Insulating heat-insulating plate for sensitive equipment and preparation method of insulating heat-insulating plate

Abstract

The invention relates to the technical field of insulating and heat-insulating materials, in particular to an insulating and heat-insulating plate for sensitive equipment and a preparation method of the insulating and heat-insulating plate. The insulating heat-insulating plate comprises a plurality of spacing layers and a plurality of reflecting layer plates; wherein the multiple reflecting layer plates and the multiple spacing layers are stacked in a staggered mode, each reflecting layer plate comprises a non-metal base layer and two metal layers, the two metal layers are attached to the two symmetrical faces of the non-metal base layer respectively, and each metal layer comprises multiple metal layer blocks arranged at intervals. The metal film on the surface of the material reflecting layer is divided into the metal layer blocks arranged at intervals, so that the heat transfer performance of the reflecting layer is improved, heat dissipation in the super-insulating coating is reduced, and the strict operation requirements of high-end sensors and superconducting equipment are met.

Description

Technical Field

[0001] This invention relates to the field of insulating and heat-insulating materials, specifically to an insulating and heat-insulating board for sensitive equipment and its preparation method. Background Technology

[0002] In modern high-tech fields, precision equipment such as sensors and superconducting machines place extremely stringent demands on their operating environments. These devices typically operate under extreme conditions, including ultra-low temperatures, high magnetic fields, or high-precision measurements, and their performance directly depends on the stability and purity of the operating environment. As a key supporting material, insulating and thermal insulation materials play a crucial role in these systems, requiring not only basic thermal insulation but also meeting multiple technical specifications such as low magnetic noise suppression, high insulation performance maintenance, and excellent thermal management capabilities.

[0003] However, current mainstream insulation materials have significant shortcomings in overall performance. Regarding maintaining high insulation performance, their insulation properties easily degrade under long-term high voltage or extreme temperature variations, affecting the long-term stable operation of equipment. Simultaneously, in terms of thermal performance, traditional materials often struggle to balance high thermal resistance with good thermal conductivity, leading to heat accumulation or uneven heat dissipation within the equipment, thus impacting overall performance. These performance deficiencies prevent existing insulation materials from fully meeting the stringent operational requirements of high-end sensors and superconducting equipment, becoming a key bottleneck restricting the development of related technologies. Summary of the Invention

[0004] In terms of related technologies, traditional insulation and heat insulation materials are difficult to achieve comprehensive and outstanding performance in terms of low magnetic noise control, high insulation performance maintenance and good thermal performance guarantee, and cannot fully meet the stringent requirements of equipment.

[0005] In a first aspect, embodiments of this application provide an insulating heat insulation board for sensitive equipment, comprising: multiple spacer layers and multiple reflective layers; wherein the multiple reflective layers and the multiple spacer layers are staggered and stacked, each reflective layer comprising: a non-metallic base layer and two metal layers, the two metal layers being respectively attached to two symmetrical surfaces of the non-metallic base layer, and the metal layers comprising multiple metal blocks spaced apart.

[0006] In conjunction with the first aspect, in one embodiment, the metal layer comprises: an aluminum-plated thin film.

[0007] In conjunction with the first aspect, in one embodiment, the spacer layer comprises: a nonwoven polyester fiber gasket.

[0008] In conjunction with the first aspect, in one embodiment, the spacer layer does not contain an adhesive.

[0009] With reference to the first aspect, in an embodiment, the insulating and heat-insulating plate comprises ten layers of the spacing layer and ten layers of the reflective layer plate, and each of the reflective layer plates is attached to the spacing layer on at least one side.

[0010] With reference to the first aspect, in an embodiment, the spacing layer and the reflective layer plate are both square-shaped.

[0011] In a second aspect, the embodiments of the present application provide a preparation method of the insulating and heat-insulating plate as described in any one of the above aspects, which comprises: combining the non-metallic base layer and the two metal layers to form a reflective layer plate; performing scribe processing on the reflective layer plate to divide the metal layer into a plurality of gap-provided metal layer blocks; combining a plurality of the reflective layer plates and a plurality of spacing layers to form an insulating and heat-insulating plate.

[0012] With reference to the second aspect, in an embodiment, the scribe processing on the reflective layer plate to divide the metal layer into a plurality of gap-provided metal layer blocks comprises: adopting a photoetching technology to cut off part of the metal layer at a preset position to divide the metal layer into a plurality of gap-provided metal layer blocks.

[0013] With reference to the second aspect, in an embodiment, the combining a plurality of the reflective layer plates and a plurality of spacing layers to form an insulating and heat-insulating plate comprises: interleaving and stacking a plurality of the reflective layer plates and a plurality of spacing layers; performing laser cutting on edges of the reflective layer plates and the plurality of spacing layers to align the reflective layer plates and the plurality of spacing layers in the thickness direction thereof to form an insulating and heat-insulating plate.

[0014] With reference to the second aspect, in an embodiment, the interleaving and stacking a plurality of the reflective layer plates and a plurality of spacing layers comprises: interleaving and stacking a plurality of non-woven polyester fiber gaskets without holes and without adhesive and a plurality of the reflective layer plates.

[0015] The technical scheme provided by the embodiments of the present application has the following beneficial effects: The present application improves the heat transfer performance of the reflective layer by dividing the metal film on the surface of the material reflective layer into gap-provided metal layer blocks, reduces the heat dissipation in the super-insulating coating, and meets the stringent operation requirements of high-end sensors and superconducting devices. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to make the technical solutions in the embodiments of the present application clearer, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings in the following description only constitute some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort.

[0017] Figure 1 A structural schematic diagram of an insulation and heat insulation plate in an embodiment of the present application; Figure 2 A top view of a reflective layer plate in an embodiment of the present application; Figure 3 A front view of a reflective layer plate in an embodiment of the present application; Figure 4 A structural schematic diagram of an insulation and heat insulation plate in an embodiment of the present application; Figure 3 A partial schematic diagram of A in FIG. 1.

[0018] In the figure: 1, a spacing layer; 2, a reflective layer plate; 21, a non-metallic base layer; 22, a metal layer; 221, a metal layer block; 3, a gap. DETAILED DESCRIPTION

[0019] In order to make the technical solutions in the embodiments of the present application clearer, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings in the following description only constitute some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort.

[0020] In the related art, the traditional insulation and heat insulation material is difficult to achieve overall and excellent performance in low magnetic noise control, high insulation performance maintenance and good thermal performance guarantee, and cannot fully meet the harsh requirements of the equipment.

[0021] In a first aspect, as shown in Figure 1 and Figure 2 The present application provides an insulation and heat insulation plate for sensitive equipment, comprising: a plurality of spacing layers 1 and a plurality of reflective layer plates 2; wherein, The plurality of reflective layer plates 2 are interleaved and stacked with the plurality of spacing layers 1, each of the plurality of reflective layer plates 2 comprises: a non-metallic base layer 21 and two metal layers 22, the two metal layers 22 are respectively attached to the two symmetrical surfaces of the non-metallic base layer 21, and the metal layer 22 comprises a plurality of metal layer blocks 221 arranged at intervals.

[0022] It is worth mentioning that the metal-coated reflective layer plate is difficult to achieve the best heat insulation effect in the deep cold insulation scene, and the heat is evenly heated and not spread in a large area. In the above embodiment of the application, the metal layer 22 of the material is divided into independent metal layer blocks 221 according to the scribing process of the chip, and the blocks are not conductive between the blocks, thereby improving the overall heat insulation performance, but are connected as a whole through the non-metal base layer 21. The above scheme can reduce eddy current heat on the one hand, and improve the signal-to-noise ratio in the changing magnetic field on the other hand.

[0023] In some optional embodiments, the metal layer block 221 is made of an aluminum-coated film.

[0024] It can be understood that the aluminum-coated film is a qualified material selection for realizing the technical effect in the scheme because of its low cost, good process adaptability (precise scribing), and excellent heat reflection performance.

[0025] In some preferred embodiments, the spacing layer 1 comprises a non-woven polyester fiber gasket.

[0026] It is worth mentioning that the spacing layer 1 can avoid heat propagation through the base layer to achieve the effect of "not allowing heat to spread in a large area". At the same time, the non-woven polyester fiber gasket is selected as the spacing layer 1, which has extremely low thermal conductivity and can effectively block the heat bridge effect to avoid heat propagation. At the same time, the polyester fiber is a non-conductive and non-magnetic material, which will not introduce eddy current or magnetic interference in the changing magnetic field, which is consistent with the characteristics of the aluminum-coated film (non-ferromagnetic). Further, the non-woven polyester fiber gasket can be used for precise cutting and is convenient for processing the reflective layer plate 2. Moreover, the polyester fiber remains flexible and insulating (without brittleness) at low temperature, avoiding cracking of traditional polymers in deep cold, and ensuring long-term stability of the heat insulation performance.

[0027] In some optional embodiments, the spacing layer 1 comprises a polyester gasket containing 100% adhesive, and the gasket is not perforated.

[0028] It can be understood that the spacing layer 1 treated by the above process can reduce the degassing rate.

[0029] In some specific embodiments, the insulating and heat insulation plate comprises ten layers of the spacing layer 1 and ten layers of the reflective layer plate 2, and each reflective layer plate 2 is at least one side attached to the spacing layer 1.

[0030] It can be understood that the insulating and heat insulation plate is composed of ten layers of the spacing layer 1 and 10 layers of the non-woven polyester fiber interlaced layer spacing material.

[0031] Optionally, the insulation and heat insulation plate has a rated compression thickness of 1.4 mm per 10 layers, and a minimum insulation spacing thickness of 3 mm per 10 layers, and the insulation is installed loosely on the plate to avoid excessive compression of the insulation and ensure good thermal performance.

[0032] In some optional embodiments, the spacer layer 1 and the reflective layer plate 2 are both square.

[0033] It should be noted that the insulation and heat insulation plate is used for SQUID sensors to reduce magnetic thermal noise, and is used for superconducting machines (such as magnet coils, motors, generators, etc.) to reduce heat dissipation in super-insulation coatings. At the same time, since the polyester felt insulation is flammable, appropriate welding protection is required, and preferably a welding-resistant material can be used for protection.

[0034] In a second aspect, the application provides a preparation method of the above-mentioned insulation and heat insulation plate, comprising the following steps: Step S1, combining the non-metal base layer 21 and the two metal layers 22 to form the reflective layer plate 2.

[0035] Step S2, performing a scribing process on the reflective layer plate 2 to divide the metal layer 22 into a plurality of gap-provided metal layer blocks 221.

[0036] It can be understood that, as shown in Figure 3 and Figure 4 , the scribing process forms gaps 3 between the metal layer blocks 221. In the above-mentioned embodiments, the metal layer 22 of the material is divided into independent metal layer blocks 221 according to the scribing process of the chip, the blocks are not conductive to each other, thereby improving the overall thermal insulation performance, but are connected as a whole through the non-metal base layer 21. The above-mentioned scheme can reduce eddy current heat on the one hand, and can improve the signal-to-noise ratio in a changing magnetic field on the other hand.

[0037] Specifically, the metal layer 22 is cut at the preset position by using a photoetching device to divide the metal layer 22 into a plurality of gap-provided metal layer blocks 221.

[0038] Further, when scribing, the metal layer 22 at the preset position needs to be completely cut in the thickness direction of the reflective layer plate to form the gaps 3 as shown in Figure 3 and Figure 4 .

[0039] Step S3, combining a plurality of the reflective layer plates 2 with a plurality of the spacer layers 1 to form the insulation and heat insulation plate.

[0040] Specifically, step S3 comprises: Step S3a, interleaving and stacking a plurality of the reflective layer plates 2 with a plurality of the spacer layers 1.

[0041] Specifically, a plurality of non-woven polyester fiber gaskets without perforation and containing no adhesive are interleaved and stacked with a plurality of the reflective layer plates 2.

[0042] It is worth mentioning that the installation of the plates needs to be done in a loose manner to prevent excessive compression of the insulation layer and ensure good thermal performance. The polyester gaskets used in the material are 100% adhesive-free and non-perforated, which can significantly reduce the outgassing rate. The maximum baking temperature can reach 125℃, and it can work stably at high temperature environment. The magnetic noise measurement is based on a 20-layer, 100mm x 100mm sample.

[0043] Step S3b, laser cutting the edges of the reflective layer plates 2 and the plurality of spacer layers 1 to align the reflective layer plates 2 and the plurality of spacer layers 1 in the thickness direction to form the insulation and heat insulation plate.

[0044] In some optional embodiments, after the materials are stacked in step S3a, the layers are stacked along the edges, and the conventional plate length is 3 meters and the width is 0.75 meters, while the size can be flexibly adjusted according to actual needs. After completion, the insulation performance test is carried out on the plate. The test needs to cover a temperature range of 300K to 77K, and the heat leakage value is different under different specifications and layers.

[0045] In summary, the present application improves the heat transfer performance of the reflective layer by dividing the metal film on the surface of the material reflective layer into gap-set metal blocks, reduces the heat dissipation in the super-insulation coating, and meets the stringent operation requirements of high-end sensors and superconducting devices.

[0046] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be a fixed connection, or a detachable connection, or an integral connection; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or a connection between two elements inside. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0047] It should be noted that, in the present application, the relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another, without necessarily requiring or implying any actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0048] The foregoing is considered as illustrative only of the principles of the application. Numerous modifications and changes will readily occur to those skilled in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Therefore, the application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An insulating heat shield for a sensitive device, characterized by, The application relates to an insulating and heat-insulating plate. The application relates to an insulating and heat-insulating plate. The application relates to an insulating and heat-insulating plate. The application relates to an insulating and heat-insulating plate.

2. The insulating panel of claim 1, wherein The application relates to an insulating and heat-insulating plate.

3. The insulating panel of claim 1, wherein The application relates to an insulating and heat-insulating plate.

4. The insulating panel of claim 3, wherein: The application relates to an insulating and heat-insulating plate.

5. The insulating panel of claim 1, wherein The application relates to an insulating and heat-insulating plate.

6. The insulating panel of claim 1, wherein: The application relates to an insulating and heat-insulating plate.

7. A method of producing the insulating and heat insulating panel according to claim 1, characterized by, The application relates to an insulating and heat-insulating plate. The application relates to an insulating and heat-insulating plate. The application relates to an insulating and heat-insulating plate. The application relates to an insulating and heat-insulating plate.

8. The production method according to claim 7, wherein The application relates to an insulating and heat-insulating plate. The application relates to an insulating and heat-insulating plate.

9. The production method according to claim 7, wherein The application relates to an insulating and heat-insulating plate. The application relates to an insulating and heat-insulating plate. The application relates to an insulating and heat-insulating plate.

10. The production method according to claim 8, wherein The application relates to an insulating and heat-insulating plate. The application relates to an insulating and heat-insulating plate. The application relates to an insulating and heat-insulating plate. The application relates to an insulating and heat-insulating plate. The application relates to an insulating and heat-insulating plate. The application relates to an insulating and heat-insulating plate. The application relates to an insulating and heat-insulating plate. The application relates to an insulating and heat-insulating plate. The application relates to an insulating and heat-insulating plate. The application relates to an insulating and heat-insulating plate. The application relates to an insulating and heat-insulating plate. The application relates to an insulating and heat-insulating plate. The application relates to an insulating and heat-insulating plate. 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