Surface-mounted circuit board detection device and method

Abstract

The invention provides a patch circuit board detection device and method.The patch circuit board detection device comprises an image obtaining unit, an image processing unit and a comparison unit, the image obtaining unit comprises an infrared image obtaining assembly and a visible light image obtaining assembly, and the image processing unit preprocesses an obtained infrared image and an obtained visible light image; the two preprocessed images are fused, the outer frame of each component on the patch circuit board is displayed by adopting a visible light image, the other parts are displayed by adopting an infrared image, the fused images are sent to a judgment unit, and the judgment unit presets the fused image of the qualified patch circuit board as a reference. And if the two images are consistent, judging that the detected patch circuit board is qualified, and if the two images are not consistent, judging that the detected patch circuit board is unqualified. The problems that in the prior art, only infrared images are used, so that the resolution ratio is low, and small-size components cannot be accurately positioned are solved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of patch circuit board, and particularly relates to a patch circuit board detection device and method. BACKGROUND

[0002] For the inspection of patch circuit board welding, due to poor welding or other reasons, the surface temperature of the device on the patch circuit board is different from that of the normal board. In the process of analyzing and finding the original cause, a thermal imager made of an infrared sensor is used to inspect the surface temperature of the chip circuit board. The current infrared thermal imager displays the surface temperature of the entire chip circuit board through image color, and the human eye cannot directly see the device on the chip circuit board. Limited by the current technical ability, the resolution of the infrared sensor is low, and for the chip circuit board with small volume and dense components, it cannot accurately help positioning. SUMMARY

[0003] The present application aims to overcome the deficiencies in the prior art and provide a patch circuit board detection device and method. The present application scheme can solve the problems in the prior art.

[0004] The technical solution of the present application is as follows:

[0005] According to a first aspect, a patch circuit board detection device is provided, comprising an image acquisition unit, an image processing unit and a comparison unit. The image acquisition unit comprises an infrared image acquisition component and a visible light image acquisition component. The infrared image acquisition component acquires an infrared image of the patch circuit board and transmits it to the image processing unit. The visible light image acquisition component acquires a visible light image of the patch circuit board and transmits it to the image processing unit. The image processing unit pre-processes the obtained infrared image and visible light image, fuses the two pre-processed images, displays the outer frame of each component on the patch circuit board using the visible light image, and displays the remaining part using the infrared image. The fused image is sent to the judgment unit. The judgment unit presets the fused image of a qualified patch circuit board as a reference. If the two images are consistent, the patch circuit board under inspection is determined to be qualified. If the two images are not consistent, the patch circuit board under inspection is determined to be unqualified.

[0006] Further, the infrared image acquisition component comprises an infrared lens and an infrared sensor.

[0007] Preferably, the infrared sensor is a high-resolution infrared sensor.

[0008] Further, the visible light image acquisition component comprises a visible light lens and a visible light sensor.

[0009] Preferably, the visible light sensor adopts a high-resolution sensor of more than 10 million industrial level.

[0010] Further, the image preprocessing includes image cropping, dark level correction, bad point correction, noise removal and image enhancement processing.

[0011] Further, the image processing unit is a programmable device.

[0012] Further, the patch circuit board detection device further comprises a display unit, the display unit is connected with the judgment unit, the result of the judgment unit is displayed, and the difference is highlighted.

[0013] According to the second aspect, the above-mentioned patch circuit board detection method comprises the following steps:

[0014] Collect the visible light image and the infrared image of the qualified patch circuit board, and fuse them according to the image fusion method to obtain the fusion image of the qualified patch circuit board;

[0015] Collect the visible light image and the infrared image of the patch circuit board to be detected, and fuse them according to the image fusion method to obtain the fusion image of the patch circuit board to be detected;

[0016] The fusion image of the patch circuit board to be detected and the fusion image of the qualified patch circuit board are compared, if they are consistent, it is determined that the patch circuit board to be detected is qualified, if they are inconsistent, it is determined that the patch circuit board to be detected is unqualified.

[0017] Further, the image fusion method comprises the following steps:

[0018] S1.1, the obtained infrared image and visible light image are respectively preprocessed;

[0019] S1.2, the preprocessed infrared image and visible light image are fused, wherein the outer frame of each component on the patch circuit board is displayed by using the visible light image, and the remaining part is displayed by using the infrared image, to obtain the fusion image of the patch circuit board.

[0020] The present application has the following beneficial effects compared with the prior art:

[0021] By using the visible + infrared detection of the present application, the infrared image and the visible light image are fused, the outer frame of the component is displayed by using the visible light image, the problem of low resolution caused by using only the infrared image in the prior art is overcome, and the problem of accurate positioning of small components cannot be solved; the other positions are displayed by using the infrared image, the problem of large data and long transmission time caused by using all visible light images is overcome, and the circuit board problem can be efficiently, accurately and reliably positioned. BRIEF DESCRIPTION OF DRAWINGS

[0022] The accompanying drawings are included to provide a further understanding of embodiments of the application, and are incorporated in and constitute a part of this specification, illustrate embodiments of the application, and together with the description serve to explain the principles of the application. It is to be understood that other embodiments can be utilized, and structural and functional modifications can be made, without departing from the scope of the present application.

[0023] Figure 1 Fig. 1 shows a schematic diagram of a patch circuit board detection device according to an embodiment of the present application;

[0024] Figure 2 Fig. 2 shows a schematic diagram of an image processing acquisition unit and an image processing unit according to an embodiment of the present application. DETAILED DESCRIPTION

[0025] It should be noted that the embodiments and features of the embodiments in the present application can be combined with each other without conflict. The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings of the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. The description of the at least one exemplary embodiment is actually only illustrative, but not as any limitation on the present application and its application or use. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor are within the scope of protection of the present application.

[0026] It should be noted that the terms used herein are only for the purpose of describing specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. As used herein, the singular form is intended to include the plural form, unless the context clearly indicates otherwise, and it should be understood that when the terms "comprise" and / or "include" are used in the specification, there is a feature, step, operation, device, component and / or combination thereof.

[0027] The foregoing is a summary and thus contains only so much of the application's essential nature as is deemed necessary for introductory purposes. The application is described and claimed more fully in the following detailed description of preferred embodiments, in connection with the attached drawings. Unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by one of ordinary skill in the art to which this application belongs. The present application illustrates and describes the principles of the application and the best mode presently contemplated by the inventors for carrying out the application. This application is therefore to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims, and not the foregoing description. For the purposes of overcoming any possible ambiguity, all technical and scientific terms used herein have the same meanings as commonly understood by one of ordinary skill in the art to which this application belongs. Although any methods and materials similar or equivalent to those described herein can be used in the practice of the present application, the preferred methods, devices, and materials are described herein. Nothing herein is to be construed as an admission that the application is not entitled to antedate such disclosure by virtue of prior application. All publications mentioned herein are incorporated by reference in their entirety for the purpose of describing and disclosing the methodologies, devices, articles, and compositions which are described in the publications and which might be used in connection with the application. The citation of any reference in this application is not an admission that the reference is prior art, particularly with respect to any patentable aspect of the application. Any discussion of the references states what their authors assert, and applicants reserve the right to challenge the accuracy and pertinency of any of the cited references. It will be clearly understood that the description of the application is the same in principle, whether it is read from the perspective of the patentee or the patent challenger. Embodiments of the application will now be described, by way of example only, with reference to the accompanying drawings.

[0028] As Figure 1 shown, according to the embodiments of the present application, according to the first aspect, a patch circuit board detection device is provided, comprising an image acquisition unit, an image processing unit and a comparison unit, the image acquisition unit comprises an infrared image acquisition component and a visible light image acquisition component, the infrared image acquisition component acquires an infrared image of a patch circuit board and transmits the infrared image to the image processing unit, the visible light image acquisition component acquires a visible light image of the patch circuit board and transmits the visible light image to the image processing unit, the image processing unit pre-processes the obtained infrared image and visible light image, fuses the two pre-processed images, displays the outer frame of each component on the patch circuit board using the visible light image, and displays the remaining part using the infrared image, and transmits the fused image to the judgment unit, the judgment unit presets the fused image of a qualified patch circuit board as a reference, if the two images are consistent, it is determined that the patch circuit board under test is qualified, and if the two images are inconsistent, it is determined that the patch circuit board under test is unqualified.

[0029] Through the above setting, the infrared image and the visible light image are fused, the outer frame of the component is displayed using the visible light image, and the problem of low resolution caused by using only the infrared image in the prior art and the problem of being unable to accurately position the small component are overcome; the other positions are displayed using the infrared image, and the problem of long transmission time caused by using all visible light images is overcome.

[0030] Further in an embodiment, the infrared image acquisition component comprises an infrared lens and an infrared sensor.

[0031] Preferably in an embodiment, the infrared sensor is a high-resolution infrared sensor.

[0032] Further in an embodiment, the visible light image acquisition component comprises a visible light lens and a visible light sensor.

[0033] In one embodiment, the visible light sensor preferably adopts a high resolution sensor of more than 100 million industrial level.

[0034] In one embodiment, the image preprocessing includes cropping, dark level correction, bad point correction, noise reduction and image enhancement processing. Through the image preprocessing, the accuracy of component resolution is improved, and the placement requirement of the patch circuit board to be detected is reduced.

[0035] In one embodiment, the image processing unit is a programmable device.

[0036] In one embodiment, the patch circuit board detection device further comprises a display unit connected with the judgment unit, which displays the result of the judgment unit and highlights the difference. This is beneficial for the rapid identification of the human eye.

[0037] According to the second aspect, the above patch circuit board detection method is provided, which comprises the following steps:

[0038] The visible light image and the infrared image of the qualified patch circuit board are collected, and the images are fused according to the image fusion method to obtain the fusion image of the qualified patch circuit board.

[0039] The visible light image and the infrared image of the patch circuit board to be detected are collected, and the images are fused according to the image fusion method to obtain the fusion image of the patch circuit board to be detected.

[0040] The fusion image of the patch circuit board to be detected and the fusion image of the qualified patch circuit board are compared. If they are consistent, it is determined that the patch circuit board to be detected is qualified. If they are inconsistent, it is determined that the patch circuit board to be detected is unqualified.

[0041] In one embodiment, the image fusion method comprises the following steps:

[0042] S1.1 The obtained infrared image and visible light image are respectively preprocessed.

[0043] S1.2 The preprocessed infrared image and visible light image are fused, wherein the outer frame of each component on the patch circuit board is displayed by the visible light image, and the remaining part is displayed by the infrared image, to obtain the fusion image of the patch circuit board.

[0044] In order to have a further understanding of the patch circuit board detection device and method provided by the present application, specific examples and drawings are described in detail below.

[0045] For the inspection of the soldering of the patch circuit board, the surface temperature of the device on the patch circuit board is different from that of the normal board due to poor soldering or other reasons. In the process of analyzing and finding the original cause, a thermal imager made of an infrared sensor is used to inspect the surface temperature of the chip circuit board. The current infrared thermal imager

[0046] The surface temperature of the entire chip circuit board is displayed by the image color, and the human eye cannot directly see the device on the chip circuit board through the image

[0047] Due to the low resolution of the infrared sensor, it is not very accurate to help locate the problem for the chip circuit board with small volume and dense components

[0048] The present patent helps to detect and display the condition of the patch circuit board by using the advantages of high resolution of visible light and friendly viewing of the human eye in a dual light fusion manner, which can help to quickly locate the problem.

[0049] The overall architecture is as shown in Figure 1 It mainly includes visible light and infrared two kinds of image sensors.

[0050] Image processing module: the data collected by the visible light and infrared sensors are transmitted to the programmable device for image processing. The processed data are uploaded to the host computer through the USB 3.0 adapter chip.

[0051] Host computer software: the data uploaded by the image processing module are displayed, and can be compared with the normal image. It should be noted that, before detection, if comparison is needed, the correct reference data should be prepared on the host computer as the comparison basis.

[0052] As shown in Figure 2 The sensor includes a visible light lens and a high-resolution sensor, which adopts a million-level industrial-grade high-resolution CIS; an infrared lens and an infrared sensor, which adopts a resolution infrared sensor, but the resolution is relatively low compared with the visible light sensor.

[0053] The image is processed based on the programmable device (FPGA) and uploaded to the host computer through the USB 3.0, which contains the following functions: the programmable device processes the collected visible light and infrared images, including cropping, dark level correction, bad point correction, denoising, image enhancement, etc. The visible light and infrared input images are fused to form an image, which is the most important innovation point of the present patent. Fusion mainly realizes that the visible light sensor can clearly capture the device. The programmable device extracts the frame information of each component on the board through algorithm. The resolution of the visible light and infrared sensors is different. The programmable device processes the two kinds of images, and finally realizes the fusion of the two kinds of images through geometric correction and point-by-point fusion.

[0054] After the host computer software collects data through the USB3.0, the image is displayed, meanwhile, the software can compare the received image with the normal PCBA fusion image, and highlight the difference position, helping to quickly locate the problem area.

[0055] To sum up, the patch circuit board detection device and method provided by the application has at least the following advantages compared with the prior art:

[0056] Through the visible + infrared detection of the application, the infrared image and the visible light image are fused, the visible light image is used to display the frame of the component, the problem that the resolution is low and the small volume component cannot be accurately positioned in the prior art by using only the infrared image is overcome, the infrared image is used to display other positions, the problem that the data is large and the transmission time is long by using all visible light images is overcome, the circuit board problem can be efficiently, accurately and reliably positioned.

[0057] The above is only the preferred embodiment of the application and is not used to limit the application, for those skilled in the art, the application can have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the application shall be included in the protection scope of the application.

Claims

1. A surface mount circuit board testing device, characterized in that, The system includes an image acquisition unit, an image processing unit, and a comparison unit. The image acquisition unit includes an infrared image acquisition component and a visible light image acquisition component. The infrared image acquisition component acquires an infrared image of the surface mount circuit board and transmits it to the image processing unit. The visible light image acquisition component acquires a visible light image of the surface mount circuit board and transmits it to the image processing unit. The image processing unit preprocesses the acquired infrared and visible light images, merges the two preprocessed images, displays the outer frame of each component on the surface mount circuit board using the visible light image, and displays the remaining parts using the infrared image. The merged image is then sent to the judgment unit. The judgment unit presets a merged image of a qualified surface mount circuit board as a reference. If the two images match, the surface mount circuit board is judged to be qualified; if they do not match, the surface mount circuit board is judged to be unqualified.

2. The surface mount circuit board testing device according to claim 1, characterized in that, The infrared image acquisition component includes an infrared lens and an infrared sensor.

3. The surface mount circuit board testing device according to claim 2, characterized in that, The infrared sensor mentioned is a high-resolution infrared sensor.

4. The surface mount circuit board testing device according to claim 3, characterized in that, The visible light image acquisition component includes a visible light lens and a visible light sensor.

5. The surface mount circuit board testing device according to claim 4, characterized in that, The visible light sensor described is a high-resolution sensor used in industrial applications with a resolution of tens of millions of pixels or more.

6. The surface mount circuit board testing device according to claim 1, characterized in that, The image preprocessing includes cropping, dark level correction, bad pixel correction, noise reduction, and image enhancement.

7. The surface mount circuit board testing device according to claim 1, characterized in that, The surface mount circuit board testing device further includes a display unit, which is connected to the judgment unit to display the result of the judgment unit and highlight the differences.

8. A method for inspecting surface mount circuit boards using a surface mount circuit board inspection apparatus as described in any one of claims 1-7, characterized in that, The method includes the following steps: Visible light and infrared images of qualified surface mount circuit boards are acquired and fused using an image fusion method to obtain a fused image of the qualified surface mount circuit board. The visible light and infrared images of the patch circuit board to be inspected are acquired and fused according to the image fusion method to obtain the fused image of the patch circuit board to be inspected. The fused image of the surface mount circuit board to be inspected is compared with the fused image of a qualified surface mount circuit board. If they match, the surface mount circuit board is deemed qualified; otherwise, it is deemed unqualified.

9. The surface mount circuit board inspection method according to claim 8, characterized in that, The image fusion method includes the following steps: S1.1 The obtained infrared and visible light images are preprocessed separately; S1.2 The preprocessed infrared image and visible light image are fused together, wherein the outer frame of each component on the patch circuit board is displayed using the visible light image, and the remaining parts are displayed using the infrared image, to obtain the fused image of the patch circuit board.

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