Integrated semiconductor reaction chamber

Abstract

The invention relates to the related technical field of semiconductor reaction chambers, in particular to an integrated semiconductor reaction chamber which comprises a shell, a bottom plate is mounted at the bottom of the shell, an adjusting mechanism is mounted at the bottom of the bottom plate, a material tray is mounted at the top of the adjusting mechanism, and a rotating mechanism is mounted at the top of the bottom plate. A cleaning mechanism is mounted on the inner wall of the shell; by arranging the adjusting mechanism, power generated when the motor rotates can be transmitted to the cleaning structure, then automatic cleaning of the inner wall of the shell is achieved, an additional power mechanism is not needed when the cleaning mechanism cleans different positions of the inner wall of the shell, energy loss is reduced, and the cleaning efficiency is improved. Oxide particles adhered to the inner wall of the shell are scrubbed by the scrubbing roller, and the inner wall of the scrubbed shell can be wiped by the cleaning roller, so that thorough cleaning is ensured, and residues can be effectively reduced.

Description

Technical Field

[0001] This invention belongs to the technical field of semiconductor reaction chambers, and more specifically, to an integrated semiconductor reaction chamber. Background Technology

[0002] Semiconductor processing includes deposition processes such as chemical vapor deposition (CVD) of metal, dielectric and semiconductor materials, etching of these layers, polishing of photoresist mask layers, etc. In the case of etching, plasma etching is usually used to etch metal, dielectric and semiconductor materials, while a semiconductor reaction chamber is a device used to perform material deposition, etching and other reactions on semiconductors under vacuum conditions.

[0003] The following technical problems still exist with existing technology: In the prior art, after semiconductors undergo material deposition and etching in the reaction chamber, oxide particles adhere to the inner wall of the housing. Existing cleaning devices mostly rely on scraping, but once the oxide particles adhere to the housing, they become tightly attached, making it impossible for simple scraping devices to effectively remove them, resulting in residues and affecting the thoroughness of removal. Furthermore, the existing cleaning mechanisms require a lot of power equipment, resulting in high energy consumption.

[0004] Therefore, in view of this, we will study and improve the existing structure and defects to provide an integrated semiconductor reaction chamber, in order to achieve a more practical and valuable purpose. Summary of the Invention

[0005] The present invention provides an integrated semiconductor reaction chamber to overcome the above-mentioned defects in the prior art.

[0006] This invention provides an integrated semiconductor reaction chamber, achieved by the following specific technical means: an integrated semiconductor reaction chamber includes a housing, a base plate installed at the bottom of the housing, an adjustment mechanism installed at the bottom of the base plate, a material support tray installed at the top of the adjustment mechanism, a rotation mechanism installed at the top of the base plate, and a cleaning mechanism installed on the inner wall of the housing; The cleaning mechanism includes a bearing ring, the outer ring of which is fixedly connected to the inner bottom of the housing. A V-shaped frame 1 is fixedly mounted on the top of the inner ring of the bearing ring. A cleaning roller and a scrubbing roller are rotatably mounted on the top of the V-shaped frame 1. A V-shaped frame 2 is mounted on the top of the cleaning roller and the scrubbing roller. Two transmission wheels are rotatably connected to the top of the V-shaped frame 2. A rotating shaft is mounted on the bottom of the two transmission wheels and connected to the top of the cleaning roller and the scrubbing roller. The rotating shaft is rotatably connected to the inner wall of the V-shaped frame 2. A motor is mounted on the top of the V-shaped frame 2. The output shaft of the motor is fixedly connected to one of the transmission wheels. A transmission belt is fitted on the inner wall of both transmission wheels. A hexagonal column 2 is mounted on the bottom of the V-shaped frame 2. A hexagonal hole 2 is opened on the top of the material tray.

[0007] As a preferred embodiment of the present invention: the adjustment mechanism includes two electric push rods, which are symmetrically installed on the top of the base plate, and the output shafts of the two electric push rods are connected to a movable disk. A material support plate is installed on the top of the movable disk, and one end of a return spring is connected to the top of the base plate, and the other end of the return spring is fixedly connected to the bottom of the movable disk.

[0008] As a preferred technical solution of the present invention: the rotating mechanism includes a motor, the motor is installed on the top of the base plate, the output shaft of the motor has a hexagonal hole, the bottom of the material tray is equipped with a hexagonal column, and the bottom end of the hexagonal column is inserted into the inner wall of the hexagonal hole.

[0009] As a preferred technical solution of the present invention: one end of a plurality of connecting rods is fixedly connected to the inner wall of the housing, and the other end of the plurality of connecting rods is fixed to a circular frame. The end of the connecting rod near the circular frame is located at the innermost side of the circular frame. A liquid storage tank is opened on the inner wall of the circular frame. The inner wall of the liquid storage tank is filled with cleaning liquid. A sealing ring is rotatably connected to the inner wall of the liquid storage tank. One end of a drain pipe is fixed to the inner wall of the sealing ring. A drain hole is opened at the top of the transmission wheel. The drain hole extends through the water pump and the second V-shaped frame to the inner wall of the brushing roller. The other end of the drain pipe is inserted into the inner wall of the brushing roller. The transmission wheel and the second V-shaped frame are rotatably connected to the drain pipe. A water pump is installed on the outside of the drain pipe. A bearing ring is also installed on the outside of the circular frame. The outer ring of the bearing ring is fixedly connected to the side of the second V-shaped frame near the second hexagonal column.

[0010] As a preferred embodiment of the present invention: a liquid filling pipe is installed on the inner wall of the sealing ring, and a control valve is installed on the inner wall of the liquid filling pipe.

[0011] As a preferred embodiment of the present invention: a sealing cover is installed on the top of the housing, a vacuum tube is installed on the top of the sealing cover, and a regulating valve is installed on the inner wall of the vacuum tube.

[0012] As a preferred technical solution of the present invention: an infrared transmitter is installed at the bottom of the V-shaped frame II, an infrared receiver is installed on the outer wall of the material tray near the hexagonal hole II, a controller is installed inside the housing, and the controller, infrared transmitter, infrared receiver, motor and electric push rod are all electrically connected.

[0013] As a preferred embodiment of the present invention: the outer edges of the cleaning roller and the scrubbing roller are both in contact with the inner wall of the housing; the cleaning roller is made of polyurethane foam; the outer edge of the scrubbing roller is provided with abrasive bristles; a water outlet is installed at the bottom of the housing; and a solenoid valve is installed on the inner wall of the water outlet.

[0014] As a preferred embodiment of the present invention: a rotating hole is provided in the middle of the movable disk, and the hexagonal prism is rotatably connected to the inner wall of the rotating hole.

[0015] Compared with the prior art, the present invention has the following beneficial effects: This invention discloses an integrated semiconductor reaction chamber. By setting an adjustment mechanism, the power of the motor rotation can be transmitted to the cleaning structure, thereby realizing automated cleaning of the inner wall of the housing. This eliminates the need for a separate power mechanism when cleaning different positions on the inner wall of the housing, reducing energy consumption. Furthermore, the brushing roller is used to scrub off the oxide particles adhering to the inner wall of the housing, and the cleaning roller can wipe the inner wall of the housing after scrubbing to ensure thorough cleaning and effectively reduce residue.

[0016] The present invention discloses an integrated semiconductor reaction chamber, which uses a water pump to inject cleaning fluid from the storage tank into the drain hole through a drain pipe, thereby wetting the washing roller and improving the thoroughness of the washing roller in washing the inner wall of the housing, and avoiding damage to the inner wall of the housing due to excessive dryness during washing. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the internal structure of the present invention; Figure 3 This is a schematic diagram of the cross-sectional structure of the shell of the present invention; Figure 4 This is a schematic diagram of the bearing ring structure of the present invention; Figure 5 This is a schematic diagram of the material tray structure of the present invention; Figure 6 This is a schematic diagram of the cross-sectional structure of the movable disk of the present invention; Figure 7 This is a schematic diagram of the circular frame structure of the present invention; Figure 8 This is a schematic diagram of the cleaning mechanism structure of the present invention; Figure 9 This is a schematic diagram of the cross-sectional structure of the circular frame of the present invention.

[0018] Explanation of reference numerals in the attached figures: 1. Housing; 2. Sealing cover; 3. Vacuum tube; 4. Base plate; 5. Electric push rod; 6. Moving plate; 7. Return spring; 8. Motor; 9. Hexagonal hole one; 10. Material support plate; 11. Hexagonal column one; 12. Rotating hole; 13. Bearing ring; 14. V-shaped frame one; 15. Cleaning roller; 16. Brushing roller; 17. V-shaped frame two; 18. Drive wheel; 19. Drive belt; 20. Motor; 21. Hexagonal column two; 22. Hexagonal hole two; 23. Connecting rod; 24. Circular frame; 25. Liquid storage tank; 26. Sealing ring; 27. Liquid drain pipe; 28. Water pump; 29. ​​Drain hole; 30. Liquid filling pipe. Detailed Implementation

[0019] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of the invention.

[0020] In the description of this invention, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0021] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0022] As attached Figure 1 To be continued Figure 9 As shown: The present invention provides an integrated semiconductor reaction chamber, including a housing 1, a base plate 4 installed at the bottom of the housing 1, an adjustment mechanism installed at the bottom of the base plate 4, a material tray 10 installed at the top of the adjustment mechanism, a rotation mechanism installed at the top of the base plate 4, and a cleaning mechanism installed on the inner wall of the housing 1. The cleaning mechanism includes a bearing ring 13. The outer ring of the bearing ring 13 is fixedly connected to the inner bottom of the housing 1. A V-shaped frame 14 is fixedly attached to the top of the inner ring of the bearing ring 13. A cleaning roller 15 and a scrubbing roller 16 are rotatably mounted on the top of the V-shaped frame 14. A second V-shaped frame 17 is mounted on the top of the cleaning roller 15 and the scrubbing roller 16. Two transmission wheels 18 are rotatably connected to the top of the second V-shaped frame 17. A rotating shaft is mounted on the bottom of the two transmission wheels 18 and connected to the top of the cleaning roller 15 and the scrubbing roller 16. The rotating shaft is rotatably connected to the inner wall of the second V-shaped frame 17. A motor 20 is installed on the top of the housing. The output shaft of the motor 20 is fixedly connected to one of the transmission wheels 18. The inner walls of the two transmission wheels 18 are fitted with a transmission belt 19. A hexagonal column 21 is installed at the bottom of the V-shaped frame 17. A hexagonal hole 22 is opened on the top of the material tray 10, so that the motor 20 can drive one of the transmission wheels 18 to rotate. With the help of the transmission belt 19, the other transmission wheel 18 can be driven to rotate. Furthermore, the cleaning roller 15 and the scrubbing roller 16 can be driven to rotate against the inner wall of the housing 1 to achieve the scrubbing and wiping of the inner wall of the housing 1.

[0023] In a preferred embodiment, the adjustment mechanism includes two electric push rods 5, which are symmetrically mounted on the top of the base plate 4. The output shafts of the two electric push rods 5 are connected to a movable disk 6. A material support disk 10 is mounted on the top of the movable disk 6. One end of a return spring 7 is connected to the top of the base plate 4, and the other end of the return spring 7 is fixedly connected to the bottom of the movable disk 6. This allows the electric push rods 5 to be driven to push the movable disk 6 upward. As the movable disk 6 moves upward, it can push the material support disk 10 upward, thereby adjusting the height of the material support disk 10. When the material support disk 10 moves upward and inserts the hexagonal column 21 into the inner wall of the hexagonal hole 22, the rotational force of the material support disk 10 can drive the cleaning mechanism to rotate synchronously. This eliminates the need for an additional power mechanism when the cleaning mechanism cleans different positions on the inner wall of the housing 1, reducing energy consumption.

[0024] In a preferred embodiment: the rotating mechanism includes a motor 8, which is mounted on the top of the base plate 4. The output shaft of the motor 8 has a hexagonal hole 9. A hexagonal column 11 is mounted on the bottom of the material tray 10. The bottom end of the hexagonal column 11 is inserted into the inner wall of the hexagonal hole 9, so that the drive motor 8 can rotate the hexagonal column 11 by using the hexagonal hole 9. In turn, the hexagonal column 11 can drive the material tray 10 to rotate stably on the top of the moving plate 6, so as to realize the angle change of the material on the inner wall of the material tray 10 and ensure the uniformity and synchronization of the semiconductor reaction at different positions.

[0025] In a preferred embodiment: One end of a plurality of connecting rods 23 is fixedly connected to the inner wall of the housing 1, and the other end of the plurality of connecting rods 23 is fixed to a circular frame 24. The end of the connecting rod 23 near the circular frame 24 is located at the innermost side of the circular frame 24. A liquid storage tank 25 is formed on the inner wall of the circular frame 24, and the inner wall of the liquid storage tank 25 is filled with cleaning fluid. A sealing ring 26 is rotatably connected to the inner wall of the liquid storage tank 25. One end of a drain pipe 27 is fixed to the inner wall of the sealing ring 26. A drain hole 29 is formed at the top of the transmission wheel 18, and the drain hole 29 extends through the water pump 28 and the second V-shaped frame 17 to the inner wall of the brush roller 16. The other end of the drain pipe 27 is inserted into the inner wall of the brush roller 16. The transmission wheel 18 and the second V-shaped frame 17 are rotatably connected to the drain pipe 27. A water pump 28 is installed on the outside of 27, and a bearing ring 13 is also installed on the outside of the circular frame 24. The outer ring of the bearing ring 13 is fixedly connected to the side of the V-shaped frame 21 near the hexagonal column 21, so that the circular frame 24 can be used for positioning, ensuring that the circular frame 24 can be stably set inside the housing 1. Then, the water pump 28 can be driven to work to add the cleaning liquid inside the liquid storage tank 25 into the drain hole 29 through the liquid discharge pipe 27, wet the brush roller 16, improve the thoroughness of the brush roller 16 when brushing the inner wall of the housing 1, and avoid the inner wall of the housing 1 being damaged due to excessive dryness during brushing. Furthermore, the sealing ring 26, which is rotatably set on the inner wall of the liquid storage tank 25, can be used to ensure that the cleaning mechanism does not interfere with the circular frame 24 during circumferential movement.

[0026] In a preferred embodiment: a liquid filling pipe 30 is installed on the inner wall of the sealing ring 26, and a control valve is installed on the inner wall of the liquid filling pipe 30 so that cleaning fluid can be added to the inside of the cleaning roller 15. The control valve is used to seal the inner wall of the liquid filling pipe 30 after filling to prevent leakage.

[0027] In a preferred embodiment: a sealing cover 2 is installed on the top of the housing 1, a vacuum tube 3 is installed on the top of the sealing cover 2, and an adjustment valve is installed on the inner wall of the vacuum tube 3, so that the opening at the top of the housing 1 can be sealed by the sealing cover 2, ensuring that the inside of the housing 1 is in a completely sealed state during operation, and the inside of the housing 1 can be evacuated to a vacuum state by using the vacuum tube 3.

[0028] In a preferred embodiment: an infrared transmitter is installed at the bottom of the V-shaped frame 17, an infrared receiver is installed on the outer wall of the material tray 10 near the hexagonal hole 22, a controller is installed inside the housing 1, and the controller, infrared transmitter, infrared receiver, motor 8 and electric push rod 5 are electrically connected, so that the position calibration of the hexagonal column 21 and hexagonal hole 22 can be achieved by using the infrared transmitter and infrared receiver, and then the controller can be used to control the stopping and operation of the motor 8 and electric push rod 5 in a timely manner.

[0029] In a preferred embodiment: the outer edges of the cleaning roller 15 and the scrubbing roller 16 are both in contact with the inner wall of the housing 1. The cleaning roller 15 is made of polyurethane foam, and the outer edge of the scrubbing roller 16 is provided with abrasive bristles. A water outlet is installed at the bottom of the housing 1, and a solenoid valve is installed on the inner wall of the water outlet, so that the cleaning roller 15 and the scrubbing roller 16 can rotate in close contact with the inner wall of the housing 1 when rotating. The scrubbing roller 16 can be used to scrub the oxide particles adhering to the inner wall of the housing 1, and the cleaning roller 15 can be used to wipe the inner wall of the housing 1 after scrubbing to ensure thorough cleaning. The particles that fall off during scrubbing can be discharged to the outside through the water outlet along with the cleaning liquid, thus achieving cleaning.

[0030] In a preferred embodiment, a rotating hole 12 is provided in the middle of the movable disk 6, and a hexagonal prism 11 is rotatably connected to the inner wall of the rotating hole 12, so as to ensure that the hexagonal prism 11 will not interfere with the movable disk 6 when rotating, thus ensuring the stability during rotation.

[0031] Working principle: First, place the semiconductor to be reacted into the inside of the tray 10, then close the sealing cover 2 to start the reaction process; After the reaction is complete, the electric push rod 5 can be driven first to push the moving plate 6 to move the material support plate 10 upward until the positions of the hexagonal column 21 and the hexagonal hole 22 are aligned. Then, the material support plate 10 can be pushed again to insert the hexagonal column 21 into the inner wall of the hexagonal hole 22. At this time, the hexagonal column 11 slides upward on the inner wall of the hexagonal hole 9, but will not detach. Then, the motor 8 can be driven to rotate the hexagonal column 11 and the material support plate 10. The cleaning structure is driven to rotate against the inner wall of the shell 1 through the hexagonal column 21 to clean the inner wall of the shell 1. The drive motor 20 drives one of the transmission wheels 18 to rotate, which in turn drives the other transmission wheel 18 to rotate in conjunction with the transmission belt 19. This further drives the cleaning roller 15 and the scrubbing roller 16 to rotate against the inner wall of the housing 1, thereby achieving the scrubbing and wiping of the inner wall of the housing 1. The drive pump 28 operates to add the cleaning liquid inside the liquid storage tank 25 into the drain hole 29 through the drain pipe 27, which wets the scrubbing roller 16, improving the thoroughness of the scrubbing of the inner wall of the housing 1 by the scrubbing roller 16, and avoiding damage to the inner wall of the housing 1 due to excessive dryness during scrubbing. The particles that fall off during scrubbing can be discharged to the outside along with the cleaning liquid through the outlet, thus achieving cleaning.

[0032] The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and to design various embodiments with various modifications suitable for a particular purpose.

Claims

1. An integrated semiconductor reaction chamber comprising a housing (1), characterized in that: The bottom of the shell (1) is provided with a bottom plate (4), the bottom of the bottom plate (4) is provided with an adjusting mechanism, the top of the adjusting mechanism is provided with a material supporting disc (10), the top of the bottom plate (4) is provided with a rotating mechanism, the inner wall of the shell (1) is provided with a cleaning mechanism; The cleaning mechanism comprises a bearing ring (13), the outer ring of the bearing ring (13) is fixedly connected with the inner bottom of the shell (1), the inner ring top of the bearing ring (13) is fixedly provided with a V-shaped frame one (14), the top of the V-shaped frame one (14) is rotatably provided with a cleaning roller (15) and a brushing roller (16) respectively, the top of the cleaning roller (15) and the brushing roller (16) is provided with a V-shaped frame two (17), the top of the V-shaped frame two (17) is rotatably connected with two transmission wheels (18), the bottom of the two transmission wheels (18) is provided with a rotating shaft, the top of the cleaning roller (15) and the brushing roller (16) is connected with the rotating shaft, the rotating shaft is rotatably connected with the inner wall of the V-shaped frame two (17), the top of the V-shaped frame two (17) is provided with a motor (20), the output shaft of the motor (20) is fixedly connected with one of the transmission wheels (18), the inner walls of the two transmission wheels (18) are commonly provided with a transmission belt (19), the bottom of the V-shaped frame two (17) is provided with a hexagonal column two (21), the top of the material supporting disc (10) is provided with a hexagonal hole two (22).

2. The integrated semiconductor reaction chamber of claim 1, wherein: The adjusting mechanism comprises two electric push rods (5), the two electric push rods (5) are symmetrically arranged on the top of the bottom plate (4), and the output shafts of the two electric push rods (5) are connected with a moving disc (6), the top of the moving disc (6) is provided with the material supporting disc (10), one end of a return spring (7) is connected with the top of the bottom plate (4), and the other end of the return spring (7) is fixedly connected with the bottom of the moving disc (6).

3. The integrated semiconductor reaction chamber of claim 1, wherein: The rotating mechanism comprises a motor (8), the motor (8) is arranged on the top of the bottom plate (4), the output shaft of the motor (8) is provided with a hexagonal hole one (9), the bottom of the material supporting disc (10) is provided with a hexagonal column one (11), and the bottom end of the hexagonal column one (11) is inserted into the inner wall of the hexagonal hole one (9).

4. The integrated semiconductor reaction chamber of claim 1, wherein: One end of the plurality of connecting rods (23) is fixedly connected to the inner wall of the shell (1), and the other end of the plurality of connecting rods (23) is fixedly connected to a circular frame (24), one end of the connecting rod (23) close to the circular frame (24) is arranged at the innermost side of the circular frame (24), the inner wall of the circular frame (24) is provided with a liquid storage groove (25), the inner wall of the liquid storage groove (25) is filled with cleaning liquid, the inner wall of the liquid storage groove (25) is rotatably connected to a sealing ring (26), one end of the sealing ring (26) is fixedly connected to a liquid return pipe (27), the top of the transmission wheel (18) is provided with a liquid discharge hole (29), and the liquid discharge hole (29) extends through the water pump (28) and the V-shaped frame two (17) to the inner wall of the brushing roller (16), the other end of the liquid return pipe (27) is inserted into the inner wall of the brushing roller (16), the transmission wheel (18) and the V-shaped frame two (17) are rotatably connected to the liquid return pipe (27), and the water pump (28) is mounted on the outside of the liquid return pipe (27), the outer circle of the bearing ring (13) is fixedly connected to the V-shaped frame two (17) close to one side of the hexagonal column two (21).

5. The integrated semiconductor reaction chamber of claim 4, wherein: The inner wall of the sealing ring (26) is provided with a liquid adding pipe (30), and the inner wall of the liquid adding pipe (30) is provided with a control valve.

6. The integrated semiconductor reaction chamber of claim 1, wherein: The top of the shell (1) is provided with a sealing cover (2), the top of the sealing cover (2) is provided with a vacuum pump (3), and the inner wall of the vacuum pump (3) is provided with an adjusting valve.

7. The integrated semiconductor reaction chamber of claim 1, wherein: The bottom of the V-shaped frame two (17) is provided with an infrared emitter, the outer wall of the material supporting disc (10) close to one side of the hexagonal hole two (22) is provided with an infrared receiver, the inside of the shell (1) is provided with a controller, and the controller, the infrared emitter, the infrared receiver, the motor (8) and the electric push rod (5) are electrically connected.

8. The integrated semiconductor reaction chamber of claim 1, wherein: The outer edges of the cleaning roller (15) and the brushing roller (16) are attached to the inner wall of the shell (1), the cleaning roller (15) is made of polyurethane foam material, the outer edge of the brushing roller (16) is provided with abrasive wire bristles, the bottom of the shell (1) is provided with a water outlet, and the inner wall of the water outlet is provided with a solenoid valve.

9. The integrated semiconductor reaction chamber of claim 2, wherein: The middle of the moving disc (6) is provided with a rotating hole (12), and the hexagonal column one (11) is rotatably connected to the inner wall of the rotating hole (12).

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