Chip embedded circuit board and embedding method thereof

Abstract

The invention belongs to the technical field of circuit boards, and particularly relates to a chip-embedded circuit board and an embedding method thereof.The chip-embedded circuit board comprises a main circuit board and a prefabricated circuit board module, the main circuit board is provided with a mounting hole, and the prefabricated circuit board module can be fixedly connected into the mounting hole; the inner wall of the mounting hole is provided with a plurality of first positioning holes, the outer side of the prefabricated circuit board module is provided with a plurality of first-stage protruding locking parts opposite to the first positioning holes in a one-to-one mode, when the prefabricated circuit board module is mounted in the main circuit board, the first-stage protruding locking parts extend into the first positioning holes, and each protruding locking part comprises a sliding block. The outer side of the sliding block is fixedly connected with a first positioning round rod matched with the first positioning hole. According to the invention, the preparation work of the prefabricated circuit board module with relatively high production difficulty and the preparation work of the main circuit board with relatively low production difficulty can be separated, so that the preparation difficulty of the chip embedded circuit board is effectively reduced.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of circuit boards, and particularly relates to a chip embedded circuit board and an embedding method thereof. BACKGROUND

[0002] In the technical field of circuit boards, chip embedded circuit boards are widely used in the fields of consumer electronics, automotive electronics and aerospace due to high integration density, excellent signal transmission performance and small size.

[0003] The preparation of a conventional chip embedded circuit board usually needs to complete chip embedding and overall processing of the circuit board in the same factory. However, due to the chip embedding process (such as high-precision cavity processing and thermal stress control), the full-process production needs to invest in high-precision equipment (such as femtosecond laser cutting machines and vacuum thermal pressure bonding machines), and the process is complex, which requires high equipment and technology, and has great difficulty in preparation. Small factories are difficult to independently complete the full-process production. SUMMARY

[0004] The purpose of the present application is to provide a chip embedded circuit board and an embedding method thereof, which can separate the preparation of a pre-made circuit board module with greater production difficulty and the preparation of a main circuit board with less production difficulty, thereby effectively reducing the preparation difficulty of the chip embedded circuit board.

[0005] The technical solutions adopted by the present application are as follows:

[0006] A chip embedded circuit board comprises a main circuit board and a pre-made circuit board module. The main circuit board is provided with a mounting hole, and the pre-made circuit board module is fixedly connected inside the mounting hole.

[0007] Further, a plurality of positioning holes one are formed in the inner wall of the mounting hole, and a plurality of first protruding locking parts corresponding to the positioning holes one are arranged on the outer side of the pre-made circuit board module. When the pre-made circuit board module is installed inside the main circuit board, the first protruding locking parts extend into the positioning holes one.

[0008] Further, the protruding locking part comprises a sliding block, and a first positioning round rod matched with the positioning hole one is fixedly connected to the outer side of the sliding block. The first positioning round rod and the positioning hole one are gap-fitted.

[0009] A guide sliding hole is formed in the peripheral side surface of the pre-made circuit board module, and the sliding block is slidingly connected inside the guide sliding hole. A moving group matched with the sliding block is further arranged on the main circuit board.

[0010] Further, the moving group comprises a glue injection port fixedly connected to the upper side of the pre-made circuit board module. A glue guide pipe hole connected with the guide sliding hole and the glue injection port is formed in the pre-made circuit board module.

[0011] Further, the inner wall of the positioning hole one is provided with a positioning hole two, and the first positioning round rod is provided with a secondary protruding locking part matched with the positioning hole two.

[0012] Further, the secondary protruding locking part comprises a pneumatic ejector pin arranged on the first positioning round rod and a gas supply group in transmission connection with the pneumatic ejector pin.

[0013] The gas supply group comprises a first through hole arranged on the end of the first positioning round rod, the first through hole is in communication with the pneumatic ejector pin at one end close to the sliding block, and the inside of the first through hole is in sliding connection with a first piston plate in interference fit with the inner wall of the first through hole, and the side surface of the first piston plate is fixedly connected with a ejector pin rod body.

[0014] The pneumatic ejector pin comprises a second through hole arranged on the side surface of the first positioning round rod, the lower end of the second through hole is in communication with the first through hole, and the inside of the second through hole is in sliding connection with a second piston plate in interference fit with the inner wall of the second through hole, and the upper side of the second piston plate is fixedly connected with a second positioning round rod, and the second positioning round rod can be inserted into the inside of the positioning hole two.

[0015] A chip embedded circuit board embedding method, comprising the following steps:

[0016] Step 1: The upper factory pre-fabricates the pre-fabricated circuit board module, embeds the chip into the substrate of the pre-fabricated circuit board module, and pre-fabricates the pre-fabricated circuit board module;

[0017] Step 2: Transport the pre-fabricated circuit board module to the lower factory;

[0018] Step 3: The lower factory produces the main circuit board;

[0019] Step 4: In the lower factory, the pre-fabricated pre-fabricated circuit board module is fixedly connected in the mounting hole, the assembly of the main circuit board and the pre-fabricated circuit board module is completed, and the preparation of the circuit board is completed.

[0020] The technical effects obtained by the application are:

[0021] The chip embedded circuit board and the embedding method thereof can separate the preparation of the pre-fabricated circuit board module with high production difficulty from the preparation of the main circuit board with low production difficulty, effectively reduce the preparation difficulty of the chip embedded circuit board in the lower factory, and further reduce the preparation difficulty of the main circuit board due to the pre-embedding of the chip in the pre-fabricated circuit board module. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 is a structural schematic diagram of the application;

[0023] Figure 2 is the sectional structure schematic view of A in the present application Figure 1

[0024] Figure 3 is the sectional structure schematic view of B in the present application Figure 1

[0025] Figure 4 is the sectional structure schematic view of C in the present application Figure 3

[0026] Figure 5 is the structure schematic view of the first convex locking part of the present application

[0027] Figure 6 is the sectional structure schematic view of the first convex locking part of the present application

[0028] Figure 7 is the sectional structure schematic view of the first piston plate or the second piston plate of the present application.

[0029] In the drawings, the components represented by each reference numeral are listed as follows:

[0030] 1, main circuit board; 2, pre-made circuit board module; 3, mounting hole; 4, guide sliding hole; 5, sliding block; 6, positioning hole one; 7, first positioning round rod; 8, glue injection port; 9, glue guide pipe hole; 10, groove; 11, V-shaped elastic sheet; 12, first through hole; 13, first piston plate; 14, ejector rod body; 15, second through hole; 16, second piston plate; 17, limiting rod; 18, second positioning round rod; 19, positioning hole two; 20, plate body; 21, annular mounting ring; 22, sealing groove mounting ring. DETAILED DESCRIPTION

[0031] In order to make the purpose and advantages of the present application more clear and explicit, the present application is specifically described below in combination with examples. It should be understood that the following text is only used to describe one or several specific embodiments of the present application, and does not strictly limit the specific protection scope requested by the present application.

[0032] As shown in Figures 1-7 , a chip embedded circuit board comprises a main circuit board 1 and a pre-made circuit board module 2, the pre-made circuit board module 2 is internally pre-made embedded chips, the main circuit board 1 is provided with a mounting hole 3, the pre-made circuit board module 2 can be fixedly connected inside the mounting hole 3, and the fixing mode can be screw connection or clamping or other mode of connection, after the pre-made circuit board module 2 is fixedly connected inside the mounting hole 3, the main circuit board 1 and the pre-made circuit board module 2 are electrically connected to form a complete circuit board.

[0033] ​​​At this time, the upper factory (large factory) preforms the prefabricated circuit board module 2, transports the prefabricated circuit board module 2 to the lower factory (small factory) after the prefabricated circuit board module 2 is manufactured, and then produces the main circuit board 1 in the lower factory, and then fixes and connects the prefabricated prefabricated circuit board module 2 in the mounting hole 3, completes the assembly of the main circuit board 1 and the prefabricated circuit board module 2, and the preparation of the circuit board is completed. By separating the preparation of the prefabricated circuit board module 2 which is difficult to produce and the preparation of the main circuit board 1 which is less difficult to produce, the preparation difficulty of the chip embedded circuit board in the lower factory can be effectively reduced, and since the chip is pre-embedded in the prefabricated circuit board module 2, the layering of the main circuit board 1 for embedding the chip is reduced, thereby further reducing the preparation difficulty of the main circuit board 1.

[0034] Here, one of the electrical connection modes of the main circuit board 1 and the prefabricated circuit board module 2 is to provide a conductive pad on the inner wall of the mounting hole 3, and a metal pin is provided on the corresponding position of the outer side of the prefabricated circuit board module 2, and the electrical connection is realized by welding the conductive pad on the inner wall of the mounting hole 3 and the metal pin on the outer side of the prefabricated circuit board module 2.

[0035] Another electrical connection mode of the main circuit board 1 and the prefabricated circuit board module 2 is to design a micro-bump on the contact surface of the prefabricated circuit board module 2 and the main circuit board 1, and to realize metal interconnection by pressing.

[0036] As shown in Figures 1-2 , the prefabricated circuit board module 2 is preferably clamped in the interior of the main circuit board 1, which specifically comprises that a plurality of positioning holes one 6 are provided on the inner wall of the mounting hole 3, and a plurality of first protruding locking parts corresponding to the positioning holes one 6 are provided on the outer side of the prefabricated circuit board module 2, and when the prefabricated circuit board module 2 is installed in the interior of the main circuit board 1, the first protruding locking parts extend into the positioning holes one 6, so that the main circuit board 1 and the prefabricated circuit board module 2 can be clamped together.

[0037] Specifically, the first protruding locking part can be an elastic top block, and the first protruding locking part can also be as shown in Figure 3 , that is, the first protruding locking part comprises a sliding block 5, and the outer side of the sliding block 5 is fixedly connected with a first positioning circular rod 7 matched with the positioning hole one 6, and the first positioning circular rod 7 is gap-fitted with the positioning hole one 6, so that the first positioning circular rod 7 can be inserted into the interior of the positioning hole one 6 for positioning.

[0038] As shown in Figures 1-3 , a guide sliding hole 4 is provided on the peripheral side surface of the prefabricated circuit board module 2, and the sliding block 5 is slidingly connected in the guide sliding hole 4, and when the mounting hole 3 is installed, the sliding block 5 slides to drive the first positioning circular rod 7 to shrink, and a moving group matched with the sliding block 5 is further provided on the main circuit board 1, which is used to drive the sliding block 5 to move, and lock the position of the sliding block 5 after the movement is completed.

[0039] The moving assembly can be a threaded moving mechanism or a magnetic moving mechanism. The moving assembly in this technical solution is as follows: Figures 1-3 As shown, the movable assembly includes a glue inlet 8 fixedly connected to the upper side of the prefabricated circuit board module 2. The prefabricated circuit board module 2 has a guide tube hole 9 connecting the guide sliding hole 4 and the glue inlet 8. After the prefabricated circuit board module 2 is installed inside the mounting hole 3, glue (the material of the glue can be epoxy resin, UV curing glue, preferably high thermal conductivity epoxy resin) is injected into the guide sliding hole 4 through the glue inlet 8. The glue then applies pressure to the slider 5, pushing the slider 5 and moving the first positioning rod 7 on the slider 5 into the positioning hole 6. After the glue cools, the slider 5 is locked.

[0040] like Figures 3-5 As shown, in order to initially lock the position of the slider 5, a V-shaped spring piece 11 is fixedly connected to the periphery of the slider 5. The initial locking force can be applied to the slider 5 by the abutment between the V-shaped spring piece 11 and the inner wall of the guide slide hole 4. In order to reduce the gap between the guide slide hole 4 and the slider 5, a groove 10 can be opened on the periphery of the slider 5, and the V-shaped spring piece 11 is fixedly connected inside the groove 10.

[0041] like Figures 3-6 As shown, a second positioning hole 19 is provided on the inner wall of the first positioning hole 6. The first positioning rod 7 is provided with a secondary protrusion locking part that matches the second positioning hole 19. The second protrusion locking part can be engaged with the inside of the second positioning hole 19 to further lock the first positioning rod 7, thereby improving the fixing stability of the prefabricated circuit board module 2.

[0042] Similar to the primary raised locking part, the secondary raised locking part can also be an elastic block. However, the secondary raised locking part can also be... Figures 4-6 As shown, the secondary protrusion locking part includes a pneumatic push rod set on the first positioning round rod 7 and an air supply group that is driven to the pneumatic push rod. By inputting gas into the pneumatic push rod through the air supply group, the pneumatic push rod can enter the interior of the positioning hole 19.

[0043] Specifically, the air supply unit includes a first through hole 12 at the end of the first positioning rod 7. The end of the first through hole 12 near the slider 5 is connected to the pneumatic push rod. A first piston plate 13 is slidably connected inside the first through hole 12 and is interference-fitted with the inner wall of the first through hole 12. A push rod body 14 is fixedly connected to the side of the first piston plate 13. The end of the push rod body 14 initially extends to the outside of the first positioning rod 7. When the first positioning rod 7 is inserted into the positioning hole 6, the push rod body 14 abuts against the bottom inner wall of the positioning hole 6. The push rod body 14 will drive the first piston plate 13 to move toward the inside of the first through hole 12, thereby pressurizing and pushing the gas inside the first through hole 12 and controlling the pneumatic push rod to move.

[0044] The pneumatic ejector rod comprises a second through hole 15 formed on the side of the first positioning round rod 7, the lower end of the second through hole 15 is communicated with the first through hole 12, the inside of the second through hole 15 is slidably connected with a second piston plate 16 in interference fit with the inner wall of the second through hole 15, the upper side of the second piston plate 16 is fixedly connected with a second positioning round rod 18, the second positioning round rod 18 can be inserted into the inside of the positioning hole two 19, when the first piston plate 13 moves, the gas in the first through hole 12 pushes the second piston plate 16 upward, so that the second positioning round rod 18 is inserted into the inside of the positioning hole two 19.

[0045] Here, the end of the first positioning round rod 7 and the end of the second positioning round rod 18 are both rounded, so that the first positioning round rod 7 can more conveniently enter the inside of the positioning hole one 6, and the second positioning round rod 18 can more conveniently enter the inside of the positioning hole two 19.

[0046] Specifically, the first piston plate 13 and the second piston plate 16 both comprise a plate body 20, the plate body 20 is slidably connected in the first through hole 12 or the second through hole 15, an annular mounting ring 21 is formed on the circumferential side of the plate body 20, a sealing groove mounting ring 22 is mounted in the inside of the annular mounting ring 21, the sealing groove mounting ring 22 is in interference fit with the inner wall of the first through hole 12 or the second through hole 15, so that the first piston plate 13 or the second piston plate 16 can be initially locked by the locking force between the sealing groove mounting ring 22 and the inner wall of the first through hole 12 or the second through hole 15.

[0047] At the same time, since the second through hole 15 is formed on the upper side of the first positioning round rod 7, in order to reduce the displacement of the second piston plate 16 under the action of gravity, the lower side of the second piston plate 16 is fixedly connected with a limiting rod 17 for supporting and limiting the second piston plate 16.

[0048] A chip embedding type circuit board embedding method comprises the following steps:

[0049] Step 1: A prefabricated circuit board module 2 is prefabricated by a superior factory, a chip is embedded into the inside of the substrate of the prefabricated circuit board module 2, and the prefabricated circuit board module 2 is prefabricated;

[0050] Step 2: The prefabricated circuit board module 2 is transported to a subordinate factory;

[0051] Step 3: A main circuit board 1 is produced by the subordinate factory;

[0052] Step 4: The prefabricated prefabricated circuit board module 2 is fixedly connected in the mounting hole 3 in the subordinate factory, the assembly of the main circuit board 1 and the prefabricated circuit board module 2 is completed, and the preparation of the circuit board is completed.

[0053] The above merely describes the preferred embodiments of the present application, and it should be pointed out that those skilled in the art can make several improvements and refinements without departing from the principles of the present application, and these improvements and refinements should also be considered as the protection scope of the present application. The structures, devices and operation methods not specifically described and explained in the present application are implemented according to the conventional means in the art, unless specifically described and limited.

Claims

1. A chip-embedded circuit board, characterized by: Including main circuit board (1) and prefabricated circuit board module (2), the mounting hole (3) is opened on the main circuit board (1), and the prefabricated circuit board module (2) can be fixedly connected inside the mounting hole (3).

2. The chip-embedded circuit board according to claim 1, wherein: A plurality of positioning holes (6) are opened on the inner wall of the mounting hole (3), the outer side of the prefabricated circuit board module (2) is provided with a plurality of first level protruding locking parts corresponding to the positioning holes (6), when the prefabricated circuit board module (2) is installed inside the main circuit board (1), the first level protruding locking parts extend into the positioning holes (6).

3. The chip-embedded circuit board according to claim 2, wherein: The first level protruding locking part includes a sliding block (5), the outer side of the sliding block (5) is fixedly connected with a first positioning round rod (7) matched with the positioning hole (6), the first positioning round rod (7) and the positioning hole (6) are gap matched; The prefabricated circuit board module (2) is provided with a guide sliding hole (4) on the circumferential side, the sliding block (5) is slidingly connected inside the guide sliding hole (4), and the main circuit board (1) is further provided with a moving group matched with the sliding block (5).

4. The chip-embedded circuit board according to claim 3, wherein: The moving group includes a glue injection port (8) fixedly connected to the upper side of the prefabricated circuit board module (2), and the prefabricated circuit board module (2) is provided with a glue guide pipe hole (9) connected with the guide sliding hole (4) and the glue injection port (8).

5. The chip-embedded circuit board according to claim 3, wherein: The sliding block (5) is provided with a groove (10) on the circumferential side, and the groove (10) is fixedly connected with a V-shaped elastic sheet (11) inside.

6. The chip-embedded circuit board according to claim 3, wherein: The inner wall of the positioning hole (6) is provided with a positioning hole (19), and the first positioning round rod (7) is provided with a second level protruding locking part matched with the positioning hole (19).

7. The chip-embedded circuit board according to claim 6, wherein: The second level protruding locking part includes a pneumatic ejector rod arranged on the first positioning round rod (7) and a gas supply group in transmission connection with the pneumatic ejector rod; The gas supply group includes a first through hole (12) opened at the end of the first positioning round rod (7), one end of the first through hole (12) close to the sliding block (5) is communicated with the pneumatic ejector rod, and the first through hole (12) is slidingly connected with a first piston plate (13) in interference fit with the inner wall of the first through hole (12), and the side of the first piston plate (13) is fixedly connected with a ejector rod body (14); The pneumatic ejector rod includes a second through hole (15) opened on the side of the first positioning round rod (7), the lower end of the second through hole (15) is communicated with the first through hole (12), the second through hole (15) is slidingly connected with a second piston plate (16) in interference fit with the inner wall of the second through hole (15), and the upper side of the second piston plate (16) is fixedly connected with a second positioning round rod (18), and the second positioning round rod (18) can be inserted into the positioning hole (19).

8. The chip-embedded circuit board according to claim 7, wherein: The first piston plate (13) and the second piston plate (16) both include a plate body (20) slidingly connected inside the first through hole (12) or the second through hole (15), and the circumferential side of the plate body (20) is provided with an annular mounting ring (21), and the inner side of the annular mounting ring (21) is provided with a sealing groove mounting ring (22).

9. The chip-embedded circuit board according to claim 7, wherein: The lower side of the second piston plate (16) is fixedly connected with a limiting rod (17).

10. A method for embedding a chip in a chip-embedded circuit board for manufacturing the chip-embedded circuit board according to any one of claims 1 to 9, characterized by: Comprising the following steps: Step 1: The upper factory pre-fabricates the pre-fabricated circuit board module (2), embeds the chip inside the substrate of the pre-fabricated circuit board module (2), and pre-fabricates the pre-fabricated circuit board module (2); Step 2: Transport the pre-fabricated circuit board module (2) to the lower factory; Step 3: The lower factory produces the main circuit board (1); Step 4: In the lower factory, the pre-fabricated pre-fabricated circuit board module (2) is fixedly connected inside the mounting hole (3), the assembly of the main circuit board (1) and the pre-fabricated circuit board module (2) is completed, and the preparation of the circuit board is completed.

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