Image recognition pick-and-place re-inspection machine and method for semiconductor devices

Abstract

The application provides a kind of image recognition pick-up material re-inspection machine and method for semiconductor device, including work platform, conveying mechanism, laser device, n image recognition devices and gripper device.The method is first using laser device to measure the distance of semiconductor device on conveying mechanism to obtain distance H, then selecting image recognition device according to H, obtaining image by flying shot of semiconductor device through image recognition device, judging NG and OK semiconductor device, if there is no NG semiconductor device, conveying to next station, if there is NG semiconductor device, replacing OK semiconductor device from pick-up material area, then flying shot re-inspection, finally entering next station, the application, the efficiency of detection is high, the quality of detection is high, and can guarantee the yield of semiconductor device in tray entering next station.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor device manufacturing equipment, in particular to a semiconductor device image recognition picking and replenishing machine and method. BACKGROUND

[0002] With the development of the times, semiconductor chips are widely used in electronic products in various industries, so the role of semiconductor chips is becoming more and more important. Based on the importance of semiconductor chips, the quality of semiconductor chips needs to be guaranteed. When the semiconductor chips are taken off the blue film, the semiconductor chips need to be sorted and visually detected. Visual detection includes front detection, back detection and side detection. Detection is a core link of quality control. Detection can accurately identify scratches, cracks and stains on the surface of the semiconductor chip, eliminate unqualified products from the source, avoid defective semiconductor chips flowing into the subsequent packaging and assembly process, and greatly reduce the time and cost loss caused by rework and repair as well as the defects caused to subsequent products. However, in the existing detection device, the detection efficiency is relatively low when sorting qualified products and unqualified products, so a high-efficiency semiconductor chip detection device is needed.

[0003] As disclosed in the patent document with patent application number 202421279695.7 and publication date 2025.03.21, an OQC inspection equipment is provided. The OQC inspection equipment stores OK products on a first tray. After the visual detection assembly detects the products on the third tray by photographing, the turnover assembly sucks up the products on the third tray and turns them over to have the back face upward. After the visual detection assembly detects the back face of the products by photographing, the turnover assembly puts the sucked products back to the original position. Then, the identification and transfer assembly reads and identifies the codes of the products one by one, and according to the visual detection result, the NG products are transferred to the second tray. The OK products are sucked from the first tray for replenishment to ensure that the first tray is full of OK products and is conveyed to the next process along with the conveying belt. The OQC inspection equipment can realize the orderly production of visual detection, removal of NG products and replenishment of OK products, and avoid the quality and safety risks caused by manual operation of confusing NG products and OK products.

[0004] The above technical scheme can reliably remove NG products and supplement OK products, but when the visual detection assembly is used to take a photo of the product for detection, the focal length of the visual detection assembly needs to be adjusted first to improve the clarity of the photo taken by the visual detection assembly, and the photo detection of the product cannot be performed when the focal length of the visual detection assembly is adjusted. In addition, the OK product is directly conveyed to the next process after being supplemented to the tray, so it is unclear whether the arrangement of the products in the entire tray is qualified and whether the surface of the supplemented OK product meets the use requirements after the OK product is supplemented. For example, it is unclear whether the position of the supplemented OK product in the tray is tilted, whether there is a suction cup mark on the supplemented OK product, and whether there is other stains on the surface of the supplemented OK product. Therefore, it is difficult to ensure whether the products in the tray conveyed to the next process are qualified. In addition, the visual detection assembly in the above technical scheme adopts static photo detection, and the detection efficiency is low.

[0005] A visual online detection device and a detection process are disclosed in Chinese Patent Application No. 202311062322.4, and a visual online detection process is specifically disclosed, including the following steps:

[0006] S1, placing a tray containing products into a conveying device;

[0007] S2, conveying the tray to a code scanning device, stopping the tray with a stopping member, and reading the two-dimensional code on the tray and the products with a code scanning mechanism;

[0008] S3, after scanning, conveying the tray to a detection device, stopping the tray with a stopping member, vacuum adsorbing the products with a lifting positioning mechanism, and lifting the tray to the upper limit block;

[0009] S4, performing glue shape detection on the products with the detection device, and determining whether the products are qualified;

[0010] S5, conveying the tray to a picking device, stopping the tray with a stopping member, and picking unqualified products with a guide camera and a picking suction nozzle;

[0011] S6, supplementing qualified products into the idle grooves on the tray with the picking suction nozzle;

[0012] S7, discharging the tray full of qualified products.

[0013] For this technical scheme, the same technical problems as in Patent Application No. 202421279695.7 exist. SUMMARY

[0014] The present application provides a kind of image recognition picks and supplements material reinspection machine platform and method for semiconductor device, the present application, detection efficiency is high, detection quality is high, and can guarantee the yield of semiconductor device in the tray in the next process.

[0015] To achieve the above object, the technical scheme of the present application is as follows: a method for image recognition and material supplementing and re-inspecting of semiconductor devices, comprising the following steps:

[0016] S1 The conveying mechanism receives a tray loaded with semiconductor devices.

[0017] S2 The conveying mechanism conveys the tray loaded with semiconductor devices, and meanwhile measures the height H between the top surface of the semiconductor devices and the laser device.

[0018] S3 According to the current positions of the n image recognition devices and the distance H0 at which the image recognition device can obtain a clear image of the top surface of the semiconductor devices, and the distance H, the mth image recognition device is determined, wherein the mth image recognition device is the image recognition device that can obtain a clear image of the top surface of the semiconductor devices with the smallest distance to be moved, and the focal length of the mth image recognition device is adjusted; wherein n is an integer greater than or equal to 2, and m is an integer greater than or equal to 1.

[0019] S4 The conveying mechanism conveys the tray loaded with semiconductor devices to the position of the mth image recognition device, and then the mth image recognition device is used to take a snapshot of the semiconductor devices to form an image.

[0020] S5 The image is used to determine whether there is an NG semiconductor device in the tray loaded with semiconductor devices; if there is no NG semiconductor device, the tray loaded with semiconductor devices is transferred to the next station by the gripper device; if there is an NG semiconductor device, S6-S8 are performed.

[0021] S6 The number i and the position a of the NG semiconductor device in the tray are determined i The gripper device sequentially transfers the NG semiconductor devices to the NG tray in the NG area according to the number i and the position a i The OK semiconductor devices in the OK tray in the OK area are supplemented to the positions from which the NG semiconductor devices are removed.

[0022] S7 The tray supplemented with OK semiconductor devices is conveyed by the conveying mechanism to the position of the mth image recognition device for snapshot re-inspection.

[0023] S8 After the snapshot re-inspection is qualified, the tray loaded with semiconductor devices after the snapshot re-inspection is conveyed by the conveying mechanism and transferred to the next station by the gripper device.

[0024] Further, the movement direction of the conveying mechanism is set as the X-axis direction, the number of semiconductor devices arranged in the X-axis direction in the tray loaded with semiconductor devices on the conveying mechanism is e, and the number of semiconductor devices arranged in the Y-axis direction is f; in S2, the step of measuring the height H between the top surface of the semiconductor device and the laser device by using the laser device is: S21 when the conveying mechanism conveys the tray loaded with semiconductor devices to below the laser device, the laser device is started, and as the conveying mechanism conveys the tray loaded with semiconductor devices, the laser device first scans a row of semiconductor devices on one side in the Y-axis direction, and then scans each row of semiconductor devices in the X-axis direction in a zigzag track or an S-shaped track by the reciprocating movement of the conveying mechanism and the movement of the laser device in the Y-axis direction.

[0025] S22 the k distances h obtained by scanning by the laser device k , and the average value is calculated to obtain the distance H.

[0026] The distance H obtained by the above method can more accurately determine the focal length of the image recognition device.

[0027] Further, a distance h k is obtained every r seconds k , the total number of the distances h k obtained by scanning the tray loaded with semiconductor devices by the laser device is k=t / r+1, and H=(h1+h2+...h k ) / k. The distance H is formed by the average value, which provides a better basis for determining the image recognition device.

[0028] Further, in the process of conveying the tray loaded with semiconductor devices to the position of the mth image recognition device by the conveying mechanism, the focal length of the mth image recognition device is adjusted according to H0 and H. Therefore, on the one hand, it can provide a basis for adjusting the focal length of the image recognition device, and on the other hand, it can make the shooting of the image recognition device clearer.

[0029] Further, the step of forming an image by the mth image recognition device in S4 includes: S41 when the conveying mechanism conveys the tray loaded with semiconductor devices to the mth image recognition device, the mth image recognition device is started, and as the conveying mechanism conveys the tray loaded with semiconductor devices, the mth image recognition device first scans a row of semiconductor devices on one side in the Y-axis direction, and then scans each row of semiconductor devices in the X-axis direction in a zigzag track or an S-shaped track by the reciprocating movement of the conveying mechanism and the movement of the mth image recognition device in the Y-axis direction.

[0030] S42 the images obtained by the mth image recognition device are spliced to form an image.

[0031] The above method, each time the X-axis direction fly is carried out, the image recognition device is fixed, thereby improving the stability of the shooting, and the obtained image is more stable.

[0032] Further, a i The position determination method is that the original coordinate point on the image is a0, wherein a0 is (x0, y0), and the coordinate point (x i , y i ) of the intersection of the diagonal line of the semiconductor device relative to a0 is taken as the position of a i . In this way, the position of the NG semiconductor device can be accurately determined, and the accurate grabbing of the NG semiconductor device by the gripper device is realized.

[0033] Further, the fly review of S7 includes detecting the position of the semiconductor device in the tray filled with OK semiconductor devices and detecting the surface of the semiconductor device.

[0034] Further, the next station is a stacking station for stacking the trays loaded with semiconductor devices; the method for stacking the trays loaded with semiconductor devices is that the trays loaded with semiconductor devices, the electrostatic film and the cover plate are placed from bottom to top in the stacking station. The method realizes the stacking of the trays, and facilitates the smooth progress of the next process.

[0035] Further, after the trays loaded with semiconductor devices are stacked, they are sequentially banded, labeled and discharged. The method facilitates the discharge and subsequent transportation through banding, and facilitates the identification of the subsequent process through labeling.

[0036] The application also provides a semiconductor device image recognition and picking and filling re-inspection machine for realizing the above-mentioned semiconductor device image recognition and picking and filling re-inspection method, which comprises a work platform, a conveying mechanism, a laser device, n image recognition devices and a gripper device, the conveying mechanism is arranged on the work platform, the laser device is arranged on the work platform and above the conveying mechanism, the image recognition devices are installed on the work platform and above the conveying mechanism, and the gripper device is arranged on the work platform; a group of more than one picking and filling areas are arranged on the work platform and at the output end of the conveying mechanism, each group of picking and filling areas comprises an NG area and an OK area, the NG area is provided with an NG tray, and the OK area is provided with an OK tray loaded with OK semiconductor devices.

[0037] The beneficial effects of the present application are as follows: the distance H measured by the laser device is used to find the mth image recognition device closest to the distance H, that is, the distance at which the image recognition device can take a clear image of the semiconductor device is H0, the distance measured by the laser device is H, and the mth image recognition device is the image recognition device that needs the smallest adjustment in the Z-axis direction, so that the focal length of the mth image recognition device is adjusted to enable the mth image recognition device to obtain a clear image. In this process, on the one hand, the best image recognition device can be selected, and on the other hand, the mth image recognition device can be adjusted to the shooting focal length more quickly relative to other image recognition devices. In addition, the focal length of the mth image recognition device is adjusted when the tray loaded with semiconductor devices enters the mth image recognition device, so that the efficiency of image recognition is improved. In the present application, since the image is formed by flash shooting, that is, the image is formed during the movement of the semiconductor device relative to the image recognition device, the overall efficiency is improved from the conveying and image forming processes. Since the conveying mechanism conveys the tray filled with OK semiconductor devices to the position of the mth image recognition device for flash re-inspection, the main contents of the flash re-inspection include whether the positions of all semiconductor devices in the tray are accurate after the OK semiconductor devices are filled into the tray, whether there are suction cup marks on the surface of the filled OK semiconductor devices, whether there are cracks and other stains, and the like, so that the semiconductor devices in the tray conveyed to the next station meet the qualified requirements. BRIEF DESCRIPTION OF DRAWINGS

[0038] Figure 1 Partial top view of the semiconductor device sorting apparatus.

[0039] Figure 2 Partial top view of the semiconductor device sorting apparatus.

[0040] Figure 3 Three-dimensional view of the jig storage area, tray buffer area, cover plate placement area, and tray buffer area in the present application.

[0041] Figure 4 Schematic view of the first material receiving assembly in the present application.

[0042] Figure 5 Schematic view of the first horizontal movement assembly in the present application.

[0043] Figure 6 Schematic view of the first vertical movement assembly in the present application.

[0044] Figure 7 Schematic view of the first tray material receiving assembly in the present application.

[0045] Figure 8 Exploded view of the first tray material receiving assembly in the present application.

[0046] Figure 9 Figure 1 is a schematic view of a first carrying assembly in the present application.

[0047] Figure 10 Figure 2 is a schematic view of a detection assembly in the present application.

[0048] Figure 11 Figure 3 is a schematic view of a conveying base and a conveying mechanism in the present application.

[0049] Figure 12 Figure 4 is a schematic view of a second carrying assembly in the present application.

[0050] Figure 13 Figure 5 is a schematic view of a picking area and a stacking area in the present application.

[0051] Figure 14 Figure 6 is a schematic view of a bundling machine in the present application.

[0052] BRIEF DESCRIPTION OF THE DRAWINGS 1a - working platform; 11a - first material receiving assembly; 110a - first material receiving base; 111a - first horizontal moving assembly; 1110a - first horizontal moving base; 1111a - first horizontal moving motor; 1112a - first horizontal moving mounting seat; 1113a - first horizontal moving rotating rod; 1114a - first horizontal moving sliding block; 1115a - first guide sliding rail; 1116a - first guide block; 112a - first vertical moving assembly; 1121a - first vertical moving drive; 1122a - first vertical moving guide rail; 1123a - first vertical moving sliding block; 1124a - first vertical moving plate; 1125a - first vertical moving motor; 113a - first tray receiving assembly; 1131a - first tray plate; 1132a - first tray column; 1133a - first tray seat; 1134a - jig; 11331a - first tray cylinder; 11332a - first tray top block; 11333a - first tray sliding block; 12a - first carrying assembly; 121a - first carrying three-dimensional module; 122a - first clamping jaw; 123a - jig storage area; 124a - tray buffer area for incomplete trays; 125a - cover plate placement area; 126a - tray buffer area; 13a - detection assembly; 131a - conveying base; 1311a - detection vertical moving assembly; 1312a - detection tray receiving assembly; 132a - detection frame; 1321a - detection two-dimensional module; 1322a - image recognition device; 1323a - laser two-dimensional module; 14a - second carrying assembly; 141a - second carrying three-dimensional module; 142a - second clamping jaw; 143a - semiconductor device suction cup; 15a - picking area; 150a - buffer area for storing trays loaded with OK semiconductor devices; 151a - NG area; 152a - OK area; 153a - stacking area; 155a - finished product buffer area; 16a - bundling machine. DETAILED DESCRIPTION

[0053] The application will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

[0054] As shown in Figure 1 and Figure 2 A semiconductor device image recognition picking and replenishing re-inspection machine for detecting and sorting semiconductor devices, in this embodiment, mainly refers to chips, includes a workbench 1a, the workbench 1a is provided with a first material receiving assembly 11a, a first carrying assembly 12a, a detection assembly 13a, a second carrying assembly 14a and a picking and replenishing area 15a.

[0055] The first carrying assembly 12a carries the tray with semiconductor devices on the first material receiving assembly 11a to the detection assembly 13a, and the detection assembly 13a detects and re-inspects the semiconductor devices. The second carrying assembly 14a is used to pick up the NG semiconductor devices identified by the detection assembly 13a into the picking and replenishing area 15a, pick up the OK semiconductor devices in the picking and replenishing area 15a and fill them into the tray corresponding to the NG semiconductor devices, and transfer the tray with all OK semiconductor devices in the detection assembly 13a to the next work station.

[0056] In the application, the OK semiconductor device refers to a good product semiconductor device detected, and the NG semiconductor device refers to a defective product semiconductor device detected.

[0057] As shown in Figures 4-6 The first material receiving assembly 11a includes a first material receiving base 110a, a first horizontal moving assembly 111a, a first vertical moving assembly 112a and a first tray receiving assembly 113a. The first material receiving base 110a is arranged on the workbench 1a, the first horizontal moving assembly 111a is arranged on the first material receiving base 110a, the first horizontal moving assembly 111a is provided with the first vertical moving assembly 112a, and the first vertical moving assembly 112a is provided with the first tray receiving assembly 113a.

[0058] As shown in Figure 4 and Figure 5As shown, the first horizontal moving assembly 111a comprises a first horizontal moving base 1110a and a first horizontal moving driving mechanism, the first horizontal moving driving mechanism comprises a first horizontal moving motor 1111a and a first horizontal moving mounting seat 1112a, the first horizontal moving base 1110a is mounted on the first material receiving base 110a, the first horizontal moving motor 1111a and the first horizontal moving mounting seat 1112a are both mounted on the first horizontal moving base 1110a, a first horizontal moving rotating rod 1113a is rotatably arranged between the first horizontal moving motor 1111a and the first horizontal moving mounting seat 1112a, the first horizontal moving rotating rod 1113a is threadedly sleeved with a first horizontal moving sliding block 1114a, the first horizontal moving rotating rod 1113a and the first horizontal moving sliding block 1114a form a screw nut structure, a first guide sliding rail 1115a is arranged on one side of the first horizontal moving rotating rod 1113a, a first guide block 1116a is slidably arranged on the first guide sliding rail 1115a, and the first guide block 1116a and the first horizontal moving sliding block 1114a are connected with the first vertical moving assembly 112a. In this embodiment, the first horizontal moving driving mechanism is provided with two.

[0059] As shown in Figure 4 , Figure 6 , the first vertical moving assembly 112a comprises a first vertical moving driving mechanism 1121a, a first vertical moving guide rail 1122a and a first vertical moving sliding block 1123a, the first vertical moving driving mechanism 1121a is connected with the first guide block 1116a and the first horizontal moving sliding block 1114a, the first vertical moving driving mechanism 1121a adopts an existing motor, screw rod and nut structure, the first vertical moving guide rail 1122a is slidably provided with the first vertical moving sliding block 1123a, the first vertical moving sliding block 1123a is provided with a first vertical moving plate 1124a, and the first vertical moving plate 1124a is provided with a first material disc material receiving assembly 113a; the moving directions of the first horizontal moving assembly 111a and the first vertical moving assembly 112a are arranged perpendicularly. One first horizontal moving driving mechanism drives one first vertical moving assembly 112a.

[0060] As shown in Figure 4 , Figure 7 , and Figure 8 , the first material disc material receiving assembly 113a comprises a first material disc plate 1131a, the first vertical moving plate 1124a is further provided with a first vertical moving motor 1125a, the first vertical moving motor 1125a is connected with the first material disc plate 1131a, the first material disc plate 1131a is provided with a first material disc seat 1133a, a first material disc column 1132a is arranged between the first material disc plate 1131a and the first material disc seat 1133a, the first material disc column 1132a is fixedly connected with the first material disc seat 1133a, a first material disc air cylinder 11331a is further arranged in the middle of the first material disc seat 1133a, a first material disc top block 11332a is arranged on the output shaft of the first material disc air cylinder 11331a, and a first material disc sliding block 11333a is arranged on the first material disc top block 11332a.

[0061] As shown in Figure 1 and Figure 2 , the length direction of the working platform 1a is defined as the X-axis direction, the direction perpendicular to the X-axis direction on the horizontal plane is the Y-axis direction, and the direction perpendicular to the XY-axis plane is the Z-axis direction.

[0062] As shown in Figures 4 to 6 , the first horizontal movement motor 1111a drives the first horizontal movement rotating rod 1113a to rotate, the rotation of the first horizontal movement rotating rod 1113a drives the first horizontal movement slider 1114a to move linearly on the first horizontal movement rotating rod 1113a, the movement of the first horizontal movement slider 1114a drives the first guide block 1116a to move on the first guide rail 1115a, the first guide block 1116a and the first horizontal movement slider 1114a are connected with the first vertical movement assembly 112a, two first horizontal movement assemblies 111a are connected with two first vertical movement assemblies 112a respectively, so that the rotation of the first horizontal movement motor can drive the first vertical movement assembly 112a to move along the X-axis direction.

[0063] As shown in Figure 6 , the first vertical movement drive 1121a can drive the first vertical movement slider 1123a to move along the first vertical movement guide rail 1122a, the movement of the first vertical movement slider 1123a driven by the first vertical movement drive 1121a is also realized by the screw and nut structure formed by the output end of the first vertical movement drive and the first vertical movement slider 1123a, and since the first vertical movement slider 1123a is provided with the first vertical movement plate 1124a, the first vertical movement plate 1124a is provided with the first tray receiving assembly 113a, so that the first vertical movement drive 1121a can drive the first tray receiving assembly 113a to move along the Y-axis direction.

[0064] As shown in Figures 6-8 , the first tray seat 1133a and the first tray plate 1131a are fixedly connected through the first tray column 1132a, the first vertical movement motor 1125a is connected with the first tray plate 1131a, the extension and retraction of the output shaft of the first vertical movement motor 1125a can drive the first tray plate 1131a to move along the Z-axis, thereby driving the entire first tray receiving assembly 113a to move along the Z-axis.

[0065] The first tray seat 1133a is provided with a first tray cylinder 11331a at the bottom. The first tray seat 1133a is provided with a notch at one corner of the four corners. The first tray cylinder 11331a drives the first tray top block 11332a to move to the notch position in the corner direction of the first tray seat 1133a and abuts against the jig 1134a on the first tray seat 1133a. When it is necessary to replace the jig 1134a, the first tray cylinder 11331a drives the first tray top block 11332a away from the first tray seat 1133a, and then the appropriate jig 1134a is placed on the first tray seat 1133a. After that, the first tray cylinder 11331a drives the first tray top block 11332a to approach the first tray seat 1133a, so that the first tray top block 11332a abuts against the jig, and the positioning of the jig 1134a is completed.

[0066] As shown in Figure 1 、 Figure 2 、 Figure 3 and Figure 9 , the first conveying assembly 12a includes a first conveying three-dimensional module 121a. The first conveying three-dimensional module 121a is provided with a first clamping jaw 122a. One side of the first conveying three-dimensional module 121a is provided with a jig storage area 123a, a tray buffer area 126a, an incomplete tray buffer area 124a, and a cover plate placement area 125a. The jig storage area is used to buffer jigs of different sizes. The incomplete tray buffer area 124a is used to buffer incomplete trays. The cover plate placement area 125a is used to place cover plates of different sizes. The tray buffer area 126a is used to buffer trays. In this embodiment, the jig storage area 123a is provided with three, the tray buffer area 126a is provided with one, the incomplete tray buffer area 124a is provided with three, and the cover plate placement area 125a is provided with three.

[0067] The first tray seat 1133a on the first tray receiving assembly 113a is provided with a jig 1134a. The jig 1134a is used to place a tray. The cover plate, the tray, and the jig are matched.

[0068] The first three-dimensional transport module 121a can drive the first gripper 122a to move along the XYZ axis. The first three-dimensional transport module 121a adopts the existing three-dimensional module structure. After the tray on the first receiving component 11a is full of semiconductor devices, the first gripper 122a on the first three-dimensional transport module 121a first picks up the cover plate from the cover plate placement area 125a. Then the first gripper 122a moves to the corresponding position of the tray on the first receiving component 11a, so that the cover plate covers the tray. The first gripper 122a moves the tray together with the cover plate to the detection component 13a. After the tray is placed, the first gripper 122a drives the cover plate back to the cover plate placement area 125a and releases the cover plate. The first three-dimensional transport module 121a is a structure that realizes movement in the three directions of XYZ axis through a drive motor and a moving slide rail. The first gripper 122a is an existing gripper mechanism.

[0069] In this embodiment, when it is necessary to replace the fixture on the first receiving component 11a, if there is no material tray on the fixture, the fixture on the first receiving component 11a is first clamped into the fixture storage area 123a by the first transport three-dimensional module 121a, and then another type of fixture is clamped onto the first receiving component 11a by the first transport three-dimensional module 121a. If the jig has a tray containing semiconductor devices that are not fully loaded, the first three-dimensional transport module 121a first picks up the cover plate from the cover plate placement area 125a. Then, the first gripper 122a moves to the corresponding position on the tray, placing the cover plate on the tray. The first gripper 122a moves the tray to the incomplete tray buffer area 124a. Then, the first three-dimensional transport module 121a transfers the jig from the first receiving assembly 11a to the jig storage area 123a. Next, the first three-dimensional transport module 121a clamps a jig of another specification onto the first receiving assembly 11a. Finally, an empty tray is picked up from the tray buffer and placed on the jig. If the tray does not contain semiconductor devices, it is not necessary to cover it with a cover plate.

[0070] like Figures 10-11 As shown, the detection component 13a includes a conveying base 131a, a conveying mechanism, and a detection device. The conveying base 131a is mounted on the working platform 1a. The conveying mechanism includes a detection longitudinal movement component 1311a. In this invention, N detection longitudinal movement components 1311a are provided, where N = n + 1, and n is the number of image recognition devices, where n is an integer greater than or equal to 2. A detection tray receiving component 1312a is provided on the detection longitudinal movement component 1311a. The detection longitudinal movement component 1311a has the same structure as the first longitudinal movement component 112a, and the detection tray receiving component 1312a has the same structure as the first tray receiving component 113a. In this embodiment, three detection longitudinal movement components 1311a are provided.

[0071] The detection device comprises a detection frame 132a, and a laser two-dimensional module 1323a is arranged on the detection frame 132a. In the embodiment, the laser two-dimensional module 1323a adopts an existing motor, a lead screw and a nut structure, and the laser two-dimensional module 1323a can move in the Y-axis direction and the Z-axis direction. A laser device is arranged on the laser two-dimensional module, and the laser device is a laser sensor in the embodiment. The detection frame 132a is further provided with a detection two-dimensional module 1321a, and an image recognition device 1322a is arranged on the detection two-dimensional module 1321a. In the embodiment, the image recognition device is a camera, and two image recognition devices are arranged on both sides of the laser device. Since the first longitudinal movement assembly 112a and the detection longitudinal movement assembly 1311a are arranged in different directions, the detection longitudinal movement assembly 1311a drives the detection tray receiving assembly 1312a to move in the X-axis direction.

[0072] In the embodiment, the detection longitudinal movement assembly 1311a first drives the tray to move to the corresponding position of the laser sensor, and then the laser sensor measures the height of the semiconductor device on the tray. After the height is measured, the vertical distance between the camera lens and the surface of the semiconductor device can be accurately adjusted, so that the focal length is clear when the image is collected.

[0073] The detection two-dimensional module 1321a is arranged on both sides of the detection frame 132a, and the detection two-dimensional module 1321a can drive the camera to move in the Y-axis and Z-axis directions. The detection two-dimensional module and the camera detect the appearance of the semiconductor device by obtaining the picture of the semiconductor device through the camera and comparing the picture of the semiconductor device with the picture of the preset semiconductor device. If the similarity is within the preset range, the semiconductor device is determined to be an OK product, otherwise it is an NG product. The detection two-dimensional module 1321a is a structure for moving in the Y-axis and Z-axis directions through a driving motor and a sliding rail.

[0074] As shown in FIG. 13, Figures 12-13 The second conveying assembly 14a comprises a second conveying three-dimensional module 141a, and a clamping hand device is arranged on the second conveying three-dimensional module 141a. The clamping hand device comprises a second clamping jaw 142a and a semiconductor device suction disc 143a. The second conveying three-dimensional module 141a has the same structure as the first conveying three-dimensional module 121a.

[0075] A plurality of picking and replenishing areas 15a are arranged at the output end of the conveying mechanism, each of the picking and replenishing areas 15a includes an NG area 151a in which an NG tray is placed and an OK area 152a in which an OK tray loaded with OK semiconductor devices is placed. In the present embodiment, three groups of picking and replenishing areas 15a are arranged, and a buffer area 150a for storing the OK trays loaded with OK semiconductor devices is arranged at one side of the picking and replenishing areas 15a, and the buffer area 150a for storing the OK trays loaded with OK semiconductor devices is used to buffer the trays transferred from the conveying mechanism.

[0076] The second carrying three-dimensional module 141a drives the second gripper 142a and the semiconductor device suction tray 143a to move along the XYZ directions, and after the camera detects and determines the OK products, i.e., the OK semiconductor devices, and the NG products, i.e., the NG semiconductor devices, an empty tray is first placed in the NG area 151a as an NG tray, and a tray with OK semiconductor devices is placed in the OK area 152a.

[0077] As shown in Figs. 1 and 2, the buffer area 150a for storing the OK trays loaded with OK semiconductor devices is arranged at one side of the picking and replenishing areas 15a, and the buffer area 150a for storing the OK trays loaded with OK semiconductor devices is used to buffer the trays transferred from the conveying mechanism. Figure 12 and Figure 13 As shown in Figs. 1 and 2, the buffer area 150a for storing the OK trays loaded with OK semiconductor devices is arranged at one side of the picking and replenishing areas 15a, and the buffer area 150a for storing the OK trays loaded with OK semiconductor devices is used to buffer the trays transferred from the conveying mechanism.

[0078] A finished product buffer area 155a is arranged at one side of the stacking area 153a, and the finished product buffer area 155a is used to buffer the trays that have been stacked in the stacking area 153a, so as to give space to the stacking area and facilitate the stacking of the descending circulating trays.

[0079] The semiconductor device image recognition picking and replenishing re-inspection method corresponding to the semiconductor device image recognition picking and replenishing re-inspection machine includes the following steps:

[0080] S1 The conveying mechanism receives the tray loaded with semiconductor devices. That is, the first carrying assembly 12a transfers the tray loaded with semiconductor devices from the jig on the first receiving assembly 11a to the conveying mechanism.

[0081] S2 The conveying mechanism conveys the tray loaded with semiconductor devices, and simultaneously measures the height H between the top surface of the semiconductor devices and the laser device by using the laser device. In the present embodiment, the number of semiconductor devices arranged in the X-axis direction in the tray loaded with semiconductor devices on the conveying mechanism is e, and the number of semiconductor devices arranged in the Y-axis direction is f; in this step, the step of measuring the height H between the top surface of the semiconductor devices and the laser device by using the laser device is as follows:

[0082] S21 When the conveying mechanism conveys the tray loaded with semiconductor devices to below the laser device, the laser device is started, and as the conveying mechanism conveys the tray loaded with semiconductor devices, the laser device first scans a row of semiconductor devices on one side in the Y-axis direction, and then scans each row of semiconductor devices in the X-axis direction in a zigzag or S-shaped track by reciprocating movement of the conveying mechanism and movement of the laser device in the Y-axis direction.

[0083] S22 The k distances h obtained by scanning of the laser device k , and the average value is calculated to obtain the distance H, specifically: a distance h is obtained every interval r seconds k , the time for scanning of the tray loaded with semiconductor devices by the laser device is t seconds, the total number of distances h obtained is k = t / r + 1, and then H = (h1 + h2 +... h k k). For example: t = 50 seconds, r = 1 second, then k = 51, and the height measured each time is h1, h2, h3... h k , then H = (h1 + h2 + h3... h 51, k) / 51. 51

[0084] ​S3 determining the mth image recognition device according to the current positions of the n image recognition devices, the distance H0 at which the image recognition device can obtain a clear image on the upper surface of the semiconductor device, and the distance H, wherein the mth image recognition device is the image recognition device that needs to move the smallest distance to obtain a clear image on the upper surface of the semiconductor device, and adjusting the focal length of the mth image recognition device; wherein n is an integer greater than or equal to 2, and m is an integer greater than or equal to 1; in this embodiment, n = 2, and it is determined that the first camera and the second camera can obtain a clear image by moving the shortest distance, and then it is determined which camera to select to take a snapshot of the semiconductor device in the tray. In this application, the snapshot refers to taking a picture when the semiconductor device moves relative to the camera in the X-axis direction. In this step, the distance measurement is more uniform and accurate. During the process in which the conveying mechanism conveys the tray loaded with the semiconductor device to the position of the mth image recognition device, the focal length of the mth image recognition device is adjusted according to H0 and H and the current position of the camera, that is, H0 is the focal length distance from the camera lens to the upper surface of the semiconductor device, which is also the distance at which the clearest image on the upper surface of the semiconductor device can be obtained. The original Z-axis coordinate of the laser device is set to 0, the Z-axis original coordinates of the first image recognition device and the second image recognition device are set to 0, it is assumed that the first image recognition device currently moves downward by 3 mm in the Z-axis direction, the second image recognition device moves downward by 2 mm in the Z-axis direction, the distance measured by the laser device at the original position is 20 mm, and the H0 of all cameras is 10 mm. Then, the first image recognition device needs to move downward by 7 mm in the Z-axis direction to obtain a clear image, and the second image recognition device needs to move downward by 8 mm in the Z-axis direction to obtain a clear image. According to the principle that the camera with the shortest moving distance is selected, the first image recognition device is selected. That is, in this application, based on the original positions of the n image recognition devices and the laser device, the mth image recognition device is determined according to the current positions of the n image recognition devices, the distance H measured by the laser device, and the distance H0 at which the clearest image is obtained. If the distances moved by the n image recognition devices are the same, the image recognition device closest to the laser device is selected as the mth image recognition device. If the distances moved by the n image recognition devices are the same and the distances from the laser device in the X-axis direction are also the same, the image recognition device in front of the tray conveying direction is selected as the mth image recognition device.

[0085] S4 conveying the tray loaded with the semiconductor device to the position of the mth image recognition device by the conveying mechanism, and then taking a snapshot of the semiconductor device by the mth image recognition device to form an image; the step of taking a snapshot of the semiconductor device by the mth image recognition device to form an image includes:

[0086] S41 When the conveyor transports the tray loaded with semiconductor devices to the m-th image recognition device, the m-th image recognition device is activated. As the conveyor transports the tray loaded with semiconductor devices, the m-th image recognition device first scans a row of semiconductor devices located on one side in the Y-axis direction. Then, through the reciprocating motion of the conveyor and the movement of the m-th image recognition device in the Y-axis direction, it sequentially scans each row of semiconductor devices in the X-axis direction in a Z-shaped or S-shaped trajectory.

[0087] S42 stitches together the graphics obtained by the m-th image recognition device to form an image. In this step, the image recognition device remains stationary during each X-axis aerial shot, thereby improving the stability of the shooting and making the obtained image more stable.

[0088] S5 determines whether there are NG semiconductor devices in the tray containing semiconductor devices by image analysis; if there are no NG semiconductor devices, the tray containing semiconductor devices is transferred to the next station, i.e., the stacking area, by a gripper device; if there are NG semiconductor devices, proceed to S6-S8.

[0089] S6 Determine the quantity i and location a of NG semiconductor devices in the tray. i The gripper device is based on the number i and the position a i The NG semiconductor devices are sequentially transferred to the NG tray in the NG area; the gripper device then fills the positions of the removed NG semiconductor devices with the OK semiconductor devices from the OK tray in the OK area; a i The method for determining the position is as follows: The original coordinate point on the image is set as a0, where a0 is (x0, y0). The coordinate point (x0, y0) of the intersection of the diagonals of the semiconductor device relative to the coordinate point (x0, y0) of a0 is determined. i y i ) as a i The position and quantity i are obtained based on the comparison.

[0090] The S7 conveyor transports the tray filled with OK semiconductor devices to the position of the m-th image recognition device for on-the-fly inspection; the on-the-fly inspection includes detecting the position of the semiconductor devices in the tray filled with OK semiconductor devices and detecting the surface of the semiconductor devices.

[0091] After passing the S8 re-inspection, the trays loaded with semiconductor devices are conveyed by a conveyor mechanism and transferred to the next workstation using a gripper device. The next workstation is a stacking station where the trays loaded with semiconductor devices are stacked. The method for stacking the trays loaded with semiconductor devices is as follows: in the stacking position, the trays loaded with semiconductor devices and the electrostatic film are placed at intervals from bottom to top, and then a cover plate is placed on the top tray loaded with semiconductor devices.

[0092] S9 The tray loaded with semiconductor devices is sequentially subjected to beam sealing, labeling and unloading after stacking, the beam sealing can be realized by Figure 14 the beam sealer 16a shown in the figure, which is the existing beam sealer structure.

[0093] The above-mentioned image recognition and filling and re-inspection machine and method for semiconductor devices find the mth image recognition device closest to the distance H according to the distance H measured by the laser device, thereby adjusting the focal length of the mth image recognition device, so that the mth image recognition device can obtain a clear image. In this process, on the one hand, the best image recognition device can be selected, and on the other hand, the mth image recognition device can be quickly focused relative to other image recognition devices. In addition, the focal length of the image recognition device is adjusted when the tray loaded with semiconductor devices enters the mth image recognition device, so the efficiency of image recognition can be improved. In the present application, the image is formed by flash shooting, that is, the image is formed during the movement of the semiconductor device relative to the image recognition device. Therefore, the overall efficiency of conveying and image formation is improved. Since the conveying mechanism conveys the tray filled with OK semiconductor devices to the position of the mth image recognition device for flash re-inspection, the main content of the flash re-inspection includes whether the positions of all semiconductor devices in the tray are accurate after filling the OK semiconductor devices into the tray, whether there are suction cup marks, cracks and other stains on the surface of the filled OK semiconductor devices, and the like. Therefore, the semiconductor devices in the tray conveyed to the next station meet the qualified requirements.

Claims

1. A method for image recognition-based material picking and replacement re-inspection of semiconductor devices, characterized in that... Includes the following steps: S1 conveyor receives a tray loaded with semiconductor devices; The S2 conveyor conveys a tray loaded with semiconductor devices, while simultaneously using a laser device to measure the height H between the top surface of the semiconductor device and the laser device. S3. Based on the current positions of the n image recognition devices and the distance H0 and H among the n image recognition devices that can obtain a clear image of the upper surface of the semiconductor device, determine the m-th image recognition device, where the m-th image recognition device is the image recognition device that needs to move the minimum distance to obtain a clear image of the upper surface of the semiconductor device, and adjust the focal length of the m-th image recognition device; where n is an integer greater than or equal to 2, and m is an integer greater than or equal to 1; The S4 conveyor transports the tray loaded with semiconductor devices to the position of the m-th image recognition device. Then, the m-th image recognition device takes a picture of the semiconductor devices to form an image. S5 determines whether there are NG semiconductor devices in the tray loaded with semiconductor devices by image analysis; if there are no NG semiconductor devices, the tray loaded with semiconductor devices is transferred to the next station by a gripper device; if there are NG semiconductor devices, proceed to S6-S8. S6 Determine the quantity i and location a of NG semiconductor devices in the tray. i The gripper device is based on the number i and the position a i The NG semiconductor devices are sequentially transferred to the NG tray in the NG area; the gripping device then fills the positions of the removed NG semiconductor devices with the OK semiconductor devices from the OK tray in the OK area. The S7 conveyor mechanism transports the tray filled with OK semiconductor devices to the position of the m-th image recognition device for rapid re-inspection. After passing the S8 aerial inspection, the tray containing semiconductor devices is transported via a conveyor mechanism and transferred to the next workstation using a gripper device. If the n image recognition devices move the same distance, the image recognition device with the shortest distance from the laser device is selected as the m-th image recognition device. If the n image recognition devices move the same distance and are also the same distance from the laser device in the X-axis direction, the image recognition device in front of the tray in the conveying direction is selected as the m-th image recognition device. The laser device first scans a row of semiconductor devices on one side in the Y-axis direction. Then, through the reciprocating motion of the conveyor mechanism and the movement of the laser device in the Y-axis direction, it scans each row of semiconductor devices in the X-axis direction in a Z-shaped or S-shaped trajectory.

2. The image recognition-based material picking and replacement inspection method for semiconductor devices according to claim 1, characterized in that: The movement direction of the conveyor mechanism is set as the X-axis direction. The number of semiconductor devices arranged in the tray containing semiconductor devices on the conveyor mechanism is e in the X-axis direction and f in the Y-axis direction. In S2, the step of measuring the height H between the top surface of the semiconductor device and the laser device using a laser device is as follows: S21 When the conveyor mechanism transports the tray loaded with semiconductor devices to the area below the laser device, the laser device is activated, and the conveyor mechanism continues to transport the tray loaded with semiconductor devices. S22 obtains k distances h by scanning with a laser device. k And calculate the average value to obtain the distance H.

3. The image recognition-based material picking and replacement inspection method for semiconductor devices according to claim 2, characterized in that: A distance h is obtained every r seconds. k If the time taken for the laser device to scan the tray containing semiconductor devices is t seconds, then the distance h obtained is... k If the total number is k = t / r + 1, then H = (h1 + h2 + ... + h) / r. k ) / k.

4. The image recognition-based material picking and replacement inspection method for semiconductor devices according to claim 1, characterized in that: During the process of the conveying mechanism transporting the tray loaded with semiconductor devices to the position of the m-th image recognition device, the focal length of the m-th image recognition device is adjusted according to H0 and H.

5. The image recognition-based material picking and re-inspection method for semiconductor devices according to claim 1, characterized in that: The steps in S4 for taking a picture of the semiconductor device using the m-th image recognition device include: S41 When the conveyor conveys the tray loaded with semiconductor devices to the m-th image recognition device, the m-th image recognition device is activated. As the conveyor conveys the tray loaded with semiconductor devices, the m-th image recognition device first scans a row of semiconductor devices located on one side in the Y-axis direction. Then, through the reciprocating motion of the conveyor and the movement of the m-th image recognition device in the Y-axis direction, it sequentially scans each row of semiconductor devices in the X-axis direction in a Z-shaped or S-shaped trajectory. S42 stitches together the graphics obtained by the m-th image recognition device to form an image.

6. The image recognition-based material picking and re-inspection method for semiconductor devices according to claim 1, characterized in that: a i The method for determining the position is as follows: The original coordinate point on the image is set as a0, where a0 is (x0, y0). The coordinate point (x0, y0) of the intersection of the diagonals of the semiconductor device relative to the coordinate point (x0, y0) of a0 is determined. i y i ) as a i The location.

7. The image recognition-based material picking and replacement inspection method for semiconductor devices according to claim 1, characterized in that: The S7's fly-through inspection includes detecting the position of semiconductor devices in a tray filled with OK semiconductor devices and inspecting the surface of the semiconductor devices.

8. The image recognition-based material picking and re-inspection method for semiconductor devices according to claim 1, characterized in that: The next station is a stacking station for stacking trays containing semiconductor devices. The method for stacking trays containing semiconductor devices is as follows: trays containing semiconductor devices and electrostatic film are placed at intervals from bottom to top in the stacking station, and then a cover plate is placed on the top tray containing semiconductor devices.

9. The image recognition-based material picking and replacement inspection method for semiconductor devices according to claim 8, characterized in that: After stacking the trays containing semiconductor devices, they are sequentially bundled, labeled, and unloaded.

10. A semiconductor device image recognition picking and replacement inspection machine, used to implement the semiconductor device image recognition picking and replacement inspection method according to claim 1, characterized in that: The system includes a working platform, a conveying mechanism, a laser device, n image recognition devices, and a gripping device. The conveying mechanism is mounted on the working platform, the laser device is mounted on the working platform and located above the conveying mechanism, the image recognition devices are mounted on the working platform and located above the conveying mechanism, and the gripping device is mounted on the working platform. At the output end of the conveying mechanism on the working platform, there is one or more material handling areas. Each material handling area includes an NG area and an OK area. The NG area contains NG trays, and the OK area contains OK trays loaded with OK semiconductor devices. The laser device first scans a row of semiconductor devices located on one side in the Y-axis direction. Then, through the reciprocating motion of the conveying mechanism and the movement of the laser device in the Y-axis direction, it sequentially scans each row of semiconductor devices in the X-axis direction in a Z-shaped or S-shaped trajectory.

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