A fluid heat sink and method of making the same

Abstract

The application discloses a fluid heat dissipation device and a preparation method thereof. The fluid heat dissipation device comprises a heat dissipation unit and a heat source unit. The heat dissipation unit comprises an encapsulation shell and an adjusting part. The encapsulation shell comprises a first encapsulation part, a second encapsulation part and a third encapsulation part. The third encapsulation part comprises a fluid inlet, and the second encapsulation part comprises a fluid outlet. The adjusting part comprises a supporting column, a first diaphragm, a connecting part and a second diaphragm. The first encapsulation part comprises a first substructure, a second substructure and a third substructure. The supporting column, the first substructure, the second substructure and the first diaphragm enclose a first cavity. The first diaphragm, the connecting part and the second diaphragm enclose a second cavity. The second diaphragm, the third substructure, the second encapsulation part and the third encapsulation part enclose a third cavity. The second diaphragm comprises a sub-outlet. The volume of the second cavity is different under different working conditions. By changing and adjusting the volume of the second cavity, the overall heat dissipation effect is improved.

Description

Technical Field

[0001] This invention relates to the technical field of electronic devices, and more particularly to a fluid heat dissipation device and its preparation method. Background Technology

[0002] With the rapid adoption of artificial intelligence in consumer electronics, products such as mobile phones, augmented reality glasses, and action cameras are integrating high-performance chips for complex tasks like image recognition, voice interaction, and real-time rendering. However, chips generate a significant amount of heat during high-performance operation. If this heat cannot be dissipated in time, it will lead to overheating, causing performance degradation, response delays, and even system crashes. For consumer electronics, heat dissipation is a particularly critical issue. Summary of the Invention

[0003] This invention provides a fluid heat dissipation device and its preparation method. The heat dissipation unit has multiple cavity structures in the adjustment section. By changing the volume of the second cavity, the overall heat dissipation effect is improved.

[0004] In a first aspect, embodiments of the present invention provide a fluid heat dissipation device, including a heat dissipation unit and a heat source unit, wherein the heat dissipation unit is located on one side of the heat source unit; The heat dissipation unit includes an encapsulated housing and an adjustment section; The encapsulation housing includes a first encapsulation portion, a second encapsulation portion, and a third encapsulation portion; the first encapsulation portion and the second encapsulation portion extend along a first direction, and the third encapsulation portion extends along a second direction connecting the second encapsulation portion and the first encapsulation portion; the cavity formed by the first encapsulation portion, the second encapsulation portion, and the third encapsulation portion houses the adjustment portion; the third encapsulation portion includes a fluid inlet, and the second encapsulation portion includes a fluid outlet; The adjustment section includes a support column, a first diaphragm, a connecting portion, and a second diaphragm; the first encapsulation section includes a first substructure, a second substructure, and a third substructure; along the second direction, the first substructure overlaps with the support column, the second substructure is located on the side of the first substructure closer to the center of the heat dissipation unit, and the third substructure is located on the side of the first substructure away from the center of the heat dissipation unit. The first diaphragm is located on the side of the support post away from the first packaging portion, and the support post, the first substructure, the second substructure, and the first diaphragm form a first cavity; the connecting portion is located on the side of the first diaphragm away from the support post, and the second diaphragm is located on the side of the connecting portion away from the first diaphragm, and the first diaphragm, the connecting portion, and the second diaphragm form a second cavity; the second diaphragm, the third substructure, the second packaging portion, and the third packaging portion form a third cavity; the second diaphragm includes a sub-outlet, and along the second direction, the sub-outlet does not overlap with the support post; The volume of the second cavity varies under different operating conditions of the fluid cooling device; the first direction and the second direction intersect.

[0005] Optionally, the second substructure also includes a differential pressure balancing orifice.

[0006] Optionally, the first diaphragm includes a first point and a second point, the first point being located on the side of the second point away from the center of the heat dissipation unit, and the first point overlapping the support column along the second direction; The second diaphragm includes a third point and a fourth point, the third point being located on the side of the fourth point away from the center of the heat dissipation unit, and along the second direction, the third point overlaps with the support column; Along the second direction, the first point overlaps with the third point, and the second point overlaps with the fourth point; along the second direction, the distance between the first point and the third point is L1, and the distance between the second point and the fourth point is L2; The fluid cooling device includes a first working state and a second working state; In the first working state, L1 < L2, and in the second working state, L1 > L2; the volume of the second cavity in the first working state is greater than the volume of the second cavity in the second working state.

[0007] Optionally, the adjustment section includes multiple piezoelectric layer structures, each piezoelectric layer structure including a first electrode layer, a piezoelectric layer, and a second electrode layer, wherein along the second direction, the first electrode layer and the second electrode layer are located on both sides of the piezoelectric layer; The first diaphragm includes a first substrate, and the piezoelectric layer structure is located on at least one side of the first substrate; the second diaphragm includes a second substrate, and the piezoelectric layer structure is located on at least one side of the second substrate; along the second direction, the piezoelectric layer structure does not overlap with the sub-outlet.

[0008] Optionally, the adjustment section includes an electrode sub-diaphragm, which does not overlap with the sub-outlet along the second direction; The first diaphragm includes a first piezoelectric layer and multiple layers of the electrode sub-diaphragms, with a layer of the first piezoelectric layer disposed between two adjacent layers of the electrode sub-diaphragms along the second direction; The second diaphragm includes a second piezoelectric layer, and along the second direction, a second piezoelectric layer is disposed between two adjacent electrode sub-diaphragms.

[0009] Optionally, the fluid cooling device may further include a circuit board; The heat dissipation unit and the heat source unit are disposed on the same side of the circuit board, and along the first direction, the heat dissipation unit is located on one side of the heat source unit; the first package portion of the heat dissipation unit is electrically connected to the circuit board through a first connection point, and the heat source unit is electrically connected to the circuit board through a second connection point; Alternatively, the heat dissipation unit and the heat source unit can be located on the same side of the circuit board, with the heat dissipation unit located on the side of the heat source unit away from the circuit board; the first package portion of the heat dissipation unit is electrically connected to the circuit board via a first connecting line, and the heat source unit is electrically connected to the circuit board via the third connecting point.

[0010] In a second aspect, embodiments of the present invention provide a method for preparing a fluid heat dissipation device, used to prepare the fluid heat dissipation device according to any one of the first aspects; the preparation method includes: A support layer is provided, and a first diaphragm, a connector, and a second diaphragm are fabricated on the support layer; the second diaphragm includes a sub-outlet. The support layer is etched and a support pillar is fabricated; along the second direction, the sub-outlet does not overlap with the support pillar; the first direction and the second direction intersect. A heat dissipation unit is formed by fabricating a packaging shell; the packaging shell includes a first packaging portion, a second packaging portion, and a third packaging portion; the first packaging portion and the second packaging portion extend along a first direction, and the third packaging portion extends along a second direction, connecting the second packaging portion and the first packaging portion; the cavity formed by the first packaging portion, the second packaging portion, and the third packaging portion houses the adjustment portion; the third packaging portion includes a fluid inlet, and the second packaging portion includes a fluid outlet; the first packaging portion includes a first substructure, a second substructure, and a third substructure; along the second direction, the first substructure overlaps with the support column, and the second substructure is located near the first substructure. On one side of the center of the heat dissipation unit, the third substructure is located on the side of the first substructure away from the center of the heat dissipation unit; the first diaphragm is located on the side of the support pillar away from the first encapsulation portion, and the support pillar, the first substructure, the second substructure, and the first diaphragm form a first cavity; the connecting portion is located on the side of the first diaphragm away from the support pillar, and the second diaphragm is located on the side of the connecting portion away from the first diaphragm, and the first diaphragm, the connecting portion, and the second diaphragm form a second cavity; the second diaphragm, the third substructure, the second encapsulation portion, and the third encapsulation portion form a third cavity; the volume of the second cavity varies under different operating conditions of the fluid heat dissipation device; The heat dissipation unit is positioned on one side of the heat source unit.

[0011] Optionally, providing a support layer and fabricating a first membrane, a connector, and a second membrane on the support layer includes: Provide a support layer; A first membrane is prepared on one side of the support layer; A connecting membrane layer is prepared on the side of the first diaphragm away from the support layer; The connection layer is etched to form the connection portion; A first sacrificial structure is filled in, the distance between the surface of the first sacrificial structure away from the support layer and the support layer is a1, and the distance between the surface of the connecting portion away from the support layer and the support layer is a2, wherein |a1-a2| / a2≤20%; A second membrane is prepared on the side of the first sacrificial structure and the connecting portion away from the first membrane; The second membrane is etched to form multiple sub-outlets; The first sacrificial structure is removed through the sub-exit.

[0012] Optionally, providing a support layer and fabricating a first membrane, a connector, and a second membrane on the support layer includes: Provide a support layer; A first membrane is prepared on one side of the support layer; A first connecting membrane layer is prepared on the side of the first diaphragm away from the support layer; The first connection layer is etched to form the first connection portion; A second sacrificial structure is filled in, the surface of the second sacrificial structure away from the support layer is at a distance b1 from the support layer, and the surface of the first connecting portion away from the support layer is at a distance b2 from the support layer, wherein |b1-b2| / b2≤20%; Provide a sacrificial support layer; A second membrane is prepared on one side of the sacrificial support layer; The second membrane is etched to form multiple sub-outlets; A second connecting membrane layer is prepared on the side of the second diaphragm away from the sacrificial support layer; The second connection layer is etched to form the second connection portion; A third sacrificial structure is filled in, wherein the distance between the surface of the third sacrificial structure away from the sacrificial support layer and the sacrificial support layer is c1, and the distance between the surface of the second connecting portion away from the sacrificial support layer and the sacrificial support layer is c2, wherein |c1-c2| / c2≤20%; The first connecting portion and the second connecting portion are bonded together to form the connecting portion; Strip the sacrificial support layer; The second sacrificial structure and the third sacrificial structure are removed through the sub-outlet.

[0013] Optionally, the fluid cooling device may further include a circuit board; Placing the heat dissipation unit on one side of the heat source unit includes: The heat dissipation unit and the heat source unit are disposed on the same side of the circuit board, and along the first direction, the heat dissipation unit is located on one side of the heat source unit; the first package portion of the heat dissipation unit is electrically connected to the circuit board through a first connection point, and the heat source unit is electrically connected to the circuit board through a second connection point; Alternatively, the heat dissipation unit and the heat source unit can be located on the same side of the circuit board, with the heat dissipation unit located on the side of the heat source unit away from the circuit board; the first package portion of the heat dissipation unit is electrically connected to the circuit board via a first connecting line, and the heat source unit is electrically connected to the circuit board via the third connecting point.

[0014] This invention provides a fluid heat dissipation device, wherein a heat dissipation unit is disposed within an encapsulation shell, and the adjustment portion of the heat dissipation unit includes a support column, a first diaphragm, a connecting portion, and a second diaphragm. Furthermore, the heat dissipation unit is divided into multiple cavity structures, namely a first cavity, a second cavity, and a third cavity, in conjunction with the encapsulation shell. By adjusting the relative positions of the first and second diaphragms, the volume of the second cavity can be dynamically changed, thereby adjusting the flow rate or volume of the fluid medium ejected from the heat dissipation unit, thus achieving heat dissipation adjustment of the heat source unit and improving the overall heat dissipation effect. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of the first fluid heat dissipation device provided in the embodiment of the present invention; Figure 2 yes Figure 1 A schematic diagram of the first operating state of the provided fluid cooling device; Figure 3 yes Figure 1 A schematic diagram of the second operating state of the provided fluid cooling device; Figure 4 This is an enlarged view of the structure of a first diaphragm and a second diaphragm provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of the structure of the second type of fluid heat dissipation device provided in the embodiments of the present invention; Figure 6 yes Figure 5 A schematic diagram of the first operating state of the provided fluid cooling device; Figure 7 yes Figure 5 A schematic diagram of the second operating state of the provided fluid cooling device; Figure 8 This is an enlarged view of the structure of another first diaphragm and second diaphragm provided in an embodiment of the present invention; Figure 9 This is a schematic diagram of the structure of the third type of fluid heat dissipation device provided in the embodiments of the present invention; Figure 10 This is a schematic diagram of the structure of the fourth fluid heat dissipation device provided in the embodiments of the present invention; Figure 11This is a schematic diagram of the preparation method of the first fluid heat dissipation device provided in the embodiment of the present invention; Figure 12 This is a schematic diagram of the preparation method of the second fluid heat dissipation device provided in the embodiment of the present invention; Figure 13 This is a process diagram of the preparation method of the first fluid heat dissipation device provided in the embodiments of the present invention; Figure 14 This is a schematic diagram of the preparation method of the third fluid heat dissipation device provided in the embodiments of the present invention; Figure 15a This is a process diagram of the first part of the preparation method of the second type of fluid heat dissipation device provided in the embodiments of the present invention; Figure 15b This is a process diagram of the second part of the preparation method of the second type of fluid heat dissipation device provided in the embodiments of the present invention. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be fully described below with reference to the accompanying drawings in the embodiments of this invention, through specific implementation methods. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort fall within the protection scope of this invention.

[0018] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a system, product, or device comprising a series of units is not necessarily limited to those steps or units explicitly listed, but may include other units not explicitly listed or inherent to such products or devices.

[0019] Figure 1 This is a schematic diagram of the structure of the first fluid heat dissipation device provided in the embodiment of the present invention. Figure 2 yes Figure 1 A schematic diagram of the first operating state of the provided fluid cooling device. Figure 3 yes Figure 1 A schematic diagram of the second operating state of the provided fluid cooling device is shown in the reference diagram. Figures 1 to 3As shown, the present invention provides a fluid heat dissipation device 10, which includes a heat dissipation unit 100 and a heat source unit 200. The heat dissipation unit 100 is located on one side of the heat source unit 200. The heat dissipation unit 100 includes a housing 110 and an adjustment portion 120. The housing 110 includes a first housing portion 111, a second housing portion 112, and a third housing portion 113. The first housing portion 111 and the second housing portion 112 extend along a first direction X1, and the third housing portion 113 extends along a second direction X2 and connects to the second housing portion 111. 12 and the first packaging section 111; the cavity formed by the first packaging section 111, the second packaging section 112 and the third packaging section 113 is used to place the adjustment section 120; the third packaging section 113 includes a fluid inlet 300, and the second packaging section 112 includes a fluid outlet 400; the adjustment section 120 includes a support post 121, a first diaphragm 122, a connecting part 123 and a second diaphragm 124; the first packaging section 111 includes a first substructure 111a, a second substructure 111b and a third substructure 111c; along the second direction X2, the first Substructure 111a overlaps with support post 121; second substructure 111b is located on the side of first substructure 111a closer to the center of heat dissipation unit 100; third substructure 111c is located on the side of first substructure 111a away from the center of heat dissipation unit 100; first diaphragm 122 is located on the side of support post 121 away from first encapsulation portion 111; support post 121, first substructure 111a, second substructure 111b, and first diaphragm 122 form a first cavity; connecting portion 123 is located on the side of first diaphragm 122 away from support post 121. The second diaphragm 124 is located on the side of the connecting portion 123 away from the first diaphragm 122. The first diaphragm 122, the connecting portion 123, and the second diaphragm 124 form a second cavity. The second diaphragm 124, the third substructure 111c, the second encapsulation portion 112, and the third encapsulation portion 113 form a third cavity. The second diaphragm 124 includes a sub-outlet 500 along the second direction X2, and the sub-outlet 500 does not overlap with the support column 121. The volume of the second cavity is different under different operating conditions of the fluid heat dissipation device. The first direction X1 and the second direction X2 intersect.

[0020] Among them, reference Figure 1 As shown, this embodiment of the invention provides a fluid heat dissipation device 10, which includes a heat dissipation unit 100 and a heat source unit 200. The heat source unit 200 can be understood as a device that generates heat during operation, such as a chip that requires heat dissipation. The heat dissipation unit 100 is located on one side of the heat source unit 200, and can dissipate heat from the heat source unit 200, preventing heat accumulation and affecting its normal operation. The relative positional relationship between the heat source unit 200 and the heat dissipation unit 100 can vary. Figure 1Only one relative positional relationship is shown as an example.

[0021] Among them, reference Figure 1 As shown, the heat dissipation unit 100 includes a housing 110 and an adjustment portion 120. The housing 110 includes a first housing portion 111, a second housing portion 112, and a third housing portion 113. The first housing portion 111 and the second housing portion 112 are disposed opposite to each other. The third housing portion 113 is used to connect the oppositely disposed second housing portion 112 and at least a portion of the first housing portion 111. The adjustment portion 120 is placed in the cavity formed by the first housing portion 111, the second housing portion 112, and the third housing portion 113. In other words, the housing 110 is equivalent to a housing structure that forms a cavity structure for placing the adjustment portion 120.

[0022] Further reference Figure 1 As shown, the third packaging section 113 includes at least one fluid inlet 300, which is used to allow fluid media such as gas or liquid to flow into the interior of the heat dissipation unit 100. Figure 1 The distance is illustrated using the example of two third encapsulation sections 113 on either side each including a fluid inlet 300. It should be noted that... Figure 1 This is a cross-sectional view of the fluid heat dissipation device 10. The overall structure of the fluid heat dissipation device 10 is not limited to... Figure 1 The diagram shows two fluid inlets 300. The specific number of fluid inlets 300 can be adjusted according to the actual heat dissipation requirements.

[0023] Further reference Figure 1 As shown, the second encapsulation section 112 includes multiple fluid outlets 400. The fluid outlets 400 are used to allow fluid media such as gas or liquid to flow out of the heat dissipation unit 100 and be transmitted to the heat source unit 200. Heat is absorbed by the fluid media such as gas or liquid, thereby dissipating heat from the heat source unit 200. Optionally, the fluid media can be low-temperature gas or liquid from the outside environment. Figure 1 The second packaging section 112 includes four fluid outlets 400 as an example. The specific number of fluid outlets 400 can be adjusted according to actual heat dissipation requirements. This embodiment of the invention does not impose a specific limitation on this.

[0024] Among them, reference Figure 1 As shown, the adjustment section 120 is disposed inside the encapsulation housing 110. The adjustment section 120 can adjust the flow rate or volume of the fluid medium, such as gas or liquid, injected into the heat dissipation unit 100 through the fluid inlet 300, thereby achieving different degrees of heat dissipation effect. For details, refer to... Figure 1As shown, the adjustment section 120 includes a support post 121, a first diaphragm 122, a connecting section 123, and a second diaphragm 124. The first diaphragm 122 is located on the side of the support post 121 away from the first encapsulation section 111, the connecting section 123 is located on the side of the first diaphragm 122 away from the support post 121, and the second diaphragm 124 is located on the side of the connecting section 123 away from the first diaphragm 122.

[0025] Further reference Figure 1 As shown, the first packaging portion 111 includes a first substructure 111a, a second substructure 111b, and a third substructure 111c. Along the second direction X2, the first substructure 111a overlaps with the support post 121, the second substructure 111b is located on the side of the first substructure 111a closer to the center of the heat dissipation unit 100, and the third substructure 111c is located on the side of the first substructure 111a away from the center of the heat dissipation unit 100. It should be noted that the first substructure 111a, the second substructure 111b, and the third substructure 111c are used to divide the first packaging portion 111 into regions, and the first substructure 111a, the second substructure 111b, and the third substructure 111c can be integrally fabricated film structures.

[0026] Specifically, the support column 121, the first substructure 111a, the second substructure 111b, and the first diaphragm 122 form a first cavity; the first diaphragm 122, the connecting portion 123, and the second diaphragm 124 form a second cavity; and the second diaphragm 124, the third substructure 111c, the second encapsulation portion 112, and the third encapsulation portion 113 form a third cavity. The support column 121 and the connecting portion 123 can be understood as support structures used to support the arrangement of the first diaphragm 122 and the second diaphragm 124. Furthermore, the second diaphragm 124 also includes multiple sub-outlets 500. Some of the fluid medium entering through the fluid inlet 300 can enter the second cavity through the sub-outlets 500, or some gas can flow out of the second cavity through the sub-outlets 500, thereby adjusting the flow rate or volume of the fluid medium at the fluid outlet 400 and achieving different degrees of heat dissipation for the heat source unit 200. Specifically, the first diaphragm 122 and the second diaphragm 124 can present different forms when the fluid heat dissipation device 10 is in different working states, thereby adjusting the volume of the second cavity accordingly, and thus pushing the gas or liquid fluid medium to flow out of the heat dissipation unit 100.

[0027] For example, refer to Figure 2 and Figure 3 As shown, the first diaphragm 122 and the second diaphragm 124 can exhibit different forms depending on the operating state of the fluid heat dissipation device 10. Specifically, refer to... Figure 2As shown, the central region of the first diaphragm 122 is shifted away from the second diaphragm 124, and the central region of the second diaphragm 124 is shifted away from the first diaphragm 122. In this case, i.e., the first operating state, the volume of the second cavity increases. In this case, the fluid medium moves as follows: it enters the interior of the heat dissipation unit 100 through the fluid inlet 300, referring to... Figure 2 Arrow a1 in the diagram; the movement path of the fluid medium in the heat dissipation unit 100 is as follows: Figure 2 Arrow a2 in the diagram; due to the increased volume of the second cavity, the air pressure inside the second cavity decreases, and some fluid medium flows into the second cavity through sub-outlet 500. (Refer to...) Figure 2 Arrow a5 in the diagram. However, some fluid medium still exits the heat dissipation unit 100 through fluid outlet 400, see reference. Figure 2 Arrow a3 in the diagram prevents the fluid medium from moving in the correct direction, thus preventing it from entering the heat dissipation unit 100 through the fluid outlet 400. The fluid medium discharged from the heat dissipation unit 100 can absorb the heat generated by the heat source unit 200. (Refer to...) Figure 2 Middle arrow a4.

[0028] For details, please refer to Figure 3 As shown, the central region of the first diaphragm 122 is shifted towards the second diaphragm 124, and the central region of the second diaphragm 124 is shifted towards the first diaphragm 122. In this case, the volume of the second cavity decreases. Figure 2 Work status conversion Figure 3 When the fluid medium is in its operating state, that is, when it transitions from the first operating state to the second operating state, the movement process of the fluid medium is as follows: it enters the interior of the heat dissipation unit 100 through the fluid inlet 300, as shown in the reference... Figure 3 Arrow b1 in the diagram; the movement path of the fluid medium in the heat dissipation unit 100 is as follows: Figure 3 Arrow b2; Due to the reduced volume of the second cavity, the air pressure inside the second cavity increases, and some fluid medium flows out of the second cavity through sub-outlet 500. (Refer to...) Figure 3 Arrow b5 in the diagram. The fluid medium entering through the fluid inlet 300 and the fluid medium exiting through the second cavity are both discharged from the heat dissipation unit 100 through the fluid outlet 400. (Refer to...) Figure 3 Arrow b3 in the diagram. This increases the volume of the fluid medium flowing out of fluid outlet 400. The fluid medium discharged from heat dissipation unit 100 can absorb the heat generated by heat source unit 200, see reference. Figure 3 The middle arrow b4 indicates improved heat dissipation for the heat source unit 200.

[0029] In summary, this invention provides a fluid heat dissipation device. The adjustment portion within the encapsulation shell of the heat dissipation unit includes a support column, a first diaphragm, a connecting portion, and a second diaphragm. The encapsulation shell further divides the heat dissipation unit into multiple cavity structures: a first cavity, a second cavity, and a third cavity. By adjusting the relative positions of the first and second diaphragms, the volume of the second cavity can be dynamically changed, thereby adjusting the flow rate or volume of the fluid medium exiting the heat dissipation unit, and ultimately adjusting the heat dissipation of the heat source unit.

[0030] refer to Figures 1 to 3 As shown, the second substructure 111b also includes a differential pressure balancing hole 600.

[0031] Further reference Figure 1 As shown, a pressure difference balancing hole 600 is also included at the second substructure 111b. The setting of the pressure difference balancing hole 600 can balance the pressure of the first cavity, thereby ensuring the stability of the overall structure of the heat dissipation unit 100.

[0032] For example, refer to Figure 2 and Figure 3 As shown, when the fluid heat dissipation device 10 is in different operating states, the relative positions of the first diaphragm 122 and the second diaphragm 124 will change, resulting in a change in the volume of the second cavity. This change in volume leads to a change in air pressure, which can be adjusted by the fluid medium entering through the sub-outlet 500 to ensure structural stability. The fluid medium entering through the fluid inlet 300 will not be transmitted into the first cavity, and the air pressure in the first cavity will also change when the position of the first diaphragm 122 changes. By providing a pressure differential balancing hole 600 at the second substructure 111b, the air pressure in the first cavity can be dynamically adjusted under different operating states, further ensuring the structural stability and reliability of the heat dissipation unit 100.

[0033] Continue to refer to Figure 2 and Figure 3As shown, the first diaphragm 122 includes a first point n1 and a second point n2. The first point n1 is located on the side of the second point n2 away from the center of the heat dissipation unit 100. Along the second direction X2, the first point n1 overlaps with the support column 121. The second diaphragm 124 includes a third point n3 and a fourth point n4. The third point n3 is located on the side of the fourth point n4 away from the center of the heat dissipation unit 100. Along the second direction X1, the third point n3 overlaps with the support column 121. Along the second direction X2, the first point n1 overlaps with the third point n3, and the second point n2 overlaps with the fourth point n4. Along the second direction X2, the distance between the first point n1 and the third point n3 is L1, and the distance between the second point n2 and the fourth point n4 is L2. The fluid heat dissipation device 10 includes a first working state and a second working state. In the first working state, L1 < L2, and in the second working state, L1 > L2. The volume of the second cavity in the first working state is greater than the volume of the second cavity in the second working state.

[0034] For details, please refer to Figure 2 and Figure 3 As shown, the first diaphragm 122 includes a first point n1 and a second point n2. The first point n1 is located on the side of the second point n2 away from the center of the heat dissipation unit 100, and along the second direction X2, the first point n1 overlaps with the support column 121. It can be understood that the area where the first point n1 is located is the connection area between the first diaphragm 122 and the support column 121; that is, the first point n1 is a reference point near the endpoint of the first diaphragm 122, and the second point n2 is a reference point near the center of the first diaphragm 122. Similarly, the second diaphragm 124 includes a third point n3 and a fourth point n4. The third point n3 is located on the side of the fourth point n4 away from the center of the heat dissipation unit 100, and along the second direction X1, the third point n3 overlaps with the support column 121; that is, the third point n3 is a reference point near the endpoint of the second diaphragm 124, and the fourth point n4 is a reference point near the center of the second diaphragm 124.

[0035] Furthermore, along the second direction X2, the first point n1 overlaps with the third point n3, and the second point n2 overlaps with the fourth point n4. In other words, the first point n1 and the third point n3 can be understood as reference points selected at comparable positions on the first diaphragm 122 and the second diaphragm 124. Similarly, the second point n2 and the fourth point n4 can also be understood as reference points selected at comparable positions on the first diaphragm 122 and the second diaphragm 124. By comparing the distances between the first point n1 and the third point n3, and the distances between the second point n2 and the fourth point n4, the deformation of the first diaphragm 122 and the second diaphragm 124 under different working conditions can be more intuitively demonstrated.

[0036] For details, please refer to Figure 2 and Figure 3 As shown, Figure 2 and Figure 3The diagram illustrates two different operating states of the fluid cooling device 10, wherein the first operating state of the fluid cooling device 10 can be referenced. Figure 2 As shown, the second operating state of the fluid cooling device can be referenced. Figure 3 As shown. Furthermore, in the first operating state, L1 < L2, while in the second operating state, L1 > L2; therefore, the volume of the second cavity in the first operating state is greater than the volume of the second cavity in the second operating state.

[0037] Figure 4 This is an enlarged structural view of a first diaphragm and a second diaphragm provided in an embodiment of the present invention. Figure 5 This is a schematic diagram of the structure of the second type of fluid heat dissipation device provided in the embodiment of the present invention. Figure 6 yes Figure 5 A schematic diagram of the first operating state of the provided fluid cooling device. Figure 7 yes Figure 5 A schematic diagram of the second operating state of the provided fluid cooling device is shown in the reference diagram. Figures 4 to 7 As shown, the adjustment section 120 includes multiple piezoelectric layer structures 125. Each piezoelectric layer structure 125 includes a first electrode layer 125a, a piezoelectric layer 125b, and a second electrode layer 125c. Along the second direction X2, the first electrode layer 125a and the second electrode layer 125c are located on opposite sides of the piezoelectric layer 125b. The first diaphragm 122 includes a first substrate 126, and the piezoelectric layer structure 125 is located on at least one side of the first substrate 126. The second diaphragm 124 includes a second substrate 127, and the piezoelectric layer structure 125 is located on at least one side of the second substrate 127. Along the second direction X2, the piezoelectric layer structure 125 does not overlap with the sub-outlet 500.

[0038] Further reference Figure 4 As shown, the adjustment section 120 includes multiple piezoelectric layer structures 125. Each piezoelectric layer structure 125 includes a first electrode layer 125a, a piezoelectric layer 125b, and a second electrode layer 125c. Along the second direction X2, the first electrode layer 125a and the second electrode layer 125c are located on both sides of the piezoelectric layer 125b. The first electrode layer 125a can be understood as the top electrode, and the second electrode layer 125c can be understood as the bottom electrode. The first electrode layer 125a, the piezoelectric layer 125b, and the second electrode layer 125c form a "sandwich" structure. The material of the piezoelectric layer 125b can include at least one or more of lead zirconate titanate (PZT), aluminum nitride (AlN), aluminum nitride-doped (ScAlN), and lithium niobate (LiNbO3). The materials of the first electrode layer 125a and the second electrode layer 125c are selected based on the material of the piezoelectric layer 125b, choosing a metal material that better fits the material, such as molybdenum, gold, titanium, or platinum. The specific materials of the piezoelectric layer structure 125 can be adjusted according to actual needs.

[0039] The piezoelectric layer structure 125 can deform to different degrees depending on the different electrical signals it receives. Furthermore, the piezoelectric layer structure 125 is disposed on the first diaphragm 122 and the second diaphragm 124. Under different operating conditions, the piezoelectric layer structure 125 can drive the first diaphragm 122 and the second diaphragm 124 to produce different deformation effects according to the different electrical signals received, thereby achieving adjustment of the volume of the second cavity.

[0040] For details, please refer to Figure 4 As shown, the first diaphragm 122 includes a first substrate 126, and a piezoelectric layer structure 125 is located on at least one side of the first substrate 126. Figure 4 The example described uses a piezoelectric layer structure 125 disposed on one side of the first substrate 126. Along the second direction X2, the piezoelectric layer structure 125 does not overlap with the sub-outlet 500; that is, the piezoelectric structure 125 disposed in the first diaphragm 122 is only disposed in the edge region of the first diaphragm 122. Similarly, refer to... Figure 4 As shown, the second diaphragm 124 includes a second substrate 127, and a piezoelectric layer structure 125 is located on at least one side of the second substrate 127. Figure 4 The example shown is an example of a piezoelectric layer structure 125 disposed on one side of the second substrate 127. Along the second direction X2, the piezoelectric layer structure 125 does not overlap with the sub-outlet 500; that is, the piezoelectric structure 125 disposed in the second diaphragm 124 is only disposed in the edge region of the first diaphragm 122 and will not interfere with the sub-outlet 500. Further, refer to... Figure 5 As shown, Figure 5 The adjustment section 120 also includes multiple piezoelectric layer structures 125 as an example. Further, refer to... Figure 6 and Figure 7 As shown, the deformation of the first diaphragm 122 and the second diaphragm 124 in the fluid heat dissipation device 10 is due to the piezoelectric layer structure 125 receiving different potential signals, as illustrated in the example. Figure 6 This shows the fluid cooling device 10 in its first operating state. Figure 7 This shows the fluid cooling device 10 in its second operating state.

[0041] Figure 8 This is an enlarged structural view of another first and second diaphragm provided in an embodiment of the present invention, with reference to... Figure 8As shown, the adjustment section 120 includes an electrode sub-film 129, which does not overlap with the sub-outlet 400 along the second direction X2; the first film 122 includes a first piezoelectric layer 131 and multiple electrode sub-films 129, with a first piezoelectric layer 131 disposed between two adjacent electrode sub-films 129 along the second direction X2; the second film 124 includes a second piezoelectric layer 132, with a second piezoelectric layer 132 disposed between two adjacent electrode sub-films 129 along the second direction X2.

[0042] Further reference Figure 8 As shown, the first diaphragm 122 includes a first piezoelectric layer 131, and the adjustment portion further includes a plurality of electrode sub-diaphragms 129, wherein the electrode sub-diaphragms 129 are disposed at the first piezoelectric layer 131. Further, along the second direction X2, the electrode sub-diaphragms 129 do not overlap with the sub-outlet 400, that is, the electrode sub-diaphragms 129 are only disposed in the edge region of the first diaphragm 122. Further, referring to... Figure 8 As shown, the number of electrode sub-films 129 on the first film 122 can be multiple. Along the second direction X2, a first piezoelectric layer 131 is disposed between two adjacent electrode sub-films 129. The structure formed by the first piezoelectric layer 131 and two adjacent electrode sub-films 129 is equivalent to a "sandwich" structure. For example, refer to... Figure 8 As shown, the first diaphragm 122 includes three electrode sub-diaphragms 129, and a first piezoelectric layer 131 exists between two adjacent electrode sub-diaphragms 129. Therefore, the three electrode sub-diaphragms 129 form two sets of "sandwich" structures. Compared with a single "sandwich" structure, the deformation adjustment effect of the first diaphragm 122 is better when receiving electrical signals.

[0043] Similarly, refer to Figure 8 As shown, the second diaphragm 124 includes a second piezoelectric layer 132, and the adjustment portion also includes a plurality of electrode sub-diaphragms 129, wherein the electrode sub-diaphragms 129 are disposed at the second piezoelectric layer 132. Furthermore, along the second direction X2, the electrode sub-diaphragms 129 do not overlap with the sub-outlet 400; that is, the electrode sub-diaphragms 129 are only disposed in the edge region of the second diaphragm 124 and will not interfere with the sub-outlet 500. Further, referring to… Figure 8 As shown, the number of electrode sub-films 129 on the second film 124 can be multiple. Along the second direction X2, a second piezoelectric layer 132 is disposed between two adjacent electrode sub-films 129. The structure formed by the second piezoelectric layer 132 and two adjacent electrode sub-films 129 is equivalent to a "sandwich" structure. For example, refer to... Figure 8As shown, the second diaphragm 124 includes three electrode sub-diaphragms 129, and a second piezoelectric layer 132 exists between two adjacent electrode sub-diaphragms 129. Therefore, the three electrode sub-diaphragms 129 form two sets of "sandwich" structures. Compared with a single "sandwich" structure, the deformation adjustment effect of the second diaphragm 124 is better when receiving electrical signals.

[0044] Figure 9 This is a schematic diagram of the structure of the third type of fluid heat dissipation device provided in the embodiments of the present invention. Figure 10 This is a schematic diagram of the structure of the fourth fluid heat dissipation device provided in the embodiments of the present invention, for reference. Figure 9 and Figure 10 As shown, the fluid heat dissipation device 10 also includes a circuit board 700; the heat dissipation unit 100 and the heat source unit 200 are disposed on the same side of the circuit board 700, and along the first direction X1, the heat dissipation unit 100 is located on one side of the heat source unit 200; the first package portion 111 of the heat dissipation unit 100 is electrically connected to the circuit board 700 through the first connection point 810, and the heat source unit 200 is electrically connected to the circuit board 700 through the second connection point 820; or, the heat dissipation unit 100 and the heat source unit 200 are disposed on the same side of the circuit board 700, and the heat dissipation unit 100 is located on the side of the heat source unit 200 away from the circuit board 700; the first package portion 111 of the heat dissipation unit 100 is electrically connected to the circuit board 700 through the first connection line 830, and the heat source unit 200 is electrically connected to the circuit board 700 through the third connection point 840.

[0045] For details, please refer to Figure 9 and Figure 10 As shown, the fluid cooling device 10 also includes a circuit board 700, and the heat source unit 200 is electrically connected to the circuit board 700. The circuit board 700 can provide relevant electrical signals to the heat source unit 200 to drive it to work. Furthermore, the circuit board 700 is also electrically connected to the heat dissipation unit 100. The circuit board 700 provides relevant electrical signals to the heat dissipation unit 100, which can drive the first diaphragm 122 and the second diaphragm 124 in the heat dissipation unit 100 to be in different states, thereby realizing different volume changes of the second cavity in the heat dissipation unit 100, realizing different working states of the fluid cooling device 10, and thus providing different degrees of heat dissipation effect to the heat source unit 200.

[0046] Further reference Figure 9As shown, the heat dissipation unit 100 and the heat source unit 200 are disposed on the same side of the circuit board 700, and along the first direction X1, the heat dissipation unit 100 is located on one side of the heat source unit 200. That is, the heat dissipation unit 100 and the heat source unit 200 are disposed adjacent to each other along the second direction X2, and both are adjacent to the circuit board 700. The first package portion 111 of the heat dissipation unit 100 is electrically connected to the circuit board 700 through a first connection point 810, and the heat source unit 200 is electrically connected to the circuit board 700 through a second connection point 820, so that the circuit board 700 provides relevant electrical signals to the heat dissipation unit 100 and the heat source unit 200 respectively. Further, refer to... Figure 9 As shown, in order to ensure that the fluid medium discharged by the heat dissipation unit 100 can dissipate heat from the heat source unit 200, 110 in the heat dissipation unit 100 also includes a fourth encapsulation portion 114, and the fourth encapsulation portion 114 is also provided with an encapsulation opening 900 close to the heat source unit 200. In this way, the fluid medium output through the fluid outlet 400 can be transmitted to the heat source unit 200 through the encapsulation opening 900, which facilitates the dissipation of heat source unit 200.

[0047] Further reference Figure 10 As shown, the heat dissipation unit 100 and the heat source unit 200 are disposed on the same side of the circuit board 700, with the heat dissipation unit 100 located on the side of the heat source unit 200 away from the circuit board 700. That is, the heat dissipation unit 100 and the heat source unit 200 are disposed adjacent to each other along the first direction X1, and the heat source unit 200 can be located on the side of the heat dissipation unit 100 closer to the circuit board 700. Specifically, the first package portion 111 of the heat dissipation unit 100 is electrically connected to the circuit board 700 via a first connecting line 830, and the heat source unit 200 is electrically connected to the circuit board 700 via a third connecting point 840. This allows the circuit board 700 to provide relevant electrical signals to the heat dissipation unit 100 and the heat source unit 200 respectively. This demonstrates the versatility of the relative positions between the heat dissipation unit 100 and the heat source unit 200.

[0048] Figure 11 This is a schematic flowchart of the preparation method of the first fluid heat dissipation device provided in the embodiment of the present invention, for reference. Figure 11 As shown, this embodiment of the invention provides a method for preparing a fluid heat dissipation device, the method comprising: S110. Provide a support layer and prepare a first diaphragm, a connector and a second diaphragm on the support layer.

[0049] This invention provides a fluid heat dissipation device, which includes a heat dissipation unit and a heat source unit. The heat source unit can be understood as a device that generates heat during operation, such as a chip requiring heat dissipation. The heat dissipation unit is located to one side of the heat source unit and dissipates heat from the heat source unit, preventing heat buildup that could affect its normal operation. The relative positional relationship between the heat source unit and the heat dissipation unit can vary. Figure 1 Only one relative positional relationship is shown as an example.

[0050] The heat dissipation unit includes a package shell and an adjustment section. The adjustment section is prepared first, and then the package shell is prepared on the outside of the adjustment section.

[0051] Specifically, the outer casing allows for the inflow and outflow of external fluid media, while the adjustment section can adjust the flow rate or volume of the gas or liquid fluid medium injected into the heat dissipation unit to achieve different levels of heat dissipation. Specifically, the adjustment section includes a support layer, a first diaphragm, a connecting portion, and a second diaphragm. The first diaphragm is located on one side of the support layer, the connecting portion is located on the side of the first diaphragm away from the support layer, and the second diaphragm is located on the side of the connecting portion away from the first diaphragm. Furthermore, multiple sub-outlets are provided at the second diaphragm.

[0052] S120, etch the support layer and prepare the support pillar.

[0053] Furthermore, the support layer is etched to form support pillars, which support the first diaphragm, the connector, and the second diaphragm. The support pillars, the first diaphragm, and the subsequently fabricated encapsulation structure can form a cavity structure. Specifically, along the second direction, the sub-outlet does not overlap with the support pillars.

[0054] S130, Prepare the encapsulation shell to form a heat dissipation unit.

[0055] Furthermore, a packaging shell is prepared, comprising a first packaging segment, a second packaging segment, and a third packaging segment; the first and second packaging segments are disposed opposite to each other, and the third packaging segment is used to connect the oppositely disposed second packaging segment and at least a portion of the first packaging segment, wherein the cavity formed by the first, second, and third packaging segments houses the adjustment segment. In other words, the packaging shell is equivalent to a shell structure that forms a cavity structure for housing the adjustment segment.

[0056] Further reference Figure 1As shown, the third packaging section 113 includes at least one fluid inlet 300, which is used to allow a fluid medium such as gas or liquid to flow into the interior of the heat dissipation unit 100. The specific number of fluid inlets can be adjusted adaptively according to the actual heat dissipation requirements. Further, refer to... Figure 1 As shown, the second encapsulation section 112 includes multiple fluid outlets 400. The fluid outlets 400 are used to allow a fluid medium, such as gas or liquid, to flow out of the heat dissipation unit 100 and be transmitted to the heat source unit 200. The fluid medium absorbs heat, thereby dissipating heat from the heat source unit 200. Optionally, the fluid medium can be a low-temperature gas or liquid from the outside environment. The specific number of fluid outlets can be adjusted according to actual heat dissipation requirements; this embodiment of the invention does not impose a specific limitation on this.

[0057] Furthermore, the first packaging segment includes a first substructure, a second substructure, and a third substructure; along the second direction, the first substructure overlaps with the support pillar, the second substructure is located on the side of the first substructure closer to the center of the heat dissipation unit, and the third substructure is located on the side of the first substructure farther from the center of the heat dissipation unit. It should be noted that the first, second, and third substructures are used to divide the first packaging segment into regions, and the first, second, and third substructures can be integrally fabricated film structures.

[0058] The system comprises a support column, a first substructure, a second substructure, and a first diaphragm forming a first cavity; a first diaphragm, a connecting portion, and a second diaphragm forming a second cavity; and a second diaphragm, a third substructure, a second encapsulation portion, and a third encapsulation portion forming a third cavity. The support column and connecting portion can be understood as support structures used to support the first and second diaphragms. Furthermore, the second diaphragm includes multiple sub-outlets. Some fluid medium entering through the fluid inlet can enter the second cavity through the sub-outlets, or some gas can flow out of the second cavity through the sub-outlets, thereby adjusting the flow rate or volume of the fluid medium at the fluid outlets and achieving different levels of heat dissipation for the heat source unit. Specifically, the first and second diaphragms can present different shapes under different operating conditions of the fluid heat dissipation device, thereby adjusting the volume of the second cavity accordingly, and thus driving gas or liquid fluid mediums out of the heat dissipation unit.

[0059] For example, refer to Figure 2 and Figure 3 As shown, the first diaphragm 122 and the second diaphragm 124 can exhibit different forms depending on the operating state of the fluid heat dissipation device 10. Specifically, refer to... Figure 2As shown, the central region of the first diaphragm 122 is shifted away from the second diaphragm 124, and the central region of the second diaphragm 124 is shifted away from the first diaphragm 122. In this case, i.e., the first operating state, the volume of the second cavity increases. In this case, the fluid medium moves as follows: it enters the interior of the heat dissipation unit 100 through the fluid inlet 300, referring to... Figure 2 Arrow a1 in the diagram; the movement path of the fluid medium in the heat dissipation unit 100 is as follows: Figure 2 Arrow a2 in the diagram; due to the increased volume of the second cavity, the air pressure inside the second cavity decreases, and some fluid medium flows into the second cavity through sub-outlet 500. (Refer to...) Figure 2 Arrow a5 in the diagram. However, some fluid medium still exits the heat dissipation unit 100 through fluid outlet 400, see reference. Figure 2 Arrow a3 in the diagram prevents the fluid medium from moving in the correct direction, thus preventing it from entering the heat dissipation unit 100 through the fluid outlet 400. The fluid medium discharged from the heat dissipation unit 100 can absorb the heat generated by the heat source unit 200. (Refer to...) Figure 2 Middle arrow a4.

[0060] For details, please refer to Figure 3 As shown, the central region of the first diaphragm 122 is shifted towards the second diaphragm 124, and the central region of the second diaphragm 124 is shifted towards the first diaphragm 122. In this case, the volume of the second cavity decreases. Figure 2 Work status conversion Figure 3 When the fluid medium is in its operating state, that is, when it transitions from the first operating state to the second operating state, the movement process of the fluid medium is as follows: it enters the interior of the heat dissipation unit 100 through the fluid inlet 300, as shown in the reference... Figure 3 Arrow b1 in the diagram; the movement path of the fluid medium in the heat dissipation unit 100 is as follows: Figure 3 Arrow b2; Due to the reduced volume of the second cavity, the air pressure inside the second cavity increases, and some fluid medium flows out of the second cavity through sub-outlet 500. (Refer to...) Figure 3 Arrow b5 in the diagram. The fluid medium entering through the fluid inlet 300 and the fluid medium exiting through the second cavity are both discharged from the heat dissipation unit 100 through the fluid outlet 400. (Refer to...) Figure 3 Arrow b3 in the diagram. This increases the volume of the fluid medium flowing out of fluid outlet 400. The fluid medium discharged from heat dissipation unit 100 can absorb the heat generated by heat source unit 200, see reference. Figure 3 The middle arrow b4 indicates improved heat dissipation for the heat source unit 200.

[0061] S140. The heat dissipation unit is placed on one side of the heat source unit.

[0062] Specifically, the heat dissipation unit can be located on one side of the heat source unit, but the specific relative position of the heat dissipation unit and the heat source unit can be adjusted adaptively according to the actual situation. This embodiment of the invention does not impose specific limitations on this.

[0063] Optionally, the fluid cooling device may also include a circuit board.

[0064] Specifically, the fluid cooling device also includes a circuit board, and the heat source unit is electrically connected to the circuit board. The circuit board can provide relevant electrical signals to the heat source unit to drive it to work. Furthermore, the circuit board is also electrically connected to the heat dissipation unit, and the circuit board provides relevant electrical signals to the heat dissipation unit, which can drive the first and second diaphragms in the heat dissipation unit to different states, thereby realizing different volume changes of the second cavity in the heat dissipation unit, realizing different working states of the fluid cooling device, and thus providing different degrees of heat dissipation effect to the heat source unit.

[0065] Specifically, the heat dissipation unit and the heat source unit can be placed on the same side of the circuit board, and along the first direction, the heat dissipation unit is located on one side of the heat source unit; the first package portion of the heat dissipation unit is electrically connected to the circuit board through the first connection point, and the heat source unit is electrically connected to the circuit board through the second connection point.

[0066] Further reference Figure 9 As shown, the heat dissipation unit 100 and the heat source unit 200 are disposed on the same side of the circuit board 700, and along the first direction X1, the heat dissipation unit 100 is located on one side of the heat source unit 200. That is, the heat dissipation unit 100 and the heat source unit 200 are disposed adjacent to each other along the second direction X2, and both are adjacent to the circuit board 700. The first package portion 111 of the heat dissipation unit 100 is electrically connected to the circuit board 700 through a first connection point 810, and the heat source unit 200 is electrically connected to the circuit board 700 through a second connection point 820, so that the circuit board 700 provides relevant electrical signals to the heat dissipation unit 100 and the heat source unit 200 respectively. Further, refer to... Figure 9 As shown, in order to ensure that the fluid medium discharged by the heat dissipation unit 100 can dissipate heat from the heat source unit 200, 110 in the heat dissipation unit 100 also includes a fourth encapsulation portion 114, and the fourth encapsulation portion 114 is also provided with an encapsulation opening 900 close to the heat source unit 200. In this way, the fluid medium output through the fluid outlet 400 can be transmitted to the heat source unit 200 through the encapsulation opening 900, which facilitates the dissipation of heat source unit 200.

[0067] Alternatively, the heat dissipation unit and the heat source unit can be located on the same side of the circuit board, with the heat dissipation unit located on the side of the heat source unit away from the circuit board; the first package portion of the heat dissipation unit is electrically connected to the circuit board via a first connecting line, and the heat source unit is electrically connected to the circuit board via a third connecting point.

[0068] Further reference Figure 10 As shown, the heat dissipation unit 100 and the heat source unit 200 are disposed on the same side of the circuit board 700, with the heat dissipation unit 100 located on the side of the heat source unit 200 away from the circuit board 700. That is, the heat dissipation unit 100 and the heat source unit 200 are disposed adjacent to each other along the first direction X1, and the heat source unit 200 can be located on the side of the heat dissipation unit 100 closer to the circuit board 700. Specifically, the first package portion 111 of the heat dissipation unit 100 is electrically connected to the circuit board 700 via a first connecting line 830, and the heat source unit 200 is electrically connected to the circuit board 700 via a third connecting point 840. This allows the circuit board 700 to provide relevant electrical signals to the heat dissipation unit 100 and the heat source unit 200 respectively. This demonstrates the versatility of the relative positions between the heat dissipation unit 100 and the heat source unit 200.

[0069] In summary, this invention provides a method for manufacturing a fluid heat dissipation device. An adjustment section is disposed inside a packaged shell, and this adjustment section includes a support column, a first diaphragm, a connecting portion, and a second diaphragm. Combined with the packaged shell, the heat dissipation unit is divided into multiple cavity structures, namely a first cavity, a second cavity, and a third cavity. By adjusting the relative positions of the first and second diaphragms, the volume of the second cavity dynamically changes, thereby adjusting the flow rate or volume of the fluid medium exiting the heat dissipation unit, and thus achieving heat dissipation adjustment of the heat source unit.

[0070] Figure 12 This is a schematic diagram of the preparation method of the second fluid heat dissipation device provided in the embodiments of the present invention. Figure 13 This is a process diagram of the fabrication method of the first fluid heat dissipation device provided in the embodiments of the present invention, for reference. Figure 12 and Figure 13 As shown, the preparation method includes: S210 provides a support layer.

[0071] For details, please refer to Figure 13 As shown in step a, a support layer 121a is provided. The support layer 121a is a membrane structure that provides support.

[0072] S220. Prepare a first membrane on one side of the support layer.

[0073] For details, please refer to Figure 13 As shown in step b, a first membrane 122 is prepared on one side of the support layer 121a.

[0074] S230. Prepare a connecting membrane layer on the side of the first membrane away from the support layer.

[0075] For details, please refer to Figure 13As shown in step c, a connecting film layer 123a is prepared on the side of the first membrane 122 away from the support layer 121a. The connecting film layer 123a is used to ensure the connection relationship between the subsequently prepared second membrane 124 and the first membrane 122.

[0076] S240, Etching the connecting film layer to form the connecting part.

[0077] For details, please refer to Figure 13 As shown in step d, the connecting film layer 123a is etched and the connecting portion 123 is formed.

[0078] S250, fill the first sacrificial structure.

[0079] For details, please refer to Figure 13 As shown in step e, a first sacrificial structure 123b is filled in the area where the etched-removed connecting film layer 123a is located. Filling the first sacrificial structure 123b ensures the flatness of the overall structure, facilitating the subsequent fabrication of the second film 123.

[0080] For details, please refer to Figure 13 As shown in step e, the distance between the surface of the first sacrificial structure 123b away from the support layer 121a and the support layer 121a is a1, and the distance between the surface of the connecting portion 123 away from the support layer 121a and the support layer 121a is a2, where |a1-a2| / a2≤20%. That is to say, the values ​​of a1 and a2 are the same or similar, thus reflecting that the surface of the first sacrificial structure 123b and the surface of the connecting portion 123 are basically on the same plane, thereby reflecting the overall flatness of the film layer.

[0081] S260. Prepare a second membrane on the side of the first sacrificial structure and the connecting portion away from the first membrane.

[0082] For details, please refer to Figure 13 As shown in step f, a second membrane 124 is prepared on the side of the first sacrificial structure 123b and the connecting portion 123 away from the first membrane 122.

[0083] S270, Etch the second film to form multiple sub-outlets.

[0084] For details, please refer to Figure 13 As shown in step g, multiple sub-outlets 500 are prepared on the second diaphragm 124. The prepared sub-outlets 500 facilitate the removal of the first sacrificial structure 123b, thereby forming a cavity structure of the first diaphragm 122, the second diaphragm 124, and the connecting portion 123.

[0085] S280, remove the first sacrificial structure through the sub-outlet.

[0086] For details, please refer to Figure 13As shown in step h, the first sacrificial structure 123b is exposed through the sub-exit 500 and can be removed by dry etching or wet etching.

[0087] S290, etch the support layer and prepare the support pillar.

[0088] For details, please refer to Figure 13 As shown in step i, a support pillar 121 is formed by etching the support layer 121a, thereby the support pillar 121, the first membrane 122 and the subsequently prepared encapsulation shell can form a cavity structure.

[0089] S2100, Prepare the encapsulation shell to form a heat dissipation unit.

[0090] For details, please refer to Figure 13 As shown in step j.

[0091] S2110. The heat dissipation unit is placed on one side of the heat source unit.

[0092] For details, please refer to Figure 13 As shown in step k.

[0093] In summary, the method for preparing a fluid heat dissipation device provided by the embodiments of the present invention embodies the specific preparation process of the adjustment section.

[0094] Figure 14 This is a schematic diagram of the preparation method of the third fluid heat dissipation device provided in the embodiments of the present invention. Figure 15a This is a process diagram of the first part of the preparation method of the second type of fluid heat dissipation device provided in the embodiments of the present invention. Figure 15b This is a process diagram of the second part of the preparation method of the second type of fluid heat dissipation device provided in the embodiments of the present invention, for reference. Figure 14 , Figure 15a and Figure 15b As shown, the preparation method also includes; S310 provides a support layer.

[0095] For details, please refer to Figure 15a As shown in step a, a support layer 121a is provided. The support layer 121a is a membrane structure that provides support.

[0096] S320. Prepare a first membrane on one side of the support layer.

[0097] For details, please refer to Figure 15a As shown in step b, a first membrane 122 is prepared on one side of the support layer 121a.

[0098] S330. Prepare a first connecting membrane layer on the side of the first membrane away from the support layer.

[0099] For details, please refer to Figure 15a As shown in step c, a first connecting membrane layer 123x is prepared on the side of the first membrane 122 away from the support layer 121a.

[0100] S340, Etch the first connecting film layer to form the first connecting portion.

[0101] For details, please refer to Figure 15a As shown in step d, the first connecting film layer 123x is etched and the first connecting portion 1231 is formed.

[0102] S350, filled with a second sacrificial structure.

[0103] For details, please refer to Figure 15a As shown in step e, the second sacrificial structure 123c is filled in the region where the first connecting film layer 123x is etched away. Filling the second sacrificial structure 123c ensures the flatness of the overall structure.

[0104] For details, please refer to Figure 15a As shown in step e, the distance between the surface of the second sacrificial structure 123c away from the support layer 121a and the support layer 121a is b1, and the distance between the surface of the first connecting portion 1231 away from the support layer 121a and the support layer 121a is b2, where |b1-b2| / b2≤20%. That is to say, the values ​​of b1 and b2 are the same or similar, thus demonstrating that the surface of the second sacrificial structure 123c and the surface of the first connecting portion 1231 are basically on the same plane, thereby demonstrating the overall flatness of the film layer.

[0105] S360 provides a sacrificial support layer.

[0106] For details, please refer to Figure 15a As shown in step f, a sacrificial support layer 121b is provided. The sacrificial support layer 121b is a membrane structure that serves a supporting function.

[0107] S370. Prepare a second membrane on one side of the sacrificial support layer.

[0108] For details, please refer to Figure 15a As shown in step g, a second membrane 124 is prepared on one side of the sacrificial support layer 121b.

[0109] S380, etch the second film to form multiple sub-outlets.

[0110] For details, please refer to Figure 15a As shown in step h, multiple sub-outlets 500 are prepared on the second membrane 124. The prepared sub-outlets 500 facilitate the removal of the second sacrificial structure 123c and the subsequently prepared third sacrificial structure.

[0111] S390. Prepare a second connecting membrane layer on the side of the second membrane away from the sacrificial support layer.

[0112] For details, please refer to Figure 15a As shown in step i, a second connecting membrane layer 123y is prepared on the side of the second membrane 124 away from the sacrificial support layer 121b.

[0113] S3100, Etch the second connecting film layer to form the second connecting part.

[0114] S3110, Fill with the third sacrificial structure.

[0115] For details, please refer to Figure 15a As shown in step j, the second connecting film layer 123y is first etched to form the second connecting portion 1232. Further, a third sacrificial structure 123d is filled in the area where the etched-removed second connecting film layer 123y is located. Filling the third sacrificial structure 123d ensures the flatness of the overall structure.

[0116] Further reference Figure 15a As shown in step j, the distance between the surface of the third sacrificial structure 123d away from the sacrificial support layer 121b and the sacrificial support layer 121b is c1, and the distance between the surface of the second connecting portion 1232 away from the sacrificial support layer 121b and the sacrificial support layer 121b is c2, where |c1-c2| / c2≤20%. That is to say, the values ​​of c1 and c2 are the same or similar, thus reflecting that the surface of the third sacrificial structure 123d and the surface of the second connecting portion 1232 are basically on the same plane, thereby reflecting the overall flatness of the film layer.

[0117] S3120, the first connecting part and the second connecting part are bonded to form a connecting part.

[0118] For details, please refer to Figure 15a As shown in step k, the first connecting part 1231 and the second connecting part 1232 are aligned and bonded together, and the first connecting part 1231 and the second connecting part 1232 form the connecting part 123.

[0119] S3130, stripping the sacrificial support layer; For details, please refer to Figure 15a As shown in step 1, the sacrificial support layer 121b is peeled off, thereby transferring the second membrane 124 to the side of the first membrane 122 away from the support layer 121a.

[0120] S3140, Remove the second and third sacrificial structures through the sub-outlet.

[0121] For details, please refer to Figure 15aAs shown in step m, the second sacrificial structure 123c and the third sacrificial structure 123d are exposed sequentially through the sub-outlet 500. The second sacrificial structure 123c and the third sacrificial structure 123d can be removed sequentially by dry etching or wet etching.

[0122] S3150, etch the support layer and prepare the support pillar.

[0123] For details, please refer to Figure 15b As shown in step n, support pillars 121 are formed by etching the support layer 121a, thereby allowing the support pillars 121, the first diaphragm 122, and the subsequently fabricated encapsulation shell to form a cavity structure. Therefore... Figure 15b This can be understood as another preparation process for adjusting part 120.

[0124] S3160, Prepare the encapsulation shell to form a heat dissipation unit.

[0125] For details, please refer to Figure 15b As shown in step o.

[0126] S3170, The heat dissipation unit is placed on one side of the heat source unit.

[0127] For details, please refer to Figure 15b As shown in step p. It should be noted that, in order to clearly illustrate the preparation process of adjustment section 120, its preparation process is described in... Figure 15a Present it. Figure 15b Step n in the figure can be understood as the preparation process following step m in Figure 15.

[0128] In summary, the alternative method for preparing a fluid heat dissipation device provided by the embodiments of the present invention demonstrates the diversity of the preparation process for the adjustment section.

[0129] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A fluid heat dissipation device, characterized in that, It includes a heat dissipation unit and a heat source unit, wherein the heat dissipation unit is located on one side of the heat source unit; The heat dissipation unit includes an encapsulated housing and an adjustment section; The encapsulation housing includes a first encapsulation portion, a second encapsulation portion, and a third encapsulation portion; the first encapsulation portion and the second encapsulation portion extend along a first direction, and the third encapsulation portion extends along a second direction to connect the second encapsulation portion and the first encapsulation portion; The adjustment section is placed in the cavity formed by the first packaging section, the second packaging section, and the third packaging section; the third packaging section includes a fluid inlet, and the second packaging section includes a fluid outlet; The adjustment section includes a support column, a first diaphragm, a connecting portion, and a second diaphragm; the first encapsulation section includes a first substructure, a second substructure, and a third substructure; along the second direction, the first substructure overlaps with the support column, the second substructure is located on the side of the first substructure closer to the center of the heat dissipation unit, and the third substructure is located on the side of the first substructure away from the center of the heat dissipation unit. The first diaphragm is located on the side of the support post away from the first packaging portion, and the support post, the first substructure, the second substructure, and the first diaphragm form a first cavity; the connecting portion is located on the side of the first diaphragm away from the support post, and the second diaphragm is located on the side of the connecting portion away from the first diaphragm, and the first diaphragm, the connecting portion, and the second diaphragm form a second cavity; the second diaphragm, the third substructure, the second packaging portion, and the third packaging portion form a third cavity; the second diaphragm includes a sub-outlet, and along the second direction, the sub-outlet does not overlap with the support post; The volume of the second cavity varies under different operating conditions of the fluid cooling device; the first direction and the second direction intersect. The first diaphragm includes a first point and a second point, the first point being located on the side of the second point away from the center of the heat dissipation unit, and along the second direction, the first point overlaps with the support column; The second diaphragm includes a third point and a fourth point, the third point being located on the side of the fourth point away from the center of the heat dissipation unit, and along the second direction, the third point overlaps with the support column; Along the second direction, the first point overlaps with the third point, and the second point overlaps with the fourth point; along the second direction, the distance between the first point and the third point is L1, and the distance between the second point and the fourth point is L2; The fluid cooling device includes a first working state and a second working state; In the first working state, L1 < L2, and in the second working state, L1 > L2; the volume of the second cavity in the first working state is greater than the volume of the second cavity in the second working state.

2. The fluid heat dissipation device according to claim 1, characterized in that, The second substructure also includes a differential pressure balancing hole.

3. The fluid heat dissipation device according to claim 1, characterized in that, The adjustment section includes multiple piezoelectric layer structures, each piezoelectric layer structure including a first electrode layer, a piezoelectric layer, and a second electrode layer. Along the second direction, the first electrode layer and the second electrode layer are located on both sides of the piezoelectric layer. The first diaphragm includes a first substrate, and the piezoelectric layer structure is located on at least one side of the first substrate; the second diaphragm includes a second substrate, and the piezoelectric layer structure is located on at least one side of the second substrate; along the second direction, the piezoelectric layer structure does not overlap with the sub-outlet.

4. The fluid heat dissipation device according to claim 1, characterized in that, The adjustment section includes an electrode sub-diaphragm, which, along the second direction, does not overlap with the sub-outlet; The first diaphragm includes a first piezoelectric layer and multiple layers of the electrode sub-diaphragms, with a layer of the first piezoelectric layer disposed between two adjacent layers of the electrode sub-diaphragms along the second direction; The second diaphragm includes a second piezoelectric layer, and along the second direction, a second piezoelectric layer is disposed between two adjacent electrode sub-diaphragms.

5. The fluid heat dissipation device according to claim 1, characterized in that, The fluid cooling device also includes a circuit board; The heat dissipation unit and the heat source unit are disposed on the same side of the circuit board, and along the first direction, the heat dissipation unit is located on one side of the heat source unit; the first package portion of the heat dissipation unit is electrically connected to the circuit board through a first connection point, and the heat source unit is electrically connected to the circuit board through a second connection point. Alternatively, the heat dissipation unit and the heat source unit can be located on the same side of the circuit board, with the heat dissipation unit located on the side of the heat source unit away from the circuit board; the first package portion of the heat dissipation unit is electrically connected to the circuit board via a first connecting line, and the heat source unit is electrically connected to the circuit board via a third connecting point.

6. A method for preparing a fluid heat dissipation device, characterized in that, A method for preparing the fluid heat dissipation device according to any one of claims 1-5; the preparation method includes: A support layer is provided, and a first diaphragm, a connector, and a second diaphragm are fabricated on the support layer; the second diaphragm includes a sub-outlet. The support layer is etched and a support pillar is fabricated; along the second direction, the sub-outlet does not overlap with the support pillar; the first direction and the second direction intersect. A heat dissipation unit is formed by fabricating a packaging shell; the packaging shell includes a first packaging portion, a second packaging portion, and a third packaging portion; the first packaging portion and the second packaging portion extend along a first direction, and the third packaging portion extends along a second direction, connecting the second packaging portion and the first packaging portion; the cavity formed by the first packaging portion, the second packaging portion, and the third packaging portion houses the adjustment portion; the third packaging portion includes a fluid inlet, and the second packaging portion includes a fluid outlet; the first packaging portion includes a first substructure, a second substructure, and a third substructure; along the second direction, the first substructure overlaps with the support column, and the second substructure is located near the first substructure. On one side of the center of the heat dissipation unit, the third substructure is located on the side of the first substructure away from the center of the heat dissipation unit; the first diaphragm is located on the side of the support pillar away from the first encapsulation portion, and the support pillar, the first substructure, the second substructure, and the first diaphragm form a first cavity; the connecting portion is located on the side of the first diaphragm away from the support pillar, and the second diaphragm is located on the side of the connecting portion away from the first diaphragm, and the first diaphragm, the connecting portion, and the second diaphragm form a second cavity; the second diaphragm, the third substructure, the second encapsulation portion, and the third encapsulation portion form a third cavity; the volume of the second cavity is different under different operating conditions of the fluid heat dissipation device; The heat dissipation unit is positioned on one side of the heat source unit.

7. The preparation method according to claim 6, characterized in that, Providing a support layer and fabricating a first membrane, a connector, and a second membrane on the support layer includes: Provide a support layer; A first membrane is prepared on one side of the support layer; A connecting membrane layer is prepared on the side of the first diaphragm away from the support layer; The connection layer is etched to form the connection portion; A first sacrificial structure is filled in, the distance between the surface of the first sacrificial structure away from the support layer and the support layer is a1, and the distance between the surface of the connecting portion away from the support layer and the support layer is a2, wherein |a1-a2| / a2≤20%; A second membrane is prepared on the side of the first sacrificial structure and the connecting portion away from the first membrane; The second membrane is etched to form multiple sub-outlets; The first sacrificial structure is removed through the sub-exit.

8. The preparation method according to claim 6, characterized in that, Providing a support layer and fabricating a first membrane, a connector, and a second membrane on the support layer includes: Provide a support layer; A first membrane is prepared on one side of the support layer; A first connecting membrane layer is prepared on the side of the first diaphragm away from the support layer; The first connection film layer is etched to form the first connection portion; A second sacrificial structure is filled in, the surface of the second sacrificial structure away from the support layer is at a distance b1 from the support layer, and the surface of the first connecting portion away from the support layer is at a distance b2 from the support layer, wherein |b1-b2| / b2≤20%; Provide a sacrificial support layer; A second membrane is prepared on one side of the sacrificial support layer; The second membrane is etched to form multiple sub-outlets; A second connecting membrane layer is prepared on the side of the second diaphragm away from the sacrificial support layer; The second connection film layer is etched to form the second connection portion; A third sacrificial structure is filled in, wherein the distance between the surface of the third sacrificial structure away from the sacrificial support layer and the sacrificial support layer is c1, and the distance between the surface of the second connecting portion away from the sacrificial support layer and the sacrificial support layer is c2, wherein |c1-c2| / c2≤20%; The first connecting portion and the second connecting portion are bonded together to form the connecting portion; Strip the sacrificial support layer; The second sacrificial structure and the third sacrificial structure are removed through the sub-outlet.

9. The preparation method according to claim 6, characterized in that, The fluid cooling device also includes a circuit board; Placing the heat dissipation unit on one side of the heat source unit includes: The heat dissipation unit and the heat source unit are disposed on the same side of the circuit board, and along the first direction, the heat dissipation unit is located on one side of the heat source unit; the first package portion of the heat dissipation unit is electrically connected to the circuit board through a first connection point, and the heat source unit is electrically connected to the circuit board through a second connection point. Alternatively, the heat dissipation unit and the heat source unit can be located on the same side of the circuit board, with the heat dissipation unit located on the side of the heat source unit away from the circuit board; the first package portion of the heat dissipation unit is electrically connected to the circuit board via a first connecting line, and the heat source unit is electrically connected to the circuit board via a third connecting point.

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