A compliant solder and high precision active coupling soldering method

Abstract

The application relates to the technical field of optical communication device production, in particular to an elastic solder and a high-precision active coupling welding method; the elastic solder has flexibility and deformation capacity; the elastic solder can keep flexible connection between a device to be welded and a substrate during coupling, and after the elastic solder is melted during welding, the elastic solder can fill the gap between the device to be welded and the substrate, so that the device to be welded is welded on the substrate. The elastic solder can keep flexible connection between the devices to be welded without affecting the coupling position, and the coupling precision is improved to the sub-micron level. During welding, the elastic solder can transfer heat from the substrate to the device to be welded, so that the device to be welded is prevented from being damaged due to overheating, and the yield is improved. The high-precision active coupling welding method has good compatibility and expansibility, and based on the method, existing mounting equipment can be modified, so that the equipment investment cost is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of optical communication device production, in particular to an elastic solder and a high-precision active coupling welding method. BACKGROUND

[0002] With the Artificial Intelligence (AI) data center becoming the core engine of global computing power industry, optical module technology is ushering in a revolutionary breakthrough. In terms of speed, the industry is rapidly iterating from 100G / 400G to 800G, 1.6T technology has entered the pre-research stage, and 6.4T has become a clear development goal. In terms of energy efficiency, the unit bandwidth power consumption is moving towards the goal of 0.01W / Gbps or below from 0.03W / Gbps. In terms of integration, the module volume continues to shrink, driving the development of devices to chip level. These technological evolutions have put unprecedented stringent requirements on component assembly precision: the alignment deviation of 800G modules needs to be controlled within 1um, and 1.6T modules need to achieve sub-micron precision of 0.5um.

[0003] However, the traditional optoelectronic device welding process faces severe challenges. The current mainstream high-temperature welding processes such as eutectic welding, reflow welding and wave soldering have obvious limitations: first, under the sub-micron precision requirement, the traditional welding process calculates the solder volume and the preset position of the to-be-welded device through theoretical calculation, and uses machine vision technology to align the to-be-welded devices, which seriously affects the alignment precision; second, the hardness of the traditional solder is high and the ductility is poor, so it must be pressed along the Z axis to contact the to-be-welded device after the solder is contacted with the to-be-welded device to ensure heat conduction, which cannot realize precise adjustment in the height direction.

[0004] These technical bottlenecks seriously restrict the reliability and yield of high-density optoelectronic integration. Therefore, overcoming the defects of the existing technology is a problem to be solved in this technical field. SUMMARY

[0005] The technical problem to be solved by the present application is that the ordinary solder and the to-be-welded device are in hard contact when welding the to-be-welded devices, which is difficult to achieve sub-micron level in alignment precision, resulting in low coupling efficiency of the to-be-welded devices.

[0006] The present application adopts the following technical solutions:

[0007] In a first aspect, the present application provides an elastic solder 1, which has flexibility and deformation ability.

[0008] The elastic solder 1 can maintain a flexible connection between the device 2 to be welded and the substrate 3 during coupling, and can fill the gap between the device 2 to be welded and the substrate 3 after being melted during welding, so as to weld the device 2 to be welded on the substrate 3.

[0009] Further, the elastic solder 1 can be stretched or compressed when deformed.

[0010] The elastic solder 1 is in a folded state.

[0011] Alternatively, the elastic solder 1 is in a folded state and has a porous structure.

[0012] Further, the elastic solder 1 comprises a plurality of elastic sheets 12 connected together at a preset angle, and a hole 120 is arranged on each of the elastic sheets 12 except for two elastic sheets 12 located at both sides of the elastic solder 1.

[0013] Further, the hole 120 comprises a first hole 121 and a second hole 122, the diameter of the first hole 121 is greater than that of the second hole 122, the first hole 121 is distributed on the edge of the elastic sheet 12, and the second hole 122 is distributed on the middle of the elastic sheet 12.

[0014] In a second aspect, the application provides a high-precision active coupling welding method, which comprises the following steps: placing a substrate 3 on a heating table 4, and placing an elastic solder 1 in a preset welding area 30, wherein the substrate 3 is attached with a first component;

[0015] Moving a second component by a multi-dimensional adjusting frame 5 to preliminarily align the second component with the elastic solder 1;

[0016] Powering the second component and the first component, and dynamically adjusting the position and angle of the second component to accurately couple the second component and the first component.

[0017] Disconnecting the power supply of the second component and the first component, and heating the elastic solder 1 by the heating table 4 to melt the elastic solder 1 and fill the gap between the second component and the substrate 3.

[0018] Further, after the accurate coupling between the second component and the first component is achieved, the elastic solder 1 is compressed, so that the upper end of the elastic solder 1 is in contact with the second component.

[0019] Further, the elastic solder 1 absorbs the heat of the heating table 4 and transmits the heat to the second component.

[0020] The heating strip 7 is arranged at a preset position in the heating table 4, so that the elastic solder 1 is uniformly heated.

[0021] Further, the method further comprises that the elastic solder 1 comprises a plurality of elastic sheets 12 connected together at preset angles, and holes 120 are arranged on the elastic sheets 12 except for two elastic sheets 12 arranged on two sides of the elastic solder 1.

[0022] The high point of the elastic sheet 12 is a wave crest 123, and the low point of the elastic sheet 12 is a wave trough 124, and a first heating cavity 125 is arranged between the wave crest 123 and the substrate 3, and a second heating cavity 126 is arranged between the wave trough 124 and the device to be welded 2; the heating strip 7 corresponds to the wave crest 123.

[0023] The holes 120 can realize heat conduction between the first heating cavity 125 and the second heating cavity 126.

[0024] Further, the method further comprises that the elastic solder 1 is heated in a nitrogen or inert gas atmosphere.

[0025] During the adjustment of the position and angle of the second assembly, the second assembly is flexibly connected to the substrate 3 through the elastic solder 1.

[0026] The beneficial effects of the present application are that the elastic solder can keep the device to be welded and the substrate flexibly connected without affecting the coupling position, and the coupling precision is improved to the sub-micron level. During the welding process, active coupling can be performed first, and after the active coupling is completed, the device to be welded and the upper end of the elastic solder are flexibly contacted; then the heating operation of the elastic solder is performed, and the elastic solder is melted to realize the welding between the device to be welded and the substrate. Since the chip in the device to be welded is powered off during the heating process, high temperature will not cause damage to the chip. In addition, during the welding process, the heat is transmitted from the substrate to the device to be welded by the elastic solder, which can also reduce the influence of high temperature on the device to be welded, and improve the yield.

[0027] Further, the high-precision active coupling welding method has good compatibility and expansibility, and based on this method, the existing mounting equipment can be modified, thereby reducing the equipment investment cost. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creating laborious work.

[0029] Figure 1 is a schematic diagram of a welding effect of an elastic solder provided by an embodiment of the present application;

[0030] Figure 2 is a schematic diagram of a structure of an elastic solder provided by an embodiment of the present application;

[0031] Figure 3 is a schematic diagram of a top view structure of an elastic solder provided by an embodiment of the present application;

[0032] Figure 4 is a schematic diagram of a top view structure of elastic pieces P3-P7 of an elastic solder provided by an embodiment of the present application;

[0033] Figure 5 is a schematic diagram of a top view structure of elastic pieces P3-P7 of an elastic solder provided by an embodiment of the present application;

[0034] Figure 6 is a schematic diagram of a structure of a wave crest and a wave trough provided by an embodiment of the present application;

[0035] Figure 7 is a schematic diagram of a structure of a first heat conduction cavity and a second heat conduction cavity provided by an embodiment of the present application;

[0036] Figure 8 is a schematic diagram of a structure of an arrangement of a heating table provided by an embodiment of the present application;

[0037] Figure 9 is a schematic diagram of a structure of another arrangement of a heating table provided by an embodiment of the present application;

[0038] Figure 10 is a schematic diagram of a flow of a high-precision active coupling welding method provided by an embodiment of the present application;

[0039] Figure 11 is a schematic diagram of a structure of a heating table, a substrate, an elastic solder, and a transmitting assembly provided by an embodiment of the present application;

[0040] Figure 12 is a schematic diagram of a top view structure of a substrate welded with a receiving assembly provided by an embodiment of the present application;

[0041] Figure 13 is a schematic diagram of a structure of a multi-dimensional adjusting frame provided by an embodiment of the present application;

[0042] Figure 14 is a schematic diagram of a welding of a common solder provided by an embodiment of the present application;

[0043] Figure 15 is a schematic diagram of a welding of an elastic solder provided by an embodiment of the present application.

[0044] In the drawings, the reference signs are:

[0045] Elastic solder 1, elastic sheet 12, hole 120, first hole 121, second hole 122, wave crest 123, wave trough 124, first heating cavity 125, second heating cavity 126, device to be welded 2, receiving assembly 20, emitting assembly 21, substrate 3, preset welding area 30, heating table 4, multi-dimensional adjusting frame 5, six-axis module 50, suction nozzle 51, ordinary solder 6, heating strip 7. DETAILED DESCRIPTION

[0046] In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and should not be used to limit the present application.

[0047] Unless otherwise required by context, the term "comprises" in the specification and claims is to be construed as open-ended, i.e. as "comprising but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example" or "some examples" are intended to mean that a particular feature, structure, material or characteristic is included in at least one embodiment or example of the disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics described can be included in any one or more embodiments or examples in any appropriate manner, i.e. although they can be carried by the embodiments or examples of the above terms due to the order of appearance and location, they are not limited to being carried by one embodiment or example in a combined manner.

[0048] In the description of the present application, the terms "first", "second" are only used for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features limited by "first", "second" can be explicitly or implicitly included one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, the meaning of "a plurality of" is two or more. In addition, for example, in the description, the same type of nouns can also be described as two independent individuals by adding "A", "B" at the end, in which case the features limited by "A", "B" are only used for the purpose of distinguishing the same type of individual description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.

[0049] In describing some embodiments, it will be understood that the terms "couple," "coupled," and "connection" and variations thereof are used generically and not necessarily meant to imply direct physical or electrical contact between two or more components. For example, the term "connected" can be used to indicate that two or more components are in direct physical or electrical contact with one another. As another example, the term "coupled" can be used to indicate that two or more components are in direct physical or electrical contact with one another. However, the term "connected" or "coupled" can also mean that two or more components are not in direct contact with one another, but nonetheless are in contact through intervening components. For example, "optical coupling," "wireless connection," and the like can be used. The embodiments disclosed herein are not necessarily limited to the specific applications described.

[0050] Furthermore, the technical features involved in each of the embodiments of the present application described below can be combined with each other as long as there is no conflict.

[0051] Embodiment 1:

[0052] In Embodiment 1, the present application provides an elastic solder, referring to Figure 1 , the elastic solder 1 has flexibility and deformability; the elastic solder 1 can maintain a flexible connection between the device to be soldered 2 and the substrate 3 during coupling, and after being melted during soldering, the elastic solder 1 can fill the gap between the device to be soldered 2 and the substrate 3 to solder the device to be soldered 2 on the substrate 3.

[0053] Common solder forms include solder paste, solder wire, solder ball, and solder film, etc. When soldering between the device to be soldered 2 and the substrate 3, the above-mentioned solder has problems such as easy occurrence of voids after soldering, low soldering efficiency, high requirement for soldering equipment, and high brittleness of the solder, which affect the coupling and soldering cost of the device to be soldered 2. The traditional soldering process has certain limitations in coupling precision and thermal stress control. The wave soldering process is prone to bridging or missed soldering when soldering high-density components, and has large thermal shock which affects the service life of the device to be soldered 2. The reflow soldering process needs to accurately control the temperature curve, and has high soldering cost. The laser soldering has slow soldering speed, etc.

[0054] In order to improve the coupling efficiency of the device to be soldered 2, the elastic solder 1 is designed. The elastic solder 1 is a solid with flexibility and deformability, and maintains a flexible connection between the device to be soldered 2 and the substrate 3 during coupling. The elastic solder 1 can elastically deform when compressed or stretched by the device to be soldered 2, and maintains the coupling position of the device to be soldered 2 unchanged.

[0055] In actual use, the elastic solder 1 can be designed and prepared according to the size of the device to be welded 2 and the specific application scenario. The elastic solder 1 should have a certain height and be able to fill the gap between the device to be welded 2 and the substrate 3 after coupling to connect the device to be welded 2 and the substrate 3. The melting point, strength and ductility of the elastic solder 1 should match the device to be welded 2. During the welding process, the elastic solder 1 melts into a liquid at the melting point, fills the gap between the device to be welded 2 and the substrate 3, and then solidifies at a low temperature to weld and fix the device to be welded 2 and the substrate 3 together.

[0056] Referring to Figures 2-5 , the elastic solder 1 can be stretched or compressed when deformed. The elastic solder 1 is in a folded state. Alternatively, the elastic solder 1 is in a folded state and has a porous structure.

[0057] Referring to Figure 2 and Figure 3 , in one embodiment, the elastic solder 1 includes a plurality of elastic sheets 12 connected together at a preset angle to form a folded state similar to an accordion bellows. The preset angle can be 20 degrees or 30 degrees, etc., which is determined according to actual conditions. Generally speaking, under the condition that the length, width and height of the elastic sheet 12 are constant, the smaller the preset angle, the smaller the distance between adjacent elastic sheets 12, and the larger the volume of the elastic solder 1 after melting. Therefore, the preset angle of the elastic solder 1 can be designed according to the size of the welding surface of the device to be welded 2 and the size of the gap between the device to be welded 2 and the substrate 3.

[0058] During the coupling process of the device to be welded 2, the folded elastic solder 1 can be stretched or compressed when deformed without affecting the coupling of the device to be welded 2. The smaller the preset angle of the elastic sheet 12, the greater the folding density of the elastic solder 1, and the smaller the deformation of stretching or compression under a certain acting force.

[0059] In order to strengthen the gas circulation during welding, holes 120 are provided on the elastic sheet 12, and the distribution area of the holes 120 can be set according to actual conditions. In actual use scenarios, if the elastic solder is formed by first compressing and folding the elastic sheet 12 according to the preset size and then making holes 120, the holes 120 are circular (see Figure 4 ); if the elastic solder is formed by first making holes 120 on the elastic sheet 12 and then compressing and folding according to the preset size, the holes 120 are elliptical (see Figure 5 ).

[0060] In one embodiment, in addition to the two pieces of the elastic sheet 12 on both sides of the elastic solder 1, the elastic sheet 12 is provided with a hole 120, and the gas flows between the elastic sheet 12 during welding; or, in addition to the two pieces of the elastic sheet 12 on both sides of the elastic solder 1, the elastic sheet 12 in the middle is provided with a hole 120 in a spaced manner, that is, the two adjacent elastic sheets 12 are provided with a hole 120 only on one of the elastic sheets 12, that is, the gas flows only between the two adjacent elastic sheets 12 during welding.

[0061] In one embodiment, continuing to refer to Figure 4 For example, the elastic sheets P3-P7, a predetermined size and number of holes 120 are arranged on each of the elastic sheets 12 according to the actual use scene, the elastic sheets 12 provided with the holes 120 are sequentially connected together to form the elastic solder 1, and no holes 120 are arranged on the two elastic sheets 12 arranged at the outermost side of the elastic solder 1 to reserve heat and improve the welding efficiency.

[0062] In one embodiment, continuing to refer to Figure 5 For example, the elastic sheets P3-P7, a predetermined size and number of holes 120 are arranged on a part of the elastic sheets 12 according to the actual use scene to form the elastic solder 1. For example, the elastic sheets 12 provided with the holes 120 and the complete elastic sheets 12 (without the holes 120) are sequentially connected together in a spaced manner, and no holes 120 are arranged on the two elastic sheets 12 arranged at the two sides of the elastic solder 1 to reserve heat and improve the welding efficiency.

[0063] It should be noted that the manufacturing method of the elastic solder in the embodiment is described based on the contents shown in Figure 4 and Figure 5 and is only for the convenience of describing the present application and does not require the present application to be constructed and operated in a specific number and size, and therefore should not be understood as a limitation on the present application.

[0064] Referring to Figure 6 and Figure 7 , for example, the high points where the elastic sheets 12 meet are the wave crests 123, and the low points where the elastic sheets 12 meet are the wave troughs 124, the elastic solder 1 is pre-welded on the substrate 3 by low temperature (in this process, the solder at the wave trough 124 is not completely melted), there is a first heating cavity 125 between the wave crest 123 and the substrate 3, the to-be-welded device 2 abuts against the wave crest 123, there is a second heating cavity 126 between the to-be-welded device 2 and the wave trough 124, and the holes 120 are arranged on the elastic sheets 12 to realize the conduction of heat between the first heating cavity 125 and the second heating cavity 126.

[0065] Referring to Figure 8, the substrate 3 is placed on the heating table 4, the heating table 4 releases heat, the heat is conducted to the elastic solder 1 through the substrate 3, due to the abutment of the wave trough 124 and the upper surface of the substrate 3, the wave trough 124 will melt earlier than the wave crest 123, causing the elastic sheet 12 to break, the elastic solder 1 cannot conduct heat to the device to be welded 2, and the elastic solder 1 is unevenly heated, affecting the welding quality.

[0066] Referring to Figure 9 , in order to make the elastic solder 1 uniformly heated, the heating strip 7 is arranged in the heating table 4, the upper surface of the heating strip 7 is flush with the upper surface of the heating table 4, the size of the heating strip 7 is selected according to the actual welding rate requirement, the heating table 4 and the heating strip 7 are arranged below the substrate 3, used for heating and melting the elastic solder 1 to enable it to fill the gap between the device to be welded 2 and the substrate 3, so as to fix the device to be welded 2 and the substrate 3 together.

[0067] In actual use, the heating strip 7 is aligned with the position of the wave crest 123 to apply local high temperature to the solder at the wave crest 123, so that the melting rate of the solder at the wave crest 123 and the solder at the wave trough 124 is consistent as much as possible.

[0068] In one embodiment, continuing to refer to Figure 9 , the size and number of the holes 120 are determined according to actual conditions, in general, the larger the size of the holes 120 and the more the number, the more heat is conducted between the first heating cavity 125 and the second heating cavity 126, and the faster the heat conduction rate. Since the wave crest 123 is located directly above the heating strip 7, the heating strip 7 conducts more heat to the wave crest 123 than to the wave trough 124, the temperature rising rate and the melting rate of the wave crest 123 and the wave trough 124 tend to be consistent, so that the elastic sheet 12 is not broken as much as possible during the heating process, to ensure the flexible contact between the device to be welded 2 and the substrate 3, realize the buffering effect, the heat is conducted from the first heating cavity 125 to the second heating cavity 126 through the holes 120, to ensure that the elastic solder 1 is uniformly heated.

[0069] Combined with Figure 4 and Figure 9In order to ensure that the melting rate of the elastic solder 1 at the edge and the middle part tends to be consistent during welding, the hole 120 includes a first hole 121 and a second hole 122, wherein the diameter of the first hole 121 is larger than the diameter of the second hole 122, the first hole 121 is distributed at the edge of the elastic sheet 12, and the second hole 122 is distributed at the middle part of the elastic sheet 12. In an embodiment, since the edge of the elastic solder 1 is in contact with the external cold air, the heat loss is faster during welding, so the first hole 121 is arranged at the edge of the elastic sheet 12, and the larger size of the first hole 121 can achieve a faster heat exchange rate, so that the heat at the edge can be conducted from the first heating cavity 125 to the second heating cavity 126 faster, facilitating the formation of a heat exchange channel and improving the uniformity of the temperature at the edge.

[0070] Since the heat loss at the edge is faster during welding, the temperature rising rate of the elastic solder 1 at the edge is lower in the same time, but the size of the first hole 121 is larger, and the volume of the elastic solder 1 at the edge is smaller compared with the middle part, that is, the volume of the elastic solder 1 at the edge is small but the temperature is low, and the volume of the elastic solder 1 at the middle part is larger but the temperature is higher, so that the melting rate of the elastic solder at the edge and the middle part of the elastic sheet 12 tends to be consistent in the same time, to optimize the welding quality.

[0071] In an embodiment, the elastic solder 1 is formed by compounding foam metal and elastic polymer.

[0072] The flexibility and deformability of the solder can be achieved by compounding foam metal and elastic polymer, the foam metal can be foam copper, foam nickel or foam silver, etc., in order to ensure the thermal conductivity of the solder, in the preferred solution, the foam metal is selected as foam copper; the elastic polymer can be polyurethane, silicone rubber or thermoplastic elastomer, etc., in order to achieve high ductility of the solder, in the preferred solution, the elastic polymer is selected as polyurethane. Further, in order to avoid damage to the chip in the device 2 to be welded due to overheating, the melting point of the elastic solder 1 formed by the foam metal and the elastic polymer should be as low as possible, and the foam metal should use a low melting point metal matrix such as indium-based, tin-based, etc., which can achieve low-temperature flexible connection and reduce thermal damage.

[0073] In an embodiment, the foam metal is a porous structure, and the elastic modulus is dynamically adjusted by compressing or releasing the pores. The foam metal has irregular pores, and when subjected to a force, the foam metal adjusts the porosity by compressing or releasing the pores, thereby dynamically adjusting the elastic modulus.

[0074] In an embodiment, different components of the metal matrix and the elastic regulation phase are selected according to the requirements to form the elastic solder 1. According to different application scenarios, the elasticity, strength and functionality of the elastic solder 1 can be controlled by selecting different metal matrices or adjusting the proportion of alloy and elastic polymer.

[0075] In the embodiment, the flexible connection between the device 2 to be welded and the substrate 3 can be maintained by the elastic solder 1 without affecting the coupling position, and the coupling precision is improved to a sub-micron level. In the welding process, the active coupling can be performed by applying power first, and then the heating operation of the elastic solder 1 is performed by turning off the power to melt the elastic solder 1 to realize the welding between the device 2 to be welded and the substrate 3. Since the chip is turned off during the heating process, the high temperature will not cause damage to the chip. In addition, the heat is transferred from the substrate 3 to the device 2 to be welded by the elastic solder 1 during the welding process, which can also reduce the impact of high temperature on the device 2 to be welded, thereby improving the yield.

[0076] In one specific application scenario, the aforementioned device 2 to be welded can be a transmitting component 21 or a receiving component 20, and the elastic solder 1 of the embodiment can be used to weld the transmitting component 21 on the substrate 3 or to weld the receiving component 20 on the substrate 3. The application of the elastic solder 1 in active high-precision welding is specifically described in Embodiments 2 and 3 below. Figure 11 and Figure 12

[0077] Embodiment 2:

[0078] In combination with Embodiment 1, the application provides a high-precision active coupling welding method, which comprises the following steps: placing the substrate 3 on the heating table 4, placing the elastic solder 1 in a preset welding area 30, and attaching a first component on the substrate 3; moving a second component by a multi-dimensional adjusting frame 5 to preliminarily align the second component with the elastic solder 1; applying power to the second component and the first component, dynamically adjusting the position and angle of the second component, so that the second component and the first component are precisely coupled; turning off the power supply of the second component and the first component, and heating the elastic solder 1 by the heating table 4 to melt the elastic solder 1 to fill the gap between the second component and the substrate 3.

[0079] In one embodiment, after the precise coupling between the second component and the first component is achieved, the elastic solder 1 is compressed so that the upper end of the elastic solder 1 is in contact with the second component.

[0080] In one embodiment, the elastic solder 1 absorbs the heat of the heating table 4 and transfers the heat to the second component.

[0081] In one embodiment, the method further comprises continuously adjusting the position and angle of the second component, and monitoring the optical power of the first component in real time until the received optical power is maximum.

[0082] ​In one embodiment, the method further comprises heating the elastic solder 1 in a nitrogen or inert gas atmosphere.

[0083] During the position and angle adjustment of the second component, the second component is flexibly connected with the substrate 3 through the elastic solder 1.

[0084] In actual application scenarios, the first component can be a receiving component 20, and correspondingly, the second component can be a transmitting component 21; or, the first component can be a transmitting component 21, and correspondingly, the second component can be a receiving component 20. The following will be specifically described based on the following embodiments 3 and 4.

[0085] Embodiment 3:

[0086] Based on the foregoing embodiment 1, refer to Figures 10-12 Taking the first component as a receiving component 20 and the second component as a transmitting component 21 as an example, the embodiment 2 of the present application provides a high-precision active coupling welding method, which comprises:

[0087] Step 101: Place the substrate 3 on the heating table 4, and place the elastic solder 1 described in embodiment 1 on the preset welding area 30, wherein the substrate 3 is attached with a receiving component 20.

[0088] According to the tolerance temperature of the to-be-welded transmitting component 21, the metal matrix, the composite ratio, etc. of the elastic solder 1 are selected, and according to the size of the to-be-welded transmitting component 21, the size, the folding mode, the folding density, etc. of the elastic solder 1 are designed, and the elastic solder 1 is prepared based on the above-mentioned related parameters.

[0089] It should be noted that the elastic solder 1 is placed and welded on the preset welding area 30, specifically, the low-temperature welding technology is used to pre-weld the elastic solder 1 on the preset welding area 30, and during the welding process, it should be ensured that the solder at the wave trough 124 is not completely melted, and the elastic solder 1 is complete without rupture.

[0090] Step 102: Move the transmitting component 21 through the multi-dimensional adjusting frame 5 to preliminarily align the transmitting component 21 with the elastic solder 1.

[0091] In combination with Figure 8 The multi-dimensional adjusting frame 5 is provided with a six-axis module 50, and a suction nozzle 51 is arranged below the z-axis of the six-axis module 50, and the suction nozzle 51 is used to fix the transmitting component 21 on the multi-dimensional adjusting frame 5.

[0092] Step 103: Power on the transmitting component 21 and the receiving component 20, dynamically adjust the position and angle of the transmitting component 21, so that the transmitting component 21 and the receiving component 20 are accurately coupled.

[0093] After power is applied, the optical power monitoring system can determine the coupling efficiency by the magnitude of the optical power, and the multi-dimensional adjustment frame 5 adjusts the position and angle of the transmitting component 21 according to the feedback of the relative position deviation.

[0094] Step 104: Disconnect the power supply to the transmitting component 21 and the receiving component 20, and heat the elastic solder 1 through the heating stage 4 so that the elastic solder 1 melts and fills the gap between the transmitting component 21 and the substrate 3.

[0095] After ensuring the gap is completely filled, turn off the heating stage 4 to allow the elastic solder 1 to cool down and revert from a liquid to a solid state, completing the welding and fixing process. After welding, perform an optical power test on the welded transmitting component 21 to ensure it meets design requirements.

[0096] In this embodiment of the invention, a receiving component 20 is disposed on a substrate 3. It is necessary to weld a transmitting component 21 onto the substrate 3, ensuring that the coupling efficiency between the transmitting component 21 and the receiving component 20 meets the requirements. Specifically, the transmitting component 21 is a light transmitting component 21, and the receiving component 20 is a light receiving component 20.

[0097] It should be noted that in this embodiment, the receiving component 20 is pre-welded onto the substrate 3, and then the positional relationship of the transmitting component 21 relative to the substrate 3 is adjusted to indirectly adjust the relative positional relationship between the transmitting component 21 and the receiving component 20, thereby achieving high-efficiency coupling.

[0098] In step 101, see Figure 11 The transmitting component 21 is moved above the substrate 3, and the elastic solder 1 is disposed between the substrate 3 and the transmitting component 21. (See reference...) Figure 12 The substrate 3 has a preset welding area 30 on its upper surface for welding the transmitting component 21. The elastic solder 1 is placed in the preset welding area 30. A receiving component 20 is provided on one side of the preset welding area 30. The receiving component 20 is attached to the upper surface of the substrate 3. Before coupling, a preset distance is provided between the substrate 3 and the transmitting component 21. The preset distance is greater than the height of the elastic solder 1.

[0099] In step 102, see Figure 13The transmission assembly 21 can be moved by the multi-dimensional adjusting frame 5, which is provided with a six-axis module 50. The six-axis module 50 is used to accurately adjust the position of the transmission assembly 21 from six dimensions, and the six-axis module 50 is provided with a suction nozzle 51, which provides suction force to firmly fix the transmission assembly 21 on the multi-dimensional adjusting frame 5. After the elastic solder 1 is placed in the preset welding area 30, the transmission assembly 21 and the elastic solder 1 are substantially aligned. It should be noted that the substantially alignment here refers to that the transmission assembly 21 is only aligned in terms of the degree of physical position, and the transmission assembly 21 is substantially aligned with the preset welding area 30.

[0100] In actual use scenarios, the six-axis module 50 can be a combination structure of a linear motor and a lead screw, a six-axis manipulator, or a magnetic levitation platform. In order to achieve sub-micron alignment, the six-axis module 50 is selected to be a combination structure of a linear motor and a lead screw, which can achieve precise positioning and balance speed and accuracy.

[0101] In actual application scenarios, the transmission assembly 21 is used to transmit optical signals, the receiving assembly 20 is connected with an optical power monitoring system, the receiving assembly 20 is used to receive optical power signals, and the optical power monitoring system is used to monitor real-time optical power to determine the alignment state, so as to achieve high-precision coupling of the transmission assembly 21 and the receiving assembly 20.

[0102] In step 103, after the basic alignment is completed, the transmission assembly 21 and the receiving assembly 20 need to be powered on. The position of the transmission assembly 21 is adjusted by monitoring the optical power signal. In this embodiment, the transmission assembly 21 transmits optical signals, the receiving assembly 20 can collect optical power signals in real time, the optical power monitoring system is started to monitor real-time optical power, and the relative positions of the transmission assembly 21 and the receiving assembly 20 are dynamically adjusted by the multi-dimensional adjusting frame 5, so that the transmission assembly 21 and the receiving assembly 20 are aligned.

[0103] Referring to Figure 14, the conventional welding process uses ordinary solder 6, in order to ensure that the transmitting assembly 21 can be smoothly welded on the substrate 3 before coupling, the volume of the required ordinary solder and the preset height of the transmitting assembly are obtained by theoretical calculation, the transmitting assembly 21 and the receiving assembly are aligned by machine vision, and the coupling is completed. After the transmitting assembly 21 and the receiving assembly 20 are coupled, in order to weld the transmitting assembly 21 and the substrate 3 together, the transmitting assembly 21 needs to be in contact with the ordinary solder 6 during the welding process. Since the ordinary solder 6 is not easy to deform, the ordinary solder 6 exerts force on the transmitting assembly 21 when in contact, resulting in changes in the locked position and angle, and it is difficult to meet the coupling accuracy requirement of sub-micron level.

[0104] In step 104, referring to Figure 15 , after the transmitting assembly 21 and the receiving assembly 20 are coupled, the transmitting assembly 21 and the receiving assembly 20 are powered off, the heating table 4 is used to heat the substrate 3, the elastic solder 1 is in contact with the substrate 3, the substrate 3 transmits heat to the elastic solder 1 so that the elastic solder 1 melts, and after the elastic solder 1 melts, it changes from solid state to liquid state, filling the gap between the transmitting assembly 21 and the substrate 3.

[0105] In one embodiment, the method further comprises continuously adjusting the position and angle of the transmitting assembly 21 and monitoring the optical power of the receiving assembly 20 in real time until the received optical power is maximum, so as to achieve precise coupling. At this time, the transmitting assembly 21 is at the final adjusted position, and the multi-dimensional adjustment frame 5 is fixed to fix the transmitting assembly 21 at the final adjusted position.

[0106] In this embodiment, during the coupling of the transmitting assembly 21 and the receiving assembly 20, the receiving assembly 20 is fixed on the substrate 3, and the relative positions of the two are kept consistent, and during the dynamic alignment of the transmitting assembly 21 and the receiving assembly 20, the position and angle of the receiving assembly 20 remain unchanged; through the multi-dimensional adjustment frame 5, the transmitting assembly 21 can realize six-dimensional adjustment of X-axis, Y-axis, Z-axis, θX-axis, θY-axis and θZ-axis, and achieve sub-micron level dynamic alignment.

[0107] During dynamic alignment, the real-time optical power of the receiving assembly 20 is constantly changing, by comparing the difference between the transmitting optical signal and the received optical power signal, the receiving assembly 20 can feedback the position and angle deviation, the multi-dimensional adjustment frame 5 can adjust the position and angle of the transmitting assembly 21 according to the feedback real-time deviation, until the optical power received by the receiving assembly 20 reaches the maximum value, at this time, the position and angle of the transmitting assembly 21 are locked, and the dynamic alignment is completed.

[0108] In order to avoid damage to the transmitting component 21 during dynamic coupling, the transmitting component 21 is flexibly connected with the substrate 3 through the elastic solder 1 during adjustment of the position and angle of the transmitting component 21, the elastic solder 1 can be compressed with the change of the position of the transmitting component 21, and the elastic solder 1 does not cause damage to the transmitting component 21.

[0109] It is to be noted that a preliminary theoretical calculation is performed on the position of the transmitting component 21 before welding, and the elastic solder 1 is designed according to the theoretical calculation to ensure that the elastic solder 1 can fill the gap between the transmitting component 21 and the receiving component 20 after melting. Specifically, after achieving accurate coupling between the transmitting component 21 and the receiving component 20, the elastic solder 1 is compressed, so that the upper end of the elastic solder 1 is in contact with the transmitting component 21.

[0110] The elastic solder 1 is provided above the transmitting component 21, and there is a gap between the transmitting component 21 and the elastic solder 1 before dynamic alignment. During dynamic alignment, the transmitting component 21 moves downward, and the distance between the transmitting component 21 and the elastic solder 1 gradually decreases. Since the elastic solder 1 has deformability, when the transmitting component 21 and the upper end of the elastic solder 1 are in contact, the elastic solder 1 is compressed and elastically deformed, so that the transmitting component 21 and the substrate 3 are flexibly connected.

[0111] The elastic solder 1 includes a plurality of elastic sheets 12 connected together at preset angles. In addition to the two elastic sheets 12 located on both sides of the elastic solder 1, holes 120 are provided on the elastic sheets 12. The high points of the elastic sheets 12 are wave crests 123, and the low points of the elastic sheets 12 are wave troughs 124. The wave crests 123 and the substrate 3 have a first heating cavity 125, and the wave troughs 124 and the device to be welded 2 have a second heating cavity 126. The holes 120 can realize heat conduction between the first heating cavity 125 and the second heating cavity 126.

[0112] In order to ensure that the melting rate of the elastic solder 1 at the edge and the middle tends to be consistent during welding, the holes 120 include first holes 121 and second holes 122, wherein the diameter of the first holes 121 is greater than the diameter of the second holes 122, the first holes 121 are distributed at the edge of the elastic sheet 12, and the second holes 122 are distributed at the middle of the elastic sheet 12.

[0113] In one embodiment, due to the edge of the elastic solder 1 being in contact with the external cold air, the heat loss is faster during welding, the temperature rising rate of the elastic solder 1 at the edge is lower in the same time, but the size of the first hole 121 is larger, and the volume of the elastic solder 1 at the edge is smaller compared with the middle part, that is, the volume of the elastic solder 1 at the edge is small but the temperature is low, and the volume of the elastic solder 1 in the middle part is larger but the temperature is higher, so that the melting rate of the elastic solder at the edge and in the middle part of the elastic sheet 12 tends to be consistent in the same time, so as to optimize the welding quality; and the first hole 121 with larger size can realize faster heat exchange rate, so that the heat at the edge can be conducted from the first heating cavity 125 to the second heating cavity 126 faster, so as to facilitate the formation of the heat exchange channel and improve the uniformity of the temperature at the edge.

[0114] In addition, since the upper end of the elastic solder 1 is in contact with the emitting assembly 21, the elastic solder 1 absorbs the heat of the heating table 4 and transmits the heat to the emitting assembly 21; the heating strip 7 is arranged at a preset position in the heating table 4, so that the elastic solder 1 is uniformly heated.

[0115] In the process of welding the emitting assembly 21 and the substrate 3, the conventional welding process usually adopts the method of pre-plating ordinary solder 6 on the emitting assembly 21 or the substrate 3, in order to enable the heat of the substrate 3 to be transmitted to the emitting assembly 21, the emitting assembly 21 is lowered until it is in contact with the solder, since the ductility of the ordinary solder 6 is low, it is not easy to deform, and the contact between the emitting assembly 21 and the solder is hard, in this process, the position and angle of the emitting assembly 21 may change due to stress, and it is difficult to achieve sub-micron level alignment accuracy, resulting in low coupling efficiency of the emitting assembly 21.

[0116] In order to improve the coupling efficiency of the emitting assembly 21, the elastic solder 1 is used to weld the emitting assembly 21, the upper end of the elastic solder 1 is in contact with the emitting assembly 21, and the contact point is the wave crest 123; the lower end is in contact with the substrate 3, and the contact point is the wave trough 124. The heating table 4 is arranged below the substrate 3, and the heating strip 7 is arranged at a preset position of the heating table 4, wherein the preset position is directly below the wave crest 123 (as shown in Figure 15 The heating strip 7 conducts more heat to the wave crest 123 than to the wave trough 124, and the temperature rising rate and the melting rate of the wave crest 123 and the wave trough 124 tend to be consistent, so that the elastic sheet 12 is not broken as much as possible during the heating process, the elastic solder 1 can transmit heat from the substrate 3 to the emitting assembly 21, so that the emitting assembly 21 and the substrate 3 are welded together, further, since the elastic solder 1 has flexibility and deformability, the deformation of the elastic solder 1 caused by compression is elastic deformation, and the position and angle of the emitting assembly 21 remain unchanged.

[0117] The method further comprises heating the elastic solder 1 in a nitrogen or inert gas atmosphere. After the coupling is completed, the power supply of the transmitting component 21 and the receiving component 20 is disconnected, a nitrogen or inert gas atmosphere is applied to the preset welding area 30 to ensure that the solder is not oxidized and the welding quality is improved. The heating table 4 is started, and heat is transmitted from the heating table 4 to the elastic solder 1 in sequence, the elastic solder 1 is continuously heated until the temperature reaches the melting point of the elastic solder 1, and the elastic solder 1 melts into a liquid state and fills the gap between the transmitting component 21 and the substrate 3.

[0118] Embodiment 4:

[0119] Based on the foregoing embodiment 1, the first component is taken as the transmitting component 21 and the second component is taken as the receiving component 20 as an example for specific description. In the embodiment of the application, the transmitting component 21 is arranged on the substrate 3, and now the receiving component 20 needs to be welded on the substrate 3, and the coupling efficiency between the transmitting component 21 and the receiving component 20 needs to meet the requirements. Among them, the transmitting component 21 is specifically a light transmitting component, and the receiving component 20 is specifically a light receiving component. That is, referring to Figure 13 , the device adsorbed by the suction nozzle 51 is changed from the transmitting component 21 to the receiving component 20.

[0120] It should be noted that in this embodiment, the transmitting component 21 is pre-welded on the substrate 3, and then the positional relationship of the receiving component 20 relative to the substrate 3 is adjusted to indirectly adjust the relative positional relationship between the transmitting component 21 and the receiving component 20, so as to realize high-efficiency coupling.

[0121] The receiving component 20 is moved above the substrate 3, the elastic solder 1 is arranged between the substrate 3 and the receiving component 20, the upper surface of the substrate 3 is provided with a preset welding area 30 for welding the receiving component 20 (wherein although the same reference numerals are used in Figure 12 , but it does not mean that the preset welding area is just in the position shown in Figure 12 , but refers to the area where the receiving component 20 should be welded), the elastic solder 1 is placed on the preset welding area 30, and a preset distance is arranged between the substrate 3 and the receiving component 20 before coupling, and the preset distance is greater than the height of the elastic solder 1.

[0122] In one embodiment, the receiving component 20 can be moved by the multi-dimensional adjusting frame 5, which is provided with a six-axis module 50. The six-axis module 50 is provided with a suction nozzle 51, which provides suction force for firmly fixing the receiving component 20 on the multi-dimensional adjusting frame 5. After the elastic solder 1 is placed on the preset welding area 30, the receiving component 20 and the elastic solder 1 are substantially aligned. It should be noted that the substantial alignment here refers to that the receiving component 20 is located above the elastic solder 1 and is substantially aligned with the preset welding area 30 only in terms of the degree of physical position alignment.

[0123] After the substantial alignment is completed, the transmitting component 21 and the receiving component 20 need to be powered on. The position of the receiving component 20 is adjusted by monitoring the optical power signal. In this embodiment, the transmitting component 21 emits an optical signal, and the receiving component 20 can collect the optical power signal in real time. The optical power monitoring system is started to monitor the real-time optical power. The relative positions of the transmitting component 21 and the receiving component 20 are dynamically adjusted by the multi-dimensional adjusting frame 5, so that the transmitting component 21 and the receiving component 20 are aligned.

[0124] In this embodiment, after the coupling of the transmitting component 21 and the receiving component 20 is completed, the transmitting component 21 and the receiving component 20 are powered off. The heating table 4 is used to heat the substrate 3. The substrate 3 transmits heat to the elastic solder 1 so that the elastic solder 1 melts. After the elastic solder 1 melts, the gap between the receiving component 20 and the substrate 3 is filled.

[0125] In this embodiment, the position and angle of the receiving component 20 are continuously adjusted, and the optical power of the receiving component 20 is monitored in real time until the received optical power is maximum. At this time, the receiving component 20 is in the final adjusted position. The multi-dimensional adjusting frame 5 is fixed to fix the receiving component 20 in the final adjusted position.

[0126] In this embodiment, during the coupling of the transmitting component 21 and the receiving component 20, the transmitting component 21 is fixed on the substrate 3, and the relative positions of the two are consistent. During the dynamic alignment of the transmitting component 21 and the receiving component 20, the position and angle of the transmitting component 21 are unchanged. Through the multi-dimensional adjusting frame 5, the receiving component 20 can realize six-dimensional adjustment of X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis, and achieve sub-micron dynamic alignment.

[0127] In the dynamic alignment process, the real-time light power of the receiving component 20 is constantly changing. By comparing the difference between the emitted light signal and the received light power signal, the receiving component 20 can feedback the position and angle deviation. The multi-dimensional adjusting frame 5 can adjust the position and angle of the receiving component 20 according to the feedback real-time deviation until the light power received by the receiving component 20 reaches the maximum value. At this time, the position and angle of the receiving component 20 are locked, and the dynamic alignment is completed.

[0128] In order to avoid damage to the receiving component 20 during dynamic coupling, the receiving component 20 is flexibly connected to the substrate 3 through the elastic solder 1 during the adjustment of the position and angle of the receiving component 20. The elastic solder 1 can be compressed with the change of the position of the receiving component 20, and the elastic solder 1 will not cause damage to the receiving component 20.

[0129] It should be noted that a preliminary theoretical calculation is performed on the position of the receiving component 20 before welding. The elastic solder 1 is designed according to the theoretical calculation to ensure that the elastic solder 1 can fill the gap between the transmitting component 21 and the receiving component 20 after melting. Specifically, after achieving accurate coupling between the transmitting component 21 and the receiving component 20, the elastic solder 1 is compressed so that the upper end of the elastic solder 1 is in contact with the receiving component 20.

[0130] Further, since the elastic solder 1 has flexibility and deformability, the deformation of the elastic solder 1 caused by compression is elastic deformation, and the position and angle of the receiving component 20 remain unchanged.

[0131] For the gas atmosphere during welding of the embodiment of the present application, the operation is consistent with that described in Embodiment 2, which will not be repeated here.

[0132] It should be noted that the elastic solder and the high-precision active coupling welding method provided by the embodiment of the present application can be applied to components with one pad and components with multiple pads. When the device to be welded is multiple pads, one pad corresponds to one elastic solder, and there is a solder resist layer between the welding areas corresponding to different pads, and combined with the existing welding technology, short circuit can be avoided.

[0133] The above only describes the preferred embodiments of the present application and does not limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An elastic solder, characterized by, The elastic solder (1) has flexibility and deformation ability, and comprises a plurality of elastic sheets (12) connected together at preset angles, and a hole (120) is arranged on each of the elastic sheets (12) except the two elastic sheets (12) at two sides of the elastic solder (1). The elastic solder (1) can keep flexible connection between the device (2) to be soldered and the substrate (3) during coupling, and can fill the gap between the device (2) to be soldered and the substrate (3) after being melted during soldering, so as to solder the device (2) to be soldered on the substrate (3).

2. The elastic solder of claim 1, wherein, The elastic solder (1) can be stretched or compressed when deformed. The elastic solder (1) is in a folded state, or the elastic solder (1) is in a folded state and has a porous structure.

3. The elastic solder of claim 1, wherein, The hole (120) comprises a first hole (121) and a second hole (122), the diameter of the first hole (121) is greater than the diameter of the second hole (122), the first hole (121) is distributed on the edge of the elastic sheet (12), and the second hole (122) is distributed on the middle part of the elastic sheet (12).

4. A high-precision active coupling welding method, characterized by, Comprise: The substrate (3) is arranged on the heating table (4), and the elastic solder (1) according to any one of claims 1-3 is placed in a preset soldering area (30), wherein the substrate (3) is attached with a first component; The second component is moved through the multi-dimensional adjusting frame (5) to preliminarily align the second component with the elastic solder (1); The second component and the first component are powered on, and the position and angle of the second component are dynamically adjusted, so that the second component and the first component are accurately coupled; The power supply of the second component and the first component is disconnected, and the elastic solder (1) is heated through the heating table (4), so that the elastic solder (1) is melted to fill the gap between the second component and the substrate (3).

5. The high-precision active coupling welding method according to claim 4, characterized in that, After the accurate coupling between the second component and the first component is realized, the elastic solder (1) is compressed, so that the upper end of the elastic solder (1) is in contact with the second component.

6. The high-precision active coupling welding method according to claim 5, characterized in that, The elastic solder (1) absorbs the heat of the heating table (4) and transmits the heat to the second component; The heating strip (7) is arranged at a preset position in the heating table (4), so that the elastic solder (1) is uniformly heated.

7. The high-precision active coupling welding method of claim 6, wherein, The method further comprises: The high point of the elastic sheet (12) is a wave crest (123), and the low point of the elastic sheet (12) is a wave trough (124), a first heating cavity (125) is arranged between the wave crest (123) and the substrate (3), and a second heating cavity (126) is arranged between the device (2) to be soldered and the wave trough (124); the heating strip (7) corresponds to the wave crest (123); The hole (120) can realize heat conduction between the first heating cavity (125) and the second heating cavity (126).

8. The high-precision active coupling welding method of claim 4, wherein, The method further comprises: The elastic solder (1) is heated in a nitrogen or inert gas atmosphere.

9. The method of claim 4, wherein, During the adjustment of the position and angle of the second component, the second component is flexibly connected to the substrate (3) by the elastic solder (1).

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