PCB embedded power module package

Abstract

The invention provides a printed circuit board (PCB) embedded power module package, which comprises a plurality of upper bridge arm power chips and lower bridge arm power chips, and further comprises an upper layer copper foil connected with an upper bridge arm direct current input terminal, a middle layer copper foil connected with a lower bridge arm direct current output terminal, and a lower layer copper foil connected with an alternating current output terminal, a plurality of open holes are formed in the middle layer copper foil at intervals; drain electrodes of the plurality of upper bridge arm power chips are respectively connected with the first thick copper piece, drain electrodes of the plurality of lower bridge arm power chips are respectively connected with the second thick copper piece, and the plurality of upper bridge arm power chips and the plurality of lower bridge arm power chips are arranged in a spaced and staggered mode. The stray inductance level in the package can be greatly reduced, the integrity and stability of signal transmission are improved, and electromagnetic interference is reduced; the heat dissipation performance is optimized, effective heat dissipation of the silicon carbide chip during high-power work is ensured, the service life of the chip is prolonged, and the system reliability is improved; the stray inductance is reduced, and the heat dissipation performance is optimized.

Description

Technical Field

[0001] This invention relates to the field of chip module packaging technology, and more specifically, to a PCB embedded power module package. Background Technology

[0002] In power electronic devices, with technological advancements and increasing demands, silicon carbide (SiC) chip power modules are gradually becoming mainstream in high-frequency, high-power-density applications. However, traditional packaging technologies face several challenges, particularly regarding stray inductance and thermal management. Stray inductance can cause voltage spikes and electromagnetic interference in circuits, affecting the efficiency and reliability of power devices. Existing patents only reduce parasitic inductance using a single layer of copper foil, which still suffers from high thermal resistance and large package size. Meanwhile, with increasing power density, thermal management becomes a critical issue in packaging design. Insufficient heat dissipation can lead to device overheating, accelerated aging, or even failure. Summary of the Invention

[0003] In view of this, the purpose of the present invention is to provide a PCB embedded power module package to solve the above problems.

[0004] The present invention adopts the following solution: This application provides a PCB embedded power module package, including multiple upper bridge arm power chips, multiple lower bridge arm power chips, an upper copper foil connected to the DC input terminal of the upper bridge arm, an intermediate copper foil connected to the DC output terminal of the lower bridge arm, a lower copper foil connected to the AC output terminal, and multiple thick copper pieces for mounting the power chips; the intermediate copper foil is provided with multiple openings at intervals; the drains of the multiple upper bridge arm power chips are respectively connected to a first thick copper piece, and the drains of the multiple lower bridge arm power chips are respectively connected to a second thick copper piece, and the multiple upper bridge arm power chips and the multiple lower bridge arm power chips are spaced apart and staggered; The upper bridge arm power chip is positioned at the opening location. The first thick copper element is connected to the upper copper foil, and the source of the upper bridge arm power chip is connected to the lower copper foil. The second thick copper element is connected to the lower copper foil, and the source of the lower bridge arm power chip is connected to the intermediate copper foil. An upper signal copper layer and a lower signal copper layer are also provided between the upper copper foil and the lower copper foil. The gate of the upper bridge arm power chip is connected to the upper signal copper layer, and the gate of the lower bridge arm power chip is connected to the lower signal copper layer.

[0005] Furthermore, the power chip and the thick copper component are connected to the upper copper foil, the middle copper foil, and the lower copper foil through numerous copper blocks.

[0006] Furthermore, the copper block is columnar.

[0007] Furthermore, the copper block is a cylinder with a radius of 0.1 mm.

[0008] Furthermore, an intermediate copper foil is provided between the first thick copper component and the upper copper foil, and they are connected by the copper block.

[0009] Furthermore, a ceramic substrate is connected to the upper side of the upper copper foil and the lower side of the lower copper foil.

[0010] Furthermore, thermally conductive copper layers are also connected to the outer sides of the ceramic substrates on both the upper and lower sides.

[0011] Furthermore, an insulating medium is filled between at least the upper copper foil and the lower copper foil.

[0012] Furthermore, the spacing between two adjacent power chips is 15mm.

[0013] By adopting the above technical solution, the present invention can achieve the following technical effects: This application provides a PCB embedded power module package that can significantly reduce the stray inductance level inside the package, improve the integrity and stability of signal transmission, and reduce electromagnetic interference; optimize heat dissipation performance to ensure effective heat dissipation of silicon carbide chips when operating at high power, extend chip life and improve system reliability; due to the reduction of stray inductance and optimization of heat dissipation performance, the packaging structure of this invention can support the application of silicon carbide chips with higher power density, meeting the future power electronic equipment's demand for miniaturization and lightweighting. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of a PCB embedded power module packaging structure according to an embodiment of the present invention; Figure 2 This is a partially exploded structural diagram of a PCB embedded power module package according to an embodiment of the present invention; Figure 3 yes Figure 2 Enlarged schematic diagram of part of the structure; Figure 4 This is a partial cross-sectional schematic diagram of a PCB embedded power module package according to an embodiment of the present invention; Figure 5This is a schematic diagram of the structure of the first thick copper part and the upper bridge arm power chip mounting in a PCB embedded power module package according to an embodiment of the present invention; Figure 6 This is a diagram showing the extraction result of the parasitic inductance of a single-phase main circuit in a PCB embedded power module package according to an embodiment of the present invention; Icons: 1. Upper bridge arm power chip; 2. Lower bridge arm power chip; 3. Upper bridge arm DC input terminal; 4. Lower bridge arm DC output terminal; 5. Middle layer copper foil; 6. Lower layer copper foil; 7. First thick copper component; 8. Opening; 9. Second thick copper component; 10. Upper signal copper layer; 11. Lower signal copper layer; 12. Copper block; 13. Middle copper foil; 14. Ceramic substrate; 16. Thermally conductive copper layer; 17. Insulating medium; 18. AC output terminal; 19. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to represent selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] Example Combination Figures 1 to 6 As shown, this embodiment provides a PCB embedded power module package, including multiple upper bridge arm power chips 1, multiple lower bridge arm power chips 2, and also includes an upper copper foil 3 connected to the upper bridge arm DC input terminal 4, an intermediate copper foil 6 connected to the lower bridge arm DC output terminal 5, a lower copper foil 7 connected to the AC output terminal 19, and multiple thick copper pieces with mounting slots for mounting the power chips; the intermediate copper foil 6 is provided with multiple openings 9 at intervals; the multiple upper bridge arm power chips 1 are mounted in the mounting slots, and their drains are respectively connected to the first thick copper piece 8; the multiple lower bridge arm power chips 2 are also mounted in the mounting slots, and their drains are respectively connected to the second thick copper piece 10, and the multiple upper bridge arm power chips 1 and the lower bridge arm power chips 2 are spaced apart and staggered; The upper bridge arm power chip 1 is positioned at the opening 9. The first thick copper element 8 is connected to the upper copper foil 3, meaning the drain of the upper bridge arm power chip 1 is connected to the upper copper foil 3 via the first thick copper element 8. The source of the upper bridge arm power chip 1 is connected to the lower copper foil 7. The second thick copper element 10 is connected to the lower copper foil 7, meaning the drain of the lower bridge arm power chip 2 is connected to the lower copper foil 7 via the second thick copper element 10. The source of the lower bridge arm power chip 2 is connected to the intermediate copper foil 6. An upper signal copper layer 11 and a lower signal copper layer 12 are also provided between the upper copper foil 3 and the lower copper foil 7. The gate of the upper bridge arm power chip 1 is connected to the upper signal copper layer 11, and the gate of the lower bridge arm power chip 2 is connected to the lower signal copper layer 12.

[0018] The upper bridge arm power chip 1 and the lower bridge arm power chip 2 described above are oriented in opposite directions in their three-dimensional structure and are staggered in pairs, preferably with a staggered distance of 15mm, forming a spatial structure. The current flow is as follows: the external power supply is connected to the upper bridge arm DC input terminal 4, flows through the upper copper foil 3 to the first thick copper piece 8, flows from the drain of the upper bridge arm power chip 1 to the upper bridge arm power chip 1, then from the source of the upper bridge arm power chip 1 to the lower copper foil 7, then from the lower copper foil 7 to the second thick copper piece 10, flows through the drain of the lower bridge arm power chip 2 to the lower bridge arm power chip 2, then from the source of the lower bridge arm power chip 2 to the middle copper foil 6, and finally flows out through the lower bridge arm DC output terminal 5.

[0019] In the spatial structure formed above, when the two ends of a component are connected in an up-down opposite manner, the current in the upper copper foil 3 (DC+) flows downward and the current in the middle copper foil 6 (DC-) flows upward. The two DC terminals are located on the same side, and their current flows are opposite. Thus, according to the electromagnetic principle, stray inductance can be canceled.

[0020] Furthermore, the power chip and the thick copper component are connected to the upper copper foil 3, the middle copper foil 6, and the lower copper foil 7 via numerous copper blocks 13. Each copper block 13 is a cylinder with a radius of 0.1 mm. Copper blocks 13 are formed by laser drilling and copper injection, replacing traditional bonding wires. This copper block 13 connection method not only effectively reduces stray inductance but also, due to copper's excellent heat dissipation properties, optimizes the heat dissipation performance of the PCB-embedded power module while achieving electrical conduction, ensuring stable electrical contact and mechanical strength when the PCB-embedded power module is connected to the system.

[0021] An intermediate copper foil 14 is provided between the first thick copper component 8 and the upper copper foil 3, and the first thick copper component 8 and the intermediate copper foil 14, as well as the upper copper foil 3 and the intermediate copper foil 14, are connected by the copper block 13; the intermediate copper foil 14 increases the heat dissipation area and improves the heat dissipation efficiency.

[0022] In this embodiment, an insulating medium 18 is filled between at least the upper copper foil 3 and the lower copper foil 7 to achieve electrical isolation of the main circuit. A ceramic substrate 16 is also connected to the upper side of the upper copper foil 3 and the lower side of the lower copper foil 7. The ceramic substrate uses aluminum nitride (thermal conductivity 320 W / m·K) as an insulating layer to prevent electrical short circuits; its excellent thermal conductivity can efficiently conduct the heat generated by the silicon carbide chip during operation to the outside, significantly improving the heat dissipation efficiency of the PCB embedded power module package. A thermally conductive copper layer 17 is also connected to the outer side of the upper and lower ceramic substrates 16, efficiently conducting the heat generated by the silicon carbide chip during operation to the outside, significantly improving the heat dissipation efficiency of the PCB embedded power module package.

[0023] By adopting the above technical solution, the present invention can achieve the following technical effects: This application provides a PCB embedded power module package, from Figure 6 It is evident that it can significantly reduce the stray inductance level inside the package, improve the integrity and stability of signal transmission, and reduce electromagnetic interference; optimize heat dissipation performance, ensure effective heat dissipation of silicon carbide chips when operating at high power, extend chip lifespan, and improve system reliability; due to the reduction of stray inductance and optimization of heat dissipation performance, the packaging structure of this invention can support silicon carbide chip applications with higher power density, meeting the future power electronic equipment's requirements for miniaturization and lightweighting.

[0024] The above are merely preferred embodiments of the present invention. The scope of protection of the present invention is not limited to the above embodiments. All technical solutions that fall within the scope of the present invention are within the scope of protection of the present invention.

[0025] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0027] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0028] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

Claims

1. A PCB embedded power module package comprising a plurality of upper bridge arm power chips (1), a plurality of lower bridge arm power chips (2), characterized in that, The upper copper foil (3) is connected with the upper bridge arm DC input terminal (4), the middle copper foil (6) is connected with the lower bridge arm DC output terminal (5), the lower copper foil (7) is connected with the AC output terminal (19), and a plurality of thick copper pieces for mounting power chips are arranged; the middle copper foil (6) is provided with a plurality of openings (9); the drains of the plurality of upper bridge arm power chips (1) are respectively connected with the first thick copper pieces (8), the drains of the plurality of lower bridge arm power chips (2) are respectively connected with the second thick copper pieces (10), and the plurality of upper bridge arm power chips (1) and the lower bridge arm power chips (2) are arranged in intervals and staggered. The upper bridge arm power chip (1) is arranged at the position of the opening (9), the first thick copper piece (8) is connected to the upper copper foil (3), and the source of the upper bridge arm power chip (1) is connected to the lower copper foil (7); the second thick copper piece (10) is connected to the lower copper foil (7), and the source of the lower bridge arm power chip (2) is connected to the middle copper foil (6); the upper copper foil (3) and the lower copper foil (7) are further provided with an upper signal copper layer (11) and a lower signal copper layer (12); the gate of the upper bridge arm power chip (1) is connected to the upper signal copper layer (11), and the gate of the lower bridge arm power chip (2) is connected to the lower signal copper layer (12).

2. The PCB-embedded power module package of claim 1, wherein, The power chip and the thick copper piece are connected to the upper copper foil (3), the middle copper foil (6) and the lower copper foil (7) through a plurality of copper blocks (13).

3. The PCB-embedded power module package of claim 2, wherein, The copper block (13) is a column.

4. The PCB-embedded power module package of claim 3, wherein, The copper block (13) is a cylinder with a radius of 0.1 mm.

5. The PCB-embedded power module package of claim 3, wherein, The first thick copper piece (8) and the upper copper foil (3) are connected through the copper block (13).

6. The PCB-embedded power module package of any of claims 1-5, wherein, The upper side of the upper copper foil (3) and the lower side of the lower copper foil (7) are further connected with a ceramic substrate (16).

7. The PCB-embedded power module package of claim 6, wherein, The outer side of the ceramic substrate (16) on the upper and lower sides is further connected with a heat-conducting copper layer (17).

8. The PCB-embedded power module package of any of claims 1-5, wherein, At least an insulating medium (18) is filled between the upper copper foil (3) and the lower copper foil (7).

9. The PCB-embedded power module package of any of claims 1-5, wherein, The interval between two adjacent power chips is 15 mm.

Images