Carrier copper foil production equipment and carrier copper foil

Abstract

The invention provides carrier copper foil production equipment and a carrier copper foil, relates to the technical field of copper foil preparation, and aims to solve the technical problem of poor stability of copper foil layer preparation in existing carrier copper foil production. The equipment comprises a crude foil machine, a conveying roller group, a stripping layer generation device, a copper foil layer generation device and a surface treatment device, the crude foil machine, the stripping layer generation device, the copper foil layer generation device and the surface treatment device are sequentially connected and linked through a conveying roller group; the copper foil layer generating device comprises a plurality of electrolytic cells, a plurality of first conductive rollers are arranged in the conveying roller set, and each first conductive roller is located on the side, close to the foil generating machine, of the corresponding electrolytic cell. The conveying roller set can further comprise one or more second conductive rollers, the second conductive rollers are located on the side, close to the crude foil machine, of the surface treatment device and located outside the device, and the first conductive rollers are large-current conductive rollers. Potential isolation of all electrolytic cells of the copper foil layer generation device is achieved through the first conductive roller, current crosstalk is avoided, and the stability and uniformity of copper foil layer deposition are guaranteed.

Description

Technical Field

[0001] This disclosure relates to the field of copper foil preparation technology, and in particular to a carrier copper foil production equipment and a carrier copper foil. Background Technology

[0002] Carrier copper foil, as a peelable copper foil, is an important electronic material for manufacturing printed circuit boards and lithium-ion batteries. Its core advantage lies in supporting an ultra-thin copper foil layer through a carrier layer, meeting the demands of high-end electronic devices for thinner and more precise materials. The surface profile, particle uniformity, and peelability of the carrier copper foil directly determine the processing precision and operational stability of downstream products.

[0003] Current copper foil carrier production generally employs a "segmented process," where after the carrier layer is generated in the electrolytic unit, it is first wound and transferred, followed by unwinding for post-processing steps such as release layer preparation and copper foil deposition. This process has two major drawbacks: Oxidation and crystallization problems: After the carrier layer is peeled off from the electrolysis device, it goes through winding, transfer and waiting for unwinding, which takes a long time. After the active copper surface comes into contact with air, it undergoes deep oxidation, and the surface crystal structure undergoes irreversible deformation. This results in the copper foil layer being too fine in profile and uneven in particle distribution, which makes it difficult to meet the requirements of high-end applications.

[0004] Poor adaptability of post-processing technology: Even with an online production solution, post-processing still follows the traditional "multi-tank step-by-step" mode, using independent roughening tanks and curing tanks to complete surface treatment. During online production, the foil material moving speed is stable; however, switching between multiple tanks can easily cause fluctuations in the electrolytic field, making it difficult to achieve the deposition of uniform nanoscale particles, which in turn affects the peeling effect between the copper foil layer and the carrier layer and the overall performance. Summary of the Invention

[0005] The purpose of this disclosure is to solve the problems of unstable electrolytic field and poor surface quality in the production of carrier copper foil, and to provide a carrier copper foil production equipment and carrier copper foil with high integration and stable processing effect.

[0006] According to a first aspect of this disclosure, a carrier copper foil production apparatus is provided, comprising a foil-forming machine, a conveying roller group, a peeling layer generating device, a copper foil layer generating device, and a surface treatment device; the foil-forming machine, the peeling layer generating device, the copper foil layer generating device, and the surface treatment device are sequentially connected and linked through the conveying roller group, the conveying roller group being used to convey the carrier layer prepared by the foil-forming machine sequentially through the peeling layer generating device, the copper foil layer generating device, and the surface treatment device to the rear end; the copper foil layer generating device includes a plurality of electrolytic cells, the conveying roller group includes a plurality of conveying rollers, and the plurality of conveying rollers further includes one or more first conductive rollers, each of the first conductive rollers being located on the side of each electrolytic cell adjacent to the foil-forming machine, and the first conductive rollers being high-current conductive rollers.

[0007] In an exemplary embodiment of this disclosure, based on the foregoing scheme, the conveying roller group further includes one or more second conductive rollers, the second conductive rollers being located on the side of the surface treatment device adjacent to the foil production machine, the second conductive rollers being located outside the surface treatment device, and the second conductive rollers being high-current conductive rollers.

[0008] In an exemplary embodiment of this disclosure, based on the aforementioned scheme, the total current of both the first conductive roller and the second conductive roller is between 200 and 2000 amps, and the total current of the second conductive roller is greater than the total current of the first conductive roller.

[0009] In an exemplary embodiment of this disclosure, based on the foregoing scheme, the surface treatment apparatus includes at least one surface treatment tank, the surface treatment tank includes an anode and a conveying roller, a portion of the roller surface of the conveying roller is immersed below the solution surface of the surface treatment tank, and the foil to be treated is conveyed backward around the roller surface of the conveying roller that is below the liquid surface; the foil is in an arc shape attached to the roller surface of the conveying roller below the liquid surface in the surface treatment tank, and the anode is immersed below the solution surface of the surface treatment tank.

[0010] In an exemplary embodiment of this disclosure, based on the foregoing scheme, the anode includes two anode plates, which are symmetrically arranged on both sides of the conveying roller.

[0011] In an exemplary embodiment of this disclosure, based on the aforementioned scheme, the two anode plates are arranged in an inclined manner, and the lower ends of the two anode plates are offset relative to their upper ends towards the center of the surface treatment tank by a predetermined distance, the predetermined distance being 1-10 centimeters.

[0012] In an exemplary embodiment of this disclosure, based on the aforementioned scheme, both the first conductive roller and the second conductive roller are made of metal and each has an axially penetrating hollow channel inside; the hollow channel is used to circulate a cooling medium to cool the first conductive roller and the second conductive roller, so that the operating temperature of the first conductive roller is maintained at 25-35°C and the operating temperature of the second conductive roller is maintained at 20-30°C.

[0013] In an exemplary embodiment of this disclosure, based on the aforementioned scheme, the total current of the first conductive roller is between 200 and 800 amps, the total current of the second conductive roller is between 900 and 1250 amps, and the voltage of the anode closest to the second conductive roller is between 7 and 8 volts.

[0014] In an exemplary embodiment of this disclosure, based on the foregoing scheme, the carrier copper foil production equipment further includes at least one pickling tank, at least one washing tank, and at least one passivation tank; the pickling tank, washing tank, and passivation tank are sequentially arranged on the side of the surface treatment device away from the copper foil layer generating device along the conveying direction of the foil.

[0015] In an exemplary embodiment of this disclosure, based on the foregoing scheme, the release layer generating apparatus includes a first brush plating assembly and a second brush plating assembly. The first brush plating assembly is used to perform a first brush plating on a preset surface of the carrier layer using phosphide salt to generate a phosphating film. The second brush plating assembly is used to perform a second brush plating on the phosphating film using phosphide metal to obtain a release layer. The second brush plating assembly is located after the first brush plating assembly.

[0016] In an exemplary embodiment of this disclosure, based on the aforementioned scheme, the first brush plating component is electroless brush plating, and the second brush plating component is pulse brush plating, with the pulse type being alternating positive and negative pulses and a duty cycle of 30%-50%.

[0017] In an exemplary embodiment of this disclosure, based on the foregoing scheme, the copper foil layer generating apparatus includes a plurality of electrolytic cells arranged sequentially along the foil conveying direction. Each electrolytic cell is provided with an independent anode assembly and a temperature control system, and adjacent electrolytic cells are potential isolated by the first conductive roller.

[0018] In another aspect of this disclosure, a carrier copper foil is provided, which is prepared using the carrier copper foil production equipment described above.

[0019] As can be seen from the above technical solution, this disclosure possesses at least one of the following advantages and positive effects: The first and second conductive rollers are configured in stages to adapt to the current requirements of copper foil deposition and surface treatment, respectively, while achieving potential isolation between each unit to avoid current crosstalk and ensure process stability.

[0020] The inclined anode plate and the arc-shaped foil path in the surface treatment tank create a gradual electrolytic field. A single tank can complete the alternating roughening and curing process without the need for multiple tanks, reducing electrolytic field fluctuations and improving the uniformity of copper foil surface particles.

[0021] The online configuration, combined with the conveyor roller group for rapid transfer, significantly shortens the exposure time of the carrier layer (≤1.0 minute), reduces the risk of oxidation and crystallization, and lays the foundation for the preparation of low-profile carrier copper foil. Attached Figure Description

[0022] The above and other features and advantages of this disclosure will become more apparent from a detailed description of exemplary embodiments thereof with reference to the accompanying drawings.

[0023] Figure 1 This is a schematic diagram of the structure of a carrier copper foil production equipment according to an embodiment of this disclosure; Figure 2 This is a schematic diagram of another carrier copper foil production equipment in this embodiment of the present disclosure; Figure 3 This is a schematic diagram of the surface treatment tank in an embodiment of this disclosure; Figure 4 This is a schematic diagram of the layer structure of the carrier copper foil in an embodiment of this disclosure.

[0024] The main components in the diagram are labeled as follows: 1. Foil forming machine; 2. Peeling layer forming device; 3. Copper foil layer forming device; 4. Surface treatment device; 5. Winding device; 6. Conveying roller group; 31. First conductive roller; 32. Electrolytic cell; 41. Second conductive roller; 42. Surface treatment tank; 13. Carrier layer; 15. Release layer; 16. Copper foil layer. Detailed Implementation

[0025] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore their detailed description will be omitted.

[0026] like Figure 1The simplified structural diagram shown illustrates that the carrier copper foil production equipment in this embodiment mainly includes a foil-making machine 1, a peeling layer generating device 2, a copper foil layer generating device 3, a surface treatment device 4, a winding device 5, and a conveyor roller group 6. Each unit is sequentially connected and linked via the conveyor roller group 6, achieving continuous production of the carrier layer from generation to finished product winding. The carrier layer prepared by the foil-making machine 1 enters the peeling layer generating device 2, the copper foil layer generating device 3, and the surface treatment device 4 sequentially via the conveyor roller group 6, and is finally wound up by the winding device 5. There is no winding and transfer step throughout the process, effectively controlling the carrier layer exposure time to ≤3.0 minutes.

[0027] The conveyor roller group 6 includes multiple ordinary conveyor rollers, a first conductive roller 31, and a second conductive roller 41. The first conductive roller 31 is correspondingly arranged on the side of each electrolytic cell 32 of the copper foil layer generating device 3 near the foil forming machine 1. The second conductive roller 41 is located on the side of the surface treatment device 4 near the foil forming machine 1 and is outside the device. The two types of conductive rollers have the dual functions of conduction and conveying, which can realize potential isolation between units, avoid mutual current interference, and ensure the stable operation of each process step. For copper foil layer generating device 3 with multiple electrolytic cells 32, such as embodiments with 5, 7, 9, or even 12 or more electrolytic cells 32, the first conductive roller 31 can be arranged with one electrolytic cell between them or with two electrolytic cells between them. The multiple first conductive rollers 31 are configured as distributed cathodes in the electrolytic field to form a step-by-step potential isolation.

[0028] Multiple electrolytic cells 32 of the copper foil layer generating device 3 are arranged sequentially along the foil conveying direction. Each cell is equipped with an independent anode assembly and a temperature control system. Adjacent electrolytic cells 32 are potential isolated by the first conductive roller 31 to ensure that the electrolysis parameters of each cell are accurate and controllable. The core of the surface treatment device 4 is the surface treatment tank. The tank is constructed with an inclined anode plate and an arc-shaped foil path to create a gradual electrolytic field, realizing alternating roughening and curing composite treatment to improve the uniformity of copper foil surface particles.

[0029] like Figure 2 As shown, in one embodiment, the structure of the carrier copper foil production equipment is as follows: Foil forming machine 1: It adopts a horizontal electrolysis structure with a titanium cathode roller diameter of 2.7 meters. The surface is precision polished with a roughness Ra≤0.2μm. The cathode roller speed is adjusted to 1.0 rpm, matching the carrier layer generation speed of 2.5 m / min. The electrolyte is a mixture of copper sulfate and sulfuric acid (copper sulfate 200g / L, sulfuric acid 80g / L), the temperature is controlled at 42±1℃, and the pH value is 1.8±0.1. The cathode current is 29600 A and the cathode voltage is 4.0V, which can stably prepare a carrier layer with a thickness of 18μm.

[0030] Conveying roller group 6 - conductive roller: First conductive roller 31: made of chrome-plated copper alloy, 200mm in diameter, total current 200-800 amps, voltage 3.0-4.5 volts; it has an axially through hollow channel (25mm in diameter) inside, through which 32℃ deionized water is circulated as the cooling medium, with a flow rate of 5-6L / min, and the working temperature is maintained at 25-35℃.

[0031] The second conductive roller 41 is made of stainless steel, with a diameter of 250mm, a total current of 900-1250 amps, and a voltage of 7-8 volts (3.0-4.0 volts higher than the cathode voltage of the foil-making machine). The internal hollow channel has a diameter of 30mm, allowing 28℃ deionized water to circulate at a flow rate of 8-10L / min. The operating temperature is controlled at 20-30℃ to prevent overheating and deformation during high-current operation.

[0032] The copper foil layer generation device 3 comprises five electrolytic cells 32 connected in series to sequentially achieve copper foil layer preparation, thickening, and densification. In the configuration of the electrolytic cells 32, first conductive rollers 31 can be installed on the front side of the second, third, and fifth electrolytic cells 32. To optimize the electrolysis process, the electrolyte concentration gradient is set in each cell, with the copper sulfate concentration increasing from 150 g / L to 180 g / L, ultimately reaching 200 g / L, while the sulfuric acid concentration increases from 85 g / L to 90 g / L, ultimately reaching 95 g / L. Furthermore, the temperature of all electrolytic cells is uniformly controlled within the range of 60~65℃ to ensure that the viscosity and resistance of the electrolyte reach ideal states, while avoiding additive decomposition and anode sludge treatment problems caused by excessively high temperatures. The temperature is controlled at 38±1℃, and the independent anode assembly of each cell adopts a titanium metal grid structure to ensure uniform current distribution. Specifically, the first conductive rollers 31 can be installed every other electrolytic cell or every two electrolytic cells. The overall design involves configuring multiple first conductive rollers 31 as distributed cathodes in the electrolytic field, thereby forming a step-by-step potential isolation.

[0033] Surface treatment device 4: A conveying roller with a diameter of 350 mm is installed in the surface treatment tank 42. Two-thirds of the roller surface is immersed in the electrolyte. The foil passes around the roller surface below the liquid surface to form an arc path with a radius of 10 cm. Two inclined anode plates are symmetrically arranged in the tank with an inclination angle of 25°. The lower end is offset by 8 cm towards the middle of the tank, thereby forming a gradual electrolytic field from 22 A / dm² at the foil inlet end to 5 A / dm² at the foil outlet end. The electrolyte is a mixture of copper sulfate and sulfuric acid, with a copper sulfate content of 160 g / L and a sulfuric acid content of 90 g / L. The temperature is controlled at 38±1℃.

[0034] Release layer generation device 2: The first brush plating component uses an electroless brush plating method to coat the phosphide salt solution onto the surface of the carrier layer to generate a phosphide film with a thickness of 50-80nm; the second brush plating component uses a pulse brush plating method with alternating positive and negative pulses (duty cycle 30%-50%) to deposit a phosphide metal layer on the phosphide film to form a release layer of the required thickness.

[0035] Post-processing and winding: The sulfuric acid solution concentration in the pickling tank is 60g / L, the temperature is 30℃, and the foil treatment time is 15 seconds; the water washing tank adopts three-stage water washing, with resistivity ≥10MΩ·cm, 15MΩ·cm, and 20MΩ·cm respectively; the chromate solution concentration in the passivation treatment tank is 12g / L, pH value is 3.5, the temperature is 30℃, and the treatment time is 30 seconds; the winding speed of the winding device 5 is synchronized with the conveying speed of each unit, and the tension is controlled at 50-70N to ensure that the finished product is wound flat.

[0036] Specifically, it includes a carrier layer 13, a release layer 15, and a copper foil layer 16. It is understandable that... Figure 4 In this embodiment, the copper foil layer 16 represents the non-cathode roller surface of the carrier copper foil, which is also referred to as the non-pressed surface or S-side (Smooth surface). The M-side represents the cathode roller surface of the carrier copper foil, which is also referred to as the pressed surface or M-side (Matte surface). In this embodiment, the release layer 15 is formed on the non-cathode roller surface of the carrier layer 13.

[0037] Existing technologies face a contradiction between continuous production and independent control of process units: segmented production results in excessively long exposure times (typically >4 hours) due to the carrier layer transfer process, leading to surface oxidation and crystallization; while traditional online solutions reduce transfer steps, the lack of effective potential isolation means when multiple electrolytic cells are connected in series causes current crosstalk, resulting in electrolytic field fluctuations and making it difficult to achieve uniform nanoscale deposition. This application's embodiments combine the "online linkage layout of foil forming machine - peeling layer forming device - copper foil forming device - surface treatment device" with the "setting of a first high-current conductive roller at the front end of each electrolytic cell," forming a combined solution that overcomes this technical bottleneck.

[0038] From a structural design perspective, the interconnected layout is not simply a series of equipment, but rather a seamless connection between various process units achieved through conveyor roller groups. This ensures that the exposure time of the carrier layer from generation to finished product winding is ≤3.0 minutes (as in Example 1, there is no winding and transfer process at a conveying speed of 2.5 meters / minute), fundamentally solving the pain point of high carrier layer oxidation rate (usually >10%) in existing segmented production. The first conductive roller is specifically set on the side of each electrolytic cell near the foil-making machine. Its high current carrying capacity (200-800 amps) and positional layout form a "distributed potential isolation barrier," allowing each electrolytic cell to independently control parameters such as electrolyte concentration, temperature, and current density (e.g., in the example, the copper sulfate concentration gradient in each cell is 150-200 g / L, and the independent temperature is controlled at 38±1℃), avoiding the problem of electrolytic parameter drift caused by current crosstalk in traditional multi-cell interconnected production. This combination of "continuous layout + multiple electrical isolation designs" is not a simple superposition of existing technologies, but rather a synergy of structure and function. It simultaneously achieves the three major technical goals of "improved production efficiency", "suppression of oxidation risk" and "stable electrolysis field". The resulting product performance improvement (such as the surface roughness Rz≤1.9μm and uniform particle size distribution of 80-200nm in Examples 1-3) is something that existing technologies cannot achieve by using online or multi-tank designs alone.

[0039] Example 1: High peel strength carrier copper foil (WW-C-RL3).

[0040] Product Features: Suitable for IC substrates, substrate-like boards, and mSAP processes; compatible with consumer electronics fields such as AI computing, communication, and storage; thin copper layer thickness of 3μm; side roughness Rz ≤ 2.0μm for functional processing and Rz ≤ 3.0μm for unprocessed side processing.

[0041] Preparation parameters: Foil generation parameters: Foil generation machine 1 prepares an 18μm (1 / 2oz) carrier layer at a generation speed of 2.5m / min.

[0042] Parameters of the first conductive roller 31: The three electrolytic cells 32 of the copper foil layer generating device 3 are equipped with three first conductive rollers 31, with currents of 600 amps, 700 amps and 800 amps respectively, voltages of 4.0 volts, and operating temperatures maintained at 30-32℃.

[0043] Release layer preparation: The electroless brush plating time of the first brush plating component is 12 seconds, and the pulse duty cycle of the second brush plating component is 40%, with a brush plating time of 18 seconds, thereby forming a release layer with a nanometer-thickness.

[0044] Copper foil layer preparation: Three electrolytic cells 32 were used for sequential deposition, with a total thickness of 3 μm (0.086 oz). The temperature of each cell was controlled at 38℃ to ensure uniform deposition.

[0045] Parameters of surface treatment device 4: the second conductive roller 41 has a current of 1200 amps and a voltage of 7.5 volts; the surface treatment tank 42 has an anode plate tilt angle of 25°, a lower end offset of 8 cm, and a current density gradient of 22-5 A / dm².

[0046] The post-processing flow is as follows: first, pickling for 15 seconds, then three-stage water washing, and then passivation treatment for 30 seconds, with the winding tension set at 65N.

[0047] Technical effects: The measured surface roughness Rz of the treated side is 1.7-1.9μm, and that of the untreated side is 2.6-2.8μm, both meeting the requirements of ≤2.0μm / ≤3.0μm.

[0048] According to GB / T7122-1996 standard, the peel strength of the release layer is adjustable within the range of 15-22 gf / cm, ensuring that the peel strength between the functional processing surface and the BT substrate is ≥2.86 lb / in, meeting the requirements of carrier board processing.

[0049] The unit area mass of the thin copper is 26±2g / ㎡, the tensile strength at room temperature (RT) is ≥300MPa, the elongation at room temperature (RT) is ≥11%, and the SEM test results show that its surface particles are uniform and dense, with no traces of oxidation.

[0050] Table 1. Typical technical specifications of the product in Example 1:

[0051] Example 2: Medium-thickness carrier copper foil (WW-C-RL2).

[0052] Product Features: Suitable for IC substrates, substrate-like boards, and mSAP processes, and adaptable to communication and storage consumer electronics. Its thin copper layer thickness is 2μm, with a roughness Rz≤2.0μm on the treated side and Rz≤3.0μm on the untreated side.

[0053] Preparation parameters: Foil generation parameters: Foil generation machine 1 prepares an 18μm (1 / 2oz) carrier layer at a generation speed of 2.3 m / min.

[0054] Parameters of the first conductive roller 31: The three electrolytic cells 32 of the copper foil layer generating device 3 are equipped with three first conductive rollers 31, with currents of 500 amps, 600 amps and 700 amps respectively, voltages of 3.8 volts, and operating temperatures maintained at 28-30℃.

[0055] Release layer preparation: The first brush plating component performs electroless brush plating for 10 seconds; the second brush plating component has a pulse duty cycle of 35% and a brush plating time of 15 seconds, ultimately forming a release layer with a nanometer-thickness.

[0056] Copper foil layer preparation: deposited sequentially in 3 electrolytic cells 32, with a total thickness of 2μm (0.057oz), and the temperature of each cell controlled at 37-38℃.

[0057] Parameters of surface treatment device 4: current of the second conductive roller 41 is 1050 amps and voltage is 7.2 volts; the anode plate of the surface treatment tank 42 has an inclination angle of 22° and a lower end offset of 6 cm; and the current density gradient is 18-5 A / dm².

[0058] Post-processing: First, perform pickling for 15 seconds, then three-stage water washing, and then passivation treatment for 30 seconds. The winding tension is 60N.

[0059] Technical effects: The measured surface roughness Rz of the treated side is 1.6-1.8 μm, while that of the untreated side is 2.5-2.7 μm, both meeting the requirement of ≤2.0 μm.

[0060] The peel strength of the release layer is 10-18 gf / cm (adjustable), and the peel strength between the functional treatment surface and the BT substrate is ≥2.86 lb / in, which meets the requirements for assembly and use.

[0061] Thin copper foil has a weight of 17±2g / ㎡, a tensile strength of ≥300MPa (RT), an elongation of ≥10% (RT), and a uniform surface particle distribution without agglomeration, ensuring its excellent performance in PCB manufacturing.

[0062] Table 2. Typical technical specifications of the product in Example 2:

[0063] Example 3: Ultrathin carrier copper foil (WW-C-RL1.5).

[0064] Product features: Suitable for IC substrates, substrate-like boards, and mSAP processes; compatible with thin and light AI computing power and consumer electronics devices; processed side roughness Rz≤2.0μm, unprocessed side roughness Rz≤3.0μm.

[0065] Preparation parameters: Foil production parameters: Foil production machine 1 prepares an 18μm (1 / 2oz) carrier layer at a production speed of 2.0 m / min, and avoids stretching deformation of the ultrathin carrier layer through a tension compensation system.

[0066] Parameters of the first conductive roller 31: The three electrolytic cells 32 of the copper foil layer generating device 3 are equipped with three first conductive rollers 31, with currents of 200 amps, 300 amps and 400 amps respectively, voltages of 3.5 volts, and operating temperatures maintained at 25-28℃ to avoid damage to the ultra-thin substrate caused by high current.

[0067] Release layer preparation: The first brush plating component is electroless for 2-5 seconds, and the second brush plating component has a pulse duty cycle of 30% and a brush plating time of 3-8 seconds, forming a nanoscale thickness release layer.

[0068] Copper foil layer preparation: Three electrolytic cells 32 were used for sequential deposition, with a total thickness of 1.5 μm (0.043 oz). Low current density deposition was used in each cell to ensure a strong bond between the copper foil layer and the release layer.

[0069] Surface treatment device 4 parameters: second conductive roller 41 current 900A, voltage 7.0V, surface treatment tank 42 anode plate tilt angle 20°, lower end offset 5cm, current density gradient 15-5A / dm², adapted to the low stress requirements of ultra-thin substrates.

[0070] Post-processing: pickling for 15 seconds → three-stage precision water washing (third stage resistivity ≥ 20 MΩ·cm) → passivation for 30 seconds, winding tension 55 N.

[0071] Technical effects: The measured side roughness of the treated surface is 1.5-1.7 μm, while that of the untreated surface is 2.4-2.6 μm, both meeting the industrial standard requirement of ≤2.0 μm.

[0072] In the manufacturing process of electronic products, the peel strength of the release layer is usually controlled within the range of 8-15 gf / cm (adjustable) to ensure that the peel strength between the functional processing surface and the BT substrate reaches or exceeds 2.86 lb / in, while ensuring that there is no damage during the peeling process.

[0073] The thin copper foil has a unit area mass of 13.5±2 g / m², a tensile strength ≥300 MPa (RT), and an elongation ≥9% (RT). These properties are higher than the tensile strength (approximately 220 MPa) and yield strength (approximately 60 MPa) of ordinary pure copper, indicating that the copper foil has high mechanical properties. SEM analysis shows that the surface particle size is between 80-200 nm, uniformly distributed, and without oxidation traces, meeting the requirements for use in thin and light electronic devices.

[0074] Table 3. Typical technical specifications of the product in Example 3:

[0075] Description of modified embodiments: If an offline mode is used, where the carrier layer is prepared and wound by an external foil-making machine and then transferred to this equipment for processing, the transfer time must be controlled to ≤4 hours. In this mode, the total current of the first conductive roller 31 is adjusted to 300-600 amps, the total current of the second conductive roller 41 is adjusted to 900-1100 amps, the lower end offset distance of the anode plate in the surface treatment tank 42 is 5-7 cm, and the current density gradient is 18-5 A / dm². Under this mode, the surface oxidation rate of the carrier layer can be controlled to ≤5%, and the surface particle size can reach 100-300 nm, still meeting the requirements for mid-to-high-end carrier copper foil and suitable for small-to-medium scale production scenarios.

[0076] In this embodiment, the technical design of the first conductive roller is not a functional reuse of ordinary conductive components, but rather, based on the process pain points of continuous deposition of carrier copper foil in multiple electrolytic cells, it achieves the dual functions of "high current deposition adaptation" and "potential isolation" for the first time. In the prior art, conductive rollers mostly only undertake the function of "conveying + single conduction", without considering the potential interference between multiple electrolytic cells during continuous production. When multiple electrolytic cells are deposited in series, the current in adjacent cells can easily form a cross-cell loop through the foil, resulting in unstable inter-cell potential difference, which in turn causes problems such as copper foil layer thickness deviation (usually > ±0.3μm) and surface particle agglomeration.

[0077] The embodiments of this application, where "the first conductive roller is a high-current conductive roller located on the side of each electrolytic cell adjacent to the foil-making machine," have two main advantages: First, the high current carrying capacity (200-800 amps) precisely matches the rapid deposition requirements of the copper foil layer. For example, in Embodiment 3, a uniform deposition of a 1.5μm ultrathin copper foil layer can be achieved with only 200-400 amps of current, resolving the contradiction between deposition efficiency and uniformity of the ultrathin copper foil layer. Second, the front-end layout design allows each electrolytic cell to form an independent electrolytic unit. Through the potential isolation effect of the first conductive roller, the current distribution error of the anode components in each cell is controlled within ±2% (as shown in the embodiment where the current density gradient of each cell is stable), avoiding cross-cell current crosstalk commonly seen in traditional online production. This dual constraint of "functional parameters + positional layout" enables the first conductive roller and the online linkage architecture to form a synergistic effect, not only ensuring the stability of continuous production in multiple electrolytic cells but also achieving product characteristics such as thin copper layers (1.5-3μm), low profile (Rz≤2.0μm), and high peel strength (≥2.86lb / in). These technical effects exceed the expectations of existing technologies.

[0078] It is understood that this disclosure is not limited to the detailed structure and arrangement of the proposed components. This disclosure may have other embodiments and can be implemented and executed in various ways. The aforementioned variations and modifications are all within the scope of this disclosure. It is understood that this disclosure, and the disclosure as defined herein, extends to all alternative combinations of two or more individual features mentioned or apparent in the text and / or drawings. All these different combinations constitute multiple alternative aspects of this disclosure. The embodiments described in this disclosure illustrate the best known way to implement this disclosure and enable those skilled in the art to utilize this disclosure.

Claims

1. A carrier copper foil production equipment, characterized in that, The copper foil production line comprises a green foil machine, a conveying roller set, a separation layer generating device, a copper foil layer generating device, and a surface treatment device. The green foil machine, the separation layer generating device, the copper foil layer generating device, and the surface treatment device are sequentially connected and linked through the conveying roller set, the conveying roller set is used for conveying the carrier layer prepared by the green foil machine to the rear end through the separation layer generating device, the copper foil layer generating device, and the surface treatment device in sequence; the copper foil layer generating device comprises a plurality of electrolytic cells, and the conveying roller set comprises a plurality of conveying rollers, one or more first conductive rollers are further included in the plurality of conveying rollers, each first conductive roller is located at one side of each electrolytic cell close to the green foil machine, and the first conductive roller is a large-current conductive roller.

2. The carrier copper foil production apparatus according to claim 1, characterized by, The conveying roller set further comprises one or more second conductive rollers, the second conductive rollers are located at one side of the surface treatment device close to the green foil machine, the second conductive rollers are located outside the surface treatment device, and the second conductive rollers are large-current conductive rollers.

3. The carrier copper foil production apparatus according to claim 2, characterized by The total current of the first conductive roller and the second conductive roller is between 200 and 2000 amperes, and the total current of the second conductive roller is greater than that of the first conductive roller.

4. The carrier copper foil production apparatus according to claim 1, characterized by The surface treatment device comprises at least one surface treatment tank, the surface treatment tank comprises an anode and one conveying roller, part of the roller surface of the conveying roller is immersed below the solution liquid level of the surface treatment tank, and the foil to be treated is conveyed to the rear around the conveying roller with the roller surface below the liquid level; The foil below the liquid level of the surface treatment tank is in an arc shape attached to the liquid level below the roller surface of the conveying roller, and the anode is immersed below the solution liquid level of the surface treatment tank.

5. The carrier copper foil production apparatus according to claim 4, characterized by The anode comprises two anode plates, and the two anode plates are symmetrically arranged on both sides of the conveying roller.

6. The carrier copper foil production apparatus according to claim 5, characterized by The two anode plates are arranged in an inclined manner, and the lower ends of the two anode plates are offset from the upper ends by a preset distance towards the middle of the surface treatment tank, and the preset distance is 1-10 cm.

7. The carrier copper foil production apparatus according to claim 2, characterized by The first conductive roller and the second conductive roller are both made of metal and have an axially-through hollow channel inside; the hollow channel is used for circulating cooling medium to cool the first conductive roller and the second conductive roller, so that the working temperature of the first conductive roller is maintained at 25-35℃, and the working temperature of the second conductive roller is maintained at 20-30℃.

8. The carrier copper foil production apparatus according to claim 3, characterized by The total current of the first conductive roller is between 200 and 800 amperes, and the total current of the second conductive roller is between 900 and 1250 amperes; and the voltage of the anode closest to the second conductive roller is between 7 and 8 volts.

9. The carrier copper foil production apparatus according to claim 1, characterized by Further comprising at least one pickling treatment tank, at least one water washing treatment tank, and at least one passivation treatment tank; the pickling treatment tank, the water washing treatment tank, and the passivation treatment tank are sequentially arranged on the side of the surface treatment device away from the copper foil layer generating device in the conveying direction of the foil.

10. The carrier copper foil production apparatus according to claim 1, characterized by The stripping layer generating device comprises a first brush plating assembly and a second brush plating assembly, the first brush plating assembly is used for generating a phosphating film by first brush plating on a preset surface of the carrier layer with phosphating salt; the second brush plating assembly is used for obtaining a stripping layer by second brush plating on the phosphating film with phosphating metal, and the second brush plating assembly is behind the first brush plating assembly.

11. The carrier copper foil production apparatus according to claim 10, wherein The brush plating mode of the first brush plating assembly is electroless brush plating, and the brush plating mode of the second brush plating assembly is pulse brush plating, the pulse type is positive pulse and negative pulse alternation, and the duty cycle is 30%-50%.

12. The carrier copper foil production apparatus according to claim 1, characterized by The copper foil layer generating device comprises a plurality of electrolytic cells arranged in sequence along the foil conveying direction, each of the electrolytic cells is provided with an independent anode assembly and a temperature control system, and the adjacent electrolytic cells are electrically isolated through the first conductive roller.

13. A carrier copper foil, characterized by, Prepared by the carrier copper foil production equipment according to any one of claims 1 to 12.

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