A gallium nitride semiconductor chip soc testing device

Abstract

The present application relates to the technical field of chip testing, in particular to a gallium nitride semiconductor chip SOC testing device, which comprises a supporting component, a docking device is fixedly installed on the top front end of the supporting component, and a gallium nitride semiconductor chip is placed in the docking device; the docking device comprises a conveying table, a blocking plate, an extension support, a first circular rod, a first piston rod, a special-shaped support, an L-shaped air cylinder, a second piston rod, a first spring and a partition plate; the extension support is fixedly installed on the two side rear ends of the conveying table; the first circular rod is symmetrically and slidingly inserted into the interior of the extension support; the partition plate is fixedly installed on one end of the first circular rod close to the conveying table; the blocking plate is fixedly installed on the opposite side end of the partition plate; the first spring is symmetrically and fixedly installed between the partition plate and the extension support, and the first spring is located outside the first circular rod. Through the arrangement of the docking device and the supporting component, the purpose of precise docking and synchronous derivation of the test socket to a large number of chips is achieved.

Description

A testing device for gallium nitride semiconductor chip SOC Technical Field

[0001] This invention relates to the field of chip testing technology, specifically to a testing device for gallium nitride semiconductor chip SOC. Background Technology

[0002] Gallium nitride (GaN) is a composite semiconductor material composed of nitrogen and gallium elements, and is hailed as one of the most important semiconductor materials after silicon.

[0003] SOC testing is a series of verification and inspection processes conducted to ensure that all functions, performance, reliability, and security of highly integrated chips meet design specifications after manufacturing. It aims to screen out chips with manufacturing defects (commonly known as "bad chips") in the shortest time and at the lowest cost, ensuring that only "good chips" are delivered to customers.

[0004] Currently, when performing docking tests on gallium nitride (GaN) chips, the existing test sockets are not suitable for testing a large number of chips due to the large number of chips and the need for auxiliary alignment and point finding each time GaN chips are installed into the test socket. As a result, the existing test sockets cannot handle the testing of a large number of chips, making it impossible to perform precise docking and synchronous export. Therefore, an improved device is needed to address the above problems. Summary of the Invention

[0005] To address the problems in the prior art, the present invention provides a testing device for gallium nitride semiconductor chip SOC.

[0006] The technical solution adopted by this invention to solve its technical problem is: a gallium nitride semiconductor chip SOC testing device, including a support component, a docking device fixedly installed at the top front end of the support component, a gallium nitride semiconductor chip placed inside the docking device, the docking device including a conveying platform, a baffle plate, an extension bracket, a first round rod, a first piston rod, a shaped bracket, an L-shaped air cylinder, a second piston rod, a first spring, and a partition plate, the extension bracket is fixedly installed at the rear ends of both sides of the conveying platform, the first round rod is symmetrically slidably inserted into the interior of the extension bracket, the partition plate is fixedly installed at one end of the first round rod near the conveying platform, the baffle plate is fixedly installed at the opposite side end of the partition plate, the first spring is symmetrically fixedly installed between the partition plate and the extension bracket, and the first spring is located on the outer ring of the first round rod, the L-shaped air cylinder is fixedly installed at the center of the bottom end of the extension bracket, the first piston rod is slidably inserted into the top end of the L-shaped air cylinder, the second piston rod is slidably inserted into the bottom end of the L-shaped air cylinder, and the shaped bracket is fixedly installed at the rear end of the partition plate.

[0007] Specifically, the support component includes a displacement device and a positioning device, with the displacement device threadedly fitted inside the positioning device.

[0008] Specifically, the displacement device includes a receiving plate, a rear support, a hexagonal rod, a contact guide rod, a first rack, a horizontal plate, a second spring, an extension alignment plate, a base plate, a second rack, a first gear, an extension base frame, a second gear, a second round rod, a third spring, a limiting base frame, a limiting base plate, and a supporting horizontal plate. The first rack is fixedly installed on both sides of the horizontal plate, the hexagonal rod is fixedly installed on the top front end of the horizontal plate, the rear support is slidably sleeved on the outer ring of the hexagonal rod, the second spring is fixedly installed between the rear support and the horizontal plate, and the second spring is located on the outer ring of the hexagonal rod, the contact guide rod is symmetrically fixedly installed on the top of the horizontal plate, and the contact guide rod is located behind the second spring, and the extension base frame is symmetrically fixedly installed on the rear end. At the front bottom of the bracket, the supporting horizontal plate is fixedly installed at the front end of the extended base frame, the receiving plate is rotatably installed at the front end of the supporting horizontal plate, the limiting base frame is fixedly installed at the bottom front end of the supporting horizontal plate, the extended alignment plate is fixedly installed on both sides of the supporting horizontal plate, the base plate is fixedly installed on both sides inside the supporting horizontal plate, the second round rod is slidably inserted into the inside of the base plate, the limiting base plate is fixedly installed at the front end of the second round rod, the third spring is fixedly installed between the limiting base plate and the base plate, and the third spring is located on the outer ring of the second round rod, the second rack is fixedly installed at the rear end of the limiting base plate, the second gear is rotatably installed on the outside of the extended base frame, and the first gear is fixedly installed between the two second gears.

[0009] Specifically, the positioning device includes a receiving cavity, a test socket, a reinforcing frame, a cam, a limiting base frame, a support base, a third gear, a lead screw, a guide rod, a push plate, a third rack, a magnetic sleeve, a positioning top frame, and an extension base frame. The guide rod is fixedly installed at the top rear of the support base, the lead screw is rotatably installed at the top rear of the support base, and the lead screw is located behind the guide rod. The test socket is fixedly installed at the top front of the support base, the receiving cavity is fixedly installed at the top front of the support base, and the receiving cavity is located at the front of the test socket. The third gear is symmetrically rotatably installed at the top of the support base. The third gear is located at the rear end of the test socket, the cam is fixedly installed at the front end of the third gear, the reinforcing frame is fixedly installed at the front end of the cam, the limiting bottom frame is fixedly installed on the top ring of the support base and is located in front of the guide rod, the positioning top frame is symmetrically fixedly installed on the top of the support base and is located between the test socket and the limiting bottom frame, the extension base is slidably inserted into the top of the positioning top frame, the push plate is fixedly installed on the top of the opposite end of the extension base, the magnetic sleeve is slidably sleeved on the outer ring of the positioning top frame, and the third rack is fixedly installed at the front end of the magnetic sleeve.

[0010] Specifically, the conveyor table is fixedly installed at the top front end of the support base, the horizontal plate is threaded onto the outer ring of the lead screw, the second rack meshes with the first gear, and the outer ring surface of the cam is in contact with the surface of the extension base away from the positioning top frame.

[0011] Specifically, the conveying platform has a through hole inside near the barrier plate, and the through hole is vertically aligned with the receiving plate. The second piston rod is vertically aligned with the extension alignment plate. The L-shaped air cylinder is hollow inside, and a sealed cavity is formed between the first piston rod, the L-shaped air cylinder, and the second piston rod.

[0012] Specifically, an insulating plastic sleeve is fixedly installed on the surface of the reinforcing frame, and the magnetic sleeve is horizontally aligned with the push plate.

[0013] Specifically, the bottom end of the irregular bracket is attached to the side end of the magnetic sleeve away from the push plate, a connecting plate is installed between the first piston rod and the partition, the front end surface of the limiting base plate is set in an arc state, the front end surface of the limiting base frame is set at 45°, and the limiting base frame is vertically aligned with the rear end bracket.

[0014] Specifically, the conveyor also includes an interception cavity and a plastic pad, the plastic pad being fixedly installed at the bottom of the conveyor, and the interception cavity being fixedly installed at the bottom of the plastic pad.

[0015] Specifically, a synchronization device is symmetrically fixedly installed at the top of the test socket. The synchronization device includes a first support cavity, a limiting spring, a movable vertical frame, a Z-shaped bracket, a voltage detection component, a contact electrode, a temperature sensor, an alignment rod, a second support cavity, a pressure sensor, and a guide spring. The limiting spring is fixedly installed inside the first support cavity. The movable vertical frame is fixedly installed at one end of the limiting spring. The Z-shaped bracket is fixedly installed on the side of the movable vertical frame away from the limiting spring. The voltage detection component is fixedly installed at the end of the Z-shaped bracket away from the movable vertical frame. The contact electrode is fixedly installed on the side of the voltage detection component. The second support cavity is symmetrically fixedly installed on the side of the voltage detection component near the contact electrode. The temperature sensor is slidably inserted into the end of the second support cavity away from the voltage detection component. The alignment rod is fixedly installed at the end of the temperature sensor near the voltage detection component. The pressure sensor is fixedly installed at the inside of the second support cavity away from the temperature sensor. The guide spring is fixedly installed between the second support cavity and the temperature sensor.

[0016] The beneficial effects of this invention are:

[0017] First, this invention uses a lead screw to rotate, which causes the horizontal plate to rise as a whole, allowing the extended alignment plate to contact the second piston rod. This causes the gallium nitride semiconductor chip on the blocking plate to fall onto the receiving plate. Simultaneously, the irregular bracket can drive the third rack to move to the side, preventing the second gear from contacting the third rack when the horizontal plate moves downward. Furthermore, as the horizontal plate moves downward, the pins of the gallium nitride semiconductor chip can be inserted into the test slots in the test socket. The first rack can also drive the third gear and the reinforcing frame to rotate simultaneously, allowing the reinforcing frame to press the pins on the gallium nitride semiconductor chip, thus completing the precise chip docking.

[0018] Second, when the horizontal plate moves upward, it can drive the second gear to move and contact the third rack, so that the second gear can drive the first gear to rotate in the opposite direction. Thus, the second rack can drive the limiting plate to be pulled out from the bottom of the receiving plate. At this time, the receiving plate will be in an inclined state, and the tested gallium nitride semiconductor chip can slide down onto the receiving cavity for collection. Furthermore, when the second gear passes the third rack, the limiting plate can automatically reset, so that the limiting plate can support the receiving plate in a horizontal state, which is convenient for receiving gallium nitride semiconductor chips again, thus completing the work of guiding and discharging gallium nitride semiconductor chips. Attached Figure Description

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] Figure 1 is a three-dimensional structural diagram of the main body from a frontal perspective in this invention;

[0021] Figure 2 is a three-dimensional structural diagram of the docking device from the front view in this invention;

[0022] Figure 3 is a three-dimensional structural diagram of the support component from the front view in this invention;

[0023] Figure 4 is a partial cross-sectional schematic diagram of the displacement device in this invention;

[0024] Figure 5 is a partially enlarged schematic diagram of point A in Figure 4 of this invention;

[0025] Figure 6 is a three-dimensional structural diagram of the positioning device from the front view in this invention;

[0026] Figure 7 is a partially enlarged schematic diagram of point B in Figure 6 of this invention;

[0027] Figure 8 is a frontal perspective three-dimensional structural diagram of the second embodiment of the conveyor platform in this invention;

[0028] Figure 9 is a frontal perspective three-dimensional structural diagram of the second embodiment of the test socket in this invention;

[0029] Figure 10 is a partial cross-sectional schematic diagram of the synchronization device in this invention;

[0030] Figure 11 is a partially enlarged schematic diagram of point C in Figure 10 of this invention.

[0031] In the diagram: 1-Docking device, 2-Supporting component, 3-Gallium nitride semiconductor chip, 4-Conveying platform, 5-Blocking plate, 6-Extension bracket, 7-First round rod, 8-First piston rod, 9-Irregular bracket, 10-L-shaped air cylinder, 11-Second piston rod, 12-First spring, 13-Baffle plate, 14-Displacement device, 15-Positioning device, 16-Receiving plate, 17-Rear end bracket, 18-Hexagonal rod, 19-Contact guide rod, 20-First rack, 21-Horizontal plate, 22-Second spring, 23-Extension alignment plate, 24-Base plate, 25-Second rack, 26-First gear, 27-Extension base frame, 28-Second gear, 29-Second round rod, 30-Third spring, 31-Limiting base frame 32-Restriction base plate, 33-Supporting horizontal plate, 34-Receiving cavity, 35-Test socket, 36-Reinforcing frame, 37-Cam, 38-Restriction base frame, 39-Supporting base, 40-Third gear, 41-Screw rod, 42-Guide rod, 43-Push plate, 44-Third rack, 45-Magnetic sleeve, 46-Positioning top frame, 47-Extension base frame, 48-Interception cavity, 49-Plastic pad, 50-Synchronization device, 51-First support cavity, 52-Limiting spring, 53-Modible vertical frame, 54-Z-type bracket, 55-Voltage detection component, 56-Contact electrode plate, 57-Temperature sensor, 58-Alignment rod, 59-Second support cavity, 60-Pressure sensor, 61-Guide spring. Detailed Implementation

[0032] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0033] The invention will be further described below with reference to the accompanying drawings.

[0034] Example 1

[0035] As shown in Figures 1 and 2, a gallium nitride semiconductor chip SOC testing device of the present invention includes a support component 2. A docking device 1 is fixedly installed at the top front end of the support component 2. A gallium nitride semiconductor chip 3 is placed inside the docking device 1. The docking device 1 includes a conveyor platform 4, a baffle plate 5, an extension bracket 6, a first round rod 7, a first piston rod 8, a special-shaped bracket 9, an L-shaped air cylinder 10, a second piston rod 11, a first spring 12, and a partition plate 13. The extension bracket 6 is fixedly installed at the rear ends of both sides of the conveyor platform 4. The first round rod 7 is symmetrically slidably inserted. Inside the extension bracket 6, the partition 13 is fixedly installed at one end of the first round rod 7 near the conveyor table 4, the baffle plate 5 is fixedly installed at the opposite side of the partition 13, the first spring 12 is symmetrically fixedly installed between the partition 13 and the extension bracket 6, and the first spring 12 is located on the outer ring of the first round rod 7, the L-shaped air cylinder 10 is fixedly installed at the bottom center of the extension bracket 6, the first piston rod 8 is slidably inserted into the top of the L-shaped air cylinder 10, the second piston rod 11 is slidably inserted into the bottom of the L-shaped air cylinder 10, and the irregular bracket 9 is fixedly installed at the rear end of the partition 13.

[0036] As shown in Figure 3, the support component 2 includes a displacement device 14 and a positioning device 15. The displacement device 14 is threaded into the inside of the positioning device 15, which can support the displacement device 14 to work.

[0037] As shown in Figures 4 and 5, the displacement device 14 includes a receiving plate 16, a rear support 17, a hexagonal rod 18, a contact guide rod 19, a first rack 20, a horizontal plate 21, a second spring 22, an extension alignment plate 23, a base plate 24, a second rack 25, a first gear 26, an extension base frame 27, a second gear 28, a second round rod 29, a third spring 30, a limiting base frame 31, a limiting base plate 32, and a supporting horizontal plate 33. The first rack 20 is fixedly installed on both sides of the horizontal plate 21. The hexagonal rod 18 is fixedly installed on the top front end of the horizontal plate 21. The rear support 17 is slidably sleeved on the outer ring of the hexagonal rod 18. The second spring 22 is fixedly installed between the rear support 17 and the horizontal plate 21, and the second spring 22 is located on the outer ring of the hexagonal rod 18. The contact guide rod 19 is symmetrically fixedly installed on the top of the horizontal plate 21, and the contact guide rod 19 is located behind the second spring 22. The extension base frame 27 is symmetrically fixedly installed at the bottom front end of the rear support 17. A horizontal support plate 33 is fixedly installed at the front end of an extension base frame 27. A receiving plate 16 is rotatably installed at the front end of the horizontal support plate 33. A limiting base frame 31 is fixedly installed at the bottom front end of the horizontal support plate 33. An extension alignment plate 23 is fixedly installed on both sides of the horizontal support plate 33. A base plate 24 is fixedly installed on both sides inside the horizontal support plate 33. A second round rod 29 is slidably inserted into the inside of the base plate 24. A limiting base plate 32 is fixedly installed at the front end of the second round rod 29. A third spring 30 is fixedly installed between the limiting base plate 32 and the base plate 24, and the third spring 30 is located on the outer ring of the second round rod 29. A second rack 25 is fixedly installed at the rear end of the limiting base plate 32. A second gear 28 is rotatably installed on the outside of the extension base frame 27. A first gear 26 is fixedly installed between the two second gears 28. When the limiting base plate 32 is displaced, it can drive the second round rod 29 to slide inside the base plate 24, so that the limiting base plate 32 can be supported to move back along a straight line.

[0038] As shown in Figures 6 and 7, the positioning device 15 includes a receiving cavity 34, a test socket 35, a reinforcing frame 36, a cam 37, a limiting base frame 38, a support base 39, a third gear 40, a lead screw 41, a guide rod 42, a push plate 43, a third rack 44, a magnetic sleeve 45, a positioning top frame 46, and an extension base frame 47. The guide rod 42 is fixedly installed at the top rear of the support base 39, and the lead screw 41 is rotatably installed at the top rear of the support base 39, with the lead screw 41 located behind the guide rod 42. The test socket 35 is fixedly installed at the top front of the support base 39, and the receiving cavity 34 is fixedly installed at the top front of the support base 39, with the receiving cavity 34 located at the front front of the test socket 35. The third gear 40 is symmetrically rotated and installed on the top of the support base 39, with the third gear 40 located at the front front of the test socket 35. At the rear end of the socket 35, the cam 37 is fixedly installed at the front end of the third gear 40, the reinforcing frame 36 is fixedly installed at the front end of the cam 37, the limiting bottom frame 38 is fixedly installed on the top ring of the support base 39, and the limiting bottom frame 38 is located in front of the guide rod 42. The positioning top frame 46 is symmetrically fixedly installed on the top of the support base 39, and the positioning top frame 46 is located between the test socket 35 and the limiting bottom frame 38. The extension base frame 47 is slidably inserted into the top of the positioning top frame 46. The push plate 43 is fixedly installed on the top of the opposite end of the extension base frame 47. The magnetic sleeve 45 is slidably sleeved on the outer ring of the positioning top frame 46. The third rack 44 is fixedly installed at the front end of the magnetic sleeve 45. An anti-detachment piece is fixedly installed on the opposite end of the positioning top frame 46 to prevent the magnetic sleeve 45 from falling off when it moves.

[0039] The conveyor table 4 is fixedly installed on the top front end of the support base 39. The horizontal plate 21 is threaded onto the outer ring of the lead screw 41. The second rack 25 meshes with the first gear 26. The outer ring surface of the cam 37 is in contact with the surface of the extension base 47 away from the positioning top frame 46. The conveyor table 4 has a through hole near the baffle plate 5, and the through hole is vertically aligned with the receiving plate 16. The second piston rod 11 is vertically aligned with the extension alignment plate 23. The L-shaped air cylinder 10 is hollow inside, and the first piston rod... 8. A sealed cavity is formed between the L-shaped air cylinder 10 and the second piston rod 11. An insulating plastic sleeve is fixedly installed on the surface of the reinforcing frame 36. The magnetic sleeve 45 is horizontally aligned with the push plate 43. The bottom end of the irregular bracket 9 is attached to the side end of the magnetic sleeve 45 away from the push plate 43. A connecting plate is installed between the first piston rod 8 and the partition plate 13. The front end surface of the limiting base plate 32 is set in an arc state. The front end surface of the limiting base frame 31 is set at a 45° angle. The limiting base frame 38 is vertically aligned with the rear support 17.

[0040] The working principle of Example 1 is as follows: In use, the gallium nitride semiconductor chip 3 is first placed on the top of the two barrier plates 5. A drive motor is installed at the bottom of the support base 39, and the lead screw 41 passes through the support base 39 and is connected to the drive motor. The drive motor can be started to drive the lead screw 41 to rotate. The horizontal plate 21 is threaded onto the outer ring of the lead screw 41, so that the lead screw 41 can drive the horizontal plate 21 to move upward. At this time, the horizontal plate 21 is slidably sleeved on the outer ring of the guide rod 42, so that the horizontal plate 21 can be guaranteed to move up and down in a straight line. Subsequently, when the horizontal plate 21 moves upward, it can drive the extension alignment plate 23 to move to contact the second piston rod 11, thereby squeezing the second piston rod 11 into the interior of the L-shaped air cylinder 10. At the same time, when the second piston rod 1 When the first piston rod 8 enters the L-shaped air cylinder 10, it can be squeezed to move outward from the inside of the L-shaped air cylinder 10. This allows the first piston rod 8 to drive the partition 13 to move away from the conveyor table 4. At the same time, when the horizontal plate 21 moves upward to its limit position, the receiving plate 16 can contact the through hole at the bottom of the conveyor table 4, and the blocking plate 5 can be misaligned from the bottom of the gallium nitride semiconductor chip 3. At this time, the gallium nitride semiconductor chip 3 can fall onto the receiving plate 16 through the through hole inside the conveyor table 4, completing the placement of the gallium nitride semiconductor chip 3. Furthermore, while the partition 13 is displaced, it can also drive the irregular bracket 9 to push the magnetic sleeve 45 to move closer to the push plate 43, so that the third rack 44 can be misaligned with the second gear 28, preventing the horizontal plate 21 from moving further away. When moving downwards, the second gear 28 contacts the third rack 44. Subsequently, as the horizontal plate 21 moves downwards, it can drive the pins of the gallium nitride semiconductor chip 3 to insert into the test socket 35. The second spring 22 allows the horizontal plate 21 to continue moving downwards, thus enabling the first rack 20 to mesh with the third gear 40. This allows the third gear 40 and the reinforcing frame 36 to rotate as the horizontal plate 21 continues to move downwards. When the cam 37 rotates, the protruding part can rotate to contact the extension base 47, allowing the extension base 47 to be displaced. This allows the push plate 43 to push the magnetic sleeve 45 back to its original position, facilitating the subsequent upward movement of the horizontal plate 21. During this process, the second gear 28 contacts the third rack 44, and when the horizontal plate 21 moves downwards to its limit position... When in position, the reinforcing frame 36 can rotate to contact the pins of the gallium nitride semiconductor chip 3, thereby pressing the pins and confining the gallium nitride semiconductor chip 3 to the test socket 35, improving the testing stability of the gallium nitride semiconductor chip 3. At this time, the test socket 35 can be energized to perform performance testing on the gallium nitride semiconductor chip 3. After the gallium nitride semiconductor chip 3 has been tested, the drive motor at the bottom of the support base 39 can be restarted, causing the lead screw 41 to rotate in the opposite direction, so that the horizontal plate 21 can move upward again. At this time, the horizontal plate 21 will drive the first rack 20 to move upward, so that the third gear 40 can drive the cam 37 and the reinforcing frame 36 to rotate in the opposite direction, and the reinforcing frame 36 can disengage from the pins on the gallium nitride semiconductor chip 3.The protruding part of the cam 37 can disengage from the extension base 47. Subsequently, when the horizontal plate 21 moves upward, the contact guide rod 19 can press the rear support 17 upward, thereby supporting the receiving plate 16 to move upward. When the second gear 28 moves to contact the third rack 44, the second gear 28 can drive the first gear 26 to rotate. When the first gear 26 rotates, it can drive the second rack 25 to move to the rear, so that the limiting base plate 32 can move to the rear until the limiting base plate 32 moves out from the bottom of the receiving plate 16. At this time, the receiving plate 16 will lose the restriction of the limiting base plate 32 and rotate downward. The limiting base 31 is mounted on the supporting horizontal plate 33. The bottom end of the receiving plate 16 is tilted, allowing it to be placed at an angle. Simultaneously, the receiving plate 16 can move above the receiving cavity 34. When the receiving plate 16 is tilted, the tested gallium nitride semiconductor chip 3 can slide down along the receiving plate 16 and fall into the receiving cavity 34. Subsequently, when the horizontal plate 21 drives the second gear 28 to move past the third rack 44, the elasticity of the third spring 30 will cause the limiting base plate 32 to move forward and reset, allowing the limiting base plate 32 to move to the bottom end of the receiving plate 16. This supports the receiving plate 16 in a horizontal position, facilitating the reception of the gallium nitride semiconductor chip 3 again, thus completing the operation.

[0041] Example 2

[0042] Based on Embodiment 1, as shown in Figure 8, the conveyor table 4 also includes an interception cavity 48 and a plastic pad 49. The plastic pad 49 is fixedly installed at the bottom inside the conveyor table 4, and the interception cavity 48 is fixedly installed at the bottom inside the plastic pad 49.

[0043] In this embodiment, a plastic pad 49 is placed at the bottom front end of the receiving cavity 34, and the receiving cavity 34 is tilted at 30°. This allows the gallium nitride semiconductor chip 3 to slide down along the receiving cavity 34 and be temporarily placed inside the plastic pad 49. The plastic pad 49 prevents the gallium nitride semiconductor chip 3 from falling. Furthermore, an intercepting cavity 48 is installed at the bottom inside the plastic pad 49 to prevent the gallium nitride semiconductor chip 3 from being bumped or knocked when it falls, thus completing the operation.

[0044] Example 3

[0045] Based on Embodiment 1, as shown in Figures 9, 10, and 11, a synchronization device 50 is symmetrically fixedly installed at the top of the test socket 35. The synchronization device 50 includes a first support cavity 51, a limiting spring 52, a movable vertical frame 53, a Z-shaped bracket 54, a voltage detection component 55, a contact electrode plate 56, a temperature sensor 57, an alignment rod 58, a second support cavity 59, a pressure sensor 60, and a guide spring 61. The limiting spring 52 is fixedly installed inside the first support cavity 51, the movable vertical frame 53 is fixedly installed at one end of the limiting spring 52, and the Z-shaped bracket 54 is fixedly installed on the side of the movable vertical frame 53 away from the limiting spring 52. The measuring component 55 is fixedly installed on the Z-shaped bracket 54 at the end away from the movable vertical frame 53. The contact electrode 56 is fixedly installed on the side end of the voltage measuring component 55. The second support cavity 59 is symmetrically fixedly installed on the side end of the voltage measuring component 55 near the contact electrode 56. The temperature sensor 57 is slidably inserted into the end of the second support cavity 59 away from the voltage measuring component 55. The alignment rod 58 is fixedly installed on the end of the temperature sensor 57 near the voltage measuring component 55. The pressure sensor 60 is fixedly installed inside the second support cavity 59 away from the temperature sensor 57. The guide spring 61 is fixedly installed between the second support cavity 59 and the temperature sensor 57.

[0046] In this embodiment, the movable vertical bracket 53 is located between the cam 37 and the extension base 47. When the cam 37 rotates, the protruding end can drive the extension base 47 and the movable vertical bracket 53 to move simultaneously. When the movable vertical bracket 53 moves, it can be moved by the Z-shaped bracket 54. When the Z-shaped bracket 54 moves, it can drive the temperature sensor 57 to contact the surface of the gallium nitride semiconductor chip 3. Subsequently, when the movable vertical bracket 53 continues to move, the guide spring 61 allows the temperature sensor 57 to enter the interior of the second support cavity 59. When the temperature sensor 57 moves to contact the pressure sensor 60, the contact electrode 56 can contact the pin on the side of the gallium nitride semiconductor chip 3. Simultaneously, the pressure sensor 60 is electrically connected to the voltage detection component 55 and the temperature sensor 57, allowing them to operate synchronously. Therefore, when the contact electrode 56 contacts the pin of the gallium nitride semiconductor chip 3, the voltage fluctuation of the gallium nitride semiconductor chip 3 during operation can be measured. At the same time, when the temperature sensor 57 contacts the surface of the gallium nitride semiconductor chip 3, it can measure... The operating temperature of the gallium nitride semiconductor chip 3 is obtained. Through the temperature sensor 57 and voltage detection component 55, the voltage and operating temperature of the gallium nitride semiconductor chip 3 can be detected, realistically simulating its operating state. Subsequently, when the cam 37 resets, it disengages from the movable vertical bracket 53, causing the movable vertical bracket 53 to lose pressure. At this time, the elasticity of the limit spring 52 will drive the movable vertical bracket 53 to move and reset, thereby allowing the contact electrode plate 56 and temperature sensor 57 to disengage from the gallium nitride semiconductor chip 3. After the gallium nitride semiconductor chip 3 is subsequently removed from the interior of 35, the temperature sensor 57 is offset from the support pin on the side of the gallium nitride semiconductor chip 3 to avoid contact between the temperature sensor 57 and the support pin of the gallium nitride semiconductor chip 3, thereby improving the accuracy of the temperature sensor 57 during measurement. After the temperature sensor 57 is reset, it can drive the alignment rod 58 to disengage from the pressure sensor 60, so that the temperature sensor 57 and the voltage detection component 55 can be de-energized, avoiding prolonged operation of the voltage detection component 55 and the temperature sensor 57, thus completing the work.

[0047] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A testing device for gallium nitride semiconductor chip SOC, comprising a support component (2), wherein a docking device (1) is fixedly mounted on the top front end of the support component (2), and a gallium nitride semiconductor chip (3) is placed inside the docking device (1), characterized in that: The docking device (1) includes a conveyor platform (4), a barrier plate (5), an extension bracket (6), a first round rod (7), a first piston rod (8), a special-shaped bracket (9), an L-shaped air cylinder (10), a second piston rod (11), a first spring (12), and a partition plate (13). The extension bracket (6) is fixedly installed on both rear ends of the conveyor platform (4). The first round rod (7) is symmetrically slidably inserted into the interior of the extension bracket (6). The partition plate (13) is fixedly installed on one end of the first round rod (7) near the conveyor platform (4). The barrier plate (5) is fixedly installed on the opposite side of the partition plate (13). The first spring (12) is... The first spring (12) is located on the outer ring of the first round rod (7), the L-shaped air cylinder (10) is fixedly installed at the bottom center of the extension bracket (6), the first piston rod (8) is slidably inserted into the top of the L-shaped air cylinder (10), the second piston rod (11) is slidably inserted into the bottom of the L-shaped air cylinder (10), and the irregular bracket (9) is fixedly installed at the rear end of the partition (13); the support component (2) includes a displacement device (14) and a positioning device (15), and the displacement device (14) is threaded into the inside of the positioning device (15);The displacement device (14) includes a receiving plate (16), a rear support (17), a hexagonal rod (18), a contact guide rod (19), a first rack (20), a horizontal plate (21), a second spring (22), an extension alignment plate (23), a base plate (24), a second rack (25), a first gear (26), an extension base frame (27), a second gear (28), a second round rod (29), a third spring (30), a limiting base frame (31), a limiting base plate (32), and a supporting horizontal plate (33). The first rack (20) The hexagonal rod (18) is fixedly installed on both sides of the horizontal plate (21), and the rear end bracket (17) is slidably sleeved on the outer ring of the hexagonal rod (18). The second spring (22) is fixedly installed between the rear end bracket (17) and the horizontal plate (21), and the second spring (22) is located on the outer ring of the hexagonal rod (18). The contact guide rod (19) is symmetrically fixedly installed on the top of the horizontal plate (21), and the contact guide rod (19) is located behind the second spring (22). The extension base frame (27) is symmetrically fixedly installed at the front bottom of the rear support bracket (17). The supporting horizontal plate (33) is fixedly installed at the front end of the extension base frame (27). The receiving plate (16) is rotatably installed at the front end of the supporting horizontal plate (33). The limiting base frame (31) is fixedly installed at the bottom front end of the supporting horizontal plate (33). The extension alignment plate (23) is fixedly installed on both sides of the supporting horizontal plate (33). The base plate (24) is fixedly installed on both sides inside the supporting horizontal plate (33). The second round rod (29) is slidably inserted. Inside the substrate (24), the limiting base plate (32) is fixedly installed at the front end of the second round rod (29), the third spring (30) is fixedly installed between the limiting base plate (32) and the substrate (24), and the third spring (30) is located on the outer ring of the second round rod (29), the second rack (25) is fixedly installed at the rear end of the limiting base plate (32), the second gear (28) is rotatably installed on the outside of the extension base frame (27), and the first gear (26) is fixedly installed between the two second gears (28);The positioning device (15) includes a receiving cavity (34), a test socket (35), a reinforcing frame (36), a cam (37), a limiting bottom frame (38), a support base (39), a third gear (40), a lead screw (41), a guide rod (42), a push plate (43), a third rack (44), a magnetic sleeve (45), a positioning top frame (46), and an extension base frame (47). The guide rod (42) is fixedly installed at the top rear of the support base (39), and the lead screw (41) is rotatably installed at the top rear of the support base (39), with the lead screw (41) located behind the guide rod (42). The test socket (35) is fixedly installed at the top front end of the support base (39), and the receiving cavity (34) is fixedly installed at the top front end of the support base (39), with the receiving cavity (34) located at the front end of the test socket (35). The third gear (40) is symmetrically rotated and installed on the support base. The base (39) is located at the top, and the third gear (40) is located at the rear end of the test socket (35). The cam (37) is fixedly installed at the front end of the third gear (40). The reinforcing frame (36) is fixedly installed at the front end of the cam (37). The limiting bottom frame (38) is fixedly installed on the top ring of the support base (39) and is located in front of the guide rod (42). The positioning top frame (46) is symmetrically fixedly installed on the top of the support base (39) and is located between the test socket (35) and the limiting bottom frame (38). The extension base frame (47) is slidably inserted into the top of the positioning top frame (46). The push plate (43) is fixedly installed on the top of the opposite end of the extension base frame (47). The magnetic sleeve (45) is slidably sleeved on the outer ring of the positioning top frame (46). The third rack (44) is fixedly installed at the front end of the magnetic sleeve (45).

2. The device for testing gallium nitride semiconductor chip SOC according to claim 1, characterized in that: The conveyor table (4) is fixedly installed on the top front end of the support base (39), the cross plate (21) is threaded onto the outer ring of the lead screw (41), the second rack (25) meshes with the first gear (26), and the outer ring surface of the cam (37) is in contact with the surface of the extension base (47) away from the positioning top frame (46).

3. The device for testing gallium nitride semiconductor chip SOC according to claim 2, characterized in that: The conveying platform (4) has a through hole in the interior near the barrier plate (5), and the through hole is vertically aligned with the receiving plate (16). The second piston rod (11) is vertically aligned with the extension alignment plate (23). The interior of the L-shaped air cylinder (10) is hollow, and a sealed cavity is formed between the first piston rod (8), the L-shaped air cylinder (10), and the second piston rod (11).

4. The device for testing gallium nitride semiconductor chip SOC according to claim 3, characterized in that: An insulating plastic sleeve is fixedly installed on the surface of the reinforcing frame (36), and the magnetic sleeve (45) is horizontally aligned with the push plate (43).

5. The device for testing gallium nitride semiconductor chip SOC according to claim 4, characterized in that: The bottom end of the irregular bracket (9) is attached to the side end of the magnetic sleeve (45) away from the push plate (43). A connecting plate is installed between the first piston rod (8) and the partition plate (13). The front end surface of the limiting base plate (32) is set in an arc state. The front end surface of the limiting base frame (31) is set at a 45° angle. The limiting base frame (38) is vertically aligned with the rear support bracket (17).

6. The device for testing gallium nitride semiconductor chip SOC according to claim 5, characterized in that: The conveying platform (4) also includes an interception cavity (48) and a plastic pad (49). The plastic pad (49) is fixedly installed at the bottom inside of the conveying platform (4), and the interception cavity (48) is fixedly installed at the bottom inside of the plastic pad (49).

7. The device for testing gallium nitride semiconductor chip SOC according to claim 6, characterized in that: A synchronization device (50) is symmetrically fixedly installed at the top of the test socket (35). The synchronization device (50) includes a first support cavity (51), a limiting spring (52), a movable vertical frame (53), a Z-shaped bracket (54), a voltage detection component (55), a contact electrode plate (56), a temperature sensor (57), an alignment rod (58), a second support cavity (59), a pressure sensor (60), and a guide spring (61). The limiting spring (52) is fixedly installed inside the first support cavity (51). The movable vertical frame (53) is fixedly installed at one end of the limiting spring (52). The Z-shaped bracket (54) is fixedly installed on the side of the movable vertical frame (53) away from the limiting spring (52). The voltage detection component (55) is fixedly installed... At one end of the Z-shaped bracket (54) away from the movable vertical frame (53), the contact electrode (56) is fixedly installed on the side end of the voltage detection component (55). The second support cavity (59) is symmetrically fixedly installed on the side end of the voltage detection component (55) near the contact electrode (56). The temperature sensor (57) is slidably inserted into the end of the second support cavity (59) away from the voltage detection component (55). The alignment rod (58) is fixedly installed on the end of the temperature sensor (57) near the voltage detection component (55). The pressure sensor (60) is fixedly installed inside the second support cavity (59) away from the temperature sensor (57). The guide spring (61) is fixedly installed between the second support cavity (59) and the temperature sensor (57).

Images