Water jet wafer unloader

Abstract

This application provides a water-flushing wafer unloading machine, including a positioning mechanism, a flushing system, a collecting mechanism, and a slide mechanism. The positioning mechanism is used to carry and position a substrate, and the substrate is used to carry the wafer. The positioning mechanism is provided with a discharge end for the wafer to be discharged from the positioning mechanism. The flushing system includes a first water spraying device disposed on the positioning mechanism, which sprays water onto the wafer from the side away from the discharge end, separating the wafer from the substrate and driving the separated wafer to be discharged from the discharge end and into the slide mechanism. One end of the slide mechanism is connected to the discharge end, and the slide mechanism provides a slide for guiding the separated wafer from the discharge end to the collecting mechanism. The collecting mechanism is connected to the other end of the slide mechanism, and the collecting mechanism is provided with a receiving end not higher than the discharge end for receiving the wafer that has been separated from the substrate and guided from the slide. This solves the problems of low efficiency and easy damage when separating wafers from the substrate in related technologies.

Description

Technical Field

[0001] This application relates to the field of wafer processing technology, and more specifically, to a water-flushing wafer unloading machine. Background Technology

[0002] In the planar processing of silicon carbide (SiC) wafers, the wafers are attached to a carrier substrate to ensure processing accuracy and stability. Currently, there are two main attachment methods: one is to use liquid wax to bond the wafer to the substrate, and the other is to use a wax-free pad combined with the surface tension of water to adsorb the wafer for processing. Compared to wax bonding, wax-free pad adsorption technology avoids wax residue contamination and reduces subsequent cleaning processes, and therefore is gradually being widely used in the semiconductor manufacturing field.

[0003] However, in wax-pad-free adsorption processes, the wafer unloading stage after wafer fabrication still faces significant technical bottlenecks. Traditional unloading methods mainly rely on manual operation, such as manual peeling or separation using auxiliary mechanical means. These methods are not only inefficient and difficult to meet the needs of large-scale production, but also prone to edge damage, microcracks, or even hidden cracks on the wafers due to uneven force or mechanical contact during the peeling process, seriously affecting the wafer yield and subsequent performance. Utility Model Content

[0004] The purpose of this application is to provide a water-flushing wafer unloading machine, including a positioning mechanism, a water flushing system, a collection mechanism, and a slide mechanism;

[0005] The positioning mechanism is used to carry and position the substrate, the substrate is used to carry the wafer, and the positioning mechanism is provided with a discharge end for the wafer to be discharged from the positioning mechanism.

[0006] The flushing system includes a first water spraying device disposed on the positioning mechanism. The first water spraying device is used to spray water onto the wafer from the side of the wafer away from the discharge end, so as to separate the wafer from the substrate and drive the separated wafer to be discharged from the discharge end and enter the slide mechanism.

[0007] One end of the slide mechanism is connected to the discharge end, and the slide mechanism provides a slide for guiding the separated wafer from the discharge end to the collection mechanism;

[0008] The collecting mechanism is connected to the other end of the slide mechanism. The collecting mechanism is provided with a receiving end that is not higher than the discharge end, for receiving the wafer that has been separated from the substrate and introduced from the slide.

[0009] In one exemplary embodiment of this application, the positioning mechanism includes:

[0010] A support and limiting structure is used to support the substrate and restrict the substrate from sliding towards the discharge end;

[0011] A rotary drive structure is connected to the support and limiting structure for driving the support and limiting structure and the substrate to rotate around the central axis of the support and limiting structure, so that the wafers surrounding the substrate are sequentially aligned with the discharge end.

[0012] In one exemplary embodiment of this application, the support limiting structure includes:

[0013] Base plate;

[0014] A vertical plate is fixed to the upper surface of the base plate;

[0015] A support plate is fixed to the top of the upright plate, and a constraint cavity for limiting the sliding of the substrate is formed on the inner side of the support plate.

[0016] In one exemplary embodiment of this application, the positioning mechanism further includes a position acquisition device for acquiring the relative position of the wafer and the discharge end.

[0017] In one exemplary embodiment of this application, the collection mechanism includes:

[0018] The material receiving station shall be configured with at least two stations, and the at least two material receiving stations shall be respectively located at the receiving end and on the adjacent side of the receiving end;

[0019] A translation drive device is connected to the receiving station for driving at least two of the receiving stations to reciprocate along the receiving end and the adjacent side of the receiving end.

[0020] In one exemplary embodiment of this application, the slide mechanism includes:

[0021] The inclined slide is set downwards along the discharge end toward the receiving end;

[0022] Multiple wafer detection sensors are spaced apart along the sliding direction of the wafer on the ramp slide, for detecting the sliding state and / or damage state of the wafer on the ramp slide.

[0023] In one exemplary embodiment of this application, the water flushing system further includes a second water spraying device, which is mounted on the slide mechanism to assist the first water spraying device in spraying water along the sliding direction of the wafer.

[0024] In one exemplary embodiment of this application, a frame structure is also included for mounting and supporting the positioning mechanism, the collection mechanism, the slide mechanism, and the flushing system.

[0025] In one exemplary embodiment of this application, a door panel and a displacement device for moving the door panel are also included; when the first water sprayer sprays water, the displacement device positions the door panel to one side of the positioning mechanism to be in a closed state; when the first water sprayer stops spraying water, the displacement device moves the door panel away from the positioning mechanism to form an operation channel for picking up and placing the substrate.

[0026] In one exemplary embodiment of this application, the flushing system further includes an adjustable support base, the adjustable support base comprising:

[0027] Mounting bracket for mounting the first water spray device;

[0028] A guide rod extends vertically through the mounting base and is slidably connected to the mounting base;

[0029] A locking element is disposed between the mounting base and the guide rod to lock the mounting base and fix the mounting base to the guide rod.

[0030] The exemplary embodiments of this application may have some or all of the following beneficial effects:

[0031] In the water-flushing wafer unloading machine provided in the example embodiment of this application, when it is necessary to separate the wafer from the substrate, the substrate carrying the wafer is first placed on the positioning mechanism. Then, the first water spray device in the flushing system sprays water towards the side of the wafer away from the discharge end. Under the impact force of the water, the wafer and the substrate are separated without damage. The wafer then slides from the receiving end to the collection mechanism through the slide mechanism for collection. The entire separation and collection process is completed automatically by the unloading machine without manual intervention. Compared with traditional manual operation, this method not only significantly improves the wafer separation efficiency but also avoids mechanical contact with the wafer, making the wafer less prone to damage and effectively ensuring the integrity and yield of the wafer.

[0032] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0033] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0034] Figure 1 This paper shows a schematic diagram of the structure of a water-flushing wafer unloading machine according to an embodiment of this application;

[0035] Figure 2 A front view of a water-flushing wafer unloading machine according to an embodiment of this application is shown;

[0036] Figure 3 A side view of a water-flushing wafer unloading machine according to an embodiment of this application is shown;

[0037] Figure 4 A top view of a water-flushing wafer unloading machine according to an embodiment of this application is shown;

[0038] Figure 5 This illustration shows a schematic diagram of the supporting and limiting structure in the embodiment of this application when it is mounted on a substrate;

[0039] Figure 6 This illustration shows a schematic diagram of the supporting and limiting structure when it does not support a substrate, according to an embodiment of this application.

[0040] Figure 7 A cross-sectional view of the positioning mechanism in an embodiment of this application is shown;

[0041] Figure 8 A schematic diagram of the slide mechanism in an embodiment of this application is shown;

[0042] Figure 9 A schematic diagram of the collection mechanism in an embodiment of this application is shown;

[0043] Figure 10 A side sectional view of the collection mechanism in an embodiment of this application is shown;

[0044] Figure 11 A top view of the collection mechanism in an embodiment of this application is shown;

[0045] Figure 12 A schematic diagram of the adjustable support base in an embodiment of this application is shown;

[0046] Figure 13 A schematic diagram of the frame structure in an embodiment of this application is shown.

[0047] Explanation of reference numerals in the attached figures:

[0048] 1. Positioning mechanism; 11. Support and limiting structure; 111. Base plate; 112. Vertical plate; 113. Support plate; 12. Rotary drive structure; 121. Motor; 122. Reducer; 123. Coupling; 124. Rotating shaft; 13. Vision camera; 2. Collection mechanism; 21. Receiving station; 211. Connecting plate; 212. Positioning plate; 213. Swing rod; 214. Switching base; 215. Lead screw; 22. Translation drive device; 3. Slide mechanism; 31. Inclined slide; 32. Wafer detection sensor; 4. Water flushing system; 41. First water spray device; 42. Second water spray device; 43. Adjustable support seat; 431. Mounting seat; 432. Guide rod; 5. Door panel; 6. Displacement device; 7. Frame structure; 71. Lower profile frame; 72. Mounting seat; 73. Upper profile frame; 8. Substrate; 9. Wafer. Detailed Implementation

[0049] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this application will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore their detailed descriptions will be omitted. Furthermore, the drawings are merely illustrative of this application and are not necessarily drawn to scale.

[0050] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another, these terms are used only for convenience, such as according to the orientation of the examples in the accompanying drawings. It is understood that if the device of the icon is flipped so that it is upside down, the component described as "upper" will become the component described as "lower." When a structure is "upper" of another structure, it may mean that the structure is integrally formed on the other structure, or that the structure is "directly" mounted on the other structure, or that the structure is "indirectly" mounted on the other structure through another structure.

[0051] The terms “a,” “one,” “the,” and “at least one” are used to indicate the existence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended inclusion and to mean that there may be other elements / components / etc. in addition to the listed elements / components / etc.; the terms “first” and “second” are used only as markers and are not a limitation on the number of objects.

[0052] In this application embodiment, a water-flushing wafer unloading machine is provided, including a positioning mechanism 1, a water flushing system 4, a collection mechanism 2, and a slide mechanism 3;

[0053] The positioning mechanism 1 is used to support and position the substrate 8, the substrate 8 is used to support the wafer 9, and the positioning mechanism 1 is provided with a discharge end for the wafer 9 to be discharged from the positioning mechanism 1.

[0054] The flushing system 4 includes a first water spraying device 41 disposed on the positioning mechanism 1. The first water spraying device 41 is used to spray water onto the wafer 9 from the side away from the discharge end, so that the wafer 9 is separated from the substrate 8, and drives the separated wafer 9 to be discharged from the discharge end and enter the slide mechanism 3.

[0055] One end of the slide mechanism 3 is connected to the discharge end, and the slide mechanism 3 provides a slide for guiding the separated wafer 9 from the discharge end to the collection mechanism 2;

[0056] The collecting mechanism 2 is connected to the other end of the slide mechanism 3. The collecting mechanism 2 is provided with a receiving end that is not higher than the discharge end, for receiving the wafer 9 that has been separated from the substrate 8 after being introduced from the slide.

[0057] In this application, the receiving end is preferably set to be lower than the discharge end, the substrate 8 is preferably made of ceramic plate, and the first water spraying device 41 is preferably made of a water spray nozzle that can spray high-pressure water. It is understood that the first water spraying device 41 should also include a water supply device that can supply water to the first water spraying device 41, such as a water pump, water pipe fittings and water tank, etc. Of course, this is not a limitation.

[0058] When it is necessary to separate the wafer 9 from the substrate 8, the substrate 8 carrying the wafer 9 is first placed on the positioning mechanism 1 (usually performed by a robotic arm). Then, the first water spray device 41 of the flushing system 4 sprays water directionally along the edge of the wafer 9 (away from the discharge end). Under the impact of the water, the wafer 9 is separated from the substrate 8 without damage. The separated wafer 9 moves directionally towards the discharge end under the guidance of the water flow. Then, it is transported from the receiving end to the collection mechanism 2 by the slide mechanism 3. The entire separation and collection process is completed automatically by the wafer unloading machine without human intervention. Compared with traditional manual operation, this wafer unloading machine not only improves the separation efficiency of the wafer 9, but also protects the wafer 9, making it less prone to damage.

[0059] In this embodiment, the number of wafers 9 placed on the substrate 8 is not limited; there can be one or more. When multiple wafers 9 are placed on the substrate 8, they should be distributed around the center of the substrate 8 at intervals. In this application, it is preferable to place six wafers 9 on the substrate 8, and the six wafers 9 are distributed around each other at uniform intervals.

[0060] In this embodiment, the positioning mechanism 1 includes a support and limiting structure 11 and a rotation drive structure 12. Its operation is as follows: The robotic arm places the substrate 8 carrying the wafer 9 onto the support and limiting structure 11. The support and limiting structure 11 not only provides stable support for the substrate 8 but also effectively limits the displacement of the substrate 8 during the separation process, ensuring that the substrate 8 remains fixed when the first water spray device 41 sprays high-pressure water, thus providing good stability for the substrate 8 during the separation process from the wafer 9. The rotation drive structure 12 can drive the support and limiting structure 11 and the substrate 8 to rotate around the central axis of the support and limiting structure 11. After the first water spray device 41 washes away the wafer 9 near the discharge end, the rotation drive structure 12 then drives the support and limiting structure 11 and the substrate 8 to rotate, causing the next wafer 9 to be processed to rotate to the vicinity of the discharge end before separation. Through the above structure, the continuous separation of multiple wafers 9 on the same substrate 8 is achieved without the need for manual rotation of the substrate 8, reducing the labor intensity of operators and improving the efficiency of wafer 9 separation.

[0061] Reference Figure 5 and Figure 6 As shown in the embodiment of this application, the supporting limiting structure 11 includes:

[0062] Base plate 111;

[0063] The upright plate 112 is vertically fixed to the upper surface of the base plate 111;

[0064] A support plate 113 is fixed to the top of the upright plate 112, and a constraint cavity for limiting the sliding of the substrate 8 is formed on the inner side of the support plate 113.

[0065] In a preferred embodiment of this application, two upright plates 112 are provided, which are arranged opposite to each other. Similarly, two support plates 113 are provided, which are fixed to the top of the two upright plates 112 respectively. The opposite sides of the two support plates 113 have a symmetrical arc structure.

[0066] When the robotic arm transports the substrate 8 above the support and limiting structure 11, it places it within the constraint cavity formed between the two support plates 113. It should be noted that the thickness of the substrate 8 needs to be slightly greater than the depth of the constraint cavity to ensure that the wafer 9 remains above the support plates 113. This ensures that when the wafer 9 separates from the surface of the substrate 8 and moves, the support plates 113 will not interfere with or obstruct its movement trajectory.

[0067] Furthermore, the upper surfaces of the two support plates 113 are arranged in a stepped manner, that is, multiple constraint cavities with gradually increasing diameters can be formed between the two support plates 113 from bottom to top. When the size of the substrate 8 changes, the robot can place the substrate 8 into the constraint cavity of the corresponding diameter, thereby achieving compatibility of substrates 8 of different specifications and thus improving the applicability of the unloading machine.

[0068] Reference Figure 5 , Figure 6 and Figure 7 As shown in the embodiment of this application, the rotary drive structure 12 includes a motor 121, a reducer 122, a coupling 123, and a rotating shaft 124. In this application, the motor 121 is preferably a servo motor 121. The servo motor 121 is connected to the reducer 122, thereby transmitting the rotational power to the reducer 122. The reducer 122 reduces the speed and increases the torque of the rotational power before transmitting it to the coupling 123, driving the coupling 123 to rotate. The coupling 123 is fixedly connected to the center of the base plate 111 through the rotating shaft 124, thereby enabling the entire support and limiting structure 11 to rotate around its own center.

[0069] Reference Figure 1 and Figure 2 As shown in the embodiment of this application, the positioning mechanism 1 further includes a position acquisition device, which is used to acquire the relative position of the wafer and the discharge end.

[0070] In one possible implementation of this application, the position acquisition device includes a vision camera 13 and an image processing unit (not shown in the figure). Specifically, the field of view of the vision camera 13 can completely cover the discharge end area of ​​the positioning mechanism 1, and is used to acquire real-time position images of the wafer 9 near the discharge end; the image processing unit analyzes and processes the acquired position images of the wafer 9, calculates the alignment deviation between the current position of the wafer 9 and the discharge end, and then generates a calibration signal. After the calibration signal is transmitted to the rotary drive structure 12, the rotary drive structure 12 is started and drives the support limiting structure 11 to rotate until the position of the wafer 9 and the discharge end reach a preset alignment state. When the alignment is completed, the image processing unit terminates the calibration signal output, and the rotary drive structure 12 stops working.

[0071] Reference Figures 9-11 As shown in the embodiment of this application, the collection mechanism 2 includes a receiving station 21 and a translation drive device 22.

[0072] Specifically, at least two receiving stations 21 are provided. This application does not impose any special restrictions on the specific number of receiving stations 21; in practical applications, the specific number can be set according to production needs. For ease of explanation, a preferred embodiment with two receiving stations 21 will be described below. The two receiving stations 21 are the first receiving station and the second receiving station. During operation, the first receiving station is located at the receiving end, and the second receiving station is located on the adjacent side of the receiving end.

[0073] The translation drive device 22 uses a rodless cylinder (other equivalent linear drive mechanisms can also be used). The translation drive device 22 drives the two receiving stations 21 to reciprocate along the receiving end and its adjacent side. Its working process is as follows: In the initial state, the rodless cylinder positions the first receiving station at the receiving end to receive the separated wafers 9; at the same time, the second receiving station is located on the adjacent side for standby. After the first receiving station has collected the rated number of wafers 9, the translation drive device 22 drives the two receiving stations 21 to move linearly, so that the second receiving station is located at the receiving end, while the first receiving station 21 is located on the adjacent side of the receiving end (it can be understood that both sides of the receiving end are adjacent sides).

[0074] The above structure enables an alternating working mode of "one in use, one on standby", allowing operators to easily unload wafers 9 from the fully loaded receiving station 21 on the adjacent side while the unloading machine is running continuously, without stopping the machine, thereby improving the efficiency of wafer 9 separation operations.

[0075] In this embodiment, the receiving station 21 further includes a position detection sensor, a connecting plate 211, a positioning plate 212 for placing the material box, a fixing swing rod 213 for fixing the material box, a station switching base 214 for supporting the sliding of the two receiving stations 21, a lead screw 215 for driving the height adjustment of the receiving box, a rotating motor for driving the lead screw 215 to rotate, and a synchronous pulley assembly.

[0076] Reference Figure 8 As shown in this embodiment, the slide mechanism 3 includes a ramp slide 31 and multiple wafer detection sensors 32. The ramp slide 31 is inclined downwards along the direction from the discharge end to the receiving end. One end of the ramp slide 31 is connected to the discharge end, and the other end is connected to the receiving end. Multiple wafer detection sensors 32 are spaced apart on the ramp slide 31 to detect the sliding state and / or damage state of the wafers 9 on the ramp slide 31. Specifically, in this application, three wafer detection sensors 32 are preferably used. Multi-point detection is achieved through multiple wafer detection sensors 32, which can not only determine whether the wafers 9 are moving downwards on the ramp slide 31, but also monitor whether the wafers 9 are broken.

[0077] Reference Figure 2, Figure 3 and Figure 8 As shown in this embodiment, the flushing system 4 further includes a second water spray device 42, which assists the first water spray device 41. In this embodiment, two second water spray devices 42 are provided, each installed on one side of the ramp chute 31, for spraying water downwards along the inclined direction of the ramp chute 31. This reduces the frictional force when the wafer 9 slides on the ramp chute 31, while simultaneously increasing the thrust for the wafer 9 as it slides on the ramp chute 31, thereby improving the smoothness of the wafer 9's movement on the ramp chute 31.

[0078] Furthermore, the flushing system 4 also includes water pipes, water tanks, water pumps, etc., which supply water to the second spray device 42. The above structure is common knowledge in the industry and will not be described in detail.

[0079] Reference Figure 1 and Figure 13 As shown in the embodiment of this application, a frame structure 7 is also included. The frame structure 7 includes a lower profile frame 71, a mounting base 72, and an upper profile frame 73. The frame structure 7 is used to install and support the positioning mechanism 1, the collecting mechanism 2, the slide mechanism 3, and the flushing system 4. This provides good stability for the entire unloading machine.

[0080] In this embodiment, a door panel 5 and a displacement device 6 for moving the door panel 5 are also included. When the first water spraying device 41 sprays water, the displacement device 6 positions the door panel 5 to one side of the positioning mechanism 1 in a closed state; when the first water spraying device 41 stops spraying water, the displacement device 6 moves the door panel 5 away from the positioning mechanism 1 to form an operating channel for picking up and placing the substrate 8. Specifically, two door panels 5 are provided, with the two door panels 5 located on opposite sides of the positioning mechanism 1. The displacement device 6 in this application uses a cylinder, although this is not a limitation. The cylinder body is fixedly connected to the frame structure 7, and the piston rod end of the cylinder is fixedly connected to the door panel 5. The cylinder is used to move the door panel 5 up and down, thereby allowing the door panel 5 to move closer to or away from the positioning mechanism 1. When the first water spraying device 41 sprays water, the displacement device 6 positions the door panel 5 on both sides of the positioning mechanism 1. At this time, the door panel 5 is in a closed state to prevent water from splashing outward. When the first water spraying device 41 stops spraying water, the displacement device 6 moves the door panel 5 up or down to move away from the positioning mechanism 1. At this time, the door panel 5 is in an open state, thereby forming an operating channel on both sides of the positioning mechanism 1 for the robot arm to pass through and pick up and put down the substrate 8.

[0081] Reference Figure 1 and Figure 12As shown in the embodiment of this application, the flushing system 4 further includes an adjustable support base 43, which includes a mounting base 431, a guide rod 432, and a locking element (not shown in the figure). The first water spray device 41 is mounted and fixed on the mounting base 431. Two guide rods 432 are provided, which pass through the mounting base 431 vertically, allowing the mounting base 431 to slide along the length of the guide rods. The locking element is disposed between the mounting base 431 and the guide rods 432 to lock the mounting base 431, thus fixing the mounting base 431 to the guide rods 432. The locking element can be constructed using threaded connections, snap-fit ​​connections, or other structures that form a fixed connection through friction with the guide rods 432; no special restrictions are placed on this. Through the above structure, the first water spray device 41 can be adaptively adjusted in height according to the working conditions.

[0082] Other embodiments of this application will readily conceive of by those skilled in the art upon consideration of the specification and practice of the embodiments thereof. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not claimed in this application. The specification and embodiments are to be considered exemplary only, and the true scope and spirit of this application are indicated by the appended claims.

Claims

1. A water-flushing type wafer unloading machine, characterized in that, Includes positioning mechanism, flushing system, collection mechanism and slide mechanism; The positioning mechanism is used to carry and position the substrate, the substrate is used to carry the wafer, and the positioning mechanism is provided with a discharge end for the wafer to be discharged from the positioning mechanism. The flushing system includes a first water spraying device disposed on the positioning mechanism. The first water spraying device is used to spray water onto the wafer from the side of the wafer away from the discharge end, so as to separate the wafer from the substrate and drive the separated wafer to be discharged from the discharge end and enter the slide mechanism. One end of the slide mechanism is connected to the discharge end, and the slide mechanism provides a slide for guiding the separated wafer from the discharge end to the collection mechanism; The collecting mechanism is connected to the other end of the slide mechanism. The collecting mechanism is provided with a receiving end that is not higher than the discharge end, for receiving the wafer that has been separated from the substrate and introduced from the slide.

2. The water-flushing wafer unloading machine according to claim 1, characterized in that, The positioning mechanism includes: A support and limiting structure is used to support the substrate and restrict the substrate from sliding towards the discharge end; A rotary drive structure is connected to the support and limiting structure for driving the support and limiting structure and the substrate to rotate around the central axis of the support and limiting structure, so that the plurality of wafers surrounding the substrate are sequentially aligned with the discharge end.

3. The water-flushing wafer unloading machine according to claim 2, characterized in that, The supporting and limiting structure includes: Base plate; A vertical plate is fixed to the upper surface of the base plate; A support plate is fixed to the top of the upright plate, and a constraint cavity for limiting the sliding of the substrate is formed on the inner side of the support plate.

4. A water-flushing wafer unloading machine according to claim 2, characterized in that, The positioning mechanism also includes a position acquisition device for acquiring the relative position of the wafer and the discharge end.

5. A water-flushing wafer unloading machine according to claim 1, characterized in that, The collection mechanism includes: The material receiving station shall be configured with at least two stations, and the at least two material receiving stations shall be respectively located at the receiving end and on the adjacent side of the receiving end; A translation drive device is connected to the receiving station for driving at least two receiving stations to reciprocate along the receiving end and the adjacent side of the receiving end.

6. A water-flushing wafer unloading machine according to claim 1, characterized in that, The slide mechanism includes: The inclined slide is set downwards along the discharge end toward the receiving end; Multiple wafer detection sensors are spaced apart along the sliding direction of the wafer on the ramp slide, for detecting the sliding state and / or damage state of the wafer on the ramp slide.

7. A water-flushing wafer unloading machine according to claim 1, characterized in that, The flushing system also includes a second water spray device, which is installed on the slide mechanism to assist the first water spray device in spraying water along the sliding direction of the wafer.

8. A water-flushing wafer unloading machine according to claim 1, characterized in that, It also includes a frame structure for mounting and supporting the positioning mechanism, the collection mechanism, the slide mechanism, and the flushing system.

9. A water-flushing wafer unloading machine according to claim 1, characterized in that, It also includes a door panel and a displacement device that moves the door panel; when the first water sprayer sprays water, the displacement device positions the door panel to one side of the positioning mechanism to be in a closed state; when the first water sprayer stops spraying water, the displacement device moves the door panel away from the positioning mechanism to form an operating channel that can pick up and put down the substrate.

10. A water-flushing wafer unloading machine according to claim 1, characterized in that, The flushing system also includes an adjustable support base, which comprises: Mounting bracket for mounting the first water spray device; A guide rod extends vertically through the mounting base and is slidably connected to the mounting base; A locking element is disposed between the mounting base and the guide rod to lock the mounting base and fix the mounting base to the guide rod.

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