Gallium nitride wafer surface quality detection device
By using a hydraulic rod and servo motor driven adjustment system and an airbag cleaning system, the problems of unstable wafer positioning and dust affecting detection in existing devices have been solved. This has enabled the switching of multi-spectral detection modes and efficient cleaning, improving the stability and accuracy of gallium nitride wafer detection.
Patent Information
- Application Number
- CN202511528772.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-24
- Publication Date
- 2025-12-23
AI Technical Summary
Existing gallium nitride wafer surface quality inspection devices cannot effectively align wafers of different sizes, and dust easily adheres during the inspection process, affecting the inspection results. The optical measurement module has a fixed angle and a single spectral detection mode, making it difficult to achieve targeted inspection.
The adjustment system, driven by a hydraulic rod and a servo motor, adjusts the angle and position of the wafer through a bevel gear and a transmission threaded rod. Combined with an airbag cleaning system and multispectral detection mode switching, it enables the limiting and cleaning of wafers of different sizes, improving detection stability and accuracy.
It achieves stable positioning and cleaning of wafers of different sizes, improves the accuracy and flexibility of detection, and enhances the clarity of optical measurements and the adaptability of multispectral detection.
Smart Images

Figure CN121186084A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the field of wafer detection, and particularly discloses a gallium nitride wafer surface quality detection device. BACKGROUND
[0002] The gallium nitride wafer is an artificial synthetic material used for manufacturing high-performance semiconductor devices, belongs to the third generation of wide-bandgap semiconductors, and the wafer detection device plays multiple key roles in semiconductor manufacturing. The wafer is a core basic material for semiconductor manufacturing and is mainly used for producing integrated circuits (IC) and other electronic components. The wafer detection device mainly has core functions such as defect detection, process control, improvement of production efficiency and quality assurance. Through high-resolution optical imaging and image processing technology, the wafer surface scratches, particle contamination, photoresist residue and other tiny defects can be quickly identified, and defect classification and positioning can be realized.
[0003] The existing gallium nitride wafer surface quality detection device has some problems in actual use. For example, the device disclosed in the patent with the publication number CN115325963A is a wafer surface three-dimensional topography measurement device and a measurement method thereof. When detecting the wafer, the wafer is placed on the object table for support and placement, which can assist the optical measurement module in detecting the wafer surface quality. The surface of the object table is mostly flat, and the produced wafers cannot be positioned when placed on the object table. If the placement is offset, the detection effect of the optical measurement module will be affected. In addition, the size of the wafer varies with the type of the wafer, and the object table cannot limit and align the wafer when the wafer is placed, which affects the detection stability and is not convenient for aligning and limiting wafers of different sizes. At the same time, when the wafer is placed for detection, the wafer is exposed and placed on the object table, and the surface of the wafer is easy to stick some dust and impurities. The residual dust and impurities can affect the detection data of the optical measurement module and affect the subsequent comparison and viewing of the quality. It is not convenient to clean and protect the dust on the surface of the wafer. At the same time, during the optical detection process, the position is adjusted every time, which will directly affect the detection result. If there is a tiny defect on the surface of the wafer, the change in the inclination angle may cause the defect characteristics to be blocked or enlarged, affecting the accuracy of defect identification.
[0004] In the scheme disclosed in the patent with the publication number CN115325963A, the motion shaft is used for moving left and right and forward and backward, and the use angle of the wafer cannot be adjusted, which affects the measurement clarity of the optical measurement module. In addition, the observation angle of the existing detection structure camera is fixed, the defect imaging effect cannot be optimized, the spectral detection mode is single and inconvenient to switch, and targeted detection cannot be realized.
[0005] Therefore, it is necessary to provide a gallium nitride wafer surface quality detection device to meet the needs of users. SUMMARY
[0006] In view of the problems that the existing gallium nitride wafer surface quality detection device is inconvenient to move and angle adjust and align the wafer, and inconvenient to limit and clean dust of wafers of different sizes, the present application is proposed.
[0007] To solve the above technical problems, according to one aspect of the present application, the present application provides the following technical scheme: a gallium nitride wafer surface quality detection device, comprising a base, a hydraulic rod is fixedly connected to the base, a detector is installed on the hydraulic rod, an optical detection lens is installed on the detector, a control panel is installed on the base, an adjusting box is fixedly connected to the base, a sliding ball is limitingly and slidably connected in the adjusting box, a first servo motor is fixedly connected to the adjusting box, a first bevel gear is fixedly connected to the output shaft of the first servo motor, a second bevel gear is meshingly connected to the first bevel gear, a connecting box is fixedly connected to the second bevel gear, a second servo motor is fixedly connected in the connecting box, a transmission threaded rod is fixedly connected to the output shaft of the second servo motor, the transmission threaded rod is rotatably connected in the connecting box, a moving plate is threadedly connected to the transmission threaded rod, a limiting box is fixedly connected to the moving plate, a third servo motor is installed on the limiting box, an inner ring gear is bearingly connected in the limiting box, a transmission gear is meshingly connected to the inner ring gear, a connecting rod is fixedly connected to the transmission gear;
[0008] As a preferred scheme of the present application, wherein: the sliding balls are equiangularly distributed in the adjusting box, and the top end surface of the sliding ball is in close contact with the bottom end surface of the connecting box.
[0009] As a preferred scheme of the present application, wherein: the output shaft of the second servo motor is fixedly connected to the center part of one end of the transmission threaded rod, and the bottom end surface of the moving plate is in close contact with the inner bottom end surface of the connecting box.
[0010] As a preferred scheme of the present application, wherein: the output shaft of the third servo motor is fixedly connected to the center part of the end of one connecting rod, the inner ring gear and the transmission gear are in the same horizontal line, the transmission gears are equiangularly distributed in the inner ring gear, and the transmission gears and the clamps correspond one by one through the connecting rods.
[0011] As a preferred scheme of the present application, wherein: the connecting rod is fixedly connected to the center part of the transmission gear, the connecting rod is rotatably connected to the limiting box, the clamps are fixedly connected to the connecting rod, and the bottom end surface of the clamp is in close contact with the inner part of the limiting box.
[0012] As a preferred scheme of the present application, wherein: the inner ring gear is fixedly connected to a push plate, a gas distribution box is fixedly connected in the limiting box, the push plate is in the shape of an isosceles triangle in cross section, a spray head is fixedly connected to the gas distribution box, a gas bag is fixedly connected to the gas distribution box, and the gas bags are equiangularly distributed on the gas distribution box.
[0013] As a preferred scheme of the present application, wherein: the hydraulic rod is fixedly connected with a positioning plate, the base is rotatably connected with a two-way threaded rod, the two-way threaded rod is fixedly connected with a rotating disc, the two-way threaded rod is threadedly connected with a moving frame, and the moving frame is fixedly connected with an extrusion block.
[0014] As a preferred scheme of the present application, wherein: the side of the detector is provided with a moving groove, a first connecting plate is slidably installed in the moving groove, an adjusting assembly is installed below the first connecting plate, a second connecting plate is fixedly connected to the first connecting plate, a damping plate is slidably installed in the second connecting plate, and a filter is fixedly connected to the bottom of the damping plate.
[0015] As a preferred scheme of the present application, wherein: the top of the damping plate is fixedly connected with a connecting ring, a plurality of filters are arranged side by side below the damping plate, a first damping block is fixedly arranged in the second connecting plate, and the first damping block protrudes from the surface of the second connecting plate.
[0016] As a preferred scheme of the present application, wherein: the adjusting assembly comprises a connecting shaft rotatably installed in the first connecting plate, a camera sensor is fixedly connected to the connecting shaft, a second damping block is abutted between the camera sensor and the first connecting plate, a rotating wheel is arranged on the side of the connecting shaft, and the rotating wheel is rotatably connected to the first connecting plate.
[0017] Compared with the prior art, the present application has the following advantages:
[0018] 1. When adjusting the use angle of the device, the first servo motor on the adjusting box can be turned on to drive the first bevel gear to rotate, the first bevel gear can drive the connecting box to rotate through the second bevel gear, and the connecting box can be supported and moved by the plurality of sliding balls at the bottom, thereby improving the stability of the connecting box during movement and facilitating the adjustment of the detection angle of the placed wafer.
[0019] 2. The second servo motor controls the rotation of the transmission threaded rod, the transmission threaded rod can push the moving plate to move left or right, and the moving plate can adjust the position of the installed limiting box during movement, so that the position can be adjusted according to the use condition.
[0020] 3. When limiting and aligning the wafer, the wafer can be placed in the groove of the limiting box, the third servo motor can be turned on to drive the connecting rod to rotate, the connecting rod can drive the transmission gear to rotate, the inner gear ring can drive the plurality of transmission gears engaged therewith to rotate when the inner gear ring is pushed to rotate by the transmission gear, the connecting rod on the transmission gear drives the clamping plate to rotate, and the equiangularly distributed clamping plates can clamp and align the placed wafer, thereby facilitating the limiting of wafers of different sizes and improving the use effect.
[0021] 4. During the limiting process, the push plate on the internal gear ring can push the airbag on the air distribution box. The airbag can push the gas into the air distribution box, and the multiple nozzles on the air distribution box can blow air to clean the surface of the wafer at the limiting point, thereby improving the subsequent testing effect.
[0022] 5. The device is equipped with an adjustment component. When the adjustment component is working, rotating the rotating wheel drives the connecting shaft to rotate. The second damping block keeps the angle between the rotating wheel and the camera sensor fixed after adjustment, allowing the camera sensor to adjust the angle at which it receives light. At the same time, the device can pull the connecting ring, moving the filter upwards, allowing the device to receive different light and enabling rapid switching between multiple detection modes. The operator can select the most suitable filter for detection based on the preliminary morphology of the defects observed on site. This solves the problems of existing detection cameras having fixed observation angles, single spectral detection modes, and inconvenient switching, making it difficult to achieve targeted detection. Attached Figure Description
[0023] To more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and detailed embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:
[0024] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention;
[0025] Figure 2 This is a side view of the detector structure of the present invention;
[0026] Figure 3 This is a side view of the regulating box structure of the present invention;
[0027] Figure 4 This is a top view schematic diagram of the transmission threaded rod structure of the present invention;
[0028] Figure 5 This is the present invention. Figure 2 Enlarged structural diagram at point A in the middle;
[0029] Figure 6 This is a side view of the limiting box structure of the present invention;
[0030] Figure 7 This is a top view schematic diagram of the internal gear ring structure of the present invention;
[0031] Figure 8 This is a schematic diagram of the airbag structure of the present invention viewed from below;
[0032] Figure 9 This is a top view schematic diagram of the clamping plate structure of the present invention;
[0033] Figure 10 is a schematic view of the side structure of the push plate of the present application;
[0034] Figure 11 is a schematic view of the side structure of the positioning plate of the present application;
[0035] Figure 12 is a schematic view of the enlarged structure at B in the present application; Figure 2
[0036] Figure 13 is a schematic view of the connection structure of the first and second adapter plates of the present application;
[0037] Figure 14 is a schematic view of the enlarged structure at A in the present application; Figure 13
[0038] Figure 15 is a schematic view of the split structure of the second adapter plate and the detector of the present application.
[0039] The reference signs: 1, base; 2, hydraulic rod; 3, detector; 4, optical detection lens; 5, control panel; 6, adjusting box; 7, sliding ball; 8, first servo motor; 9, first bevel gear; 10, second bevel gear; 11, connecting box; 12, second servo motor; 13, transmission threaded rod; 14, moving plate; 15, limiting box; 16, third servo motor; 17, inner gear ring; 18, transmission gear; 19, connecting rod; 20, clamping plate; 21, push plate; 22, air distribution box; 23, spray head; 24, air bag; 25, positioning plate; 26, bidirectional threaded rod; 27, turntable; 28, moving frame; 29, extrusion block; 30, moving groove; 31, first adapter plate; 32, second adapter plate; 33, optical filter; 34, damping plate; 35, first damping block; 36, connecting ring; 37, adjusting assembly; 3701, camera sensor; 3702, connecting shaft; 3703, rotating wheel; 3704, second damping block. DETAILED DESCRIPTION
[0040] In order to make the above-mentioned objects, features and advantages of the present application more apparent and easy to understand, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings.
[0041] In the following description, a lot of specific details are set forth in order to give a full and thorough understanding of the present application, but the present application can also be implemented in other ways different from those described herein, and those skilled in the art can make similar generalizations without departing from the connotation of the present application, therefore the present application is not limited by the specific embodiments disclosed below.
[0042] Secondly, the application is described in detail in combination with the schematic diagram. In the detailed description of the embodiments of the application, the sectional view of the device structure is partially enlarged without the general proportion for the convenience of illustration, and the schematic diagram is only an example which should not limit the scope of protection of the application. In addition, the three-dimensional spatial dimensions of length, width and depth should be included in the actual production.
[0043] Embodiments
[0044] In order to make the purpose, technical scheme and advantages of the application more clear, the embodiments of the application will be further described in detail below in combination with the drawings.
[0045] As Figures 1-15 shown, a gallium nitride wafer surface quality detection device, including the base 1, the base 1 is fixedly connected with the hydraulic rod 2, the hydraulic rod 2 is installed with the detector 3, the detector 3 is installed with the optical detection lens 4, the base 1 is installed with the control panel 5, the base 1 is fixedly connected with the adjusting box 6, the adjusting box 6 is limitedly and slidably connected with the slide bead 7, the adjusting box 6 is fixedly connected with the first servo motor 8, the output shaft of the first servo motor 8 is fixedly connected with the first bevel gear 9, the first bevel gear 9 is meshingly connected with the second bevel gear 10, the second bevel gear 10 is fixedly connected with the connecting box 11, the connecting box 11 is fixedly connected with the second servo motor 12 in it, the output shaft of the second servo motor 12 is fixedly connected with the transmission threaded rod 13, the transmission threaded rod 13 is rotatably connected in the connecting box 11, the transmission threaded rod 13 is threadedly connected with the moving plate 14, the moving plate 14 is fixedly connected with the limit box 15, the limit box 15 is installed with the third servo motor 16, the limit box 15 is bearingly connected with the inner ring gear 17, the inner ring gear 17 is meshingly connected with the transmission gear 18, the transmission gear 18 is fixedly connected with the connecting rod 19; the first bevel gear 9 can drive the connecting box 11 to rotate through the second bevel gear 10, so as to adjust the angle, the moving plate 14 can adjust the position of the installed limit box 15 when moving, the position can be adjusted according to the use, the connecting rod 19 on the transmission gear 18 drives the clamping plate 20 to rotate, the equiangularly distributed clamping plates 20 can clamp and align the placed wafer, which is convenient for limiting the wafers of different sizes.
[0046] In the embodiment, the sliding beads 7 are distributed at equal angles in the adjusting box 6, the top end surface of the sliding beads 7 is attached to the bottom end surface of the connecting box 11, the output shaft of the second servo motor 12 is fixedly connected to the center of one end of the transmission screw rod 13, the bottom end surface of the moving plate 14 is attached to the bottom end surface in the connecting box 11, the movement of the moving plate 14 can adjust the position of the equipment, and the multiple sliding beads 7 distributed at equal angles can support and hold the connecting box 11, so as to ensure the stability of the connecting box 11 during movement and avoid shaking and tilting. When the moving plate 14 drives the limiting box 15 to adjust the left and right positions, the moving plate 14 can move stably by being attached and held by the inner surface of the connecting box 11.
[0047] In the embodiment, the output shaft of the third servo motor 16 is fixedly connected to the center of the end of the one-side connecting rod 19, and the inner gear ring 17 and the transmission gear 18 are in the same horizontal line, so that the rotation of the inner gear ring 17 can drive the transmission gears 18 distributed at equal angles to rotate simultaneously, and the installed third servo motor 16 can drive the one-side connecting rod 19 to rotate stably.
[0048] In the embodiment, the transmission gears 18 are distributed at equal angles in the inner gear ring 17, the transmission gears 18 are one-to-one corresponding to the clamping plates 20 through the connecting rods 19, the connecting rods 19 are fixedly connected to the center of the transmission gears 18, the connecting rods 19 are rotatably connected to the limiting box 15, the clamping plates 20 are fixedly connected to the connecting rods 19, the bottom end surface of the clamping plates 20 is attached to the inside of the limiting box 15, the clamping plates 20 distributed at equal angles can clamp and limit wafers of different sizes, and the clamping plates 20 attached to the limiting box 15 can stably clamp and limit the placed wafers.
[0049] In the embodiment, the inner gear ring 17 is fixedly connected with the push plate 21, the limiting box 15 is fixedly connected with the gas distribution box 22, the push plate 21 is in the shape of an isosceles triangle in cross section, the gas distribution box 22 is fixedly connected with the spray head 23, the gas distribution box 22 is fixedly connected with the air bag 24, and the air bags 24 are distributed at equal angles on the gas distribution box 22, so that the push plates 21 distributed at equal angles can push the corresponding air bags 24, the gas in the air bags 24 can clean the surface dust of the placed wafers, and the multiple air bags 24 distributed at equal angles can improve the gas delivery amount and the cleaning effect of the spray head 23.
[0050] In the embodiment, the hydraulic rod 2 is fixedly connected with the positioning plate 25, the base 1 is rotatably connected with the bidirectional screw rod 26, the bidirectional screw rod 26 is fixedly connected with the rotating disc 27, the bidirectional screw rod 26 is threadedly connected with the moving frame 28, and the moving frame 28 is fixedly connected with the extrusion block 29, so that the hydraulic rod 2 and the connected parts can be disassembled and installed on the base 1, the disassembly is convenient for storage and transportation, and the space occupied by the equipment is saved.
[0051] In this embodiment, a moving groove 30 is provided on the side of the detector 3. A first connecting plate 31 is slidably installed in the moving groove 30. An adjustment component 37 is installed below the first connecting plate 31. A second connecting plate 32 is fixedly connected to the first connecting plate 31. A damping plate 34 is slidably installed in the second connecting plate 32. A filter 33 is fixedly connected to the bottom of the damping plate 34. The damping plate 34 can remain fixed after adjusting its position, thereby using different filters 33 for detection, which enhances the adjustability of the device. The moving groove 30, in conjunction with the first connecting plate 31, enables the second connecting plate 32 to move vertically up and down, and maintains a certain resistance after moving to a suitable position.
[0052] In this embodiment, a connecting ring 36 is fixedly connected to the top of the damping plate 34, and multiple filters 33 are arranged side by side below the damping plate 34. A first damping block 35 is fixedly arranged inside the second connecting plate 32. The first damping block 35 protrudes from the surface of the second connecting plate 32. The first damping block 35 is used to increase the resistance of the second connecting plate 32 to move up and down, so that the second connecting plate 32 remains fixed after moving to a suitable position.
[0053] In this embodiment, the adjustment component 37 includes a connecting shaft 3702 rotatably mounted in the first connecting plate 31. A camera sensor 3701 is fixedly connected to the connecting shaft 3702. A second damping block 3704 is abutting between the camera sensor 3701 and the first connecting plate 31. A rotating wheel 3703 is provided on the side of the connecting shaft 3702. The rotating wheel 3703 is rotatably connected to the first connecting plate 31. After the external light source illuminates the wafer, the light passes through the filter 33, and light of a specific wavelength is reflected onto the photosensitive surface of the camera sensor 3701. By switching the filter 33 with different optical characteristics into the optical path, the wavelength of the light reflected to the camera sensor 3701 can be changed, thereby achieving targeted high-contrast imaging of different types of defects.
[0054] It should be noted that this invention is a gallium nitride wafer surface quality inspection device, firstly combined with... Figures 1-12When aligning the wafer, the wafer can be placed in the groove of the limiting box 15. The third servo motor 16 is turned on to drive the connecting rod 19 on one side to rotate. The connecting rod 19 can drive the transmission gear 18 to rotate. When the transmission gear 18 pushes the internal gear ring 17 to rotate, the internal gear ring 17 can drive the meshing multiple transmission gears 18 to rotate. The connecting rod 19 on the transmission gear 18 drives the clamping plate 20 to rotate. The clamping plates 20, which are distributed at equal angles, can clamp and align the placed wafer, which is convenient for limiting wafers of different sizes and improving the use effect. The surface of the installed clamping plate 20 is provided with a rubber coating, which can increase the contact friction during clamping and prevent slippage and tilting. At the same time as the wafer is limited, the clamping plates 20, which are distributed at equal angles, can push the wafer to be placed in the center of the groove of the limiting box 15, which can be aligned below the optical inspection lens 4, ensuring that the optical inspection lens 4 can perform clear image acquisition.
[0055] The second servo motor 12 controls the rotation of the transmission threaded rod 13, which can push the moving plate 14 to move left or right. When the moving plate 14 moves, it can adjust the position of the installed limit box 15. The position can be adjusted according to the usage. During the limiting process, the push plate 21 on the internal gear ring 17 can push the air bag 24 on the air distribution box 22. The air bag 24 can push gas into the air distribution box 22. The multiple nozzles 23 on the air distribution box 22 can blow air to clean the wafer surface of the limit, improving the subsequent inspection effect.
[0056] When the wafer's operating angle needs to be adjusted for auxiliary inspection, the first servo motor 8 on the adjustment box 6 can be turned on to drive the first bevel gear 9 to rotate. The first bevel gear 9 can drive the connecting box 11 to rotate through the second bevel gear 10. When the connecting box 11 rotates, it can be supported and moved by multiple sliding balls 7 at the bottom, which improves the stability of the connecting box 11 during movement and facilitates the adjustment of the detection angle between the limiting box 15 and the wafer. The adjustment of the angle can cause the defect features to be obscured or magnified, affecting the accuracy of defect identification.
[0057] The installed control panel 5 controls the operation of the equipment. The hydraulic rod 2 on the base 1 can adjust the height of the detector 3. The detector 3 and the optical inspection lens 4 can inspect whether the wafer meets the production requirements. During the inspection process, the data is transmitted to the computer screen for staff to analyze and view.
[0058] When the wafer is subsequently disassembled and removed, the right-side transmission gear 18 rotates in the opposite direction. The rotation of the transmission gear 18 synchronously drives the internal gear ring 17 to rotate in the opposite direction. The multiple connecting rods 19 drive the clamping plate 20 to rotate in the opposite direction. The clamping plate 20 can release the clamped wafer and remove the wafer after testing. After the push plate 21 is disengaged from the airbag 24, the airbag 24 is not obstructed and can reset to suck air, ensuring that air blowing can be performed for cleaning during the next push.
[0059] When disassembling the hydraulic rod 2, the rotatable turntable 27 drives the bidirectional threaded rod 26 to rotate. The bidirectional threaded rod 26 can drive the two side movable frames 28 to move outward. At the same time, the pressing block 29 on the movable frame 28 can be disassembled from the positioning plate 25. The positioning plate 25 can be disassembled and removed without obstruction for disassembly, maintenance or storage and transportation. When fixing, the positioning plate 25 on the hydraulic rod 2 is inserted into the base 1, and the bidirectional threaded rod 26 is rotated in the opposite direction. The two side movable frames 28 drive the pressing block 29 to move inward. The inclined surface of the pressing block 29 can press the positioning plate 25 to move downward, limiting the installation of the connected hydraulic rod 2.
[0060] like Figure 1 and Figures 13-15 As shown, the first damping block 35 increases the resistance to the vertical movement of the second connecting plate 32, ensuring that the second connecting plate 32 remains fixed after moving to the appropriate position. The moving groove 30, in conjunction with the first connecting plate 31, allows the second connecting plate 32 to move vertically up and down. The rotating wheel 3703 drives the connecting shaft 3702 to rotate, thereby adjusting the angle at which the camera sensor 3701 receives light. After the external light source illuminates the wafer, the light passes through the filter 33, and light of a specific wavelength is reflected onto the photosensitive surface of the camera sensor 3701. By switching filters 33 with different optical properties into the optical path, the wavelength of light reflected to the camera sensor 3701 can be changed, thereby achieving targeted high-contrast imaging of different types of defects.
[0061] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the invention. In particular, as long as there is no structural conflict, the features in the disclosed embodiments can be combined with each other in any manner. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.
Claims
1. A gallium nitride wafer surface quality inspection device, comprising a base (1), characterized in that: A hydraulic rod (2) is fixedly connected to the base (1), a detector (3) is mounted on the hydraulic rod (2), an optical detection lens (4) is mounted on the detector (3), a control panel (5) is mounted on the base (1), an adjustment box (6) is fixedly connected to the base (1), a ball bearing (7) is slidably connected to the adjustment box (6), a first servo motor (8) is fixedly connected to the adjustment box (6), a first bevel gear (9) is fixedly connected to the output shaft of the first servo motor (8), a second bevel gear (10) is meshed with the first bevel gear (9), and a connecting box (1) is fixedly connected to the second bevel gear (10). 1) A second servo motor (12) is fixedly connected inside the connecting box (11). The output shaft of the second servo motor (12) is fixedly connected to a transmission threaded rod (13). The transmission threaded rod (13) is rotatably connected inside the connecting box (11). A moving plate (14) is threadedly connected to the transmission threaded rod (13). A limit box (15) is fixedly connected to the moving plate (14). A third servo motor (16) is installed on the limit box (15). An internal gear ring (17) is connected to the bearing inside the limit box (15). The internal gear ring (17) is meshed with a transmission gear (18). A connecting rod (19) is fixedly connected to the transmission gear (18).
2. The gallium nitride wafer surface quality inspection device according to claim 1, characterized in that: The ball bearings (7) are distributed at equal angles inside the regulating box (6), and the top surface of the ball bearings (7) is in contact with the bottom surface of the connecting box (11).
3. The gallium nitride wafer surface quality inspection device according to claim 1, characterized in that: The output shaft of the second servo motor (12) is fixedly connected to the center of one end of the transmission threaded rod (13), and the bottom surface of the moving plate (14) is in contact with the bottom surface inside the connecting box (11).
4. The gallium nitride wafer surface quality inspection device according to claim 1, characterized in that: The output shaft of the third servo motor (16) is fixedly connected to the center of the end of the connecting rod (19) on one side. The internal gear ring (17) and the transmission gear (18) are on the same horizontal line. The transmission gear (18) is distributed at equal angles in the internal gear ring (17). The transmission gear (18) corresponds one-to-one with the clamping plate (20) through the connecting rod (19).
5. The gallium nitride wafer surface quality inspection device according to claim 1, characterized in that: The connecting rod (19) is fixedly connected to the center of the transmission gear (18), and the connecting rod (19) is rotatably connected to the limiting box (15). A clamping plate (20) is fixedly connected to the connecting rod (19), and the bottom end face of the clamping plate (20) is in contact with the inside of the limiting box (15).
6. The gallium nitride wafer surface quality inspection device according to claim 1, characterized in that: A push plate (21) is fixedly connected to the internal gear ring (17), and an air distribution box (22) is fixedly connected inside the limiting box (15). The push plate (21) has an isosceles triangle cross section. A nozzle (23) is fixedly connected to the air distribution box (22), and an airbag (24) is fixedly connected to the air distribution box (22). The airbags (24) are distributed at equal angles on the air distribution box (22).
7. The gallium nitride wafer surface quality inspection device according to claim 1, characterized in that: A positioning plate (25) is fixedly connected to the hydraulic rod (2), a bidirectional threaded rod (26) is rotatably connected to the base (1), a turntable (27) is fixedly connected to the bidirectional threaded rod (26), a movable frame (28) is threadedly connected to the bidirectional threaded rod (26), and an extrusion block (29) is fixedly connected to the movable frame (28).
8. The gallium nitride wafer surface quality inspection device according to claim 7, characterized in that: The detector (3) has a moving groove (30) on its side. A first connecting plate (31) is slidably installed in the moving groove (30). An adjustment component (37) is installed below the first connecting plate (31). A second connecting plate (32) is fixedly connected to the first connecting plate (31). A damping plate (34) is slidably installed in the second connecting plate (32). A filter (33) is fixedly connected to the bottom of the damping plate (34).
9. The gallium nitride wafer surface quality inspection device according to claim 8, characterized in that: A connecting ring (36) is fixedly connected to the top of the damping plate (34), and multiple filters (33) are arranged side by side below the damping plate (34). A first damping block (35) is fixedly arranged inside the second connecting plate (32), and the first damping block (35) protrudes from the surface of the second connecting plate (32).
10. The gallium nitride wafer surface quality inspection device according to claim 1, characterized in that: The adjustment assembly (37) includes a connecting shaft (3702) rotatably mounted in the first connecting plate (31), a camera sensor (3701) fixedly connected to the connecting shaft (3702), a second damping block (3704) abutting between the camera sensor (3701) and the first connecting plate (31), and a rotating wheel (3703) provided on the side of the connecting shaft (3702), the rotating wheel (3703) being rotatably connected to the first connecting plate (31).
Citation Information
Patent Citations
Wafer surface three-dimensional shape measuring device and measuring method thereof
CN115325963A