A vehicle-mounted ceramic aluminum-based copper-clad laminate and its processing method

Abstract

This invention relates to the field of electronic materials technology, and more particularly to an automotive-grade ceramic aluminum-based copper-clad laminate and its processing method. The technical solution includes a copper-clad layer, a ceramic layer, a nano-gradient interface layer, and an aluminum base layer. The ceramic layer adopts a functionally graded integrated design. The aluminum base layer integrates heat dissipation fins, pin-shaped heat dissipation columns, and microporous channels. Reinforcing ribs penetrate the mounting holes of the interface layer to form a macroscopic mechanical interlock. The peripheral locking mechanism converts the longitudinal bolt locking force into a lateral clamping force through the cooperation of wedge-shaped blocks and slots, actively suppressing vibration fretting and thermally induced shear stress, greatly enhancing the vibration resistance and reliability of the overall structure. The nano-gradient interface layer, composed of an alumina nanofiber layer and a nanowire composite network, solves four major problems: interface bonding, ultra-high thermal conductivity, oxidation resistance, and stress buffering. This invention achieves excellent electrical insulation, extremely high thermal conductivity, excellent thermal shock resistance, and strong mechanical strength, perfectly meeting the requirements of automotive applications.

Description

Technical Field

[0001] This invention relates to the field of electronic materials technology, and in particular to an automotive ceramic aluminum-based copper-clad laminate and its processing method. Background Technology

[0002] With the rapid development of automotive power electronics technologies such as new energy vehicles and high-end automotive radar, their core components are evolving towards ultra-high power density and extremely small package size. This places almost contradictory and demanding requirements on their heat dissipation substrates: they must simultaneously achieve excellent electrical insulation, extremely high longitudinal thermal conductivity, a coefficient of thermal expansion (CTE) that matches the semiconductor chip, and ultra-high reliability to withstand long-term severe thermal cycling and mechanical vibration.

[0003] Currently, mainstream technologies such as ceramic-clad copper (DBC / AMB) and metal-based copper (IMS) clad laminates both suffer from fundamental and irreconcilable defects. While CBC clad laminates offer good insulation, the significant mismatch in thermal expansion coefficients between them and aluminum heat sinks generates fatal shear stress during thermal cycling, leading to interfacial fatigue, delamination, and even cracking. Although metal-based copper clad laminates have good compatibility with aluminum, their internal polymer insulation layer has extremely poor thermal conductivity, becoming a core bottleneck for heat dissipation. Furthermore, their insufficient resistance to high-temperature aging makes it difficult to meet reliability standards.

[0004] Existing technologies typically employ a single or simple material system to address issues such as ultra-high heat flux conduction, massive thermal stress mitigation, long-term environmental aging, and high-strength mechanical bonding in automotive power devices. A single material layer usually cannot solve these problems simultaneously. Therefore, a multi-material, functionally sequential automotive ceramic-aluminum-based copper-clad laminate structure is proposed, which combines the ceramic copper-clad laminate with aluminum heat dissipation to jointly solve the above problems, while fundamentally solving the reliability problem of connecting dissimilar materials from ceramic to aluminum. Summary of the Invention

[0005] The purpose of this invention is to address the problems existing in the background art by proposing a vehicle-mounted ceramic aluminum-based copper-clad laminate and its processing method.

[0006] In a first aspect, this application provides an automotive ceramic aluminum-based copper-clad laminate, including a copper-clad layer for attaching precision circuits, a ceramic layer, an aluminum base layer, and further comprising:

[0007] The nanogradient interface layer is fabricated on the bottom ceramic layer using electrospinning technology. The nanogradient interface layer includes a top layer, an intermediate layer, a functional layer, and a bottom layer arranged in a linear array from top to bottom. The fiber layer of the top layer and the mesh of the intermediate layer are interlocked and entangled. The intermediate layer and the functional layer are connected by a covering. The functional layer and the bottom layer are fused together.

[0008] The copper-clad laminate also includes a locking mechanism surrounding the copper-clad layer, ceramic layer, nano-gradient interface layer, and aluminum base layer. The locking mechanism includes two sets of protective plates, which respectively cover the upper and lower sides of the copper-clad layer, ceramic layer, nano-gradient interface layer, and aluminum base layer, and are rotatably connected by a pivot. The outer walls of both sets of protective plates are fixedly connected with wedge-shaped blocks and fixed with fixing bolts. The interior of the copper-clad layer and the aluminum base layer are provided with wedge-shaped slots that match the wedge-shaped blocks.

[0009] Optionally, the copper clad layer is attached to the upper surface of the ceramic layer by soldering or direct bonding to ensure excellent conductivity and sufficient peel strength. The ceramic layer includes a ceramic upper layer, a ceramic middle layer and a ceramic lower layer arranged in a linear array from top to bottom. The ceramic upper layer is disposed on the side close to the copper clad layer and the ceramic lower layer is disposed on the side close to the nano-gradient interface layer.

[0010] Optionally, the upper ceramic layer, middle ceramic layer, and lower ceramic layer are designed as a single unit to provide high insulation and high thermal conductivity.

[0011] Optionally, the top layer is an alumina nanofiber layer, the middle layer is a nanowire composite network, the functional layer is a rare earth oxide functionalized layer, and the bottom layer is a nanoporous aluminum-silicon alloy layer.

[0012] Optionally, the copper-clad laminate may also include an aluminum substrate connected to the underlying layer using a hot-pressing process;

[0013] The aluminum base layer includes heat dissipation fins with high heat dissipation characteristics. The heat dissipation fins are fixed inside the aluminum base layer. The aluminum base layer is provided with vertically designed needle-shaped heat dissipation columns and horizontally designed microporous channels.

[0014] Optionally, the needle-shaped heat dissipation columns are composed of several columns and arranged in a linear array.

[0015] Optionally, the micropore channels are composed of several and are designed in a crisscross pattern.

[0016] Optionally, the aluminum base layer is provided with reinforcing ribs, and the upper side of the outer wall of the reinforcing ribs extends through the interior of a pre-set mounting hole inside the nano-gradient interface layer.

[0017] Optionally, the thickness of the copper foil in the copper-clad layer varies in different regions.

[0018] Secondly, the present invention provides a method for processing automotive ceramic aluminum-based copper-clad laminates, applied to the automotive ceramic aluminum-based copper-clad laminate described in the first aspect, the method comprising the following steps:

[0019] S1. Provide a ceramic substrate as the ceramic layer;

[0020] S2. On a main surface of the ceramic substrate, the top layer is formed by electrospinning. On the top layer, the intermediate layer is grown by chemical vapor deposition. On the intermediate layer, the functional layer is formed by atomic layer deposition. On the functional layer, the bottom layer is deposited by plasma spraying, which together constitute the nanogradient interface layer.

[0021] S3. Provide an aluminum substrate as the aluminum base layer, and bond the bottom layer and the aluminum base layer together by a hot pressing process;

[0022] S4. Form the copper-clad layer on another main surface of the ceramic substrate.

[0023] In summary, this application includes at least one of the following beneficial technical effects:

[0024] This invention, through the tight fit between the reinforcing ribs and mounting holes, and the wedge-shaped locking design of the peripheral locking mechanism, forms an active stress reinforcement. This structure efficiently converts the longitudinal locking force into the transverse clamping force, which not only greatly enhances the bending and vibration resistance of the overall substrate, but also effectively suppresses the fretting wear of each functional layer under vibration. At the same time, it actively counteracts the transverse shear stress caused by the mismatch of thermal expansion coefficients, suppressing the delamination trend from the mechanical root, and ensuring the long-term structural integrity and reliability under harsh automotive conditions.

[0025] Furthermore, by working together with a functionally graded ceramic layer and an aluminum base layer with enhanced heat dissipation structure, a highly efficient and low-resistance thermal management path is formed from the chip to the environment. The ceramic layer achieves an optimized distribution of insulation and thermal conductivity, while the fins, pins, and microchannels of the aluminum base layer significantly improve convective heat transfer efficiency. Together, they significantly reduce the junction temperature of power components and increase the system power density.

[0026] Finally, the interlocking structure formed by the reinforcing ribs and mounting holes solves the reliability problem of vibration-thermal cycling coupling unique to the vehicle environment. This not only greatly enhances the bending and vibration resistance of the substrate, but also effectively suppresses thermal shear stress by generating mechanical compressive stress, which is the key to ensuring the long-term stable operation of the overall structure under harsh conditions. Attached Figure Description

[0027] Figure 1 A schematic diagram of the overall structure of a vehicle-mounted ceramic aluminum-based copper-clad laminate of the present invention is provided.

[0028] Figure 2 This is a schematic diagram of the overall exploded structure;

[0029] Figure 3 This is a schematic diagram of the structure beneath the copper cladding layer;

[0030] Figure 4This is a schematic diagram of the exploded structure of the nanogradient interface layer;

[0031] Figure 5 This is a schematic diagram of the exploded structure of an aluminum substrate.

[0032] Figure 6 This is a schematic diagram of the exploded structure of the ceramic layer;

[0033] Figure 7 for Figure 2 Enlarged view of point A in the middle;

[0034] Figure 8 This is a flowchart of a method for processing automotive ceramic aluminum-based copper-clad laminates.

[0035] Reference numerals: 1. Copper cladding layer; 2. Ceramic layer; 201. Upper ceramic layer; 202. Middle ceramic layer; 203. Lower ceramic layer; 3. Nanogradient interface layer; 301. Bottom layer; 302. Functional layer; 303. Intermediate layer; 304. Top layer; 4. Aluminum base layer; 401. Heat dissipation fins; 402. Needle-shaped heat dissipation columns; 403. Microporous channels; 5. Reinforcing ribs; 6. Mounting holes; 7. Locking mechanism; 701. Wedge-shaped slot; 702. Protective plate; 703. Shaft; 704. Fixing bolt; 705. Wedge-shaped block. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] like Figures 1-5 As shown, the present invention proposes an automotive ceramic aluminum-based copper-clad laminate, comprising a copper-clad layer 1 for fabricating and carrying electronic circuits and providing an electrical connection and mechanical mounting platform for power components, and a ceramic layer 2 that can achieve high electrical insulation and rapid heat dissipation; the copper-clad layer 1 is attached to the upper surface of the ceramic layer 2 by brazing.

[0038] The thickness of the copper foil in copper clad layer 1 varies in different areas. The following is a detailed description of the copper clad laminate:

[0039] In this embodiment, when the power element on the copper-clad layer 1 generates heat, the heat is first efficiently conducted to the ceramic layer 2 below. The ceramic layer 2 achieves electrical insulation while diffusing the heat laterally.

[0040] In another implementation, the copper cladding layer 1 is attached to the upper surface of the ceramic layer 2 by brazing or direct bonding.

[0041] Specifically, the brazing method uses an active brazing filler metal as the intermediate layer of 303, and the filler metal composition is a silver-copper-titanium alloy. The brazing process is carried out in a vacuum environment, and metallurgical bonding is achieved through the chemical reaction between the active element titanium and the ceramic surface.

[0042] The direct bonding method involves tightly bonding high-purity oxygen-free copper foil to a finely polished ceramic surface, and performing hot-press bonding under a reducing atmosphere to form a transition layer through atomic diffusion.

[0043] like Figures 1-5 As shown, the copper-clad laminate also includes a nano-gradient interface layer 3 that can eliminate thermal stress and prevent interface delamination and cracking, and an aluminum base layer 4 that can dissipate heat to the surrounding environment. In one embodiment, the aluminum base layer 4 is penetrated into the interior of the mounting holes 6 inside the nano-gradient interface layer 3 by reinforcing ribs 5. Through the interference or tight fit between the reinforcing ribs 5 and the mounting holes 6, a continuous mechanical compressive stress is applied at the key points of the interface. This compressive stress can effectively offset part of the transverse shear stress caused by thermal expansion, thereby significantly reducing the risk of interface delamination. It also provides an efficient heat path that leads directly from the nano-gradient interface layer 3 to the depth of the aluminum base layer 4, further optimizing the transverse and longitudinal heat distribution and dissipation efficiency, and avoiding the formation of local hot spots.

[0044] In this embodiment, heat enters the nanogradient interface layer 3. Through its functionally graded material properties, the nanogradient interface layer 3 efficiently conducts heat while mitigating thermal stress between the ceramic and metal. Ultimately, the heat is transferred to the aluminum substrate 4. During this process, the reinforcing ribs 5, which run through the nanogradient interface layer 3 and the aluminum substrate 4, form an interlocking structure across the aluminum substrate 4 and the nanogradient interface layer 3 through the tight fit of the mounting holes 6. This significantly enhances the overall mechanical rigidity and vibration and impact resistance of the substrate, enabling it to operate stably in complex automotive vibration environments. This ensures the structural integrity and reliability for long-term use, guaranteeing high reliability in automotive environments.

[0045] like Figure 1 , Figure 2 and Figure 5 As shown, the ceramic layer 2 also includes a ceramic upper layer 201, a ceramic middle layer 202 and a ceramic lower layer 203 arranged in a linear array from top to bottom; in one embodiment, the ceramic upper layer 201 is disposed on the side close to the copper clad layer 1 and the ceramic lower layer 203 is disposed on the side close to the nanogradient interface layer 3.

[0046] The upper ceramic layer 201, the middle ceramic layer 202, and the lower ceramic layer 203 are designed as a single unit to provide high insulation and high thermal conductivity. The ceramic layer 2 is described in detail below:

[0047] In this embodiment, the upper ceramic layer 201, which is close to the circuit, focuses on providing high insulation strength and high mechanical strength to ensure a firm bond with the copper-clad layer 1; the middle ceramic layer 202, as a performance transition zone, has a gradient change in composition and structure, which effectively buffers the internal stress caused by the difference in thermal expansion coefficients between the upper and lower layers; the bottom ceramic layer 203 focuses on achieving extremely high thermal conductivity, so as to efficiently and uniformly transport the accumulated heat to the nano-gradient interface layer 3.

[0048] like Figures 1-3 As shown, the nanogradient interface layer 3 also includes a top layer 304, a middle layer 303, a functional layer 302, and a bottom layer 301 arranged in a linear array from top to bottom. In one embodiment, the top layer 304 of the nanogradient interface layer 3 is directly prepared on the lower ceramic layer 203 at the bottom of the ceramic layer 2 using electrospinning technology. The top layer 304 is an alumina nanofiber layer, constructed using electrospinning technology. The middle layer 303 is a nanowire composite network, in-situ grown on the fiber network, and the nanowire composite network is raised in the vertical direction. The core functional layer 302 provides extremely high intrinsic thermal conductivity and ensures heat dissipation at ultra-high heat flux density. Functional layer 302 is a rare earth oxide functionalized layer. A dense rare earth oxide functionalized layer is wrapped with atomic layer deposition technology. This film perfectly isolates oxygen and moisture, providing protection for the nanowire network in the middle and ensuring stable performance. The bottom layer 301 is a nanoporous aluminum-silicon alloy layer. Its porous structure facilitates the diffusion of aluminum atoms during hot pressing to form a strong metallurgical bond. It also has good plastic deformation ability, which can absorb and dissipate energy, and is used to resolve stress and eliminate the risk of delamination.

[0049] The fiber layer of the top layer 304 and the mesh of the middle layer 303 are intertwined and connected in a staggered manner. Through the nano-interlocking effect, a high-strength, large-area initial bond with the ceramic layer 2 is achieved, and the first-level CTE buffer is completed. The middle layer 303 and the functional layer 302 are connected in a wrapping manner. The middle layer 303 provides extremely high longitudinal thermal conductivity, completely eliminating the heat dissipation bottleneck of this interface. The functional layer 302 and the bottom layer 301 are fused together. The functional layer 302, through its anti-oxidation barrier, ensures the chemical stability and thermal conductivity durability of the nanowire network under long-term high-temperature conditions. The porous structure of the bottom layer 301 facilitates hot-press diffusion to form a metallurgical bond. Its plasticity acts as the final stress buffer pad, completely absorbing and releasing residual stress. The nano-gradient interface layer 3 is described in detail below:

[0050] In this embodiment, the top layer 304 first forms a nanoscale interlock and chemical bond with the ceramic layer 2, achieving initial bonding and transition of thermal expansion coefficient; the heat is then captured by the intermediate layer 303, and the longitudinal heat transfer is greatly accelerated through the highly thermally conductive nanowire network; the functional layer 302 covers and protects the intermediate layer 303, preventing its high-temperature oxidation and ensuring the long-term stability of the heat channel; the final bottom layer 301 has a thermal expansion coefficient closest to that of the aluminum base layer 4, and achieves metallurgical bonding through hot pressing. While completing the final heat transfer, its porous plasticity completely resolves the interfacial stress and eliminates the risk of delamination.

[0051] like Figure 1 , Figure 2 and Figure 4 As shown, the aluminum base layer 4 also includes heat dissipation fins 401 with high heat dissipation characteristics; in one embodiment, the upper surface of the aluminum base layer 4 is connected to the bottom layer 301 under the nano-gradient interface layer 3 by hot pressing process, the heat dissipation fins 401 are fixed inside the aluminum base layer 4, and the aluminum base layer 4 is provided with vertically designed needle-shaped heat dissipation columns 402 and horizontally designed microporous channels 403.

[0052] The needle-shaped heat dissipation pillars 402 are composed of several elements and arranged in a linear array. The micro-channels 403 are composed of several elements and arranged in a crisscross pattern. The aluminum base layer 4 is described in detail below:

[0053] In this embodiment, the heat dissipation fins 401 on the surface of the aluminum base layer 4 significantly increase the contact area with the cooling air, achieving convective heat transfer under forced air cooling; the vertically distributed needle-shaped heat dissipation columns 402 further increase the heat dissipation area and improve heat dissipation efficiency under turbulent flow; while the crisscrossing microporous channels 403 inside form air circulation to carry away heat, meeting the heat dissipation requirements of extreme power.

[0054] like Figures 1-7 As shown, the copper-clad laminate also includes a locking mechanism 7 that surrounds the copper-clad layer 1, ceramic layer 2, nano-gradient interface layer 3, and aluminum base layer 4. In one embodiment, the locking mechanism 7 includes two sets of protective plates 702, which respectively cover the upper and lower sides of the copper-clad layer 1, ceramic layer 2, nano-gradient interface layer 3, and aluminum base layer 4, and are rotatably connected via a pivot 703. Wedge-shaped locking blocks 705 are fixedly connected to the outer walls of both sets of protective plates 702 and secured by fixing bolts 704. Wedge-shaped slots 701 that match the wedge-shaped locking blocks 705 are provided inside the copper-clad layer 1 and the aluminum base layer 4. The locking mechanism 7 is described in detail below:

[0055] In this embodiment, through the cooperation of its unique wedge-shaped locking block 705 and wedge-shaped locking groove 701, the longitudinal locking force of the fixing bolt 704 is efficiently converted into a huge transverse clamping force, forming a uniform pre-compression stress on the entire laminated structure, effectively suppressing the fretting wear of each layer under vibration, and actively offsetting the transverse shear stress generated in thermal cycling, thereby fundamentally preventing interface delamination and performance degradation. Its external protective plate 702 provides mechanical protection and structural reinforcement at the same time.

[0056] like Figures 1-8 As shown, the present invention also provides a method for processing automotive ceramic aluminum-based copper-clad laminates, the method comprising the following steps:

[0057] S1. Provide a ceramic substrate as ceramic layer 2;

[0058] S2. On a main surface of a ceramic substrate, a top layer 304 is formed by electrospinning. On the top layer 304, an intermediate layer 303 is grown by chemical vapor deposition. On the intermediate layer 303, a functional layer 302 is formed by atomic layer deposition. On the functional layer 302, a bottom layer 301 is deposited by plasma spraying. Together, they form a nano-gradient interface layer 3.

[0059] S3. Provide an aluminum substrate as an aluminum base layer 4, and combine the bottom layer 301 with the aluminum base layer 4 through a hot pressing process;

[0060] S4. A copper-clad layer 1 is formed on another main surface of the ceramic substrate.

[0061] Specifically, a flat ceramic layer 2 is provided as a substrate. On its lower surface, an electrospinning process is first used to obtain a uniformly distributed nanofiber layer with a three-dimensional network structure by precisely controlling the concentration of the spinning solution, the ambient temperature and humidity, and the electric field strength. Then, after heat treatment at an appropriate temperature, a strong nanoscale mechanical interlock and partial chemical bond are formed with the ceramic layer 2 to obtain a firmly bonded alumina nanofiber top layer 304. This fiber layer provides a huge specific surface area and abundant reactive sites.

[0062] Subsequently, a gaseous precursor is introduced onto the fiber layer using chemical vapor deposition (CVD). Under precisely controlled temperature and atmosphere, the precursor undergoes a chemical reaction, and the generated nanowire-like materials, such as carbon nanotubes and metal oxide nanowires, grow in situ in the fiber network, forming an interlocking nanowire composite network intermediate layer 303. By precisely controlling the reaction temperature, gas pressure, and precursor flow rate, the directional growth and interweaving of nanowires in the fiber network can be achieved, forming a continuous three-dimensional network structure with high thermal conductivity, which greatly enhances the mechanical strength and thermal continuity between layers.

[0063] Next, an atomic layer deposition (ALD) process is used to deposit a dense rare earth oxide film on the surface of the intermediate layer 303 of the nanowire composite network. By utilizing the inherent self-limiting surface reaction of ALD technology and the direct proportionality between film thickness and cycle number, the thickness of the functional layer 302 can be precisely and uniformly controlled, thereby achieving precise regulation of its antioxidant protection performance and interfacial activity. Layer by layer, the film is precisely deposited on the surface of the nanowire network to form a uniform, dense, and pinhole-free functional layer 302. This functional layer 302 effectively passivates the surface and provides a highly active interface for subsequent connections.

[0064] Then, a nanoporous aluminum-silicon alloy layer is deposited on the functional layer 302 using a plasma spraying process. By optimizing the spraying power, powder feeding rate and substrate preheating temperature, the flight state and spreading behavior of the molten particles can be controlled, thereby obtaining a coating with suitable porosity and surface activity, creating favorable conditions for subsequent hot-pressing metallurgical bonding with the aluminum substrate. After spreading and solidification, a bottom layer 301 with nanoscale pores is formed, and the porous structure provides a channel for subsequent hot-pressing diffusion.

[0065] Finally, the ceramic substrate with the prepared nano-gradient layer is aligned with the aluminum base layer 4, and a certain pressure and heat are applied through a hot pressing process. Under the combined action of heat and force, atoms on the surface of the aluminum substrate diffuse into the nanoporous layer, achieving a strong metallurgical bond and ultimately completing the integrated manufacturing of the entire copper-clad laminate.

[0066] The above specific embodiments are merely several optional embodiments of the present invention. Based on the technical solutions of the present invention and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. A vehicle-mounted ceramic aluminum-based copper-clad plate, comprising a copper-clad layer (1) attached with fine circuits, and a ceramic layer (2), a nano gradient interface layer (3) and an aluminum-based layer (4) sequentially stacked from top to bottom below the copper-clad layer (1), characterized in that: a top layer (304) at the top of the nano gradient interface layer (3) is directly prepared on a ceramic lower layer (203) at the bottom of the ceramic layer (2) by electrostatic spinning technology, the nano gradient interface layer (3) comprises a top layer (304), an intermediate layer (303), a functional layer (302) and a bottom layer (301) designed in a linear array from top to bottom, the fiber layer of the top layer (304) and the grid of the intermediate layer (303) are connected in staggered interaction, the intermediate layer (303) and the functional layer (302) are connected in a cladding shape, and the functional layer (302) and the bottom layer (301) are connected by melting; the copper-clad plate further comprises a locking mechanism (7) cladded on the periphery of the copper-clad layer (1), the ceramic layer (2), the nano gradient interface layer (3) and the aluminum-based layer (4), the locking mechanism (7) comprises two groups of protective plates (702), the two groups of protective plates (702) are cladded on the upper and lower sides of the copper-clad layer (1), the ceramic layer (2), the nano gradient interface layer (3) and the aluminum-based layer (4) around, and are rotationally connected through a rotating shaft (703), the outer walls of the two groups of protective plates (702) are fixedly connected with wedge-shaped clamping blocks (705) and are fixed through fixing bolts (704), and the interiors of the copper-clad layer (1) and the aluminum-based layer (4) are provided with wedge-shaped clamping grooves (701) matched with the wedge-shaped clamping blocks (705); the top layer (304) is an aluminum oxide nanofiber layer, the intermediate layer (303) is a nanowire composite network, the functional layer (302) is a rare earth oxide functional layer, and the bottom layer (301) is a nano porous aluminum-silicon alloy layer. the copper-clad layer (1) is attached to the upper surface of the ceramic layer (2) by brazing or direct bonding, the ceramic layer (2) comprises a ceramic upper layer (201), a ceramic middle layer (202) and a ceramic lower layer (203) designed in a linear array from top to bottom, the ceramic upper layer (201) is arranged on the side close to the copper-clad layer (1), and the ceramic lower layer (203) is arranged on the side close to the nano gradient interface layer (3).

2. The ceramic aluminum-based copper-clad plate for vehicle according to claim 1, wherein the ceramic upper layer (201), the ceramic middle layer (202) and the ceramic lower layer (203) are designed in an integrated manner.

3. The ceramic aluminum-based copper-clad plate for vehicle according to claim 2, wherein the copper-clad plate further comprises an aluminum-based layer (4) connected with the bottom layer (301) by a hot pressing process; 4. The ceramic aluminum-based copper-clad plate for vehicle according to claim 1, wherein the aluminum-based layer (4) comprises heat dissipation fins (401) with high heat dissipation characteristics, the heat dissipation fins (401) are fixed in the aluminum-based layer (4), and the aluminum-based layer (4) is provided with vertically designed needle-shaped heat dissipation columns (402) and horizontally designed microporous channels (403). the needle-shaped heat dissipation columns (402) are composed of a plurality of linear array-shaped designs.

5. The ceramic aluminum-based copper-clad plate for vehicle according to claim 4, wherein the microporous channels (403) are composed of a plurality of longitudinal and transverse interlaced designs.

6. The ceramic aluminum-based copper-clad plate for vehicle according to claim 4, wherein ​ 7. The ceramic aluminum-based copper-clad plate for vehicle according to claim 4, wherein The aluminum base layer (4) is internally provided with a reinforcing rib (5), and the outer wall of the reinforcing rib (5) is internally provided with a mounting hole (6) penetrating through the nanometer gradient interface layer (3).

8. The ceramic aluminum-based copper-clad plate for vehicles according to claim 1, wherein The copper foil thickness of the copper clad layer (1) is different in different regions.

9. A processing method of the vehicle-mounted ceramic aluminum-based copper-clad plate, applied to the vehicle-mounted ceramic aluminum-based copper-clad plate of any one of claims 1-8, characterized in that, The method comprises the following steps: S1, providing a ceramic substrate as the ceramic layer (2); S2, on one main surface of the ceramic substrate, the top layer (304) is formed by using an electrostatic spinning process, on the top layer (304), the middle layer (303) is grown by using a chemical vapor deposition process, on the middle layer (303), the functional layer (302) is formed by using an atomic layer deposition process, and on the functional layer (302), the bottom layer (301) is deposited by using a plasma spraying process, which together constitute the nanometer gradient interface layer (3); S3, providing an aluminum substrate as the aluminum base layer (4), and combining the bottom layer (301) and the aluminum base layer (4) by a hot pressing process; S4, forming the copper clad layer (1) on the other main surface of the ceramic substrate.

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