Anti-interference semiconductor packaging device based on multi-layer electromagnetic shielding and preparation method thereof

Abstract

The application relates to the technical field of semiconductors, and particularly provides an anti-interference semiconductor packaging device based on a multilayer electromagnetic shield and a preparation method thereof. The device comprises a packaging shell and a pressure sensing assembly. The packaging shell comprises an insulating heat-resistant shell and a conductive metal plating layer arranged on the inner wall surface of the insulating heat-resistant shell. The pressure sensing assembly is arranged inside the conductive metal plating layer. The pressure sensing assembly comprises a composite substrate and a pressure sensing chip arranged on the composite substrate. The composite substrate is arranged in a grounded mode and electrically connected to the conductive metal plating layer. The grounded end of the pressure sensing chip is electrically connected to the composite substrate, so that electromagnetic closed-loop shielding and conductive discharge are realized. The application effectively realizes electromagnetic shielding and improves the detection precision, stability and reliability of the sensor.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to an anti-interference semiconductor packaging device based on multilayer electromagnetic shielding and its preparation method. Background Technology

[0002] With the increasing demands for intelligent and highly reliable operation in my country's power system, gas-insulated switchgear (GIS) equipment is widely used in medium- and high-voltage substations, transmission hubs, and urban power distribution systems due to its advantages such as compact structure, superior insulation performance, and low operation and maintenance costs. In GIS equipment, pressure parameters, as one of the key indicators of internal gas state and insulation reliability, have become an important object of online monitoring. Typically, pressure parameters are detected using micro-electro-mechanical system (MEMS) pressure sensors.

[0003] As a typical high-voltage, high-electric-field device, GIS has an extremely complex internal electromagnetic environment. During operation, phenomena such as opening and closing actions, arc discharge, and partial discharge generate a large number of transient high-frequency electromagnetic interference signals. These interferences can be coupled into the sensor system through various forms such as radiation, induction, and conduction, which can easily cause distortion, drift, or even failure of the output signal of MEMS pressure sensors. Summary of the Invention

[0004] The anti-interference semiconductor packaging device and its preparation method based on multi-layer electromagnetic shielding provided by the embodiments of the present invention at least solve the problem that pressure sensors in GIS are susceptible to interference and thus affect detection accuracy, effectively achieve electromagnetic shielding, and improve sensor detection accuracy, stability and reliability.

[0005] In a first aspect, the present invention provides an anti-interference semiconductor packaging device based on multi-layer electromagnetic shielding, comprising: a packaging shell including an insulating and heat-resistant outer shell and a conductive metal plating layer disposed on the inner wall surface of the insulating and heat-resistant outer shell; a pressure sensing component disposed inside the conductive metal plating layer; the pressure sensing component including a composite substrate and a pressure sensing chip disposed on the composite substrate; the composite substrate being grounded and electrically connected to the conductive metal plating layer; the ground terminal of the pressure sensing chip being electrically connected to the composite substrate to achieve electromagnetic closed-loop shielding and conductive discharge.

[0006] In one embodiment of the present invention, the composite substrate includes a pad layer, a mechanical bearing layer, a conductive layer, a first insulating layer, a metal ground layer, a second insulating layer, and a signal wiring layer stacked sequentially; the pad layer is grounded and electrically connected to the conductive metal plating layer; the conductive layer is electrically connected to the pad layer and the metal ground layer respectively, and the signal wiring layer is electrically connected to the ground terminal of the pressure sensing chip and the metal ground layer respectively.

[0007] In one embodiment of the present invention, a signal grounding hole communicating with the metal grounding layer is provided on the signal wiring layer and the second insulating layer; a grounding conductive hole communicating with the conductive metal plating layer is provided on the metal grounding layer, the first insulating layer, the conductive layer, the mechanical bearing layer, and the pad layer; the ground terminal of the pressure sensing chip is electrically connected to the conductive metal plating layer through the signal grounding hole and the grounding conductive hole; a grounding pin hole communicating with the outside is provided on the metal grounding layer, the first insulating layer, the conductive layer, the mechanical bearing layer, the pad layer, and the insulating heat-resistant shell; the ground terminal of the pressure sensing chip is grounded through the signal grounding hole and the grounding pin hole; a signal pin hole communicating with the outside is provided on the signal wiring layer, the second insulating layer, the metal grounding layer, the first insulating layer, the conductive layer, the mechanical bearing layer, the pad layer, and the insulating heat-resistant shell; the pressure sensing chip outputs a signal through the signal pin hole.

[0008] In one embodiment of the present invention, the insulating heat-resistant outer shell is provided with an vent hole; the encapsulation shell further includes a conductive connection group, the conductive connection group including two conductive metal strips in contact with the conductive metal plating surface, the conductive metal strips including a first end, a second end, and a main body portion disposed between the first end and the second end, the first end being disposed at the inner orifice of the vent hole, and the second end being electrically connected to the composite substrate; the two main body portions of the conductive connection group are disposed opposite to each other on both sides of the pressure sensing component.

[0009] In one embodiment of the present invention, a positioning groove is provided in the middle region of the insulating heat-resistant shell, and a positioning guide surface is provided at the opening of the positioning groove; the pressure sensing component is disposed in the positioning groove, and a conductive epoxy resin adhesive is disposed between the pressure sensing component and the positioning groove.

[0010] In one embodiment of the present invention, the second end portion includes: a first extension section disposed at the opening of the positioning groove and connected to the main body portion; a second extension section disposed on the groove wall of the positioning groove and connected to the first extension section; a third extension section disposed at the bottom of the positioning groove and connected to the second extension section; and a conductive metal portion disposed at the corner of the positioning groove and connected to the third extension section; wherein the pressure sensing component is disposed on the conductive metal portion and electrically connected to the conductive metal portion.

[0011] In one embodiment of the present invention, a flexible membrane is provided at the inner orifice of the air passage, and a nano-hydrophobic coating is provided on the inner surface of the flexible membrane.

[0012] In one embodiment of the present invention, the exposed welding area of ​​the pressure sensing chip and the composite substrate is provided with a thermosetting encapsulation material.

[0013] In one embodiment of the present invention, a polymer geomembrane is provided on the exposed surface of the pressure sensing chip.

[0014] In one embodiment of the present invention, the exposed surface of the composite substrate is provided with a moisture-proof and insulating protective coating.

[0015] In one embodiment of the present invention, a conductive moisture-proof film is provided on the surface of the conductive metal coating.

[0016] In one embodiment of the present invention, the insulating heat-resistant outer shell includes: a shell cover with a first conical guide slope on its edge; a shell body with a second conical guide slope on its edge, and a limiting shoulder disposed around the second conical guide slope; the second conical guide slope is sealed to the first conical guide slope.

[0017] Secondly, the present invention also provides a preparation method for preparing the anti-interference semiconductor packaging device based on multilayer electromagnetic shielding as described in any one of the above claims, comprising the steps of: covering the inner wall surface of an insulating and heat-resistant outer shell with a conductive metal plating layer to obtain a packaging shell; placing a pressure sensing chip on a composite substrate, and electrically connecting the ground terminal of the pressure sensing chip to the composite substrate to obtain a pressure sensing component; placing the pressure sensing component inside the conductive metal plating layer, and grounding the composite substrate of the pressure sensing component and electrically connecting it to the conductive metal plating layer to achieve electromagnetic closed-loop shielding and conductive discharge, thereby obtaining the anti-interference semiconductor packaging device based on multilayer electromagnetic shielding.

[0018] Compared with the prior art, the above-described technical solution of the present invention has the following advantages:

[0019] The anti-interference semiconductor packaging device based on multi-layer electromagnetic shielding described in this invention provides a packaging shell for the pressure sensing component. The shell's insulating and heat-resistant outer layer provides mechanical protection, while a conductive metal plating layer forms the outermost electromagnetic shield, preventing external electromagnetic radiation from entering the packaging shell. Simultaneously, by constructing a complete electromagnetic interference discharge path for the pressure sensing component, a multi-layered, closed-loop electromagnetic shielding structure is formed, effectively suppressing inductive coupling and common-mode interference of high-frequency electromagnetic waves and rapidly dissipating induced current. Based on this, it effectively solves the problems of poor stability, weak anti-interference capability, and insufficient reliability of MEMS pressure sensors under strong electromagnetic interference, improving the detection accuracy, adaptability, stability, and reliability of MEMS pressure sensors in complex scenarios such as GIS. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other embodiments can be obtained based on these drawings without creative effort. In the drawings:

[0021] Figure 1 This is a schematic diagram of the anti-interference semiconductor packaging device based on multi-layer electromagnetic shielding in a preferred embodiment of the present invention.

[0022] Figure 2 This is a cross-sectional view of an anti-interference semiconductor packaging device based on multi-layer electromagnetic shielding in a preferred embodiment of the present invention.

[0023] Figure 3 This is an exploded structural diagram of an anti-interference semiconductor packaging device based on multi-layer electromagnetic shielding in a preferred embodiment of the present invention.

[0024] Figure 4 This is a schematic diagram of the shell body in a preferred embodiment of the present invention.

[0025] Figure 5 This is a schematic diagram of the shell cover in a preferred embodiment of the present invention.

[0026] Figure 6 This is one of the structural schematic diagrams of the pressure sensing component in a preferred embodiment of the present invention.

[0027] Figure 7 This is a second schematic diagram of the pressure sensing component in a preferred embodiment of the present invention.

[0028] Figure 8 This is a cross-sectional view of the pressure sensing component in a preferred embodiment of the present invention.

[0029] Figure 9 This is a cross-sectional view of the signal grounding hole in a preferred embodiment of the present invention.

[0030] Figure 10 This is a cross-sectional view of the grounding conductive hole in a preferred embodiment of the present invention.

[0031] Figure 11 This is a cross-sectional view of the signal pin hole in a preferred embodiment of the present invention.

[0032] Figure 12 This is a cross-sectional view of the grounding pin hole in a preferred embodiment of the present invention.

[0033] Figure 13 yes Figure 2 A cross-sectional view of the inner orifice of the vent at point A in the middle.

[0034] Figure 14 yes Figure 3 A partial structural diagram of the shell body at point B.

[0035] Figure 15 yes Figure 11 A partial structural diagram of the pressure sensing chip at point C.

[0036] Figure 16 yes Figure 11 A partial cross-sectional view of the pressure sensing component at point D.

[0037] Figure 17 yes Figure 12 A schematic diagram of a partial cross-sectional view of the composite substrate at point E in the middle.

[0038] Figure 18 This is a schematic flowchart of the preparation method in a preferred embodiment of the present invention.

[0039] The above figures include the following reference numerals:

[0040] 10. Encapsulation shell; 11. Insulating and heat-resistant outer shell; 111. Shell cover; 1111. Vent hole; 1112. First cone-angle guide slope; 112. Shell body; 1121. Positioning groove; 1122. Positioning guide surface; 1123. Second cone-angle guide slope; 1124. Limiting shoulder; 12. Conductive metal plating; 121. Conductive moisture-proof film; 13. Conductive connection group; 130. Conductive metal strip; 131. First end; 132. Main body; 133. Second end; 1331. First extension section; 1332. Second extension section; 1333. Third extension section; 1334. Conductive... 14. Electrical metal part; 141. Flexible diaphragm; 20. Nano-hydrophobic coating; 21. Pressure sensing component; 21. Composite substrate; 2101. Pad layer; 2102. Mechanical bearing layer; 2103. Conductive layer; 2104. First insulating layer; 2105. Metal grounding layer; 2106. Second insulating layer; 2107. Signal wiring layer; 2108. Signal grounding hole; 2109. Grounding conductive hole; 2110. Grounding pin hole; 2111. Signal pin hole; 22. Pressure sensing chip; 23. Thermosetting structural encapsulant; 24. Polymer impermeable membrane; 25. Moisture-proof insulating protective coating. Detailed Implementation

[0041] Embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While some embodiments of the invention are shown in the drawings, it should be understood that the invention can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the invention. It should be understood that the accompanying drawings and embodiments are for illustrative purposes only and are not intended to limit the scope of protection of the invention.

[0042] It should be noted that GIS equipment typically uses sulfur hexafluoride (SF6) or other environmentally friendly alternative gases as insulation and arc-quenching media. This equipment operates at high voltage levels, has large breaking capacity, and undergoes frequent opening and closing operations. In this fully enclosed structure, pressure parameters, as one of the key indicators of the internal gas state and insulation reliability of the GIS equipment, become an important object of online monitoring. MEMS pressure sensors, with their high sensitivity, small size, and fast response, have become a key sensor type of focus in this scenario in recent years.

[0043] However, MEMS pressure sensors are susceptible to transient high-frequency electromagnetic interference signals within GIS equipment. Strong electric fields can induce common-mode interference and induced currents, interfering with the normal sampling signal of the pressure sensor chip. In existing technologies, the packaging structure of MEMS pressure sensors is mostly a simple covering of silicone, epoxy resin, or metal shells, providing only basic physical protection and mechanical fixation. This packaging structure has weak suppression capability against high-frequency interference, is prone to electric field induction coupling, affecting signal quality and leading to problems such as distortion, drift, or even failure of the MEMS pressure sensor.

[0044] To solve the above problems, refer to Figure 1 and Figure 2 As shown, this embodiment of the invention provides an anti-interference semiconductor packaging device based on multi-layer electromagnetic shielding. The anti-interference semiconductor packaging device based on multi-layer electromagnetic shielding includes a packaging shell 10 and a pressure sensing component 20.

[0045] The encapsulation shell 10 includes an insulating and heat-resistant outer shell 11 and a conductive metal plating layer 12, the conductive metal plating layer 12 covering the inner wall surface of the insulating and heat-resistant outer shell 11.

[0046] The insulating and heat-resistant housing 11 is a hollow and perforated structure, which provides mechanical protection for the internal structure while allowing the internal pressure sensing component 20 to detect pressure. For example, an air passage 1111 is prepared on the insulating and heat-resistant housing 11 by laser drilling, and a flexible diaphragm 14 is provided on the air passage 1111 to achieve the sealing of the air cavity inside the encapsulation shell 10.

[0047] Thus, under changing environmental pressure, external gas passes through the vent 1111, causing the flexible diaphragm 14 to be compressed and undergo slight deformation. At this time, the gas in the sealed air chamber inside the encapsulation shell 10 is compressed, and the pressure acts on the pressure sensing component 20, causing corresponding changes in electrical parameters, thereby causing the pressure sensing component 20 to output a corresponding pressure signal, realizing pressure detection.

[0048] The embodiments of the present invention do not limit the specific shape of the insulating heat-resistant shell 11, such as a hollow cuboid, a hollow cylinder, etc.

[0049] The insulating and heat-resistant outer shell 11 is preferably made of ceramic material. Ceramics offer the following advantages in high-voltage GIS applications: extremely high dielectric strength, extremely low water absorption and chemical stability, suitable for long-term encapsulation, low coefficient of thermal expansion to prevent thermal mismatch leading to encapsulation cracking, and high mechanical strength. In some other embodiments, polyimide-reinforced composite materials, high-strength plastics (such as PPS), and ceramic encapsulation materials can also be selected.

[0050] During operation, the conductive metal plating layer 12 forms the outermost electromagnetic shield, blocking external electromagnetic radiation from entering the encapsulation shell 10.

[0051] The conductive metal plating 12 can be made of common conductive metals such as copper, nickel, silver, and gold. Among them, copper is preferred for preparing the conductive metal plating 12. Copper has high electrical conductivity (second only to silver), low cost, easy processing, and good compatibility with ceramics. It can be efficiently deposited through methods such as chemical plating and laser sintering.

[0052] The pressure sensing component 20 is disposed inside the conductive metal plating layer 12 to realize pressure detection. Specifically, the pressure sensing component 20 includes a composite substrate 21 and a pressure sensing chip 22, with the pressure sensing chip 22 disposed on the composite substrate 21. Preferably, the pressure sensing chip 22 is configured as a MEMS pressure sensor, which is positioned directly opposite the flexible diaphragm 14.

[0053] The composite substrate 21 is grounded and electrically connected to the conductive metal plating layer 12. The ground terminal (GND) of the pressure sensing chip 22 is electrically connected to the composite substrate 21 to achieve electromagnetic closed-loop shielding and conductive discharge. This eliminates the adverse effects of common-mode and differential-mode interference signals on the pressure sensing chip 22. Those skilled in the art can configure the specific electrical connections of each component according to actual needs. During operation, the gas pressure in the sealed air chamber inside the package 10 acts on the sensing diaphragm area of ​​the pressure sensing chip 22, causing changes in electrical parameters such as capacitance and resistance. The internal detection circuit of the pressure sensing chip 22 collects these changes and outputs corresponding analog or digital pressure signals to achieve pressure detection.

[0054] On one hand, the ground terminal of the pressure sensing chip 22 is electrically connected to the composite substrate 21, and the composite substrate 21 is electrically connected to the conductive metal plating layer 12. In this way, a complete electromagnetic shielding closed loop is formed, and the conductive metal plating layer 12 is connected to the ground plane (GND plane) of the overall system, forming an electromagnetic closed-loop shielding cage, so that the interference electric field induced current is discharged through the conductive path, preventing interference from coupling to the signal line.

[0055] On the other hand, the ground terminal of the pressure sensing chip 22 is electrically connected to the composite substrate 21, which is grounded. In this way, the composite substrate 21 can be connected to the external system ground or external shielding shell to form a grounding loop for the main functional signal, providing a stable low-impedance signal reference ground for the pressure sensing chip 22, and ensuring the integrity of electrical functions, anti-interference capability, and common-mode rejection capability.

[0056] With the electromagnetic shielding closed loop combined with the grounding loop of the main function signal, the pressure sensing chip 22 has a stable ground wire, and the insulating and heat-resistant shell 11 forms a shielding cage, which can effectively prevent electromagnetic interference and common-mode interference.

[0057] The anti-interference semiconductor packaging device based on multi-layer electromagnetic shielding described in this invention provides a packaging shell 10 for the pressure sensing component 20. The insulating and heat-resistant outer shell 11 of the packaging shell 10 provides mechanical protection, while the conductive metal plating layer 12 forms the outermost electromagnetic shielding cover, preventing external electromagnetic radiation from entering the packaging shell 10. Simultaneously, by constructing a complete electromagnetic interference discharge path for the pressure sensing component 20, a multi-layered, closed-loop electromagnetic shielding structure is formed, effectively suppressing inductive coupling and common-mode interference of high-frequency electromagnetic waves and rapidly dissipating induced current. Based on this, it effectively solves the problems of poor stability, weak anti-interference capability, and insufficient reliability of MEMS pressure sensors under strong electromagnetic interference, improving the detection accuracy, adaptability, stability, and reliability of MEMS pressure sensors in complex scenarios such as GIS.

[0058] Reference Figure 2 and Figure 3 As shown, in some embodiments of the anti-interference semiconductor packaging device based on multi-layer electromagnetic shielding of the present invention, the insulating and heat-resistant outer shell 11 includes a shell cover 111 and a shell body 112, and the shell cover 111 and the shell body 112 are detachably connected.

[0059] Preferably, both the cover 111 and the main body 112 are rectangular parallelepipeds. (Refer to...) Figure 2 , Figure 3 and Figure 5 As shown, an air vent 1111 is provided on the cover 111. The axial direction of the air vent 1111 is parallel to the thickness direction of the cover 111, and the air vent 1111 is provided in the middle region of the cover 111 in a direction perpendicular to the thickness direction of the cover 111.

[0060] Preferably, when assembling the flexible diaphragm 14 and the shell cover 111, a layer of chromium is coated on the edge of the flexible diaphragm 14 and the edge of the inner orifice of the vent 1111, and the flexible diaphragm 14 is welded together by laser.

[0061] Reference Figure 2 , Figure 4 and Figure 5 As shown, in some embodiments of the anti-interference semiconductor packaging device based on multi-layer electromagnetic shielding of the present invention, the edge of the cover 111 is provided with a first conical angle guide slope 1112, and the edge of the main body 112 is provided with a second conical angle guide slope 1123 and a limiting shoulder 1124, with the limiting shoulder 1124 located around the second conical angle guide slope 1123. The first conical angle guide slope 1112 and the second conical angle guide slope 1123 cooperate to achieve a sealed connection.

[0062] Preferably, the first cone-angle guide slope 1112 is configured as an inner cone-angle guide slope, and the second cone-angle guide slope 1123 is configured as a matching outer cone-angle guide slope. When assembling the cover 111 and the body 112, conductive epoxy resin adhesive (not shown) is first spirally applied to the second cone-angle guide slope 1123 using a dispensing device. Then, the cover 111 is directly inserted into the body 112 along its thickness direction to complete the initial assembly. Afterward, a stepped temperature curing process (existing technology) is used to allow the conductive epoxy resin adhesive to fully flow and cure, achieving a sealed connection between the cover 111 and the body 112.

[0063] Reference Figure 2 , Figure 3 and Figure 4 As shown, in some embodiments of the anti-interference semiconductor packaging device based on multi-layer electromagnetic shielding of the present invention, a positioning groove 1121 is provided in the central region of the insulating and heat-resistant outer shell 11. It will be understood that each groove wall of the positioning groove 1121 on the shell body 112 is provided with a conductive metal plating layer 12.

[0064] Preferably, the positioning groove 1121 is disposed on the shell body 112, and the positioning groove 1121 is configured as a rectangular recessed structure. A positioning guide surface 1122 is provided at the opening of the positioning groove 1121. Preferably, an arc transition surface is provided between the positioning guide surfaces 1122. The pressure sensing component 20 is disposed within the positioning groove 1121, and a conductive epoxy resin adhesive (not shown) is provided between the pressure sensing component 20 and the positioning groove 1121.

[0065] Based on this, the pressure sensing component 20 can be quickly and precisely positioned and stably fixed through the positioning groove 1121, enabling the pressure sensing component 20 to have excellent vibration resistance, achieve long-term mechanical stability, and have resistance to thermal expansion and contraction, achieving thermal stress compensation. This allows the device to maintain the tight bonding of each layer of the composite substrate 21 after undergoing electrothermal cycles and external vibrations, avoiding performance degradation and improving the reliability of the device in complex industrial scenarios.

[0066] Reference Figure 6 , Figure 7 and Figure 8 As shown, in some embodiments of the anti-interference semiconductor packaging device based on multi-layer electromagnetic shielding of the present invention, the composite substrate 21 includes a pad layer 2101, a mechanical bearing layer 2102, a conductive layer 2103, a first insulating layer 2104, a metal ground layer 2105, a second insulating layer 2106, and a signal wiring layer 2107 stacked sequentially.

[0067] The pad layer 2101 is grounded and electrically connected to the conductive metal plating layer 12 to achieve external connection. Preferably, the pad layer 2101 is provided with a penetrating ground pad (not shown) for external connection. The pad layer 2101 is preferably made of copper and undergoes an electroless nickel immersion gold (ENIG) plating treatment on its surface. The copper pads ensure low-impedance connection, while the plating treatment significantly improves oxidation resistance and soldering repeatability.

[0068] A mechanical support layer 2102 is disposed between the conductive layer 2103 and the pad layer 2101. As the main structural support, the mechanical support layer 2102 provides strength, insulation, and stability, ensuring the stability of each component under thermal cycling and mechanical impact. Preferably, the mechanical support layer 2102 is made of alumina. Alumina is low in cost, has a mature manufacturing process, and offers good insulation and mechanical strength.

[0069] The conductive layer 2103 is electrically connected to the metal ground layer 2105 and the pad layer 2101. The function of the conductive layer 2103 is to carry signal wiring, grounding patterns, and mating pads, providing electrical connection to the upper structure and achieving signal and grounding continuity. It requires low resistance and high reliability. Electrolytic copper is preferably used for the conductive layer 2103. Copper has extremely low resistivity, ensuring signal transmission efficiency and low impedance in the grounding loop, and can withstand a certain current to prevent localized overheating during prolonged operation.

[0070] The first insulating layer 2104 is disposed between the metal ground layer 2105 and the conductive layer 2103. The first insulating layer 2104 provides structural support and electrical isolation interface for connection with the pad layer 2101, while resisting moisture, heat and ion migration. Preferably, the first insulating layer 2104 is made of polyimide (PI) film, which is moisture and heat resistant and has good dimensional stability.

[0071] The metallic grounding layer 2105 is electrically connected to the pad layer 2101 via the conductive layer 2103. The metallic grounding layer 2105 serves as the primary electromagnetic shielding layer and provides an electrical closed-loop path with the conductive metal plating layer 12. When connected to an external ground wire or shielding housing via the pad layer 2101, it forms a bidirectional shielding and conductive discharge path. Preferably, the metallic grounding layer 2105 is a large-area continuous copper layer; if necessary, the surface can be plated with nickel / gold to enhance oxidation resistance and conductivity reliability. The copper grounding layer forms a low-impedance shielding plane, effectively dissipating interference current and improving electromagnetic compatibility. It can also form a complete closed loop with the conductive metal plating layer 12 and the conductive metal strip 130 inside the housing, constructing an electromagnetic shielding cage and reducing the impact of external electromagnetic interference on the sensor signal.

[0072] A second insulating layer 2106 is disposed between the signal wiring layer 2107 and the metal ground layer 2105. The second insulating layer 2106 electrically isolates the signal conductors of the signal wiring layer 2107 from the metal ground layer 2105, providing an adhesion substrate for the metal ground layer 2105. Preferably, the second insulating layer 2106 is made of polyimide (PI) film. Polyimide has good flexibility, high temperature resistance, and a low dielectric constant, providing reliable electrical isolation between the signal wiring layer 2107 and the metal ground layer 2105, ensuring complete insulation between them, preventing short circuits and leakage, and maintaining low dielectric loss in high-frequency environments.

[0073] The signal wiring layer 2107 is electrically connected to the ground terminal of the pressure sensing chip 22 and the metal ground layer 2105, respectively. The signal wiring layer 2107 provides a stable mounting platform for the pressure sensing chip 22, and the signals from each channel led out from the pressure sensing chip 22 need to be transmitted through the signal wiring layer 2107. Copper is preferably used as the conductor material, and the surface is chemically plated with nickel immersion gold treatment. The low resistivity of copper conductors can reduce signal loss.

[0074] Those skilled in the art can configure the connection methods between the layers according to actual needs.

[0075] To ensure the reliable operation of the pressure sensing component 20 in a GIS system, in addition to setting up a complete electromagnetic discharge path, the signal transmission path also needs to be considered. In existing technologies, the wiring and packaging layers of conventional MEMS pressure sensor packaging structures are relatively simple. The signal path between the MEMS chip and the pins is often long and lacks an isolation layer, which easily leads to signal crosstalk and reflection. In severe cases, it can even cause problems such as error accumulation and data loss, making it difficult to guarantee the reliability of high-precision pressure measurement.

[0076] To solve the above problems, refer to Figure 9 , Figure 10 , Figure 11 and Figure 12 As shown, the anti-interference semiconductor packaging device based on multi-layer electromagnetic shielding of the present invention, in some embodiments:

[0077] In the first aspect, a signal grounding hole 2108 is provided on the signal wiring layer 2107 and the second insulating layer 2106, which is connected to the metal grounding layer 2105. The metal grounding layer 2105, the first insulating layer 2104, the conductive layer 2103, the mechanical bearing layer 2102 and the pad layer 2101 are provided with grounding conductive holes 2109 that are connected to the conductive metal plating layer 12. The grounding terminal of the pressure sensing chip 22 is electrically connected to the conductive metal plating layer 12 through the signal grounding hole 2108 and the grounding conductive hole 2109.

[0078] Secondly, the metal grounding layer 2105, the first insulating layer 2104, the conductive layer 2103, and the mechanical bearing layer 2102 are provided with grounding pin holes 2110 that connect to the pad layer 2101. The grounding terminal of the pressure sensing chip 22 is grounded through the signal grounding hole 2108 and the grounding pin hole 2110.

[0079] Thirdly, the signal wiring layer 2107, the second insulating layer 2106, the metal ground layer 2105, the first insulating layer 2104, the conductive layer 2103, and the mechanical bearing layer 2102 are provided with signal pin holes 2111 that connect to the pad layer 2101, and the pressure sensing chip 22 outputs signals through the signal pin holes 2111.

[0080] Those skilled in the art can set the position and number of each hole according to actual needs.

[0081] Preferably, the pressure sensing chip 22 is mounted on the signal wiring layer 2107 by flip-chip bonding. Specifically, the pressure sensing chip 22 has solder balls (not shown) on its bottom, and the signal wiring layer 2107 has pads (not shown) that correspond one-to-one with the solder balls.

[0082] When assembling the pressure sensor chip 22 and the composite substrate 21, dot-shaped adhesive pillars are first pre-set at positions corresponding to the four corners of the signal wiring layer 2107 and the pressure sensor chip 22. Then, the solder balls of the pressure sensor chip 22 and the pads of the signal wiring layer 2107 are aligned and thermo-pressed together. Subsequently, encapsulating adhesive is applied to the gaps between the pressure sensor chip 22 and the signal wiring layer 2107 to achieve connection.

[0083] This structure can significantly shorten the signal transmission path, reduce signal reflection and crosstalk, improve signal integrity and sampling accuracy, effectively ensure the high real-time performance and high fidelity of pressure signals, and meet the requirements of high-precision measurement.

[0084] During operation, on the one hand, the ground terminal of the pressure sensing chip 22 is routed along the ground trace of the signal wiring layer 2107, through the signal ground hole 2108 to the metal ground layer 2105, and then through the ground conductive hole 2109 to the conductive metal plating layer 12, forming a complete electromagnetic shielding closed loop. The conductive metal plating layer 12 is connected to the GND plane to form an electromagnetic closed-loop shielding cage, so that the interference electric field induced current is discharged through the conductive path, preventing interference from coupling to the signal line.

[0085] On the other hand, the ground terminal of the pressure sensing chip 22 is routed along the ground trace of the signal wiring layer 2107, through the signal ground hole 2108 to the metal ground layer 2105, and then through the ground pin hole 2110 to the ground pad of the bottom pad layer 2101. The ground pad is then soldered to the external ground pin, thereby connecting to the external system ground wire or the external shielding shell, forming a grounding loop for the main functional signal. This provides a stable low-impedance signal reference ground for the pressure sensing chip 22, ensuring the integrity of the electrical function, anti-interference capability, and common-mode rejection capability.

[0086] With the electromagnetic shielding closed loop combined with the grounding loop of the main function signal, the pressure sensing chip 22 has a stable ground wire, and the insulating and heat-resistant shell 11 forms a shielding cage, which can effectively prevent electromagnetic interference and common-mode interference.

[0087] This electromagnetic shielding structure not only forms a multi-level grounding closed loop from the inside of the chip to the periphery of the package, but also has a low-impedance, high-integrity conductive path, which can quickly discharge interference induced current, significantly improve the common-mode rejection capability and anti-interference performance of the MEMS pressure sensor chip, and ensure stable and reliable output of pressure signal.

[0088] Reference Figure 3 , Figure 4 and Figure 5 As shown, in some embodiments of the anti-interference semiconductor packaging device based on multi-layer electromagnetic shielding of the present invention, the packaging shell 10 further includes a conductive connection group 13.

[0089] The conductive connection assembly 13 includes two conductive metal strips 130 in contact with the conductive metal plating layer 12. Each conductive metal strip 130 includes a first end 131, a second end 133, and a main body portion 132 disposed between the first end 131 and the second end 133. The first end 131 is disposed at the inner opening of the vent hole 1111, and the second end 133 is electrically connected to the composite substrate 21. The two main body portions 132 of the conductive connection assembly 13 are disposed opposite each other on both sides of the pressure sensing component 20. Preferably, the two main body portions 132 are respectively disposed on two opposite inner wall surfaces of the housing body 112.

[0090] Those skilled in the art can determine the specific number of conductive connection groups 13 according to actual needs, such as one or more groups. Preferably, two groups of conductive connection groups 13 are provided, with a total of four conductive metal strips 130 forming a cross-shaped path structure. This surface-contact electrical connection method can further improve the electromagnetic shielding effect. In this way, by forming a spatially continuous cross-shielding loop, the electric field leakage path and magnetic field coupling area can be effectively reduced, thereby enhancing the ability to suppress strong external electromagnetic interference. At the same time, the cross-shaped structure can also disperse stress and current paths in multiple directions, ensuring the electrical stability and mechanical reliability of the package during long-term operation.

[0091] In this embodiment of the invention, the first end 131 of the conductive metal strip 130 is disposed on the cover 111, and the main body 132 and the second end 133 are both disposed on the inner wall surface of the main body 112.

[0092] Reference Figure 4 As shown, in some embodiments of the anti-interference semiconductor packaging device based on multilayer electromagnetic shielding of the present invention, the second end 133 includes a first extension 1331, a second extension 1332, a third extension 1333 and a conductive metal portion 1334.

[0093] The first extension section 1331 is disposed at the opening of the positioning groove 1121 and connected to the main body 132. The second extension section 1332 is disposed on the groove wall of the positioning groove 1121 and connected to the first extension section 1331. The third extension section 1333 is disposed at the bottom of the positioning groove 1121 and connected to the second extension section 1332. The conductive metal part 1334 is disposed at the corner of the positioning groove 1121 and connected to the third extension section 1333. The pressure sensing component 20 is disposed on the conductive metal part 1334 and electrically connected to the conductive metal part 1334. This structure can effectively improve the stability and reliability of the pressure sensing component 20.

[0094] The conductive metal strip 130 can be made of common conductive metals such as copper, nickel, silver, and gold. Copper is preferred for preparing the conductive metal strip 130. Specifically, copper has high electrical conductivity (second only to silver) and excellent conductivity; copper is easy to chemically plate or electroplated, allowing for control of thickness and good adhesion; copper has good surface weldability; copper is low in cost and has high maturity; copper can be efficiently deposited through chemical plating, laser sintering, and other methods.

[0095] In other embodiments, other electrical connection methods can also be employed. For example, a continuous peripheral ground ring can be formed on the top layer of the composite substrate 21, with multiple surrounding vias between the ground ring and the inner metal ground layer 2105, so that the ground ring and the metal ground layer 2105 are tightly coupled, forming an integrated low-impedance grounding network. The grounding network is extended to the bottom layer through longitudinal vias, forming a complete annular metal contact strip on the pad layer.

[0096] During assembly, a 360° conductive spring ring is embedded between the contact strip and the conductive metal plating layer 12. The conductive spring ring achieves multi-point parallel connection with the conductive metal plating layer 12 through multiple evenly distributed elastic contact points.

[0097] In this way, an equipotential network with low inductance and low contact resistance is constructed between the chip's ground terminal, the ground ring, the metal ground layer 2105, and the conductive metal plating layer 12. This can effectively reduce the potential difference between common-mode and differential-mode interference in different conductors and improve the electromagnetic shielding capability and environmental adaptability of the entire package over a wide frequency range.

[0098] Given that the GIS structure is a completely sealed shell, its internal gas cannot circulate with the outside. During long-term operation, moisture accumulates, resulting in a high relative humidity inside, which may even lead to condensation. Furthermore, the coexistence of high humidity and high electromagnetic interference poses a significant threat to the normal operation of MEMS chips. Besides the strong electric field inducing common-mode interference and induced current, interfering with the chip's normal sampling signal, long-term humidity can lead to decreased insulation performance, metal corrosion, solder joint failure, leakage, and even short circuits within the sensor.

[0099] In existing technologies, traditional encapsulation methods typically employ conformal coating and sealing ring pressing for protection. However, given the long-term high humidity conditions inside GIS systems, these methods are insufficient to effectively prevent the penetration of trace amounts of moisture in the gas, resulting in rapid degradation of moisture resistance and potential device failure in the later stages of use.

[0100] In addition, the applicant has also attempted to enhance electromagnetic shielding by using multi-layer metal casings or metallized ceramic packaging technology, or to improve signal paths and packaging hermeticity by introducing silicon nitride protective layers and through-silicon via (TSV) technology, achieving some progress. However, most of these methods are local optimizations and fail to build an integrated packaging system encompassing electromagnetic shielding, conductive discharge, signal transmission, and humidity isolation at the overall structural level. In practical engineering applications, especially in environments like GIS where there are dual challenges of strong electromagnetic interference and humidity stress, these sensors still generally suffer from poor stability, weak anti-interference capabilities, and unstable lifespan, severely restricting their long-term online deployment and the implementation of intelligent status monitoring functions.

[0101] To solve the above problems, refer to Figure 13 , Figure 14 , Figure 15 , Figure 16 and Figure 17 As shown, the anti-interference semiconductor packaging device based on multi-layer electromagnetic shielding of the present invention, in some embodiments, includes five moisture-proof structures, achieving progressive moisture protection from the inside out, from the pressure sensing chip 22 to the entire packaging structure. Specifically, these include a nano-hydrophobic coating 141, a thermosetting structural encapsulant 23, a polymer impermeable membrane 24, a moisture-proof insulating protective coating 25, and a conductive moisture-proof membrane 121.

[0102] The inner surface of the flexible diaphragm 14 is provided with a nano-hydrophobic coating 141, which can effectively inhibit the adhesion of condensate and improve the dynamic pressure measurement sensitivity and stability.

[0103] The exposed welding area between the pressure sensing chip 22 and the composite substrate 21 is provided with a thermosetting structural encapsulant 23. By providing the thermosetting structural encapsulant 23, localized gas sealing can be achieved, enhancing mechanical bonding strength and improving vibration and thermal shock resistance. Preferably, the thermosetting structural encapsulant 23 is epoxy resin, which has advantages such as strong adhesion, high mechanical strength after curing, and low cost. In some other embodiments, silicone gel, polyurethane adhesive, modified acrylic adhesive, low-temperature co-fired ceramic filler, etc., can also be selected.

[0104] The exposed surface of the pressure sensing chip 22 is provided with a polymer geomembrane 24. Preferably, the polymer geomembrane is a parylene film, which is a highly dense, pinhole-free, controllable-thickness uniform insulating film with atomic-level encapsulation capability and extremely low water vapor permeability, ensuring moisture isolation of the sensitive areas of the chip. Preferably, the parylene film is deposited by chemical vapor deposition. In some other embodiments, polyimide coatings, siloxane films, epoxy organic coatings, fluoropolymer coatings, etc., can also be selected.

[0105] A moisture-proof and insulating protective coating 25 is provided on the exposed surface of the composite substrate 21. By providing the moisture-proof and insulating protective coating 25, a middle barrier that provides both electrical insulation and moisture barrier properties can be formed. Preferably, the moisture-proof and insulating protective coating 25 is a conformal coating, which has good moisture resistance and environmental adaptability, simple processing, balances flexibility and mechanical adhesion, high transparency, high maintainability, and low maintenance costs. In some other embodiments, fluorocarbon coatings, silicone resin-based conformal coatings, full-plate parylene coatings, polyester coatings, etc., can also be selected.

[0106] A conductive moisture-proof film 121 is provided on the surface of the conductive metal plating layer 12. The conductive moisture-proof film 121 has both electrical conductivity and anti-oxidation properties, which can delay the aging of the conductive metal plating layer 12. When a conductive metal strip 130 is provided, a conductive moisture-proof film 121 is also provided on the surface of the conductive metal strip 130.

[0107] The above-mentioned multiple moisture-proof structures can effectively isolate the erosion of moisture and condensation in the sealed cavity of the GIS, extend the life of the sensor and ensure long-term stable operation.

[0108] On the other hand, embodiments of the present invention also provide a preparation method for preparing an anti-interference semiconductor packaging device based on multilayer electromagnetic shielding as described in any of the above embodiments. The preparation method includes the following steps:

[0109] A conductive metal plating layer 12 is applied to cover the inner wall of the insulating and heat-resistant outer shell 11 to obtain the encapsulation shell 10.

[0110] The pressure sensing chip 22 is placed on the composite substrate 21, and the ground terminal of the pressure sensing chip 22 is electrically connected to the composite substrate 21 to obtain the pressure sensing component 20.

[0111] The pressure sensing component 20 is disposed inside the conductive metal plating layer 12, and the composite substrate 21 of the pressure sensing component 20 is grounded and electrically connected to the conductive metal plating layer 12 to achieve electromagnetic closed-loop shielding and conductive discharge, thereby obtaining an anti-interference semiconductor packaging device based on multi-layer electromagnetic shielding.

[0112] Specifically, before setting the conductive metal plating layer 12, the shell cover 111 and the shell body 112 are first obtained. Vent holes 1111 are prepared on the shell cover 111, and the flexible diaphragm 14 is welded to the shell cover 111 using chromium. Subsequently, copper is deposited on the inner wall surface of the insulating and heat-resistant shell 11 through methods such as chemical plating and laser sintering to prepare the conductive metal plating layer 12 and the conductive metal strip 130.

[0113] When setting up the pressure sensing chip 22 and the composite substrate 21, on the one hand, the ground terminal of the pressure sensing chip 22 is routed along the ground trace of the signal wiring layer 2107, through the signal grounding hole 2108 to the metal grounding layer 2105, so that it can subsequently reach the conductive metal plating layer 12 through the grounding conductive hole 2109, forming a complete electromagnetic shielding closed loop. On the other hand, the ground terminal of the pressure sensing chip 22 is routed along the ground trace of the signal wiring layer 2107, through the signal grounding hole 2108 to the metal grounding layer 2105, and then through the grounding pin hole 2110 to the grounding pad of the bottom pad layer 2101, so that it can be soldered to the external grounding pin through the grounding pad, thereby connecting to the external system ground wire or the external shielding shell, forming a grounding loop for the main functional signal.

[0114] Subsequently, the pressure sensing component 20 is accurately positioned and fixed within the positioning groove 1121 of the housing body 112. During installation, alignment is achieved based on the positioning guide surface 1122 of the positioning groove 1121, so that the solder pad layer 2101 is correspondingly soldered to the conductive metal part 1334 at the bottom of the positioning groove 1121. After installation, an appropriate amount of conductive epoxy resin adhesive is applied between the positioning groove 1121 and the pressure sensing component 20.

[0115] After the internal components are installed, conductive epoxy resin is spirally applied to the second cone-shaped guide slope 1123 using a dispensing device. Then, the cover 111 is directly inserted into the body 112 along its own thickness direction, completing the initial assembly. Subsequently, a stepped temperature curing process is used to allow the conductive epoxy resin to fully flow and cure, achieving highly reliable mechanical fastening, electrical conductivity, and hermetic sealing between the cover 111 and the body 112. This ensures the integrity of the encapsulated shell 10 and the long-term stability of the device, thus completing the final encapsulation.

[0116] It should be noted that the term "comprising" and its variations used in the embodiments of the present invention are open-ended, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". The modifications of "one" and "a plurality" mentioned in the embodiments of the present invention are illustrative and not restrictive, and those skilled in the art should understand that unless explicitly indicated otherwise in the context, they should be understood as "one or more".

[0117] The steps described in the method embodiments provided by the present invention can be performed in different orders and / or in parallel. Furthermore, the method embodiments may include additional steps and / or omit the steps shown. The scope of protection of the present invention is not limited in this respect.

[0118] The term "embodiment" in this specification refers to a specific feature, structure, or characteristic described in connection with an embodiment that may be included in at least one embodiment of the invention. The appearance of this phrase in various places in the specification does not necessarily imply the same embodiment, nor does it imply independence or alternativeity from other embodiments. The various embodiments in this specification are described in a related manner, with reference to each other for similar or identical parts. In particular, for apparatus, device, and system embodiments, since they are substantially similar to method embodiments, the description is relatively simple, and relevant details are referred to in the description of the method embodiments.

[0119] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of protection. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the appended claims.

Claims

1. An anti-interference semiconductor packaging device based on multi-layer electromagnetic shielding, characterized in that, The application relates to an anti-interference semiconductor packaging device based on a multilayer electromagnetic shield. The application relates to an anti-interference semiconductor packaging device based on a multilayer electromagnetic shield. The application relates to an anti-interference semiconductor packaging device based on a multilayer electromagnetic shield. The application relates to an anti-interference semiconductor packaging device based on a multilayer electromagnetic shield. The application relates to an anti-interference semiconductor packaging device based on a multilayer electromagnetic shield. The application relates to an anti-interference semiconductor packaging device based on a multilayer electromagnetic shield. The application relates to an anti-interference semiconductor packaging device based on a multilayer electromagnetic shield. The application relates to an anti-interference semiconductor packaging device based on a multilayer electromagnetic shield. The application relates to an anti-interference semiconductor packaging device based on a multilayer electromagnetic shield. The application relates to an anti-interference semiconductor packaging device based on a multilayer electromagnetic shield. The application relates to an anti-interference semiconductor packaging device based on a multilayer electromagnetic shield. The application relates to an anti-interference semiconductor packaging device based on a multilayer electromagnetic shield. The application relates to an anti-interference semiconductor packaging device based on a multilayer electromagnetic shield.

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The application relates to an anti-interference semiconductor packaging device based on a multilayer electromagnetic shield. The application relates to an anti-interference semiconductor packaging device based on a multilayer electromagnetic shield. The application relates to an anti-interference A first extension section is arranged at a slot opening of the positioning slot and connected to the main body section; A second extension section is arranged at a slot wall of the positioning slot and connected to the first extension section; A third extension section is arranged at a slot bottom of the positioning slot and connected to the second extension section; A conductive metal section is arranged at a slot corner of the positioning slot and connected to the third extension section; The pressure sensing assembly is arranged on the conductive metal section and electrically connected to the conductive metal section.

6. The multi-layer electromagnetic shielding based anti-interference semiconductor packaging device according to claim 1, characterized in that: The inner hole of the gas passage is provided with a flexible diaphragm, and the inner surface of the flexible diaphragm is provided with a nano-hydrophobic coating.

7. The multi-layer electromagnetic shielding based anti-tamper semiconductor package device of any one of claims 1 to 3, wherein, At least one of the following features is included: The exposed area of the pressure sensing chip and the composite substrate is provided with a thermosetting structural packaging material; The exposed surface of the pressure sensing chip is provided with a high-molecular anti-seepage film; The exposed surface of the composite substrate is provided with a moisture-proof insulation protective coating; The surface of the conductive metal plating layer is provided with a conductive moisture-proof film.

8. The multi-layer electromagnetic shielding based anti-tamper semiconductor package device of claim 1, wherein, The insulating heat-resistant shell comprises: A shell cover with a first taper angle guide slope at the edge; A shell main body with a second taper angle guide slope at the edge and a limiting shoulder at the periphery of the second taper angle guide slope; the second taper angle guide slope is in sealing connection with the first taper angle guide slope.

9. A method of manufacturing an interference resistant semiconductor package based on multi-layer electromagnetic shielding according to any one of claims 1 to 8, characterized in that, The steps include: Covering the inner wall surface of the insulating heat-resistant shell with a conductive metal plating layer to obtain a packaging shell; Arranging a pressure sensing chip on a composite substrate so that the ground end of the pressure sensing chip is electrically connected to the composite substrate to obtain a pressure sensing assembly; Arranging the pressure sensing assembly inside the conductive metal plating layer so that the composite substrate of the pressure sensing assembly is grounded and electrically connected to the conductive metal plating layer to realize electromagnetic closed-loop shielding and conductive discharge, thereby obtaining a multi-layer electromagnetic shielding based anti-interference semiconductor packaging device.

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