Semiconductor heating device with cooling function and use method thereof

Abstract

The invention discloses a semiconductor heating device with a cooling function and a use method thereof, and relates to the technical field of semiconductor processing. According to the semiconductor heating device with the cooling function and the using method thereof, the semiconductor heating device comprises a base, a shell is fixedly installed at the top of the base, a shaking limiting assembly is arranged in the shell, a cooling assembly is arranged on one side of the shell, and a circulating assembly is arranged in the shell; the shaking limiting assembly comprises a vibration motor fixedly installed on the inner bottom wall of the shell. According to the device, the shaking limiting assembly and the cooling assembly are arranged, so that when the semiconductor wafer is placed and heated, the semiconductor wafer can be extruded and laminated synchronously, meanwhile, the device can be started and cooled at the same time, and after cooling is completed, the limiting operation can be canceled, so that the situation that multi-step operation needs to be carried out in the using process is avoided, and the working efficiency is improved. And meanwhile, the use convenience of the device is improved, subsequent use is facilitated, and the use convenience of the device is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, specifically to a semiconductor heating device with cooling function and its usage method. Background Technology

[0002] Semiconductor technology refers to various semiconductor processing techniques, including wafer growth, thin film deposition, photolithography, etching, doping, and process integration. It's the technology of using semiconductors as materials to fabricate components and integrated circuits. Elements in the periodic table can be broadly classified into three categories based on their conductivity: conductors, semiconductors, and insulators. The most common semiconductor is silicon (Si). While semiconductors can also be compounds of two elements, such as GaAs, compound semiconductors are mostly used in optoelectronics. The vast majority of electronic components are made with silicon as the substrate; therefore, the electronics industry is also known as the semiconductor industry. The largest application of semiconductor technology is integrated circuits (ICs). ICs are present in computers, mobile phones, and various electrical appliances and information products. They are used to perform various control functions, much like the brain and nerves in the human body. Processing semiconductors requires heating, necessitating the use of semiconductor heating devices and methods.

[0003] However, current semiconductor heating devices on the market cannot simultaneously perform compression and bonding operations when placing and heating semiconductor wafers, nor can they remove the limiting operation after cooling is completed when the device is turned on. This affects the ease of use of the heating device and subsequent heating and cooling operations. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor heating device with a cooling function and a method of using it, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor heating device with a cooling function, comprising a base, a housing fixedly mounted on the top of the base, a sway limiting component disposed inside the housing, a cooling component disposed on one side of the housing, and a circulation component disposed inside the housing.

[0006] The sway limiting assembly includes a vibration motor fixedly installed on the bottom wall of the housing. The output shaft of the vibration motor is provided with a rotating disk. A heating wire is embedded in the inner bottom wall of the rotating disk. A cover plate is provided inside the rotating disk. Cavities are opened on both sides of the upper surface of the rotating disk. Piston tubes are fixedly installed on both sides of the rotating disk. A piston plate is slidably connected inside the piston tube. A push rod is fixedly installed on one side of the piston plate. One end of the push rod passes through the cavity and extends to the inside of the cavity where a sliding plate is fixedly installed. A touch switch is fixedly installed on one side of the inner wall of the cavity. An electric push rod is fixedly installed on the top of the sliding plate. A connecting plate is fixedly installed on the top of the electric push rod. A connecting rod is fixedly installed on the bottom of the connecting plate. A cooling disk is provided in the inner cavity of the rotating disk. Slide rails are fixedly installed on both sides of the top of the cooling disk. A slider is slidably connected inside the slide rail. The top of the slider is fixedly connected to the bottom of the connecting rod.

[0007] The wobbling limit component can limit the movement of the semiconductor wafer during use, and also facilitates its contact with the heating cover plate. This improves the heating efficiency of the device and facilitates subsequent operations.

[0008] The circulation assembly includes a transmission pipe fixedly installed inside the housing. One end of the transmission pipe is connected to an inlet pipe and an outlet pipe, and one end of the inlet pipe and the outlet pipe are respectively connected to the top of the cooling plate.

[0009] The device is equipped with a circulation component, which facilitates the circulation of the coolant during use. This improves the cooling efficiency of the device, makes it easier to use, and enhances its usability.

[0010] Preferably, a positioning tube is fitted onto the output shaft of the vibration motor, the top of the positioning tube is fixedly connected to the bottom of the rotating disk, a screw is inserted into one side of the positioning tube, one end of the screw passes through the positioning tube and is threaded to the surface of the output shaft, a groove is provided on the cover plate, a screw is inserted into the groove, and the bottom of the screw is threaded to the inner bottom wall of the rotating disk.

[0011] The positioning tube and screw facilitate the fixed connection between the rotating disc and the output shaft of the vibration motor during use, thereby simplifying subsequent installation and disassembly operations, improving the ease of use and efficiency of the device.

[0012] Preferably, a cooling box is provided in the middle of the transmission pipe, the transmission pipe passes through the cooling box, and solenoid valves are connected to the surface of the transmission pipe and on both sides of the cooling box. One-way valves are connected to the inlet pipe and the outlet pipe near the top of the cooling plate.

[0013] The cooling box facilitates connection and cooling operations during use, and also makes it convenient to cool the liquid inside the cooling box later, thus facilitating the cooling of the corresponding medicine.

[0014] Preferably, the top of the cooling box is connected to a liquid inlet pipe, the top of the liquid inlet pipe is threaded with a sealing cap, the surface of the sealing cap is fixedly installed with an anti-slip strip, the surface of the anti-slip strip is provided with anti-slip texture, and the bottom of the cooling box is connected to a cleaning pipe, one end of the cleaning pipe penetrates the shell and extends to the outside of the shell.

[0015] The sealed cover allows for easy addition of medicine or other liquids to the cooling box during use, while the cleaning tube facilitates cleaning of the cooling box, thus improving the ease of use of the device.

[0016] Preferably, one end of each of the two piston tubes is connected by a semi-circular hydraulic tube, and one end of the semi-circular hydraulic tube is connected to a hydraulic connecting tube, one end of which penetrates the housing and extends to the outside of the housing.

[0017] The semi-circular hydraulic pipe and hydraulic connecting pipe facilitate the internal pressurization of the piston tube during use, thereby improving the ease of use of the device and simplifying subsequent operations.

[0018] Preferably, the cooling and heat-reducing assembly includes a cooling box fixedly installed on one side of the housing, one end of a transmission pipe passing through the housing and extending to the outside of the housing and communicating with one side of the cooling box, a water pump being connected to one side of the cooling box, the outlet of the water pump being connected to a circulation pipe, one end of the circulation pipe passing through the housing and extending to the inside of the housing and communicating with the other end of the transmission pipe.

[0019] Preferably, a semiconductor refrigeration chip is inserted into one side of the cooling box, one end of which penetrates through the cooling box and extends into the interior of the cooling box to fit against one side of the cooling box. A flow sensor is fixedly installed on the top of the semiconductor refrigeration chip at the port of the transmission pipe.

[0020] The semiconductor cooling chip facilitates the cooling of the liquid after heat exchange during use, thus making it easier to cool the liquid during subsequent use.

[0021] Preferably, a stud is inserted at one end of the semiconductor cooling chip outside the cooling box, and one end of the stud is fixedly connected to one side of the cooling box. An anti-slip ring and a nut are sequentially fitted on the surface of the stud. One side of the anti-slip ring is in contact with one side of the cooling box, and one side of the nut is in contact with one side of the anti-slip ring.

[0022] By incorporating a shaking limit component and a cooling component, the semiconductor wafer can be simultaneously pressed and bonded while being placed and heated. Simultaneously, the wafer can be cooled while the device is activated, and the limit operation can be canceled after cooling is complete. This avoids the need for multiple steps during use, improving the ease of use of the device and facilitating subsequent applications.

[0023] Preferably, an inspection door is hinged to the front surface of the housing, a PLC controller is fixedly installed on the front surface of the inspection door, a handle is fixedly installed on one side of the inspection door, the surface of the handle is provided with anti-slip texture, and the vibration motor, heating wire, electric push rod, water pump, flow sensor and semiconductor cooling chip are electrically connected to the PLC controller respectively.

[0024] A PLC controller is a digital electronic system designed for industrial applications. It uses a programmable memory to store instructions for performing logical operations, sequential control, timing, counting, and arithmetic operations. Through digital and analog inputs and outputs, it controls various types of machinery or production processes. The working principle of a PLC controller can be summarized as: centralized sampling, centralized output, and periodic cyclic scanning.

[0025] 1. Centralized sampling

[0026] The on / off status of all input terminals is read sequentially, and the read information is stored in the input image register. At this time, the input image register is refreshed. Since the PLC uses centralized sampling, even if the input changes during the program processing stage, the content in the input image register will not change until the input sampling stage of the next cycle.

[0027] 2. Periodic cyclic scanning

[0028] PLCs operate in a continuously looping sequential scanning mode. The time taken for each scan is called the scan cycle or working cycle. The ladder diagram program is scanned line by line in a top-to-bottom, left-to-right sequence, and logical operations are performed based on the results sampled in the input image registers. The results of the operations are then stored in the relevant image registers.

[0029] If a program jump instruction is encountered, the jump address is determined based on whether the jump condition is met. Since the PLC operates serially, the PLC's execution result depends on the order of the ladder diagram.

[0030] 3. Centralized output

[0031] After timing processing is complete, the state of each point in all output image registers is transferred to the output latch, and then the external load is driven through the output terminal.

[0032] Fold this section to edit the output format

[0033] 1. Relay output: Relay output has a slow response speed and a large output current, generally reaching 2A, but the contact life is short and the output frequency is low, with a maximum of 1HZ.

[0034] 2. Transistor output: Transistor output has a fast response speed, low output current, long contact life, and a very high output frequency, which can reach 10kHz.

[0035] 3. Analog output, typically 0-20mA current signal, 4-20mA current signal, 0-5V voltage signal, 0-10V voltage signal, etc.

[0036] A method for using a semiconductor heating device with a cooling function is as follows:

[0037] S1. Open the maintenance door, then the PLC controller controls the electric push rod to extend, and at the same time, the hydraulic oil is drawn out from the inside of the semi-circular hydraulic pipe. Then the piston plate will drive the slide plate on the push rod to move, so that the slider is located on both sides of the two slide rails. At this time, the cooling plate and the rotating plate are separated.

[0038] S2. Then, the semiconductor material to be heated can be placed on the cover plate inside the rotating disk. At the same time, the maintenance door can be closed and the PLC controller can be controlled. At this time, the hydraulic oil will be squeezed from the inside of the semi-circular hydraulic pipe, and the slide plate will squeeze the touch switch, thereby causing the touch switch to control the electric push rod to retract. This causes the connecting plate and connecting rod on the electric push rod to squeeze the slider, thereby causing the slide rail to squeeze the cooling plate downward, thus facilitating the limiting operation of the semiconductor material. At the same time, the heating wire works to heat it.

[0039] S3. While heating, the water pump works to drive the liquid in the cooling box through the circulation pipe into the interior of the transmission pipe. At this time, the liquid in the cooling box can be water-cooled. When the solenoid valve on the transmission pipe is closed, the liquid will enter the interior of the inlet pipe and then be discharged from the outlet pipe through the cooling plate into the other end of the transmission pipe.

[0040] S4. When water in the transmission pipe enters the cooling box, the flow sensor senses the water flow, and the PLC controller controls the semiconductor cooling chip to work. The hot water passing through the semiconductor cooling chip is cooled. At the same time, the water pump works and sends water through the circulation pipe into the interior of the transmission pipe for circulation cooling.

[0041] Compared with the prior art, the beneficial effects of the present invention are:

[0042] (1) This semiconductor heating device with cooling function can simultaneously squeeze and bond the semiconductor wafer when it is placed and heated by the set shaking limit component and cooling cooling component. At the same time, it can cool the wafer while the device is turned on. After the cooling is completed, the limit operation can be canceled, thereby avoiding the need for multiple steps in the process of use. It also improves the ease of use of the device and facilitates subsequent use.

[0043] (2) This semiconductor heating device with cooling function, by setting up a circulation component, facilitates the circulation of cooling liquid during use, thereby facilitating subsequent circulation and cooling operations, improving the cooling efficiency of the device, and making it easier to use.

[0044] (3) This semiconductor heating device with cooling function can limit the semiconductor wafer during use by setting a shaking limiting component, and also facilitate its contact with the heating cover plate, thereby improving the heating efficiency of the device during subsequent use and facilitating subsequent operation. Attached Figure Description

[0045] Figure 1 This is a first-view three-dimensional structural diagram of the present invention;

[0046] Figure 2 This is a second-view three-dimensional structural diagram of the present invention;

[0047] Figure 3 This is a schematic diagram of the third-view three-dimensional structure of the present invention;

[0048] Figure 4 This is a first-view three-dimensional structural diagram of the present invention;

[0049] Figure 5 This is a second-view three-dimensional structural diagram of the present invention;

[0050] Figure 6 For the present invention Figure 1 Enlarged schematic diagram of the structure at point A in the middle;

[0051] Figure 7 For the present invention Figure 2 Enlarged schematic diagram of the structure at point B;

[0052] Figure 8 For the present invention Figure 3 Enlarged schematic diagram of the structure at point C;

[0053] Figure 9 For the present invention Figure 4 Enlarged schematic diagram of the structure at point D.

[0054] In the diagram: 1. Base; 2. Housing; 3. Shaking limit assembly; 300. Vibration motor; 301. Rotary disc; 302. Heating wire; 303. Cover plate; 304. Piston tube; 305. Piston plate; 306. Push rod; 307. Slide plate; 308. Touch switch; 309. Electric push rod; 310. Connecting plate; 311. Connecting rod; 312. Cooling plate; 313. Slide rail; 314. Slider; 315. Semi-circular hydraulic pipe; 316. Hydraulic connection. 317. Connector; 4. Screw; 5. Cooling assembly; 6. Cooling box; 7. Water pump; 8. Circulation pipe; 9. Semiconductor cooling chip; 10. Flow sensor; 11. Stud; 12. Anti-slip ring; 13. Nut; 14. Circulation assembly; 15. Transmission pipe; 16. Inlet pipe; 17. Outlet pipe; 18. Cooling box; 19. Liquid inlet pipe; 20. Cleaning pipe; 20. Inspection door; 21. PLC controller. Detailed Implementation

[0055] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0056] Please see Figures 1-9 The present invention provides a technical solution: a semiconductor heating device with cooling function, including a base 1, a housing 2 fixedly installed on the top of the base 1, a shaking limiting component 3 provided inside the housing 2, a cooling component 4 provided on one side of the housing 2, and a circulation component 5 provided inside the housing 2.

[0057] The swaying limiting assembly 3 includes a vibration motor 300 fixedly installed on the bottom wall of the housing 2. The output shaft of the vibration motor 300 is provided with a rotating disk 301. A heating wire 302 is embedded in the inner bottom wall of the rotating disk 301. A cover plate 303 is provided inside the rotating disk 301. Cavities are formed on both sides of the upper surface of the rotating disk 301. Piston tubes 304 are fixedly installed on both sides of the rotating disk 301. A piston plate 305 is slidably connected inside the piston tube 304. A push rod 306 is fixedly installed on one side of the piston plate 305. One end of the push rod 306 passes through the cavity and... A slide plate 307 is fixedly installed inside the cavity. A touch switch 308 is fixedly installed on one side of the inner wall of the cavity. An electric push rod 309 is fixedly installed on the top of the slide plate 307. A connecting plate 310 is fixedly installed on the top of the electric push rod 309. A connecting rod 311 is fixedly installed on the bottom of the connecting plate 310. A cooling plate 312 is provided in the inner cavity of the rotating disk 301. Slide rails 313 are fixedly installed on both sides of the top of the cooling plate 312. A slider 314 is slidably connected inside the slide rails 313. The top of the slider 314 is fixedly connected to the bottom of the connecting rod 311.

[0058] The sway limiting component 3 can limit the movement of the semiconductor wafer during use, and also facilitates its contact with the heating cover plate 303. This improves the heating efficiency of the device and facilitates subsequent operation.

[0059] The circulation assembly 5 includes a transmission pipe 500 fixedly installed inside the housing 2. One end of the transmission pipe 500 is connected to an inlet pipe 501 and an outlet pipe 502. One end of the inlet pipe 501 and the outlet pipe 502 are respectively connected to the top of the cooling plate 312.

[0060] The circulation component 5 is set up to facilitate the circulation of the cooling liquid during use, thereby improving the cooling efficiency of the device and making it easier to use.

[0061] Please see Figure 3 A positioning tube 312 is fitted onto the output shaft of the vibration motor 300. The top of the positioning tube 312 is fixedly connected to the bottom of the rotating disk 301. A screw 317 is inserted into one side of the positioning tube 312. One end of the screw 317 passes through the positioning tube 312 and is threaded to the surface of the output shaft. A groove is provided on the cover plate 303. A screw 318 is inserted into the groove. The bottom of the screw 318 is threaded to the inner bottom wall of the rotating disk 301. The positioning tube 312 and the screw 317 facilitate the fixed connection between the rotating disk 301 and the output shaft of the vibration motor 300 during use, thereby facilitating subsequent installation and disassembly operations, improving the ease of use and efficiency of the device.

[0062] Please see Figure 2 A cooling box 503 is provided in the middle of the transmission pipe 500. The transmission pipe 500 passes through the cooling box 503. Solenoid valves are connected to the surface of the transmission pipe 500 and on both sides of the cooling box 503. One-way valves are connected to the inlet pipe 501 and the outlet pipe 502 near the top of the cooling plate 312. The cooling box 503 is provided to facilitate the connection and cooling operation during use, and also to facilitate the cooling operation of the liquid in the cooling box 503 during subsequent use, which is convenient for the subsequent cooling operation of the corresponding medicine.

[0063] Please see Figure 5 The top of the cooling box 503 is connected to a liquid inlet pipe 504, and the top of the liquid inlet pipe 504 is threaded with a sealing cap. The surface of the sealing cap is fixedly installed with an anti-slip strip, and the surface of the anti-slip strip has anti-slip texture. The bottom of the cooling box 503 is connected to a cleaning pipe 505, one end of which penetrates the housing 2 and extends to the outside of the housing 2. The sealing cap facilitates the addition of medicine or other liquids to the inside of the cooling box 503 during use. At the same time, the cleaning pipe 505 facilitates the cleaning operation inside the cooling box 503, thereby improving the ease of use of the device.

[0064] Please see Figure 3 One end of each of the two piston tubes 304 is connected by a semi-circular hydraulic tube 315, and one end of the semi-circular hydraulic tube 315 is connected to a hydraulic connecting tube 316. One end of the hydraulic connecting tube 316 passes through the housing 2 and extends to the outside of the housing 2. The semi-circular hydraulic tube 315 and the hydraulic connecting tube 316 facilitate the internal pressurization of the piston tubes 304 during use, thereby improving the ease of use of the device and facilitating subsequent operations.

[0065] Please see Figure 5 The cooling and heat-reducing assembly 4 includes a cooling box 400 fixedly installed on one side of the housing 2. One end of the transmission pipe 500 passes through the housing 2 and extends to the outside of the housing 2, communicating with one side of the cooling box 400. A water pump 401 is connected to one side of the cooling box 400. The outlet of the water pump 401 is connected to a circulation pipe 402. One end of the circulation pipe 402 passes through the housing 2 and extends to the inside of the housing 2, communicating with the other end of the transmission pipe 500.

[0066] Please see Figure 5A semiconductor cooling chip 403 is inserted into one side of the cooling box 400. One end of the semiconductor cooling chip 403 passes through the cooling box 400 and extends into the interior of the cooling box 400, fitting against one side of the cooling box 400. A flow sensor 404 is fixedly installed at the top of the semiconductor cooling chip 403 corresponding to the opening of the transmission pipe 500. The semiconductor cooling chip 403 facilitates the cooling of the liquid after heat exchange during use, thus facilitating subsequent cooling operations.

[0067] Please see Figure 9 A stud 405 is inserted into one end of the semiconductor cooling chip 403 located outside the cooling chamber 400. One end of the stud 405 is fixedly connected to one side of the cooling chamber 400. An anti-slip ring 406 and a nut 407 are sequentially fitted onto the surface of the stud 405. One side of the anti-slip ring 406 is in contact with one side of the cooling chamber 400, and one side of the nut 407 is in contact with one side of the anti-slip ring 406. The sway limiting component 3 and the cooling component 4 can simultaneously squeeze and adhere the semiconductor chip when it is placed and heated. At the same time, the device can be cooled while it is turned on. After cooling is completed, the limiting operation can be canceled, thus avoiding the need for multiple steps during use and improving the ease of use of the device.

[0068] Please see Figure 4 The front surface of the housing 2 is hinged to an inspection door 6. A PLC controller 7 is fixedly installed on the front surface of the inspection door 6. A handle is fixedly installed on one side of the inspection door 6. The surface of the handle has anti-slip texture. The vibration motor 300, heating wire 302, electric push rod 309, water pump 401, flow sensor 404 and semiconductor cooling chip 403 are electrically connected to the PLC controller 7. The PLC controller 7 is a digital computing electronic system designed for industrial applications. It uses a programmable memory to store operation instructions for performing logic operations, sequential control, timing, counting and arithmetic operations. It controls various types of machinery or production processes through digital and analog inputs and outputs. The working principle of the PLC controller 7 can be briefly described as: centralized sampling, centralized output and periodic cyclic scanning.

[0069] 1. Centralized sampling

[0070] The on / off status of all input terminals is read sequentially, and the read information is stored in the input image register. At this time, the input image register is refreshed. Since the PLC uses centralized sampling, even if the input changes during the program processing stage, the content in the input image register will not change until the input sampling stage of the next cycle.

[0071] 2. Periodic cyclic scanning

[0072] PLCs operate in a continuously looping sequential scanning mode. The time taken for each scan is called the scan cycle or working cycle. The ladder diagram program is scanned line by line in a top-to-bottom, left-to-right sequence, and logical operations are performed based on the results sampled in the input image registers. The results of the operations are then stored in the relevant image registers.

[0073] If a program jump instruction is encountered, the jump address is determined based on whether the jump condition is met. Since the PLC operates serially, the PLC's execution result depends on the order of the ladder diagram.

[0074] 3. Centralized output

[0075] After timing processing is complete, the state of each point in all output image registers is transferred to the output latch, and then the external load is driven through the output terminal.

[0076] Fold this section to edit the output format

[0077] 1. Relay output: Relay output has a slow response speed and a large output current, generally reaching 2A, but the contact life is short and the output frequency is low, with a maximum of 1HZ.

[0078] 2. Transistor output: Transistor output has a fast response speed, low output current, long contact life, and a very high output frequency, which can reach 10kHz.

[0079] 3. Analog output, typically 0-20mA current signal, 4-20mA current signal, 0-5V voltage signal, 0-10V voltage signal, etc.

[0080] A method for using a semiconductor heating device with a cooling function is as follows:

[0081] S1. Open the maintenance door 6, then the PLC controller 7 controls the electric push rod 309 to extend, and at the same time, the hydraulic oil is drawn out from the inside of the semi-circular hydraulic pipe 315. Then the piston plate 305 will drive the slide plate 307 on the push rod 306 to move, so that the slider 314 is located on both sides of the two slide rails 313. At this time, the cooling plate 312 is separated from the rotating plate 301.

[0082] S2. Then, the semiconductor material to be heated can be placed on the cover plate 303 inside the rotating disk 301. At the same time, the maintenance door 6 can be closed and the PLC controller 7 can be controlled. At this time, the hydraulic oil will be squeezed from the inside of the semi-circular hydraulic pipe 315, and the slide plate 307 will squeeze the touch switch 308, so that the touch switch 308 controls the electric push rod 309 to retract, thereby causing the connecting plate 310 and connecting rod 311 on the electric push rod 309 to squeeze the slider 314, thereby causing the slide rail 313 to squeeze the cooling disk 312 downward, thus facilitating the limiting operation of the semiconductor material. At the same time, the heating wire 302 works to heat.

[0083] S3. While heating, the water pump 401 works to drive the liquid in the cooling box 400 through the circulation pipe 402 into the interior of the transmission pipe 500. At this time, the liquid in the cooling box 503 can be water-cooled. When the solenoid valve on the transmission pipe 500 is closed, the liquid will enter the interior of the inlet pipe 501 and then be discharged from the outlet pipe 502 through the cooling plate 312 into the other end of the transmission pipe 500.

[0084] S4. When the water in the transmission pipe 500 enters the cooling box 400, the flow sensor 404 senses the water flow, and the PLC controller 7 controls the semiconductor cooling chip 403 to work. The hot water through the semiconductor cooling chip 403 is cooled. At the same time, the water pump 401 works and sends water through the circulation pipe 402 into the interior of the transmission pipe 500 for circulation cooling.

[0085] Working principle: When in use, the maintenance door 6 is opened, and then the PLC controller 7 controls the electric push rod 309 to extend, while the hydraulic oil is drawn out from the inside of the semi-circular hydraulic pipe 315. Then the piston plate 305 will drive the slide plate 307 on the push rod 306 to move, so that the slider 314 is located on both sides of the two slide rails 313. At this time, the cooling plate 312 is separated from the rotating plate 301.

[0086] The semiconductor material to be heated can then be placed on the cover plate 303 inside the rotating disk 301. At the same time, the maintenance door 6 can be closed and the PLC controller 7 can be controlled. At this time, hydraulic oil will be squeezed from the inside of the semi-circular hydraulic pipe 315, and the slide plate 307 will squeeze the touch switch 308, thereby causing the touch switch 308 to control the electric push rod 309 to retract. This causes the connecting plate 310 and connecting rod 311 on the electric push rod 309 to squeeze the slider 314, thereby causing the slide rail 313 to squeeze the cooling disk 312 downward, thus facilitating the limiting operation of the semiconductor material. At the same time, the heating wire 302 works to heat the material.

[0087] While heating, the water pump 401 works to drive the liquid in the cooling box 400 through the circulation pipe 402 into the transmission pipe 500. At this time, the liquid in the cooling box 503 can be water-cooled. When the solenoid valve on the transmission pipe 500 is closed, the liquid will enter the inlet pipe 501 and then be discharged from the outlet pipe 502 through the cooling plate 312 into the other end of the transmission pipe 500.

[0088] When water in the transmission pipe 500 enters the cooling box 400, the flow sensor 404 senses the water flow, and the PLC controller 7 controls the semiconductor cooling chip 403 to work. The hot water through the semiconductor cooling chip 403 is cooled. At the same time, the water pump 401 works and sends water through the circulation pipe 402 into the interior of the transmission pipe 500 for circulation cooling.

[0089] All standard parts used in this invention can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here. The contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0090] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the spirit of the invention, such designs should fall within the protection scope of the present invention.

Claims

1. A semiconductor heating device with a cooling function, comprising a base (1), wherein a housing (2) is fixedly mounted on the top of the base (1), characterized in that: The shell (2) is provided with a shaking limiting component (3), a cooling component (4) is provided on one side of the shell (2), and a circulation component (5) is provided inside the shell (2). The sway limiting assembly (3) includes a vibration motor (300) fixedly installed on the bottom wall of the housing (2). The output shaft of the vibration motor (300) is provided with a rotating disk (301). A heating wire (302) is embedded in the bottom wall of the rotating disk (301). A cover plate (303) is provided inside the rotating disk (301). Cavities are provided on both sides of the upper surface of the rotating disk (301). A piston tube (304) is fixedly installed on both sides of the rotating disk (301). A piston plate (305) is slidably connected inside the piston tube (304). A push rod (306) is fixedly installed on one side of the piston plate (305). One end of the push rod (306) passes through the cavity. A slide plate (307) is fixedly installed inside the body and extends into the cavity. A touch switch (308) is fixedly installed on one side of the inner wall of the cavity. An electric push rod (309) is fixedly installed on the top of the slide plate (307). A connecting plate (310) is fixedly installed on the top of the electric push rod (309). A connecting rod (311) is fixedly installed on the bottom of the connecting plate (310). A cooling plate (312) is provided in the inner cavity of the rotating disk (301). Slide rails (313) are fixedly installed on both sides of the top of the cooling plate (312). A slider (314) is slidably connected inside the slide rail (313). The top of the slider (314) is fixedly connected to the bottom of the connecting rod (311). The circulation component (5) includes a transmission pipe (500) fixedly installed inside the housing (2). One end of the transmission pipe (500) is connected to an inlet pipe (501) and an outlet pipe (502). One end of the inlet pipe (501) and the outlet pipe (502) are respectively connected to the top of the cooling plate (312).

2. A semiconductor heating device with cooling function according to claim 1, characterized in that: A positioning tube (312) is fitted onto the output shaft of the vibration motor (300). The top of the positioning tube (312) is fixedly connected to the bottom of the rotating disk (301). A screw (317) is inserted into one side of the positioning tube (312). One end of the screw (317) passes through the positioning tube (312) and is threaded to the surface of the output shaft. A groove is provided on the cover plate (303). A screw (318) is inserted into the groove. The bottom of the screw (318) is threaded to the inner bottom wall of the rotating disk (301).

3. A semiconductor heating device with cooling function according to claim 1, characterized in that: A cooling box (503) is provided in the middle of the transmission pipe (500). The transmission pipe (500) passes through the cooling box (503). Solenoid valves are connected to the surface of the transmission pipe (500) and both sides of the cooling box (503). One-way valves are connected to the water inlet pipe (501) and the water outlet pipe (502) near the top of the cooling plate (312).

4. A semiconductor heating device with cooling function according to claim 3, characterized in that: The top of the cooling box (503) is connected to an inlet pipe (504), and the top of the inlet pipe (504) is threaded with a sealing cap. An anti-slip strip is fixedly installed on the surface of the sealing cap, and the surface of the anti-slip strip is provided with anti-slip texture. The bottom of the cooling box (503) is connected to a cleaning pipe (505), and one end of the cleaning pipe (505) penetrates the housing (2) and extends to the outside of the housing (2).

5. A semiconductor heating device with cooling function according to claim 1, characterized in that: One end of each of the two piston tubes (304) is connected by a semi-circular hydraulic tube (315), and one end of the semi-circular hydraulic tube (315) is connected to a hydraulic connecting tube (316). One end of the hydraulic connecting tube (316) passes through the housing (2) and extends to the outside of the housing (2).

6. A semiconductor heating device with cooling function according to claim 1, characterized in that: The cooling and heat-reducing assembly (4) includes a cooling box (400) fixedly installed on one side of the housing (2). One end of the transmission pipe (500) passes through the housing (2) and extends to the outside of the housing (2) and communicates with one side of the cooling box (400). A water pump (401) is connected to one side of the cooling box (400). The outlet of the water pump (401) is connected to a circulation pipe (402). One end of the circulation pipe (402) passes through the housing (2) and extends to the inside of the housing (2) and communicates with the other end of the transmission pipe (500).

7. A semiconductor heating device with cooling function according to claim 6, characterized in that: A semiconductor refrigeration chip (403) is inserted into one side of the cooling box (400). One end of the semiconductor refrigeration chip (403) passes through the cooling box (400) and extends into the interior of the cooling box (400) to fit against one side of the cooling box (400). A flow sensor (404) is fixedly installed at the top of the semiconductor refrigeration chip (403) corresponding to the opening of the transmission pipe (500).

8. A semiconductor heating device with cooling function according to claim 1, characterized in that: The semiconductor cooling chip (403) is fitted with a stud (405) at one end outside the cooling box (400). One end of the stud (405) is fixedly connected to one side of the cooling box (400). An anti-slip ring (406) and a nut (407) are sequentially fitted on the surface of the stud (405). One side of the anti-slip ring (406) is in contact with one side of the cooling box (400), and one side of the nut (407) is in contact with one side of the anti-slip ring (406).

9. A semiconductor heating device with cooling function according to claim 1, characterized in that: The front surface of the housing (2) is hinged with an inspection door (6). A PLC controller (7) is fixedly installed on the front surface of the inspection door (6). A handle is fixedly installed on one side of the inspection door (6). The surface of the handle is provided with anti-slip texture. The vibration motor (300), heating wire (302), electric push rod (309), water pump (401), flow sensor (404), and semiconductor cooling chip (403) are electrically connected to the PLC controller (7).

10. A method of using a semiconductor heating device with cooling function according to any one of claims 1-9, wherein the specific method of use is as follows: S1. Open the maintenance door (6), and then the PLC controller (7) controls the electric push rod (309) to extend, while the hydraulic oil is drawn out from the inside of the semi-circular hydraulic pipe (315). Then the piston plate (305) will drive the slide plate (307) on the push rod (306) to move, so that the slider (314) is located on both sides of the two slide rails (313). At this time, the cooling plate (312) is separated from the rotating plate (301). S2. Then the semiconductor material to be heated can be placed on the cover plate (303) inside the rotating disk (301), and the maintenance door (6) can be closed at the same time. The PLC controller (7) is controlled. At this time, the hydraulic oil will be squeezed from the inside of the semi-circular hydraulic pipe (315), and the slide plate (307) will squeeze the touch switch (308), so that the touch switch (308) controls the electric push rod (309) to retract, so that the connecting plate (310) and connecting rod (311) on the electric push rod (309) will squeeze the slider (314), so that the slide rail (313) will squeeze the cooling plate (312) downward, thus facilitating the limiting operation of the semiconductor material. At the same time, the heating wire (302) will work to heat it. S3. While heating, the water pump (401) works to drive the liquid in the cooling box (400) through the circulation pipe (402) into the interior of the transmission pipe (500). At this time, the liquid in the cooling box (503) can be water-cooled. When the solenoid valve on the transmission pipe (500) is closed, the liquid will enter the interior of the inlet pipe (501) and then be discharged from the outlet pipe (502) through the cooling plate (312) into the other end of the transmission pipe (500). S4. When the water in the transmission pipe (500) enters the cooling box (400), the flow sensor (404) senses the water flow, and the PLC controller (7) controls the semiconductor cooling chip (403) to work. The hot water through the semiconductor cooling chip (403) is cooled. At the same time, the water pump (401) works and sends water through the circulation pipe (402) into the transmission pipe (500) for circulation cooling.

Images