A thermal compression bonding chip peeling step-by-step top block mechanism

Abstract

The present application relates to the field of semiconductor device packaging, in particular to a hot-press bonding chip peeling step-by-step top block mechanism, which solves the problems of successful peeling of thin chips and cracking and fragmentation damage in the peeling process. The hot-press bonding chip peeling step-by-step top block mechanism comprises a top block sleeve, a top plate and a step-by-step top block assembly; the step-by-step top block assembly comprises a spring seat, a guide pin, a guide seat, an outer ring lifting piece, a middle ring lifting piece and an inner ring lifting piece; the top of the inner ring lifting piece, the middle ring lifting piece and the outer ring lifting piece are uniformly provided with staggered convex parts and concave parts. The hot-press bonding chip peeling step-by-step top block mechanism can sequentially lift out the outer ring top block, the middle top block and the inner ring top block, which can successfully realize chip peeling and greatly reduce the damage rate of chips in the peeling process. For thin chips with a thickness of less than or equal to 30 microns, the step-by-step top block mechanism is particularly important.

Description

TECHNICAL FIELD

[0001] The application belongs to the field of semiconductor device packaging, and relates to a hot-press bonding device, in particular to a hot-press bonding chip peeling step-by-step top block mechanism. BACKGROUND

[0002] The hot-press bonding process belongs to a flip chip bonding process, which is different from the traditional flip chip bonding process. The hot-press bonding process does not need a batch reflow soldering process after the chip bonding process is completed. In the bonding process, the temperature and the pressure need to be monitored and adjusted in real time, and the temperature, the pressure and the position of the bonding head need to be adjusted according to the bonding process.

[0003] The traditional flip chip bonding process is to dip the chip soldering point in flux or distribute the flux on the substrate, then visually align the chip and place it on the substrate pad, and then realize the interconnection of the two through reflow soldering. With the development of the light and thin size of the chip and the substrate, the micro-contraction of the bump size and pitch, the chip or the substrate may be warped in the process of reflow soldering, and the chip may not be accurately mounted due to the warping. The hot-press bonding process controls the pressure and temperature applied to the chip and the substrate through the bonding head and the base, thereby avoiding the warping problem.

[0004] Specifically, the hot-press bonding process flow is as follows: first, dip the interconnection bump of the chip in flux to a certain depth, align the chip through vision, and press the chip on the corresponding soldering position of the wafer through the bonding head, and at the same time, the temperature of the bonding head is raised to above the melting point of the solder. The bonding head applies pressure to the chip, and after reaching the descending position, the temperature is rapidly lowered to below the melting point of the solder. When the temperature decreases to the set value, the bonding head is lifted, and the bonding process is completed. In the hot-press bonding process, the temperature rising and falling rate is usually more than 100℃ / s, compared with the traditional reflow soldering process, the temperature rising rate is less than 2℃ / s.

[0005] Hot-press bonding action flow: through the chip peeling, chip turning, flux dipping, visual detection, visual alignment and hot-pressing work stations, the chip with bumps is welded to the wafer, and multi-layer stacking alignment welding is realized. Chip peeling is the first action link, which mainly completes the peeling of the chip from the blue film, and the turning mechanism adsorbs the peeled chip to the flux dipping station. There are two ways of chip peeling: for thicker chips, a thimble peeling method is used; for thin chips with a thickness of less than or equal to 50 microns, the thimble peeling method may cause chip cracking and fragmentation damage. Therefore, there is an urgent need for a peeling solution that can peel thin chips and avoid chip cracking and fragmentation damage during the peeling process. SUMMARY

[0006] In order to solve the problems of successful peeling of thin chips and cracking and fragmentation damage in the peeling process, the application provides a hot-press bonding chip peeling step-by-step top block mechanism, which can improve the peeling success rate of thin chips and reduce the damage rate in the chip peeling process.

[0007] The application is implemented by adopting the following technical scheme: a hot-press bonding chip peeling step-by-step top block mechanism, comprising: a top block sleeve;

[0008] A top plate is fixedly installed at the top end of the top block sleeve, the center of the top plate is provided with a top block corresponding hole, and a suction hole is formed around the top block corresponding hole;

[0009] A step-by-step top block assembly is located inside the top block sleeve and has a gap with the inner wall of the top block sleeve, and the bottom is supported by a lifting mechanism to realize step-by-step jacking;

[0010] The step-by-step top block assembly comprises:

[0011] A spring seat is horizontally extended outward at the bottom to form a first spring limiting seat;

[0012] A guide pin is vertically fixed at the top of the spring seat;

[0013] A guide seat is located above the spring seat, the guide seat is an internally-through structure, the bottom port of the guide seat is horizontally extended inward to form a limiting base, the top port is horizontally extended outward to form a second spring limiting seat, and the second spring limiting seat is provided with a guide through hole matched with the guide pin;

[0014] An outer ring jacking piece is located above the guide seat and is an internally-through structure, the side wall of the outer ring jacking piece is provided with a guide hole matched with the guide pin from the bottom to the top, the outer side wall of the middle part of the outer ring jacking piece is extended outward to form a third spring limiting seat, and the inner side wall of the middle part of the outer ring jacking piece is extended inward to form an outer ring inner side limiting table; the outer contour of the top of the outer ring jacking piece is in a convex structure, a first cavity is formed between the top of the convex structure and the bottom surface of the top plate, the center of the convex structure can be extended out of the corresponding hole of the top plate, and the middle horizontal section of the convex structure can abut against the lower surface of the top plate; a second cavity is formed between the bottom of the convex structure and the outer ring inner side limiting table; the guide pin passes through the guide through hole and extends into the guide hole of the outer ring jacking piece;

[0015] The middle ring lifting piece is internally through from top to bottom and is fixedly connected with the guide seat. The bottom of the middle ring lifting piece is located on the limiting base of the guide seat. The inner side wall of the middle part of the middle ring lifting piece extends inward to form a middle ring inner side limiting table. The outer side wall of the middle upper part of the middle ring lifting piece extends outward to form a middle ring outer side limiting table which is movably limited in the second cavity.

[0016] The inner ring lifting piece is in an axial structure and penetrates the inside of the middle ring lifting piece. The top of the inner ring lifting piece can extend from the axial structure center of the middle ring lifting piece. The bottom of the inner ring lifting piece extends out of the bottom of the guide seat and is fixedly connected with the spring seat. The middle upper part of the inner ring lifting piece extends outward to form an inner ring limiting table which is movably limited in the third cavity.

[0017] The top of the inner ring lifting piece, the middle ring lifting piece and the outer ring lifting piece are all provided with staggered convex parts and concave parts.

[0018] The first compression spring is compressed and supported between the second spring limiting holder and the third spring limiting holder to support the outer ring lifting piece and to make the top of the guide pin have a gap with the top of the guide hole.

[0019] The second compression spring has a greater rigidity than the first compression spring. The second compression spring is compressed and supported between the first spring limiting holder and the second spring limiting holder to make the spring seat have a gap with the guide seat.

[0020] When the hot-press bonding chip peeling step-by-step top block mechanism works, the bottom of the step-by-step top block assembly is supported and controlled to move up and down by the lifting mechanism; at the starting moment, the top of the outer ring top lifting piece, the middle ring top lifting piece and the inner ring top lifting piece has the same starting height; when the bottom of the step-by-step top block assembly is subjected to the upward thrust of the lifting mechanism, the step-by-step top block assembly moves upward as a whole until the middle horizontal section of the convex letter-shaped structure of the outer ring top lifting piece abuts against the lower surface of the top plate (i.e. the lower surface of the first cavity), at which time the outer ring top lifting piece stops moving; the lifting mechanism continues to apply the upward thrust, at which time the first compression spring is compressed first because its stiffness is smaller than that of the second compression spring, so the guide seat, the middle ring top lifting piece and the inner ring top lifting piece continue to move upward, the middle ring outer side limiting table moves upward in the second cavity and abuts against the upper surface of the second cavity, at which time the middle ring top lifting piece stops moving; the lifting mechanism continues to apply the upward thrust, at which time the second compression spring is compressed because the first compression spring has been compressed to the limit, so the spring seat drives the inner ring top lifting piece to move upward, the inner ring limiting table moves upward in the third cavity and then abuts against the upper surface of the third cavity, at which time the inner ring top lifting piece stops moving; the outer ring top lifting piece, the middle ring top lifting piece and the inner ring top lifting piece are sequentially lifted out, at which time the distance between the upper surface of the inner ring top lifting piece and the upper surface of the top plate is about 2 mm, the distance between the upper surface of the middle ring top lifting piece and the upper surface of the top plate is about 0.5 mm, and the distance between the upper surface of the outer ring top lifting piece and the upper surface of the top plate is about 0.3 mm, thus completing the step-by-step lifting action and achieving the step-by-step lifting of the blue film and the chip above the top plate, thereby more effectively completing the peeling of the chip from the blue film.

[0021] Further, the outer ring top lifting piece comprises:

[0022] The outer ring mounting block is internally through from top to bottom, the top end of which extends horizontally outward to form a third spring limiting seat, and the inner side wall below the third spring limiting seat extends horizontally inward to form an outer ring inner side limiting table; the guide hole is formed in the side wall of the outer ring mounting block;

[0023] The outer ring top block is above the outer ring mounting block and is internally through from top to bottom, the lower part of which is a through structure and is connected to the top of the third spring limiting seat of the outer ring mounting block by the first screw; the top of the outer ring top block extends horizontally inward and then protrudes upward from the center to form a convex letter-shaped structure, the top of the outer ring top block and the bottom of the top plate form a first cavity, the horizontal part of the top of the outer ring top block and the outer ring inner side limiting table form a second cavity, and the top of the outer ring top block is provided with an outer ring top block recess and an outer ring top block protrusion.

[0024] Further, the middle ring top lifting piece comprises:

[0025] The intermediate mounting block is internally through from top to bottom, the bottom of the intermediate mounting block is placed on the limiting base of the guide seat, the intermediate mounting block is connected with the guide seat through the fourth screw, the inner side wall of the middle part of the intermediate mounting block extends horizontally and inwardly to form a middle circle inner side limiting table, and the top port extends horizontally and outwardly to form an extension section;

[0026] The intermediate top block is located above the intermediate mounting block and is internally through from top to bottom, the bottom of the intermediate top block is connected with the extension section of the intermediate mounting block through the second screw to form a middle circle outer side limiting table, the bottom center of the intermediate top block is upwardly protruded, and the third cavity is formed between the protruded part and the middle circle outer side limiting table; the top of the intermediate top block is in an axial structure, and the top of the axial structure is provided with an intermediate top block protruding part and an intermediate top block recessed part.

[0027] Further, the spring seat is provided with a central through hole; the inner circle top lifting piece comprises:

[0028] The inner circle fixed shaft is horizontally outwardly extended at the top to form an inner circle limiting table, the inner circle limiting table is movably limited in the third cavity, the bottom of the inner circle fixed shaft passes through the central through hole of the spring seat and is connected with the spring seat through the fifth screw, and the top center of the inner circle fixed shaft is provided with a slot;

[0029] The inner circle top block is in an axial structure, the bottom of the inner circle top block is inserted into the slot of the inner circle fixed shaft and is connected through the third screw located at the inner circle limiting table, and the top of the inner circle top block is provided with an inner circle top block recessed part and an inner circle top block protruding part.

[0030] Further, the step-by-step top block assembly further comprises an intermediate bushing and an inner circle bushing; the intermediate bushing is sleeved between the outer side of the intermediate mounting block and the inner side of the outer circle mounting block and is located between the top of the guide seat and the outer circle inner side limiting table in the axial direction; the inner circle bushing is sleeved between the inner side of the intermediate mounting block and the outer side of the inner circle fixed shaft and is located between the limiting base of the guide seat and the middle circle inner side limiting table in the axial direction.

[0031] The heat pressure bonding chip peeling step-by-step top block mechanism can sequentially eject the outer circle top block, the intermediate top block and the inner circle top block, the chip peeling can be successfully realized for the thin chip with a thickness less than or equal to 50 microns, and the damage rate of the chip in the peeling process can be greatly reduced; the step-by-step top block peeling is particularly important for the thin chip with a thickness less than or equal to 30 microns; the step-by-step top block mechanism is suitable for various advanced packaging devices with the chip peeling action from the blue film and has the depth research significance and the popularization significance. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 It is a front view schematic diagram of the mechanism.

[0033] Figure 2 It isFigure 1 a sectional view of the schematic diagram.

[0034] Figure 3 is Figure 1 a schematic diagram of the internal partial section.

[0035] Figure 4 is Figure 1 a schematic diagram of the internal partial front view.

[0036] Figure 5 is Figure 1 a schematic diagram of the top view.

[0037] Figure 6 is a partial enlarged view of the initial position of the step-by-step top block assembly.

[0038] Figure 7 is a partial enlarged view of the simultaneous ejection of the outer ring top block, the middle top block, and the inner ring top block.

[0039] Figure 8 is a partial enlarged view of the simultaneous ejection of the middle top block and the inner ring top block.

[0040] Figure 9 is a partial enlarged view of the ejection of the inner ring top block.

[0041] Figure 10 is a schematic diagram of the cooperation of the step-by-step top block mechanism for the peeling of the chip, the blue film, and the hot-press bonded chip.

[0042] 1, top block cap nut; 2, top block sleeve; 3, top block cap mechanism locking nut; 4, first spring limiting seat; 5, outer ring top block; 6, first screw; 7, middle top block; 8, second screw; 9, inner ring top block; 10, third screw; 11, outer ring mounting block; 12, middle bushing; 13, middle mounting block; 14, inner ring bushing; 15, inner ring fixed shaft; 16, guide seat; 17, guide pin; 18, spring seat; 19, second spring limiting seat; 20, third spring limiting seat; 21, first compression spring; 22, fourth screw; 23, fifth screw; 24, second compression spring; 25, top plate; 26, adsorption hole; 27, adsorption groove; 28, top block corresponding hole; 29, inner ring top block recess; 30, inner ring top block protrusion; 31, middle top block protrusion; 32, middle top block recess; 33, outer ring top block recess; 34, outer ring top block protrusion; 35, first cavity; 36, second cavity; 37, third cavity; 38, chip; 39, blue film. DETAILED DESCRIPTION

[0043] A step-by-step top block mechanism for the peeling of a hot-press bonded chip, comprising:

[0044] a top block sleeve 2;

[0045] A top plate 25 is fixedly installed at the top end of the top block sleeve 2. The top plate 25 is provided with a top block corresponding hole 28 in the center and adsorption holes 26 and adsorption grooves 27 around the top block corresponding hole 28.

[0046] The stepped top block assembly is located inside the top block sleeve 2 and has a gap with the inner wall of the top block sleeve 2. The bottom is supported by a lifting mechanism to realize stepped jacking.

[0047] The stepped top block assembly comprises:

[0048] The spring seat 18 is horizontally extended outward at the bottom to form a first spring limiting seat 4.

[0049] The guide pin 17 is vertically fixed at the top of the spring seat 18.

[0050] The guide seat 16 is located above the spring seat 18. The guide seat 16 is an internally-through structure. The bottom port is horizontally extended inward to form a limiting base. The top port is horizontally extended outward to form a second spring limiting seat 19. The second spring limiting seat 19 is provided with a guide through hole matched with the guide pin 17.

[0051] The outer ring jacking member is located above the guide seat 16 and is an internally-through structure. The side wall of the outer ring jacking member is provided with a guide hole matched with the guide pin 17 from the bottom to the top. The outer ring jacking member is provided with a third spring limiting seat 20 extended outward from the outer side wall of the middle part and an outer ring inner limiting table extended inward from the inner side wall of the middle part. The top part of the outer ring jacking member has a convex structure. The top part of the convex structure and the bottom surface of the top plate 25 form a first cavity 35. The center of the convex structure can be extended from the top plate corresponding hole 28 and the middle horizontal part of the convex structure can be rested on the lower surface of the top plate 25. The bottom part of the convex structure and the outer ring inner limiting table form a second cavity 36. The guide pin 17 passes through the guide through hole and extends into the guide hole of the outer ring jacking member.

[0052] The middle ring jacking member is located inside the outer ring jacking member and the guide seat 16 and is fixedly connected with the guide seat 16. The middle ring jacking member is an internally-through structure. The bottom falls on the limiting base of the guide seat 16. The inner side wall of the middle part is extended inward to form a middle ring inner limiting table. The outer side wall of the middle upper part is extended outward to form a middle ring outer limiting table which is movably limited in the second cavity 36. The top center of the middle ring jacking member has an axial structure which can pass through the center of the convex structure of the top part of the outer ring jacking member. The bottom center of the middle ring outer limiting table is protruded upward and forms a third cavity 37 with the middle ring inner limiting table.

[0053] The inner ring lifting piece is in an axial structure, penetrates the inner part of the middle ring lifting piece, and the top of the inner ring lifting piece can be extended from the center of the axial structure of the middle ring lifting piece, the bottom of the inner ring lifting piece is fixedly connected with the spring seat 18 after being extended outward from the bottom of the guiding seat 16, and the middle upper part of the inner ring lifting piece is horizontally extended to form an inner ring limiting table which is movably limited in the third cavity 37;

[0054] The top of the inner ring lifting piece, the middle ring lifting piece and the outer ring lifting piece are respectively provided with staggered convex parts and concave parts;

[0055] The first compression spring 21 is compressed and supported between the second spring limiting seat 19 and the third spring limiting seat 20 to support the outer ring lifting piece and make the top of the guiding pin 17 have a gap with the top of the guiding hole;

[0056] The second compression spring 24 has a rigidity greater than that of the first compression spring 21, is compressed and supported between the first spring limiting seat 4 and the second spring limiting seat 19 to make the spring seat 18 have a gap with the guiding seat 16.

[0057] The outer ring lifting piece comprises:

[0058] The outer ring mounting block 11 is internally and vertically penetrated, the top end of the outer ring mounting block 11 is horizontally extended outward to form the third spring limiting seat 20, and an inner side limiting table of the outer ring is formed by horizontally extending inward at the inner side wall below the third spring limiting seat 20; the guiding hole is opened on the side wall of the outer ring mounting block 11;

[0059] The outer ring top block 5 is located above the outer ring mounting block 11 and is internally and vertically penetrated, the lower part of the outer ring top block 5 is a through diameter structure and is connected with the top of the third spring limiting seat 20 of the outer ring mounting block through the first screw 6, the top of the outer ring top block 5 is horizontally extended inward and then protrudes upward from the center to form a convex structure, the first cavity 35 is formed between the top of the outer ring top block 5 and the bottom of the top plate 25, the second cavity 36 is formed between the horizontal part of the top of the outer ring top block 5 and the inner side limiting table of the outer ring, and the outer ring top block 5 is provided with the outer ring top block concave part 33 and the outer ring top block convex part 34.

[0060] The middle ring lifting piece comprises:

[0061] The middle mounting block 13 is internally and vertically penetrated, the bottom of the middle mounting block 13 is located on the limiting bottom of the guiding seat 16, the middle mounting block 13 is connected with the guiding seat 16 through the fourth screw 22, the inner side wall of the middle part of the middle mounting block 13 is horizontally extended inward to form the inner side limiting table of the middle ring, and the top end of the middle mounting block 13 is horizontally extended outward to form an extension section;

[0062] The intermediate top block 7 is located above the intermediate mounting block 13 and has an internal up-and-down through structure, the bottom of the intermediate top block 7 is connected with the extension section of the intermediate mounting block 13 through the second screw 8 to form the outer limiting platform of the middle circle, the bottom center of the intermediate top block 7 is upwardly protruded, the protruded part and the outer limiting platform of the middle circle form the third cavity 37, the top of the intermediate top block 7 is in the shape of a shaft, and the top of the shaft-shaped structure is provided with the intermediate top block protruding part 31 and the intermediate top block recessed part 32.

[0063] The spring seat 18 is provided with a central through hole, and the inner circle top lifting part comprises:

[0064] The inner circle fixing shaft 15 is horizontally outwardly extended at the top to form the inner circle limiting platform, the inner circle limiting platform is movably limited in the third cavity 37, the bottom of the inner circle fixing shaft 15 penetrates through the central through hole of the spring seat 18 and is connected with the spring seat 18 through the fifth screw 23, and the top center of the inner circle fixing shaft 15 is provided with a slot;

[0065] The inner circle top block 9 is in the shape of a shaft, the bottom of the inner circle top block 9 is inserted into the slot of the inner circle fixing shaft 15 and is connected through the third screw 10 located at the inner circle limiting platform, and the top of the inner circle top block 9 is provided with the inner circle top block recessed part 29 and the inner circle top block protruding part 30.

[0066] The step-by-step top block assembly further comprises the intermediate bushing 12 and the inner circle bushing 14, the intermediate bushing 12 is sleeved between the outer side of the intermediate mounting block 13 and the inner side of the outer circle mounting block 11 and is located between the top of the guide seat 16 and the inner limiting platform of the outer circle along the axial direction, and the inner circle bushing 14 is sleeved between the inner side of the intermediate mounting block 13 and the outer side of the inner circle fixing shaft 15 and is located between the limiting base of the guide seat 16 and the inner limiting platform of the middle circle along the axial direction.

[0067] The application will be further described in combination with the drawings and embodiments.

[0068] In some embodiments of the application, a step-by-step top block mechanism for hot-press bonding chip peeling is provided, as shown in Figures 1 to 10

[0069] The mechanism top ejection action process is as follows: the lower surface of the top block sleeve 2 is positioned by the positioning groove, the top block cap mechanism lock nut 3 is fixed, the lower surface of the spring seat 18 is positioned by the positioning groove, and the spring seat 18 is fixed by the external lock nut, the spring seat 18 is externally threaded, and the external lock nut is internally threaded, so as to ensure the coincidence accuracy of the center and angle of the outer circle top block 5 and the top block corresponding hole 28, that is, the outer circle top block 5 can be smoothly ejected and retracted from the top block corresponding hole 28; Figure 6 The outer circle top block 5, the intermediate top block 7 and the inner circle top block 9 are in the initial height position; when the lower surface of the inner circle fixing shaft 15 is subjected to an upward thrust, the outer circle top block 5 moves upward and stops moving by abutting against the lower surface of the top plate 25, and the state is as shown in​Figure 7 Figure 6 shows the state after the first compression spring 21 is compressed. The intermediate mounting block 13 moves upward, driving the intermediate top block 7 and the inner ring top block 9 to move upward simultaneously, and stopping at the inner upper surface of the outer ring top block 5. The state is shown in Figure 7. Figure 8 Figure 8 shows the state after the second compression spring 24 is compressed. The inner ring fixed shaft 15 drives the inner ring top block 9 to move upward, and stops at the inner upper surface of the intermediate top block 7. The state is shown in Figure 9. Figure 9 Figure 10 shows the state after the outer ring top block 5, the intermediate top block 7, and the inner ring top block 9 are sequentially ejected. At this time, the upper surface of the inner ring top block 9 is about 2 mm away from the upper surface of the top plate 25, the upper surface of the intermediate top block 7 is about 0.5 mm away from the upper surface of the top plate 25, and the upper surface of the outer ring top block 5 is about 0.3 mm away from the upper surface of the top plate 25. The first cavity 35 serves as the lifting space of the entire stepped top block assembly, and the outer ring top block 5, the intermediate top block 7, and the inner ring top block 9 can be pushed out of the corresponding hole 28 of the top plate 25 and come into contact with the bottom surface of the blue film 39. The second cavity 36 serves as the lifting space of the intermediate top block 7 and the inner ring top block 9, which are ejected from the center hole of the outer ring top block 5 and are higher than the outer ring top block 5. The third cavity 37 serves as the lifting space of the inner ring top block 9, which is ejected from the center hole of the intermediate top block 7 and is higher than the intermediate top block 7, thereby realizing the stepped ejection action. The blue film 39 and the chip 38 are ejected in steps, and are more easily peeled off by the flipping mechanism.

[0070] The mechanism retraction action process is as follows: when the lower surface of the inner ring fixed shaft 15 is no longer subjected to upward pushing force, and the external compression force on the second compression spring 24 disappears, the inner ring top block 9 moves downward under the elastic force of the second compression spring 24, the intermediate top block 7 moves downward under the elastic force of the first compression spring 21, and the outer ring top block 5 moves downward. The upper surfaces of the outer ring top block 5, the intermediate top block 7, and the inner ring top block 9 are in the same plane. At this time, the lower surface of the inner ring fixed shaft 15 continues to move downward, and the three move downward simultaneously for a distance, reaching below the top plate 25. At this time, it is the initial state, Figure 6 Figure 11 shows the initial state.

[0071] The step-by-step chip peeling process is as follows: first, the cut-open chips 38 are bonded on the blue film 39, and the flipping mechanism of the hot-press bonding device needs to adsorb the chips 38 from the blue film 39, the flipping mechanism has a suction nozzle on it, which adsorbs the chips 38 from the blue film 39 to complete the chip peeling; the blue film 39 needs to complete the film expansion action first to expand the spacing of the chips 38, so as to avoid the single chip 38 from being pulled by the surrounding chips 38 during peeling; the upper surface of the top plate 25 is tightly attached to the lower surface of the blue film 39, and the adsorption holes 26 and the adsorption grooves 27 on the upper surface of the top plate 25 adsorb the blue film 39 through air at this time, the flipping suction nozzle reaches above the chips 38 and adsorbs the chips 38; the outer ring top block 5, the middle top block 7 and the inner ring top block 9 of the step-by-step top block mechanism are simultaneously ejected at this time, the chip 38 position corresponding to the outer ring top block recess 33 starts to peel, then the middle top block 7 and the inner ring top block 9 are simultaneously ejected, the chip 38 position corresponding to the middle top block recess 32 starts to peel, then the inner ring top block 9 is ejected, the chip 38 position corresponding to the inner ring top block recess 29 starts to peel, the suction nozzle of the flipping mechanism needs to move upward synchronously with the outer ring top block 5, the middle top block 7 and the inner ring top block 9, to ensure that the pressure of the flipping suction nozzle on the chips 38 does not change during the peeling process, avoiding damage to the chips 38 caused by downward pressure; with the sequential ejection of the outer ring top block 5, the middle top block 7 and the inner ring top block 9, the chips 38 corresponding to the outer ring top block recess 33, the middle top block recess 32 and the inner ring top block recess 29 are sequentially peeled from the blue film 39 under the action of the upward peeling force generated by the simultaneous adsorption of the flipping suction nozzle; the inner ring top block 9 moves downward, the chip part corresponding to the inner ring top block protrusion 30 is peeled, the middle top block 7 moves downward, the chip part corresponding to the middle top block protrusion 31 is peeled, the outer ring top block 5 moves downward, the chip part corresponding to the outer ring top block protrusion 34 is peeled; the flipping mechanism moves upward to complete the peeling of the chips from the blue film 39.

[0072] The mechanism is composed as follows: the top plate 25 is fixed on the top block sleeve 2 by the top block cap nut 1, the lower end of the top block sleeve 2 is internally threaded, the top block cap mechanism locking nut 3 is internally threaded, the lower surface of the top block sleeve 2 is positioned by a positioning groove, the top block sleeve 2 is fixed by the top block cap mechanism locking nut 3, thereby fixing the position and angular direction of the top plate 25; the lower surface of the spring seat 18 is positioned by a positioning groove, the lower end of the spring seat 18 is externally threaded, the externally located locking nut is internally threaded, the spring seat 18 is fixed by the externally located locking nut, thereby fixing the position and angular direction of the outer ring top block 5, which can ensure the coincidence precision of the center and angle of the outer ring top block 5 and the top block corresponding hole 28, that is, the outer ring top block 5 can be smoothly pushed out and retracted from the top block corresponding hole 28; the inner ring bushing 14 is installed in the middle installation block 13, the inner ring top block 9 is connected with the inner ring fixed shaft 15 by the third screw 10, the inner ring fixed shaft 15 is installed in the inner ring bushing 14, the middle top block 7 is connected with the middle installation block 13 by the second screw 8; the middle bushing 12 is installed in the outer ring installation block 11, the middle installation block 13 is installed in the middle bushing 12; the outer ring top block 5 is connected with the outer ring installation block 11 by the first screw 6; the guide pin 17 is installed in the guide hole of the outer ring installation block 11 after passing through the guide through hole of the guide seat 16, the first compression spring 21 is sleeved on the outer ring of the outer ring installation block 11, the guide seat 16 is connected with the middle installation block 13 by the fourth screw 22; the second compression spring 24 is sleeved on the outer ring of the guide seat 16 and the spring seat 18, the spring seat 18 and the inner ring fixed shaft 15 are connected by the fifth screw 23, and the bottom of the guide pin 17 is fixed on the spring seat 18. The middle bushing 12 and the inner ring bushing 14 are guide parts for mechanism movement.

[0073] The outer ring top block recess 33 and the outer ring top block convex part 34 are uniformly distributed on the upper surface of the outer ring top block 5, the outer ring top block recess 33 is lower than the outer ring top block convex part 34, the middle top block convex part 31 and the middle top block recess 32 are uniformly distributed on the upper surface of the middle top block 7, the middle top block recess 32 is lower than the middle top block convex part 31, the inner ring top block recess 29 and the inner ring top block convex part 30 are uniformly distributed on the upper surface of the inner ring top block 9, and the inner ring top block recess 29 is lower than the inner ring top block convex part 30; after installation, the inner ring top block convex part 30, the middle top block convex part 31 and the outer ring top block convex part 34 are on the same plane, and the installation flatness is less than 15 microns; if it is greater than 15 microns, the risk of thin chip peeling damage will be increased; the top plate 25 has an adsorption hole 26 and an adsorption groove 27, the area of the adsorption groove 27 is greater than that of the adsorption hole 26, in order to increase the adsorption area between the upper surface of the top plate 25 and the blue film 39 and make the adsorption more firm; the driving force of the lower surface of the fixed shaft 15 is driven by a servo motor or a linear motor, different peeling speeds can be set during the peeling process, the peeling process is flexibly controlled, and thus the peeling success rate is improved and the peeling loss rate is reduced. During the peeling operation, a negative pressure device is arranged below the top block sleeve 2 to adsorb the blue film 39 on the upper surface of the top plate 25, and the peeling operation is combined with the overturning mechanism, there is a gap between the top block sleeve 2 and the step-by-step top block assembly, which can be used as an air flow passage.

[0074] The first and second screws are inner hexagonal cylindrical head screws, which are vertically arranged to connect corresponding components; the third, fourth and fifth screws are inner hexagonal flat end set screws, which are horizontally arranged and fixed to corresponding components.

Claims

1. A step-by-step top block mechanism for peeling off thermo-bonded chips, characterized in that, include: Top block sleeve (2); The top plate (25) is fixedly installed at the top port of the top block sleeve (2). The top plate (25) has a corresponding hole (28) for the top block in the center and an adsorption hole (26) is opened around the corresponding hole (28). The step-by-step top block assembly is located inside the top block sleeve (2) and has a gap with the inner wall of the top block sleeve (2). The bottom is supported by a lifting mechanism to achieve step-by-step lifting. The step-by-step top block assembly includes: Spring seat (18), the bottom of which extends horizontally outward to form a first spring limiting seat (4); The guide pin (17) is vertically fixed at the top of the spring seat (18); The guide seat (16) is located above the spring seat (18). The guide seat (16) has an internal structure that runs through the top and bottom. Its bottom port extends horizontally inward to form a limiting base, and its top port extends horizontally outward to form a second spring limiting seat (19). The second spring limiting seat (19) has a guide through hole that matches the guide pin (17). The outer ring lifting component is located above the guide seat (16). It has an internal structure that runs vertically through the interior. The side wall of the outer ring lifting component has a guide hole that matches the guide pin (17) from the bottom upward. The outer side wall of the middle part of the outer ring lifting component extends outward to form a third spring limiting seat (20). The inner side wall of the middle part of the outer ring lifting component extends inward to form an inner limiting platform of the outer ring. The outer contour of the top of the outer ring lifting component is a convex shape. The top of the convex shape and the bottom surface of the top plate (25) form a first cavity (35). The center of the convex shape can extend out from the corresponding hole (28) of the top plate, and the horizontal section of the middle part of the convex shape can abut against the lower surface of the top plate (25). The bottom of the convex shape and the inner limiting platform of the outer ring form a second cavity (36). The guide pin (17) passes through the guide through hole and extends into the guide hole of the outer ring lifting component. The middle ring lifting component is located inside the outer ring lifting component and guide seat (16) and is fixedly connected to the guide seat (16). It has an internal structure that runs vertically through the middle ring. The bottom rests on the limiting base of the guide seat (16). The inner wall of the middle ring extends inward to form the inner limiting platform of the middle ring. The outer wall of the middle and upper part extends horizontally outward in the part that is higher than the inner limiting platform of the middle ring to form the outer limiting platform of the middle ring that is movable and limited in the second cavity (36). The top center of the middle ring lifting component is an axial structure that can pass through the center of the convex structure of the top of the outer ring lifting component. The bottom center of the outer limiting platform of the middle ring protrudes upward and forms a third cavity (37) with the inner limiting platform of the middle ring. The inner ring lifting component has a shaft-like structure that runs through the interior of the middle ring lifting component. The top of the inner ring lifting component can extend out from the center of the shaft-like structure of the middle ring lifting component. The bottom of the inner ring lifting component extends out from the bottom of the guide seat (16) and is fixedly connected to the spring seat (18). The upper part of the inner ring lifting component extends horizontally outward to form an inner ring limiting platform that is movable and limited in the third cavity (37). The tops of the inner ring lifting component, the middle ring lifting component, and the outer ring lifting component are evenly distributed with staggered protrusions and recesses; The first compression spring (21) is compressed and supported between the second spring limit seat (19) and the third spring limit seat (20) to support the outer ring lifting member and to make the top of the guide pin (17) and the top of the guide hole have a gap. The second compression spring (24) has a stiffness greater than that of the first compression spring (21). The compression support is between the first spring limiting seat (4) and the second spring limiting seat (19) to create a gap between the spring seat (18) and the guide seat (16).

2. The step-by-step top block mechanism for peeling off thermo-bonded chips as described in claim 1, characterized in that, The outer ring lifting component includes: The outer ring mounting block (11) has an internally through structure, with its top end extending horizontally outward to form a third spring limiting seat (20), and extending horizontally inward at a position lower than the inner side wall of the third spring limiting seat (20) to form an inner limiting platform of the outer ring; the guide hole is opened on the side wall of the outer ring mounting block (11). The outer ring top block (5) is located above the outer ring mounting block (11) and has an internal through structure. The lower part is a through structure and is connected to the top of the third spring limiting seat (20) of the outer ring mounting block through the first screw (6). The top of the outer ring top block (5) extends horizontally inward and then protrudes upward from the center to form a convex structure. The top of the outer ring top block (5) and the bottom of the top plate (25) form a first cavity (35). The horizontal part of the top of the outer ring top block (5) and the inner limiting platform of the outer ring form a second cavity (36). The top of the outer ring top block (5) is provided with an outer ring top block recess (33) and an outer ring top block protrusion (34).

3. The step-by-step top block mechanism for peeling off thermo-bonded chips as described in claim 2, characterized in that, The center ring lifting component includes: The middle mounting block (13) has an internal structure that runs vertically through the interior. The bottom of the middle mounting block (13) rests on the limiting base of the guide seat (16). The middle mounting block (13) is connected to the guide seat (16) by the fourth screw (22). The inner side wall of the middle mounting block (13) extends horizontally inward to form the inner limiting platform of the middle ring, and the top port extends horizontally outward to form the extension section. The middle top block (7) is located above the middle mounting block (13) and has an internal through-hole structure. Its bottom is connected to the extension of the middle mounting block (13) through the second screw (8) to form the outer limiting platform of the middle ring. The bottom center of the middle top block (7) protrudes upward, and the protruding part and the outer limiting platform of the middle ring form a third cavity (37). The top of the middle top block (7) has an axial structure, and the top of the axial structure is provided with a middle top block protrusion (31) and a middle top block recess (32).

4. The step-by-step top block mechanism for peeling off thermo-bonded chips as described in claim 3, characterized in that, The spring seat (18) has a central through hole; the inner ring lifting member includes: The inner ring fixed shaft (15) extends horizontally outward at the top to form an inner ring limiting platform. The inner ring limiting platform is movably limited within the third cavity (37). The bottom of the inner ring fixed shaft (15) passes through the central through hole of the spring seat (18) and is connected to the spring seat (18) through the fifth screw (23). A slot is opened at the center of the top of the inner ring fixed shaft (15). The inner ring top block (9) is a shaft-shaped structure. Its bottom is inserted into the slot of the inner ring fixing shaft (15) and connected by the third screw (10) located at the inner ring limiting platform. The top of the inner ring top block (9) has an inner ring top block recess (29) and an inner ring top block protrusion (30).

5. The step-by-step top block mechanism for peeling off thermo-bonded chips as described in claim 4, characterized in that, The step-by-step top block assembly also includes an intermediate bushing (12) and an inner ring bushing (14); the intermediate bushing (12) is fitted between the outer side of the intermediate mounting block (13) and the inner side of the outer ring mounting block (11), and is located axially between the top of the guide seat (16) and the inner limit platform of the outer ring; the inner ring bushing (14) is fitted between the inner side of the intermediate mounting block (13) and the outer side of the inner ring fixing shaft (15), and is located axially between the limit base of the guide seat (16) and the inner limit platform of the middle ring.

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