Temperature noise testing apparatus, method and system

Abstract

This application relates to the field of aerospace technology and discloses a temperature noise testing device, method, and system. This application utilizes a semiconductor cooler to generate precise temperature excitation on the surface of the test object. A first temperature sensor measures the temperature in real time and generates a feedback signal, while a second temperature sensor simultaneously measures multi-point temperature distribution data. A control module controls the power output of the semiconductor cooler based on the feedback signal, a temperature display module processes and displays the temperature distribution, and a structural module adjusts the temperature distribution. This allows the control module to comprehensively adjust the operating state of the semiconductor cooler based on the feedback signal and temperature distribution data, thereby achieving an accurate assessment of the temperature noise of the test object. This device solves the problem that related technologies cannot accurately assess the coupling effect of temperature noise on gravitational wave detection systems, improving assessment accuracy and reliability, and providing key technical support for ground verification of gravitational wave detection.

Description

Technical Field

[0001] This application relates to the field of aerospace technology, specifically to a temperature noise testing device, method, and system. Background Technology

[0002] In the field of space gravitational wave detection, such as in ground verification, temperature noise testing is a key technical aspect. It is necessary to achieve mK-level temperature stability and high-resolution multi-point temperature measurement in a vacuum environment in order to evaluate the impact of temperature gradient on the radiometer effect, thermal radiation pressure and outgassing effect of the test quality.

[0003] In related technologies, temperature control devices typically rely on single-point or limited-point measurement, such as using a single PT100 or NTC sensor for temperature monitoring. However, these technologies suffer from several limitations: First, insufficient temperature control accuracy, often only reaching ±0.1°C levels, failing to meet mK-level stability requirements. Second, low resolution in multi-point temperature measurement; common devices struggle to simultaneously process more than 40 temperature data points and lack effective interpolation algorithms to reconstruct the temperature profile. Third, inadequate thermal equilibrium design; existing structural modules such as vapor chambers and heat sinks are not optimized for vacuum environments, resulting in low heat dissipation efficiency and uneven temperature distribution. Furthermore, these technologies do not simulate space-based device conditions, leading to inconsistencies between ground-based testing and real-world environments. These limitations prevent these technologies from accurately assessing the coupling impact of temperature noise on gravitational wave detection systems. Summary of the Invention

[0004] This application provides a temperature noise testing device, method, and system to address the problem that related technologies cannot accurately assess the coupling effect of temperature noise on gravitational wave detection systems.

[0005] In a first aspect, this application provides a temperature noise testing device for ground-based verification of gravitational wave detection, comprising: a semiconductor cooler for generating temperature excitation on the surface of a test object; a first temperature sensor for measuring the real-time temperature of the test object's surface and generating a feedback signal; a second temperature sensor for simultaneously measuring temperature distribution data at multiple points on the test object's surface; a control module connected to the semiconductor cooler and the first temperature sensor for controlling the power output of the semiconductor cooler based on the feedback signal; a temperature display module connected to the second temperature sensor for processing the temperature distribution data and displaying the temperature distribution; and a structural module connected to the semiconductor cooler and the test object for equalizing the temperature distribution on the test object's surface; wherein the control module receives the feedback signal and the temperature distribution data processed by the temperature display module, and adjusts the operating state of the semiconductor cooler based on the feedback signal and the temperature distribution data to achieve temperature noise assessment of the test object.

[0006] Beneficial Effects: The temperature noise testing device provided in this application generates precise temperature excitation on the surface of the test object through a semiconductor cooler. Combined with real-time temperature measurement and feedback signal generation by a first temperature sensor, and simultaneous measurement of multi-point temperature distribution data by a second temperature sensor, the control module controls the power output of the semiconductor cooler based on the feedback signal. The temperature display module processes and displays the temperature distribution, and the structural module adjusts the temperature distribution. This allows the control module to comprehensively adjust the operating state of the semiconductor cooler based on the feedback signal and temperature distribution data, thereby achieving an accurate assessment of the temperature noise of the test object. This device solves the problem that related technologies cannot accurately assess the coupling effect of temperature noise on gravitational wave detection systems, improves the assessment accuracy and reliability, and provides key technical support for ground-based verification of gravitational wave detection.

[0007] In one optional implementation, the control module includes: a temperature control unit for executing a proportional-integral-derivative control algorithm to adjust the power output of the semiconductor cooler; a processing unit connected to the first temperature sensor for calibrating the position and correcting the data of the first temperature sensor; and a communication unit for uploading the temperature feedback signal of the control module and the temperature data of the temperature measurement and display module to a host computer in real time.

[0008] Beneficial effects: By refining the control module into a temperature control unit, a processing unit, and a communication unit, the temperature control unit executes a proportional-integral-derivative (PID) control algorithm to precisely adjust the power output of the thermoelectric cooler, ensuring temperature stability; the processing unit performs point calibration and data correction on the first temperature sensor, improving measurement accuracy; and the communication unit uploads data to the host computer in real time, facilitating remote monitoring and adjustment. This scheme enhances the dynamic response capability and data integrity of temperature control, further improving the reliability of temperature noise assessment and system operability.

[0009] In an optional implementation, the processing unit is further connected to the second temperature sensor and is used to perform point calibration of the first temperature sensor through the second temperature sensor, including generating correction coefficients for the nonlinear characteristics of the first temperature sensor using the Steinhart-Hart equation, and correcting the output of the first temperature sensor based on the correction coefficients.

[0010] Beneficial effects: By connecting the processing unit to the second temperature sensor, the first temperature sensor is calibrated using the second sensor, and the Steinhart-Hart equation is applied to generate correction coefficients to correct the nonlinear output of the first temperature sensor, significantly improving the measurement accuracy and linearity of the first temperature sensor. This scheme reduces temperature feedback errors, ensuring that the control module adjusts the thermoelectric cooler based on high-precision data, thereby improving the temperature control accuracy and noise assessment accuracy of the entire device.

[0011] In one alternative embodiment, the first temperature sensor is a negative temperature system thermistor sensor, and the second temperature sensor is a platinum resistance temperature sensor.

[0012] Beneficial effects: By combining a negative temperature coefficient thermistor sensor and a platinum resistance temperature sensor, the real-time nature of temperature data and the reliability of multi-point measurements are ensured. This scheme optimizes data acquisition quality, provides a high-precision and highly stable data foundation for temperature noise assessment, and enhances the credibility of the assessment results.

[0013] In one optional implementation, the control module is used to establish bidirectional communication with the host computer via the RS232 serial communication protocol.

[0014] Beneficial effects: By establishing bidirectional communication between the control module and the host computer using the RS232 serial communication protocol, stable and real-time transmission of temperature feedback signals and temperature data is achieved, facilitating data recording, analysis, and control command issuance by the host computer. This solution enhances the system's interactivity and remote controllability, improves the automation level of the testing process, and supports efficient temperature noise assessment.

[0015] In one optional embodiment, the temperature measurement and display module includes: a signal processing unit connected to the second temperature sensor, used to process temperature data from the second temperature sensor through a bridge circuit and a lock-in amplifier circuit, and to digitize the temperature data through an analog-to-digital converter; a display unit connected to the signal processing unit, used to receive the digitized temperature data and display temperature distribution data in real time; and a transmission unit connected to the control module, used to transmit the temperature data processed by the display unit to the control module to support the temperature adjustment decision of the control module.

[0016] Beneficial effects: By refining the temperature measurement and display module into a signal processing unit, a display unit, and a transmission unit, the signal processing unit processes and digitizes the temperature data using a bridge circuit and a lock-in amplifier circuit. The display unit visualizes the temperature distribution in real time, and the transmission unit sends the data to the control module, achieving high-precision processing, real-time monitoring, and efficient transmission of temperature data. This solution supports the control module in making rapid adjustment decisions, improving the real-time performance and accuracy of temperature noise assessment.

[0017] In one alternative implementation, the signal processing unit supports simultaneous measurement of at least 40 channels of the second temperature sensor, with a measurement resolution of 10^-3 Kelvin.

[0018] Beneficial effects: By supporting simultaneous measurements from at least 40 secondary temperature sensors through the signal processing unit, and achieving a measurement resolution of 10^-3 Kelvin, this approach can capture subtle temperature changes and spatial distribution details on the test object's surface, providing high-resolution temperature data. This solution ensures the accuracy of temperature profile reconstruction, provides rich data support for temperature gradient calculation and noise assessment, and significantly enhances the detail and reliability of the evaluation.

[0019] In one alternative implementation, the transmission unit is used to transmit data with the control module via the Modbus remote terminal unit protocol.

[0020] Beneficial effects: By using the Modbus remote terminal unit protocol for data transmission with the control module, reliable packet packaging, efficient transmission, and good compatibility are ensured, reducing communication errors. This scheme optimizes the data flow, supporting the control module to receive temperature data in real time, thereby improving the efficiency of temperature adjustment decisions and the stability of the entire system.

[0021] In one optional embodiment, the structural module includes: a temperature equalization unit connected to the cold end of the thermoelectric cooler to equalize the temperature distribution of the thermoelectric cooler; a heat sink unit connected to the hot end of the thermoelectric cooler to dissipate the heat of the thermoelectric cooler; and a heat dissipation unit connected to the heat sink unit for dissipating heat to the external environment through heat pipes and air cooling devices.

[0022] Beneficial effects: By refining the structural modules into a temperature equalization unit, a heat sink unit, and a heat dissipation unit, the temperature equalization unit is connected to the cold end of the thermoelectric cooler to even out the temperature distribution. The heat sink unit is connected to the hot end to dissipate heat, and the heat dissipation unit dissipates heat through heat pipes and an air-cooling device, ensuring the uniformity of the surface temperature of the test object and the thermal stability of the system. This scheme prevents localized hot or cold spots, provides a stable thermal environment for temperature noise assessment, and improves the consistency and reliability of the assessment results.

[0023] In one optional embodiment, the temperature equalization unit includes: a temperature equalization plate, the surface of which is provided with a gold-plated layer; the surface of the temperature equalization plate is also provided with sensor pre-drilled holes for embedding the first temperature sensor and the second temperature sensor.

[0024] Beneficial effects: The temperature equalization unit, including a temperature equalization plate with a gold-plated surface and sensor pre-drilled holes, optimizes heat conduction efficiency and sensor installation accuracy. This solution ensures accurate placement and long-term stability of temperature measurement points, further enhances temperature distribution adjustment and data reliability, and supports more precise noise assessment.

[0025] In one optional embodiment, the device further includes a power supply module connected to the control module, the thermoelectric cooler, and the temperature measurement and display module, for supplying power to the control module, the thermoelectric cooler, and the temperature measurement and display module.

[0026] Beneficial effects: By connecting the power module to the control module, semiconductor cooler, and temperature display module, a stable power supply is provided, ensuring the normal operation of each module and avoiding the impact of power fluctuations on temperature control and measurement accuracy. This solution enhances the reliability and anti-interference capability of the device, provides a foundation for long-term stable testing, and improves the continuity and accuracy of temperature noise assessment.

[0027] In one optional embodiment, the power supply module includes: a dual-channel adjustable DC power supply for providing adjustable DC power to the control module and the semiconductor cooler; and an AC / DC switching power supply for providing DC power to the temperature measurement and display module.

[0028] Beneficial effects: By providing adjustable power to the control module and semiconductor cooler through a dual-channel adjustable DC power supply, and a stable DC power supply to the temperature measurement and display module through an AC / DC switching power supply, the power supply matching and flexible adjustment are achieved to adapt to different operating modes. This solution ensures the efficient operation of each module and power efficiency, further optimizing the overall performance and energy management of the device.

[0029] Secondly, this application also provides a temperature noise testing method, implemented by the temperature noise testing device of the first aspect or any embodiment described above, comprising: controlling a semiconductor cooler to alternately heat at a preset cycle through a control module to generate a periodic temperature difference on the surface of the object under test; synchronously collecting temperature distribution data at multiple points on the surface of the object under test through a second temperature sensor, and processing the temperature distribution data through a temperature measurement and display module; reconstructing the temperature profile of the object under test and calculating the temperature gradient distribution based on the temperature distribution data processed by the temperature measurement and display module; collecting the torsion balance oscillation data of the object under test, and analyzing the influence of temperature noise on the torque of the object under test in conjunction with the temperature gradient distribution.

[0030] Beneficial Effects: The temperature noise testing method provided in this application generates a periodic temperature difference by controlling a semiconductor cooler, simultaneously collecting multi-point temperature distribution data, processing the data to reconstruct the temperature profile and calculate the gradient, and combining the torque effect analysis with torsion balance oscillation data to achieve a comprehensive assessment of temperature noise. This scheme ensures the reliability and repeatability of the steps, directly solves the problem of inaccurate assessment of the coupled effects of temperature noise in related technologies, and provides an operable and efficient testing process.

[0031] Thirdly, this application also provides a temperature noise testing system, comprising: a temperature noise testing device according to the first aspect or any of the embodiments described above; a vacuum maintaining device for maintaining a vacuum environment on the order of 10^-5 Pascals; a test mass torsion balance device for simulating the sensitive structure of a gravitational wave detector as the test object; an optical detection device for acquiring torsion balance micro-displacement data of the test mass torsion balance device; and a data analysis device for correlating and analyzing the temperature data output by the temperature noise testing device with the torsion balance micro-displacement data.

[0032] Beneficial Effects: The temperature noise testing system provided in this application integrates a temperature noise testing device, a vacuum maintenance device, a test mass torsion balance device, an optical detection device, and a data analysis device, providing a complete testing platform. This system can accurately assess the torque effect of temperature noise on sensitive structures under simulated space conditions. It is highly systematic, and the assessment results are accurate and reliable, providing a comprehensive solution for ground-based verification of gravitational wave detection. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the specific embodiments or related technologies of this application, the drawings used in the description of the specific embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the module structure of a temperature noise testing device according to an embodiment of this application;

[0035] Figure 2 This is a schematic diagram of the module structure of the control module in an embodiment of this application;

[0036] Figure 3 This is a schematic diagram of the module structure of the temperature measurement and display module according to an embodiment of this application;

[0037] Figure 4 This is a schematic diagram of the module structure of an embodiment of this application;

[0038] Figure 5 This is a schematic diagram of the distribution of temperature sensor locations in an embodiment of this application from a top-down perspective;

[0039] Figure 6 This is a schematic diagram of the distribution of temperature sensor points in the side view of an embodiment of this application;

[0040] Figure 7 This is a schematic diagram of the temperature control scheme according to an embodiment of this application;

[0041] Figure 8This is a schematic diagram of an experimental device for temperature control via structural modules according to an embodiment of this application.

[0042] Figure 9 This is a temperature excitation sequence diagram of an embodiment of this application;

[0043] Figure 10 This is a schematic flowchart of the temperature noise testing method according to an embodiment of this application;

[0044] Figure 11 This is a flowchart illustrating the specific test experiment of the temperature noise testing method according to an embodiment of this application.

[0045] Figure 12 This is a graph showing the actual temperature change after the temperature noise test stabilized according to an embodiment of this application.

[0046] Figure 13 This is a schematic diagram of the module structure of the temperature noise testing system according to an embodiment of this application;

[0047] Figure 14 This is a structural diagram of the temperature noise testing system according to an embodiment of this application.

[0048] Explanation of reference numerals in the attached figures:

[0049] 1. Temperature and noise testing system; 10. Temperature and noise testing device; 20. Vacuum maintaining device; 30. Test mass torsion balance device; 40. Optical inspection device; 50. Data analysis device;

[0050] 100. Semiconductor cooler; 200. First temperature sensor; 300. Second temperature sensor;

[0051] 400. Control module; 410. Temperature control unit; 420. Processing unit; 430. Communication unit;

[0052] 500. Temperature measurement and display module; 510. Signal processing unit; 520. Display unit; 530. Transmission unit;

[0053] 600. Structural module; 610. Temperature distribution unit; 620. Heat sink unit; 630. Heat dissipation unit;

[0054] 700. Power module. Detailed Implementation

[0055] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0056] In the description of this application, it should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0057] Although there are already some devices and methods for temperature control and environmental simulation, there are still some key limitations that cannot meet the ground verification requirements for space gravitational wave detection.

[0058] First, space-based gravitational wave detection is extremely sensitive to relative temperature changes, requiring the generation of mK-level temperature gradients on structures under vacuum conditions and the maintenance of repeatable periodic excitation over a long period. However, existing temperature control systems often rely on single-point or limited-point measurements, making it difficult to simultaneously provide high-resolution (≈10) data at multiple points. -3 K) and the temperature profile that can be reconstructed by interpolation cannot accurately evaluate the coupling effect of the radiometer torque, thermal radiation pressure and outgassing effect caused by the temperature gradient.

[0059] Second, common temperature measurement schemes involve trade-offs in sensor selection and measurement chain: for example, while highly stable platinum resistance thermometers (PT100) have good linearity, their low resistance makes them unsuitable for achieving high quantization resolution in high-impedance measurement circuits; while thermistors (NTCs) have high resistance, which is beneficial for high-resolution measurements, but they are inherently less linear and drift over time. Related technologies typically do not combine the advantages and disadvantages of these two types of sensors through systematic calibration and closed-loop strategies to balance long-term stability and instantaneous resolution.

[0060] Third, to reproduce the surface treatments (such as gold plating) and thermal conductivity / reflection characteristics of the experimental subjects and spacecraft components in space, as well as the thermal conductivity / dissipation paths in a vacuum, existing ground-based devices have not been aligned with the actual coupling conditions of the target spacecraft in terms of structural modules, vapor chamber design, heat dissipation links, and vacuum interfaces. This results in inconsistencies between the obtained thermal response and the flight environment, thus affecting the accuracy of the mapping from temperature noise to torque noise. Therefore, related technologies cannot provide repeatable and interpolable temperature profiles and corresponding torque noise assessments while ensuring vacuum levels, long-term stability, multi-point mK-level measurement resolution, and consistency with spacecraft materials / structures.

[0061] Reference Figure 1 As shown, according to a first aspect of the embodiments of this application, a temperature noise testing device is provided for ground verification of gravitational wave detection, including a semiconductor cooler, a first temperature sensor, a second temperature sensor, a control module, a temperature measurement and display module, and a structural module.

[0062] Specifically, a thermoelectric cooler is used to generate temperature excitation on the surface of the test object; a first temperature sensor is used to measure the real-time temperature of the test object's surface and generate a feedback signal; a second temperature sensor is used to simultaneously measure temperature distribution data at multiple points on the test object's surface; a control module is connected to the thermoelectric cooler and the first temperature sensor, and controls the power output of the thermoelectric cooler based on the feedback signal; a temperature display module is connected to the second temperature sensor, and processes and displays the temperature distribution data; a structural module is connected to the thermoelectric cooler and the test object, and adjusts the temperature distribution on the test object's surface; wherein, the control module receives the feedback signal and the temperature distribution data processed by the temperature display module, and adjusts the operating state of the thermoelectric cooler based on this data to achieve temperature noise assessment of the test object.

[0063] The aforementioned temperature noise testing device generates precise temperature excitation on the surface of the test object using a semiconductor cooler. A first temperature sensor measures the temperature in real time and generates a feedback signal, while a second temperature sensor simultaneously measures multi-point temperature distribution data. A control module controls the power output of the semiconductor cooler based on the feedback signal, a temperature display module processes and displays the temperature distribution, and a structural module adjusts the temperature distribution. This allows the control module to comprehensively adjust the operating state of the semiconductor cooler based on the feedback signal and temperature distribution data, thereby achieving an accurate assessment of the temperature noise of the test object. This device solves the problem of related technologies being unable to accurately assess the coupling effect of temperature noise on gravitational wave detection systems, improving assessment accuracy and reliability, and providing key technical support for ground-based verification of gravitational wave detection.

[0064] Reference Figure 2As shown, in some embodiments of this application, the control module includes a temperature control unit, a processing unit, and a communication unit. The temperature control unit is used to execute a proportional-integral-derivative control algorithm to adjust the power output of the semiconductor cooler; the processing unit is connected to a first temperature sensor and is used to perform point calibration and data correction on the first temperature sensor; the communication unit is used to upload the temperature feedback signal of the control module and the temperature data of the temperature display module to the host computer in real time.

[0065] More specifically, the control module connects to a computer via a USB-232 cable. The computer allows adjustment, control, and display of a series of parameters and values, including: target temperature, actual temperature, temperature limit, maximum set temperature, minimum set temperature, temperature adjustment step value, decimal places in temperature display, maximum output voltage, hot / cold voltage ratio, maximum output current, output mode, switch, power output status, expected output voltage, actual output voltage, actual output current, sensor type, sensor deviation, sensor reference resistance, sensor resistance, NTC 25℃ resistance value, NTC thermistor calculation formula, NTC thermistor index formula coefficients, NTC thermistor S&H equation coefficient 1, NTC thermistor S&H equation coefficient 2, NTC thermistor S&H equation coefficient 3, PT. 0℃ resistance value, PT resistance coefficient 1, PT resistance coefficient 2, PT resistance coefficient 3, sensor open circuit protection result, sensor open circuit protection low threshold, sensor open circuit protection high threshold, PID type, PID proportional coefficient, PID integral time, PID derivative time, PID control interval, PID formula, automatic tuning progress, switch control window, dynamic acceleration window, overvoltage protection threshold adjustment, actual overvoltage protection threshold, overvoltage protection result, overcurrent protection threshold adjustment, actual overcurrent protection threshold, overcurrent protection result, current limiting protection switch, current limiting protection value, overtemperature protection mode, overtemperature protection low threshold, overtemperature protection high threshold, overtemperature protection result, overtemperature protection hysteresis value, TOK output polarity, external status, external control, data recording, data curves, etc.

[0066] In these embodiments, the control module is subdivided into a temperature control unit, a processing unit, and a communication unit. The temperature control unit executes a proportional-integral-derivative (PID) control algorithm to precisely adjust the power output of the thermoelectric cooler, ensuring temperature stability. The processing unit performs point calibration and data correction on the first temperature sensor to improve measurement accuracy. The communication unit uploads data to the host computer in real time, facilitating remote monitoring and adjustment. This scheme enhances the dynamic response capability and data integrity of temperature control, further improving the reliability of temperature noise assessment and system operability.

[0067] In some embodiments of this application, the processing unit is also connected to a second temperature sensor for point calibration of the first temperature sensor via the second temperature sensor, including generating correction coefficients for the nonlinear characteristics of the first temperature sensor using the Steinhart-Hart equation, and correcting the output of the first temperature sensor based on the correction coefficients.

[0068] More specifically, in some embodiments of this application, the first temperature sensor is a high-precision bare-head two-wire NTC thermistor sensor, which has a resistance of 10000Ω at 25°C and is a hemispherical sensor with a diameter of 1.3mm.

[0069] The second temperature sensor is a high-precision bare-head four-wire PT100 sensor. The sensor's dimensions (length * width * height) are 2.45mm * 2.1mm * 0.75mm. The four-wire PT100 sensor uses four wires for connection: two for transmitting the constant current source and the other two for transmitting the measurement signal. Because the constant current source and measurement signal are transmitted using separate wires, errors introduced by wire resistance can be completely eliminated, achieving high-precision temperature measurement.

[0070] In these embodiments, a processing unit is connected to a second temperature sensor. The second temperature sensor is used to calibrate the position of the first temperature sensor, and the Steinhart-Hart equation is applied to generate correction coefficients to correct the nonlinear output of the first temperature sensor, significantly improving the measurement accuracy and linearity of the first temperature sensor. This approach reduces temperature feedback errors, ensuring that the control module adjusts the thermoelectric cooler based on high-precision data, thereby improving the temperature control accuracy and noise assessment accuracy of the entire device.

[0071] In some embodiments of this application, the first temperature sensor is a negative temperature system thermistor sensor, and the second temperature sensor is a platinum resistance temperature sensor.

[0072] In these embodiments, the combination of a negative temperature coefficient thermistor sensor and a platinum resistance temperature sensor ensures the real-time nature of temperature data and the reliability of multi-point measurements. This approach optimizes data acquisition quality, provides a high-precision and highly stable data foundation for temperature noise assessment, and enhances the credibility of the assessment results.

[0073] In some embodiments of this application, the control module is used to establish bidirectional communication with the host computer via the RS232 serial communication protocol.

[0074] In these embodiments, the control module establishes bidirectional communication with the host computer using the RS232 serial communication protocol, achieving stable and real-time transmission of temperature feedback signals and temperature data. This facilitates data recording, analysis, and control command issuance by the host computer. This solution enhances the system's interactivity and remote controllability, improves the automation level of the testing process, and supports efficient temperature noise assessment.

[0075] Reference Figure 3 As shown, in some embodiments of this application, the temperature measurement and display module includes a signal processing unit, a display unit, and a transmission unit. The signal processing unit is connected to the second temperature sensor and is used to process the temperature data from the second temperature sensor through a bridge circuit and a lock-in amplifier circuit, and to digitize the temperature data through an analog-to-digital converter; the display unit is connected to the signal processing unit and is used to receive the digitized temperature data and display the temperature distribution data in real time; the transmission unit is connected to the control module and is used to transmit the temperature data processed by the display unit to the control module to support the temperature adjustment decision of the control module.

[0076] More specifically, in some embodiments of this application, the temperature display module comprises a touchscreen high-precision six-bit 40-channel controller, a 24-bit A / D converter chip, single-chip computer control technology, an RS232 amplifier, and 40-channel PT100 sensors. The temperature display module processes data obtained from multiple temperature sensor points, reads the temperature distribution, and modifies the temperature calibration values. This module uses PT100 temperature sensors to convert temperature data into values ​​accurate to three decimal places, which are then directly displayed on the touchscreen. The channel module and the touchscreen act as slave and master devices, respectively, using the standard Modbus-RTU protocol. A master computer is developed using LabVIEW based on the communication protocol, enabling real-time reading, display, and storage of temperature data on the computer.

[0077] Based on this, the temperature measurement and display module adopts an overall temperature measurement scheme of resistive temperature sensor + AC bridge + pre-amplifier + lock-in amplifier for readout. To convert the measured physical quantity into a digital signal that can be recognized, processed, and transmitted by a computer, a digital-to-analog (A / D) conversion is required. Existing A / D conversion modules are typically below 28 bits. Considering the special requirements of electronic components on spacecraft platforms and the effective bit redundancy of A / D conversion devices, this module limits the bit depth of the A / D conversion module to 16 bits to more closely approximate future real-world application scenarios. Under this premise, the system's resolution for any physical quantity is 1 / 2¹⁶, or 1.5 × 10⁻⁵. Therefore, this module uses a bridge circuit to eliminate most of the DC bias, leaving only the effective voltage signal caused by temperature changes, thereby improving the measurement resolution.

[0078] In these embodiments, the temperature measurement and display module is subdivided into a signal processing unit, a display unit, and a transmission unit. The signal processing unit processes and digitizes the temperature data using a bridge circuit and a lock-in amplifier circuit. The display unit visualizes the temperature distribution in real time, and the transmission unit sends the data to the control module. This achieves high-precision processing, real-time monitoring, and efficient transmission of temperature data. This solution supports the control module in making rapid adjustment decisions, improving the real-time performance and accuracy of temperature noise assessment.

[0079] Optionally, in some embodiments of this application, the signal processing unit supports simultaneous measurement of at least 40 second temperature sensors with a measurement resolution of 10^-3 Kelvin.

[0080] In these embodiments, the signal processing unit supports simultaneous measurements from at least 40 secondary temperature sensors with a measurement resolution of 10^-3 Kelvin, enabling the capture of subtle temperature changes and spatial distribution details on the test object's surface, providing high-resolution temperature data. This approach ensures the accuracy of temperature profile reconstruction, provides rich data support for temperature gradient calculation and noise assessment, and significantly enhances the detail and reliability of the evaluation.

[0081] Optionally, in some embodiments of this application, the transmission unit is used to transmit data with the control module via the Modbus remote terminal unit protocol.

[0082] In these embodiments, data transmission between the transmission unit and the control module utilizes the Modbus remote terminal unit protocol, ensuring reliable packet packaging, efficient transmission, and good compatibility, while reducing communication errors. This scheme optimizes the data flow, enabling the control module to receive temperature data in real time, thereby improving the efficiency of temperature adjustment decisions and the stability of the entire system.

[0083] Reference Figure 4 As shown, in some embodiments of this application, the structural module includes a temperature equalization unit, a heat sink unit, and a heat dissipation unit. The temperature equalization unit is connected to the cold end of the thermoelectric cooler to equalize the temperature distribution of the thermoelectric cooler; the heat sink unit is connected to the hot end of the thermoelectric cooler to dissipate the heat from the thermoelectric cooler; and the heat dissipation unit is connected to the heat sink unit to dissipate the heat to the external environment through heat pipes and air cooling devices.

[0084] In these embodiments, by refining the structural modules into a temperature equalization unit, a heat sink unit, and a heat dissipation unit, the temperature equalization unit is connected to the cold end of the thermoelectric cooler to equalize the temperature distribution, the heat sink unit is connected to the hot end to dissipate heat, and the heat dissipation unit dissipates heat through heat pipes and an air-cooling device, ensuring the uniformity of the surface temperature of the test object and the thermal stability of the system. This approach prevents localized hot or cold spots, provides a stable thermal environment for temperature noise assessment, and improves the consistency and reliability of the assessment results.

[0085] In some embodiments of this application, the temperature equalization unit includes: a temperature equalization plate, the surface of which is provided with a gold-plated layer; the surface of the temperature equalization plate is also provided with sensor pre-drilled holes for embedding a first temperature sensor and a second temperature sensor.

[0086] It should be noted that because some components used in the satellite's gravitational wave detection are gold-plated, which gives them excellent stability, superior thermal / electrical conductivity, and high reflectivity, gold plating was also applied during ground-based verification to ensure consistency with the conditions of the components on the satellite.

[0087] More specifically, in some embodiments of this application, the structural module includes a heat sink, a heat spreader, a mass block, a polyimide gasket, and polyimide screws. These are primarily used to balance heat, generate a temperature gradient, and dissipate heat generated by the TEC semiconductor cooler.

[0088] The heat spreader is made of CNC-machined copper, possessing high thermal conductivity and structural strength. The heat spreader is 16.6mm thick. Figure 5 As shown, the smaller frame is located symmetrically at the center of the larger frame. The smaller frame is machined downwards from the larger frame. The smaller frame has a side length of 50mm and a height of 1.6mm. Two 5.6mm long and 1.6mm high slits need to be left on both sides of one side of the smaller frame (to provide exit points for the TEC wires). The sensor pre-drilled holes are obtained by drilling holes in the heat spreader. Figure 5 From the top view, the 50mm*50mm frame is divided into 16 small squares. (Refer to...) Figure 6 As shown in the side view, the center of the five holes is at the center of the side height, with the diameter of the center hole being 4.5mm and the diameter of the other four holes being 3.5mm.

[0089] The heat sink is used to absorb the heat dissipated from the heat dissipation end of the TEC semiconductor cooler and to discharge it to the vacuum tank through the heat conduction tape. The device uses aluminum alloy and brass, which have high thermal coefficients. The heat conduction tape discharges the heat on the heat sink to the laboratory environment through the vacuum tank flange and is cooled by air.

[0090] The mass block is made of brass, and the temperature control design at both ends is symmetrical. There is a temperature distribution plate at each of its upper and lower ends. The temperature gradient is obtained by controlling the two temperature distribution plates.

[0091] Polyimide gaskets and polyimide screws are used to insulate heat and prevent thermal short circuits from forming on both sides of the thermoelectric cooler.

[0092] In these embodiments, the temperature equalization unit includes a temperature equalization plate with a gold-plated layer and sensor pre-drilled holes, optimizing heat conduction efficiency and sensor installation accuracy. This solution ensures accurate placement and long-term stability of temperature measurement points, further enhancing temperature distribution adjustment and data reliability, and supporting more accurate noise assessment.

[0093] Reference Figure 7 As shown, based on the above structure, the temperature control scheme of this application is as follows: The temperature controller is placed outside the vacuum tank to control the temperature of the two heat exchange plates inside the vacuum tank. The heat dissipation generated by the temperature control is transmitted to the outside of the vacuum tank through the heat-conducting copper pipe through the flange of the vacuum tank, and is cooled by air. The host computer edits the temperature control sequence and controls the temperature controller to generate a temperature control signal through the RS232 communication protocol to realize the temperature excitation of the system and thus test the temperature noise.

[0094] The experimental setup uses a PT100 platinum resistance thermometer for temperature measurement, with the TEC (thermal control unit) serving as the temperature control actuator. Auxiliary structures such as a heat spreader, heat sink, and heat pipes are required to complete the temperature conduction process. Thermal grease should be applied to the connections between the various temperature conduction mechanisms to improve the thermal conductivity of the gaps between the structural components. For specific temperature control solutions, refer to [reference needed]. Figure 9 As shown.

[0095] In this design, a temperature gradient is applied to both sides of the mass block, and the temperature control design at both ends is symmetrical. Taking one side as an example, the following explanation is provided:

[0096] Figure 8 The green area represents the temperature distribution plate, and its temperature represents the temperature applied to the mass block. Five sensors are distributed within the temperature distribution plate for temperature control and monitoring. Holes must be drilled in the temperature distribution plate to embed the sensors to ensure the accuracy of the test temperature. Materials with high thermal conductivity (aluminum alloy, brass, oxygen-free copper, and pure copper) are required.

[0097] Figure 8 The red label indicates a TEC semiconductor cooler. The green vapor chamber is the temperature control end, and the blue heat sink is the heat dissipation end. Since the TEC cools by transferring cold energy between its two ends, heat will be generated at the heat dissipation end during the temperature control process, and the heat needs to be conducted outward.

[0098] Figure 8 The blue area indicates a heat sink, which is used to absorb the heat dissipated by the TEC heat sink and discharge it to the vacuum tank through heat pipes. It needs to be made of a material with a high thermal conductivity (aluminum alloy, brass, oxygen-free copper, copper).

[0099] In the diagram, orange 8 represents a heat pipe that conducts heat from the heat sink to the laboratory environment through the vacuum tank flange.

[0100] In some embodiments of this application, the device further includes a power supply module connected to the control module, the thermoelectric cooler, and the temperature measurement and display module, for supplying power to the control module, the thermoelectric cooler, and the temperature measurement and display module.

[0101] In these embodiments, a stable power supply is provided by connecting the power module to the control module, the thermoelectric cooler, and the temperature display module, ensuring the normal operation of each module and avoiding the impact of power fluctuations on temperature control and measurement accuracy. This approach enhances the reliability and anti-interference capability of the device, provides a foundation for long-term stable testing, and improves the continuity and accuracy of temperature noise assessment.

[0102] In some embodiments of this application, the power supply module includes: a dual-channel adjustable DC power supply for providing adjustable DC power to the control module and the semiconductor cooler; and an AC / DC switching power supply for providing DC power to the temperature measurement and display module.

[0103] In these embodiments, a dual-channel adjustable DC power supply provides adjustable power to the control module and the thermoelectric cooler, while an AC / DC switching power supply provides stable DC power to the temperature measurement and display module. This achieves power matching and flexible adjustment to adapt to different operating modes. This solution ensures efficient operation of each module and high power efficiency, further optimizing the overall performance and energy management of the device.

[0104] Optionally, in some embodiments of this application, the thermoelectric cooler is model 8B082TZ420222-0, with dimensions of 50mm × 50mm × 4.14mm, and the cooling method involves transferring cold energy between its front and back ends. In testing, the thermoelectric cooler alternately heats at a cycle of 2500 seconds, generating a temperature difference of ΔT ≈ 400mK, with temperature stability better than 3mK. (Refer to...) Figure 9 The temperature excitation sequence shown ensures a repeatable excitation mode.

[0105] Based on the above embodiments, the control concept and debugging process of the control module of this application are as follows:

[0106] The control module employs a temperature controller based on classic PID closed-loop control, combined with sensor pre-calibration and linearization processing to achieve mK-level temperature control accuracy. The controller hardware includes a 16-bit A / D sampling channel, a dual-channel constant current source / drive, and an output power driver (dual-channel adjustable DC power supply interface for driving the TEC), and communicates with the host computer via RS232 (Modbus-RTU / custom protocol are both acceptable). The control strategy included in the control module is as follows:

[0107] Sensors and Signal Processing: The control loop uses NTC (bare-head, two-wire) as the main sensor to improve A / D measurement resolution (NTC nominal resistance ≈ 10 kΩ). Before each experiment, the system's built-in PT100 (four-wire, high stability) is used to calibrate the NTC and generate correction coefficients (see "Calibration and Linearization") to eliminate NTC zero drift and batch variations. The NTC temperature-resistance relationship is expressed using the Steinhart–Hart equation: 1 / T = A + Bln R + C(ln R) 3 The PT100 (platinum resistance thermometer) uses the Callendar–Van Dusen form or a low-order polynomial for temperature-resistance conversion; the coefficients of the two types of sensors and the S&H coefficients can be configured in the controller and stored by the host computer.

[0108] PID control loop: A discrete-time PID controller is used, which includes: integral limiting, derivative low-pass filtering, output saturation and limiting processing, feedforward / ramp setting, and adaptive gain scaling (using more conservative parameters when the deviation from the setpoint is large). The controller supports automatic tuning and manual fine-tuning.

[0109] Output and Protection: The controller output is a stable constant current / constant voltage drive TEC (supporting cold / hot polarity switching), and has overvoltage, overcurrent, overtemperature, and sensor open circuit protection logic (configurable thresholds). When an abnormality occurs, it enters a safe power reduction or disconnects the output. All key quantities (target temperature, actual temperature, PID parameters, output voltage / current, protection status) are uploaded to the host computer in real time and recorded.

[0110] Accuracy assurance measures include: employing a 16-bit ADC (effective bit count), a highly stable reference voltage, a constant current excitation source, and a low-noise amplifier; digital filtering (moving average or Kalman filtering optional) is applied to the raw ADC data; interpolation / polynomial correction or lookup table (LUT) is used to linearize the NTC; periodic PT100 cross-calibration is performed within the temperature control loop to monitor drift and recalibrate the NTC coefficients, ensuring long-term stability. These measures achieve single-point temperature control stability better than ±0.003 ℃ (3 mK) and support resolution requirements on the order of 1 mK.

[0111] Excitation and wiring: The PT100 uses a four-wire connection and is excited by a high-stability constant current source; the NTC uses a stable constant current or constant voltage source and attention should be paid to the influence of lead impedance (because it is a two-wire circuit, calibration is required to eliminate the error caused by the lead resistance).

[0112] According to a second aspect of the embodiments of this application, a temperature noise testing method is also provided, implemented by the temperature noise testing apparatus of the first aspect or any embodiment described above, with reference to... Figure 10 As shown, the method includes:

[0113] S1: The control module controls the semiconductor cooler to heat alternately at a preset cycle, generating a periodic temperature difference on the surface of the object under test;

[0114] S2: The temperature distribution data of multiple points on the surface of the object under test is collected synchronously through the second temperature sensor, and the temperature distribution data is processed by the temperature display module.

[0115] S3: Based on the temperature distribution data processed by the temperature measurement and display module, reconstruct the temperature profile of the object under test and calculate the temperature gradient distribution;

[0116] S4: Collect the torsion balance oscillation data of the object under test, and analyze the influence of temperature noise on the torque of the object under test in combination with the temperature gradient distribution.

[0117] The temperature noise testing method provided in this application generates a periodic temperature difference by controlling a semiconductor cooler, simultaneously acquiring multi-point temperature distribution data, processing the data to reconstruct the temperature profile and calculate the gradient, and combining the torque effect analysis with torsion balance oscillation data to achieve a comprehensive assessment of temperature noise. This scheme ensures the reliability and repeatability of the steps, directly solves the problem of inaccurate assessment of the coupled effects of temperature noise in related technologies, and provides an operable and efficient testing process.

[0118] More specifically, based on the above-mentioned temperature noise testing method, the testing scheme of this application refers to... Figure 11 As shown. First, the radiometer effect, thermal radiation pressure, and exhaust effect caused by the temperature gradient within the sensitive structure are measured to obtain the corresponding air pressure, temperature coefficient, and correction factor. To obtain the torque effect, heating points are symmetrically arranged on two opposite sides outside the sensitive structure and temperature excitation is applied. Temperature sensors are used to monitor the temperature at different locations. The temperature data is interpolated to obtain the spatial distribution of the temperature on the inner surface of the inertial sensor, reconstructing the temperature profile data. The obtained data is then processed and evaluated to finally assess the temperature noise.

[0119] Reference Figure 12 As shown, the two opposing TECs provide heating alternately in a 2500s cycle, with temperature stability better than 3mK.

[0120] Reference Figure 13 As shown, according to a third aspect of an embodiment of this application, a temperature noise testing system is also provided, including the temperature noise testing apparatus of the first aspect or any of the embodiments described above, and further comprising:

[0121] Vacuum maintaining device, used to maintain a vacuum environment on the order of 10^-5 Pascals;

[0122] Test mass torsion balance device, used as the test object, to simulate the sensitive structure of gravitational wave detector;

[0123] An optical detection device is used to collect micro-displacement data of the torsion balance of the test mass torsion balance device;

[0124] The data analysis device is used to correlate and analyze the temperature data output by the temperature noise testing device with the micro-displacement data of the torsion balance.

[0125] In the temperature noise testing system of this application, the test object adopts a test mass torsion balance device (i.e., a test mass torsion balance system), and the overall structural diagram of the testing system is shown in the figure below. Figure 14 As shown. This test uses the temperature gradient as the modulated signal source and uses optical readout to test the torque generated by it. TECs are attached to two fixed plates, and the hot end of the TEC is connected to the vacuum chamber via a graphite heating tape (or a copper tube or other material with high thermal conductivity) to ensure high-precision temperature control of the cold end of the TEC. The TEC applies temperature excitation to the system, thereby testing the impact of temperature noise on the system.

[0126] It should be noted that the testing process based on this system is as follows:

[0127] First, test preparation is required, including:

[0128] Adjust the temperature and noise testing system based on the test mass torsion balance to achieve a stable state;

[0129] The noise power spectrum of the optical readout laser interferometer circuit was confirmed to reach 10. -12 ms -2 Hz -1 / 2 Design specifications;

[0130] Confirm that the system vacuum level reaches 10. -5 Pa level;

[0131] Confirm that the software and hardware systems are ready for testing.

[0132] Secondly, it is necessary to ensure that the test environment meets the requirements, as detailed in Table 1 below.

[0133] Table 1 Testing Environment Requirements

[0134]

[0135] Finally, testing was conducted. A TEC (thermal energy control system) was used on two fixed plates to control and excite the temperature at the mK level, generating a periodic temperature difference. The oscillation of the torsion balance was measured, and the temperature distribution of the mass block was also tested.

[0136] The specific experimental steps are as follows:

[0137] (1) Complete the test preparation and set the laboratory temperature to 22℃.

[0138] (2) Control the temperature of the two fixed plates to 25±0.001℃.

[0139] (3) Control the temperature difference between the two fixed plates to 400mK (25±0.2℃). The temperature control stability is better than that of the plate. Use the periodic intermittent temperature excitation and use the optical readout system to measure the torque generated by the torsion balance. Record the temperature data of the test mass. Repeat this step 3 times.

[0140] (4) Change the temperature inside the vacuum chamber and stabilize it for 24 hours. Repeat step (3) with the ambient temperature inside the vacuum chamber set to 10℃, 15℃, 30℃, 35℃ and 45℃ respectively.

[0141] Adjust the vacuum level inside the vacuum chamber to 5×10 -5 Pa, 2×10 -4 Pa, 2×10 -3 Repeat step (3) under the Pa condition.

[0142] The temperature noise testing system provided in this application integrates a temperature noise testing device, a vacuum maintenance device, a test mass torsion balance device, an optical detection device, and a data analysis device, providing a complete testing platform. This system can accurately assess the torque effect of temperature noise on sensitive structures under simulated space conditions. It is highly systematic, and the assessment results are accurate and reliable, providing a comprehensive solution for ground-based verification of gravitational wave detection.

[0143] Although embodiments of this application have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of this application, and all such modifications and variations fall within the scope defined by the appended claims.

Claims

1. A temperature noise testing device for ground-based verification of gravitational wave detection, characterized in that, include: Semiconductor coolers are used to generate temperature excitation on the surface of a test object; The first temperature sensor is used to measure the real-time temperature of the surface of the test object and generate a feedback signal; The second temperature sensor is used to simultaneously measure the temperature distribution data at multiple points on the surface of the test object; A control module, connected to the thermoelectric cooler and the first temperature sensor, is used to control the power output of the thermoelectric cooler based on the feedback signal; A temperature measurement and display module, connected to the second temperature sensor, is used to process the temperature distribution data and display the temperature distribution. The temperature measurement and display module includes a signal processing unit, connected to the second temperature sensor, used to process the temperature data from the second temperature sensor through a bridge circuit and a lock-in amplifier circuit, and to digitize the temperature data through an analog-to-digital converter. The signal processing unit supports simultaneous measurement from at least 40 channels of the second temperature sensor, with a measurement resolution of 10^-3 Kelvin. A structural module, connected to the semiconductor cooler and the test object, is used to equalize the temperature distribution on the surface of the test object; the structural module includes: a temperature equalization unit, connected to the cold end of the semiconductor cooler to equalize the temperature distribution of the semiconductor cooler; the temperature equalization unit includes: a temperature equalization plate, the surface of which is provided with a gold-plated layer; The control module receives the feedback signal and the temperature distribution data processed by the temperature measurement and display module, and adjusts the operating state of the semiconductor cooler based on the feedback signal and the temperature distribution data to achieve temperature noise assessment of the test object.

2. The temperature noise testing device according to claim 1, characterized in that, The control module includes: The temperature control unit is used to execute a proportional-integral-derivative control algorithm to adjust the power output of the semiconductor cooler; The processing unit is connected to the first temperature sensor and is used to perform point calibration and data correction on the first temperature sensor. The communication unit is used to upload the temperature feedback signal of the control module and the temperature data of the temperature measurement and display module to the host computer in real time.

3. The temperature noise testing device according to claim 2, characterized in that, The processing unit is also connected to the second temperature sensor and is used to perform point calibration of the first temperature sensor through the second temperature sensor, including generating correction coefficients for the nonlinear characteristics of the first temperature sensor using the Steinhart-Hart equation, and correcting the output of the first temperature sensor based on the correction coefficients.

4. The temperature noise testing device according to claim 2, characterized in that, The first temperature sensor is a negative temperature system thermistor sensor, and the second temperature sensor is a platinum resistance temperature sensor.

5. The temperature noise testing device according to claim 2, characterized in that, The control module is used to establish bidirectional communication with the host computer via the RS232 serial communication protocol.

6. The temperature noise testing device according to claim 1, characterized in that, The temperature measurement and display module also includes: The display unit is connected to the signal processing unit and is used to receive the digitized temperature data and display the temperature distribution data in real time. A transmission unit, connected to the control module, is used to transmit the temperature data processed by the display unit to the control module to support the temperature adjustment decision of the control module.

7. The temperature noise testing device according to claim 6, characterized in that, The transmission unit is used to transmit data with the control module via the Modbus remote terminal unit protocol.

8. The temperature noise testing device according to claim 1, characterized in that, The structural module also includes: A heat sink unit is connected to the hot end of the thermoelectric cooler to dissipate the heat from the thermoelectric cooler; The heat dissipation unit, connected to the heat sink unit, is used to dissipate heat to the external environment through heat pipes and air cooling devices.

9. The temperature noise testing device according to claim 1, characterized in that, The surface of the temperature distribution plate is also provided with sensor pre-drilled holes for embedding the first temperature sensor and the second temperature sensor.

10. The temperature noise testing device according to any one of claims 1 to 9, characterized in that, The device further includes: A power supply module, connected to the control module, the semiconductor cooler, and the temperature measurement and display module, is used to supply power to the control module, the semiconductor cooler, and the temperature measurement and display module.

11. The temperature noise testing device according to claim 10, characterized in that, The power module includes: A dual-channel adjustable DC power supply is provided to supply adjustable DC power to the control module and the semiconductor cooler; An AC / DC switching power supply is used to provide DC power to the temperature measurement and display module.

12. A temperature noise testing method, implemented using the temperature noise testing apparatus according to any one of claims 1 to 11, characterized in that, include: The control module controls the semiconductor cooler to heat alternately at a preset cycle, generating a periodic temperature difference on the surface of the object under test; The temperature distribution data of multiple points on the surface of the object under test is collected synchronously by the second temperature sensor, and the temperature distribution data is processed by the temperature display module. Based on the temperature distribution data processed by the temperature measurement and display module, the temperature profile of the object under test is reconstructed and the temperature gradient distribution is calculated. The torsion balance oscillation data of the object under test are collected, and the influence of temperature noise on the torque of the object under test is analyzed in combination with the temperature gradient distribution.

13. A temperature noise testing system, characterized in that, include: The temperature noise testing apparatus according to any one of claims 1 to 11; Vacuum maintaining device, used to maintain a vacuum environment on the order of 10^-5 Pascals; Test mass torsion balance device, used as the test object, to simulate the sensitive structure of gravitational wave detector; An optical detection device is used to collect the micro-displacement data of the torsion balance of the test mass torsion balance device; A data analysis device is used to correlate and analyze the temperature data output by the temperature noise testing device with the micro-displacement data of the torsion balance.

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