Liquid cooling plate and 3D printing method

Abstract

The application discloses a liquid cooling plate and a 3D printing method, and relates to the technical field of 3D printing, in particular to a liquid cooling plate and a 3D printing method. The liquid cooling plate comprises a liquid cooling plate body and a plurality of guide vanes. The liquid cooling plate body is provided with a closed cavity. The closed cavity is provided with a heat conduction inner cavity and a flow guide channel which are not communicated with each other. A plurality of guide vanes are arranged in the heat conduction inner cavity and the flow guide channel. Each guide vane is arranged along the flow direction of the cooling liquid in the heat conduction inner cavity and the heat conduction outer cavity. A turbulence channel is formed between two adjacent guide vanes. A plurality of heat conduction members are arranged in the first flow guide section and / or the third flow guide section. The heat conduction members are transversely arranged in the first flow guide section and / or the third flow guide section. One end of the heat conduction member penetrates through the side wall of the heat conduction inner cavity and enters the heat conduction inner cavity. The second cooling liquid which is frozen due to residue in the heat conduction channel can be quickly melted in an extremely cold environment. In a high-temperature environment, the overall temperature of the liquid cooling plate can be quickly raised. The flowability of the cooling liquid is improved, the heat conduction efficiency of the cooling liquid is higher, and the cooling liquid can realize more efficient heat conduction flow.

Description

Technical Field

[0001] This invention relates to the field of server cooling technology, specifically to a liquid cooling plate and a 3D printing method. Background Technology

[0002] With the exponential growth in the number of transistors in GPUs (Graphics Processing Units) and the dramatic increase in power consumption, their thermal design power can reach hundreds of watts or even higher. Therefore, if the high heat generated by the GPU cannot be dissipated in time, the chip will overheat and resort to frequency throttling as a self-protection mechanism, resulting in performance loss. Prolonged overheating can even permanently damage the hardware. As GPU power consumption continues to rise, efficient heat dissipation solutions become crucial. Current GPU cooling methods typically employ liquid cooling. Liquid cooling primarily achieves heat conduction through the circulation of coolant. For example, in patent document CN120568687A, the method involves introducing a liquid working fluid into the cooling chamber through an inlet, which fully integrates with the micro-fins to conduct the heat generated by the GPU to the micro-fins and then to the cooling working fluid, thereby achieving a cooling effect.

[0003] In the above heat transfer process, the cooling working fluid turns into a gaseous state after reaching its boiling point and is discharged from the outlet. The heat of the memory module is conducted to the bottom rib through the heat-conducting material (mainly metal material), and finally the heat is carried away by the air. Secondly, in patent document 2 with publication number CN115509329A, multiple liquid cooling pipes are deployed in the upper space of the GPU module to optimize the liquid cooling flow structure.

[0004] Therefore, as can be seen from the aforementioned Patent Document 1, in extremely cold environments, when the GPU is not running, the cooling water remaining in the liquid cooling plate will freeze into ice. When the GPU starts running, a large amount of heat is generated instantly, which is difficult to melt the ice in a short time. This makes it difficult for the cooling water to dissipate heat quickly, and the instantaneous high temperature will also vaporize the internal ice directly, causing the pressure inside the liquid cooling plate to increase instantly and causing safety problems. In high-temperature environments, the cooling water is usually around 6°-7°. The temperature difference between the cooling water and the environment will cause water droplets to easily condense on the surface of the liquid cooling plate, causing short circuits or other hidden dangers. As can be seen from the aforementioned Patent Document 2, in environments where liquid cooling is used to dissipate heat from the GPU, the existing coolant flow usually uses liquid cooling pipes to circulate the coolant. The coolant has poor fluidity in the liquid cooling pipes and low heat transfer efficiency. Summary of the Invention

[0005] This invention aims to at least partially solve one of the technical problems in related technologies. Therefore, one object of this invention is to provide a liquid-cooled plate, comprising:

[0006] A liquid-cooled plate with a closed cavity is produced by 3D printing. The closed cavity has a non-communicating heat-conducting inner cavity and a flow channel. The flow channel is arranged around the outer periphery of the heat-conducting inner cavity. The heat-conducting inner cavity is provided with a first liquid inlet and a first liquid outlet, and the heat-conducting inner cavity is used to store a first coolant.

[0007] The flow channel includes a first flow section, a second flow section distributed on both sides of the first flow section and connected to the first flow section, a third flow section connected to the other end of the two second flow sections, and a flow surface connected to the third flow section and disposed below the heat-conducting inner cavity. The first flow section is provided with a second liquid inlet, and the flow surface is provided with a second liquid outlet on the side away from the third flow section.

[0008] Both the heat-conducting inner cavity and the flow-guiding channel are provided with a plurality of flow-guiding fins. Each flow-guiding fin is arranged along the liquid flow direction in the heat-conducting inner cavity and the heat-conducting outer cavity, and a turbulence channel is formed between two adjacent flow-guiding fins.

[0009] A plurality of heat-conducting elements are provided in the first flow guide section and / or the third flow guide section. The heat-conducting elements are transversely disposed in the first flow guide section and / or the third flow guide section, and one end of the heat-conducting element passes through the side wall of the heat-conducting inner cavity into the heat-conducting inner cavity.

[0010] Preferably, the heat-conducting inner cavity includes a heat-conducting sidewall and a heat-conducting bottom wall. The heat-conducting inner cavity achieves heat conduction and isolation with the first flow section, the second flow section and the third flow section through the heat-conducting sidewall. The heat-conducting inner cavity achieves heat conduction and isolation with the flow surface through the heat-conducting bottom wall.

[0011] Preferably, the spacing between two adjacent guide fins is 1mm-5.5mm, and the thickness of the guide fins is 0.2mm-2mm.

[0012] Preferably, the first guide section, the second guide section, and the heat-conducting inner cavity are all located above the guide surface, and the bottoms of the first guide section and the second guide section are isolated from the guide surface and do not communicate with each other.

[0013] Preferably, the guide fins include a first arc-shaped turbulence section and a second arc-shaped turbulence section connected in sequence, and a plurality of the first arc-shaped turbulence sections and the second arc-shaped turbulence sections are connected in sequence and repeatedly to form a plurality of bent turbulence sections.

[0014] Preferably, each of the flow guide fins is provided with a flow guide hole, and the flow guide hole is provided on the first arc-shaped turbulence section or the second arc-shaped turbulence section. The flow guide holes on all the flow guide fins are on the same straight line in the lateral direction, and the turbulence channels are interconnected.

[0015] Preferably, a plurality of the first arc-shaped turbulence segments and the second arc-shaped turbulence segments are connected sequentially and repeatedly to form a wave shape, and the bending turbulence section is the connection point between the crest and trough of the wave.

[0016] Preferably, the heat-conducting component is provided with at least two heat-conducting branches, one end of each heat-conducting branch is connected to and connected to one end of the heat-conducting component extending into the flow channel, and the other end of each heat-conducting branch is a free end distributed in the flow channel.

[0017] Preferably, the heat-conducting component further includes a heat-conducting main stem, which is connected to at least two heat-conducting branches, and the heat-conducting main stem extends through and protrudes from the heat-conducting inner cavity, while the at least two heat-conducting branches are connected to the first flow guide section and / or the third flow guide section.

[0018] Preferably, one end of the flow guide fin in the heat-conducting inner cavity is provided with a heat-conducting insert fin, the heat-conducting insert fin extends through the side wall of the heat-conducting inner cavity into the first flow guide section, and the heat-conducting element extending into the heat-conducting inner cavity is located between two adjacent heat-conducting insert fins, and the heat-conducting insert fin is closely attached to the heat-conducting element.

[0019] The above-described solution of the present invention has at least the following beneficial effects:

[0020] The liquid cooling plate provided by this invention stores a first coolant with a low freezing point and a high boiling point in the heat-conducting cavity. This allows the heat generated by the GPU after startup to be rapidly transferred to the heat-conducting cavity in extremely cold environments, forcing the temperature of the cavity to rise rapidly and conduct through heat-conducting components to the flow channels. This allows the second coolant, which may have frozen due to residue in the heat-conducting channels, to melt quickly. In high-temperature environments, when the second coolant enters the liquid cooling plate, the heat is rapidly conducted to the first coolant in the heat-conducting cavity through the heat-conducting components, causing the temperature of the cavity to rise even faster. Simultaneously, the heat from the GPU can also be transferred through the flowing... The second coolant rapidly diffuses throughout the entire liquid cooling plate, allowing the overall temperature of the plate to rise quickly. This evaporates the water vapor on the surface of the plate, preventing the formation of residual water droplets. Furthermore, during the circulation process of the first coolant entering the heat-conducting cavity and the second coolant entering the flow channel, several flow guide fins completely disperse the first and second coolants within the liquid cooling plate. This increases the heat dissipation area of ​​the first and second coolants within the flow channel, thereby improving the fluidity of the coolant and resulting in higher heat transfer efficiency and more efficient heat conduction.

[0021] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of the liquid cooling plate provided in the embodiment of the present invention;

[0024] Figure 2 This is a cross-sectional view of the liquid cooling plate provided in an embodiment of the present invention;

[0025] Figure 3 yes Figure 2 The enlarged view of part A shown;

[0026] Figure 4 This is another cross-sectional view of the liquid cooling plate provided in this embodiment of the invention;

[0027] Figure 5 This is a schematic diagram of the structure of the heat-conducting fins provided in the embodiments of the present invention;

[0028] Figure 6 This is a partial structural schematic diagram of the heat-conducting fins provided in an embodiment of the present invention;

[0029] Explanation of icon numbers:

[0030] 10. Liquid-cooled plate; 11. Thermally conductive inner cavity; 111. First liquid inlet; 112. First liquid outlet; 113. Thermally conductive sidewall; 114. Thermally conductive bottom wall; 12. Flow channel; 121. First flow section; 122. Second flow section; 123. Third flow section; 124. Flow surface; 125. Second liquid inlet; 126. Second liquid outlet; 13. Receptacle;

[0031] 20. Guide fins; 21. Fluid flow channel; 22. First arc-shaped fluid flow section; 23. Second arc-shaped fluid flow section; 24. Bending fluid flow section; 25. Heat-conducting insert; 26. Fluid flow hole;

[0032] 30. Thermal conductive component; 31. Thermal conductive branch; 32. Thermal conductive trunk.

[0033] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0034] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0035] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "circumferential," and "radial," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0037] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0038] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0039] The liquid cooling plate and 3D printing method of the present invention are described in detail below with reference to the accompanying drawings.

[0040] like Figure 1 and Figure 2 As shown, the liquid cooling plate provided in this embodiment of the invention includes: a liquid cooling plate body 10 with a closed cavity, fabricated using a 3D printing method, wherein the specific steps of the 3D printing method include:

[0041] Step S10: Prepare metal powder in advance as raw material for 3D printing.

[0042] Step S20: Perform 3D modeling based on the shape and size of the liquid cooling plate 10 to generate a 3D simulation model of the liquid cooling plate 10.

[0043] Step S30: Decompose the 3D simulation model to determine the laser scanning path and laser scanning printing parameters for each layer of liquid-cooled plate 10 in the 3D simulation model.

[0044] Step S40: Based on the laser scanning path and laser scanning printing parameters corresponding to each layer of liquid cooling plate in the 3D simulation model, the liquid cooling plate body 10 is printed layer by layer using a printing substrate to obtain a liquid cooling plate body 10 with a closed cavity.

[0045] The metal powder can be made of materials such as copper powder or aluminum alloy powder. The 3D simulation model can be obtained by modeling with 3D software, such as 3Dmax, UG, etc. The thickness of each layer of liquid cooling plate 10 in the 3D simulation model can be determined according to the specific laser scanning printing parameters. The laser scanning printing parameters can include laser power, laser printing area, etc. The laser scanning path can be determined according to the outline of the 3D model to determine its printing start point and printing end point. The above-mentioned closed cavity has a non-communicating heat-conducting inner cavity 11 and a flow channel 12. The liquid cooling plate 10 is provided with a receiving groove 13 for fixing and installing the GPU on the upper surface of the heat-conducting inner cavity 11. The flow channel 12 is arranged around the outer periphery of the heat-conducting inner cavity 11. The heat-conducting inner cavity 11 is provided with a first liquid inlet 111 and a first liquid outlet 112. The first liquid inlet 111 can be used to transport coolant into the heat-conducting inner cavity 11, and the first liquid outlet 112 can be used to discharge coolant out of the heat-conducting inner cavity 11. The heat-conducting inner cavity 11 is used to store the first coolant with a low freezing point and a high boiling point.

[0046] Preferably, the first ends of the first liquid inlet 111 and the first liquid outlet 112 are higher than the inner bottom surface of the heat-conducting inner cavity 11. More preferably, the first end of the first liquid inlet 111 is close to the inner top surface of the heat-conducting inner cavity 11, so that when the first coolant is delivered into the heat-conducting inner cavity 11 from the first liquid inlet 111 and stored, the first coolant can fill the heat-conducting inner cavity 11 to a height close to the inner top surface, so that the first coolant can fill the heat-conducting inner cavity 11 to the maximum extent for storage.

[0047] like Figure 2 and Figure 4 As shown, the flow channel 12 includes a first flow section 121, second flow sections 122 distributed on both sides of the first flow section 121 and connected to the first flow section 121, a third flow section 123 connected to the other end of the two second flow sections 122, and a flow surface 124 connected to the third flow section 123 and disposed below the heat-conducting inner cavity 11. The first flow section 121 is provided with a second liquid inlet 125. When the second coolant is delivered into the second liquid inlet 125 by the delivery pump, the second coolant can enter the first flow channel 11 through the second liquid inlet 125. The first guide section 121 allows the second coolant to be diverted from the first guide section 121 to two second guide sections 122, thereby allowing the second coolant in the two second guide sections 122 to flow together to the third guide section 123. After entering the third guide section 123, the coolant can flow through the third guide section 123 to the guide surface 124. Since a second outlet 126 is provided on the side of the guide surface 124 away from the third guide section 123, the second coolant entering the guide surface 124 can be circulated back to the delivery pump from the second outlet 126.

[0048] Furthermore, both the heat-conducting inner cavity 11 and the flow-guiding channel 12 are provided with a number of flow-guiding fins 20. Each flow-guiding fin 20 is arranged along the flow direction of the coolant in the heat-conducting inner cavity 11 and the flow-guiding channel 12, and a turbulence channel 21 is formed between two adjacent flow-guiding fins 20. It can be understood that the regular undulating structure of the flow-guiding fin 20 represents a structure with periodic undulating changes, such as a V-shaped undulating structure, a wave-shaped undulating structure, a U-shaped undulating structure, etc. Optionally, each flow-guiding fin 20 can also adopt an irregular undulating structure, such as an irregular concave-convex structure, etc. By setting the flow-guiding fin 20 as an undulating structure, the heat dissipation area of ​​the flow-guiding fin 20 is larger, and when the second coolant enters the flow-guiding channel 12, the undulating structure can make the flow of the second coolant better, so that the second coolant and the flow-guiding fin 20 can be in full contact, and the flow-guiding efficiency is higher.

[0049] As a preferred method, such as Figure 5 and Figure 6 As shown, each guide fin 20 is provided with a first arc-shaped turbulence section 22 and a second arc-shaped turbulence section 23 connected sequentially along its own length direction, so that the first arc-shaped turbulence section 22 and the second arc-shaped turbulence section 23 are repeatedly connected in a regular undulating structure; more preferably, a number of first arc-shaped turbulence sections 22 and second arc-shaped turbulence sections 23 are connected sequentially and repeatedly to form a wave shape, and the bent turbulence section 24 is the connection point of the wave crest and trough, the height difference between the wave crest and the trough can be 3mm-10mm, combined with Figure 6 As shown, when the second coolant flows through the first arc-shaped turbulence section 22 and the second arc-shaped turbulence section 23 in sequence, the flow velocity and flow direction of the second coolant can be changed by the first arc-shaped turbulence section 22 and the second arc-shaped turbulence section 23, so that the second coolant can flow along the bending direction of the turbulence channel 21, which increases the contact area between the coolant and the first arc-shaped turbulence section 22 and the second arc-shaped turbulence section 23, and improves the heat transfer capacity of the liquid cooling plate.

[0050] Understandably, when the GPU transfers heat to the liquid cooling plate, the heat can be dispersed onto several guide fins 20. When delivering coolant to the heat-conducting outer cavity, a delivery pump can be connected to the second inlet 125, allowing the coolant to be circulated sequentially from the first guide section 121, the two second guide sections 122, the third guide section 123, and the guide surface 124. This allows the coolant to be dispersed among the heat-conducting fins to various areas of the guide channel 12. Finally, the coolant is circulated back to the delivery pump through the second outlet 126. As the coolant flows between the guide fins 20, since both the guide channel 12 and the heat-conducting bottom cavity are equipped with heat-conducting fins, the coolant can quickly remove the heat from the heat-conducting fins from the liquid cooling plate. This allows the GPU's heat to be quickly transferred to the liquid cooling plate and then quickly removed by the coolant, resulting in better overall heat conduction of the liquid cooling plate.

[0051] like Figure 2 As shown, a plurality of heat-conducting elements 30 are provided in the first guide section 121 and / or the third guide section 123. The heat-conducting elements 30 are transversely arranged in the first guide section 121 and / or the third guide section 123, and one end of the heat-conducting element 30 passes through the side wall of the heat-conducting inner cavity 11 into the heat-conducting inner cavity 11.

[0052] Specifically, the first coolant can be a low-condensing-point, high-boiling-point coolant, such as an aqueous solution of ethylene glycol, fluorinated liquid, or synthetic heat transfer oil. The second coolant can be ordinary cooling water, such as deionized water. When the supply of the second coolant stops, because the second coolant has no antifreeze capability, residue will remain in the flow channel 12. Therefore, in extremely cold environments, if the GPU is not running, the second coolant in the flow channel 12 will freeze into ice. The GPU is mounted on the housing 13, which is usually located on the heat-conducting cavity 11. When the GPU starts up... Heat can be preferentially conducted to the heat-conducting inner cavity 11, thereby enabling the second coolant in the heat-conducting inner cavity 11 to heat up rapidly in extremely cold environments. The heat can also be quickly conducted through the heat-conducting component 30 to the first flow section 121 and / or the third flow section 123, and then quickly diffused to the liquid cooling plate 10 through the heat-conducting component 30. This can quickly melt the second coolant frozen in the flow channel 12, and in high-temperature environments, the heat from the GPU can be quickly diffused through the heat-conducting component 30 to the entire liquid cooling plate 10, so as to evaporate the water vapor on the surface of the liquid cooling plate and avoid the formation of residual water droplets.

[0053] In a more preferred embodiment, the third guide section 123 is provided with a plurality of guide fins 20, and the height of the guide fins 20 is less than the height of the third guide section 123. When the coolant enters the third guide section 123, the second coolant can be concentrated and dispersed between the heat-conducting fins in the third guide section 123, avoiding the flow of the coolant in the thickness direction between the heat-conducting fins due to the excessive height of the heat-conducting fins, and ensuring better flow of the second coolant from the guide channel 12 to the heat-conducting bottom cavity.

[0054] like Figure 2 and Figure 4As shown, the heat-conducting inner cavity 11 includes a heat-conducting sidewall 113 and a heat-conducting bottom wall 114. The heat-conducting inner cavity 11 achieves heat conduction between itself and the first guide section 121, the second guide section 122, and the third guide section 123 through the heat-conducting sidewall 113. The heat-conducting sidewall 113 can also isolate the first coolant within the heat-conducting inner cavity 11 from the first guide section 121, the second guide section 122, and the third guide section 123. The heat-conducting inner cavity 11 achieves both heat conduction and isolation with the guide surface 124 through the heat-conducting bottom wall 114. The area of ​​the guide surface 124 is not less than that of the heat-conducting inner cavity 11. The heat-conducting bottom wall 114 is provided, wherein the GPU is attached and fixed on the receiving groove 13 and located above the heat-conducting inner cavity 11, so that the heat of the GPU can be preferentially conducted to the heat-conducting inner cavity 11 and transferred to the first guide section 121 and the third guide section 123 through the heat-conducting component 30; preferably, the area of ​​the heat-conducting inner cavity 11 is larger than 4 / 5 of the area of ​​the liquid cooling plate 10, so that when the heat of the GPU is conducted to the heat-conducting inner cavity 11, the heat can be quickly diffused to the entire liquid cooling plate by the heat-conducting component 30 and discharged through the first coolant and the second coolant, ensuring that the heat conduction efficiency of the liquid cooling plate is higher.

[0055] More preferably, the first guide section 121, the second guide section 122, and the heat-conducting inner cavity 11 are all located above the guide surface 124. The bottoms of the first guide section 121 and the second guide section 122 are isolated from the guide surface 124 and do not communicate with each other, so that the two coolants can flow and conduct heat independently in the heat-conducting inner cavity 11 and the guide channel 12, thereby improving the heat conduction effect of the liquid cooling plate 10. As a preferred embodiment, a temperature sensor can be installed in the guide channel 12 to monitor the temperature of the second coolant entering the guide channel 12 and the temperature of the second coolant flowing out of the guide channel 12 before the second coolant is delivered into the guide channel 12 from the second inlet 125. When the second coolant is in channel 12, its temperature can be around 6 degrees Celsius. When the second coolant is output from the second outlet 126, its temperature can be around 25 degrees Celsius. In order to keep the temperature of the second coolant stable, the temperature of the second coolant is monitored by a temperature sensor. If the output temperature of the second coolant is too high (for example, exceeding 26 degrees Celsius), the delivery rate of the second coolant can be increased. If the output temperature of the second coolant is kept stable, the delivery rate of the second coolant can be controlled to keep it constant. This keeps the temperature of the coolant constant and avoids the problem of condensation on the surface of the liquid cooling plate.

[0056] like Figure 2 and Figure 3 As shown, the heat-conducting component 30 also includes a heat-conducting main stem 32, which is integrally connected to at least two heat-conducting branches 31. The heat-conducting main stem 32 passes through the inner wall and extends between a number of flow guide fins 20, and at least two heat-conducting branches 31 are connected to the outer wall.

[0057] In this embodiment, the heat-conducting main trunk 32 can be connected in the heat-conducting inner cavity 11, or in the first guide section 121 and / or the third guide section 123. At least two heat-conducting branches 31 can be connected at one end in the heat-conducting inner cavity 11. Preferably, at least two heat-conducting branches 31 are connected in the first guide section 121 and / or the third guide section 123, so that the residual second coolant in the first guide section 121 and / or the third guide section 123 is dispersed by the heat-conducting branches 31. When the guide channel 12 is de-iced by heat, the heat transferred from the heat-conducting inner cavity 11 to the heat-conducting branches 31 can quickly diffuse, allowing the frozen second coolant in the guide channel 12 to melt rapidly. Optionally, the number of heat-conducting branches 31 can be greater than two, resulting in higher heat conduction efficiency between the heat-conducting component 30 and the heat-conducting outer cavity. At least two heat-conducting branches 31 are inclined to each other and intersected. For example, it can be formed into a tree branch shape, etc. Preferably, the included angle between at least two heat-conducting branches 31 is 10°-45°, for example, it can be 20°. The included angle between at least two heat-conducting branches 31 should ensure more efficient heat transfer while maintaining the highest possible density. As an optional method, the heat-conducting element 30 can also adopt a grid shape, etc., and the radial cross-sectional structure of the heat-conducting element 30 can be formed into a circle, ellipse or rectangle, etc., or it can adopt an irregular shape, etc. The heat-conducting main stem 32 penetrates through the inner wall and protrudes from the heat-conducting inner cavity 11, so that after the heat-conducting main stem 32 is connected to the inner wall, the heat of the inner wall can be quickly transferred to the heat-conducting main stem 32. Since the heat-conducting main stem 32 is connected to at least two heat-conducting branches 31, and at least two heat-conducting branches 31 are connected to the outer wall, the at least two heat-conducting branches 31 can be rapidly heated, thereby achieving the ice-breaking effect in extremely cold environments.

[0058] Furthermore, in combination Figure 2 and Figure 3 As shown, one end of the flow guide fin 20 in the heat-conducting inner cavity 11 is provided with a heat-conducting insert 25. The heat-conducting insert 25 extends through the side wall of the heat-conducting inner cavity 11 into the first flow guide section 121. The heat-conducting main stem 32 extending into the heat-conducting inner cavity 11 is located between two adjacent heat-conducting inserts 25. The heat-conducting insert 25 and the heat-conducting main stem 32 are closely attached to each other, so that the heat transferred from each flow guide fin 20 to the heat-conducting insert 25 can be transferred to the heat-conducting branch 31 through the heat-conducting main stem 32, and diffused to the entire liquid cooling plate 10 through the heat-conducting branch 31, so as to achieve rapid ice breaking in extremely cold environments and water vapor evaporation in high-temperature environments.

[0059] like Figure 3As shown, the heat-conducting component 30 has at least two layers in the height direction of the liquid cooling plate 10, and they are aligned or staggered with each other in the height direction. Several heat-conducting branches 31 are interlaced to form a cross-grid structure that fills the first guide section 121 or the third guide section 123, which makes the heat transfer between the heat-conducting inner cavity 11 and the heat-conducting outer cavity more efficient. It can melt the second coolant that is frozen in the heat-conducting outer cavity more quickly in extremely cold environments, and it can also evaporate the water vapor on the surface of the liquid cooling plate more quickly in high-temperature environments.

[0060] like Figure 5 and Figure 6 As shown, each guide fin 20 is provided with a guide hole 26, and the guide holes 26 are all located on the first arc-shaped turbulence section 22 or the second arc-shaped turbulence section 23. All the guide holes 26 on the guide fins 20 are aligned on the same straight line in the transverse direction, and the turbulence channels 21 are interconnected. When the first coolant and the second coolant flow to their respective turbulence channels 21, the two coolants can be quickly transferred to the respective turbulence channels 21 through the guide holes 26, resulting in better flow of the two coolants within the turbulence channels 21. This is a more preferred method. Yes, each guide fin 20 has multiple guide holes 26, which are spaced apart along the length of the guide fin 20. Each guide hole 26 on each guide fin 20 can be located on the same straight line, so that the two coolants can flow better between the various turbulence channels 21 and the heat transfer efficiency is higher. Optionally, the shape of the guide holes 26 can be rectangular, circular, elliptical, etc., and the multiple guide holes 26 can be located at the edge of the guide fin 20 or at the center of the guide fin 20.

[0061] like Figure 6 As shown, the spacing between two adjacent guide fins 20 is 1mm-5.5mm, and the thickness of the guide fins 20 is 0.2mm-2mm. The spacing L1 between the guide fins 20 determines the width of the guide channel 12. The smaller the spacing L1 between the guide fins 20, the higher the density of the several guide fins 20. The larger the spacing L1 between the guide fins 20, the lower the density of the several guide fins 20. The spacing L1 and thickness L2 of the guide fins 20 should meet the requirement of high density of several guide fins 20 under the premise of strong coolant flow. For example, the spacing L1 between two adjacent guide fins 20 can be 3.5mm, and the thickness L2 of the guide fins 20 can be 1mm. The above dimensions of spacing L1 and thickness L2 are only examples and are not limited here.

[0062] The liquid cooling plate provided by this invention stores a first coolant with a low freezing point and a high boiling point in the heat-conducting cavity 11. This allows the heat generated after the GPU starts up to be rapidly transferred to the heat-conducting cavity 11 in extremely cold environments, forcing the temperature of the heat-conducting cavity 11 to rise rapidly and be conducted through the heat-conducting component 30 to the flow channel 12. This allows the second coolant, which may have frozen due to residue in the heat-conducting channel, to melt quickly. In high-temperature environments, the heat can be rapidly conducted to the entire liquid cooling plate through the heat-conducting component 30, causing the temperature of the liquid cooling plate to rise even faster. Simultaneously, the heat from the GPU can also be transferred through the flowing coolant. The rapid diffusion across the entire liquid cooling plate allows the overall temperature of the liquid cooling plate to rise quickly, thereby evaporating the water vapor on the surface of the liquid cooling plate and preventing the formation of residual water droplets. Furthermore, during the circulation process of the first coolant entering the heat-conducting inner cavity 11 and the second coolant entering the flow channel 12, the first and second coolants can be completely dispersed within the liquid cooling plate by several flow guide fins 20. This increases the heat dissipation area of ​​the coolant within the turbulence channel 21, thereby improving the fluidity of the coolant and making its heat transfer efficiency higher, allowing the coolant to achieve more efficient heat conduction flow.

[0063] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0064] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A liquid-cooled plate, characterized in that, include: A liquid-cooled plate with a closed cavity is fabricated using 3D printing. The closed cavity contains non-communicating heat-conducting inner cavities and flow channels. The flow channels are arranged around the outer periphery of the heat-conducting inner cavities. The heat-conducting inner cavities are provided with a first liquid inlet and a first liquid outlet, and are used to store a first coolant. The first coolant includes any one of ethylene glycol aqueous solution, fluorinated liquid, or synthetic heat-conducting oil. The flow channel includes a first flow section, a second flow section distributed on both sides of the first flow section and connected to the first flow section, a third flow section connected to the other end of the two second flow sections, and a flow surface connected to the third flow section and disposed below the heat-conducting inner cavity. The first flow section is provided with a second liquid inlet, and the flow surface is provided with a second liquid outlet on the side away from the third flow section. Both the heat-conducting inner cavity and the flow-guiding channel are provided with a plurality of flow-guiding fins. Each flow-guiding fin is arranged along the liquid flow direction in the heat-conducting inner cavity and the heat-conducting outer cavity, and a turbulence channel is formed between two adjacent flow-guiding fins. A plurality of heat-conducting elements are provided in the first flow guide section and / or the third flow guide section. The heat-conducting elements are transversely disposed in the first flow guide section and / or the third flow guide section, and one end of the heat-conducting element passes through the side wall of the heat-conducting inner cavity into the heat-conducting inner cavity.

2. The liquid cooling plate according to claim 1, characterized in that, The heat-conducting inner cavity includes a heat-conducting sidewall and a heat-conducting bottom wall. The heat-conducting inner cavity achieves heat conduction and isolation with the first flow section, the second flow section and the third flow section through the heat-conducting sidewall. The heat-conducting inner cavity achieves heat conduction and isolation with the flow surface through the heat-conducting bottom wall.

3. The liquid cooling plate according to claim 1, characterized in that, The spacing between two adjacent guide fins is 1mm-5.5mm, and the thickness of the guide fins is 0.2mm-2mm.

4. The liquid cooling plate according to claim 1, characterized in that, The first guide section, the second guide section, and the heat-conducting inner cavity are all located above the guide surface, and the bottoms of the first guide section and the second guide section are isolated from the guide surface and do not communicate with each other.

5. The liquid cooling plate according to claim 1, characterized in that, The guide fins include a first arc-shaped turbulence section and a second arc-shaped turbulence section connected in sequence, and several first arc-shaped turbulence sections and second arc-shaped turbulence sections are connected in sequence and repeatedly to form several bent turbulence sections.

6. The liquid cooling plate according to claim 5, characterized in that, Each of the flow guide fins is provided with a flow guide hole, and the flow guide hole is provided on the first arc-shaped turbulence section or the second arc-shaped turbulence section. The flow guide holes on all the flow guide fins are on the same straight line in the lateral direction, and the turbulence channels are interconnected.

7. The liquid cooling plate according to claim 1, characterized in that, The heat-conducting component is provided with at least two heat-conducting branches. One end of each heat-conducting branch is connected to and connected to one end of the heat-conducting component extending into the flow channel. The other end of each heat-conducting branch is a free end distributed within the flow channel.

8. The liquid cooling plate according to claim 7, characterized in that, The heat-conducting component further includes a heat-conducting main trunk, which is connected to at least two heat-conducting branches. The heat-conducting main trunk extends through and protrudes from the heat-conducting inner cavity, and the at least two heat-conducting branches are connected to the first flow guide section and / or the third flow guide section.

9. The liquid cooling plate according to claim 1, characterized in that, One end of the flow guide fins in the heat-conducting inner cavity extends with a heat-conducting insert. The heat-conducting insert penetrates the side wall of the heat-conducting inner cavity and extends into the first flow guide section. The heat-conducting element extending into the heat-conducting inner cavity is located between two adjacent heat-conducting inserts, and the heat-conducting insert is closely attached to the heat-conducting element.

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