Adhesive removing agent and adhesive removing method

Abstract

The invention discloses a degumming agent and a degumming method. The adhesive remover provided by the invention comprises the following components in percentage by mass: 18%-25% of a main solvent; 8%-12% of a cosolvent; 0.8%-1.5% of a cationic surface active agent; 2%-4% of an auxiliary cationic surfactant; 0.8%-1.2% of a pH stabilizing agent; 0.05% to 0.15% of a corrosion inhibitor; and the balance of water; wherein the main solvent comprises an alcohol ether solvent, the cosolvent comprises an alcohol solvent, the cationic surface active agent comprises at least one of a double-chain cationic surface active agent and a multi-chain cationic surface active agent, and the auxiliary cationic surface active agent comprises a single-chain cationic surface active agent. The adhesive remover provided by the invention can mildly, efficiently and completely strip an adhesive layer adhered to the surface of a base material without damaging the base material.

Description

Technical Field

[0001] This application relates to the field of adhesive removal technology, specifically to adhesive removal agents and methods. Background Technology

[0002] Currently, common adhesive removal methods include mechanical peeling, high-temperature baking, solvent dissolution, chemical etching, and laser ablation, all of which can remove the adhesive layer on the substrate surface to varying degrees.

[0003] However, existing adhesive removal methods have harsh operating conditions, are not easy to completely remove adhesive, and can cause irreversible damage to the substrate to varying degrees. They can also severely damage the adhesive layer structure, making it difficult to achieve the goal of gentle adhesive removal without damaging the product. In addition, they may also cause environmental pollution problems. Summary of the Invention

[0004] In view of this, in order to solve at least one of the above technical problems, embodiments of this application provide a novel adhesive remover.

[0005] In addition, this application also provides a method for removing adhesive.

[0006] This application provides a desmearing agent comprising: a main solvent (18%–25%); a co-solvent (8%–12%); a cationic surfactant (0.8%–1.5%); an auxiliary cationic surfactant (2%–4%); a pH stabilizer (0.8%–1.2%); a corrosion inhibitor (0.05%–0.15%); and the balance being water. The main solvent comprises alcohol ether solvents, the co-solvent comprises alcohol solvents, the cationic surfactant comprises at least one of double-chain cationic surfactants and multi-chain cationic surfactants, and the auxiliary cationic surfactant comprises single-chain cationic surfactants.

[0007] In some possible embodiments, the double-chain cationic surfactant includes at least one of bis(dodecyl)dimethylammonium chloride, bis(tetradecyl)dimethylammonium chloride, bis(octadecyl)dimethylammonium chloride, and bis(decyl)dimethylammonium bromide.

[0008] In some possible embodiments, the multi-chain cationic surfactant includes at least one of trioctylmethylammonium chloride and ethoxylated tridecylmethylammonium chloride.

[0009] In some possible embodiments, the single-chain cationic surfactant includes at least one of hexadecyltrimethylammonium chloride, octadecyltrimethylammonium chloride, tetradecyltrimethylammonium bromide, and cocamidopropyl hydroxysulfonate betaine.

[0010] In some possible embodiments, the alcohol ether solvent includes at least one of propylene glycol butyl ether, diethylene glycol butyl ether, dipropylene glycol methyl ether, and tripropylene glycol methyl ether.

[0011] In some possible embodiments, the alcohol solvent includes at least one of n-propanol, isopropanol, ethanol, and tert-butanol.

[0012] In some possible embodiments, the pH stabilizer includes at least one of sodium citrate, sodium bicarbonate, triethanolamine, and disodium hydrogen phosphate-citric acid complex.

[0013] In some possible embodiments, the corrosion inhibitor includes at least one of benzotriazole, sodium silicate, dodecyl phosphate, and sodium molybdate.

[0014] In some possible embodiments, the adhesive remover comprises, by weight percentage, 22% propylene glycol butyl ether, 10% n-propanol, 1.2% dodecyl dimethyl ammonium chloride, 3% hexadecyl trimethyl ammonium chloride, 1% sodium citrate, 0.1% benzotriazole, and 62.7% water.

[0015] In addition, this application embodiment also provides a method for removing adhesive, including: placing a substrate having an adhesive layer in an adhesive remover and ultrasonically cleaning it until the adhesive layer separates from the substrate, wherein the adhesive remover includes the aforementioned adhesive remover.

[0016] In some possible embodiments, the adhesive layer is made of at least one of ultraviolet-curable adhesive, moisture-curable reactive polyurethane sealant, and pressure-sensitive adhesive.

[0017] In some possible embodiments, the temperature of the ultrasonic cleaning is 25°C to 60°C.

[0018] In some possible embodiments, the ultrasonic cleaning time is 10 min to 60 min.

[0019] In some possible embodiments, the frequency of the ultrasonic cleaning is 45 kHz to 60 kHz.

[0020] In some possible embodiments, the ultrasonic cleaning current is 1A to 3A.

[0021] Compared to existing technologies, the adhesive remover provided in this application contains a cationic surfactant. The cationic surfactant has a positively charged hydrophilic cationic head group and a hydrophobic long chain, which enhances the adhesive remover's penetration into the adhesive layer through electrostatic adsorption. This allows the adhesive remover to penetrate into the molecular structure of the adhesive layer, disrupting the intermolecular forces and emulsifying and dispersing the adhesive layer, thereby enabling the adhesive layer to be peeled off completely from the surface of the adhered object. Therefore, this adhesive remover can achieve efficient, complete, and thorough peeling of the adhesive layer under mild conditions, preserving the adhesive layer structure relatively intact without damaging the substrate. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the adhesive removal process of the cationic surfactant in the adhesive remover provided in an embodiment of this application, wherein, Figure 1 Figure a in the diagram is a schematic diagram of surface adsorption. Figure 1 Figure b in the diagram is a schematic diagram of complete adsorption. Figure 1 Figure c in the diagram is a schematic diagram of overall desorption.

[0023] Figure 2 This is a flowchart illustrating the working method of the adhesive remover provided in one embodiment of this application.

[0024] Figure 3 This is a comparison image of the roughness of the substrate before and after adhesive removal using an adhesive remover in Example 1 of this application. Figure 3 Figure a in the image shows the surface roughness of the substrate before adhesive removal. Figure 3 Figure b in the figure shows the surface roughness of the substrate after the adhesive has been removed by the adhesive remover. Detailed Implementation

[0025] The embodiments of this application are described in detail below. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application; it should be noted that, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; where there is no conflict, the implementation methods and features of the implementation methods of this application can be combined with each other; many specific details are set forth in the following description to provide a full understanding of this application, and the described implementation methods are only a part of the implementation methods of this application, and not all of the implementation methods.

[0026] The inventors discovered that the adhesion between the adhesive layer and the substrate is mainly achieved through physical / chemical changes on the substrate surface. These adhesion phenomena can be categorized into five mechanisms: physical adsorption, electrostatic reaction, mechanical anchoring, interpenetration, and chemical reaction. For example, interpenetration (molecular diffusion) refers to the phenomenon where, when the temperature is higher than the glass transition temperature of the adhesive layer or when the adhesive layer contains solvents, interpenetration may occur between the adhesive layer and the substrate interface, even if the adhesive layer and substrate are thermodynamically compatible. Mechanical anchoring refers to the adhesive layer filling microscopic depressions (such as machining lines or porous structures) on the substrate surface, forming a "barbed" anchoring structure after curing that resists peeling forces through physical locking, or forming an elastomer (such as polyurethane or silicone) after curing that resists peeling forces through elastic locking. Depending on the characteristics of the adhesive layer and the substrate itself, sometimes two or more adhesion mechanisms may occur simultaneously.

[0027] Therefore, this application provides a novel adhesive remover for removing an adhesive layer formed by adhesive curing on a substrate surface. The adhesive remover comprises, by weight percentage: Main solvent, 18%~25%; Cosolvent, 8%~12%; Cationic surfactant, 0.8%~1.5%; Auxiliary cationic surfactant, 2%~4%; pH stabilizer, 0.8%~1.2%; Corrosion inhibitor, 0.05%~0.15%; and The remaining water; The main solvent includes alcohol ether solvents, the co-solvent includes alcohol solvents, the cationic surfactant includes at least one of double-chain cationic surfactants and multi-chain cationic surfactants, and the auxiliary cationic surfactant includes single-chain cationic surfactants.

[0028] The main solvent in the adhesive remover is used to quickly wet the surface of the adhesive layer and penetrate into the interior of the adhesive layer and the gaps between the adhesive layer and the surface of the adhered object (substrate). Through hydrogen bonds and van der Waals forces, it breaks the molecular chains of the adhesive layer, reducing the adhesion between the adhesive layer and the substrate, thereby peeling off the adhesive layer. This main solvent includes alcohol ether solvents and is suitable for peeling adhesive layers formed by UV-curable adhesives (UV adhesives), moisture-curing reactive polyurethane sealants (PUR sealants), and pressure-sensitive adhesives. The material types of UV adhesives and pressure-sensitive adhesives can include acrylate type, polyurethane type, and polyurethane-acrylate type, etc.

[0029] The main solvent constitutes 18% to 25% of the adhesive remover by mass, which facilitates rapid peeling of the adhesive layer without damaging the substrate. When the main solvent content is too low (below 18%), the peeling rate decreases; when the main solvent content is too high (above 25%), it may cause substrate damage, such as surface swelling of PBT substrates. The main solvent percentage of the adhesive remover by mass can, for example, be 18%, 19%, 20%, 21%, 22%, 23%, 24%, 25%, or any value within the range of any two of the above values.

[0030] The main solvent includes alcohol ether solvents. Further, the alcohol ether solvent may include at least one of propylene glycol butyl ether, diethylene glycol butyl ether, dipropylene glycol methyl ether, and tripropylene glycol methyl ether. All of the above main solvents have high chemical stability and do not react with metal, glass, or plastic substrates, or substrates with anodized aluminum coatings, thus reducing corrosion or whitening.

[0031] The main function of co-solvents in adhesive removers is to improve their solubility, volatility, and viscosity. Specifically, co-solvents can improve the dissolving power of the main solvent, helping solvent molecules penetrate the adhesive layer more easily, disrupting the interaction between the adhesive layer and the substrate, and thus promoting adhesive peeling. Co-solvents can also regulate the evaporation rate of the adhesive remover, preventing it from evaporating too quickly while removing the adhesive layer, thereby extending the action time and allowing for deeper penetration into the adhesive layer, improving removal efficiency. Co-solvents can also adjust the viscosity of the adhesive remover, improving the uniformity and efficiency of adhesive removal, and avoiding poor removal results due to excessive viscosity or thinness. Depending on the type of main solvent, a co-solvent with the aforementioned functions can be selected. For example, for main solvents such as alcohol ethers, alcohol solvents are used as co-solvents.

[0032] A co-solvent content of 8% to 12% of the adhesive remover's mass percentage is beneficial for moderately improving the aforementioned properties of the adhesive remover. If the co-solvent content is too low (below 8%), the adhesive remover will evaporate too quickly; if the co-solvent content is too high (above 12%), the emission of organic compounds will increase, reducing the environmental friendliness of the adhesive remover. The co-solvent content of the adhesive remover's mass percentage can, for example, be 8%, 9%, 10%, 11%, 12%, or any value within the range of any two of the above values.

[0033] In some embodiments, the alcohol solvent may include at least one of n-propanol, isopropanol, ethanol, and tert-butanol.

[0034] This application adds a cationic surfactant to the adhesive remover. Since the cationic surfactant has a positively charged hydrophilic cationic head group and a hydrophobic long chain, it is a key component for improving adhesive removal efficiency, protecting the substrate and optimizing the adhesive removal process.

[0035] Please see Figure 1 Cationic surfactants first attract each other through electrostatic interactions between their positively charged cationic head groups (such as ammonium ion centers) and the negatively charged regions (such as -OH, -COOH, etc.) on the adhesive layer surface, forming surface adsorption (e.g. Figure 1 (Figure a) can accelerate the penetration rate of the main solvent. It then penetrates into the interface gaps between the adhesive layer and the substrate to form complete adsorption (such as...). Figure 1 (See Figure b). The hydrophobic long chains of cationic surfactants, due to their hydrophobicity, can insert into the adhesive layer, effectively penetrating its molecular structure and disrupting intermolecular forces. This emulsifies and disperses the adhesive layer, synergistically weakening the cross-linking structure of the adhesive layer with the main solvent, thus enhancing penetration strength. Furthermore, the concentration of cationic surfactants at the adhesive-substrate interface is higher than inside the adhesive layer. The adhesive remover preferentially disrupts the adhesion between the adhesive layer and the substrate at this interface, rather than within the adhesive layer itself. As the interfacial adhesion continues to decrease, the adhesive layer detaches entirely from the substrate surface (e.g., ...). Figure 1 (See Figure c in the diagram), and the adhesive layer can maintain a relatively intact structure, which is beneficial for the recycling of the adhesive layer.

[0036] By adding cationic surfactants, the adhesive remover effectively enhances wettability and penetration efficiency even at lower operating temperatures (e.g., 25°C–60°C) through electrostatic adsorption and disruption of intermolecular forces in the adhesive layer, as well as by increasing the penetration rate and strength of the main solvent. The ether bonds of the main solvent insert into the cationic surfactant's structural chain, reducing micelle vesicle curvature and forming a three-dimensional cubic micelle network, increasing adsorption sites for the remover. The synergistic effect of these two components maximizes interfacial adsorption. Therefore, this remover can achieve efficient, complete, and thorough removal of the adhesive layer under mild conditions, reducing energy consumption and the risk of thermal damage to the substrate. It also avoids chemical or mechanical damage to the substrate, effectively ensuring its integrity and performance stability. Furthermore, due to the unique mechanism of action of the cationic surfactant-containing remover, it achieves overall peeling rather than complete dissolution of the adhesive layer, creating favorable conditions for its recycling. The remover does not chemically react with the adhesive layer, maintaining its own properties, which helps extend its service life and reduce waste generation, aligning with the trend of green environmental protection.

[0037] Furthermore, the cationic surfactant may include at least one of double-chain cationic surfactants and multi-chain cationic surfactants, possessing two or more hydrophobic long chains, which can provide stronger hydrophobicity and interfacial adsorption capacity. It adsorbs onto the adhesive layer surface and further disrupts the intermolecular forces of the adhesive layer through "hydrophobic insertion," thus dominating the peeling of the adhesive layer. Specifically, the double-chain cationic surfactant may include at least one of bis(dodecyl)dimethylammonium chloride, bis(tetradecyl)dimethylammonium chloride, bis(octadecyl)dimethylammonium chloride, and bis(decyl)dimethylammonium bromide; the multi-chain cationic surfactant may include at least one of trioctylmethylammonium chloride and ethoxylated tridecylmethylammonium chloride.

[0038] A cationic surfactant comprising 0.8% to 1.5% of the adhesive remover by mass is beneficial for moderately improving the removal efficiency. When the cationic surfactant content is too low (below 0.8%), the reaction sites between the adhesive remover and the adhesive layer decrease, resulting in lower penetration and removal efficiency. When the cationic surfactant content is too high (above 12%), it may pose a risk of corrosion to the substrate. The cationic surfactant content in the adhesive remover can, for example, be 0.8%, 0.9%, 1.0%, 1.1%, 1.2%, 1.3%, 1.4%, 1.5%, or any value within the range of any two of the above values.

[0039] The adhesive remover contains an auxiliary cationic surfactant, which is mainly used to further reduce the surface tension of the adhesive remover, help the adhesive remover to quickly and efficiently wet the adhesive layer surface, solubilize micelles, help the cationic surfactant to disperse and attack the interface between the adhesive layer and the substrate, accelerate the penetration of the adhesive remover into the interface between the adhesive layer and the substrate, thereby improving the penetration and peeling speed of the adhesive remover, and can also act as an emulsifier to maintain the mixing stability of the main solvent and co-solvent in the adhesive remover with water.

[0040] For both double-chain and multi-chain cationic surfactants, the auxiliary cationic surfactant can be a single-chain cationic surfactant. This single-chain surfactant has less steric hindrance and good single-chain flexibility, which helps the cationic surfactant penetrate further into the adhesive layer at the substrate interface, accelerating the penetration rate. Double-chain and multi-chain cationic surfactants have stronger adsorption properties, while single-chain auxiliary cationic surfactants have stronger penetration properties. The difference in hydrophobic long chains between the cationic surfactant and the auxiliary cationic surfactant can synergistically improve the overall peeling effect of the adhesive remover on the adhesive layer. Furthermore, the auxiliary cationic surfactant can be co-solventized with a co-solvent to generate high aspect ratio micelles, which penetrate the adhesive layer at the substrate interface, synergistically enhancing the penetration and peeling effect of the adhesive remover.

[0041] In some embodiments, the single-chain cationic surfactant includes at least one of hexadecyltrimethylammonium chloride, octadecyltrimethylammonium chloride, tetradecyltrimethylammonium bromide, and cocamidopropyl hydroxysulfonyl betaine. Taking the single-chain quaternary ammonium salt (hexadecyltrimethylammonium chloride, octadecyltrimethylammonium chloride, and tetradecyltrimethylammonium bromide) as a cosolvent with n-propanol as an example, the alkyl chain agent in the single-chain quaternary ammonium salt can be co-solventized with n-propanol to generate high aspect ratio micelles that penetrate the interface between the adhesive and the substrate, synergistically enhancing the penetration and peeling effect of the adhesive remover.

[0042] The auxiliary cationic surfactant constitutes 2% to 4% of the adhesive remover by mass, which is beneficial for improving the penetration efficiency of the adhesive remover. When the content of the auxiliary cationic surfactant is too low (below 2%), the peeling speed of the adhesive remover will decrease; when the content of the auxiliary cationic surfactant is too high (above 4%), the viscosity of the adhesive remover will increase, which may lead to uneven dispersion of the adhesive remover and affect the adhesive removal effect. The auxiliary cationic surfactant as a percentage of the adhesive remover by mass can, for example, be 2%, 2.2%, 2.5%, 2.8%, 3%, 3.2%, 3.5%, 3.8%, 4%, or any value within the range of any two of the above values.

[0043] The pH stabilizer in the adhesive remover is used to control the pH value of the adhesive remover, ensuring that the adhesive remover will not affect the adhesive removal effect or damage the substrate due to changes in acidity or alkalinity during use.

[0044] A pH stabilizer comprising 0.8% to 1.2% of the adhesive remover by mass helps stabilize the adhesive remover's pH. If the pH stabilizer content is too low (below 0.8%), it will accelerate the corrosion of the substrate by the adhesive remover; if the pH stabilizer content is too high (above 1.2%), it will increase the risk of crystallization in the adhesive remover. The pH stabilizer's percentage by mass in the adhesive remover can, for example, be 0.8%, 0.9%, 1.0%, 1.1%, 1.2%, or any value within the range of any two of the above values.

[0045] In some embodiments, the pH stabilizer may include at least one of sodium citrate, sodium bicarbonate, triethanolamine, and disodium hydrogen phosphate-citric acid complex.

[0046] The corrosion inhibitors in adhesive removers form a protective layer on the substrate surface, preventing other components in the remover from corroding the metal substrate or other easily corroded materials (such as the anodized film on the substrate surface). Especially when treating metal substrates, the acidic or alkaline components in the remover may cause some corrosion; the corrosion inhibitor can effectively prevent this corrosion.

[0047] The corrosion inhibitor constitutes 0.05% to 0.15% of the adhesive remover by mass, which is beneficial for providing effective protection to the substrate. When the corrosion inhibitor content is too low (below 0.05%), the probability of pitting corrosion on the substrate increases; when the corrosion inhibitor content is too high (above 0.15%), the desorption efficiency of the adhesive remover decreases. The corrosion inhibitor percentage of the adhesive remover by mass can, for example, be 0.05%, 0.06%, 0.07%, 0.08%, 0.09%, 0.10%, 0.11%, 0.12%, 0.13%, 0.14%, 0.15%, or any value within the range of any two of the above values.

[0048] In some embodiments, the corrosion inhibitor may include at least one of benzotriazole, sodium silicate, dodecyl phosphate, and sodium molybdate.

[0049] The adhesive remover provided in this application is a water-based adhesive remover. The aforementioned components in the adhesive remover are soluble in water, and the adhesive remover can be thoroughly rinsed off with water after the adhesive layer is peeled off. Water, as a carrier for the adhesive remover components, can also adjust the concentration and viscosity of the adhesive remover, thereby improving its dispersibility. Furthermore, the water-based adhesive remover aligns with the concept of green and environmentally friendly development.

[0050] Compared to oil-based adhesive removers, the adhesive remover provided in this application exhibits excellent mildness and superior substrate compatibility and selective solubility. This is because the addition amounts of the main solvent, co-solvent, cationic surfactant, and auxiliary cationic surfactant in the adhesive remover are within the aforementioned relatively small range, achieving efficient removal of the adhesive layer. Furthermore, it specifically targets and partially dissolves the adhesive layer, with the water solvent accounting for approximately 56.15% to 70.35% of the adhesive remover's mass, a relatively large proportion. Therefore, the adhesive remover is mild and will not damage the substrate. Moreover, when an anodized film exists on the substrate surface, the adhesive remover can reduce the erosion of the anodized film. Simultaneously, the mild action of this adhesive remover allows the adhesive layer to maintain a relatively intact structure when peeled from the substrate surface.

[0051] In some embodiments, the adhesive removal temperature of the adhesive remover can be 25°C to 60°C. Compared to existing adhesive removers that require high temperatures of around 90°C to remove adhesive, the adhesive remover of this application can effectively remove adhesives even at the aforementioned lower removal temperatures, and can even efficiently remove adhesives at room temperature of 25°C, which helps to reduce energy consumption and reduce the risk of thermal damage to the substrate. The adhesive removal temperature of the adhesive remover can, for example, be 25°C, 30°C, 35°C, 40°C, 45°C, 50°C, 55°C, 60°C, or any value within the range of any two of the above values. The adhesive removal temperature of the adhesive remover can further be 25°C to 45°C.

[0052] For example, this application provides an adhesive remover, which, by mass percentage, may include 18%~25% propylene glycol butyl ether, 8%~12% n-propanol, 0.8%~1.5% dodecyl dimethyl ammonium chloride, 2%~4% hexadecyl trimethyl ammonium chloride, 0.8%~1.2% sodium citrate, 0.05%~0.15% benzotriazole, and the balance being water. This adhesive remover can be used to remove the adhesive layer from the surface of an anodized PBT substrate. The adhesive layer material can be a UV adhesive (UV glue), which may include PU (polyurethane) type adhesives, PMMA (acrylate) type adhesives, and PU-PMMA type adhesives, etc.

[0053] Taking the curing of modified polyurethane acrylate UV adhesive (PU-PMMA type UV adhesive) to form an adhesive layer as an example, the main reaction process is as follows: 1. Photoinitiator absorbs ultraviolet light: The photoinitiator in the UV curing material absorbs ultraviolet light under ultraviolet irradiation and generates active free radicals. 2. Initiates monomer polymerization: The active free radicals initiate the opening of the carbon-carbon double bonds in the acrylate monomers, carrying out a free radical polymerization reaction to form chain-growing free radicals. 3. Chain growth: The chain-growing free radicals continuously react with monomer molecules, causing the polymer chains to grow continuously. 4. Crosslinking reaction: As the reaction proceeds, crosslinking reactions may occur between polymer chains, forming a three-dimensional network structure, thereby causing the adhesive to cure and form an adhesive layer. The schematic diagram of its polymerization reaction structure is as follows: In this example, the cationic surfactant in the adhesive remover is bis(dodecyl)dimethylammonium chloride. The molecular structure of bis(dodecyl)dimethylammonium chloride contains a positively charged ammonium ion center and a double-chain long-chain alkyl group. During the adhesive removal process, the positively charged portion attracts the negatively charged adhesive layer and quickly adsorbs onto the surface of the adhesive layer. The long-chain alkyl portion, due to its high hydrophobicity, can penetrate into the molecular structure of the adhesive layer, disrupting the intermolecular interactions and emulsifying and dispersing the adhesive layer. This allows the adhesive layer to be completely peeled off from the substrate surface without damaging the anodic oxide film or the substrate. The auxiliary cationic surfactant in this adhesive remover is hexadecyltrimethylammonium chloride, which helps the cationic surfactant further penetrate the adhesive layer and accelerates the penetration rate. Understandably, the specific selection and proportion of each component in the adhesive remover can be adjusted according to the type of adhesive layer and substrate to be separated.

[0054] Compared with the prior art, the adhesive remover provided in this application has the following beneficial effects: 1. Because the adhesive remover contains cationic surfactants, which have positively charged hydrophilic cationic head groups and hydrophobic long chains, they can electrostatically adsorb and disrupt the intermolecular forces of the adhesive layer. This allows for efficient, complete, and thorough removal of the adhesive layer without requiring high temperatures, reducing energy consumption and the risk of thermal damage to the substrate. It also avoids chemical or mechanical damage to the substrate, effectively ensuring its integrity and performance stability. Furthermore, the cationic surfactants synergistically work with the main solvent to increase the adsorption sites of the adhesive remover and improve the interfacial adsorption effect.

[0055] 2. The adhesive remover also contains auxiliary cationic surfactants, which are used to quickly and efficiently wet the adhesive layer surface, solubilize micelles, and improve the penetration and peeling speed of the adhesive remover. Furthermore, the auxiliary cationic surfactants are co-solventized with the co-solvents, synergistically enhancing the penetration and peeling effect of the adhesive remover.

[0056] 3. The adhesive remover is gentle and will not damage the substrate. When the substrate has an anodized film, the adhesive remover will not damage the anodized film, which helps to ensure the integrity and performance stability of the substrate.

[0057] 4. Because the adhesive remover achieves relatively complete peeling rather than complete dissolution of the adhesive layer, it creates favorable conditions for the recycling of the adhesive layer. Furthermore, the adhesive remover does not readily react chemically with the adhesive layer, and its own properties are not easily altered, which helps extend the service life of the adhesive remover, reduce waste generation, and aligns with the trend of green and environmentally friendly development.

[0058] Please see Figure 2 As shown in the embodiments of this application, a method for removing adhesive is also provided, including: Step S1: The substrate with the adhesive layer is placed in an adhesive remover and ultrasonically cleaned until the adhesive layer separates from the substrate. The adhesive remover includes the aforementioned adhesive remover.

[0059] Specifically, the adhesive layer is formed by curing the adhesive on the substrate surface. The aforementioned adhesive remover is added to a constant-temperature ultrasonic water bath, and the substrate with the adhesive layer attached is completely immersed in the adhesive remover for ultrasonic cleaning to peel off the adhesive. After the adhesive layer is peeled off, the substrate is cleaned and dried.

[0060] In some embodiments, the material of the adhesive layer may include at least one of ultraviolet-curing UV adhesive (UV adhesive), moisture-curing reactive polyurethane sealant (PUR sealant), and pressure-sensitive adhesive.

[0061] In some embodiments, the ultrasonic cleaning temperature can be between 25°C and 60°C. At this temperature, complete and thorough peeling of the adhesive layer can be achieved, while also reducing energy consumption and thermal damage to the substrate. The ultrasonic cleaning temperature can, exemplarily, be 25°C, 30°C, 35°C, 40°C, 45°C, 50°C, 55°C, 60°C, or any value within the range of any two of the above values. The ultrasonic cleaning temperature can further be between 40°C and 50°C.

[0062] In some embodiments, the ultrasonic cleaning time can be 10 min to 60 min, which is beneficial for thoroughly peeling off the adhesive layer, reducing residual adhesive, and shortening the adhesive removal time, thus accelerating the removal process. The ultrasonic cleaning time can, exemplarily, be 10 min, 20 min, 30 min, 40 min, 50 min, 60 min, or any value within the range of any two of the above values. The ultrasonic cleaning time can further be 25 min to 35 min.

[0063] In some embodiments, the ultrasonic cleaning frequency can be 45kHz to 60kHz, which is beneficial for further improving the adhesive removal efficiency of the adhesive remover while reducing damage to the substrate. The ultrasonic cleaning frequency can exemplary be 45kHz, 50kHz, 55kHz, 60kHz, or any value within the range of any two of the above values. The ultrasonic cleaning frequency can further be 45kHz to 50kHz.

[0064] In some embodiments, the ultrasonic cleaning current can be 1A to 3A, which can effectively improve the adhesive removal effect of the adhesive remover while reducing damage to the substrate. The ultrasonic cleaning current can exemplary be 1A, 1.5A, 2A, 2.5A, 3A, or any value within the range of any two of the above values. The ultrasonic cleaning current can further be 1.5A to 2.5A.

[0065] Compared with the prior art, the adhesive removal method provided in this application has the following beneficial effects: 1. Due to the use of the aforementioned adhesive remover, this application method can efficiently peel off the adhesive layer under mild conditions.

[0066] 2. The application method of this adhesive remover is unlikely to adversely affect the performance and appearance of the substrate.

[0067] 3. The application method of this adhesive remover is simple, energy-efficient, and environmentally friendly, and can be applied on a large scale to remove adhesive layers on substrate surfaces.

[0068] The following specific examples further illustrate the aforementioned adhesive remover and its application method.

[0069] Example 1 An adhesive remover, by weight percentage, comprises 22% propylene glycol butyl ether, 10% n-propanol, 1.2% dodecyl dimethyl ammonium chloride, 3% hexadecyl trimethyl ammonium chloride, 1% sodium citrate, 0.1% benzotriazole and 62.7% water.

[0070] Preparation method of adhesive remover: Prepare the raw materials according to the above formula, mix and stir to obtain adhesive remover.

[0071] Application methods of adhesive remover include: Step S1: The substrate with the adhesive layer after anodizing is placed in the above-mentioned adhesive remover and ultrasonically cleaned at 45°C with a frequency of 50 kHz and a current of 2 A for 30 min. The adhesive layer material is PU-PMMA type UV adhesive.

[0072] Adhesive removal results: The adhesive layer was completely peeled off without any residue. The structure of the peeled adhesive layer was relatively intact, and the adhesive remover on the substrate surface could be cleaned off with water.

[0073] Example 2 An adhesive remover, by weight percentage, comprises 22% propylene glycol butyl ether, 10% n-propanol, 0.8% dodecyl dimethyl ammonium chloride, 3% hexadecyl trimethyl ammonium chloride, 1% sodium citrate, 0.1% benzotriazole and 63.1% water.

[0074] Preparation method of adhesive remover: Prepare the raw materials according to the above formula, mix and stir to obtain adhesive remover.

[0075] Application methods of adhesive remover include: Step S1: The substrate with the adhesive layer after anodizing is placed in the above-mentioned adhesive remover and ultrasonically cleaned at 45°C with a frequency of 50 kHz and a current of 2 A for 30 min. The adhesive layer material is PU-PMMA type UV adhesive.

[0076] Adhesive removal results: The adhesive layer was completely peeled off without any residue. The structure of the peeled adhesive layer was relatively intact, and the adhesive remover on the substrate surface could be cleaned off with water.

[0077] Example 3 An adhesive remover, by weight percentage, comprises 22% propylene glycol butyl ether, 10% n-propanol, 1.5% dodecyl dimethyl ammonium chloride, 3% hexadecyl trimethyl ammonium chloride, 1% sodium citrate, 0.1% benzotriazole and 62.4% water.

[0078] Preparation method of adhesive remover: Prepare the raw materials according to the above formula, mix and stir to obtain adhesive remover.

[0079] Application methods of adhesive remover include: Step S1: The substrate with the adhesive layer after anodizing is placed in the above-mentioned adhesive remover and ultrasonically cleaned at 45°C with a frequency of 50 kHz and a current of 2 A for 30 min. The adhesive layer material is PU-PMMA type UV adhesive.

[0080] Adhesive removal results: The adhesive layer was completely peeled off without any residue. The structure of the peeled adhesive layer was relatively intact, and the adhesive remover on the substrate surface could be cleaned off with water.

[0081] Example 4 An adhesive remover, by weight percentage, comprises 22% propylene glycol butyl ether, 10% n-propanol, 1.2% dodecyl dimethyl ammonium chloride, 2% hexadecyl trimethyl ammonium chloride, 1% sodium citrate, 0.1% benzotriazole and 63.7% water.

[0082] Preparation method of adhesive remover: Prepare the raw materials according to the above formula, mix and stir to obtain adhesive remover.

[0083] Application methods of adhesive remover include: Step S1: The substrate with the adhesive layer after anodizing is placed in the above-mentioned adhesive remover and ultrasonically cleaned at 45°C with a frequency of 50 kHz and a current of 2 A for 30 min. The adhesive layer material is PU-PMMA type UV adhesive.

[0084] Adhesive removal results: The adhesive layer was completely peeled off without any residue. The structure of the peeled adhesive layer was relatively intact, and the adhesive remover on the substrate surface could be cleaned off with water.

[0085] Example 5 An adhesive remover, by weight percentage, comprises 22% propylene glycol butyl ether, 10% n-propanol, 1.2% dodecyl dimethyl ammonium chloride, 4% hexadecyl trimethyl ammonium chloride, 1% sodium citrate, 0.1% benzotriazole and 61.7% water.

[0086] Preparation method of adhesive remover: Prepare the raw materials according to the above formula, mix and stir to obtain adhesive remover.

[0087] Application methods of adhesive remover include: Step S1: The substrate with the adhesive layer after anodizing is placed in the above-mentioned adhesive remover and ultrasonically cleaned at 45°C with a frequency of 50 kHz and a current of 2 A for 30 min. The adhesive layer material is PU-PMMA type UV adhesive.

[0088] Adhesive removal results: The adhesive layer was completely peeled off without any residue. The structure of the peeled adhesive layer was relatively intact, and the adhesive remover on the substrate surface could be cleaned off with water.

[0089] Example 6 An adhesive remover, by weight percentage, comprises 22% propylene glycol butyl ether, 10% n-propanol, 1.2% ethoxylated trimedylmethyl ammonium chloride, 3% hexadecyltrimethylammonium chloride, 1% sodium citrate, 0.1% benzotriazole and 62.7% water.

[0090] Preparation method of adhesive remover: Prepare the raw materials according to the above formula, mix and stir to obtain adhesive remover.

[0091] Application methods of adhesive remover include: Step S1: The substrate with the adhesive layer after anodizing is placed in the above-mentioned adhesive remover and ultrasonically cleaned at 45°C with a frequency of 50 kHz and a current of 2 A for 30 min. The adhesive layer material is PU-PMMA type UV adhesive.

[0092] Adhesive removal results: The adhesive layer was completely peeled off without any residue. The structure of the peeled adhesive layer was relatively intact, and the adhesive remover on the substrate surface could be cleaned off with water.

[0093] Comparative Example 1 An oily adhesive remover, by mass percentage comprising 12%~17% polyether-modified siloxane, 23%~30% dipropylene glycol methyl ether acetic acid, 20%~30% N-ethylpyrrolidone and 30%~45% dipropylene glycol methyl ether.

[0094] Preparation method of adhesive remover: Prepare the raw materials according to the above formula, mix and stir to obtain adhesive remover.

[0095] Application methods of adhesive remover include: Step S1: The substrate with the adhesive layer after anodizing is placed in the above-mentioned oily adhesive remover and ultrasonically cleaned at 80°C with a frequency of 50 kHz and a current of 2 A for 30 min. The adhesive layer material is PU-PMMA type UV adhesive.

[0096] Adhesive removal results: The adhesive layer was removed, but a small amount of residual adhesive remained. The adhesive layer structure was severely damaged, and because the components of the oil-based adhesive remover are insoluble in water, the oil-based adhesive remover residue on the substrate surface was difficult to clean with water.

[0097] Comparative Example 2 A cleaning agent, by mass percentage, comprises 5% to 7% alkyl glycoside, 0.2% to 0.3% methylbenzotriazole, 1.5% to 2% sodium gluconate, 8% to 10% sodium carbonate, and 82% to 85% deionized water.

[0098] Preparation method of cleaning agent: Prepare raw materials according to the above formula, mix and stir to obtain adhesive remover.

[0099] The application methods of cleaning agents include: Step S1: Place the substrate with an adhesive layer after anodic oxidation treatment in the above cleaning agent, and perform ultrasonic cleaning at 80 °C for 30 min with a frequency of 50 kHz and a current of 2 A. Here, the material of the adhesive layer is PU-PMMA type UV glue.

[0100] Debonding result: The adhesive layer was not removed.

[0101] Comparative Example 3 A debonder, by mass percentage, includes 22% propylene glycol butyl ether, 10% n-propanol, 1% sodium citrate, 0.1% benzotriazole, and 62.7% water.

[0102] Preparation method of the debonder: Configure raw materials according to the above formula, mix and stir to obtain the debonder.

[0103] Application method of the debonder, including: Step S1: Place the substrate with an adhesive layer after anodic oxidation treatment in the above debonder, and perform ultrasonic cleaning at 45 °C for 30 min with a frequency of 50 kHz and a current of 2 A. Here, the material of the adhesive layer is PU-PMMA type UV glue.

[0104] Debonding result: The adhesive layer was not completely peeled off, and there was a large amount of residual glue.

[0105] For the substrates in the above Examples 1-6 and Comparative Examples 1-3, before and after being treated with the above debonder, roughness, color, and glossiness tests were carried out, and the results are shown in Tables 1, Table 2, and Table 3.

[0106] (I) Roughness test method: Observe the height profile of the substrate surface using a Zygo white light interferometer, take 9 points, and test the roughness of the substrate.

[0107] (II) Color test method: Refer to GB / T 11186.2-2022, under the condition of D65 light source, at a 90° angle, use a color difference meter to measure the color parameters of the substrate surface: L*, a*, b*, and color difference: dL*, da*, db*. Among them, the differences of each color parameter of the substrate surface before and after debonding meet the following conditions to be qualified: |L* 前 -L* 后 |<5, |a* 前 -a* 后 |<1, |b* 前 -b* 后 |<1, |dL* 前 -dL* 后 |<2, |da* 前 -da* 后 |<1, |db* 前 -db*后 | < 1; otherwise it is unqualified.

[0108] (III) Glossiness test method: Using a glossmeter, at a 90° geometric angle, measure the glossiness of the left edge (L) and the right edge (R) of the substrate surface. The edge area is 3 mm away from the edge of the substrate. Among them, the difference in glossiness of the substrate surface before and after removing the glue meets the following conditions to be qualified: |L edge value 前 - L edge value 后 | < 2, |R edge value 前 - R edge value 后 | < 2; otherwise it is unqualified.

[0109] The above results show that: In Examples 1 - 6, the glue remover can effectively peel the adhesive layer from the substrate surface under relatively mild temperature (45°C) conditions, which is beneficial to energy conservation. And the glue removers in Examples 1 - 6 are water-based glue removers, which are more environmentally friendly. While in Comparative Example 1, the adhesive layer on the substrate surface can only be removed at a high temperature (80°C), the structure of the adhesive layer is damaged, and there is a small amount of residual glue on the substrate surface. The oil-based glue remover in Comparative Example 1 will also increase energy consumption and cause certain thermal damage to the substrate. In Comparative Example 2, the adhesive layer still cannot be completely peeled off after being treated at a high temperature (80°C) for 30 min, and the glue removal effect is not as good as that in Examples 1 - 6. The glue remover in Comparative Example 3 lacks cationic surfactants and auxiliary cationic surfactants compared with Example 1, and the peeling effect decreases, making it difficult to completely peel the adhesive layer.

[0110] Combined with Table 1 and Figure 3 It can be seen that the glue remover used in Example 1 does not cause a significant change in the roughness of the substrate before and after the glue removal treatment, indicating that the glue remover in Example 1 can better protect the substrate and keep the substrate in a good surface state.

[0111] As shown in Table 2, the color difference and gloss of the anodic oxide film on the substrate surface before and after treatment with the adhesive remover in Examples 1-6 are relatively small, indicating that the adhesive remover in Examples 1-6 does not change the color difference and gloss of the anodic oxide film on the substrate surface, ensuring the integrity and performance stability of the substrate. However, the substrate in Comparative Example 1 shows a large change in color difference and gloss before and after adhesive removal treatment, indicating that the adhesive remover and its application method in Comparative Example 1 can damage the substrate, affecting its performance and surface appearance. Furthermore, the substrate in Comparative Example 2 shows a large change in color difference but a small change in gloss before and after adhesive removal treatment, indicating that the adhesive remover and its application method in Comparative Example 2 can also damage the substrate, affecting its performance and surface appearance. The adhesive remover in Comparative Example 3 has no effect on the performance and surface appearance of the substrate.

[0112] Therefore, by adding cationic surfactants to the water-based adhesive remover, the wettability and penetration efficiency of the adhesive remover are improved, enabling the adhesive remover to efficiently, completely and thoroughly peel off the adhesive layer on the substrate surface under mild conditions, thus preserving the adhesive layer structure relatively intact without damaging the substrate.

[0113] The above description of the embodiments is only for the purpose of helping to understand the method and core idea of ​​this application; in addition, those skilled in the art can make various other corresponding changes and modifications based on the technical concept of this application, and all such changes and modifications should fall within the protection scope of the claims of this application.

Claims

1. A glue remover, characterized in that, The adhesive remover comprises, by weight percentage: Main solvent, 18%~25%; Cosolvent, 8%~12%; Cationic surfactant, 0.8%~1.5%; Auxiliary cationic surfactant, 2%~4%; pH stabilizer, 0.8%~1.2%; Corrosion inhibitor, 0.05%~0.15%; and The remaining water; The main solvent includes alcohol ether solvents, the co-solvent includes alcohol solvents, the cationic surfactant includes at least one of double-chain cationic surfactants and multi-chain cationic surfactants, and the auxiliary cationic surfactant includes single-chain cationic surfactants.

2. The adhesive remover according to claim 1, characterized in that, The double-chain cationic surfactant includes at least one of bis(dodecyl)dimethylammonium chloride, bis(tetradecyl)dimethylammonium chloride, bis(octadecyl)dimethylammonium chloride, and bis(decyl)dimethylammonium bromide.

3. The adhesive remover according to claim 1, characterized in that, The multi-chain cationic surfactant includes at least one of trioctylmethylammonium chloride and ethoxylated tridecylmethylammonium chloride.

4. The adhesive remover according to claim 1, characterized in that, The single-chain cationic surfactant includes at least one of hexadecyltrimethylammonium chloride, octadecyltrimethylammonium chloride, tetradecyltrimethylammonium bromide, and cocamidopropyl hydroxysulfonate betaine.

5. The adhesive remover according to claim 1, characterized in that, The alcohol ether solvent includes at least one of propylene glycol butyl ether, diethylene glycol butyl ether, dipropylene glycol methyl ether, and tripropylene glycol methyl ether; and / or The alcohol solvents include at least one of n-propanol, isopropanol, ethanol, and tert-butanol.

6. The adhesive remover according to claim 1, characterized in that, The pH stabilizer includes at least one of sodium citrate, sodium bicarbonate, triethanolamine, and disodium hydrogen phosphate-citric acid complex; and / or The corrosion inhibitor includes at least one of benzotriazole, sodium silicate, dodecyl phosphate, and sodium molybdate.

7. The adhesive remover according to claim 1, characterized in that, The adhesive remover comprises, by weight percentage, 18%~25% propylene glycol butyl ether, 8%~12% n-propanol, 0.8%~1.5% dodecyl dimethyl ammonium chloride, 2%~4% hexadecyl trimethyl ammonium chloride, 0.8%~1.2% sodium citrate, 0.05%~0.15% benzotriazole, and the balance being water.

8. A method for removing adhesive, characterized in that, include: A substrate having an adhesive layer is placed in an adhesive remover and ultrasonically cleaned until the adhesive layer separates from the substrate, wherein the adhesive remover comprises the adhesive remover as described in any one of claims 1 to 7.

9. The adhesive removal method according to claim 8, characterized in that, The adhesive layer is made of at least one of ultraviolet-curable adhesive, moisture-curable reactive polyurethane sealant, and pressure-sensitive adhesive.

10. The adhesive removal method according to claim 8, characterized in that, The temperature for ultrasonic cleaning is 25℃~60℃; The ultrasonic cleaning time is 10 min to 60 min; The ultrasonic cleaning frequency is 45kHz~60kHz; The ultrasonic cleaning current is 1A~3A.

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