Display panel and display device

Abstract

The invention provides a display panel and a display device. The display panel comprises a display area and a non-display area, and the non-display area comprises a binding area; the display panel comprises a substrate as well as a metal bump and an organic layer which are positioned on one side of the substrate, the organic layer is provided with a hollow part positioned in the binding area, and the metal bump is positioned in the hollow part; wherein at least one organic layer is provided with a groove, and the groove is communicated with the hollowed-out part and extends in the direction away from the hollowed-out part. According to the invention, the grooves can be used as bubble release paths to prevent the anisotropic conductive adhesive from generating bubble accumulation at the boundary position of the organic layer, so that film stripping between the anisotropic conductive adhesive and metal can be prevented, and the product reliability is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel and a display device. BACKGROUND

[0002] At present, the design of display products is continuously optimized in terms of high refresh rate, narrow frame, high display effect and the like to adapt to market demand. OLED (Organic Light-Emitting Diode) products have become mainstream design in the market due to their advantages of lightness, high brightness, low power consumption, fast response, high definition, good flexibility and high luminous efficiency. The driving chip and the metal bump on the display panel are bound by anisotropic conductive adhesive to provide signals to the signal lines in the display area through the metal bump. In some use scenarios, there is a peeling risk between the anisotropic conductive adhesive and the metal bump, and failure occurs. SUMMARY

[0003] Embodiments of the present application provide a display panel and a display device to solve the technical problem of peeling risk between anisotropic conductive adhesive and a metal bump.

[0004] In a first aspect, embodiments of the present application provide a display panel, which comprises a display area and a non-display area, the non-display area comprising a binding area; The display panel comprises a substrate and a metal bump and an organic layer located on one side of the substrate, the organic layer having an opening in the binding area, and the metal bump being located in the opening; At least one of the organic layers has a groove, which is in communication with the opening and extends away from the opening.

[0005] In a second aspect, based on the same inventive concept, embodiments of the present application also provide a display device comprising the display panel provided by any of the embodiments of the present application.

[0006] The display panel and the display device provided by embodiments of the present application have the following beneficial effects: the display panel has a groove on at least one of the organic layers at the position of the binding area, and the groove is in communication with the opening in which the metal bump is exposed. In the binding process of the driving chip, the groove in communication with the opening can increase the flow space of the anisotropic conductive adhesive, and the anisotropic conductive adhesive can flow from the opening to the groove. The groove is used as a bubble release path to prevent the accumulation of bubbles in the anisotropic conductive adhesive at the boundary position of the organic layer. It is equivalent to cutting off the invasion path of water vapor and sweat, thereby preventing the film layer peeling between the anisotropic conductive adhesive and the metal, and increasing the product reliability. BRIEF DESCRIPTION OF DRAWINGS

[0007] In order to make the technical solutions in the embodiments of the present application or the prior art clearer, the accompanying drawings needed in the embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort based on these drawings.

[0008] Figure 1 A partial schematic view of a display panel in the related art; Figure 2 A schematic view of a display panel provided by an embodiment of the present application; Figure 3 A partial schematic view of a display panel in the related art; Figure 2 A schematic view of a cross section at a position of a tangent A-A' in the related art; Figure 4 A schematic view of another display panel provided by an embodiment of the present application; Figure 5 A schematic view of another display panel provided by an embodiment of the present application; Figure 6 A partial schematic view of a display panel in the related art; Figure 5 A schematic view of a cross section at a position of a tangent B-B' in the related art; Figure 7 A schematic view of another display panel provided by an embodiment of the present application; Figure 8 A schematic view of another display panel provided by an embodiment of the present application; Figure 9 A schematic view of another display panel provided by an embodiment of the present application; Figure 10 A partial schematic view of a display panel provided by an embodiment of the present application; Figure 11 A partial schematic view of a display panel in the related art; Figure 2 A schematic view of another cross section at a position of a tangent A-A' in the related art; Figure 12 A partial schematic view of a display panel in the related art; Figure 11 A top view of the first organic layer and the second organic layer in the binding area in the related art; Figure 13 A schematic view of a display panel film layer structure provided by an embodiment of the present application; Figure 14 A partial schematic view of a display panel in the related art; Figure 2 A schematic view of another cross section at a position of a tangent A-A' in the related art; Figure 15 A schematic view of another display panel film layer structure provided by an embodiment of the present application; Figure 16 A partial schematic view of a display panel in the related art; Figure 2 A schematic view of another cross section at a position of a tangent A-A' in the related art; Figure 17 AFigure 16 A partial top view of the three organic layers in the bonding area; Figure 18 for Figure 2 Another cross-sectional view at the location of the tangent AA′; Figure 19 for Figure 2 Another cross-sectional view at the location of the tangent AA′; Figure 20 This is a schematic diagram of a display device provided in an embodiment of the present invention. Detailed Implementation

[0009] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0010] The terminology used in the embodiments of this invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. The singular forms “a,” “the,” and “the” as used in the embodiments of this invention and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0011] Various modifications and variations can be made to this invention without departing from its spirit or scope, as will be apparent to those skilled in the art. Therefore, this invention is intended to cover modifications and variations falling within the scope of the corresponding claims (the claimed technical solutions) and their equivalents. It should be noted that the embodiments provided in this invention can be combined with each other without contradiction.

[0012] In related technologies, display panels are at risk of failure when used in high temperature and high humidity environments. The failure risk is caused by the anisotropic conductive adhesive peeling off from the metal at the bonding position between the driver chip and the panel. Figure 1 This is a partial schematic diagram of a display panel in related technologies. For example... Figure 1 As shown, the display panel includes a substrate 00, an organic layer 01, and metal bumps 02. Holes exposing the metal bumps 02 are formed on the organic layer 01. The metal bumps 02 are electrically connected to terminals 031 on the driver chip 03 via anisotropic conductive adhesive 04. Conductive particles are present between the metal bumps 02 and the overlapping terminals 031. Figure 1 (Not shown). By Figure 1It can be seen that there is a step difference between the driving chip 03 and the boundary of the organic layer 01. In the process of binding the driving chip 03 and the panel, the step difference between the anisotropic conductive adhesive 04 and the boundary of the organic layer 01 is easy to cause the anisotropic conductive adhesive 04 to gather at the boundary position of the organic layer 01. The anisotropic conductive adhesive 04 gathered at the boundary position of the organic layer 01 cannot be released and generates a bubble 05. When used in a high temperature and high humidity environment, hand sweat provides an environmental factor that causes corrosion to devices in the display panel. Sweat reaches the vicinity of the driving chip 03 from the conductive cloth gap, enters the anisotropic conductive adhesive 04 through the bubble 05 at the boundary position of the organic layer 01, and then causes peeling between the anisotropic conductive adhesive 04 and the metal, resulting in binding failure.

[0013] To solve the problems in the related art, embodiments of the present application provide a display panel, at least one organic layer at the binding position of the display panel and the driving chip is provided with a groove, the groove is connected with the hollow part exposing the metal bump, thereby the groove can be used as a release path of the anisotropic conductive adhesive in the binding process, avoiding the anisotropic conductive adhesive gathering at the boundary position of the organic layer to generate a bubble. Thus, the risk of peeling between the anisotropic conductive adhesive and the metal when the display panel is used in a high temperature and high humidity environment is reduced. The above is the main technical concept of the present application, which will be illustrated by specific embodiments.

[0014] Figure 2 A display panel provided by an embodiment of the present application is shown in the figure, Figure 3 For Figure 2 A cross-sectional view at the tangent position A-A' is shown in the figure. As can be seen from the figure, Figure 2 And Figure 3 The display panel includes a display area AA and a non-display area BA, and the non-display area BA includes a binding area BA1. The display panel includes a substrate 00 and a metal bump 10 and an organic layer 20 located on one side of the substrate 00. The organic layer 20 has a hollow part 30 located in the binding area BA1, and the metal bump 10 is located in the hollow part 30. The metal bump 10 can be used for binding connection with the driving chip, and the driving chip can provide signals to the display area AA through the metal bump 10. At least one organic layer 20 has a groove 40, and the groove 40 is connected with the hollow part 30 and extends away from the hollow part 30. Figure 2 In the figure, the shape of the groove 40 in the top view is roughly rectangular. In the embodiments of the present application, the shape of the groove 40 is not limited, and the top view shape can be a regular shape such as a rectangle, a trapezoid, a triangle, etc., or the top view shape can also be an irregular figure. The groove 40 can be a straight line groove in its extension direction, or a groove with corners.

[0015] The display panel provided in this embodiment of the invention has a trench 40 formed on at least one organic layer 20 at the bonding area BA1. The trench 40 is connected to the cutout 30 of the exposed metal bump 10 on the organic layer 20. In the bonding process of bonding the driver chip, the connection between the trench 40 and the cutout 30 increases the flow space of the anisotropic conductive adhesive. The anisotropic conductive adhesive can flow from the cutout 30 to the trench 40. The trench 40 serves as a bubble release path, preventing the anisotropic conductive adhesive from accumulating at the boundary of the organic layer 20 (i.e., the boundary where the organic layer forms the cutout or the trench). This effectively cuts off the intrusion path of moisture and sweat, thereby preventing film peeling between the anisotropic conductive adhesive and the metal and increasing product reliability.

[0016] In some implementations... Figure 4 This is another schematic diagram of a display panel provided in an embodiment of the present invention, such as... Figure 4 As shown, the non-display area BA also includes a bending area BA2, which is located between the display area AA and the bonding area BA1. After the bending area BA2 bends, the bonding area BA1 is placed on the side away from the light-emitting surface of the display panel. This reduces the bezel width of the display panel.

[0017] In some implementations... Figure 5 This is a schematic diagram of another display panel provided in an embodiment of the present invention. Figure 6 for Figure 5 A schematic diagram of a cross-section at the location of the tangent line BB′. (Combined with...) Figure 5 and Figure 6 The display panel includes a driver chip 50, which has multiple pins 51. Within the cutout 30, the pins 51 and the metal bumps 10 are connected by anisotropic conductive adhesive 60. The anisotropic conductive adhesive 60 is doped with conductive particles (…). Figure 6 (Not shown), in the bonding process, pressure is applied to electrically connect pin 51 and metal bump 10 via conductive particles. Figure 6 As can be seen, the anisotropic conductive adhesive 60 fills at least part of the trench 40. In the bonding process of the driver chip 50, the anisotropic conductive adhesive 60 can flow from the cutout 30 towards the trench 40, using the trench 40 as a bubble release path to prevent bubble accumulation at the boundary of the organic layer 20. This effectively cuts off the intrusion path of moisture and sweat, thereby preventing film peeling between the anisotropic conductive adhesive 60 and the metal (i.e., the metal bumps 10 and the pins 51), increasing product reliability.

[0018] In some implementations, such as Figure 2As shown, the length of the groove 40 in its extending direction is L. If the groove 40 extends along the first direction a, its length along the first direction a is L; if the groove 40 extends along the second direction b, its length along the second direction b is L. Here, L≥100μm. The inventors have analyzed that the size of the bubble generated by the aggregation of the anisotropic conductive adhesive is about 100μm. The embodiment sets L≥100μm, which on one hand can increase the space for the flow of the anisotropic conductive adhesive by the groove 40 to prevent the aggregation of the anisotropic conductive adhesive to generate bubbles; on the other hand, the length of the groove 40 is comparable to the size of the bubble, and when the bubble has been generated in the anisotropic conductive adhesive, the bubble can also move to the position of the groove 40 to break, preventing the accumulation of bubbles at the boundary position of the organic layer 20.

[0019] In some embodiments, L≤150μm. That is, the length of the groove 40 is not set to be too large, which can meet the requirement of using the groove 40 as a bubble release path to prevent the accumulation of bubbles of the anisotropic conductive adhesive 60 at the boundary position of the organic layer 20, and also avoid the waste of space and material caused by the too large length L of the groove 40.

[0020] In some embodiments, the width of the groove 40 along the direction perpendicular to the extending direction of the groove 40 is d1, and 50μm≤d1≤100μm. Figure 2 As shown, the length of the groove 40 extending along the second direction b is L, and the width of the groove 40 along the first direction a is d1. In this embodiment, the width of the groove 40 is limited to a certain range, which can ensure the requirement of bubble release and also can arrange a certain number of grooves in the arrangement direction of the groove 40, thereby meeting the requirement of preventing the aggregation of the anisotropic conductive adhesive at multiple positions.

[0021] In some embodiments, as shown, Figure 2 As shown, n grooves 40 are arranged on at least one side of the hollow 30, the spacing between two adjacent grooves 40 is d2, n is an integer, n≥2, and 50μm≤d2≤100μm. In this embodiment, the spacing d2 between the adjacent grooves 40 is set to meet a certain range, which cooperates with the width d1 of the groove 40 to arrange a relatively large number of grooves 40 in a limited space, thereby releasing the aggregation of the anisotropic conductive adhesive at multiple positions to prevent the accumulation of bubbles generated by the aggregation.

[0022] In some embodiments, the plurality of grooves 40 are arranged at equal intervals on at least one side of the hollow 30. Such arrangement can make the stress condition of the anisotropic conductive adhesive on at least one side of the hollow 30 relatively uniform in the binding process, so that the anisotropic conductive adhesive can flow along the groove 40 relatively uniformly, and the aggregation of the anisotropic conductive adhesive at multiple positions can be better released.

[0023] In other embodiments, n grooves 40 are provided on at least one side of the cutout 30, where n ≥ 2, and the n grooves 40 may also be arranged at non-equidistant intervals.

[0024] In some implementations, such as Figure 2 As shown, the length of the cutout 30 in the first direction a is greater than its length in the second direction b. The first direction a and the second direction b are parallel to the plane of the substrate 00, and the first direction a and the second direction b intersect each other. A groove 40 is provided on at least one side of the cutout 30 along the second direction b. In the top view, the cutout 30 is roughly elongated, and its shape can be designed to fit the shape of the driver chip. The cutout 30 is relatively long on both sides of the second direction b, and the boundary of the organic layer 20 extending along the first direction a is also relatively long. During the bonding process, the organic layer 20 will come into contact with more anisotropic conductive adhesive on both sides of the second direction b. The groove 40 is provided on at least one side of the cutout 30 along the second direction b, which can be used as a release path for air bubbles in the anisotropic conductive adhesive, preventing the anisotropic conductive adhesive from accumulating and forming air bubbles at this location. This prevents the film layer from peeling off between the anisotropic conductive adhesive and the metal due to the intrusion of moisture and sweat.

[0025] Figure 2 The diagram illustrates that grooves 40 are provided on both sides of the cutout 30 along the second direction b. In some embodiments, grooves 40 are provided only on one side of the cutout 30 along the second direction b, and are not shown in the diagram here.

[0026] In some implementations... Figure 7 This is a schematic diagram of another display panel provided in an embodiment of the present invention. Figure 7 This illustrates a portion of the display panel. For example... Figure 7As shown, the hollowed-out portion 30 has a first side C1 and a second side C2 opposite in the second direction b, and the distance from the first side C1 to the display area AA in the second direction b is less than the distance from the second side C2 to the display area AA. Among them, the length of the groove 40 connected to the first side C1 in the extension direction thereof is d11, and the length of the groove 40 connected to the second side C2 in the extension direction thereof is d12, d11>d12. The bending state of the bending area BA2 in the display panel can place the binding area BA1 on the side away from the light-emitting surface of the display panel. That is, the binding area BA1 and the part of the structure located away from the display area AA of the binding area BA1 are placed on the side away from the light-emitting surface of the display panel. The part of the structure located away from the display area AA of the binding area BA1 generally also needs to be bound and connected with the flexible circuit board, so the first side C1 of the hollowed-out portion 30 in the second direction b has more free space compared to the second side C2. The embodiment of the present application uses the free space between the first side C1 and the bending area BA2 to set the groove 40 to have a relatively large extension length, which can make the flow of anisotropic conductive adhesive at the position of the first side C1 more smooth in the binding and pressing process, and more effectively prevent the anisotropic conductive adhesive from accumulating to produce bubbles.

[0027] In some embodiments, as shown in FIG. 6, the groove 40 is arranged on at least one side of the hollowed-out portion 30 in the first direction a. Figure 2 As shown, the groove 40 is arranged on at least one side of the hollowed-out portion 30 in the first direction a. In this embodiment, the groove 40 is arranged on at least one side of the hollowed-out portion 30 in the first direction a and at least one side of the hollowed-out portion 30 in the second direction b, which can increase the ability of the anisotropic conductive adhesive to flow in multiple directions in the binding and pressing process, and avoid the anisotropic conductive adhesive from accumulating to produce bubbles at the boundary position of the organic layer 20.

[0028] In some embodiments, Figure 8 Another schematic diagram of a display panel provided by an embodiment of the present application is shown in FIG. 7. Figure 8 As shown, the groove 40 includes a first groove 41 and a second groove 42, the first groove 41 is located on one side of the hollowed-out portion 30 in the first direction a, and the second groove 42 is located on one side of the hollowed-out portion 30 in the second direction b; the length of the first groove 41 in the extension direction thereof is greater than the length of the second groove 42 in the extension direction thereof. Figure 8It can be seen that the extension length of the first trench 41 in the first direction a is greater than the extension length of the second trench 42 in the second direction b. Considering that the location of the cutout 30 is used to bond the driver chip, after designing the shape of the cutout 30 according to the size of the driver chip, a relatively large space will be reserved on both sides of the cutout 30 along the first direction a. Setting the first trench 41 to have a larger length in its extension direction can make reasonable use of the space in the non-display area, making the flow of anisotropic conductive adhesive in the first direction a smoother during the bonding process. This can also reduce the amount of anisotropic conductive adhesive flowing in the second direction b to a certain extent, so that no bubbles will be generated at the boundary of the organic layer 20 extending along the first direction a and the boundary of the organic layer 20 extending along the second direction b due to the accumulation of anisotropic conductive adhesive.

[0029] In some implementations... Figure 9 This is a schematic diagram of another display panel provided in an embodiment of the present invention. Figure 9 As shown, the groove 40 includes a first groove 41 and a second groove 42. The first groove 41 is located on one side of the perforation 30 in the first direction a, and the second groove 42 is located on one side of the perforation 30 in the second direction b. The first groove 41 extends along the first direction a, and the second groove 42 extends along the second direction b. The width of the first groove 41 perpendicular to its extension direction is d12, and the width of the second groove 42 perpendicular to its extension direction is d22, where d12 is less than d22. In this embodiment of the invention, the length of the perforation 30 in the first direction a is greater than its length in the second direction b. The amount of anisotropic conductive adhesive in contact with the boundary of the organic layer 20 extending along the first direction a will be relatively more. Therefore, the width of the groove 40 on the side of the perforation 30 along the second direction b can be relatively larger, or the number of grooves can be relatively more, to avoid the accumulation of anisotropic conductive adhesive and the generation of bubbles at different positions of the boundary of the organic layer 20 extending along the first direction a.

[0030] It can be understood that the top-view direction of the display panel is parallel to the projection direction of the trench 40 onto the substrate. In the top view illustrated in the above embodiment, the shape of the trench 40 is approximately rectangular, that is, the orthogonal projection shape of the trench 40 onto the substrate 00 is rectangular. In other embodiments, the orthogonal projection shape of the trench 40 onto the substrate 00 may also be at least one of a triangle, trapezoid, circle, and ellipse.

[0031] Figure 10 This is a partial schematic diagram of another display panel provided in an embodiment of the present invention. Figure 10 As can be seen from the top view, the orthographic projection shape of some trenches 40 substrate 00 is trapezoidal, and the orthographic projection shape of some trenches 40 substrate 00 is rectangular.

[0032] In some implementations... Figure 11 for Figure 2Another cross-sectional view at the position of the tangent A-A'. Figure 11 As shown in the figure, the organic layer 20 includes a first organic layer 21 and a second organic layer 22, the second organic layer 22 is located on the side of the first organic layer 21 away from the substrate 00; along the direction e perpendicular to the plane where the substrate 00 is located, the hollows 30 of the first organic layer 21 and the hollows 30 of the second organic layer 22 at least partially overlap. Among them, the first organic layer 21 does not have a groove, and the second organic layer 22 has a groove 40.

[0033] Figure 12 For Figure 11 The top view of the first organic layer and the second organic layer in the binding area. Figure 12 Only the first organic layer 21 and the second organic layer 22 at the local position of the binding area BA1 are shown. Figure 12 (a) is a local top view of the first organic layer 21, Figure 12 (b) is a local top view of the second organic layer 22, it can be seen that the first organic layer 21 and the second organic layer 22 respectively have hollows 30, and the first organic layer 21 does not have a groove, and the second organic layer 22 has a groove 40.

[0034] In this embodiment, the organic layer 20 located in the binding area BA1 includes a first organic layer 21 and a second organic layer 22, both the first organic layer 21 and the second organic layer 22 have hollows 30, and a groove 40 is arranged on one of the first organic layer 21 and the second organic layer 22 to communicate with the hollow 30. Such arrangement can use the groove 40 as a bubble release path to prevent the accumulation of bubbles of the anisotropic conductive adhesive at the boundary position of the organic layer 20. Moreover, the organic layer 20 without groove 40 can cover some lines arranged below the groove 40 at the position where the direction e overlaps with the groove 40, avoiding the risk of corrosion caused by the exposure of metal lines.

[0035] In other embodiments, along the direction e perpendicular to the plane where the substrate 00 is located, the hollows 30 of the first organic layer 21 and the hollows 30 of the second organic layer 22 at least partially overlap, the first organic layer 21 has a groove 40, and the second organic layer 22 does not have a groove. This is not shown in the figure.

[0036] In some embodiments, Figure 13 A display panel film layer structure provided by an embodiment of the present application is shown in the figure. Figure 13As shown, the display panel includes a semiconductor layer p, a first metal layer M1, a second metal layer M2, a third metal layer M3 and a fourth metal layer M4 on the side of the substrate 00, and the first metal layer M1, the second metal layer M2, the third metal layer M3 and the fourth metal layer M4 are sequentially away from the substrate 00. Among them, the active layer of the transistor is located in the semiconductor layer p, the gate of the transistor, the first plate of the storage capacitor and some control signal lines are located in the first metal layer M1, the second plate of the storage capacitor and some signal lines are located in the second metal layer M2, the source and drain of part of the transistor and some connection lines are located in the third metal layer M3, and the data line and / or power line are located in the fourth metal layer M4. Among them, at least part of the first organic layer 21 is located between the third metal layer M3 and the fourth metal layer M4, and at least part of the second organic layer 22 is located on the side of the fourth metal layer M4 away from the substrate 00. As shown Figure 13 As shown, the display panel further comprises a light emitting device PD, the light emitting device PD is located on the side of the second organic layer 22 away from the substrate 00, the pixel definition layer 81 is used to separate adjacent light emitting devices PD, and the encapsulation layer 82 is further provided on the side of the light emitting device PD away from the substrate 00, and the encapsulation layer 82 is used to isolate water and oxygen and form protection for the light emitting device PD.

[0037] In the embodiment of the application, the trench 40 is provided on at least one of the first organic layer 21 and the second organic layer 22 located in the binding area BA1, and the trench 40 is communicated with the hollowing 30. In the process of binding the display panel and the driving chip, the trench 40 can be used as a bubble release path to prevent the anisotropic conductive adhesive from generating bubble accumulation at the boundary position of the organic layer 20. The invasion path of water vapor and sweat is cut off, thereby preventing the film layer peeling between the anisotropic conductive adhesive and the metal, and increasing the product reliability.

[0038] As shown Figure 13 As shown, the inorganic layer 71 is provided between the semiconductor layer p and the first metal layer M1, the inorganic layer 72 is provided between the first metal layer M1 and the second metal layer M2, and the inorganic layer 73 is provided between the second metal layer M2 and the third metal layer M3. In some embodiments, a groove is provided on at least one of the above three inorganic layers.

[0039] Figure 14 As shown Figure 2 As shown Figure 14 As shown, the display panel further comprises a first inorganic layer 70-1 located on the side of the first organic layer 21 close to the substrate 00; the first inorganic layer 70-1 has a first groove 74 located in the binding area; along the direction e perpendicular to the plane where the substrate 00 is located, the first groove 74 at least partially overlaps with the trench 40. Figure 14 For example, the first groove 74 is provided on the inorganic layer 73 between the second metal layer M2 and the third metal layer M3.

[0040] In this embodiment of the invention, perforations 30 are provided on both the first organic layer 21 and the second organic layer 22 within the binding area, and a groove 40 is provided on one of the first organic layer 21 and the second organic layer 22, communicating with the perforations 30. Simultaneously, a first groove 74 is provided on at least one first inorganic layer 70-1, and the first groove 74 overlaps with the groove 40. Taking the formation of a groove 40 on the second organic layer 22 as an example... Since the first inorganic layer 70-1 is located on the side of the first organic layer 21 close to the substrate 00, when the first organic layer 21 is fabricated on the first inorganic layer 70-1, the first organic layer 21 will fill the first trench 74 and form a recessed area of ​​a certain area on the surface of the organic layer. Then, the trench 40 fabricated on the second organic layer 22 overlaps with the first trench 74, which can make the trench 40 deeper. Thus, with the length and width of the trench 40 fixed, the depth of the trench 40 is increased, which increases the space for the flow of anisotropic conductive adhesive in the bonding process and improves the ability to release air bubbles in the anisotropic conductive adhesive.

[0041] In other implementations, Figure 15 This is a schematic diagram of another display panel film layer structure provided in an embodiment of the present invention. Figure 15 As shown, the display panel includes a semiconductor layer p, a first metal layer M1, a second metal layer M2, a third metal layer M3, and a fourth metal layer M4 located on one side of the substrate 00. The first metal layer M1, the second metal layer M2, the third metal layer M3, and the fourth metal layer M4 are sequentially located away from the substrate 00. The semiconductor layer p and the four metal layers are all located in the driving layer 92, in which pixel circuits, shift driving circuits, and some signal lines are arranged. A device layer 93 is disposed on the side of the driving layer 92 away from the substrate 00. The device layer 93 includes a pixel definition layer 81 and multiple light-emitting devices PD. An encapsulation layer 82 is disposed on the side of the device layer 93 away from the substrate 00. A touch layer 91 is disposed on the side of the encapsulation layer 82 away from the substrate 00. Touch electrodes are arranged in the touch layer 91. Figure 15 (Not shown), the touch layer 91 enables the touch function of the display panel. Optionally, a cover plate is also provided on the side of the touch layer 91 away from the substrate 00. Figure 15 (Not shown).

[0042] The organic layer 20 in the display panel includes a first organic layer 21, a second organic layer 22, and a third organic layer 23, which are sequentially away from the substrate 00. At least part of the first organic layer 21 is located between the third metal layer M3 and the fourth metal layer M4, and at least part of the second organic layer 22 is located on the side of the fourth metal layer M4 away from the substrate 00, i.e., at least part of the first organic layer 21 and at least part of the second organic layer 22 are located in the driving layer. In addition, at least part of the third organic layer 23 is located on the side of the touch layer 91 away from the substrate 00. The third organic layer 23 may, for example, be an optically transparent adhesive that plays a bonding role between the touch layer 91 and the cover plate.

[0043] In some embodiments, Figure 16 For Figure 2 Another cross-sectional schematic view in the position of the tangent A-A' in FIG. 6. Figure 17 For Figure 16 Partial top view schematic view of the three organic layers in the binding area. As Figure 16 shown, the hollows 30 of the first organic layer 21, the hollows 30 of the second organic layer 22, and the hollows 30 of the third organic layer 23 at least partially overlap in the direction e perpendicular to the plane in which the substrate 00 lies. Figure 17 (a) is a top view of the first organic layer 21, Figure 17 (b) is a top view of the second organic layer 22, Figure 17 (c) is a top view of the third organic layer 23. As Figure 17 can be seen, the first organic layer 21 has no groove, and the second organic layer 22 and the third organic layer 23 each have a groove 40. In combination Figure 16 , the groove 40 of the second organic layer 22 and the groove 40 of the third organic layer 23 overlap in the direction e perpendicular to the plane in which the substrate 00 lies. In this embodiment, when there are three organic layers 20 in the binding area, the three organic layers 20 are each made with a hollow 30 to expose the metal bumps 10, and then grooves 40 are made in two of the three organic layers 20, so that the grooves 40 are in communication with the hollows 30, and the grooves 40 in the two organic layers 20 overlap in the direction e, thereby being able to increase the depth of the groove 40 while the length and width of the groove 40 are fixed, and thus increasing the space for the flow of the anisotropic conductive adhesive in the binding process, and improving the ability to release bubbles in the anisotropic conductive adhesive. In addition, there is at least one organic layer without a groove among the three organic layers 20, which can cover some lines arranged below the groove 40, avoiding the risk of corrosion of the metal lines exposed to the outside.

[0044] Figure 16The second organic layer 22 and the third organic layer 23 are both provided with the groove 40 for illustration. In other embodiments, the first organic layer 21 and the second organic layer 22 are respectively provided with the groove 40 in communication with the hollowing 30, or the first organic layer 21 and the third organic layer 23 are respectively provided with the groove 40 in communication with the hollowing 30, which are not illustrated in the figures.

[0045] In other embodiments, one of the first organic layer 21, the second organic layer 22 and the third organic layer 23 is provided with the groove 40, which is not illustrated in the figures. At least one of the three organic layers 20 is provided with the groove in communication with the hollowing 30, and at least one of the organic layers 20 is provided with the hollowing 30 only without the groove. In this way, the groove 40 can be used as the bubble release path to prevent the anisotropic conductive adhesive from accumulating bubbles at the boundary position of the organic layer 20, and the organic layer 20 without the groove can be used to cover the metal wiring below the groove 40 to prevent corrosion caused by the exposed wiring.

[0046] In some embodiments, as shown in FIG. 6, the inorganic layer 71 is provided between the semiconductor layer p and the first metal layer M1, the inorganic layer 72 is provided between the first metal layer M1 and the second metal layer M2, and the inorganic layer 73 is provided between the second metal layer M2 and the third metal layer M3. Figure 15 In some embodiments, at least one of the three inorganic layers is provided with the first groove 74 located in the binding area BA1.

[0047] Figure 18 For Figure 2 another cross-sectional view at the tangent position A-A' is shown in FIG. 7. As shown in FIG. 7, the display panel further includes the first inorganic layer 70-1 located on the side of the first organic layer 21 close to the substrate 00, and at least one of the first inorganic layers has the first groove 74 located in the binding area. Figure 18 Figure 18 ​The inorganic layer 73 is taken as a first inorganic layer 70-1 provided with a first groove 74. The first groove 74 at least partially overlaps the groove 40 along the direction e perpendicular to the plane of the substrate 00. In this embodiment, the first inorganic layer 70-1 is located on the side of the first organic layer 21 close to the substrate 00. Although the thickness of the organic layer is generally greater than that of the inorganic layer in a display panel, when the first groove 74 is made on the first inorganic layer 70-1, the organic layer made thereon cannot completely fill the first groove 74, but forms a recessed area of a certain area on the surface of the organic layer. Thus, when the second organic layer 22 and the third organic layer 23 are further made on the first organic layer 21, the overlap of the groove 40 of the second organic layer 22 and the third organic layer 23 with the first groove 74 can make the depth of the groove 40 greater, thereby increasing the depth of the groove 40 under the condition that the length and width of the groove 40 are fixed, and increasing the space for the flow of the anisotropic conductive adhesive in the binding process, and improving the ability to release bubbles in the anisotropic conductive adhesive.

[0048] Figure 18 Only the first groove 74 provided on the inorganic layer 73 is taken as an example. In other embodiments, the first groove 74 can also be provided on the inorganic layer 72 and / or the inorganic layer 71, which is not shown in the figures.

[0049] In other embodiments, Figure 19 For Figure 2 Another cross-sectional view at the position of the tangent line A-A' is shown. As shown in the figure, Figure 19 The display panel further includes a second inorganic layer 70-2 between the second organic layer 22 and the third organic layer 23; the second inorganic layer 70-2 has a second groove 75 at the binding area BA1; the second groove 75 at least partially overlaps the groove 40 along the direction e perpendicular to the plane of the substrate 00. The second inorganic layer 70-2 can be an inorganic layer in the touch layer 91, such as an inorganic layer between two metal layers in the touch layer 91. In this embodiment, the second groove 75 is made in the second inorganic layer 70-2 between the second organic layer 22 and the third organic layer 23, and the second groove 75 overlaps the groove 40, so that the second groove 75 is in communication with the hollow 30. By providing the second groove 75 overlapping the groove 40, the flow space of the anisotropic conductive adhesive in the binding process can be increased, and the ability to release bubbles in the anisotropic conductive adhesive can be improved.

[0050] Based on the same inventive concept, the embodiments of the present application also provide a display device, Figure 20 A display device provided by the embodiments of the present application is shown in the figure, Figure 20As shown, the display device comprises the display panel 100 provided by any of the embodiments of the present application. The structure of the display panel 100 has been described in the above embodiments, and will not be repeated here. The display device provided by the embodiments of the present application may be, for example, a mobile phone, a tablet, a computer, a television, a smart wearable product, or any other electronic device having a display function.

[0051] The above merely describes preferred embodiments of the present application, and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the scope of protection of the present application.

[0052] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the above embodiments, or make equivalent replacement to part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel, characterized by, The display panel comprises a display area and a non-display area, and the non-display area comprises a binding area; The display panel comprises a substrate, a metal bump and an organic layer on one side of the substrate, the organic layer has a hollow in the binding area, and the metal bump is located in the hollow; At least one of the organic layers has a groove, which is in communication with the hollow and extends away from the hollow.

2. The display panel of claim 1, wherein The length of the hollow in the first direction is greater than the length of the hollow in the second direction, and the first direction and the second direction are respectively parallel to the plane in which the substrate is located, and the first direction and the second direction intersect each other; The groove is arranged on at least one side of the hollow along the second direction.

3. The display panel of claim 2, wherein The hollow has a first side and a second side opposite to each other in the second direction, and the distance between the first side and the display area is less than the distance between the second side and the display area along the second direction; The length of the groove in communication with the first side in the extension direction is d11, and the length of the groove in communication with the second side in the extension direction is d12, and d11>d12.

4. The display panel of claim 2, wherein The groove is arranged on at least one side of the hollow along the first direction.

5. The display panel of claim 4, wherein The groove comprises a first groove and a second groove, the first groove is located on one side of the hollow in the first direction, and the second groove is located on one side of the hollow in the second direction; The length of the first groove in the extension direction is greater than the length of the second groove in the extension direction, and / or the width of the first groove perpendicular to the extension direction is less than the width of the second groove perpendicular to the extension direction.

6. The display panel of claim 1, wherein The length of the groove in the extension direction is L, and L≥100μm.

7. The display panel of claim 6, wherein L≤150μm.

8. The display panel of claim 1, wherein The width of the groove perpendicular to the extension direction of the groove is d1, and 50μm≤d1≤100μm.

9. The display panel of claim 1, wherein n grooves are arranged on at least one side of the hollow, the distance between two adjacent grooves is d2, n is an integer, n≥2, and 50μm≤d2≤100μm.

10. The display panel of claim 1, wherein The grooves are arranged equidistantly on at least one side of the hollow.

11. The display panel of claim 1, wherein The projection shape of the groove on the substrate is at least one of a rectangle, a triangle, a trapezoid, a circle and an ellipse.

12. The display panel of claim 1, wherein The organic layer comprises a first organic layer and a second organic layer, and the second organic layer is located on a side of the first organic layer away from the substrate; The hollowing of the first organic layer and the hollowing of the second organic layer at least partially overlap in a direction perpendicular to a plane in which the substrate is located; One of the first organic layer and the second organic layer has the trench.

13. The display panel of claim 12, wherein The display panel comprises a first metal layer, a second metal layer, a third metal layer and a fourth metal layer located on a side of the substrate, and the first metal layer, the second metal layer, the third metal layer and the fourth metal layer are sequentially away from the substrate; At least part of the first organic layer is located between the third metal layer and the fourth metal layer, and at least part of the second organic layer is located on a side of the fourth metal layer away from the substrate.

14. The display panel of claim 13, wherein The display panel further comprises a first inorganic layer located on a side of the first organic layer close to the substrate; The first inorganic layer has a first hollowing located in the binding area, and the first hollowing at least partially overlaps with the trench in a direction perpendicular to a plane in which the substrate is located.

15. The display panel of claim 1, wherein The organic layer comprises a first organic layer, a second organic layer and a third organic layer, and the first organic layer, the second organic layer and the third organic layer are sequentially away from the substrate; The hollowing of the first organic layer, the hollowing of the second organic layer and the hollowing of the third organic layer at least partially overlap in a direction perpendicular to a plane in which the substrate is located; One of the first organic layer, the second organic layer and the third organic layer has the trench, or two of the first organic layer, the second organic layer and the third organic layer have the trench, and the trenches of the two organic layers overlap in a direction perpendicular to a plane in which the substrate is located.

16. The display panel of claim 15, wherein The display panel further comprises a first inorganic layer located on a side of the first organic layer close to the substrate; At least one of the first inorganic layers has a first hollowing located in the binding area, and the first hollowing at least partially overlaps with the trench in a direction perpendicular to a plane in which the substrate is located.

17. The display panel of claim 15, wherein The display panel further comprises a second inorganic layer located between the second organic layer and the third organic layer; The second inorganic layer has a second hollowing located in the binding area, and the second hollowing at least partially overlaps with the trench in a direction perpendicular to a plane in which the substrate is located.

18. The display panel of claim 15, wherein The display panel comprises a driving layer, a device layer and a touch layer, the device layer is located on a side of the driving layer away from the substrate, and the touch layer is located on a side of the device layer away from the substrate; At least part of the first organic layer and at least part of the second organic layer are located in the driving layer, and at least part of the third organic layer is located on a side of the touch layer away from the substrate.

19. The display panel of claim 1, wherein, The display panel comprises a driving chip, and the driving chip comprises a plurality of pins; and within the hollowed-out portion, the pins and the metal bumps are connected by anisotropic conductive adhesive. The anisotropic conductive adhesive fills at least part of the groove.

20. A display device comprising: A display panel as claimed in any one of claims 1 to 19.

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