Auxiliary device for stable test of probe card in ultra-high temperature environment
By using a locking plate and locking ring structure made of low thermal expansion coefficient material on the probe card, the probe position is prevented from shifting during high-temperature testing, thus solving the problem of probe misalignment and improving the accuracy of testing and wafer yield.
Patent Information
- Application Number
- CN202511570012.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-30
- Publication Date
- 2025-12-26
AI Technical Summary
In high-temperature testing, the probe may shift position due to thermal expansion and contraction, affecting test accuracy and potentially scratching wafer pins, thus reducing wafer yield.
A stable testing auxiliary device consisting of a first locking plate, a PCB board, and a second locking plate is used to prevent probe displacement by using materials with low thermal expansion coefficients and multiple locking structures, including the connection and locking of the protrusion and the locking ring and the restriction of multiple fasteners.
It effectively prevents probe position displacement in ultra-high temperature environments, ensures test accuracy, avoids wafer pin damage, and improves wafer yield.
Smart Images
Figure CN121208596A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of probe card auxiliary testing, and particularly relates to a probe card stable testing auxiliary device in an ultrahigh temperature environment. BACKGROUND
[0002] In the field of semiconductor testing, a probe card is a core component installed on a chip testing machine and specially designed for radio frequency signal testing. The testing stability of the probe card directly determines the wafer yield and product reliability. With the iteration of semiconductor technology and the improvement of testing standards, the introduction of high-temperature testing in the wafer probe testing stage has become a necessary link for screening defective chips under high-temperature working conditions. Generally, compared with normal temperature testing, in high-temperature testing, various components such as a PCB board and a first locking ring used to limit the position of a probe piece will expand and contract with heat, which will cause the position of multiple probes to deviate, that is, the probe thermal expansion runout phenomenon occurs. The probe runout will not only cause abnormal contact between the probe and the wafer pin but also may scratch the pin, directly affecting the testing accuracy and ultimately causing the wafer yield to decrease. SUMMARY
[0003] In order to prevent the probe runout as much as possible, the present application provides a probe card stable testing auxiliary device in an ultrahigh temperature environment.
[0004] The probe card stable testing auxiliary device in an ultrahigh temperature environment provided by the present application adopts the following technical scheme: A probe card stable testing auxiliary device in an ultrahigh temperature environment includes a first locking plate, a PCB board and a second locking plate which are sequentially stacked, the first locking plate and the second locking plate press and lock the PCB board, the PCB board has a mounting groove, the first locking ring for locking the probe is arranged in the mounting groove, the first locking plate includes a protruding part near one end of the PCB board, and the protruding part and the first locking ring are jointly connected with a locking piece.
[0005] By adopting the above technical scheme, after the probe is fixed in the first locking ring by resin molding, in the ultrahigh temperature environment, as long as the thermal expansion range of the first locking plate and the second locking plate is not large, the thermal expansion range of the PCB board locked by the first locking plate and the second locking plate will also not be large, which is equivalent to limiting the deformation of the whole PCB board. Based on this design, the probe molded in the first locking ring can be prevented from running out. In addition, the connection locking of the protruding part and the first locking ring can further prevent the deformation of the first locking ring and prevent the probe from running out. In the present application, the locking of the first locking plate and the second locking plate on the two sides of the PCB board and the connection locking of the protruding part and the first locking ring are used to realize the double limitation of the deformation of the first locking ring and effectively prevent the probe installed on the first locking ring from running out.
[0006] Preferably, the protruding portion has a first set of connecting holes, the first locking ring has a second set of connecting holes, and the locking member is detachably connected to the first set of connecting holes and the second set of connecting holes.
[0007] Preferably, the first set of connecting holes has a plurality of first connecting holes, and the plurality of first connecting holes are uniformly distributed along the circumferential direction of the first locking ring, and the second set of connecting holes has a second connecting hole corresponding to each first connecting hole.
[0008] By adopting the above technical solution, the plurality of circumferentially distributed first connecting holes can effectively prevent the first locking ring from expanding outward.
[0009] Preferably, the material of the first locking ring is ceramic.
[0010] By adopting the above technical solution, the thermal expansion coefficient of ceramic is relatively small, and the material properties are stable.
[0011] Preferably, the first locking ring includes a plurality of through grooves for filling resin arranged transversely in the middle portion.
[0012] By adopting the above technical solution, the plurality of through grooves for filling resin, i.e., mounting probes, based on the above distribution form can be effectively limited from deforming by the plurality of circumferentially distributed locking members.
[0013] Preferably, the PCB has a plurality of first locking holes uniformly distributed around the mounting groove, and the first locking plate has a second locking hole corresponding to each first locking hole, and each first locking hole and the corresponding second locking hole are detachably connected with a first fastener.
[0014] By adopting the above technical solution, the plurality of first fasteners distributed around the mounting groove can better limit the overall deformation of the PCB and thereby limit the deformation of the first locking ring located in the first mounting groove.
[0015] Preferably, the PCB has a plurality of first mounting holes uniformly distributed around the plurality of first locking holes, and the second locking plate has a second mounting hole corresponding to each first mounting hole, and each first mounting hole and the corresponding second mounting hole are detachably connected with a second fastener.
[0016] By adopting the above technical solution, the deformation of the PCB is further limited based on the plurality of second fasteners.
[0017] Preferably, the second locking plate includes a second locking ring, one end of the first locking ring close to the second locking plate is an outward protruding portion, and the outward protruding portion is inserted into the second locking ring.
[0018] By adopting the above technical solution, the deformation of the outward protruding portion is limited by the second locking ring, thereby limiting the deformation of the first locking ring.
[0019] Preferably, the second locking plate further comprises a frame and a plurality of connecting rods connected to the frame, the plurality of connecting rods are located in the frame, the plurality of connecting rods are evenly distributed along the outer periphery of the frame and the accommodating space is formed between adjacent connecting rods, and the second locking ring is fixed in the frame through the plurality of connecting rods.
[0020] By adopting the above technical scheme, the accommodating space can accommodate the external electronic components and connect with the PCB, and the plurality of connecting rods can limit the deformation of the second locking ring.
[0021] In summary, the present application has at least one of the following beneficial technical effects: 1. After the probe is fixed in the first locking ring by resin molding, in the ultrahigh temperature environment, as long as the thermal expansion range of the first locking plate and the second locking plate is not large, the thermal expansion range of the PCB locked by the first locking plate and the second locking plate will also not be large, which is equivalent to limiting the deformation of the whole PCB, and based on this design, the probe molded in the first locking ring can be prevented from running; in addition, the connection locking of the protruding part and the first locking ring can further prevent the deformation of the first locking ring and prevent the probe from running. In this application, the locking of the first locking plate and the second locking plate on both sides of the PCB and the connection locking of the protruding part and the first locking ring are used to realize the double limitation of the deformation of the first locking ring and effectively prevent the probe installed on the first locking ring from running. 2. The plurality of first fasteners distributed around the mounting groove can better limit the overall deformation of the PCB and limit the deformation of the first locking ring located in the first mounting groove, the deformation of the PCB is further limited by the plurality of second fasteners, and the deformation of the outer protruding part is limited by the second locking ring, thereby limiting the deformation of the first locking ring. BRIEF DESCRIPTION OF DRAWINGS
[0022] Figure 1 is an exploded view of the probe card stable testing auxiliary device in the embodiment of the present application in the ultrahigh temperature environment; Figure 2 is a structural schematic view for embodying the first locking plate.
[0023] Markings in the drawings: 1, first locking plate; 11, protruding part; 111, first butt joint hole; 12, second locking hole; 13, window; 2, PCB; 21, mounting groove; 22, step part; 23, first locking hole; 24, first mounting hole; 3, second locking plate; 31, accommodating space; 32, second mounting hole; 33, frame; 34, connecting rod; 4, first locking ring; 41, through groove; 42, second butt joint hole; 5, second locking ring. DETAILED DESCRIPTION
[0024] The application will be described in further detail below with reference to the drawings.
[0025] In the description of the present application, it should be understood that the orientation description, such as the orientation or position relationship indicated by up, down, front, back, left, right and the like, is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.
[0026] The embodiment of the present application discloses a probe card stable testing auxiliary device under super high temperature environment. It is used to prevent the probe from running position under super high temperature environment as much as possible. In the embodiment, the super high temperature environment refers to 150 DEG C or above.
[0027] With reference to Figure 1 , the probe card stable testing auxiliary device under super high temperature environment comprises a first locking plate 1, a PCB plate 2 and a second locking plate 3 which are stacked from top to bottom in sequence. The first locking plate 1 and the second locking plate 3 press and lock the PCB plate 2. The first locking plate 1, the PCB plate 2 and the second locking plate 3 are all made of materials with low thermal expansion coefficient. The thermal expansion coefficient of the first locking plate 1 and the second locking plate 3 is about 30% less than that of the PCB plate 2. It should be noted that the material of the PCB plate 2 has certain requirements, so it is difficult to directly select a material with extremely low thermal expansion coefficient.
[0028] With reference to Figure 1 , the PCB plate 2 has a mounting groove 21 at the middle position. The mounting groove 21 comprises a stepped portion 22. A first locking ring 4 for locking the probe is clamped in the mounting groove 21. The first locking ring 4 is in transition fit with the mounting groove 21. The upper end of the first locking ring 4 is flush with the stepped portion 22. Figure 2 The first locking plate 1 comprises a protruding portion 11 close to one end of the PCB plate 2. The protruding portion 11 and the first locking ring 4 are jointly connected with a locking piece. The protruding portion 11 can be inserted into the mounting groove 21 and abut with the upper end of the first locking ring 4. The second locking plate 3 comprises a second locking ring 5. One end of the first locking ring 4 close to the second locking plate 3 is an outward protruding portion which is inserted into the second locking ring 5.
[0029] In this application, the probe can be integrally molded into the first locking ring 4 using resin. When exposed to ultra-high temperatures, the thermal expansion of the first locking plate 1 and the second locking plate 3 is small, and consequently, the thermal expansion of the PCB board 2 locked by the first and second locking plates 1 and 3 is also small. This effectively limits the deformation of the entire PCB board 2. Since the difference in thermal expansion between the first locking plate 1, the second locking plate 3, and the PCB board 2 is small, the internal stress generated when the PCB board 2 is restricted in its deformation is usually not too high, and the structure of the PCB board 2 remains stable. Consequently, the shape of the first locking ring 4 is constrained by the entire PCB board 2. Based on this design, probe displacement within the first locking ring 4 can be prevented. Furthermore, the connection and locking between the protrusion 11 and the first locking ring 4 further prevents deformation of the first locking ring 4 and thus prevents probe displacement. The cooperation between the outward protrusion and the second locking ring 5 further restricts the deformation of the first locking ring 4. In this application, the locking of both sides of the PCB board 2 by the first locking plate 1 and the second locking plate 3, as well as the connection and locking of the protrusion 11 with the first locking ring 4, achieves a dual restriction on the deformation of the first locking ring 4, thereby effectively preventing the probe installed on the first locking ring 4 from shifting.
[0030] Reference Figure 1 Specifically, the first locking ring 4 includes multiple transversely arranged through grooves 41 for filling resin in the middle, and the probe is generally integrally molded into the through grooves 41 by resin casting. To ensure the reliable shape of the first locking ring 4, the first locking ring 4 is made of ceramic, which has an extremely low coefficient of thermal expansion.
[0031] Reference Figure 1 and Figure 2 Specifically, the protrusion 11 has multiple first mating holes 111, which are evenly distributed along the outer periphery of the first locking ring 4. In this embodiment, corresponding to the distribution pattern of the through slots 41, there are two first mating holes 111, which are located on both sides of the multiple through slots 41. The first locking ring 4 has a second mating hole 42 corresponding to each first mating hole 111. Locking elements are detachably connected to the first mating hole 111 and the second mating hole 42. The locking elements are, for example, bolts. The multiple locking elements distributed around the ring effectively prevent the first locking ring 4 from expanding and deforming outward.
[0032] Reference Figure 1 and Figure 2, the PCB board 2 has a plurality of first locking holes 23 which are evenly distributed around the mounting groove 21, the first locking plate 1 has a second locking hole 12 corresponding to each first locking hole 23, each first locking hole 23 and the corresponding second locking hole 12 are detachably connected with a first fastener, for example, a screw. The PCB board 2 has a plurality of first mounting holes 24 which are evenly distributed around the plurality of first locking holes 23, the second locking plate 3 has a second mounting hole 32 corresponding to each first mounting hole 24, each first mounting hole 24 and the corresponding second mounting hole 32 are detachably connected with a second fastener, also for example, a screw. Of course, in this embodiment, in order to ensure that the extrusion locking of the first locking plate 1 and the second locking plate 3 to the PCB board 2 is reliable, a plurality of second locking holes 12 are also distributed in the middle area of the first locking plate 1, and a plurality of second mounting holes 32 are also distributed in the middle area of the second locking plate 3.
[0033] The plurality of first fasteners distributed around the mounting groove 21 can better limit the overall deformation of the PCB board 2 and thereby limit the deformation of the first locking ring 4 located in the first mounting groove 21, and the plurality of second fasteners further limit the deformation of the PCB board 2.
[0034] Referring to Figure 1 The second locking plate 3 further includes a frame 33 and four connecting rods 34 connected to the frame 33, the four connecting rods 34 are located in the frame 33, the four connecting rods 34 are evenly distributed along the outer circumferential direction of the frame 33 and form an accommodation space 31 between adjacent connecting rods 34, and the second locking ring 5 is fixed to the middle position in the frame 33 through the plurality of connecting rods 34. The first locking plate 1 also has a plurality of windows 13, and the accommodation space 31 and the window 13 are mainly used for connecting external electronic components with the PCB board 2. The present application can limit the deformation of the PCB board 2 as much as possible without affecting the use of the PCB board 2 as much as possible.
[0035] The implementation principle of the probe card stable test auxiliary device in the embodiment of the present application is as follows: When the probe is integrally formed and fixed in the first locking ring 4, when it is in an ultrahigh temperature environment, since the thermal expansion range of the first locking plate 1 and the second locking plate 3 is not large, the thermal expansion range of the PCB board 2 locked by the first locking plate 1 and the second locking plate 3 will also not be large, which is equivalent to limiting the overall deformation of the PCB board 2, and the form of the first locking ring 4 is limited by the overall PCB board 2, based on this design, the probe formed in the first locking ring 4 can be prevented from running out of position; The connection and locking of the protruding part 11 and the first locking ring 4 can further prevent the deformation of the first locking ring 4 and thereby prevent the probe from running out of position, and the cooperation of the outer protruding part and the second locking ring 5 can further limit the deformation of the first locking ring 4.
[0036] The embodiments of the present application are preferred embodiments of the present application, and are not intended to limit the protection scope of the present application, and thus: any equivalent changes made according to the structure, shape, principle of the present application should be covered within the protection scope of the present application.
Claims
1. A probe card stable testing auxiliary device under ultra-high temperature environment, characterized in that: The device includes a first locking plate (1), a PCB board (2), and a second locking plate (3) stacked in sequence. The first locking plate (1) and the second locking plate (3) press and lock the PCB board (2). The PCB board (2) has a mounting groove (21). The mounting groove (21) is provided with a first locking ring (4) for locking the probe. The first locking plate (1) includes a protrusion (11) near one end of the PCB board (2). The protrusion (11) and the first locking ring (4) are connected together with a locking element.
2. The probe card stable testing auxiliary device under ultra-high temperature environment according to claim 1, characterized in that: The protrusion (11) has a first mating hole (111), the first locking ring (4) has a second mating hole (42), and the locking member is detachably connected to the first mating hole (111) and the second mating hole (42).
3. The probe card stable testing auxiliary device under ultra-high temperature environment according to claim 2, characterized in that: The first docking hole (111) has multiple holes, and the multiple first docking holes (111) are evenly distributed along the outer periphery of the first locking ring (4). The second docking hole (42) is also provided for each first docking hole (111).
4. The probe card stable testing auxiliary device under ultra-high temperature environment according to claim 3, characterized in that: The first locking ring (4) is made of ceramic.
5. The probe card stable testing auxiliary device under ultra-high temperature environment according to claim 3, characterized in that: The first locking ring (4) includes a plurality of transversely arranged through grooves (41) for filling resin in the middle.
6. The probe card stable testing auxiliary device under ultra-high temperature environment according to claim 1, characterized in that: The PCB board (2) has a plurality of first locking holes (23), which are evenly distributed around the mounting groove (21). The first locking plate (1) has a second locking hole (12) corresponding to each first locking hole (23). Each first locking hole (23) and the corresponding second locking hole (12) are detachably connected to a first fastener.
7. The probe card stable testing auxiliary device under ultra-high temperature environment according to claim 6, characterized in that: The PCB board (2) has a plurality of first mounting holes (24), which are evenly distributed around a plurality of first locking holes (23). The second locking plate (3) has a second mounting hole (32) corresponding to each first mounting hole (24). Each first mounting hole (24) and the corresponding second mounting hole (32) are detachably connected to a second fastener.
8. The probe card stable testing auxiliary device under ultra-high temperature environment according to claim 1, characterized in that: The second locking plate (3) includes a second locking ring (5), and the end of the first locking ring (4) near the second locking plate (3) is an outward protrusion, which is fitted and inserted into the second locking ring (5).
9. The probe card stable testing auxiliary device under ultra-high temperature environment according to claim 8, characterized in that: The second locking plate (3) also includes a frame (33) and a plurality of connecting rods (34) connected to the frame (33). The plurality of connecting rods (34) are located inside the frame (33). The plurality of connecting rods (34) are evenly distributed along the outer periphery of the frame (33) and an accommodating space (31) is formed between adjacent connecting rods (34). The second locking ring (5) is fixed inside the frame (33) by the plurality of connecting rods (34).