Wafer chip mounter and method

Abstract

The invention discloses a wafer chip mounter and method, and relates to the technical field of chip mounters, the wafer chip mounter comprises a base, one side of the top of the base is provided with a film built-in rack, the surface of the base is provided with a placing frame, the middle of the placing frame is provided with a vacuum chuck, and two sides of the placing frame are provided with control assemblies for discharging bubbles. According to the wafer chip mounter and method, the driving motor drives the half gear to rotate, then the moving frame reciprocates, in the rotating, ascending, descending and moving processes of the smoothing plate, proper pressure can be applied to the film, bubbles between the wafer and the film are thoroughly discharged, the bubbles can be prevented from being dispersed into smaller bubbles in the bubble discharging mode, and the wafer chip mounter and the wafer chip mounter have the advantages of being simple in structure and convenient to operate. The flattening plate is arranged on the surface of the wafer, bubble residues are effectively prevented, the laminating fitness is greatly improved, all areas on the surface of the wafer are treated by the flattening plate through multiple times of cyclic operation, the laminating quality is further improved, and the laminating degree of the film on the surface of the wafer reaches an extremely high level.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of die bonder, in particular to a wafer die bonder and method. BACKGROUND

[0002] In the field of semiconductor manufacturing, wafer die bonding is a crucial process, and its core goal is to precisely and tightly bond a thin film on the wafer surface, thereby ensuring the performance and quality of the wafer in subsequent processing and final product. The presence of air bubbles is one of the key factors affecting the quality of wafer die bonding. Air bubbles not only damage the bonding between the thin film and the wafer, but also may cause a series of problems in subsequent processes, such as causing the thin film to fall off, affecting the electrical properties of the wafer, and thus reducing the yield of the product. Therefore, how to efficiently and completely expel the air bubbles between the wafer and the thin film has become a key challenge in the development of wafer die bonder technology. Currently, there are various types of wafer die bonders on the market, one of the more common existing technologies is to use a roller-type pressing device to expel air bubbles. This device usually consists of one or more rollers, which roll along the wafer surface during the die bonding process, applying pressure to bond the thin film to the wafer while trying to expel the air bubbles. However, this existing technology has many obvious defects:

[0003] Firstly, when expelling air bubbles, the roller-type pressing device has a linear contact between the roller and the thin film, resulting in uneven pressure distribution. During the rolling process, some areas may be damaged due to excessive pressure, while other areas may not be able to effectively expel air bubbles due to insufficient pressure, making the problem of air bubble residue still more prominent.

[0004] Secondly, when encountering small or irregularly shaped air bubbles, the roller-type pressing device has difficulty in completely expelling them. During the rolling process, small air bubbles may be squeezed and dispersed into more small air bubbles, which are even more difficult to detect and expel, further reducing the bonding between the thin film and the wafer and posing a potential threat to the quality of the wafer.

[0005] In addition, the roller-type pressing device has difficulty in ensuring uniform and appropriate pressure on all areas of the wafer surface, especially for special areas such as the edges and corners of the wafer. The roller may not be able to completely cover or apply sufficient pressure, resulting in insufficient air bubble expulsion in these areas and affecting the overall die bonding quality. SUMMARY

[0006] In view of the deficiencies of the prior art, the present application provides a wafer die bonder and method, which solves the technical problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention is implemented through the following technical solution: a wafer placement machine, including a base, a thin film built-in frame is provided on one side of the top of the base, a placement frame is provided on the surface of the base, a vacuum suction cup is provided in the middle of the placement frame, and control components for removing air bubbles are provided on both sides of the placement frame.

[0008] The control assembly includes a support base fixedly mounted on the top of the base. Moving frames are slidably connected to both sides of the support base. Moving rods are fixedly connected to the inner ends of the moving frames. Push rods are fixedly connected to the other ends of the moving rods. Swing frames are rotatably connected to the upper and lower ends of the inner side of the support base. Slide grooves are opened on the inner ends of the swing frames, and the ends of the moving rods are slidably installed in the slide grooves. Rectangular blocks are fixedly connected to the other ends of the two swing frames. Connecting frames are slidably connected to the other side of the rectangular blocks in the vertical direction. A smoothing plate for smoothing the film is rotatably connected to the bottom end of the connecting frame.

[0009] As a further preferred embodiment of this technical solution, a movable frame is slidably connected to the surface of the machine base, and a pressure roller is provided at the bottom of the movable frame.

[0010] As a further preferred embodiment of this technical solution, a drive motor is fixedly installed on the side wall of the support base, a connecting rod is fixedly connected to the output end of the drive motor, half gears are fixedly connected to both sides of the connecting rod, and racks are fixedly connected to the upper and lower ends of the inner cavity of the moving frame, and the racks and half gears are meshed and matched.

[0011] As a further preferred embodiment of this technical solution, a vertical rod is rotatably connected to the upper end of the connecting frame, and the bottom end of the vertical rod is fixedly connected to the connecting frame. A sliding shaft is provided at the top of the vertical rod, and a limit block is fixedly connected to the outer wall of the vertical rod.

[0012] As a further preferred embodiment of this technical solution, an arc-shaped frame is fixedly connected to the inner end of the support base. The inner end of the arc-shaped frame is provided with an ascending groove, a descending groove, and a pressing groove. The ascending groove, descending groove, and pressing groove are connected and arranged in a manner that allows the sliding shaft to slide within the ascending groove, descending groove, and pressing groove.

[0013] As a further preferred embodiment of this technical solution, a slide block is slidably connected to the bottom of the arc frame, and a vertical rod is slidably installed on the slide block. A first damping spring sleeved on the vertical rod is provided between the slide block and the limiting block.

[0014] As a further preferred embodiment of this technical solution, a fixed plate is fixedly connected to the end of the connecting frame, a ratchet is fixedly connected to the center of the flat plate, a pawl is rotatably connected to the surface of the fixed plate, and the pawl and the ratchet are properly matched. A second damping spring is provided between the fixed plate and the pawl.

[0015] As a further preferred embodiment of this technical solution, a rotating frame is rotatably connected to the base, and a first crossbar and a second crossbar are rotatably connected to the inner end of the rotating frame. A control frame is rotatably connected to the first crossbar, and a circular blade is provided at the bottom of the control frame.

[0016] This invention also discloses a wafer placement method for a wafer mounter, specifically including the following steps:

[0017] Step 1: Place the workpiece holder in the placement frame and place the wafer on the workpiece holder. Fix it with a vacuum suction cup. Heat the vacuum suction cup to the preset temperature and transfer the film from the feeding system to the top of the wafer. Move the pressure roller on the surface of the placement frame by the moving frame to make the film adhere to the surface of the wafer. With the help of the heated suction cup, make the film adhere evenly and initially remove air bubbles.

[0018] Step 2: The drive motor drives the half gear to rotate, first cooperating with the rack to move the moving frame and other components inward, driving the flat plate to rotate to a horizontal position. During this process, the sliding shaft passes through the rising groove to the falling groove, and under the action of the first damping spring, the flat plate moves down to contact the film. Then the half gear continues to rotate, causing the moving frame and other components to move outward, and the flat plate rotates outward. The sliding shaft passes through the falling groove to the pressing groove, and the flat plate moves on the wafer surface to expel air bubbles, enhancing the film adhesion.

[0019] Step 3: By rotating the rotating frame to a position level with the wafer, control the transverse cutting blade to move laterally to cut the film laterally. Then, control the control frame to drive the circular blade to rotate synchronously, and the circular blade cuts off the excess part around the film.

[0020] Compared with existing technologies, it has the following advantages:

[0021] By driving the motor to rotate the half gear, the moving frame moves back and forth. During the rotation, rising, falling and moving process, the flat plate can apply appropriate pressure to the film, completely expelling the air bubbles between the wafer and the film. This method of expelling air bubbles can prevent the bubbles from dispersing into smaller bubbles, effectively preventing air bubble residue and greatly increasing the adhesion of the coating. After multiple cycles of operation, it is ensured that all areas of the wafer surface are processed by the flat plate, further improving the coating quality and achieving an extremely high level of film adhesion on the wafer surface.

[0022] The ratchet fixedly connected to the axis of the flat plate and the pawl rotatably connected to the surface of the fixed plate fixedly connected to the end of the connecting frame are properly engaged. Under the elastic force of the second damping spring, the pawl can be tightly engaged with the ratchet, thereby preventing the flat plate from rotating in the opposite direction. This design allows the flat plate to maintain a stable tilt angle during the subsequent bubble discharge process, ensuring the uniformity and consistency of the pressure applied to the film. No matter how the drive motor rotates, the flat plate can process the film according to the preset angle, avoiding the problem of incomplete bubble discharge or uneven pressure on the film caused by angle changes, and further improving the stability of operation. Attached Figure Description

[0023] Figure 1This is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0025] Figure 3 This is a schematic diagram of the control component in this invention;

[0026] Figure 4 This is a schematic diagram of the structure of the movable frame, movable rod, push rod, and swing frame in this invention;

[0027] Figure 5 This is a partial structural diagram of the rectangular block, connecting frame, flat plate, vertical rod, and sliding shaft in this invention;

[0028] Figure 6 This is a partial structural diagram of the connecting frame, flat plate, ratchet, and pawl in this invention;

[0029] Figure 7 This is a partial structural diagram of the rectangular block, vertical rod, arc frame, and slide block in this invention;

[0030] Figure 8 This is a schematic diagram of the arc-shaped frame and sliding shaft in this invention.

[0031] In the diagram: 1. Base; 2. Film internal frame; 3. Placement frame; 4. Vacuum suction cup; 5. Control components; 6. Rotating frame; 11. Moving frame; 12. Pressure roller; 51. Support base; 52. Moving frame; 53. Rack; 54. Moving rod; 55. Push rod; 56. Swing frame; 57. Slide groove; 58. Rectangular block; 59. Connecting frame; 510. Flat plate; 511. Drive motor; 512. Connecting rod; 513. Half tooth 514. Wheel; 515. Vertical rod; 516. Limiting block; 517. Slide seat; 518. First damping spring; 519. Sliding shaft; 520. Ratchet; 521. Fixing plate; 522. Pawl; 523. Second damping spring; 524. Arc frame; 525. Rising groove; 526. Lowering groove; 61. Pressing groove; 62. First crossbar; 63. Control frame; 64. Circular blade; 65. Second crossbar; 66. Cross-cutting blade. Detailed Implementation

[0032] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] Example 1: Combining Figures 1-8As shown, the present invention provides a technical solution: a wafer mounting machine, which mainly consists of a base 1. A thin film built-in frame 2 is carefully designed and installed on one side of the top of the base 1. The thin film roll is precisely mounted on this thin film built-in frame 2 to ensure that the roll can rotate smoothly during use. By carefully adjusting the tension of the roll, the film is effectively prevented from being too loose or too tight, thereby ensuring that the path of the film always remains flat and will not be twisted or deviated. All these measures are to prevent misalignment in the subsequent film mounting process. A placement frame 3 is also specially opened on the surface of the base 1 for placing the workpiece rack. The wafer to be processed is placed firmly on the workpiece rack and fixed by a vacuum suction cup 4. The vacuum suction cup 4 can be heated to a preset temperature. A vacuum suction cup 4 is set in the middle of the placement frame 3, and a heating element is embedded inside it. The adhesion between the film and the wafer surface is significantly enhanced by heat conduction, effectively reducing the generation of bubbles. In order to further optimize the process, control components 5 for venting bubbles are also equipped on both sides of the placement frame 3.

[0034] A movable frame 11 is mounted on the surface of the base 1 via a sliding connection. The bottom end of the movable frame 11 is equipped with a pressure roller 12. Driven by the movable frame 11, the pressure roller 12 can move on the surface of the placement frame 3, thereby making the film tightly adhere to the wafer surface.

[0035] The control component 5 includes a support base 51 fixedly installed on the top of the base 1. A movable frame 52 is slidably connected to both sides of the support base 51. A movable rod 54 is fixedly connected to the inner end of the movable frame 52. A push rod 55 is fixedly connected to the other end of the movable rod 54. A swing frame 56 is installed on the upper and lower inner sides of the support base 51 by a rotatable connection. A groove 57 is opened on the inner end of the swing frame 56. The end of the movable rod 54 can be slidably installed in this groove 57. A rectangular block 58 is fixedly connected to the other end of the two swing frames 56. A connecting frame 59 is slidably connected to the other side of the rectangular block 58 in the vertical direction. A smoothing plate 510 for smoothing the film is installed on the bottom end of the connecting frame 59 by a rotatable connection to ensure that the film is flat and without marks during the bonding process.

[0036] A drive motor 511 is firmly installed on the side wall of the support base 51. The output end of the drive motor 511 is connected to the connecting rod 512 by a fixed connection. Two half gears 513 are fixedly connected to both sides of the connecting rod 512. In the inner cavity of the moving frame 52, racks 53 are firmly connected to both the upper and lower ends. These racks 53 and the half gears 513 form a precise meshing relationship. When the drive motor 511 starts, it can drive the half gears 513 to rotate synchronously. Under the action of the racks 53 at the upper and lower ends, the half gears 513 can effectively drive the moving frame 52 to reciprocate.

[0037] A vertical rod 514 is mounted on the upper end of the connecting frame 59 by a rotatable connection. The bottom end of the vertical rod 514 is fixedly connected to the connecting frame 59 to ensure its stability. A sliding shaft 518 is provided at the top of the vertical rod 514, and a limiting block 515 is fixedly connected to the outer wall of the vertical rod 514 to limit the movement range of the sliding shaft 518.

[0038] An arc-shaped frame 523 is firmly connected to the inner end of the support base 51. The inner end of the arc-shaped frame 523 is provided with an ascending groove 524, a descending groove 525, and a pressing groove 526. These three grooves are interconnected to form a circulation path. The sliding shaft 518 slides in these grooves. By sliding in the ascending groove 524, descending groove 525, and pressing groove 526, it can effectively help the subsequent smoothing plate 510 to remove air bubbles between the wafer and the thin film, ensuring the smooth operation.

[0039] A slide block 516 is installed at the bottom of the arc frame 523 by a sliding connection, and the vertical rod 514 is slidably installed on the slide block 516 to ensure its flexible movement. Between the slide block 516 and the limiting block 515, a first damping spring 517 is provided and sleeved on the vertical rod 514 to provide appropriate damping force and ensure the stability of the system.

[0040] A fixed plate 520 is securely connected to the end of the connecting bracket 59, and a ratchet 519 is fixedly connected to the axis of the flat plate 510. A pawl 521 is mounted on the surface of the fixed plate 520 by means of rotational connection, and a precise engagement relationship is formed between the pawl 521 and the ratchet 519. A second damping spring 522 is provided between the fixed plate 520 and the pawl 521. When the flat plate 510 is rotated to a suitable tilt angle, the elastic force of the second damping spring 522 can push the pawl 521 and the ratchet 519 to engage tightly, thereby effectively preventing the flat plate 510 from rotating in the opposite direction and avoiding affecting the subsequent operation effect of the flat plate 510 in removing bubbles between the wafer and the thin film.

[0041] In an embodiment of the present invention, by activating the drive motor 511 fixedly installed on the side wall of the support base 51, the connecting rod 512 fixedly connected to the output end of the drive motor 511 begins to rotate synchronously. The half gears 513 fixedly connected on both sides of the connecting rod 512 also rotate accordingly. The half gears 513 cooperate with the racks 53 fixedly connected to the upper and lower ends of the inner cavity of the moving frame 52, driving the moving frame 52 to reciprocate. When the drive motor 511 drives the half gears 513 to rotate synchronously, the half gears 513 first mesh with the racks 53 on one side, driving the moving frame 52 to move inward. The moving rod 54 fixedly connected to the inner end of the moving frame 52 and the push rod 55 fixedly connected to the other end of the moving rod 54 also move inward synchronously. The push rod 55 cooperates with the rotation of the upper and lower ends of the inner side of the support base 51. The sliding groove 57 on the inner end of the swing frame 56 drives the swing frame 56 to rotate inward. The rectangular block 58 fixedly connected to the other end of the swing frame 56, the connecting frame 59 slidably connected to the other side of the rectangular block 58 in the vertical direction, and the smoothing plate 510 for smoothing the film rotatably connected to the bottom end of the connecting frame 59 also rotate inward to a horizontal position. During the rotation, the sliding shaft 518 set at the top of the vertical rod 514 rotatably connected to the upper end of the connecting frame 59 slides in the rising groove 524 on the inner end of the arc frame 523 fixedly connected to the inner end of the support base 51. When the sliding shaft 518 slides in the rising groove 524, it drives the vertical rod 514, the connecting frame 59 and the smoothing plate 510 to move upward and compress the sleeve on the vertical rod 514. The first damping spring 517, located between the slide block 516 and the limiting block 515, can rotate the flat plate 510 to a suitable tilt angle as needed while the flat plate 510 rises. The ratchet 519 fixedly connected to the axis of the flat plate 510 and the pawl 521 rotatably connected to the surface of the fixed plate 520 fixedly connected to the end of the connecting frame 59 are properly engaged. Under the elastic force of the second damping spring 522, the pawl 521 can tightly engage with the ratchet 519, thereby preventing the flat plate 510 from rotating in the opposite direction and ensuring that the flat plate 510 maintains a stable tilt angle during the subsequent air bubble discharge process. When the rectangular block 58, the connecting frame 59, and the flat plate 510 rotate to the horizontal position, the sliding shaft 518 moves from the rising groove 524 to the falling groove. Within 525, when the sliding shaft 518 moves into the descending groove 525, under the elastic force of the first damping spring 517, it pushes the limiting block 515, vertical rod 514, sliding shaft 518, connecting frame 59, and flat plate 510 downward, causing the bottom of the flat plate 510 to contact the thin film on the wafer surface. As the drive motor 511 drives the half gear 513 to continue rotating, the half gear 513 meshes with another rack 53, driving the moving frame 52 to move outward. The moving frame 52 drives the moving rod 54 and the pushing rod 55 to move outward synchronously. The pushing rod 55, in conjunction with the sliding groove 57, drives the swing frame 56, rectangular block 58, connecting frame 59, and flat plate 510 to rotate outward. During this process, the sliding shaft 518 moves from the descending groove 525 into the downward pressing groove 526.The smoothing plate 510 moves on the wafer surface. During its movement, the smoothing plate 510, through its specific shape and tilt angle, applies appropriate pressure to the thin film, expelling air bubbles between the wafer and the thin film. This method of expelling air bubbles prevents them from dispersing into smaller bubbles, effectively avoiding bubble residue and greatly increasing the adhesion of the coating.

[0042] The drive motor 511 rotates continuously, driving the half gear 513 to rotate continuously in a cycle, thereby causing the moving frame 52 to move back and forth continuously. The smoothing plate 510 also performs a reciprocating air bubble removal operation on the wafer surface. Through multiple cycles, it is ensured that all areas on the wafer surface are processed by the smoothing plate 510, and any possible air bubbles are completely removed. After the air bubble removal operation on the entire wafer surface is completed, the moving frame 11 drives the pressure roller 12 to leave the surface of the placement frame 3, and turns off the heating and vacuum adsorption functions of the vacuum suction cup 4. The wafer with the film applied is then removed from the workpiece holder. At this point, the entire wafer film application operation is completed.

[0043] Example 2: Combination Figure 8 As shown, based on Embodiment 1, a rotating frame 6 is rotatably connected to the base 1. A first crossbar 61 and a second crossbar 64 are rotatably connected to the inner end of the rotating frame 6. A control frame 62 is rotatably connected to the first crossbar 61. A circular blade 63 is provided at the bottom of the control frame 62. The circular blade 63 is used to cut the excess part around the film to ensure that the film edge is neat and reduce the trimming workload in subsequent processes. The blade is made of imported material, has a long life and high cutting accuracy, and supports quick replacement to adapt to different film types.

[0044] In an embodiment of the present invention, by rotating the rotating frame 6 to a position level with the wafer, the cross-cutting blade 65 is controlled to move laterally to cut the film laterally, and then the control frame 62 is controlled to drive the circular blade 63 to rotate synchronously, and the circular blade 63 cuts the excess part around the film.

[0045] This invention also discloses a wafer placement method for a wafer mounter, specifically including the following steps:

[0046] Step 1: Place the workpiece holder in the placement frame 3 and place the wafer in the workpiece holder. Fix it with the vacuum suction cup 4. Heat the vacuum suction cup 4 to the preset temperature and transfer the film from the feeding system to the top of the wafer. Move the pressure roller 12 on the surface of the placement frame 3 through the moving frame 11 so that the film adheres to the surface of the wafer. With the help of the heated suction cup, the film is evenly adhered and air bubbles are initially eliminated.

[0047] Step 2: The drive motor 511 drives the half gear 513 to rotate, first cooperating with the rack 53 to move the moving frame 52 and others inward, driving the flat plate 510 to rotate to a horizontal position. During this process, the sliding shaft 518 passes through the rising groove 524 to the falling groove 525. Under the action of the first damping spring 517, the flat plate 510 moves down and contacts the film. Then, the half gear 513 continues to rotate, causing the moving frame 52 and others to move outward. The flat plate 510 rotates outward, and the sliding shaft 518 passes through the falling groove 525 to the pressing groove 526. The flat plate 510 moves on the wafer surface to expel air bubbles and enhance the film adhesion.

[0048] Step 3: By rotating the rotating frame 6 to a position level with the wafer, control the transverse cutting blade 65 to move laterally to cut the film laterally. Then, control the control frame 62 to drive the circular blade 63 to rotate synchronously, and the circular blade 63 cuts the excess part around the film.

[0049] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer mounter, comprising a mounting base (1), characterized in that: A film built-in frame (2) is provided on one side of the top of the base (1), a placement frame (3) is provided on the surface of the base (1), a vacuum suction cup (4) is provided in the middle of the placement frame (3), and control components (5) for venting bubbles are provided on both sides of the placement frame (3). The control component (5) includes a support base (51) fixedly installed on the top of the base (1). A movable frame (52) is slidably connected to both sides of the support base (51). A movable rod (54) is fixedly connected to the inner end of the movable frame (52). A push rod (55) is fixedly connected to the other end of the movable rod (54). A swing frame (56) is rotatably connected to the upper and lower ends of the inner side of the support base (51). A groove (57) is opened on the inner end of the swing frame (56), and the end of the movable rod (54) is slidably installed in the groove (57). A rectangular block (58) is fixedly connected to the other end of the two swing frames (56). A connecting frame (59) is slidably connected to the other side of the rectangular block (58) in the vertical direction. A smoothing plate (510) for smoothing the film is rotatably connected to the bottom end of the connecting frame (59).

2. The wafer mounter according to claim 1, characterized in that: A movable frame (11) is slidably connected to the surface of the base (1), and a pressure roller (12) is provided at the bottom of the movable frame (11).

3. A wafer placement machine according to claim 1, characterized in that: A drive motor (511) is fixedly installed on the side wall of the support base (51). A connecting rod (512) is fixedly connected to the output end of the drive motor (511). Half gears (513) are fixedly connected to both sides of the connecting rod (512). A rack (53) is fixedly connected to both the upper and lower ends of the inner cavity of the moving frame (52), and the rack (53) and the half gear (513) mesh properly.

4. A wafer placement machine according to claim 3, characterized in that: A vertical rod (514) is rotatably connected to the upper end of the connecting frame (59), and the bottom end of the vertical rod (514) is fixedly connected to the connecting frame (59). A sliding shaft (518) is provided at the top of the vertical rod (514), and a limit block (515) is fixedly connected to the outer wall of the vertical rod (514).

5. A wafer placement machine according to claim 4, characterized in that: An arc-shaped frame (523) is fixedly connected to the inner end of the support base (51). The inner end of the arc-shaped frame (523) is provided with an ascending groove (524), a descending groove (525), and a pressing groove (526). The ascending groove (524), descending groove (525), and pressing groove (526) are connected and arranged in a manner that allows the sliding shaft (518) to slide within the ascending groove (524), descending groove (525), and pressing groove (526).

6. A wafer placement machine according to claim 5, characterized in that: The bottom of the arc frame (523) is slidably connected to a slide block (516), and the vertical rod (514) is slidably installed on the slide block (516). A first damping spring (517) is sleeved on the vertical rod (514) between the slide block (516) and the limiting block (515).

7. A wafer placement machine according to claim 6, characterized in that: A fixed plate (520) is fixedly connected to the end of the connecting frame (59), and a ratchet (519) is fixedly connected to the axis of the flat plate (510). A pawl (521) is rotatably connected to the surface of the fixed plate (520), and the pawl (521) and the ratchet (519) are properly engaged. A second damping spring (522) is provided between the fixed plate (520) and the pawl (521).

8. A wafer placement machine according to claim 7, characterized in that: A rotating frame (6) is rotatably connected to the base (1). A first crossbar (61) and a second crossbar (64) are rotatably connected to the inner end of the rotating frame (6). A control frame (62) is rotatably connected to the first crossbar (61). A circular blade (63) is provided at the bottom of the control frame (62).

9. A wafer placement method for a wafer mounter as described in any one of claims 1-8, characterized in that, Specifically, the following steps are included: Step 1: Place the workpiece holder in the placement frame (3) and place the wafer in the workpiece holder. Fix it with a vacuum chuck (4). Heat the vacuum chuck (4) to a preset temperature and transfer the film from the feeding system to the top of the wafer. Move the pressure roller (12) on the surface of the placement frame (3) through the moving frame (11) so that the film adheres to the surface of the wafer. Combined with the heating chuck, the film adheres evenly and the air bubbles are initially eliminated. Step 2: The drive motor (511) drives the half gear (513) to rotate. First, it works with the rack (53) to move the moving frame (52) and other parts inward, causing the flat plate (510) to rotate to a horizontal position. During this process, the sliding shaft (518) passes through the rising groove (524) to the falling groove (525). Under the action of the first damping spring (517), the flat plate (510) moves down and contacts the film. Then, the half gear (513) continues to rotate, causing the moving frame (52) and other parts to move outward. The flat plate (510) rotates outward, and the sliding shaft (518) passes through the falling groove (525) to the pressing groove (526). The flat plate (510) moves on the wafer surface to expel air bubbles and enhance the film adhesion. Step 3: By rotating the rotating frame (6) to a position level with the wafer, control the transverse cutting blade (65) to move laterally to cut the film laterally. Then, control the control frame (62) to drive the circular blade (63) to rotate synchronously, and the circular blade (63) cuts the excess part around the film.

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