A vehicle-mounted ceramic aluminum-based copper-clad laminate and its processing method

By introducing a nano-gradient interface layer and a locking mechanism into the automotive ceramic aluminum-based copper-clad laminate, the problems of heat flow conduction, thermal stress relief, and mechanical bonding of automotive power electronic devices are solved, achieving efficient thermal management and structural stability, and improving the reliability and heat dissipation performance of the devices.

CN121240314BActive Publication Date: 2026-03-06LUOYANG INST OF SCI & TECH +2
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Patent Information

Application Number
CN202511813721.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-12-04
Publication Date
2026-03-06
Estimated Expiration
2045-12-04

AI Technical Summary

Technical Problem

Existing technologies cannot simultaneously solve the problems of ultra-high heat flux conduction, huge thermal stress resolution, long-term environmental aging, and high-strength mechanical bonding of automotive power electronic devices, especially the interface fatigue and delamination cracking caused by the mismatch of thermal expansion coefficients between ceramic copper-clad laminates and aluminum heat sinks.

Method used

The design employs a nano-gradient interface layer and a locking mechanism. A multi-layer structure is constructed through processes such as electrospinning, chemical vapor deposition, and atomic layer deposition. Combined with a ceramic layer and an aluminum base layer, it forms an efficient thermal management pathway and mechanical interlock. The interlocking of reinforcing ribs and mounting holes counteracts the transverse shear stress caused by the mismatch in thermal expansion coefficients.

Benefits of technology

It significantly enhances the substrate's resistance to bending and vibration, suppresses delamination, ensures long-term structural integrity and reliability under harsh automotive conditions, and improves thermal management efficiency and system power density.

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Abstract

This invention relates to the field of electronic materials technology, and more particularly to an automotive-grade ceramic aluminum-based copper-clad laminate and its processing method. The technical solution includes a copper-clad layer, a ceramic layer, a nano-gradient interface layer, and an aluminum base layer. The ceramic layer adopts a functionally graded integrated design. The aluminum base layer integrates heat dissipation fins, pin-shaped heat dissipation columns, and microporous channels. Reinforcing ribs penetrate the mounting holes of the interface layer to form a macroscopic mechanical interlock. The peripheral locking mechanism converts the longitudinal bolt locking force into a lateral clamping force through the cooperation of wedge-shaped blocks and slots, actively suppressing vibration fretting and thermally induced shear stress, greatly enhancing the vibration resistance and reliability of the overall structure. The nano-gradient interface layer, composed of an alumina nanofiber layer and a nanowire composite network, solves four major problems: interface bonding, ultra-high thermal conductivity, oxidation resistance, and stress buffering. This invention achieves excellent electrical insulation, extremely high thermal conductivity, excellent thermal shock resistance, and strong mechanical strength, perfectly meeting the requirements of automotive applications.
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