Wafer processing device

Abstract

The embodiment of the invention provides a wafer processing device which comprises a cavity, an adjusting plate and a spraying head arranged in the cavity, a window is formed in the top wall of the cavity, the adjusting plate is erected above the top wall through at least two lifting assemblies, and the spraying head is connected with the adjusting plate through a connecting rod penetrating through the window; wherein the lifting assembly comprises a connecting piece, a lifting piece and a movable piece, the connecting piece is arranged above the adjusting plate, a first through hole is formed in the adjusting plate, the lifting piece is arranged in the first through hole in a penetrating mode, the connecting piece is connected with the top wall through the lifting piece, and the adjusting plate is connected with the connecting piece through the movable piece; the lifting assemblies are configured in the mode that when the lifting piece in any lifting assembly ascends or descends, the movable piece drives one side of the adjusting plate to synchronously ascend or descend, so that the angle of the adjusting plate is changed. According to the wafer processing device, the wafer can be uniformly processed.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more specifically, to a wafer processing apparatus. Background Technology

[0002] Wafer processing apparatuses typically process wafers using techniques such as cleaning, etching, and plasma-enhanced chemical vapor deposition (PECVD). One type of wafer processing apparatus includes a cavity containing a tray and spray heads. The spray heads deliver processing gases into the cavity to process the wafers on the trays. In such a cavity, if the spray heads are at an angle to the trays, the wafers may be subjected to non-uniform processing during the wafer processing.

[0003] To address this, existing technologies typically involve manually measuring and adjusting the spray nozzles and trays during wafer processing assembly to ensure parallelism. However, due to factors such as the high-temperature environment during the process, the trays gradually deform during operation, causing the spray nozzles and trays to lose parallelism, thus resulting in substandard wafer processing quality. Summary of the Invention

[0004] Embodiments of this application provide a wafer processing apparatus that can at least to some extent uniformly process wafers.

[0005] This application provides a wafer processing apparatus, including a cavity with a window on its top wall; an adjustment plate mounted above the top wall via at least two lifting assemblies; and a spray head disposed inside the cavity and connected to the adjustment plate via a connecting rod passing through the window. Each lifting assembly includes a connector, a lifting member, and a movable member. The connector is disposed above the adjustment plate, which has a first through hole. The lifting member passes through the first through hole, and the connector is connected to the top wall via the lifting member. The adjustment plate is connected to the connector via the movable member. The lifting assembly is configured such that when any one of the lifting members rises or falls, the movable member causes one side of the adjustment plate to rise or fall synchronously, thereby changing the angle of the adjustment plate.

[0006] Specifically, the adjusting plate and / or the connecting member are provided with a second through hole, and the movable member is a connecting rod with an anti-detachment part. The connecting rod moves up and down in the second through hole under the drive of the lifting member.

[0007] Specifically, a spring is provided between the connector and the adjusting plate, and the spring is sleeved on the outside of the connecting rod.

[0008] Specifically, the adjusting plate and / or the connecting member are provided with a limiting groove, the movable member is a connecting rod with a slider, the slider is slidably engaged in the limiting groove, and the cross-section of the limiting groove is larger than the cross-section of the slider.

[0009] Specifically, the depth of the limiting groove is greater than the thickness of the slider, and the difference between the depth of the limiting groove and the thickness of the slider is greater than or equal to one-third of the thickness of the slider.

[0010] Specifically, each of the lifting components includes a plurality of the connecting rods, which are evenly distributed around the lifting component.

[0011] Specifically, the movable component consists of two adjusting rods that are rotatably connected.

[0012] Specifically, the lifting component is hinged to the top wall of the cavity.

[0013] Specifically, there are three lifting components, which are evenly distributed around the connecting rod.

[0014] Specifically, it also includes an elastic seal for sealing the gap between the connecting rod and the window.

[0015] Specifically, the connecting rod is a hollow tube, and the elastic seal has a fluid inlet. The connecting rod is connected to a first fluid supply device, and the fluid inlet is connected to a second fluid supply device.

[0016] The wafer processing apparatus of this application adjusts the level of the adjustment plate by a lifting assembly, thereby adjusting the level of the spray head relative to the tray, so that the wafer can be processed uniformly.

[0017] Other features and advantages of this application will become apparent from the following detailed description, or may be learned in part from practice of this application.

[0018] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort. In the drawings:

[0020] Figure 1 This paper shows a cross-sectional view of a wafer processing apparatus according to one embodiment of the present application.

[0021] Figure 2 It shows Figure 1 A partial structural diagram of the lifting component in a wafer processing device;

[0022] Figure 3A This diagram illustrates the usage state of a wafer processing apparatus according to one embodiment of the present application.

[0023] Figure 3B It shows Figure 3A Another schematic diagram of the wafer processing apparatus of the embodiment in use;

[0024] Figure 4A A schematic diagram of the wafer processing apparatus in use according to yet another embodiment of this application is shown;

[0025] Figure 4B It shows Figure 4A Another schematic diagram of the wafer processing apparatus of the embodiment in use;

[0026] Figure 5A A schematic diagram of the wafer processing apparatus in use according to yet another embodiment of this application is shown;

[0027] Figure 5B It shows Figure 5A Another schematic diagram of the wafer processing apparatus of the embodiment in use;

[0028] Figure 6A A schematic diagram of the wafer processing apparatus in use according to yet another embodiment of this application is shown;

[0029] Figure 6B It shows Figure 6A Another schematic diagram of the wafer processing apparatus of the embodiment in use;

[0030] Figure 7 This paper shows a cross-sectional view of a wafer processing apparatus according to one embodiment of the present application.

[0031] Figure 8 A schematic diagram of the wafer processing apparatus in use according to another embodiment of this application is shown.

[0032] Among them, 100 is the spray head, 200 is the top wall of the cavity, 300 is the leveling mechanism, 301 is the adjusting plate, 3011 is the first through hole, 3012 is the protrusion, 302 is the lifting rod, 303 is the driving component, 3031 is the connecting plate, 304 is the spring, 305 is the connecting rod, 306 is the limiting plate, 307 is the second through hole, 308 is the limiting groove, 309 is the slider, 310 is the bushing, 400 is the connecting rod, 500 is the first bellows, and 600 is the second fluid supply device. Detailed Implementation

[0033] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.

[0034] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.

[0035] Please refer to Figures 1 to 8 This application provides a wafer processing apparatus for adjusting the angle between the spray head 100 and the tray, and also for adjusting the distance between the spray head 100 and the tray, so that the wafer can be processed uniformly.

[0036] The wafer processing apparatus includes a cavity and a tray and a spray head 100 disposed within the cavity. The wafer is placed on the tray, and the spray head 100 is positioned above the tray. A first fluid supply device supplies a first fluid to the spray head 100 via a hollow connecting rod 400, and the spray head 100 supplies the first fluid to the wafer on the tray for wafer processing.

[0037] like Figure 1 As shown, a leveling mechanism 300 is provided above the top wall 200 of the cavity. The leveling mechanism 300 is connected to the spray head 100 via a connecting rod 400 to adjust the angle between the spray head 100 and the tray (not shown). The top wall 200 of the cavity has a window through which the connecting rod 400 passes. The area of ​​the window is larger than the cross-sectional area of ​​the connecting rod 400, allowing the connecting rod 400 to move within the window when the angle of the spray head 100 is adjusted. In this embodiment, placing the leveling mechanism 300 outside the cavity causes less interference to the interior of the cavity compared to placing it inside, and also better ensures the cleanliness of the interior of the cavity.

[0038] A first bellows 500 is fitted over the connecting rod 400. One end of the first bellows 500 is sealed to the connecting rod 400, and the other end covers the window and is sealed to the top wall 200 of the cavity. This seal prevents contaminants from outside the cavity from entering through the window, thus improving the yield after wafer processing. In other embodiments of this application, the first bellows 500 can be replaced with an elastic cap or other elastic sealing element. For example, the first bellows 500 is an elastic ring fitted over the connecting rod 400. The inner ring of the elastic ring is sealed to the connecting rod 400, and the outer ring is sealed to the window.

[0039] The first bellows 500 has a fluid inlet on its side wall, which communicates with a second fluid supply device 600 located outside the cavity, for introducing a second fluid into the cavity. The second fluid enters the gap between the first bellows 500 and the connecting rod 400 through the fluid inlet, and then enters the cavity through the gap between the connecting rod 400 and the window. This prevents the first fluid entering the cavity through the connecting rod 400 from accumulating at the top of the cavity, thus avoiding the formation of particles from the first fluid in the top space of the cavity that fall onto the wafer and contaminate it. Simultaneously, depending on the needs of the wafer processing process, at least two fluids can be simultaneously introduced into the cavity through the connecting rod 400 and the fluid inlet, which can improve the efficiency of wafer processing. For example, the second fluid can be nitrogen or other purging gases, or other fluids used to alter the cavity environment or participate in reactions.

[0040] The wafer processing apparatus of this application includes an adjustment plate mounted above a top wall via at least two lifting assemblies. The adjustment plate and the at least two lifting assemblies constitute a leveling mechanism 300. Each lifting assembly includes a connector, a lifting component, and a movable component.

[0041] like Figure 1As shown, in this embodiment, the connecting member is specifically implemented as a driving member 303, and the lifting member is specifically implemented as a lifting rod 302. An adjusting plate 301 is disposed above the top wall 200 of the cavity and connected to the spray head 100 via a connecting rod 400. The driving member 303 is disposed above the adjusting plate 301 and connected to the adjusting plate 301 via a movable member. The adjusting plate 301 has a first through hole 3011. One end of the lifting rod 302 passes through the first through hole 3011 and connects to the driving member 303. The other end of the lifting rod 302 is fixedly connected to the top wall 200 of the cavity, so that the adjusting plate 301 can be raised and lowered by the driving member 303. The diameter of the first through hole 3011 is larger than the diameter of the lifting rod 302, thereby providing space for the lifting rod 302 to move within the first through hole 3011. The leveling mechanism 300 includes multiple driving members 303 distributed above the adjusting plate 301, each driving member 303 being connected to a lifting rod 302. The driving component 303 can be a motor, electric cylinder, or pneumatic cylinder, etc. In other embodiments of this application, the lifting rod 302 can also be a lifting shaft, lifting slide rail, or other lifting component. In other embodiments of this application, the driving component 303 can be located in other positions, and a connecting plate or other connecting component is provided above the adjusting plate 301 to connect with the lifting rod 302.

[0042] In one specific implementation, such as Figure 3AAs shown, the movable components are a connecting rod 305 and a limiting piece 306 that is fixedly fitted to the connecting rod 305. A second through hole 307 is provided on the adjusting plate 301. One end of the connecting rod 305 is fixedly connected to the driving member 303, and the other end passes through the second through hole 307 and engages with the limiting piece 306 to connect the driving member 303 to the adjusting plate 301. The distance from the limiting piece 306 to the driving member 303 is greater than the thickness of the adjusting plate 301, and the size of the limiting piece 306 is greater than the second through hole 307. Therefore, the connecting rod 305 can move up and down within the second through hole 307, and the limiting piece 306 can prevent the connecting rod 305 from disengaging from the driving member 303 and the adjusting plate 301. To allow the adjusting plate 301 to tilt, the area of ​​the second through hole 307 is greater than the cross-sectional area of ​​the connecting rod 305. When the lifting rod 302 of a driving component 303 rises, the lifting rod 302 sequentially exerts an upward force on the adjusting plate 301 through the driving component 303, the connecting rod 305, and the limiting piece 306 located below the adjusting plate 301, thereby causing one side of the adjusting plate 301 to rise and changing the level of the adjusting plate 301. There can be one or more connecting rods 305 on a driving component 303. When there are multiple connecting rods 305, they are arranged around the lifting rod 302 so that the limiting piece 306 located below the adjusting plate 301 can always exert an upward force on the adjusting plate 301 when the adjusting plate 301 is at any angle. Multiple lifting rods 302 adjust the level of the adjusting plate 301 by adjusting the height of different positions of the adjusting plate 301, thereby adjusting the level of the spray head 100 and achieving angle adjustment between the spray head 100 and the tray. In other embodiments of this application, the limiting piece 306 is integrally formed with the connecting rod 305.

[0043] Reference Figure 2 A spring 304 is also provided between the driving member 303 and the adjusting plate 301. The spring 304 is sleeved on the connecting rod 305 and supports the driving member 303, so that there is a certain space between the driving member 303 and the adjusting plate 301, so that the driving member 303 will not interfere with the change of the level of the adjusting plate 301. When the lifting rod 302 of one of the driving members 303 descends, the lifting rod 302 exerts a downward force on the adjusting plate 301 through the driving member 303 and the spring in sequence, thereby driving one side of the adjusting plate 301 to descend, so as to change the level of the adjusting plate 301. In other embodiments of this application, the spring 304 is sleeved on the lifting rod 302 located between the driving member 303 and the adjusting plate 301, or the spring 304 is directly fixed to the driving member 303, or the spring 304 is directly fixed to the adjusting plate 301. The spring 304 can also be replaced with other elastic support members that do not affect the rotation of the driving member 303 and the lifting rod 302.

[0044] like Figure 3BAs shown, when the lifting rods 302 of one or more driving members 303 rise or fall to different heights, different positions on the surface of the adjusting plate 301 are subjected to upward or downward forces of different magnitudes, causing the different positions on the surface of the adjusting plate 301 to rise or fall accordingly, thereby changing the levelness of the adjusting plate 301 and thus adjusting the levelness of the spray head 100. The space between the second through hole 307 on the adjusting plate 301 and the driving member 303 provides space for the adjusting plate 301 to rotate relative to the connecting rod 305, and also restricts the rotation angle of the adjusting plate 301, thereby limiting the rotation angle of the adjusting plate 301 so that the spray head 100 maintains that angle after rotating to a set angle. In addition, the rotation angle of the adjusting plate 301 is also limited by the first through hole 3011. Since the area of ​​the first through hole 3011 is larger than the cross-sectional area of ​​the lifting rod 302, the inner edge of the first through hole 3011 does not contact the side wall of the lifting rod 302 under normal circumstances. When the inner edge of the first through hole 3011 abuts against the side wall of the lifting rod 302, the adjusting plate 301 stops rotating.

[0045] When the lifting rods 302 of multiple drive components 303 rise to the same height simultaneously, different positions on the surface of the adjusting plate 301 are subjected to the same upward force, causing the adjusting plate 301 to drive the spray head 100 to rise. When the lifting rods 302 of multiple drive components 303 fall to the same height simultaneously, different positions on the surface of the adjusting plate 301 are subjected to the same downward force, causing the adjusting plate 301 to drive the spray head 100 to fall.

[0046] In other embodiments of this application, such as Figure 4A As shown, a connecting plate 3031 protrudes below the driving component 303. A second through hole 307 is provided on the connecting plate 3031 of the driving component 303. One end of the connecting rod 305 is fixed to the adjusting plate 301, and the other end passes through the second through hole 307 on the connecting plate 3031 and cooperates with the limiting piece 306 to connect the driving component 303 and the adjusting plate 301. The area of ​​the second through hole 307 is larger than the cross-sectional area of ​​the connecting rod 305. When the adjusting plate 301 is in a horizontal state, the lifting rod 302 supports the driving component 303, and the limiting piece 306 is in contact with the connecting plate 3031. The connecting plate 3031 suspends the adjusting plate 301 above the top wall 200 of the cavity through the limiting piece 306 and the connecting rod 305. Figure 4BAs shown, when the lifting rod 302 of one or more driving components 303 rises or falls, different positions on the surface of the adjusting plate 301 are subjected to upward or downward forces of different magnitudes, causing the adjusting plate 301 to tilt, thereby adjusting the levelness of the spray head 100. When the adjusting plate 301 is subjected to a tilting force, since the connecting rod 305 and the adjusting plate 301 are fixedly connected, the adjusting plate 301 exerts a tilting force on the connecting rod 305 in the second through hole 307. The connecting rod 305 transmits this tilting force to the limiting plate 306, which rotates around one side of the limiting plate as a fulcrum, causing the connecting rod 305 to rotate in the second through hole 307 and rise relative to the second through hole 307, thereby causing the connecting rod 305 to tilt the adjusting plate 301. In other embodiments of this application, both the connecting plate 3031 and the adjusting plate 301 are provided with a second through hole 307. The area of ​​the second through hole 307 on the connecting plate is larger than the area of ​​the cross-section of the connecting rod 305, and the area of ​​the second through hole 307 on the adjusting plate 301 is larger than the area of ​​the cross-section of the connecting rod 305.

[0047] In other embodiments of this application, the connecting rod 305 can also be replaced by a screw and nut structure, with the screw inserted into the second through hole 307 and the nut serving as an anti-loosening structure. The area of ​​the second through hole 307 is larger than the cross-sectional area of ​​the screw.

[0048] In other embodiments of this application, such as Figure 5AAs shown, the adjusting plate 301 and the driving component 303 are connected by a connecting rod 305 and a limiting groove 308. Specifically, one end of the connecting rod 305 is fixedly connected to the driving component 303, and the other end of the connecting rod 305 is connected to a slider 309. A limiting groove 308 is formed on the adjusting plate 301, and the slider 309 is engaged in the limiting groove 308. The slider 309 is cut from a surface perpendicular to the opening of the limiting groove 308. The cross-section of the slider 309 is smaller than the opening cross-section of the limiting groove 308, and the width of the slider 309 is greater than the width of the opening of the limiting groove 308, so that the slider 309 can move within the limiting groove 308 without detaching from it. The thickness of the slider 309 is less than the depth of the limiting groove 308. For example, the difference between the depth of the limiting groove 308 and the thickness of the slider 309 is not less than one-third of the thickness of the slider 309, so that the limiting groove 308 can be tilted relative to the slider 309. A certain space is left between the adjusting plate 301 and the driving component 303 to allow the adjusting plate 301 to adjust its level. When the lifting rod 302 of one driving component 303 rises, the lifting rod 302 applies an upward force to the adjusting plate 301 through the driving component 303, connecting rod 305, slider 309, and the opening of the limiting groove 308, causing one side of the adjusting plate 301 to rise. When the lifting rod 302 of one driving component 303 falls, the lifting rod 302 applies a downward force to the adjusting plate 301 through the driving component 303, connecting rod 305, slider 309, and the bottom of the limiting groove 308, causing one side of the adjusting plate 301 to fall, thus changing the level of the adjusting plate 301. The extension direction of the limiting groove 308 is set as needed. Figure 5B As shown, when the lifting rod 302 of one or more driving components 303 rises or falls, the lifting rod 302 causes the adjusting plate 301 to tilt, and the limiting groove 39 on the adjusting plate 301 also tilts. Under the action of gravity, the limiting groove 308 slides downward relative to the slider 309. When the slider 309 slides to the end of the limiting groove 308, it stops sliding, and the adjusting plate 301 completes the adjustment. The tilt angle of the adjusting plate 301 is related to the length of the limiting groove 308. The tilt angle of the adjusting plate 301 is also related to the depth of the limiting groove 308.

[0049] In other embodiments of this application, such as Figure 6A As shown, the limiting groove 308 is disposed on the connecting plate 3031 of the driving component 303, the connecting rod 305 is connected to the limiting groove 308 through the slider 309, and the connecting rod 305 is fixedly connected to the adjusting plate 301. Figure 6B As shown, when the lifting rod 302 of one or more driving components 303 rises or falls, the lifting rod 302 causes the adjusting plate 301 to tilt. Under the action of gravity, the adjusting plate 301 drives the slider 309 to slide downward in the limiting groove 308 through the connecting rod 305. When the slider 309 slides to the end of the limiting groove 308, it stops sliding, and the position of the adjusting plate 301 is adjusted.

[0050] In other embodiments of this application, limiting grooves 308 are provided on the connecting plate 3031 of the adjusting plate 301 and the driving member 303, and both ends of the connecting rod 305 are slidably connected to the limiting grooves 308 through sliders 309.

[0051] In other embodiments of this application, the structure of the leveling mechanism 500 differs from the aforementioned embodiments, specifically in the connection method between the driving member 303 and the adjusting plate 301. For example... Figure 7 As shown, rotating shafts protrude from both sides of the driving component 303, and two protrusions 3011 are provided on the adjusting plate 301. Each protrusion 3011 is provided with a bushing 310 adapted to the rotating shaft, so that the driving component 303 and the adjusting plate 301 are connected through the rotating shaft and the bushing 310. Specifically, the driving component 303 and the rotating shaft are fixedly connected, the adjusting plate 301 and the protrusions 3011 are fixedly connected, the protrusions 3011 and the bushings 310 are fixedly connected, while the rotating shaft and the bushing 310 are rotatably connected. A certain distance is left between the driving component 303 and the adjusting plate 301 to provide adjustment space for the adjusting plate 301. The lifting rod 302, the driving component 303, the protrusions 3011, the rotating shaft, and the bushing 310 constitute a lifting assembly. There are multiple lifting assemblies, evenly distributed on the adjusting plate 301. Figure 8 As shown, when the lifting rod 302 in a set of lifting components rises, the raised lifting rod 302 sequentially applies an upward force to one side of the adjusting plate through the driving member 303, the rotating shaft, and the bushing 310, thereby changing the angle of the adjusting plate 301. Since the rotating shaft and the bushing 310 are rotatably connected, and there is an adjustment space between the driving member 303 and the adjusting plate 301, the angle between the adjusting plate 301 and the driving member 303 can change. In other embodiments of this application, the rotating shaft is disposed on the protrusion 3011, and the bushing 310 is connected to the driving member 303. In other embodiments of this application, the bushing 310 can be replaced by a rotating hole formed on the protrusion, the diameter of which is equal to the diameter of the rotating shaft. In other embodiments of this application, the rotating shaft, the bushing 310, and the protrusion 3011 can be replaced with other connecting structures. For example, the adjusting plate 301 and the driving component 303 can be connected by two rotatably connected adjusting rods, one of which is connected to the adjusting plate 301 and the other is connected to the driving component 303.

[0052] In other embodiments of this application, refer again to Figure 1The lifting rod 302 is connected to the top wall 200 of the cavity via a ball joint structure. In this embodiment, one end of the lifting rod 302 can rotate relative to the adjusting plate 301 via the driving member 303. The first through hole of the adjusting plate 301 can limit the angle between the lifting rod 302 and the adjusting plate 301. When the lifting rod 302 contacts the first through hole, the first through hole will push the lifting rod 302 to rotate relative to the top wall 200 of the cavity via the ball joint structure, thereby changing the angle between the lifting rod 302 and the top wall 200 of the cavity, so that the lifting rod 302 tilts, making it easier to adjust the level of the adjusting plate 301. At the same time, since there are multiple lifting rods 302, and the rotation angle between the lifting rod 302 and the adjusting plate 301 is limited by the first through hole, after each lifting rod 302 rises to a set height, the rotation angle of each lifting rod 302 will be limited by the other lifting rods 302. Therefore, the adjusting plate 301 can be fixed at the set angle. In other embodiments of this application, the lifting rod 302 can be connected to the top wall 200 of the cavity via a hinge structure or a rotating structure that can change the angle between the projection of the adjusting plate 301 and the lifting rod 302 in the vertical plane.

[0053] Preferably, there are three lifting rods 302, and the three lifting rods 302 are not collinear, so that while each lifting rod 302 is stably limited, the adjusting plate 301 can tilt at multiple angles, thereby better adjusting the level of the spray head 100 relative to the tray. For example, the three lifting rods 302 can be evenly arranged around the connecting rod 400. The lifting rods 302 are located at the edge of the adjusting plate 301 to avoid the distance between adjacent lifting rods 302 being too close, which would prevent the adjusting plate 301 from being unable to adjust the angle. The diameter of the adjusting plate 301 or the diameter of the circumscribed circle of the adjusting plate 301 is greater than or equal to the diameter of the spray head 100.

[0054] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the embodiments disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein.

[0055] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A wafer processing apparatus, characterized in that, include: The cavity has a window on its top wall; The adjustment plate is mounted above the top wall via at least two lifting components; A spray head is disposed inside the cavity and connected to the adjusting plate via a connecting rod passing through the window; The lifting assembly includes a connector, a lifting component, and a movable component. The connector is located above the adjusting plate. The adjusting plate has a first through hole, and the lifting component passes through the first through hole. The connector is connected to the top wall through the lifting component. The adjusting plate and the connector are connected through the movable component. The lifting assembly is configured such that when any lifting component in the lifting assembly rises or falls, the movable component drives one side of the adjusting plate to rise or fall synchronously, so as to change the angle of the adjusting plate.

2. The wafer processing apparatus according to claim 1, characterized in that, The adjusting plate and / or the connecting member are provided with a second through hole. The movable member is a connecting rod with an anti-detachment part. The connecting rod moves up and down in the second through hole under the drive of the lifting member.

3. The wafer processing apparatus according to claim 2, characterized in that, A spring is provided between the connector and the adjusting plate, and the spring is sleeved on the outside of the connecting rod.

4. The wafer processing apparatus according to claim 1, characterized in that, The adjusting plate and / or the connecting member have a limiting groove. The movable member is a connecting rod with a slider. The slider is slidably engaged in the limiting groove. The cross-section of the limiting groove is larger than the cross-section of the slider.

5. The wafer processing apparatus according to claim 4, characterized in that, The depth of the limiting groove is greater than the thickness of the slider, and the difference between the depth of the limiting groove and the thickness of the slider is greater than or equal to one-third of the thickness of the slider.

6. The wafer processing apparatus according to claim 2, characterized in that, Each of the lifting components includes a plurality of links, which are evenly distributed around the lifting member.

7. The wafer processing apparatus according to claim 1, characterized in that, The movable component consists of two adjusting rods, which are rotatably connected.

8. The wafer processing apparatus according to claim 1, characterized in that, The lifting component is hinged to the top wall of the cavity.

9. The wafer processing apparatus according to claim 1, characterized in that, The number of lifting components is three, and the three lifting components are evenly distributed around the connecting rod.

10. The wafer processing apparatus according to claim 1, characterized in that, It also includes a resilient seal for sealing the gap between the connecting rod and the window.

11. The wafer processing apparatus according to claim 10, characterized in that, The connecting rod is a hollow tube, and the elastic seal has a fluid inlet. The connecting rod is connected to a first fluid supply device, and the fluid inlet is connected to a second fluid supply device.

Images