Modularized flow guide and heat dissipation control system for industrial control mainboard

Abstract

The invention provides a modular flow guide heat dissipation control system for an industrial control mainboard, and relates to the technical field of heat dissipation control. A heat flow distribution matrix is constructed through heat source distribution characteristics of all heat dissipation sub-modules; determining a parameterized geometric model of the diversion channel according to the heat flow distribution matrix, and performing nonlinear multi-objective optimization on the parameterized geometric model to obtain optimized diversion control parameters; according to the flow guide control parameters, differentiated segmented design is carried out on each heat dissipation sub-module, stand column type micro-rib configuration is obtained, and then uniform-temperature heat dissipation factors are determined through the stand column type micro-rib configuration; determining a diversion heat dissipation instruction based on the environment temperature vector, the uniform temperature heat dissipation factor and the heat flow distribution matrix; different heat dissipation sub-modules of the industrial control mainboard are driven through the flow guide heat dissipation instruction to conduct self-adaptive flow guide, a uniform heat dissipation index is obtained, self-adaptive uniform temperature adjustment and intelligent flow guide control in the multi-module heat dissipation process of the industrial control mainboard can be achieved, and the operation stability of the mainboard is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation control, and more particularly to a modularized flow-guiding heat dissipation control system for an industrial control mainboard. BACKGROUND

[0002] With the continuous improvement of the integration of electronic devices, heat dissipation control technology has become a key link affecting system reliability and service life. Traditional heat dissipation methods mainly include natural convection, air cooling and liquid cooling methods, which reduce the working temperature of electronic components through heat sinks, fans or cooling liquids. However, such heat dissipation methods often only focus on the discharge of overall heat, lack of targetedness and dynamic adjustment capability, and are prone to local overheating and uneven heat dissipation under complex working conditions.

[0003] In the field of industrial control, the mainboard, as the core control unit, integrates multiple different heat sources such as processors, power chips, memories and interface circuits. In view of the characteristics of multiple heat sources distributed on the industrial control mainboard, the modularized flow-guiding heat dissipation method divides different heat dissipation areas on the mainboard to realize the rapid transfer of local heat and the improvement of overall heat dissipation efficiency. However, the existing modularized flow-guiding heat dissipation method for industrial control mainboard still has obvious defects: first, the flow-guiding channel design of the industrial control mainboard is mostly fixed structure, lacking parameterization and optimization means, and it is difficult to adapt to different loads and working environments; second, the temperature uniformity between different heat dissipation areas is insufficient, which easily causes some devices to be in high temperature state for a long time, affecting the system reliability; and the heat dissipation control method is mostly static adjustment, which fails to combine real-time temperature feedback and intelligent scheduling, resulting in low heat dissipation efficiency and inability to cope with complex and variable operating conditions. Therefore, how to realize adaptive temperature uniformity adjustment and intelligent flow-guiding control of the multi-module heat dissipation process of the industrial control mainboard to improve the stability of the mainboard operation is a difficult problem faced by the industry. SUMMARY

[0004] The present application provides a modularized flow-guiding heat dissipation control system for an industrial control mainboard, which can realize adaptive temperature uniformity adjustment and intelligent flow-guiding control of the multi-module heat dissipation process of the industrial control mainboard to improve the stability of the mainboard operation.

[0005] The present application provides a modularized flow-guiding heat dissipation control system for an industrial control mainboard, which comprises: a heat flow division module for dividing the industrial control mainboard into different heat dissipation sub-modules, and constructing a heat flow distribution matrix based on the heat source distribution characteristics of all the heat dissipation sub-modules; a flow-guiding parameter optimization module for determining a parameterized geometric model of a flow-guiding channel according to the heat flow distribution matrix, and performing nonlinear multi-objective optimization on the parameterized geometric model to obtain optimized flow-guiding control parameters; The uniform temperature heat dissipation module is used for differentiating and segmenting each heat dissipation sub-module according to the flow guide control parameter to obtain a column type micro-rib configuration, and then locally compensates the flow guide channel through the column type micro-rib configuration to obtain a uniform temperature heat dissipation factor. The scheduling control module is used for determining an environmental temperature vector of the industrial control mainboard, determining a flow guide heat dissipation instruction based on the environmental temperature vector, the uniform temperature heat dissipation factor and the heat flow distribution matrix. The dynamic monitoring module is used for driving different heat dissipation sub-modules of the industrial control mainboard to adaptively guide flow through the flow guide heat dissipation instruction to obtain a uniform heat dissipation index.

[0006] In the embodiment, the division of the industrial control mainboard into different heat dissipation sub-modules specifically includes: Obtaining device layout information of the industrial control mainboard; According to the device layout information, the industrial control mainboard is divided into a central processing unit region, a power device region, a storage controller and an interface region, and then different heat dissipation sub-modules are obtained.

[0007] In the embodiment, the heat flow distribution matrix is constructed based on the heat source distribution characteristics of all heat dissipation sub-modules, which specifically includes: Determining the heat source distribution characteristics of all heat dissipation sub-modules; According to the spatial position relationship of all heat dissipation sub-modules, the heat source distribution characteristics are coordinate mapped to obtain heat flow distribution coordinates; The heat flow distribution coordinates are nonlinearly fitted by using a radial basis function network, and then a heat flow distribution matrix is obtained.

[0008] In the embodiment, the parameterized geometric model of the flow guide channel is determined according to the heat flow distribution matrix, which specifically includes: The heat flow distribution matrix is subjected to principal component extraction to obtain the heat flow density of each heat dissipation sub-module; The geometric direction of the flow guide channel in the flow guide plate is determined according to the heat flow density of all heat dissipation sub-modules; The geometric direction is converted into a geometric parameter, and the geometric parameter is coupled and mapped to obtain a parameterized geometric model of the flow guide channel.

[0009] In the embodiment, the parameterized geometric model is subjected to nonlinear multi-objective optimization to obtain the optimized flow guide control parameter, which specifically includes: A cross-section gradient function of the flow guide channel of the flow guide plate is constructed, and then the transition curvature and cross-section gradient of the flow guide channel are determined through the cross-section gradient function; The number, thickness and inclination angle of the flow guide plate are parameterized to obtain a parameter vector of the flow guide plate. Solving the transition curvature, the cross-sectional gradient and the parameter vector iteratively based on a genetic algorithm and a radial basis function to obtain optimized flow guide control parameters.

[0010] In the embodiment, each heat dissipation sub-module is designed differently according to the flow guide control parameters to obtain a columnar micro-rib configuration, which specifically includes: Collecting heat flow distribution intensities of each heat dissipation sub-module; Determining heat flow micro-rib intervals according to all the heat flow distribution intensities; Simulating a heat flow field of the industrial control mainboard according to the heat flow micro-rib intervals and the flow guide control parameters to obtain a columnar micro-rib configuration for channel flow guide and heat dissipation.

[0011] In the embodiment, the columnar micro-rib configuration is used to locally compensate the temperature of the flow guide channel to obtain an isothermal heat dissipation factor, which specifically includes: Simulating the temperature of the flow guide channel according to the columnar micro-rib configuration, and then extracting a temperature compensation interval and a temperature difference convergence domain of each heat dissipation sub-module; Determining a heat flow gradient according to all the temperature compensation intervals; Determining a local heat exchange efficiency of the flow guide channel through the heat flow gradient and all the temperature difference convergence domains; Iteratively compensating a temperature simulation process of the flow guide channel based on the local heat exchange efficiency to obtain an isothermal heat dissipation factor.

[0012] In the embodiment, the environmental temperature vector of the industrial control mainboard is determined, which specifically includes: Collecting a temperature sample set through a temperature sensor array; Constructing an environmental temperature distribution field based on the temperature sample set using a three-dimensional interpolation algorithm, and then performing principal component analysis on the environmental temperature distribution field to obtain an environmental temperature vector.

[0013] In the embodiment, a flow guide heat dissipation instruction is determined based on the environmental temperature vector, the isothermal heat dissipation factor and the heat flow distribution matrix, which specifically includes: Constructing a finite state machine control model based on the isothermal heat dissipation factor; The finite state machine control model determines an environmental temperature condition according to the environmental temperature vector; The finite state machine control model determines a heat flow load distribution according to the heat flow distribution matrix; Determining a flow guide heat dissipation instruction of an industrial control mainboard operating state through the environmental temperature condition and the heat flow load distribution.

[0014] In the embodiment, the parameterized geometric model is a three-dimensional set model.

[0015] The technical scheme provided by the embodiments disclosed in the application has the following beneficial effects: By dividing the industrial control mainboard into different heat dissipation submodules, a heat flow distribution matrix is constructed based on the heat source distribution characteristics of all the heat dissipation submodules; the parameterized geometric model of the flow guide channel is determined according to the heat flow distribution matrix, the flow guide control parameter is obtained by performing nonlinear multi-objective optimization on the parameterized geometric model; the flow guide control parameter is used to perform differential segmentation design on each heat dissipation submodule to obtain a columnar micro-rib configuration, and then the columnar micro-rib configuration is used to perform local temperature compensation on the flow guide channel to obtain a uniform heat dissipation factor; the environmental temperature vector of the industrial control mainboard is determined, and the flow guide heat dissipation instruction is determined based on the environmental temperature vector, the uniform heat dissipation factor and the heat flow distribution matrix; and the different heat dissipation submodules of the industrial control mainboard are driven to perform adaptive flow guiding through the flow guide heat dissipation instruction to obtain a uniform heat dissipation index.

[0016] As can be seen from the above, in the present application, adaptive uniform temperature regulation and intelligent flow guiding control of the multi-module heat dissipation process of the industrial control mainboard can be realized. First, the heat source layout and heat flow intensity distribution of different functional areas of the mainboard are obtained, which provides full input conditions for subsequent flow guiding design and differential heat dissipation strategy; and the parameterized geometric model of the flow guide channel is established according to the heat flow distribution matrix, and the number, curvature and thickness of the channel are iteratively solved by combining the nonlinear multi-objective optimization method, which can form an optimized balance between heat dissipation efficiency and fluid resistance, and provide accurate geometric parameter support for efficient and controllable heat dissipation structure; secondly, differential segmentation design is performed on the heat dissipation submodules based on the optimized flow guide control parameter to obtain a columnar micro-rib configuration, and local temperature compensation is performed combined with the configuration, which can realize heat flow balance between high heat flow density areas and low heat flow density areas, thereby generating a uniform heat dissipation factor, which is conducive to inhibiting local overheating of the industrial control mainboard; then, the environmental temperature vector under the running environment of the mainboard is collected and constructed, and the flow guide heat dissipation instruction is generated by combining the uniform heat dissipation factor and the heat flow distribution matrix, which can enable the system to dynamically adjust the heat dissipation strategy according to the real-time temperature condition and load state, thereby realizing active heat dissipation control based on feedback information; finally, the flow guide heat dissipation instruction is executed to drive the adaptive flow guiding of different heat dissipation submodules, and then the temperature difference is collected and counted to generate a uniform heat dissipation index, so that the heat dissipation process has closed-loop optimization capability and can continuously correct and compensate during operation, thereby realizing adaptive uniform temperature regulation and intelligent flow guiding control of the multi-module heat dissipation process, which is conducive to improving the heat dissipation balance and operation stability of the industrial control mainboard.

[0017] In summary, the technical scheme adopted in the present application can realize adaptive uniform temperature regulation and intelligent flow guiding control of the multi-module heat dissipation process of the industrial control mainboard to improve the stability of the mainboard operation. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only illustrate some of the embodiments of the present application, and other drawings can be obtained by those of ordinary skill in the art without any creative effort.

[0019] Figure 1 is a module structure diagram of a modular flow-guiding heat dissipation control system for an industrial control mainboard according to the present application; Figure 2 is a flow diagram of determining a parameterized geometric model of a flow-guiding channel in some embodiments of the present application; Figure 3 is an exemplary flow diagram of determining a columnar micro-rib configuration in some embodiments of the present application. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be described clearly and completely in the following with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without any creative effort fall within the scope of protection of the present application.

[0021] The embodiments of the present application provide a modular flow-guiding heat dissipation control system for an industrial control mainboard. The core of the system is to divide the industrial control mainboard into different heat dissipation sub-modules, construct a heat flow distribution matrix based on the heat source distribution characteristics of all the heat dissipation sub-modules, determine a parameterized geometric model of a flow-guiding channel according to the heat flow distribution matrix, perform nonlinear multi-objective optimization on the parameterized geometric model to obtain optimized flow-guiding control parameters, perform differential segmented design on each heat dissipation sub-module according to the flow-guiding control parameters to obtain a columnar micro-rib configuration, then perform local temperature compensation on the flow-guiding channel through the columnar micro-rib configuration to obtain a uniform heat dissipation factor, determine an environmental temperature vector of the industrial control mainboard, determine flow-guiding heat dissipation instructions based on the environmental temperature vector, the uniform heat dissipation factor and the heat flow distribution matrix, and drive different heat dissipation sub-modules of the industrial control mainboard to perform self-adaptive flow guiding through the flow-guiding heat dissipation instructions to obtain a uniform heat dissipation index.

[0022] In order to better understand the above technical solutions, the above technical solutions will be described in detail in the following with reference to the drawings in the specification and specific embodiments. Refer to Figure 1As shown in the figure, the figure is a module structure diagram of a modularized flow guide heat dissipation control system for an industrial control mainboard provided in the application, the control system comprising: a heat flow division module 100, a flow guide parameter optimization module 200, a uniform temperature heat dissipation module 300, a scheduling control module 400 and a dynamic monitoring module 500, which are described as follows: The heat flow division module 100 is used for dividing the industrial control mainboard into different heat dissipation sub-modules, and a heat flow distribution matrix is constructed based on the heat source distribution characteristics of all the heat dissipation sub-modules.

[0023] In this embodiment, the industrial control mainboard is divided into different heat dissipation sub-modules in the following manner: Obtain the device layout information of the industrial control mainboard; According to the device layout information, the industrial control mainboard is divided into a central processor region, a power device region, a storage controller and an interface region, and different heat dissipation sub-modules are obtained.

[0024] In specific implementation, first, the device layout information of the industrial control mainboard can be exported from an electronic design automation software, and the device layout information includes: an industrial control mainboard layer file, an assembly file, a device bill of materials, an electrical connection table and a three-dimensional model file of the industrial control mainboard, wherein the industrial control mainboard layer file is used to represent the frame and the slotted hole of the industrial control mainboard, the assembly file includes: device reference number, center coordinates, rotation angle, package name and height information, the device bill of materials includes device category and function description information, and the electrical connection table is used to identify the power phase and the key signal; then, a polar coordinate system is constructed with the lower left corner of the industrial control mainboard as the origin and in millimeter units, the device layout information of the industrial control mainboard is mapped to the polar coordinate system through Python, and then the center coordinates of the central processor region, the power device region, the storage controller and the interface region are extracted in the polar coordinate system through a feature extraction algorithm, and the central processor region, the power device region, the storage controller and the interface region obtained by division according to the center coordinates are divided by an edge detection algorithm to obtain different heat dissipation sub-modules; It should be noted that the heat dissipation sub-modules in the application include: the central processor region, the power device region, the storage controller and the interface region, and preferably, the feature extraction algorithm can be pre-trained through the device layout information of the industrial control mainboard, and then the pre-trained feature extraction algorithm is used to extract the center coordinates, which is beneficial to improve the granularity of module division.

[0025] In this embodiment, the heat flow distribution matrix can be constructed based on the heat source distribution characteristics of all the heat dissipation sub-modules in the following manner: Determine the heat source distribution characteristics of all the heat dissipation sub-modules; Based on the spatial relationship of all heat dissipation submodules, coordinate mapping is performed on the heat source distribution characteristics to obtain the heat flow distribution coordinates; The heat flux distribution coordinates are nonlinearly fitted using a radial basis function network to obtain the heat flux distribution matrix.

[0026] In specific implementation, firstly, the temperature of each heat dissipation submodule can be collected by a thermistor sensor under the standard operating conditions of the industrial control motherboard to obtain the heat source intensity and heat source distribution range of each heat dissipation submodule. This heat source intensity and distribution range are then used as the heat source distribution characteristics of the heat dissipation submodules, resulting in the heat source distribution characteristics of all heat dissipation submodules. Next, using the center coordinates of each heat dissipation submodule as a reference point, coordinate mapping is performed on the heat source distribution characteristics according to the hierarchical coordinate system of the industrial control motherboard to obtain the heat flow distribution coordinates of each heat dissipation submodule in the hierarchical coordinate system. Finally, a radial basis function network is used to perform nonlinear fitting on all heat flow distribution coordinates. By iteratively solving the weight parameters of the fitting function, the fitting result can truly reflect the spatial heat flow distribution state of the industrial control motherboard, thus obtaining the heat flow distribution matrix.

[0027] It should be noted that the heat flow distribution matrix in this application is a two-dimensional numerical matrix that characterizes the heat flow intensity distribution relationship and spatial coupling characteristics among the heat dissipation submodules of the industrial control motherboard. This heat flow distribution matrix can reflect the heat flow conduction trend and heat load distribution of different heat dissipation submodules in the overall thermal environment. The rows of the heat flow distribution matrix represent the heat dissipation submodule number, and the columns of the heat flow distribution matrix represent the heat flow intensity of the heat dissipation submodule at different coordinate points, which is used to provide a quantitative basis for the construction of the geometric model of the flow channel and the optimization of heat dissipation. In this embodiment, the kernel function of the radial basis function network can be selected as a Gaussian function, which is convenient to enhance the sensitivity to local heat flow changes during the fitting process.

[0028] The flow guiding parameter optimization module 200 is used to determine the parameterized geometric model of the flow guiding channel based on the heat flow distribution matrix, and to perform nonlinear multi-objective optimization on the parameterized geometric model to obtain the optimized flow guiding control parameters.

[0029] Preferred, Reference Figure 2 As shown in the figure, this is a flowchart illustrating the process of determining the parameterized geometric model of the flow guiding channel in this embodiment. The determination of the parameterized geometric model of the flow guiding channel based on the heat flux distribution matrix in this embodiment can be achieved through the following steps: First, in step S21, principal component extraction is performed on the heat flux distribution matrix to obtain the heat flux density of each heat dissipation submodule; Then, in step S22, the geometric direction of the flow channel in the flow guide plate is determined based on the heat flux density of all heat dissipation submodules; Finally, in step S23, the geometric direction is converted into a geometric parameter, and the geometric parameter is coupled and mapped to obtain a parameterized geometric model of the flow guide channel.

[0030] In a specific implementation, first, the principal component with the largest contribution in the heat flow distribution matrix is extracted by singular value decomposition, and the numerical result corresponding to the principal component is taken as the heat flux density of each heat dissipation sub-module, so as to obtain the heat flux densities of all heat dissipation sub-modules; then, the geometric direction of the flow guide channel is determined according to the heat flux densities of the heat dissipation sub-modules, taking the level coordinate system of the industrial control mainboard as the reference coordinate system, specifically: when the heat flux density of a certain heat dissipation sub-module is significantly higher than those of other heat dissipation sub-modules, the geometric direction of the flow guide channel is preferentially pointed to the center point of the heat dissipation sub-module to enhance the heat flow export efficiency, and when the heat flux density distribution is relatively balanced, the geometric direction of the flow guide channel is set to be parallel to the diagonal direction of the polar coordinate system to ensure the balance of the overall flow field distribution; finally, the geometric direction is converted according to the angle value, length value and channel cross-section width to obtain geometric parameters including the direction angle of the flow guide channel, the channel length and the channel cross-section width, and the geometric parameters and the polar coordinate system are combined through the polar coordinate mapping and parameter coupling technology in Python, so as to generate the parameterized geometric model of the flow guide channel, wherein the channel cross-section width can be determined by the industrial parameters of the flow guide plate used by the industrial control mainboard, and the flow guide plate is used for heat dissipation of the industrial control mainboard through flow guide.

[0031] It should be noted that the parameterized geometric model in the present application is a three-dimensional set model, which is used to describe the direction, length, cross-section shape and positional relationship of the flow guide channel in space, and can provide complete geometric input conditions for multi-objective optimization; preferably, in actual application, the three-dimensional set model can be modeled in the manner of voxel set combined with triangular mesh set, which can ensure geometric accuracy while taking into account calculation efficiency.

[0032] In the present embodiment, the parameterized geometric model is subjected to nonlinear multi-objective optimization to obtain the optimized flow guide control parameters, which can be achieved in the following manner, namely: A cross-section gradient function of the flow guide channel of the flow guide plate is constructed, and then the transition curvature and cross-section gradient of the flow guide channel are determined through the cross-section gradient function; The number, thickness and inclination angle of the channels of the flow guide plate are parameterized to obtain a parameter vector of the flow guide plate; The transition curvature, the cross-section gradient and the parameter vector are iteratively solved based on the genetic algorithm and the radial basis function to obtain the optimized flow guide control parameters.

[0033] In specific implementation, firstly, the cross-sectional dimension data of the flow guide channel can be extracted using the industrial parameters of the flow guide plate through the industrial control motherboard. Then, the cross-sectional gradient function of the flow guide channel is obtained by fitting the cross-sectional dimension data using a polynomial function. This gradient function is used to calculate the rate of change of the cross-section between the start and end points of the channel, thereby obtaining the transition curvature and cross-sectional gradient of the flow guide channel. Next, the number of channels in the flow guide plate, the wall thickness of the flow guide channel, and the tilt angle of the flow guide channel relative to the plate-level coordinate system are represented by numerical parameters, constructing a parameter vector containing the number of channels, thickness, and tilt angle. This parameter vector represents the design variables of the flow guide channel in space. Finally, based on the iterative search capability of the genetic algorithm, the parameter vector is initialized and subjected to crossover and mutation operations. Simultaneously, the transition curvature and cross-sectional gradient are nonlinearly fitted using radial basis functions to establish an objective function. The objective function aims to maximize heat dissipation efficiency and minimize fluid resistance. The optimal solution after convergence of the optimization objective is obtained through iterative evolution calculation, and this optimal solution is used as the optimized flow guide control parameters.

[0034] It should be noted that the flow control parameters in this application refer to a set of adjustable parameters that control the geometry of the flow guide channel. This set of adjustable parameters includes the number, thickness, tilt angle, transition curvature, and cross-sectional gradient of the flow guide channel, which are used to represent the heat dissipation performance and flow characteristics of the flow guide channel. In this embodiment, through nonlinear multi-objective optimization, the flow control parameters can reach the global optimum under the condition of satisfying the balance between heat dissipation efficiency and flow resistance, which is beneficial to improving the overall flow cooling effect of the industrial control motherboard. The genetic algorithm can avoid getting trapped in local optima, and the fitting process of the radial basis function ensures the approximation accuracy of complex nonlinear relationships, which is beneficial to quickly obtain convergent solutions in multi-objective optimization.

[0035] The uniform temperature heat dissipation module 300 is used to perform differentiated segmentation design on each heat dissipation sub-module according to the flow guidance control parameters to obtain a column-type micro-rib configuration, and then to perform local temperature adjustment compensation on the flow guidance channel through the column-type micro-rib configuration to obtain a uniform temperature heat dissipation factor.

[0036] Preferred, Reference Figure 3 As shown, this figure is an exemplary flowchart for determining the column-type micro-rib configuration in this embodiment. In this embodiment, the column-type micro-rib configuration is obtained by performing differentiated segmentation design on each heat dissipation submodule according to the flow control parameters, which can be achieved by the following steps: First, in step S31, the heat flow distribution intensity of each heat dissipation submodule is collected; Then, in step S32, the heat flow microrib interval is determined based on all heat flow distribution intensities; Finally, in step S33, the heat flow field simulation is performed on the industrial control mainboard according to the heat flow micro-rib interval and the flow guide control parameter, and a columnar micro-rib configuration for channel flow guide and heat dissipation is obtained.

[0037] In a specific implementation, first, the heat flow of the central processor region, the power device region, the storage controller region and the interface region of the industrial control mainboard can be collected by using a thermistor sensor, and the temperature time sequence can be recorded by an industrial computer in cooperation with the thermistor sensor. Then, the temperature difference between adjacent sampling points in the same heat dissipation sub-module and the measurement interval can be calculated by a numerical calculation software in the industrial computer, and the heat flow distribution intensity of the heat dissipation sub-module can be obtained. Then, a heat flow intensity contour map can be generated on the coordinate system of the industrial control mainboard according to the heat flow distribution intensity of all heat dissipation sub-modules by using a visualization algorithm. The high-intensity threshold and the medium-intensity threshold can be set by threshold segmentation, for example, the first 20 percentiles are set as high intensity, the last 20 percentiles are set as low intensity, and the rest are set as medium intensity. The heat flow micro-rib interval is obtained, that is, the heat flow micro-rib interval includes a high-intensity heat flow micro-rib interval, a medium-intensity heat flow micro-rib interval and a low-intensity heat flow micro-rib interval. Finally, a columnar micro-rib candidate array can be generated in the flow guide channel of the flow guide plate by using a three-dimensional modeling software. Different column diameters, column heights and column spacings are allocated according to different intensity intervals. Then, a heat flow field simulation model containing the flow guide channel and the columnar micro-rib can be established by using a finite element simulation software. The thermal conductivity, the contact thermal resistance and the convective heat transfer boundary conditions can be read by the heat flow field simulation model. Then, the columnar micro-rib configuration can be obtained by combining the column diameter, the column height and the column spacing.

[0038] It should be noted that the columnar micro-rib configuration in the present application is a geometric parameter set (including column diameter, column height, column spacing and array direction) of the array-arranged columnar micro-rib in the flow guide channel and the partition arrangement configuration of the flow guide channel in the heat flow micro-rib interval. The columnar micro-rib configuration is used to increase the heat transfer area and induce near-wall disturbance to improve the local heat transfer coefficient. The temperature non-uniformity can be significantly reduced and the local overheating can be inhibited under the condition of meeting the flow guide control parameter constraint. The heat flow distribution intensity acquisition, the heat flow micro-rib interval division and the columnar micro-rib configuration determination in the present embodiment can be realized by the collaborative process of the thermistor sensor, the industrial computer, the numerical calculation software, the three-dimensional modeling software and the finite element simulation software.

[0039] In the present embodiment, the columnar micro-rib configuration is used to locally compensate the temperature of the flow guide channel, and the uniform heat dissipation factor can be obtained by the following method: The temperature simulation is performed on the flow guide channel according to the columnar micro-rib configuration, and then the temperature interval and the temperature difference convergence domain of each heat dissipation sub-module are extracted. The heat flow gradient is determined according to all the temperature intervals. determine the local heat exchange efficiency of the flow guide channel through the heat flow gradient and all temperature difference convergence domains; iteratively compensate a temperature regulation simulation process of the flow guide channel based on the local heat exchange efficiency to obtain an isothermal heat dissipation factor.

[0040] In a specific implementation, first, a three-dimensional geometric model of the flow guide channel including a columnar micro-rib configuration is imported into computer simulation software, and standard boundary conditions such as fluid inlet velocity, fluid inlet temperature, and outlet pressure are set at the channel inlet. The temperature regulation simulation of fluid and solid coupling of the flow guide channel is performed by the finite volume method to obtain temperature distribution curves of each heat dissipation sub-module at different positions, and then a smoothing algorithm is used to extract the temperature regulation interval and temperature difference convergence domain of each heat dissipation sub-module from the temperature distribution curves. Then, the temperature change rate between different regions is calculated through a rate calculation formula according to the temperature regulation interval of all heat dissipation sub-modules, and the temperature change rate is taken as the heat flow gradient, where the heat flow gradient is an index describing the direction and intensity of heat conduction at different positions in the flow guide channel. Finally, the heat flow gradient is coupled with all temperature difference convergence domains through the finite element simulation method to obtain the heat exchange efficiency of the local region corresponding to the temperature difference convergence domain. The heat exchange efficiency is numerically integrated and weighted averaged, and then a local heat exchange efficiency model of the flow guide channel as a whole is established based on the Newton cooling formula through the result of numerical integration and weighted averaging. The local heat exchange efficiency is obtained by solving the local heat exchange efficiency model, and the local heat exchange efficiency is iteratively adjusted based on an iterative algorithm to adjust the standard boundary conditions of the channel. When the temperature difference convergence at the outlet of the flow guide channel is a smooth curve, the local heat exchange efficiency at this time can be taken as the isothermal heat dissipation factor.

[0041] It should be noted that the isothermal heat dissipation factor in this application is a numerical index representing the uniformity of temperature distribution and the local temperature regulation compensation capability in the flow guide channel. The isothermal heat dissipation factor can describe the degree of temperature consistency of different heat dissipation sub-modules of the industrial control mainboard in the overall heat dissipation process, and is used to guide the generation of flow guide heat dissipation instructions by the subsequent scheduling control module. In this embodiment, the calculation and iterative compensation of the local heat exchange efficiency gradually reduce the temperature difference between high heat flow regions and low heat flow regions, which is beneficial to the operation stability of the industrial control mainboard under different load conditions.

[0042] The scheduling control module 400 is configured to determine an environmental temperature vector of the industrial control mainboard, and determine a flow guide heat dissipation instruction based on the environmental temperature vector, the isothermal heat dissipation factor, and the heat flow distribution matrix.

[0043] In this embodiment, the environmental temperature vector of the industrial control mainboard can be determined in the following manner, that is: collecting a temperature sample set by a temperature sensor array; A three-dimensional interpolation algorithm is used to construct an ambient temperature distribution field based on the temperature sample set, and then principal component analysis is performed on the ambient temperature distribution field to obtain an ambient temperature vector.

[0044] In a specific implementation, first, an array of temperature sensors is arranged at four corner points and a central region of the industrial control mainboard. Preferably, the array of temperature sensors uses thermistor temperature sensors, and the temperature of ambient air and the surface of the industrial control mainboard can be continuously collected at a sampling frequency of seconds by a data acquisition card to obtain a temperature sample set. Then, the collected temperature sample set is imported into a three-dimensional modeling software, and the length, width, and height of the industrial control mainboard are used as coordinate axes. A three-dimensional interpolation algorithm is used to numerically complete the temperature data between the temperature sample points to form an ambient temperature distribution field covering the entire spatial region of the industrial control mainboard. Principal component analysis is performed on all temperature values in the ambient temperature distribution field, that is, all temperature values are converted into principal component vectors, and the principal components with a cumulative contribution rate of more than 90% are extracted by a principal component analysis algorithm. Then, the principal components are used as an ambient temperature vector, which is used to represent the thermal environment state of the industrial control mainboard.

[0045] It should be noted that the ambient temperature vector in this application refers to a numerical vector of the overall temperature distribution characteristics of the air environment and the surface region around the industrial control mainboard. The ambient temperature vector can reflect the overall trend and main change direction of the external environment temperature and the surface temperature of the mainboard, and is used for subsequent generation and scheduling control of the flow guiding and heat dissipation instructions.

[0046] In this embodiment, the determination of the flow guiding and heat dissipation instructions based on the ambient temperature vector, the uniform temperature heat dissipation factor, and the heat flow distribution matrix can be performed in the following manner, that is: A finite state machine control model is constructed based on the uniform temperature heat dissipation factor. The finite state machine control model determines an ambient temperature condition according to the ambient temperature vector. The finite state machine control model determines a heat flow load distribution according to the heat flow distribution matrix. The flow guiding and heat dissipation instructions of the industrial control mainboard are determined by the ambient temperature condition and the heat flow load distribution.

[0047] In a specific implementation, first, the uniform heat dissipation factor can be taken as a state variable input to construct a finite state machine control model, wherein the finite state machine control model can divide the heat dissipation process of the industrial control mainboard into three basic states of a low temperature interval, a suitable temperature interval and a high temperature interval, and preset corresponding flow guide adjustment strategies for each state; then, the collected environmental temperature vector is input into the finite state machine control model, which can determine whether the environmental temperature vector falls into the low temperature interval, the suitable temperature interval or the high temperature interval based on a threshold judgment method, and then output an environmental temperature condition, which is based on the temperature distribution result of the external environment where the industrial control mainboard is located, and is used to represent the heat conduction constraint of the mainboard under different external environments; then, the heat flow distribution matrix is imported into the finite state machine control model, which can quantize the heat flow density of different heat dissipation submodules through matrix decomposition, and then output a heat flow load distribution, which refers to the heat flow distribution relationship formed according to the heat source intensity and the conduction path of each heat dissipation submodule, and is used to reflect the heat flow direction and the load concentration area of the whole mainboard; finally, the finite state machine control model logically combines the environmental temperature condition and the heat flow load distribution, matches the preset heat dissipation adjustment strategy through a table lookup method, and outputs a flow guide heat dissipation instruction in combination with the instruction format of the industrial computer of the industrial control mainboard, wherein the flow guide heat dissipation instruction includes a fan speed adjustment instruction, a flow guide plate angle adjustment instruction, a micro-rib region start-stop instruction and a power distribution instruction, wherein the fan speed adjustment instruction is used to adjust the speed of the fan in different heat dissipation submodule regions to change the local airflow; the flow guide plate angle adjustment instruction is used to drive the electric actuator of the flow guide plate to adjust the angle to change the direction of the flow guide channel; the micro-rib region start-stop instruction is used to control the local on-off of the columnar micro-rib heat dissipation unit; and the power distribution instruction is used to dynamically distribute the heat dissipation power of the power device region.

[0048] It should be noted that the flow guide heat dissipation instruction in the present application refers to a specific adjustment signal generated in combination with the environmental temperature condition and the heat flow load distribution, which can accurately control the opening degree, channel switching and heat dissipation submodule air duct direction of the flow guide plate, and is used to realize airflow redistribution and heat flow balance inside the industrial control mainboard; in addition, the finite state machine control model is a sequence control model based on state transition and condition judgment, which is used to switch the heat dissipation control strategy between different environmental temperature conditions and heat flow load distributions, and is beneficial to the dynamic adjustment of the flow guide heat dissipation process of the industrial control mainboard; the finite state machine control model realizes the simplified processing of complex heat dissipation conditions through state division and threshold judgment, which is beneficial to the real-time and stability of the heat dissipation adjustment process.

[0049] In addition, it should be noted that in the present application, the industrial control host board of the industrial computer refers to a central processing and control unit installed on the industrial control host board. The central processing and control unit is used to receive monitoring signals, analyze heat dissipation adjustment logic, and issue control instructions, thereby realizing real-time scheduling of the heat dissipation sub-module. The instruction format of the industrial computer can include an address field, a function code field, a data length field, a data field, and a check field. The address field is used to identify a specific heat dissipation sub-module. The function code field is used to indicate the type of operation to be performed. The data length field is used to mark the number of bytes in the data field. The data field is used to carry specific control parameter values. The check field is used for error detection and verification during data transmission to ensure the reliability of the heat dissipation instruction.

[0050] The dynamic monitoring module 500 is used to drive different heat dissipation sub-modules of the industrial control host board to perform adaptive flow guiding through the heat dissipation instruction, thereby obtaining uniform heat dissipation indicators.

[0051] In the present embodiment, the heat dissipation instruction is used to drive different heat dissipation sub-modules of the industrial control host board to perform adaptive flow guiding, thereby obtaining uniform heat dissipation indicators. The following methods can be used: The heat dissipation instruction is used to drive different heat dissipation sub-modules of the industrial control host board to perform flow guiding and heat dissipation, and then the temperature differences of each heat dissipation sub-module are collected. All temperature differences are statistically calculated to obtain heat dissipation indicators. Based on the heat dissipation indicators and a preset threshold, the process of heat dissipation is adaptively optimized to obtain uniform heat dissipation indicators.

[0052] In specific implementation, first, the heat dissipation instruction can be input to the industrial computer of the industrial control host board. The industrial computer drives the fan speed, the opening and closing angle of the flow guide plate, and the airflow direction in the heat dissipation channel, so that different heat dissipation sub-modules perform flow guiding and heat dissipation adjustment according to the heat dissipation instruction, and the temperature data of each heat dissipation sub-module is obtained. The temperature difference between adjacent heat dissipation sub-modules is taken as the temperature difference. Finally, all temperature differences are statistically calculated, for example, the average, variance, and maximum difference are calculated to form heat dissipation indicators, and the heat dissipation indicators are compared with a preset threshold. When the heat dissipation indicators exceed the preset threshold, the fan speed or the flow guide plate angle is iteratively compensated through the heat dissipation instruction until the temperature difference converges to a stable range interval. The range interval can be taken as the uniform heat dissipation indicator. The preset threshold can be preset according to the actual material and industrial environment of the industrial control host board, which is not limited here.

[0053] It should be noted that the uniform heat dissipation index in the present application refers to a numerical index reflecting the temperature difference degree between different heat dissipation sub-modules of the industrial control mainboard, and is used to evaluate the balance and effectiveness of the flow guiding and heat dissipation adjustment; wherein, the statistical calculation method of the temperature difference can be selected as the average value, the variance or the maximum difference value according to the actual needs, preferably, the maximum difference value can be used as the determination standard in the present embodiment, which is beneficial to intuitively represent the heat dissipation uniformity of the industrial control mainboard as a whole, and further improve the reliability of the mainboard operation.

[0054] In summary, the technical scheme adopted in the present application can realize the adaptive uniform temperature adjustment and intelligent flow guiding control of the multi-module heat dissipation process of the industrial control mainboard, so as to improve the stability of the mainboard operation.

[0055] The present application is described with reference to flowcharts and / or block diagrams of the methods, devices (systems) and computer program products according to the embodiments of the present application. It should be understood that each flow and / or block in the flowcharts and / or block diagrams, and the combination of the flows and / or blocks in the flowcharts and / or block diagrams can be realized by computer program instructions. These computer program instructions can be provided to the processor of a general-purpose computer, a special-purpose computer, an embedded processor or other programmable data processing devices to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing devices generate a means for implementing the functions specified in the flowcharts and / or block diagrams. Figure 1 The functions specified in one flow or multiple flows and / or blocks Figure 1 The functions specified in one flow or multiple flows and / or blocks

[0056] Those skilled in the art can understand that all or part of the steps of various methods in the above embodiments can be completed by instructing the relevant hardware by means of a program, and the program can be stored in a computer readable storage medium, including Read-Only Memory (ROM), Random Access Memory (RAM), Programmable Read-Only Memory (PROM), Erasable Programmable Read-Only Memory (EPROM), One-time Programmable Read-Only Memory (OTPROM), Electrically-Erasable Programmable Read-Only Memory (EEPROM), Compact Disc Read-Only Memory (CD-ROM) or other optical disk storage, magnetic disk storage, magnetic tape storage, or any other medium that can be used to carry or store data in a computer readable manner.

[0057] It should also be noted that the terms "comprising", "containing", or any other variant thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements, but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the statement "comprising a" does not exclude the existence of additional identical elements in the process, method, article, or apparatus that includes the element.

Claims

1. A modular heat dissipation control system for industrial control motherboards, characterized in that, The control system includes: The heat flow partitioning module is used to divide the industrial control motherboard into different heat dissipation sub-modules and construct a heat flow distribution matrix based on the heat source distribution characteristics of all heat dissipation sub-modules. The flow guiding parameter optimization module is used to determine the parameterized geometric model of the flow guiding channel based on the heat flow distribution matrix, and to perform nonlinear multi-objective optimization on the parameterized geometric model to obtain the optimized flow guiding control parameters. The uniform temperature heat dissipation module is used to perform differentiated segment design on each heat dissipation sub-module according to the flow control parameters to obtain a column-type micro-rib configuration, and then to perform local temperature adjustment compensation on the flow channel through the column-type micro-rib configuration to obtain a uniform temperature heat dissipation factor. The scheduling and control module is used to determine the ambient temperature vector of the industrial control motherboard, and to determine the heat dissipation command based on the ambient temperature vector, the uniform temperature heat dissipation factor and the heat flow distribution matrix. The dynamic monitoring module is used to drive different heat dissipation sub-modules of the industrial control motherboard to adaptively guide heat dissipation through the heat dissipation guidance command, so as to obtain uniform heat dissipation index.

2. The modular heat dissipation control system for an industrial control motherboard as described in claim 1, characterized in that, The industrial control motherboard is divided into different heat dissipation sub-modules, specifically including: Obtain the component layout information of the industrial control motherboard; Based on the device layout information, the industrial control motherboard is divided into a central processing unit area, a power supply device area, a storage controller area, and an interface area, thereby obtaining different heat dissipation sub-modules.

3. The modular heat dissipation control system for an industrial control motherboard as described in claim 1, characterized in that, The heat flow distribution matrix is ​​constructed based on the heat source distribution characteristics of all heat dissipation submodules, specifically including: Determine the heat source distribution characteristics of all heat dissipation submodules; Based on the spatial relationship of all heat dissipation submodules, coordinate mapping is performed on the heat source distribution characteristics to obtain the heat flow distribution coordinates; The heat flux distribution coordinates are nonlinearly fitted using a radial basis function network to obtain the heat flux distribution matrix.

4. A modular heat dissipation control system for an industrial control motherboard as described in claim 1, characterized in that, The parameterized geometric model of the flow channel determined based on the heat flux distribution matrix specifically includes: Principal component extraction is performed on the heat flux distribution matrix to obtain the heat flux density of each heat dissipation submodule; The geometric direction of the flow channel in the flow guide plate is determined based on the heat flux density of all heat dissipation submodules; The geometric direction is converted into geometric parameters, and the geometric parameters are coupled and mapped to obtain a parameterized geometric model of the flow channel.

5. A modular heat dissipation control system for an industrial control motherboard as described in claim 1, characterized in that, The optimized diversion control parameters obtained by performing nonlinear multi-objective optimization on the parameterized geometric model specifically include: Construct the cross-sectional gradient function of the flow channel of the guide plate, and then determine the transition curvature and cross-sectional gradient of the flow channel through the cross-sectional gradient function; The number of channels, thickness, and tilt angle of the deflector are parameterized to obtain the parameter vector of the deflector; The transition curvature, the cross-sectional gradient, and the parameter vector are iteratively solved using a genetic algorithm and radial basis functions to obtain the optimized flow control parameters.

6. A modular heat dissipation control system for an industrial control motherboard as described in claim 1, characterized in that, Based on the aforementioned flow control parameters, each heat dissipation submodule is designed with differentiated segmentation, resulting in a column-type micro-rib configuration that specifically includes: Collect the heat flow distribution intensity of each heat dissipation submodule; Determine the heat flux microrib interval based on all heat flux distribution intensities; Based on the heat flow microrib interval and the flow guidance control parameters, the thermal flow field of the industrial control motherboard is simulated to obtain the column-type microrib configuration for heat dissipation through channel flow guidance.

7. A modular heat dissipation control system for an industrial control motherboard as described in claim 1, characterized in that, The localized temperature adjustment compensation of the airflow channel through the column-type micro-rib configuration yields a uniform temperature heat dissipation factor, specifically including: Based on the column-type micro-rib configuration, temperature regulation simulation is performed on the flow channel to extract the temperature regulation range and temperature difference convergence domain of each heat dissipation sub-module. Determine the heat flux gradient based on all temperature control ranges; The local heat transfer efficiency of the flow channel is determined by the heat flux gradient and all temperature difference convergence regions. Based on the local heat transfer efficiency, the temperature regulation simulation process of the flow channel is iteratively compensated to obtain the uniform temperature heat dissipation factor.

8. A modular heat dissipation control system for an industrial control motherboard as described in claim 1, characterized in that, Determining the ambient temperature vector of the industrial control motherboard specifically includes: Temperature sample sets are collected using a temperature sensor array; An environmental temperature distribution field is constructed based on the temperature sample set using a three-dimensional interpolation algorithm. Then, principal component analysis is performed on the environmental temperature distribution field to obtain the environmental temperature vector.

9. A modular heat dissipation control system for an industrial control motherboard as described in claim 1, characterized in that, Determining the heat dissipation command based on the ambient temperature vector, the uniform temperature heat dissipation factor, and the heat flow distribution matrix specifically includes: A finite state machine control model is constructed based on the aforementioned uniform temperature heat dissipation factor; The finite state machine control model determines the ambient temperature conditions based on the ambient temperature vector. The finite state machine control model determines the heat flux load distribution based on the heat flux distribution matrix; The heat dissipation command is used to determine the operating status of the industrial control motherboard based on the ambient temperature conditions and the heat load distribution.

10. A modular heat dissipation control system for an industrial control motherboard as described in claim 1, characterized in that, The parametric geometric model is a three-dimensional set model.

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