management assembly of any one of claims 1 to 3, wherein, The control chip is communicatively connected with the vehicle controller through a local internet or a controller area network.

5. The thermal management assembly of any one of claims 1 to 3, wherein, The first valve coil is an expansion valve coil or a throttle valve coil, and the second valve coil is an expansion valve coil or a throttle valve coil.

6. The thermal management assembly of any one of claims 1 to 3, wherein, The application further relates to a valve coil control method for a vehicle air conditioner, which comprises the following steps:

7. The thermal management assembly of any one of claims 1 to 3, wherein, The vehicle controller sends a first control signal and a second control signal to the control chip; 8. A thermal management control method, characterized by, The control chip sends a first driving signal to the first driver according to the first control signal, and sends a second driving signal to the second driver according to the second control signal; The first driver drives the first valve coil to operate according to the first driving signal, and the second driver drives the second valve coil to operate according to the second driving signal. The control chip receives sensing signals of the sensor and sends the sensing signals to the vehicle controller. The sensing signals of the sensor are sent to the vehicle controller through an electric wire, and the vehicle controller controls operation of the sensor. ​ 9. The thermal management control method of claim 8, wherein, ​ ​ 10. The thermal management control method of claim 8, wherein, ​ ​

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