High-density optoelectronic interconnect device for three-dimensional package integration

Abstract

The disclosure provides a three-dimensional packaged integrated high-density optoelectronic interconnection device, which can be applied to the fields of optoelectronic integration, optical communication and optical computing, and the device comprises: an electrical interconnection chip for transmitting electrical signals, transmitting electrical signals generated by an electrical computing chip to an optical interconnection chip for processing, and / or feeding back electrical signals processed by the optical interconnection chip to the electrical computing chip; an optical interconnection chip for processing and transmitting optical signals, converting received electrical signals into optical signals for transmission, and / or converting received optical signals back into electrical signals for transmission; an interposer for realizing electrical signal distribution and connection between the electrical computing chip and the electrical interconnection chip; and micro-bumps for establishing physical connection between the electrical interconnection chip and the optical interconnection chip and between the optical interconnection chip and the interposer, so as to realize transmission of electrical signal data between multiple chips.

Description

Technical Field

[0001] This disclosure relates to the fields of optoelectronic integration, optical communication and optical computing technologies, and more specifically, to a high-density optoelectronic interconnect device with three-dimensional package integration. Background Technology

[0002] With the ever-increasing demand for high-speed and parallel processing capabilities from artificial intelligence, deep learning, and high-performance computing, photonic computing, with its inherent parallelism, high density, and low latency, is considered a key technology for overcoming the bottlenecks of electronic computing. Existing optoelectronic integrated systems handle large-scale data transmission through optical interconnects, but challenges remain in the interconnection and reconfigurable switching between computing chips. Current optical computing chips typically use photonic devices to perform large-scale analog calculations, while electrical computing chips handle system control and digital computation.

[0003] Since optical computing chips and electrical computing chips have different applicable ranges, how to efficiently interconnect optical computing chips and electrical computing chips so as to perform high-speed computing within their respective applicable ranges is a technical problem that needs to be solved. Summary of the Invention

[0004] (a) Technical problems to be solved

[0005] This disclosure provides a high-density optoelectronic interconnect device with three-dimensional packaging integration, which at least partially solves one of the above-mentioned technical problems.

[0006] (II) Technical Solution

[0007] According to a first aspect of this disclosure, a three-dimensional packaged integrated high-density optoelectronic interconnect device is provided, comprising: an electrical interconnect chip for transmitting electrical signals, transmitting electrical signals generated by an electrical computing chip to an optical interconnect chip for processing, and / or feeding back the processed electrical signals from the optical interconnect chip to the electrical computing chip; an optical interconnect chip for processing and transmitting optical signals, converting received electrical signals into optical signals for transmission, and / or converting received optical signals back into electrical signals for transmission; an interposer layer for distributing and connecting electrical signals between the electrical computing chip and the electrical interconnect chip; and microbumps for establishing physical connections between the electrical interconnect chip and the optical interconnect chip, and between the optical interconnect chip and the interposer layer, so as to realize the transmission of electrical signal data between multiple chips.

[0008] According to embodiments of this disclosure, the optical interconnect chip includes: an optical transceiver chip for transmitting and receiving optical signals and realizing the mutual conversion between optical signals and electrical signals; waveguides and other passive devices for guiding the transmission of optical signals within the optical interconnect chip and performing passive processing on the optical signals to meet different optical communication requirements; and a micro-ring optical switching chip for adjusting the output optical signal to realize the switching and routing of optical signals between different channels.

[0009] According to embodiments of this disclosure, the micro-ring optical switching chip includes a multi-channel optical input / output array, which includes: an optical input port for receiving externally input optical signals; an optical output port for outputting processed optical signals; a waveguide for providing a transmission path for the optical signals and guiding the optical signals to propagate within the chip; and a thermally / electrically tunable micro-ring for controlling the transmission path of the optical signals by changing its own resonant state through thermal / electric tuning.

[0010] According to embodiments of this disclosure, the optical transceiver chip further includes a grating coupler for coupling light from an external laser to the optical interconnect chip.

[0011] According to embodiments of this disclosure, the interposer layer includes metal redistribution, and the optical interconnect chip includes metal vias; the electrical computing chip is connected to the electrical interconnect chip through the metal redistribution and the metal vias; the electrical signals output by the electrical computing chip are laid out and guided based on the metal redistribution, and the electrical signals are transmitted to the metal vias; the electrical signals are transmitted to the electrical interconnect chip based on the metal vias of the optical interconnect chip.

[0012] According to embodiments of this disclosure, the device further includes an optical fiber, and the optical interconnect chip includes an end-face coupler. The optical signal output by the optical computing chip is transmitted to the end-face coupler via the optical fiber, and the end-face coupler guides the received optical signal to the micro-ring optical switching chip of the optical interconnect chip.

[0013] According to embodiments of this disclosure, the optical interconnect chip further includes metal layer vias and metal wiring layers, which are used to transmit electrical signals to the signal electrodes or thermal electrodes of the debugger of the optical transceiver chip, and to transmit electrical signals to the electrodes of the micro-ring optical switching chip.

[0014] According to embodiments of this disclosure, the optical transceiver chip has the dual function of transmitting and receiving optical signals, including a multi-channel micro-ring modulator and a multi-channel cascaded micro-ring receiver.

[0015] According to embodiments of this disclosure, the micro-ring optical switching chip is either a thermally tunable micro-ring array or an electrically tunable micro-ring array based on active doping.

[0016] According to embodiments of this disclosure, the materials for the metal layer vias and metal trace layers are copper or aluminum, and the materials for the micro-bumps are copper or copper-containing alloys.

[0017] (III) Beneficial Effects

[0018] The high-density optoelectronic interconnect device with three-dimensional packaging integration provided in this disclosure has at least the following advantages:

[0019] By interconnecting multiple optical computing chips with electrical computing chips, flexible path switching and parallel transmission are achieved through the reconfigurable micro-ring optical switching chip and optical transceiver chip of the optical interconnect chip. This enables efficient and high-speed exchange of data between multiple optical computing chips and electrical computing chips, allowing the optical computing chips and electrical computing chips to process different data. Attached Figure Description

[0020] The above and other objects, features and advantages of this disclosure will become clearer from the following description of embodiments with reference to the accompanying drawings, in which:

[0021] Figure 1 This schematically illustrates a structural diagram of a high-density optoelectronic interconnect device integrated in a three-dimensional package according to an embodiment of the present disclosure;

[0022] Figure 2 A top view schematically illustrates a high-density optoelectronic interconnect device with three-dimensional packaging integration according to an embodiment of the present disclosure;

[0023] Figure 3 The diagram schematically illustrates the structure of a basic switching unit of a micro-ring optical switching chip according to an embodiment of the present disclosure.

[0024] [Attached image labels]

[0025] 1-Electrical interconnect chip; 2-Micro bump; 3-Optical interconnect chip; 301a-Metallic layer via; 301b-Metallic trace layer; 302-Metallic via; 303a-Optical transceiver chip; 303b-Waveguide and other passive devices; 303c-Micro-ring optical switch chip; 303d-End face coupler; 4-Fiber optic cable; 5-Optical computing chip; 6-Intermediate layer; 601-Metallic redistribution line; 7-Electrical computing chip; 801a-Optical... First input port; 801b - First optical output port; 802a - Second optical input port; 802b - Second optical output port; 803a - Third optical input port; 803b - Third optical output port; 804a - Fourth optical input port; 804b - Fourth optical output port; 805a - Upper waveguide; 805b - Left waveguide; 806a - First thermally / electrically tunable microring; 806b - Second thermally / electrically tunable microring; 9. Optoelectronic interconnect chip. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with specific embodiments and accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without inventive effort are within the scope of protection of this disclosure.

[0027] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. The terms “comprising,” “including,” etc., as used herein indicate the presence of the stated features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0028] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0029] In the description of this disclosure, it should be understood that the terms "longitudinal", "length", "circumferential", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the subsystem or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure.

[0030] Throughout the accompanying drawings, identical elements are represented by the same or similar reference numerals. Conventional structures or constructions have been omitted where they may cause confusion in understanding this disclosure. Furthermore, the shapes, dimensions, and positional relationships of the components in the drawings do not reflect actual size, scale, or actual positional relationships. Additionally, any reference numerals placed between parentheses in the claims should not be construed as limiting the claims.

[0031] Similarly, to simplify this disclosure and aid in understanding one or more of the various aspects of the disclosure, in the above description of exemplary embodiments of the present disclosure, various features of the present disclosure are sometimes grouped together in a single embodiment, figure, or description thereof. The use of terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refers to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present disclosure. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this disclosure, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0033] This disclosure provides a high-density optoelectronic interconnect device with three-dimensional packaging integration. Before introducing the technical solution provided by this disclosure, the relevant technologies involved in this disclosure will be described first.

[0034] Microring resonators, as small-sized wavelength selectors and switching units with low tuning power consumption, have been widely used in photonic integrated circuits to achieve programmable routing. However, the resonant bandwidth and dynamic controllable range of a single microring are limited, making it difficult to meet the requirements of large-scale, stable system-level interconnects.

[0035] Currently, there is a need for an overall architecture that enables high-density interconnection of optical computing chips and electrical computing chips at the system level. This architecture should support minimizing photoelectric-optical conversion in the optical domain and achieving flexible wavelength routing and parallel transmission through reconfigurable microring arrays. Simultaneously, the electrical chips need to integrate system monitoring and closed-loop tuning mechanisms to perform real-time correction of microring resonance and power balance, overcoming process tolerances and temperature drift, thereby meeting the comprehensive requirements of high performance, low power consumption, and long-term stability for scenarios such as optoelectronic intelligent computing and data center interconnection.

[0036] This disclosure provides a three-dimensional packaged integrated high-density optoelectronic interconnect device, comprising: an electrical interconnect chip 1 for transmitting electrical signals, transmitting electrical signals generated by an electrical computing chip 7 to an optical interconnect chip 3 for processing, and / or feeding back the processed electrical signals from the optical interconnect chip 3 to the electrical computing chip 7; an optical interconnect chip 3 for processing and transmitting optical signals, converting received electrical signals into optical signals for transmission, and / or converting received optical signals back into electrical signals for transmission; an intermediary layer 6 for distributing and connecting electrical signals between the electrical computing chip and the electrical interconnect chip; and microbumps 2 for establishing physical connections between the electrical interconnect chip 1 and the optical interconnect chip 3, and between the optical interconnect chip and the intermediary layer, to enable the transmission of electrical signal data between multiple chips.

[0037] This disclosure integrates optical computing chips and electrical computing chips with optical interconnect chips and electrical interconnect chips through three-dimensional packaging. This allows the optical computing chips to focus on large-scale analog computation, while the electrical computing chips handle system control and digital computation. Both operate at high speed within their respective areas of application, while the optical interconnect chips enable efficient data interaction and collaborative work, thus improving the overall system's computational efficiency. The micro-ring optical switching chip within the optical interconnect chip is based on a four-channel optical input / output array, enabling large-scale connections and flexible exchange of input / output data between multiple optical and electrical computing chips, meeting the data exchange needs of complex computing scenarios.

[0038] Figure 1 A schematic diagram of a high-density optoelectronic interconnect device integrated in a three-dimensional package according to an embodiment of the present disclosure is shown.

[0039] Figure 2 A top view schematically illustrates a high-density optoelectronic interconnect device integrated in a three-dimensional package according to an embodiment of the present disclosure.

[0040] like Figure 1 , Figure 2 As shown, the high-density optoelectronic interconnect device with three-dimensional packaging integration in this embodiment includes an electrical interconnect chip 1, a micro-bump 2, an optical interconnect chip 3, an optical fiber 4, an optical computing chip 5, an interposer 6, and an electrical computing chip 7.

[0041] The electrical interconnect chip 1 is used for transmitting electrical signals. For example, the electrical interconnect chip 1 can be used to transmit the electrical signals generated by the electrical computing chip 7 to the optical interconnect chip 3, so that the optical interconnect chip 3 can process the received electrical signals. The electrical interconnect chip 1 can also be used to feed back the electrical signals processed by the optical interconnect chip 3 to the electrical computing chip 7, thereby realizing the orderly flow of electrical signals in the high-density optoelectronic interconnect device.

[0042] The optical interconnect chip 3 is used for processing and transmitting optical signals. For example, the optical interconnect chip 3 can be used to convert received electrical signals into optical signals for transmission, or it can be used to convert received optical signals back into electrical signals for transmission. For instance, the optical interconnect chip 3 can convert electrical signals into optical signals for transmission via an optical transceiver chip, and simultaneously convert received optical signals back into electrical signals, achieving seamless integration of optoelectronic signals. The optical interconnect chip 3 may also include a micro-ring optical switching chip to facilitate flexible switching and routing of optical signals, thereby accurately guiding the optical signals to the target chip according to different data exchange requirements.

[0043] In some embodiments, the electrical interconnect chip 1 can be connected to the optical interconnect chip 3 via microbumps to enable bidirectional transmission of photoelectric signals between the two.

[0044] Interposer 6 provides physical support for the entire device, ensuring stable integration of all chips. Interposer 6 enables electrical connections between the electrical interconnect chip and the electrical computing chip via metal rewiring 601. The metal rewiring allows for flexible modification of signal transmission paths based on actual needs, rearranging the signal pins on the electrical computing chip to meet the connection requirements with the optical interconnect chip, thus ensuring efficient signal transmission between chips. Interposer 6 can be a silicon interposer, a glass interposer, or an organic interposer, and the metal rewiring material can be copper, aluminum, or other metals.

[0045] Microbumps 2 are used to establish electrical connections between electrical interconnect chips and optical interconnect chips, ensuring the transmission of electrical signals between the two chips. For example, electrical interconnect chip 1 can be connected to optical interconnect chip 3 via microbumps 2, electrical interconnect chip 1 can be connected to interposer layer 6 via metal vias 302, and optical interconnect chip 3 can be connected to interposer layer 6 via microbumps 2. The material of microbumps 2 can be copper, copper-containing alloys, etc.

[0046] In some embodiments, the optical interconnect chip 3 may include: an optical transceiver chip 303a, a waveguide and other passive devices 303b, a micro-ring optical switching chip 303c, a metal layer via 301a, a metal trace layer 301b, a metal via 302, and an end face coupler 303d.

[0047] The optical computing chip 5 can be coupled to the end-face coupler 303d via the optical fiber 4, and then connected to the optical interconnect chip 3. The electrical computing chip 7 can be connected to the electrical interconnect chip 1 via the metal redistribution 601 of the interposer layer 6 and then via the metal via 302 of the optical interconnect chip 3.

[0048] In this embodiment, the optical computing chip is directly coupled to the end-face coupler of the optical interconnect chip via an optical fiber. Optical signals can be transmitted between the optical computing chip and the optical interconnect chip without undergoing electrical signal conversion. The optical transceiver chip, waveguide, other passive devices, and micro-ring optical switching chip within the optical interconnect chip all operate in the optical domain. Optical signals are transmitted and processed between these devices, reducing unnecessary photoelectric-optical conversion processes and thus minimizing photoelectric-optical conversion within the optical domain.

[0049] The interposer layer includes metal redistribution. The electrical computing chip connects to the electrical interconnect chip through the metal redistribution and metal vias in the interposer layer. The electrical signals output by the electrical computing chip can be laid out and guided based on the metal redistribution, and the electrical signals can be transmitted to the metal vias. The electrical signals are also transmitted to the electrical interconnect chip based on the metal vias of the optical interconnect chip.

[0050] For example, electrical signals can be transmitted to the signal electrodes or thermally modulated electrodes of the modulator of the optical transceiver chip 303a through the metal layer via 301a and the metal wiring layer 301b of the optical interconnect chip 3, or to the electrodes of the micro-ring optical switching chip 303c. The materials of the metal layer via and the metal wiring layer can be metals such as aluminum and copper.

[0051] The 303a optical transceiver chip integrates a multi-channel micro-ring modulator and a multi-channel cascaded micro-ring receiver, enabling simultaneous transmission and reception of optical signals. At the transmitting end, the micro-ring modulator, under the control of an electrical signal, modulates the electrical signal onto the optical carrier, generating an optical signal with a specific frequency and phase. At the receiving end, the cascaded micro-ring receiver accurately receives the optical signal and converts it into an electrical signal, providing a foundation for subsequent signal processing.

[0052] In some embodiments, the optical transceiver chip 303a may also include a grating coupler to couple light from an external laser into the optical interconnect chip, providing a light source for the transmission of optical signals.

[0053] The microring optical switching chip 303c is used to adjust the output optical signal to achieve the switching and routing of the optical signal between different channels. For example, the microring optical switching chip can be either a thermally tunable microring array or an actively doped electrically tunable microring array.

[0054] The microring optical switching chip disclosed herein employs a multi-channel optical input / output array structure. The resonant characteristics of the microrings can be altered by thermally or electrically tuning the microring array, thereby enabling optical signal routing and switching. For example, when the second thermally / electrically tunable microring is not resonant, the light from the first optical input port completely enters the upper waveguide; when tuned towards the resonant direction, the light gradually shifts from entering the upper waveguide to entering the left waveguide. Based on the microring resonant characteristics, light entering different waveguides can be split over a wide range, achieving optical switching.

[0055] In some embodiments, the optical interconnect chip may include an end-face coupler, and the optical signal output by the optical computing chip may be transmitted to the end-face coupler via optical fiber, and the end-face coupler guides the received optical signal to the micro-ring optical switching chip of the optical interconnect chip.

[0056] In some embodiments, the multi-channel input / output array of the micro-ring optical switching chip may include: an optical input port, an optical output port, a waveguide, and a thermal / electrical tuning ring. The optical input port is used to receive externally input optical signals; the optical output port is used to output processed optical signals; the waveguide is used to provide a transmission path for the optical signals and guide the optical signals to propagate within the chip; the thermal / electrical tuning ring is used to change its own resonant state through thermal / electrical tuning, thereby controlling the transmission path of the optical signals.

[0057] Figure 3The diagram schematically illustrates the structure of a basic switching unit of a micro-ring optical switching chip according to an embodiment of the present disclosure.

[0058] like Figure 3 As shown, taking a four-channel optical input / output array as the basic switching unit of a micro-ring optical switching chip as an example, the micro-ring optical switching chip 303c includes four optical input ports and four optical output ports, namely, optical input port 801a, optical input port 802a, optical input port 803a, optical input port 804a, optical output port 801b, optical output port 802b, optical output port 803b, and optical output port 804b. The optical input ports are used to receive externally input optical signals, and the optical output ports are used to output the processed optical signals.

[0059] The micro-ring optical switching chip 303c also includes multiple thermally / electrically tunable micro-rings (first thermally / electrically tunable micro-ring 806a, second thermally / electrically tunable micro-ring 806b) and waveguides in different directions (upper waveguide 805a, left waveguide 805b, right waveguide, and lower waveguide). The waveguides provide a transmission path for the optical signal, guiding its propagation within the chip. The thermally / electrically tunable micro-rings control the light transmission path; by changing the resonant state of the micro-rings, the transmission path of the optical signal between the waveguides can be controlled, enabling optical signal switching and splitting, thus achieving flexible optical switching operations.

[0060] The following section provides a further introduction to the operation of the micro-ring optical switching chip under different resonant states of the thermally / electrically tunable micro-ring.

[0061] When the second thermo / electrically tunable microring 806b is not resonant, the light from the first optical input port 801a enters the upper waveguide 805a completely. When the second thermo / electrically tunable microring 806b is tuned towards resonance, the light from the first optical input port 801a gradually shifts from entering the upper waveguide 805a to entering the left waveguide 805b. According to the microring resonance characteristics, the light entering the upper waveguide 805a and the light entering the left waveguide 805b can be split within a wide range by adjusting their ratio. Through this splitting and optical path switching, the optical switching operation is completed.

[0062] When the first thermo / electrically tunable microring 806a is not resonant, the light from the second optical input port 802a enters the left waveguide 805b completely. When the first thermo / electrically tunable microring (806a) is tuned to the resonant direction, some of the light that originally entered the left waveguide 805b will gradually enter the upper waveguide 805a. According to the microring resonant characteristics, the light entering the upper waveguide 805a and the light entering the left waveguide 805b can be tunably split over a wide range, thereby achieving optical exchange.

[0063] The second optical output port 802b and the third optical output port 803b are responsible for outputting the split light from the upper waveguide 805a and the right waveguide. That is, the light from the upper waveguide and the right waveguide is mixed in a certain proportion and then output from the second optical output port 802b and the third optical output port 803b.

[0064] The optical switching process of the third optical input port 803a and the fourth optical input port 804a is similar to that of the first optical input port and the second optical input port. After the input light is tuned by the micro-ring inside the chip, the output is split into the lower waveguide and the right waveguide. That is, after the input light is processed, it is distributed to the lower waveguide and the right waveguide for output according to a certain ratio.

[0065] The optical switching process of the first optical output port 801b and the fourth optical output port 804b is similar to that of the second optical output port and the third optical output port. They are responsible for outputting the split light from the left waveguide 805b and the lower waveguide. That is, the light from the left waveguide and the lower waveguide are mixed in proportion and then output from the first optical output port 801b and the fourth optical output port 804b.

[0066] In some embodiments, combined with Figure 1 , Figure 2 The process of signal transmission and exchange between optical computing chips and electrical computing chips based on optical interconnect chips is further introduced.

[0067] The optical interconnect chip processes output signals, including signals output to the optical computing chip and signals output to the electrical computing chip.

[0068] When a signal is about to enter the optical computing chip 5, the output optical signal is adjusted based on the micro-ring optical switching chip 303c. The adjusted optical signal enters the optical fiber 4 through the end-face coupler 303d, and is then transmitted to the optical computing chip (5) via the optical fiber. The end-face coupler (303d) acts as a "connector" between the optical fiber and the chip, ensuring that the optical signal can enter the optical fiber from the chip efficiently and accurately. When a signal is about to enter the electrical computing chip 7, the optical interconnect chip 3 uses the receiving end of the optical transceiver chip 303a to convert the received optical signal into an electrical signal based on the photodetector at the receiving end. The converted electrical signal is then transmitted to the electrical computing chip 7 through the rewiring 601.

[0069] The optical interconnect chip receives and converts input signals, including processing signals from optical computing chips and processing signals from electrical computing chips.

[0070] The signals generated after the optical computing chip 5 processes the data can be transmitted back to the optical interconnect chip via optical fiber 4. These signals can then be coupled to the micro-ring optical switching chip 303c of the optical interconnect chip 3 via end-face coupler 303d for further processing or distribution.

[0071] The electrical signals in the electrical computing chip 7 can be converted into optical signals by the transmitter micro-ring modulator of the optical transceiver chip (303a) of the optical interconnect chip 3. The converted optical signals enter the micro-ring optical switching chip 303c of the optical interconnect chip 3, where they are managed and distributed along with other signals.

[0072] In this embodiment, a complex and efficient optical switching network is formed by large-scale interconnection of a micro-ring optical switching chip 303c based on a four-channel optical input / output array as the basic switching unit. This optical switching network enables the exchange of input and output data between multiple optical computing chips 5 and electrical computing chips 7. It allows for flexible routing and distribution of signals between different chips according to system requirements, ensuring fast and accurate data transmission between computing chips, thereby achieving efficient collaborative operation of the entire computing system.

[0073] This embodiment of the disclosure achieves flexible path switching and parallel transmission through the cooperation of a reconfigurable micro-ring optical switching chip and an optical transceiver chip. The optical transceiver chip is responsible for transmitting and receiving optical signals, while the micro-ring optical switching chip flexibly switches the path of the optical signals according to data transmission requirements. When it is necessary to transmit data from the optical computing chip to the electrical computing chip, or vice versa, the micro-ring optical switching chip can dynamically adjust the transmission path of the optical signals, allowing the optical signals to reach the target chip through appropriate waveguides and ports.

[0074] Optical interconnect chips can simultaneously process data from multiple optical computing chips and electrical computing chips, achieving efficient and high-speed data exchange through parallel transmission of multiple optical signals. For example, multiple optical computing chips can simultaneously transmit data to the optical interconnect chip via optical signals of different wavelengths. The optical interconnect chip then routes this data to the corresponding electrical computing chips or other optical computing chips through a micro-ring optical switching chip, meeting the needs of optical and electrical computing chips in processing different data. This efficient and high-speed exchange of data between multiple optical and electrical computing chips enables them to process different types of data.

[0075] It should be noted that the present invention does not limit the size of the optoelectronic interconnect chip 9, the optical computing chip 5, and the electrical computing chip 7. Those skilled in the art can make corresponding adjustments to obtain the required chip size.

[0076] The embodiments of this disclosure have been described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of this disclosure. Although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination. Without departing from the scope of this disclosure, those skilled in the art can make various substitutions and modifications, all of which should be included within the protection scope of this disclosure.

Claims

1. A high-density optoelectronic interconnect device with three-dimensional packaging integration, characterized in that, The device includes: The electrical interconnect chip (1) is used to transmit electrical signals, transmit the electrical signals generated by the electrical computing chip (7) to the optical interconnect chip (3) for processing, and / or feed back the electrical signals processed by the optical interconnect chip (3) to the electrical computing chip (7). The optical interconnect chip (3) is used to process and transmit optical signals, convert the received electrical signals into optical signals for transmission, and / or convert the received optical signals back into electrical signals for transmission. Intermediate layer (6) is used to realize the distribution and connection of electrical signals between the electrical computing chip and the electrical interconnect chip; Microbumps (2) are used to establish physical connections between the electrical interconnect chip (1) and the optical interconnect chip (3), and between the optical interconnect chip and the interposer layer, so as to enable the transmission of electrical signal data between multiple chips; The optical interconnect chip (3) includes an optical transceiver chip (303a), a micro-ring optical switching chip (303c), a metal layer via (301a), and a metal wiring layer (301b). The metal layer via (301a) and the metal trace layer (301b) are respectively electrically connected to the signal electrode or thermoelectric electrode of the modulator of the optical transceiver chip (303a) and the electrode of the micro-ring optical switching chip (303c). The optical transceiver chip (303a) integrates a multi-channel micro-ring modulator and a multi-channel cascaded micro-ring receiver to realize the transmission and reception of optical signals; the micro-ring optical switching chip (303c) is a thermally tunable micro-ring array or an actively doped electrically tunable micro-ring array, used to exchange input and output data of multiple optical computing chips and electrical computing chips. The device also includes an optical fiber (4) and an end-face coupler (303d) disposed on the optical interconnect chip (3); the optical signal output by the optical computing chip (5) is transmitted to the end-face coupler (303d) based on the optical fiber (4), and the end-face coupler (303d) guides the received optical signal to the micro-ring optical switching chip (303c).

2. The apparatus according to claim 1, characterized in that, The optical interconnect chip (3) includes: Waveguides and other passive devices (303b) are used to guide optical signals through the optical interconnect chip and to perform passive processing on the optical signals to meet different optical communication needs.

3. The apparatus according to claim 2, characterized in that, The micro-ring optical switching chip includes a multi-channel optical input / output array, which comprises: Optical input port, used to receive externally input optical signals; Optical output port, used to output processed optical signals; Waveguides are used to provide a transmission path for optical signals and guide the optical signals to propagate within the chip. Thermo- / electro-tunable microrings are used to control the transmission path of optical signals by changing their resonant state through thermal / electric tuning.

4. The apparatus according to claim 2, characterized in that, The optical transceiver chip also includes: A grating coupler is used to couple light from an external laser to an optical interconnect chip (3).

5. The apparatus according to claim 2, characterized in that, The interposer layer (6) includes a metal rewiring layer (601), and the optical interconnect chip (3) includes a metal via (302). The electrical computing chip (7) is connected to the electrical interconnect chip (1) through the metal rewiring (601) and the metal via (302); Based on the metal rewiring (601), the electrical signals output by the electrical computing chip (7) are laid out and guided, and the electrical signals are transmitted to the metal via (302). Based on the metal via (302) of the optical interconnect chip (3), the electrical signals are transmitted to the electrical interconnect chip (1).

6. The apparatus according to claim 2, characterized in that, The optical transceiver chip (303a) has the dual function of transmitting and receiving optical signals, including a multi-channel micro-ring modulator and a multi-channel cascaded micro-ring receiver.

7. The apparatus according to claim 2, characterized in that, The micro-ring optical switching chip (303c) is either a thermally tunable micro-ring array or an electrically tunable micro-ring array based on active doping.

8. The apparatus according to claim 1, characterized in that, The metal layer via (301a) and metal trace layer (301b) are made of copper or aluminum, and the micro bumps (2) are made of copper or copper alloy.

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