Perovskite mining packaging composite material and preparation method thereof

Abstract

The invention relates to the technical field of photovoltaic packaging materials, in particular to a packaging composite material for a perovskite mine and a preparation method of the packaging composite material. The packaging composite material for the perovskite mine comprises a creep-resistant layer, a barrier layer and a low-temperature cross-linking layer, the creep-resistant layer comprises polyolefin resin, silane grafted POE (Polyolefin Elastomer) resin, an irradiation cross-linking agent and a first antioxidant; the barrier layer comprises polyolefin resin master batch and a free radical trapping agent; the low-temperature crosslinking layer comprises EVA resin, modified EVA resin, a low-temperature crosslinking agent, an anti-hydrolysis agent and a second antioxidant. According to the packaging composite material for the perovskite, the creep-resistant layer, the barrier layer and the low-temperature cross-linking layer are compounded, and the components of each layer are regulated and controlled, so that the water vapor barrier property, the high-temperature creep resistance, the damp-heat aging resistance and the like of the packaging composite material can be remarkably improved on the basis of reducing the corrosion damage to the perovskite material.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic encapsulation materials technology, and in particular to a perovskite encapsulation composite material and its preparation method. Background Technology

[0002] With the rapid development of renewable energy technologies, the photovoltaic industry, as an important branch, is undergoing unprecedented changes. Among the many photovoltaic materials, perovskite solar cell modules have attracted much attention due to their advantages such as high photoelectric conversion efficiency, strong light absorption, wide spectral response range, good low-light performance, low cost, simple manufacturing process, and wide range of applications.

[0003] Perovskite solar cells mainly consist of a transparent conductive substrate, an electron transport layer, a perovskite layer, and a hole transport layer. However, perovskite materials are extremely sensitive to environmental factors such as water, oxygen, temperature, and ultraviolet light. Therefore, the choice of encapsulation materials is crucial to the stability and lifespan of perovskite solar cells. In traditional crystalline silicon solar cell encapsulation schemes, two layers of EVA, EPE, or POE films are typically used to bond the cell to the glass or backsheet. To improve the mechanical strength and creep resistance of the encapsulation film, polar additives and crosslinking agents need to be added. However, perovskite materials are sensitive to the composition of the encapsulation film; some crosslinking agents and additives may react chemically with it, leading to interfacial corrosion or decomposition. Furthermore, the lamination temperature of crosslinked films usually needs to be above 140°C, at which temperature the crystal structure of perovskite is destroyed, reducing the efficiency of the perovskite module. While thermoplastic films greatly reduce the amount of polar additives added to the film, thus reducing the corrosion of perovskite solar cells by the additives, and the lamination temperature is also lower, the film cannot be cured and cross-linked. The film has poor adhesion, high temperature resistance, and resistance to damp heat aging, and cannot provide good protection for the encapsulated perovskite solar cells.

[0004] In view of this, the present invention is hereby proposed. Summary of the Invention

[0005] The purpose of this invention is to provide a perovskite encapsulation composite material and its preparation method. The encapsulation composite material of this invention significantly improves the creep resistance and resistance to humid heat aging of the material while reducing corrosion and damage to the perovskite material.

[0006] To achieve the above-mentioned objectives of the present invention, the first aspect of the present invention provides a perovskite encapsulation composite material, comprising an anti-creep layer, a barrier layer and a low-temperature crosslinking layer sequentially stacked along its thickness direction; The anti-creep layer comprises the following components by weight: 60-80 parts of polyolefin resin, 20-40 parts of silane-grafted POE resin, 0.1-1 parts of irradiated crosslinking agent, and 0.05-0.5 parts of first antioxidant; The barrier layer comprises the following components by weight: 100 parts of polyolefin resin masterbatch and 0.1 to 1 part of free radical scavenger; The low-temperature crosslinking layer comprises the following components by weight: 50-80 parts of EVA resin, 20-50 parts of modified EVA resin, 0.1-1 part of low-temperature crosslinking agent, 0.1-0.5 parts of anti-hydrolysis agent, and 0.05-0.5 parts of second antioxidant; The polyolefin resin masterbatch is mainly prepared from high-melting-point polyolefin resin, a first initiator and silane-modified mesoporous silica in a mass ratio of 100:(0.01~0.3):(1~10). The modified EVA resin is mainly prepared from EVA resin, a second initiator, a silane coupling agent and a hydrophobic agent in a mass ratio of 100:(0.01~0.15):(1~5):(0.5~2).

[0007] In a specific embodiment of the present invention, the high melting point polyolefin resin has a melting point of 80-90°C and a melt index of 1-14 g / 10 min under the condition of 190°C / 2.16 kg.

[0008] In a specific embodiment of the present invention, the first initiator and the second initiator each independently include at least one of dicumyl peroxide, benzoyl peroxide, 2,5-di-tert-butylperoxide-2,5-dimethylhexane, and cumyl peroxide.

[0009] In a specific embodiment of the present invention, the free radical scavenger includes at least one of triphenyl phosphite, tri(nonylphenyl) phosphite, pentaerythritol distearate diphosphite, alkylated diphenylhydroxylamine, and bis(octadecyl)hydroxylamine.

[0010] In a specific embodiment of the present invention, the silane coupling agent in the modified EVA resin includes at least one of vinyltrimethoxysilane, vinyltriethoxysilane, vinyltributanone oxime silane, vinyltris(β-methoxyethoxy)silane, and γ-methacryloyloxypropyltrimethoxysilane.

[0011] In a specific embodiment of the present invention, the hydrophobic agent includes at least one of octyltrimethoxysilane, octyltriethoxysilane, hexadecyltrimethoxysilane, hexadecyltriethoxysilane, octadecyltrimethoxysilane, and octadecyltriethoxysilane.

[0012] In a specific embodiment of the present invention, the 0.1-h half-life temperature of the low-temperature crosslinking agent is 95–120°C. Further, the low-temperature crosslinking agent includes at least one selected from tert-amyl peroxide-2-ethylhexanoate, tert-butyl peroxide-2-ethylhexanoate, tert-hexyl peroxide-2-ethylhexyl carbonate, 2,5-dimethyl-2,5-bis(2-ethylhexanoate peroxy)hexane, di-(3,5,5-trimethylhexanoyl) peroxide, and tert-butyl peroxide-2-isooctanoate.

[0013] In a specific embodiment of the present invention, the anti-hydrolysis agent includes at least one of monomeric carbodiimide anti-hydrolysis agent and polymeric carbodiimide anti-hydrolysis agent.

[0014] In a specific embodiment of the present invention, the irradiation crosslinking agent includes at least one of trimethylolpropane tri(3-mercaptopropionic acid), tri(2-hydroxyethyl)isocyanurate triacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, and ethoxylated trimethylolpropane triacrylate.

[0015] In a specific embodiment of the present invention, the silane-grafted POE resin is a vinyltrimethoxysilane-grafted POE resin.

[0016] In a specific embodiment of the present invention, the thicknesses of the anti-creep layer, the barrier layer, and the low-temperature cross-linking layer account for 20%–30%, 10%–20%, and 40%–60% of the total thickness of the encapsulated composite material, respectively.

[0017] In a specific embodiment of the present invention, the anti-creep layer comprises the following components by weight: 60-70 parts of polyolefin resin, 30-40 parts of silane-grafted POE resin, 0.1-1 parts of irradiated crosslinking agent, and 0.05-0.5 parts of first antioxidant.

[0018] In a specific embodiment of the present invention, the low-temperature crosslinking layer comprises the following components by weight: 50-65 parts of EVA resin, 35-50 parts of modified EVA resin, 0.1-1 parts of low-temperature crosslinking agent, 0.1-0.5 parts of anti-hydrolysis agent, and 0.05-0.5 parts of second antioxidant.

[0019] The second aspect of the present invention provides a method for preparing the perovskite encapsulation composite material provided in the first aspect of the present invention, comprising the following steps: dispensing materials according to the composition of an anti-creep layer, a barrier layer and a low-temperature crosslinking layer, and performing multilayer co-extrusion; and then subjecting the anti-creep layer side of the film obtained by multilayer co-extrusion to electron beam irradiation treatment.

[0020] In a specific embodiment of the present invention, the electron beam irradiation treatment is performed with a voltage of 100-500 kV, a beam current of 20-50 mA, and a linear velocity of 20-50 m / min.

[0021] Compared with the prior art, the beneficial effects of the present invention are as follows: (1) The perovskite encapsulation composite material of the present invention is compounded in multiple layers of anti-creep layer, barrier layer and low temperature cross-linking layer, and the components of each layer are controlled. On the basis of reducing the corrosion damage to perovskite materials, it can significantly improve the water vapor barrier performance, high temperature anti-creep performance and damp heat aging resistance of the encapsulation composite material.

[0022] (2) The perovskite battery prepared using the perovskite encapsulation composite material of the present invention can provide good protection for the perovskite battery and improve the efficiency and stability of the perovskite module. Detailed Implementation

[0023] The technical solution of the present invention will be clearly and completely described below with reference to specific embodiments. However, those skilled in the art will understand that the embodiments described below are some embodiments of the present invention, but not all embodiments, and are only used to illustrate the present invention, and should not be regarded as limiting the scope of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Where specific conditions are not specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall be followed. Where the manufacturers of reagents or instruments are not specified, they are all conventional products that can be purchased commercially.

[0024] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships, are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0025] The first aspect of the present invention provides a perovskite encapsulation composite material, comprising an anti-creep layer, a barrier layer and a low-temperature crosslinking layer sequentially stacked along its thickness direction; The creep-resistant layer comprises the following components by weight: 60-80 parts of polyolefin resin, 20-40 parts of silane-grafted POE resin, 0.1-1 parts of irradiated crosslinking agent, and 0.05-0.5 parts of first antioxidant; The barrier layer comprises the following components by weight: 100 parts of polyolefin resin masterbatch and 0.1 to 1 part of free radical scavenger; The low-temperature crosslinking layer comprises the following components by weight: 50-80 parts of EVA resin, 20-50 parts of modified EVA resin, 0.1-1 part of low-temperature crosslinking agent, 0.1-0.5 parts of anti-hydrolysis agent, and 0.05-0.5 parts of second antioxidant; The polyolefin resin masterbatch is mainly prepared from high-melting-point polyolefin resin, a first initiator and silane-modified mesoporous silica in a mass ratio of 100:(0.01~0.3):(1~10). Modified EVA resin is mainly prepared by EVA resin, a second initiator, a silane coupling agent and a hydrophobic agent in a mass ratio of 100:(0.01~0.15):(1~5):(0.5~2).

[0026] The perovskite encapsulation composite material of the present invention is compounded in multiple layers, including an anti-creep layer, a barrier layer and a low-temperature cross-linking layer, and the components of each layer are controlled. This can significantly improve the water vapor barrier performance, high-temperature creep resistance and humid heat aging resistance of the encapsulation composite material while reducing corrosion damage to the perovskite material.

[0027] The anti-creep layer of the present invention, with low additive content, not only improves the barrier properties against water vapor and oxygen, but also imparts good anti-creep properties to the encapsulated composite material. Specifically, silane-grafted POE resin is introduced into the anti-creep layer. Under electron beam irradiation, free radicals are generated, causing the molecular chains of POE resin to directly form a micro-crosslinked network. Simultaneously, the irradiated crosslinking agent has multiple functional groups, which can be grafted onto the molecular chains of POE resin via free radicals, improving the uniformity of the micro-crosslinked network and enhancing the anti-creep performance. Furthermore, the silane in the silane-grafted POE resin can further condense to form a three-dimensional network, further enhancing the anti-creep performance. In different embodiments, the amounts of each component in the anti-creep layer, by weight, can be as follows: The amount of polyolefin resin can be 60 parts, 65 parts, 70 parts, 75 parts, 80 parts, or any combination thereof; the amount of silane-grafted POE resin can be 20 parts, 25 parts, 30 parts, 35 parts, 40 parts, or any combination thereof; the amount of irradiation crosslinking agent can be 0.1 parts, 0.2 parts, 0.3 parts, 0.5 parts, 0.8 parts, 1 part, or any combination thereof; the amount of the first antioxidant can be 0.05 parts, 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, or any combination thereof.

[0028] In a specific embodiment of the present invention, the anti-creep layer comprises the following components by weight: 60-70 parts of polyolefin resin, 30-40 parts of silane-grafted POE resin, 0.1-1 parts of irradiated crosslinking agent, and 0.05-0.5 parts of first antioxidant.

[0029] In a specific embodiment of the present invention, the proportion of additives in the anti-creep layer is ≤1wt%, such as 1wt%, 0.8wt%, 0.5wt%, 0.4wt%, 0.2wt%, or any combination thereof, which can significantly reduce the corrosion of perovskite solar cells by additives.

[0030] The barrier layer uses high-melting-point polyolefin resin as the main body, which has a regular molecular chain structure and low polarity, thus improving the barrier ability of the encapsulated composite material against water vapor and oxygen. Furthermore, the silane-modified mesoporous silica introduced into the polyolefin resin masterbatch has a high specific surface area, which can form a free radical diffusion barrier in the barrier layer, hindering the migration of peroxide free radicals, reactive small molecules, and acidic substances to the anti-creep layer. Simultaneously, the silane modified on the surface of the mesoporous silica improves its dispersion performance in the matrix of the barrier layer, and the silanol groups (Si-OH) on the surface can also combine with free radicals. The free radical scavenger in the barrier layer can directly and efficiently capture alkyl free radicals and alkoxy free radicals, forming non-free radical products. In different embodiments, the amount of free radical scavenger in the barrier layer, relative to 100 parts by weight of polyolefin resin masterbatch, can be 0.1 parts, 0.2 parts, 0.3 parts, 0.5 parts, 0.8 parts, 1 part, or any combination thereof.

[0031] In different embodiments, the amount of the first initiator in the polyolefin resin masterbatch can be 0.01%, 0.05%, 0.1%, 0.15%, 0.2%, 0.3% of the mass of the high-melting-point polyolefin resin, or any combination thereof; the amount of silane-modified mesoporous silica can be 1%, 3%, 5%, 8%, 10% of the mass of the high-melting-point polyolefin resin, or any combination thereof.

[0032] In a specific embodiment of the present invention, the preparation of the polyolefin resin masterbatch includes: mixing a high-melting-point polyolefin resin, a first initiator, and silane-modified mesoporous silica in a certain proportion, and then performing melt extrusion granulation. Further, the melt extrusion granulation temperature is 120–180°C, and the melt extrusion granulation can be performed using a twin-screw extruder.

[0033] Introducing a certain amount of anti-hydrolysis agent into the low-temperature crosslinking layer allows it to react with the carboxylic acid produced by the decomposition of EVA resin, forming a stable and side-effect-free substance that inhibits the hydrolysis of EVA resin and extends the service life of the film. Furthermore, the low-temperature crosslinking agent in the low-temperature crosslinking layer can release free radicals at 120°C, enabling the encapsulated composite material to undergo a crosslinking reaction at 120°C. Simultaneously introducing silane coupling agents and hydrophobic agents into the modified EVA resin not only improves the adhesion and water-blocking properties of the encapsulated composite material but also increases the number of active sites for crosslinking reactions, thereby increasing the degree of crosslinking and improving the aging resistance of the component. In different embodiments, the amounts of each component in the low-temperature crosslinking layer, by weight, can be as follows: The amount of EVA resin can be 50 parts, 55 parts, 60 parts, 65 parts, 70 parts, 75 parts, 80 parts, or any combination thereof. The amount of modified EVA resin can be 20 parts, 25 parts, 30 parts, 35 parts, 40 parts, 45 parts, 50 parts, or any combination thereof. The amount of low-temperature crosslinking agent can be 0.1 parts, 0.3 parts, 0.5 parts, 0.8 parts, 1 part, or any combination thereof; The amount of anti-hydrolysis agent can be 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, or any combination thereof; The amount of the second antioxidant can be 0.05 parts, 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, or any combination thereof.

[0034] In a specific embodiment of the present invention, the low-temperature crosslinking layer comprises the following components by weight: 50-65 parts of EVA resin, 35-50 parts of modified EVA resin, 0.1-1 parts of low-temperature crosslinking agent, 0.1-0.5 parts of anti-hydrolysis agent, and 0.05-0.5 parts of second antioxidant.

[0035] In different embodiments, the amount of the second initiator in the modified EVA resin can be 0.01%, 0.05%, 0.07%, 0.1%, 0.15% of the mass of the EVA resin, or any combination thereof; the amount of the silane coupling agent can be 1%, 2%, 3%, 4%, 5% of the mass of the EVA resin, or any combination thereof; and the amount of the hydrophobic agent can be 0.5%, 0.8%, 1%, 1.2%, 1.5%, 1.8%, 2% of the mass of the EVA resin, or any combination thereof.

[0036] In a specific embodiment of the present invention, the preparation of modified EVA resin includes: mixing EVA resin, a second initiator, a silane coupling agent, and a hydrophobic agent in a certain proportion, and then performing melt extrusion granulation. Further, the melt extrusion granulation temperature is 120–180°C, and the melt extrusion granulation can be performed using a twin-screw extruder.

[0037] In a specific embodiment of the present invention, the melting point of the high-melting-point polyolefin resin is 80–90°C, and the melt index at 190°C / 2.16 kg is 1–14 g / 10 min. In different embodiments, the melting point of the high-melting-point polyolefin resin can be 80°C, 85°C, 90°C, or any combination thereof, and the melt index at 190°C / 2.16 kg can be 1 g / 10 min, 3 g / 10 min, 5 g / 10 min, 7 g / 10 min, 10 g / 10 min, 14 g / 10 min, or any combination thereof.

[0038] In a specific embodiment of the present invention, the high melting point polyolefin resin includes at least one of polyethylene, ethylene-octene polyolefin resin and ethylene-butene polyolefin resin, such as including but not limited to mLLDPE and POP polyolefin resin.

[0039] In a specific embodiment of the present invention, the first initiator and the second initiator each independently include at least one of dicumyl peroxide, benzoyl peroxide, 2,5-di-tert-butylperoxide-2,5-dimethylhexane, and cumyl peroxide.

[0040] In a specific embodiment of the present invention, the preparation of silane-modified mesoporous silica includes the following steps: (a) Ethanol and water are mixed and stirred at a volume ratio of 4:1 to obtain an ethanol-water mixed solvent. 5% of the mass of the mixed solvent is weighed and added to the mixed solvent. The mixture is stirred at 40-60°C until completely dissolved. Then, 25% ammonia water is added and the pH is adjusted to 9-11 to obtain solution A. (b) Ethyl orthosilicate and γ-methacryloyloxypropyltrimethoxysilane were mixed at a molar ratio of 10:1 and stirred until homogeneous to obtain solution B; (c) At room temperature, solution B is slowly added dropwise to solution A and stirred continuously for 6 to 24 hours to obtain sol product A; wherein the molar ratio of tetraethyl orthosilicate in solution B to hexadecyltrimethylammonium bromide in solution A is 4:1; (d) Ethanol and 25% hydrochloric acid were mixed and stirred at a volume ratio of 4:1 to obtain a glycolic acid mixed solvent. Sol product A was added to the glycolic acid mixed solvent and stirred to dissolve. The mixture was refluxed and extracted 10 to 20 times at 60 to 70°C. The solid product was then filtered and dried in a vacuum oven to constant weight to obtain silane-modified mesoporous silica. The mass ratio of sol product A to glycolic acid mixed solvent was 1:10.

[0041] In a specific embodiment of the present invention, the free radical scavenger includes at least one of triphenyl phosphite, tri(nonylphenyl) phosphite, pentaerythritol distearate diphosphite, alkylated diphenylhydroxylamine, and bis(octadecyl)hydroxylamine.

[0042] In a specific embodiment of the present invention, the silane coupling agent in the modified EVA resin includes at least one of vinyltrimethoxysilane, vinyltriethoxysilane, vinyltributanone oxime silane, vinyltris(β-methoxyethoxy)silane, and γ-methacryloyloxypropyltrimethoxysilane.

[0043] In a specific embodiment of the present invention, the hydrophobic agent includes at least one selected from octyltrimethoxysilane, octyltriethoxysilane, hexadecyltrimethoxysilane, hexadecyltriethoxysilane, octadecyltrimethoxysilane, and octadecyltriethoxysilane.

[0044] In a specific embodiment of the present invention, the 0.1-hour half-life temperature of the low-temperature crosslinking agent is 95–120°C, such as 95°C, 105°C, 110°C, 115°C, 120°C, or any combination thereof. The 0.1-hour half-life temperature refers to the temperature corresponding to a half-life of 0.1 hours for the low-temperature crosslinking agent. Further, the low-temperature crosslinking agent includes at least one of tert-amyl peroxide-2-ethylhexanoate, tert-butyl peroxide-2-ethylhexanoate, tert-hexyl peroxide-2-ethylhexyl carbonate, 2,5-dimethyl-2,5-bis(2-ethylhexanoate peroxy)hexane, di-(3,5,5-trimethylhexanoyl) peroxide, and tert-butyl peroxide-2-ethylhexanoate.

[0045] In a specific embodiment of the present invention, the anti-hydrolysis agent includes at least one of monomeric carbodiimide anti-hydrolysis agent and polymeric carbodiimide anti-hydrolysis agent.

[0046] In a specific embodiment of the present invention, the irradiation crosslinking agent includes at least one of trimethylolpropane tri(3-mercaptopropionic acid), tri(2-hydroxyethyl)isocyanurate triacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, and ethoxylated trimethylolpropane triacrylate.

[0047] In a specific embodiment of the present invention, the silane-grafted POE resin is a vinyltrimethoxysilane-grafted POE resin.

[0048] In a specific embodiment of the present invention, the polyolefin resin in the anti-creep layer includes POE resin.

[0049] In a specific embodiment of the present invention, the VA content in the EVA resin in the low-temperature crosslinking layer and the EVA resin used to prepare the modified EVA resin can be 16wt% to 28wt%.

[0050] In a specific embodiment of the present invention, the first antioxidant and the second antioxidant each independently include at least one of antioxidant 1010, 2,6-di-tert-butyl-4-methylphenol, butylated hydroxyanisole, 2,2'-methylenebis(4-methyl-6-tert-butylphenol), 2,2'-thiobis(4-methyl-6-tert-butylphenol), and 4,4'-thiobis(6-tert-butyl-3-methylphenol).

[0051] In a specific embodiment of the present invention, the thicknesses of the anti-creep layer, the barrier layer, and the low-temperature cross-linking layer account for 20%–30%, 10%–20%, and 40%–60% of the total thickness of the encapsulated composite material, respectively.

[0052] Adjusting the thickness of each layer to meet the above conditions helps to balance the effectiveness of each layer, ensure compatibility between layers, and improve the aging resistance of the encapsulated composite material. For example, in different embodiments, the thickness of the anti-creep layer can be 20%, 22%, 25%, 28%, 30% of the total thickness of the encapsulated composite material, or any combination thereof; the thickness of the barrier layer can be 10%, 12%, 15%, 18%, 20% of the total thickness of the encapsulated composite material, or any combination thereof; and the thickness of the low-temperature crosslinking layer can be 40%, 42%, 45%, 48%, 50%, 52%, 55%, 58%, 60% of the total thickness of the encapsulated composite material, or any combination thereof.

[0053] In a specific embodiment of the present invention, the total thickness of the encapsulated composite material is 100 to 1000 μm, such as 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1000 μm or any combination thereof.

[0054] The second aspect of the present invention provides a method for preparing the perovskite encapsulation composite material provided in the first aspect of the present invention, comprising the following steps: dispensing materials according to the composition of an anti-creep layer, a barrier layer and a low-temperature crosslinking layer, and performing multilayer co-extrusion; and then subjecting the anti-creep layer side of the film obtained by multilayer co-extrusion to electron beam irradiation treatment.

[0055] In a specific embodiment of the present invention, in multilayer co-extrusion, the extrusion temperature range of the anti-creep layer and the low-temperature crosslinking layer is set to 50-90°C; the extrusion temperature range of the barrier layer is set to 70-90°C; and the co-extrusion die temperature is 80-95°C.

[0056] In a specific embodiment of the present invention, during electron beam irradiation, the voltage is 100–500 kV, the beam current is 20–50 mA, and the linear velocity is 20–50 m / min. In different embodiments, the voltage can be 100 kV, 200 kV, 300 kV, 400 kV, 500 kV, or any combination thereof; the beam current can be 20 mA, 30 mA, 40 mA, 50 mA, or any combination thereof; and the linear velocity can be 20 m / min, 30 m / min, 40 m / min, 50 m / min, or any combination thereof.

[0057] When the encapsulation composite material of the present invention is used for encapsulating perovskite solar cells, the creep-resistant layer side of the encapsulation composite material faces the solar cell. Perovskite solar cells prepared using the encapsulation composite material of the present invention provide excellent protection for the perovskite solar cells and improve the efficiency and stability of the perovskite module.

[0058] When perovskite encapsulation composite materials are used for encapsulating perovskite solar cells, the lamination temperature is 120±5℃ and the lamination time is 10~20min.

[0059] Information regarding some raw materials involved in the following specific embodiments of the present invention can be found below, but is not limited thereto: POE resin: SK's 8813V; High melting point polyolefin resin: DOW's VP8770G1; EVA resin: E280PV from Hanwha Total of South Korea; Silane-grafted POE resin: GF101 from Ningbo Nengzhiguang New Material Technology Co., Ltd.

[0060] Example 1 This embodiment provides a perovskite encapsulation composite material, comprising an anti-creep layer, a barrier layer, and a low-temperature crosslinking layer sequentially stacked along its thickness direction. The anti-creep layer has a thickness of 200 μm, the barrier layer has a thickness of 100 μm, and the low-temperature crosslinking layer has a thickness of 400 μm.

[0061] The raw materials for the anti-creep layer include the following components by weight: 60 parts of POE resin 8813V, 40 parts of silane-grafted POE resin GF101, 1 part of trimethylolpropane triacrylate, and 0.2 parts of antioxidant 1010.

[0062] The barrier layer comprises the following components by weight: 100 parts of polyolefin resin masterbatch and 1 part of alkylated diphenylhydroxylamine. The polyolefin resin masterbatch is obtained by melt extrusion granulation of high-melting-point polyolefin resin VP8770G1, dicumyl peroxide, and silane-modified mesoporous silica in a mass ratio of 100:0.3:10. During melt extrusion, the temperatures of each zone of the twin-screw extruder are as follows: Zone I 90–95℃, Zone II 100–120℃, Zone III 160–180℃, Zone IV 160–180℃, Zone V 160–180℃, Zone VI 160–180℃, and die head 130℃. The preparation method of silane-modified mesoporous silica includes the following steps: (a) Ethanol and water are mixed and stirred at a volume ratio of 4:1 to obtain an ethanol-water mixed solvent. 5% of the mass of the mixed solvent is weighed and added to the mixed solvent. The mixture is stirred at 50°C until completely dissolved. Then, 25% ammonia water is added and the pH value is adjusted to 10 to obtain solution A. (b) Ethyl orthosilicate and γ-methacryloyloxypropyltrimethoxysilane were mixed at a molar ratio of 10:1 and stirred until homogeneous to obtain solution B; (c) At room temperature, solution B is slowly added dropwise to solution A and stirred continuously for 12 hours to obtain sol product A; wherein the molar ratio of tetraethyl orthosilicate in solution B to hexadecyltrimethylammonium bromide in solution A is 4:1; (d) Ethanol and 25% hydrochloric acid were mixed and stirred at a volume ratio of 4:1 to obtain a glycolic acid mixed solvent. Sol product A was added to the glycolic acid mixed solvent and stirred to dissolve. The mixture was refluxed and extracted 15 times at 65°C. The solid product was then filtered and dried in a vacuum oven to constant weight to obtain silane-modified mesoporous silica. The mass ratio of sol product A to glycolic acid mixed solvent was 1:10.

[0063] The raw materials for the low-temperature crosslinking layer include the following components by weight: 50 parts of EVA resin E280PV, 50 parts of modified EVA resin, 1 part of tert-hexyl peroxide-2-ethylhexyl carbonate, 0.5 parts of polymeric carbodiimide anti-hydrolysis agent, and 0.2 parts of antioxidant 1010. The modified EVA resin is obtained by melt extrusion granulation of EVA resin E280PV, dicumyl peroxide, vinyltrimethoxysilane, and octyltrimethoxysilane in a mass ratio of 100:0.15:5:1. During melt extrusion, the temperatures of each zone of the twin-screw extruder are as follows: Zone I 90-95℃, Zone II 100-120℃, Zone III 160-180℃, Zone IV 160-180℃, Zone V 160-180℃, Zone VI 160-180℃, and the die head 130℃.

[0064] The preparation method of the perovskite encapsulation composite material in this embodiment includes the following steps: (1) The raw materials of the anti-creep layer, barrier layer and low temperature cross-linking layer are respectively formulated, and multi-layer melt co-extrusion, casting and pressing, and cooling to form a film are carried out; wherein, the extrusion temperature range of the anti-creep layer and the low temperature cross-linking layer is set to 50-90℃; the extrusion temperature range of the barrier layer is set to 70-90℃; and the co-extrusion die temperature is 90-95℃.

[0065] (2) Electron beam irradiation treatment was performed on the anti-creep layer side of the film obtained by multi-layer melt co-extrusion. During the electron beam irradiation treatment, the voltage was 500kV, the beam current was 49mA, and the linear velocity was 25m / min to obtain the perovskite encapsulation composite material.

[0066] Example 2 This embodiment refers to the perovskite encapsulation composite material and its preparation method in Example 1, the difference being that the amount of raw material used in the barrier layer is different, while the rest is the same as in Example 1. The specific differences are as follows.

[0067] In this embodiment, the raw materials for the barrier layer include the following components by weight: 100 parts of polyolefin resin masterbatch and 1 part of alkylated diphenylhydroxylamine; the polyolefin resin masterbatch is prepared by melt extrusion granulation of high-melting-point polyolefin resin VP8770G1, dicumyl peroxide and silane-modified mesoporous silica in a mass ratio of 100:0.2:5; the preparation method is the same as in Example 1.

[0068] Example 3 Group This set of examples refers to the perovskite encapsulation composite material and its preparation method in Example 1, with the only difference being that the type of high-melting-point polyolefin resin used to prepare the polyolefin resin masterbatch in the barrier layer is different; all other aspects are the same as in Example 1. The specific differences are as follows.

[0069] Example 3a: In this example, an equal weight of VERSIFY™ 3200 resin was used to replace the high melting point polyolefin resin VP8770G1 in Example 1; Example 3b: In this example, VL0005 of equal weight was used to replace the high melting point polyolefin resin VP8770G1 in Example 1; Example 3c: In this example, LF575 of equal weight is used to replace the high melting point polyolefin resin VP8770G1 in Example 1.

[0070] Example 4 group This example group refers to the perovskite encapsulation composite material and its preparation method in Example 1, with the only difference being the amount of POE resin 8813V and silane-grafted POE resin GF101 used in the anti-creep layer. All other aspects are the same as in Example 1. Specific differences are as follows.

[0071] Example 4a: In this example, the amount of POE resin 8813V in the anti-creep layer is 70 parts, and the amount of silane-grafted POE resin GF101 is 30 parts. Example 4b: In this example, the amount of POE resin 8813V in the anti-creep layer is 80 parts, and the amount of silane-grafted POE resin GF101 is 20 parts. Example 4c: In this example, the amount of POE resin 8813V in the anti-creep layer is 90 parts, and the amount of silane-grafted POE resin GF101 is 10 parts.

[0072] Example 5 group This set of examples refers to the perovskite encapsulation composite material and its preparation method in Example 1, with the only difference being the amount of EVA resin E280PV and modified EVA resin used in the raw materials of the low-temperature crosslinking layer. All other aspects are the same as in Example 1. Specific differences are as follows.

[0073] Example 5a: In this example, the amount of EVA resin E280PV used in the low-temperature crosslinking layer is 65 parts, and the amount of modified EVA resin is 35 parts. Example 5b: In this example, the amount of EVA resin E280PV used in the low-temperature crosslinking layer is 90 parts, and the amount of modified EVA resin is 10 parts. Example 5c: In this example, the amount of EVA resin E280PV used in the low-temperature crosslinking layer is 40 parts, and the amount of modified EVA resin is 60 parts.

[0074] Comparative Example 1 Comparative Example 1 refers to the perovskite encapsulation composite material and its preparation method in Example 1, the difference being that the amount of raw material used in the creep-resistant layer is different, while the rest are the same as in Example 1. The specific differences are as follows.

[0075] In Comparative Example 1, the raw materials for the anti-creep layer include the following components by weight: 100 parts of POE resin 8813V, 1 part of trimethylolpropane triacrylate, and 0.2 parts of antioxidant 1010.

[0076] Comparative Example 2 Comparative Example 2 refers to the perovskite encapsulation composite material and its preparation method in Example 1, the difference being that the raw material for the barrier layer is different, while the rest is the same as in Example 1. The specific differences are as follows.

[0077] In Comparative Example 2, the raw materials for the barrier layer include the following components by weight: 100 parts of high-melting-point polyolefin resin VP8770G1 and 1 part of alkylated diphenylhydroxylamine.

[0078] Comparative Example 3 Comparative Example 3 refers to the perovskite encapsulation composite material and its preparation method in Example 1, the difference being that the amount of raw materials used in the low-temperature crosslinking layer is different, while the rest are the same as in Example 1. The specific differences are as follows.

[0079] In Comparative Example 3, the raw materials for the low-temperature crosslinking layer include the following components by weight: 100 parts of EVA resin E280PV, 1 part of tert-hexyl peroxide-2-ethylhexyl carbonate, 0.5 parts of polymeric carbodiimide anti-hydrolysis agent, and 0.2 parts of antioxidant 1010.

[0080] Comparative Example 4 Comparative Example 4 refers to the perovskite encapsulation composite material and its preparation method in Example 1, except that: there is no anti-creep layer, the thickness of the barrier layer is 300 μm, the thickness of the low-temperature crosslinking layer is 400 μm, and the rest are the same as in Example 1.

[0081] Comparative Example 5 Comparative Example 5 refers to the perovskite encapsulation composite material and its preparation method in Example 1, except that: there is no barrier layer, wherein the thickness of the anti-creep layer is 300 μm, the thickness of the low-temperature crosslinking layer is 400 μm, and the rest are the same as in Example 1.

[0082] Comparative Example 6 Comparative Example 6 refers to the perovskite encapsulation composite material and its preparation method in Example 1, except that: there is no low-temperature crosslinking layer, wherein the thickness of the anti-creep layer is 200 μm, the thickness of the barrier layer is 500 μm, and the rest are the same as in Example 1.

[0083] Comparative Example 7 Comparative Example 7 refers to the perovskite encapsulation composite material and its preparation method from Example 1, the difference being that the irradiation parameters are different, while everything else is the same as in Example 1. Specific differences are as follows.

[0084] The creep-resistant layer side of the film obtained by multilayer melt co-extrusion was subjected to electron beam irradiation treatment. During the electron beam irradiation treatment, the voltage was 500kV, the beam current was 49mA, and the linear velocity was 10m / min, resulting in a perovskite encapsulation composite material.

[0085] Experimental Example The encapsulation composite materials (films) prepared in different implementations and comparative proportions were tested as follows, and the test results are shown in Table 1.

[0086] 1. Crosslinking degree test and water vapor transmission rate test Test sample preparation: Take the encapsulation composite materials prepared by different examples and comparative examples, and according to the test method of GB / T 29848-2018 "Ethylene-vinyl acetate copolymer (EVA) film for photovoltaic module encapsulation", place the encapsulation composite material in a vacuum laminator and laminate it at 120°C for 15 minutes to obtain test sample one; perform crosslinking degree test and water vapor transmission rate test on the prepared test sample one.

[0087] Pre-crosslinking degree test: Take the encapsulation composite materials prepared in different examples and comparative examples, cut them into small particles with a size of less than 3mm × 3mm, weigh between 0.2020 and 0.2050g, and perform the following steps: a) Take a clean, dried 120-mesh stainless steel mesh and cut it into a rectangle of 35mm × 70mm. Fold it in half once to make it 35mm × 35mm. Then fold the two open edges twice at 2~2.5mm intervals to make an open mesh bag of 30mm × 35mm. Weigh the bag and record the weight as W1.

[0088] b) Weigh 0.2020 to 0.2050 g of the cut film, put it into a stainless steel mesh bag, and record the weight as W2.

[0089] c) Fold the opening of the mesh bag, seal it with wire, and mark each group of samples. Insert the mesh bag into the side opening of the three-necked flask, ensuring that the mesh bag does not touch the inner wall and bottom of the flask. Seal the flask opening with a rubber stopper. Add 2 / 3 volume of xylene solvent to the flask, ensuring that the sample bag is immersed in the solvent. Attach a reflux condenser to the middle of the flask and heat to approximately 145°C until the xylene boils. Start timing for 5 hours, maintaining a reflux rate of 20 drops / min to 40 drops / min.

[0090] d) After reflux, remove the sample and place it in a vacuum oven at 140℃ until it reaches constant weight. Remove the sample package from the oven, remove the iron wire, and place it in a desiccator to cool for 30 minutes before weighing it and recording the weight as W3.

[0091] The degree of crosslinking is calculated using the following formula, and the result is rounded to two decimal places. The average value of the test results is taken. D = ×100% In the formula: D: Degree of cross-linking, expressed as a percentage (%). W1: Mass of the empty stainless steel wire mesh bag, in grams (g). W2: Mass of the stainless steel mesh bag containing the sample, in grams (g). W3: Mass of the sample package after solvent extraction and drying, in grams (g).

[0092] Crosslinking degree test: The test was conducted according to the method in GB / T 29848-2018 "Ethylene-vinyl acetate copolymer (EVA) film for photovoltaic module encapsulation".

[0093] Water vapor transmission rate test: The test shall be conducted in accordance with the method in GB / T 30412-2013 "Determination of water vapor transmission rate of plastic films and sheets - Humidity sensor method".

[0094] 2. Creep resistance test Test sample preparation and testing method: Take the encapsulation composite material prepared in different implementations and comparative proportions, place the encapsulation composite material between two 200mm×200mm×4mm glass pieces, the size of the encapsulation composite material is consistent with the glass, put the glass-encapsulation composite material-glass into a vacuum laminator, laminate at 120℃ for 15min, and then place it vertically in an oven at 100℃ for 100h. Detect the relative displacement distance between the two glass pieces. If the relative displacement distance is less than 1mm, the test is passed; otherwise, it is failed.

[0095] 3. High temperature and high humidity aging test Test Sample Preparation and Testing Methods: Encapsulation composite materials prepared in different implementations and comparative proportions were placed in a vacuum laminator according to the test methods in GB / T 29848-2018 "Ethylene-Vinyl Acetate Copolymer (EVA) Film for Photovoltaic Module Encapsulation," following the order of "tempered glass / encapsulation composite material / backsheet." The lamination was carried out at 120℃ for 15 minutes to obtain single-glass test samples. Then, the single-glass test samples were subjected to high-temperature and high-humidity aging performance testing for 2000 hours according to the test methods in GB / T 29848-2018 "Ethylene-Vinyl Acetate Copolymer (EVA) Film for Photovoltaic Module Encapsulation." Finally, the peel strength between the encapsulation composite material and the glass was measured.

[0096] 4. Acid value test Take the encapsulation composite materials prepared in different implementations and comparative proportions, and place them in a vacuum laminator in the order of "tempered glass / encapsulation composite material / backsheet" and laminate them at 120℃ for 15 minutes. Then, place the prepared components in an aging chamber for high temperature and high humidity aging test for 2000 hours (same as the high temperature and high humidity aging test in step 3). After the test, use a knife to separate the backsheet and encapsulation composite material, cut the encapsulation composite material into small pieces of 3mm×3mm, weigh about 8g of the small sample, record the weight as M1 (in g), and add it to a conical flask containing 200mL of a solution prepared by water and ethanol in a volume ratio of 1:1, so that the free acid in the sample is fully dissolved in the leaching solution. Pipette all the treated extract into a titration flask, add 10 drops of bromothymol blue indicator (the solution will be pale yellow at this point), and titrate with KOH ethanol solution until a cyan or pale blue endpoint is reached. Record the volume of KOH solution required, V3 (in mL). Perform a blank test using a mixture of 100 mL distilled water and 100 mL anhydrous ethanol, adding the same amount of indicator solution and titrating until the same color change endpoint is reached. Record the volume of KOH solution required, V4 (in mL). The acetic acid content can be calculated using the following formula: Acetic acid content (ppm) = [(V3-V4)×C] （KOH） [×60 / M1]×1000; In the formula, C （KOH） This represents the concentration of the KOH ethanol solution, in mol / L. V3 - The volume of KOH solution required for titrating the sample solution, in mL; V4 - The volume of KOH solution required for the blank determination, in mL; M1 - Mass of the sample, in grams.

[0097] Table 1 Performance test results of different encapsulation composite materials

[0098] The test results above show that the water vapor permeability of the 10 parts of silane-modified mesoporous silica added during the preparation of the polyolefin resin masterbatch in Example 1 is 5.97 g / m³. 2 • After 24 hours of high temperature and humidity aging, the acid value of the film was 358 ppm, and the water vapor transmission rate in Example 2 was 8.12 g / m³. 2After 24 hours of high-temperature and high-humidity aging, the acid value of the film was 451 ppm. The results of Examples 1 and 2 show that increasing the content of silane-modified mesoporous silica in the polyolefin resin masterbatch process can improve the water-blocking performance of the film and reduce the release of acidic substances during the aging process. In Examples 1 and 3a, 3b, and 3c, polyolefin resin masterbatches with different melting points were used to prepare the barrier layer. Specifically, VP8770G1 had a melting point of 82°C, VERSIFY™3200 had a melting point of 85°C, VL0005 had a melting point of 103°C, and LF575 had a melting point of 62°C. According to the test results of Examples 1 and 3a, 3b, and 3c, the higher the melting point of the resin, the more regular its molecular chain structure, the higher its crystallinity, and the better its water-blocking effect. Therefore, Example 3a has the lowest water vapor transmission rate, and Example 3c has the highest water vapor transmission rate. However, the melting point of the particles in Example 3b is too high, and melting these particles requires increasing the temperature of the co-extrusion die. This results in slight cross-linking of the cross-linking agent in the low-temperature cross-linking layer during the co-extrusion die process, leading to slight defects in the appearance of the film, and therefore no test data was collected. In Examples 1 and 4a, 4b, and 4c, the content of silane-grafted POE resin decreased sequentially, to 40 parts, 30 parts, 20 parts, and 10 parts, respectively. According to the test results, as the content of silane-grafted POE resin decreased, the pre-crosslinking degree and cross-linking degree of the films prepared in Examples 1 and 4a, 4b, and 4c also decreased, resulting in a decrease in water vapor barrier capacity, a decrease in adhesion after humid heat aging, and an increase in acid value, leading to a decrease in the overall performance of the film. In Examples 1 and 5a, 5b, and 5c, the content of modified EVA resin in the low-temperature crosslinking layer differed. Test results showed that as the modified EVA content increased, the degree of crosslinking of the film increased, improving its resistance to damp heat aging. However, some ungrafted polar additives remained in the modified EVA resin. Excessive addition of modified EVA resin introduced too many polar additives into the film, leading to an increase in the film's acid value. Conversely, insufficient addition of modified EVA resin reduced the film's crosslinking degree, decreased its moisture barrier properties, and accelerated film failure, resulting in an increased content of acidic substances released. In Comparative Example 1, without the addition of silane-grafted POE resin, the pre-crosslinking degree of the film decreased, and the adhesion after aging decreased. In Comparative Example 2, the barrier layer was prepared directly using VP8770G1 resin, resulting in decreased water resistance and increased water vapor permeability. In Comparative Example 3, without the addition of modified EVA resin, the degree of crosslinking of the film decreased, and the adhesion after aging decreased. In Comparative Examples 4 to 6, the anti-creep layer, barrier layer, and low-temperature crosslinking layer were reduced respectively. The adhesive film prepared in Comparative Example 4 had no anti-creep properties, the adhesive film prepared in Comparative Example 5 had significantly reduced water vapor barrier properties, and the adhesive film prepared in Comparative Example 6 had no anti-creep effect and reduced aging adhesion.Comparative Example 7 adjusted the irradiation dose of the adhesive film, increased the pre-crosslinking degree of the adhesive film, and increased the overall crosslinking degree of the adhesive film, resulting in an overly hard adhesive film. This reduced the fluidity of the adhesive film during lamination, leading to poor interfacial wettability between the adhesive film and the glass and battery, and a significant decrease in adhesion after aging.

[0099] Therefore, the perovskite encapsulation composite material of the present invention, through multi-layer compounding of an anti-creep layer, a barrier layer and a low-temperature cross-linking layer, regulates the components of each layer and pre-treats with an appropriate irradiation dose, enabling the encapsulation composite material to have excellent water vapor barrier performance and high-temperature anti-creep performance, as well as good resistance to damp heat aging, etc.; it can play a good protective role for perovskite cells and improve the efficiency and stability of perovskite modules.

[0100] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A packaging composite for perovskite, characterized by, The anti-creep layer, the barrier layer and the low-temperature crosslinking layer are sequentially stacked along the thickness direction of the pipe. The anti-creep layer comprises the following components in parts by weight: polyolefin resin 60-80 parts, silane grafted POE resin 20-40 parts, irradiation crosslinking agent 0.1-1 part and first antioxidant 0.05-0.5 part. The barrier layer comprises the following components in parts by weight: polyolefin resin masterbatch 100 parts and free radical trapping agent 0.1-1 part. The low-temperature crosslinking layer comprises the following components in parts by weight: EVA resin 50-80 parts, modified EVA resin 20-50 parts, low-temperature crosslinking agent 0.1-1 part, anti-hydrolysis agent 0.1-0.5 part and second antioxidant 0.05-0.5 part. The polyolefin resin masterbatch is mainly prepared from high-melting-point polyolefin resin, first initiator and mesoporous silica modified by silane at a mass ratio of 100:(0.01-0.3):(1-10). The modified EVA resin is mainly prepared from EVA resin, second initiator, silane coupling agent and hydrophobic agent at a mass ratio of 100:(0.01-0.15):(1-5):(0.5-2).

2. The encapsulant composite for perovskite according to claim 1, characterized by, At least one of the following characteristics is possessed: (1) The high-melting-point polyolefin resin has a melting point of 80-90℃ and a melt index of 1-14 g / 10 min under the condition of 190℃ / 2.16 kg. (2) The first initiator and the second initiator each independently comprises at least one of dicumyl peroxide, dibenzoyl peroxide, 2,5-di-tert-butyl peroxy-2.5-dimethylhexane and cumyl peroxide. (3) The free radical trapping agent comprises at least one of triphenyl phosphite, tris(nonylphenyl)phosphite, dipentaerythritol fumarate, alkylated diphenylamine and bis(octadecyl)hydroxylamine.

3. The encapsulant composite for perovskite according to claim 1, characterized by, At least one of the following characteristics is possessed: (1) In the modified EVA resin, the silane coupling agent comprises at least one of vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris(butanoneoxime)silane, vinyltris(β-methoxyethoxy)silane and γ-methacryloyloxypropyltrimethoxysilane. (2) The hydrophobic agent comprises at least one of octyltrimethoxysilane, octyltriethoxysilane, hexadecyltrimethoxysilane, hexadecyltriethoxysilane, octadecyltrimethoxysilane and octadecyltriethoxysilane.

4. The encapsulant composite for perovskite according to claim 1, characterized by, At least one of the following characteristics is possessed: (1) The low-temperature crosslinking agent has a half-life temperature of 0.1 h of 95-120℃. Preferably, the low-temperature crosslinking agent comprises at least one of tert-amyl peroxy-2-ethylhexanoate, tert-butyl peroxy-2-ethylhexanoate, tert-hexyl peroxy-2-ethylhexyl carbonate, 2,5-dimethyl-2,5-bis(2-ethylhexanoate peroxide)hexane, di-(3,5,5-trimethylhexanoyl) peroxide and tert-butyl peroxyisooctanoate. (2) The anti-hydrolysis agent comprises at least one of monomeric carbodiimide anti-hydrolysis agent and polymeric carbodiimide anti-hydrolysis agent.

5. The encapsulant composite for perovskite according to claim 1, characterized by, At least one of the following characteristics is possessed: (1) the irradiation crosslinking agent comprises at least one of trimethylolpropane-tris(3-mercaptopropionic acid) ester, tris(2-hydroxyethyl)isocyanuric acid triacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate and ethoxylated trimethylolpropane triacrylate; (2) the silane grafted POE resin is a vinyl trimethoxysilane grafted POE resin.

6. The encapsulant composite for perovskite according to claim 1, characterized by, The thickness of the anti-creep layer, the barrier layer and the low-temperature crosslinking layer accounts for 20-30%, 10-20% and 40-60% of the total thickness of the packaging composite respectively.

7. The encapsulant composite for perovskite according to claim 1, characterized by, The anti-creep layer comprises the following components in parts by weight: polyolefin resin 60-70 parts, silane grafted POE resin 30-40 parts, irradiation crosslinking agent 0.1-1 part and first antioxidant 0.05-0.5 part.

8. The encapsulant composite for perovskite according to claim 1, characterized by, The low-temperature crosslinking layer comprises the following components in parts by weight: EVA resin 50-65 parts, modified EVA resin 35-50 parts, low-temperature crosslinking agent 0.1-1 part, hydrolysis inhibitor 0.1-0.5 part and second antioxidant 0.05-0.5 part.

9. Process for the preparation of a packaging composite material for perovskites according to any one of claims 1 to 8, characterized in that, The method comprises the following steps: respectively dosing the components of the anti-creep layer, the barrier layer and the low-temperature crosslinking layer, and performing multilayer co-extrusion; and then performing electron beam irradiation treatment on the anti-creep layer side of the multilayer co-extruded film.

10. The method of claim 9, wherein, In the electron beam irradiation treatment, the voltage is 100-500 kV, the beam current is 20-50 mA, and the linear speed is 20-50 m / min.

Images