Plastic packaging method and plastic packaging system

Abstract

The embodiment of the invention provides a plastic packaging method and a plastic packaging system. The method comprises the following steps: placing an intermediate chip packaging body on a bearing platform; moving a chip cover plate to cover the chip area; scattering plastic packaging material powder on the surface of the chip cover plate through a powder scattering device so as to form a first plastic packaging powder layer in a non-chip area; solidifying the first plastic package powder layer through a laser solidification device to form a first plastic package layer; repeatedly forming the first plastic package layers in the non-chip area until the heights of the multiple first plastic package layers are consistent with the height of the chip; moving the chip cover plate back to the initial position; scattering plastic packaging material powder on the surfaces of the uppermost first plastic packaging layer and the chip through a powder scattering device to form a second plastic packaging powder layer; solidifying the second plastic package powder layer through a laser solidification device to form a second plastic package layer; and the second plastic packaging layers are repeatedly formed in the chip area until the height of the formed multiple second plastic packaging layers reaches the preset height. The method is carried out at normal temperature, warping is reduced, and energy and time are saved.

Description

Technical Field

[0001] This disclosure pertains to the field of semiconductor packaging technology, specifically relating to a molding method and molding system. Background Technology

[0002] With the rapid development of the semiconductor industry, improving product quality and human safety in the packaging field has become a key challenge. After the initial processes such as die mounting and wire bonding, packaged products need to be encapsulated to protect the internal structure. The commonly used encapsulation method is to first fix the product to be encapsulated in the mold, then heat and melt the encapsulating material in the injection port and inject it into the corresponding mold through the injection rod, and finally complete the curing process.

[0003] The existing plastic sealing method has the following problems: 1) The molding compound melts at 175℃. To ensure uniform changes in the viscosity of the molding compound, the temperature of the mold and injection rod is also 175℃. The temperature difference between the mold and room temperature is large, which will affect the warping of the product. At the same time, in order to ensure that the material can melt as soon as possible, the mold on the machine needs to be kept at 175±5℃ at all times. This will cause excessive energy consumption in production and place extremely high demands on production discipline and employee safety. 2) The time from injection molding to complete curing is approximately 3 to 5 minutes. After initial curing, the product needs to be baked in an oven for 5 to 7 hours to fully cure, which takes a long time. 3) The size and thickness of the plastic seal area are entirely determined by the mold, which to some extent limits the variety of products; 4) Product injection molding is completed in one go. If machine alarms or force majeure factors occur during the process, the injection molding will be interrupted and the product will be scrapped.

[0004] To address the aforementioned problems, it is necessary to propose a reasonable and effective molding method and molding system that solves these problems. Summary of the Invention

[0005] The present disclosure aims to at least solve one of the technical problems existing in the prior art, and to provide a molding method and molding system.

[0006] One aspect of this disclosure provides a molding method, the method comprising: An intermediate chip package is placed on a carrier platform, the intermediate chip package including a chip area and a non-chip area; Move the chip cover plate from its initial position and place it over the chip area; The molding compound powder is sprinkled onto the surface of the chip cover plate by a powder-sprinkling device, so that the molding compound powder forms a first molding compound powder layer in the non-chip area along the groove of the chip cover plate; The first molding powder layer is sintered by laser irradiation using a laser curing device to form the first molding layer; The first molding compound layer is formed repeatedly in the non-chip area until the height of the stacked multiple layers of the first molding compound layer is the same as the height of the chip. Move the chip cover back to its initial position; The molding compound powder is sprinkled onto the surface of the topmost first molding layer and the chip using a powder-sprinkling device to form a second molding powder layer; The second molding powder layer is formed by laser irradiation and sintering using a laser curing device to form the second molding layer. The second molding layer is formed repeatedly in the chip area until the height of the stacked multiple layers of the second molding layer reaches a preset height.

[0007] Optionally, the chip cover includes a plurality of shielding covers that match the chip, and the slot is provided between adjacent shielding covers; wherein, the number of shielding covers is greater than the number of chips; The method further includes: When the chip cover is placed over the chip area, the shielding cover at the front end of the chip cover is placed over the chip corresponding to it. After each first molding layer is formed, the chip cover is moved forward so that the shielding cover located at the rear end of the chip cover is sequentially placed on the corresponding chip, and then powder is reapplied to form a new first molding layer.

[0008] Optionally, the method further includes: When the height of the first molding layer formed by stacking multiple layers is consistent with the height of the chip, the chip cover is automatically moved back to the initial position by an elastic element.

[0009] Optionally, the chip cover is driven to reciprocate via a driving device; wherein the driving device includes a drive motor, a single-sided gear connected to the drive motor, and a rack meshing with the single-sided gear and disposed on the chip cover; The method further includes: When the single-sided gear rotates from the toothed part to the toothless part, the chip cover is pulled back to the initial position under the action of the elastic element.

[0010] Another aspect of this disclosure provides a molding compounding system for molding an intermediate chip package, the intermediate chip package including a chip region and a non-chip region, and the molding compounding system including a carrier platform, a powder dispensing device, a chip cover plate and a laser curing device; The support platform is used to place the intermediate chip package; The powder-spraying device is movably disposed above the intermediate chip package and is used to repeatedly and evenly spray the molding compound powder contained therein onto the non-chip area and the chip area to form a corresponding molding compound powder layer. The chip cover plate is movably disposed on the support platform. When powder is applied to non-chip areas, the chip cover plate can move from its initial position to cover the chip, and when powder is applied to the chip area, the chip cover plate can move back to its initial position. After each powder application by the powder application device to form the encapsulated powder layer, the corresponding encapsulated powder layer is sintered by laser irradiation using the laser curing device.

[0011] Optionally, the chip cover includes a plurality of shielding covers that match the chip, wherein the number of shielding covers is greater than the number of chips; A slot is provided between adjacent shielding covers. When powder is applied to the non-chip area, the molding compound powder can be deposited along the slot in the non-chip area to form a molding compound powder layer. Optionally, the system further includes a driving device and an elastic element, wherein the driving device drives the chip cover to reciprocate, and the elastic element is elastically connected to the chip cover. The driving device includes a drive motor, a single-sided gear driven by the drive motor, and a rack meshing with the single-sided gear and disposed on the chip cover plate; wherein... When the single-sided gear rotates from the toothed part to the toothless part, the encapsulation in the non-chip area is completed, and the chip cover can be pulled back to the initial position under the action of the elastic member.

[0012] Optionally, the driving device further includes a slider disposed at the bottom of the chip cover plate and a guide rail disposed on the support platform; The slider is slidably mounted on the guide rail.

[0013] Optionally, the powder-spreading device includes a housing, a motor, and a rotating platform; The rotating platform is located at the bottom of the housing, and the motor is connected to the rotating platform to drive the rotating platform to rotate within the housing; The contents of the housing are filled with molding compound powder; The bottom of the housing is provided with a first through hole, and the rotating platform is provided with a second through hole penetrating its thickness; wherein, When the motor drives the rotating platform to rotate until the first through hole and the second through hole are aligned, the powder spreading device begins to spread powder.

[0014] Optionally, the powder-spreading device further includes a first translation mechanism and a second translation mechanism connected to the housing; The first translation mechanism is used to drive the housing to translate along a first direction, and the second translation mechanism is used to drive the housing to translate along a second direction.

[0015] The molding method and molding system of this disclosure have the following characteristics: In the molding method, after the molding powder layer is formed in the non-chip area and the chip area, the high-temperature irradiation sintering time of the laser curing device is only about 30 seconds, after which the temperature can be restored to room temperature. The entire molding process is carried out at room temperature, which reduces warpage, saves energy, and provides a safe working environment. The entire molding process is carried out at a slow pace, and each contact between the wire and the product is in a flowing state, which has very little impact on the wire arc. The molding thickness depends on the number of molding cycles, and an infinitely large molding thickness can be achieved without being affected by the molding mold. The entire molding process is carried out at room temperature, and the stress release is almost zero. No re-baking is required after molding, which can save a lot of time. Attached Figure Description

[0016] Figure 1 This is a schematic flowchart of a molding method according to one embodiment of the present disclosure; Figure 2 This is a schematic diagram of the structure of a molding and encapsulation system according to another embodiment of this disclosure; Figure 3 This is a schematic diagram of the structure of a chip cover plate according to another embodiment of this disclosure; Figure 4 This is a front view of a driving device according to another embodiment of this disclosure; Figure 5 This is a top view of a driving device according to another embodiment of this disclosure; Figures 6 to 8 This is a schematic diagram showing the movement of the chip cover during the formation of the first molding layer in an embodiment of this disclosure; Figure 9 This is a schematic diagram showing the position of the chip cover plate when the second molding layer is formed in an embodiment of this disclosure; Figure 10 This is a schematic diagram of the powder-spreading device when it is turned off in an embodiment of this disclosure; Figure 11 This is a schematic diagram of the powder-spreading device being turned on in an embodiment of this disclosure. Detailed Implementation

[0017] To enable those skilled in the art to better understand the technical solutions of the embodiments of this disclosure, the embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0018] SLS (Selective Laser Sintering) is a curing method based on powder bed sintering using an infrared laser. First, a layer of powder material is laid out using a powder-laying roller. The powder is then heated to a temperature just below the powder's sintering point by a temperature control system within the printing equipment. Next, a laser beam irradiates the powder layer, raising its temperature above its melting point, thus sintering and bonding it to the pre-formed components below. Once one layer is sintered, the printing platform descends by one layer thickness, the powder-laying system lays new powder material on the platform, and the laser beam is used again for sintering. This process is repeated layer by layer until the entire product is encapsulated.

[0019] However, traditional SLS technology places powder in a powder bed and uses the printing platform to descend and the powder spreading roller to roll each layer of material for encapsulation. For silicon chips, the rolling of the powder spreading roller can lead to a series of risks such as silicon wafer breakage and displacement. In addition, the encapsulated product has a certain thickness of chip, which leads to uneven powder spreading. Therefore, there is no precedent for the use of this technology in the semiconductor field.

[0020] like Figure 2 As shown, this disclosure provides an innovative molding and encapsulation system for encapsulating intermediate chip packages based on traditional SLS technology, setting a precedent for the application of SLS technology in the semiconductor field.

[0021] The intermediate chip package 200 includes a chip region 210 and a non-chip region 220, and the molding system includes a carrier platform 110, a powder dispensing device 120, a chip cover plate 130, and a laser curing device 140.

[0022] The carrier platform 110 is used to place the intermediate chip package 200. That is, the substrate with the chip mounted on it is fixed on the carrier platform 110. The powder-spraying device 120 is movably disposed above the intermediate chip package 200, and is used to repeatedly and evenly spray the molding compound powder contained therein onto the non-chip area and the chip area to form a corresponding molding compound powder layer. In this embodiment, the molding compound powder can be resin powder.

[0023] The chip cover plate 130 is movably disposed on the support platform 110. When powder is applied to the non-chip area 220, the chip cover plate 130 can move from its initial position to cover the chip. When powder is applied to the chip area 210, the chip cover plate 130 can move back to its initial position.

[0024] In this embodiment, the chip cover plate is used to perform molding on the non-chip area and the chip area respectively. This avoids direct contact between the powder application device and the chip, and keeps the molding thickness on a plane, thus improving the reliability of the molding.

[0025] After each application of powder by the powder-spreading device 120 to form the molding compound powder layer, the corresponding molding compound powder layer is sintered by laser irradiation using the laser curing device 140. The laser irradiation sintering time for the corresponding molding compound powder layer by the laser curing device 140 is approximately 30 seconds. Figure 2 As shown, the laser curing device 140 can be a combination of a carbon dioxide laser emitter 141 and a scanning mirror 142.

[0026] During the encapsulation process, the intermediate chip package 200 is fixed to the support platform 110, and the chip cover plate 130 is moved from its initial position to the chip area and placed over the chip. The encapsulating powder contained therein is evenly spread to the non-chip area using the powder spreading device 120, forming a first encapsulating powder layer in the non-chip area. The first encapsulating powder layer is then sintered by laser irradiation using a laser curing device 140 to form a first encapsulation layer. This process of spreading powder in the non-chip area to form the first encapsulating powder layer and sintering it by laser irradiation using the laser curing device 140 continues until the thickness of the multi-layered first encapsulation layer matches the thickness of the chip. At this point, powder spreading in the non-chip area is stopped. The chip cover plate 130 is then moved back to its initial position, exposing both the chip area 210 and the non-chip area 220 to the outside. Then, the powder-spraying device 120 continues to spray powder onto the chip area and the surface of the first molding compound, forming a second molding compound powder layer on the chip surface and the surface of the first molding compound layer. The laser curing device 140 then uses laser irradiation to sinter the formed second molding compound powder layer, forming the second molding compound layer. The powder-spraying process is repeated on the surface of the formed second molding compound layer to form stacked second molding compound layers until the height of the multi-layer stacked second molding compound layers reaches the preset height, thus completing the molding of the intermediate chip package 200.

[0027] The molding system provided in this disclosure has a high-temperature sintering time of only about 30 seconds after forming a molding powder layer in the non-chip and chip areas by a powder-spraying device and a laser curing device. After that, it can be restored to room temperature. The entire molding process is carried out at room temperature, which reduces warpage, saves energy, and provides a safe working environment. The entire molding process is carried out at a slow pace, and each contact between the wire and the product is in a flowing state, which has very little impact on the wire arc. The molding thickness depends on the number of molding cycles, and an infinitely large molding thickness can be achieved without being affected by the molding mold. The entire molding process is carried out at room temperature, and the stress release is almost zero. No re-baking is required after molding, which can save a lot of time.

[0028] For example, such as Figure 3 As shown, the chip cover plate 130 includes a plurality of shielding covers 131 that match the chip, and the number of shielding covers 131 is greater than the number of chips.

[0029] A slot 132 is provided between adjacent shielding covers 131. When powder is applied to the non-chip area 220, the molding compound powder can be deposited along the slot 132 in the non-chip area to form a molding compound powder layer. For example, such as Figure 2 As shown, the system also includes a driving device 150 and an elastic element 160. The driving device 150 drives the chip cover plate 130 to reciprocate, and the elastic element 160 is elastically connected to the chip cover plate 130. In this embodiment, the elastic element 160 can be a spring.

[0030] like Figure 4 and Figure 5 As shown, the driving device includes a drive motor 151, a single-sided gear 152 that is connected to the drive motor 151, and a rack 153 that is meshed with the single-sided gear 152 and disposed on the chip cover plate 130.

[0031] Specifically, during the encapsulation of the non-chip area 220, the drive motor 151 rotates, causing the single-sided gear 152 to engage with the rack 153 to drive the chip cover plate 130 from its initial position to move above the chip area 210 and place it over the chip. The position of the shielding cover 131 in the chip cover plate 130 matches the position of the chip. The matching accuracy is controlled by the step rotation of the drive motor 151. Since the spacing between each chip in the product is consistent, and the spacing of the slots 132 in the chip cover plate 130 is also consistent, the drive motor 151 only needs to maintain a constant linear speed and unit step time to achieve precise placement of the shielding cover 131 over the product.

[0032] When the single-sided gear 152 rotates from the toothed part to the toothless part, the encapsulation of the non-chip area 220 is completed, and the chip cover plate 130 can be pulled back to its initial position under the action of the elastic member 160. Then, powder is further applied to the encapsulation layer of the chip area and the non-chip area.

[0033] In this embodiment, when the non-chip area 220 is encapsulated, the chip cover plate 130 can be automatically pulled back to the initial position under the action of the elastic member 160 to continue encapsulating the chip area, thereby achieving continuous automatic operation.

[0034] For example, such as Figure 4As shown, the driving device 150 also includes a slider 154 disposed at the bottom of the chip cover plate 130 and a guide rail 111 disposed on the support platform 110; the slider 154 is slidably disposed on the guide rail 111.

[0035] In this embodiment, the reciprocating movement of the chip cover can be driven by the cooperation of a drive motor, a single-sided gear, a rack, a slider, and a guide rail, thereby improving the molding efficiency.

[0036] For example, such as Figure 10 and Figure 11 As shown, the powder-spreading device 120 includes a housing 121, a motor 122, and a rotating platform 123.

[0037] The rotating platform 123 is disposed at the bottom of the housing 121, and the motor 122 is connected to the rotating platform 123 for driving the rotating platform 123 to rotate within the housing 121. The housing 121 contains molding compound powder. The bottom of the housing 121 is provided with a first through hole 121a, and the rotating platform 123 is provided with a second through hole 123a penetrating its thickness.

[0038] Among them, such as Figure 10 As shown, when the motor 122 drives the rotating platform 123 to rotate until the first through hole 121a and the second through hole 123a are aligned, the powder-spreading device 120 is activated and begins to spread powder. Figure 11 As shown, when the motor 122 drives the rotating platform 123 to rotate until the first through hole 121a and the second through hole 123a are misaligned, the powder spreading device 120 shuts down and stops spreading powder.

[0039] In this embodiment, by setting a first through hole and a second through hole, and by driving a rotating platform to rotate by a motor to align or misalign the two holes, the powder-spreading device can be turned on or off.

[0040] For example, the powder-spreading device 120 further includes a first translation mechanism and a second translation mechanism connected to the housing 121. The first translation mechanism is used to drive the housing 121 to translate along a first direction, and the second translation mechanism is used to drive the housing 121 to translate along a second direction. In this embodiment, the first direction can be the X direction and the second direction can be the Y direction. Of course, the first direction and the second direction can also be other directions, and this embodiment does not specifically limit them.

[0041] Specifically, such as Figure 2As shown, in this embodiment, the first translation mechanism may include a translation slider 124 and a translation guide rail 125. The first end of the translation slider is fixedly connected to the housing 121, and the second end of the translation slider 124 is slidably disposed on the translation guide rail 125. The translation slider 124 translates along the translation guide rail 125, thereby driving the housing 121 to translate, realizing the powder application to the intermediate chip package. The structure of the second translation mechanism is the same as that of the first translation mechanism, which is also a combination of a translation slider and a translation guide rail.

[0042] like Figure 1 As shown, another aspect of this disclosure provides a molding method S100, which uses the molding system described above for molding. The molding method S100 specifically includes: S110. Place the intermediate chip package on the support platform, wherein the intermediate chip package includes a chip area and a non-chip area.

[0043] like Figure 2 As shown, an intermediate chip package 200 is placed on a support platform 110, wherein the intermediate chip package 200 includes a chip region 210 and a non-chip region 220. The intermediate chip package 200 can be fixed to the support platform 110 by vacuum adsorption.

[0044] S120. Move the chip cover from its initial position and place it over the chip area.

[0045] like Figure 3 As shown, the chip cover plate 130 includes a plurality of shielding covers 131 that match the chips, and slots 132 are provided between adjacent shielding covers 131. The number of shielding covers is greater than the number of chips. Figure 3 As shown, multiple shielding covers 131 are distributed in a matrix.

[0046] Specifically, such as Figure 6 As shown, the drive motor 151 rotates, causing the single-sided gear 152 to engage with the rack 153 to drive the chip cover plate 130 from its initial position to move above the chip area 210, so that the cover 131 covers the chip corresponding to it.

[0047] S130. The molding compound powder is sprinkled onto the surface of the chip cover plate by the powder spreading device, so that the molding compound powder forms a first molding powder layer in the non-chip area along the groove of the chip cover plate.

[0048] Specifically, the powder-spreading device 120 is moved above the intermediate chip package 200 by the translation of the first and second translation mechanisms. Figure 10As shown, when the motor 122 is started and the rotating platform 123 is rotated until the first through hole 121a and the second through hole 123a are aligned, the motor 122 is turned off. At this time, the molding compound powder in the housing 121 flows sequentially through the second through hole 123a and the first through hole 121a, and the molding compound powder is sprinkled onto the surface of the chip cover plate 130. The molding compound powder is deposited along the slot 132 of the chip cover plate 130 in the non-chip area 220 to form a first molding compound powder layer in the non-chip area 220. In this embodiment, the molding compound powder can be resin powder.

[0049] The method further includes: When the chip cover plate 130 is placed on the chip area 210, the shielding cover 131 at the front end of the chip cover plate 130 is placed on the corresponding chip.

[0050] like Figure 7 As shown, after each first molding compound layer is formed, the chip cover plate 130 is moved forward so that the shielding cover 131 located at the rear end of the chip cover plate 130 is sequentially placed on the corresponding chip, and then powder is reapplied to form a new first molding compound layer. This can prevent the accumulation of molding compound powder that was not completely sintered and cured in the groove, thus preventing unnecessary contamination.

[0051] Specifically, in this embodiment, after each first molding layer is formed, the chip cover 130 is moved forward so that the shielding cover 131 is moved forward by one unit, and then powder is reapplied to form a new first molding layer.

[0052] It should be noted that the trajectory of the powder spreading device 120 is not limited and can be selected according to actual needs.

[0053] S140. The first molding powder layer is sintered by laser irradiation using a laser curing device to form the first molding layer.

[0054] A combination of a carbon dioxide laser emitter 141 and a scanning mirror 142 is used to irradiate and sinter the first molding powder layer with a laser for about 30 seconds, so that the first molding powder layer is solidified into the first molding layer 230.

[0055] S150. Repeat the process of forming the first molding compound layer in the non-chip area multiple times until the height of the stacked multilayer first molding compound layer is consistent with the height of the chip.

[0056] Specifically, after forming the first molding compound layer 230, powder is applied to the non-chip area 220 using the powder application device 120 to form a first molding compound powder layer. Then, the first molding compound powder layer is sintered by laser irradiation using the laser curing device 140 to form the second molding compound layer, and so on. Figure 8As shown, the process continues until the height of the multi-layered first molding compound 230 is consistent with the height of the chip, thus completing the molding of the non-chip area.

[0057] S160, Move the chip cover back to its initial position.

[0058] like Figure 11 As shown, after the encapsulation of the non-chip area 220 is completed, the motor 122 is restarted, causing the first through hole 121a and the second through hole 123a to be misaligned. At this time, the powder dispensing device 120 stops dispensing powder. Figure 8 As shown, at this time, the single-sided gear 152 rotates from the toothed part to the toothless part, and the chip cover plate 130 can be automatically pulled back to the initial position under the action of the elastic member 160. Then, powder is further applied to the encapsulation layer of the chip area and the non-chip area.

[0059] S170. The molding compound powder is sprinkled onto the surface of the uppermost first molding layer and the chip by the powder-sprinkling device to form a second molding powder layer.

[0060] After the chip cover 130 is moved back to its initial position, as Figure 10 As shown, the motor 122 is restarted, and the rotating platform 123 is rotated until the first through hole 121a and the second through hole 123a are aligned. When the motor 122 is turned off, the molding compound powder in the housing 121 flows through the second through hole 123a and the first through hole 121a in sequence, and falls onto the surface of the top first molding layer and the chip to form the second molding powder layer.

[0061] S180. The second molding powder layer is formed by laser irradiation and sintering using a laser curing device to form the second molding layer.

[0062] A combination of a carbon dioxide laser emitter 141 and a scanning mirror 142 is used to irradiate and sinter the second molding powder layer with a laser for about 30 seconds, so that the second molding powder layer is solidified into the second molding layer 240.

[0063] S190. Repeat the process of forming the second molding layer in the chip area multiple times until the height of the stacked multilayer second molding layer reaches a preset height.

[0064] Specifically, after the first second molding compound layer 240 is formed, powder is applied to the surface of the first second molding compound layer 240 using a powder application device 120 to form a second molding compound powder layer. Then, a laser curing device 140 is used to laser-irradiate and sinter the formed second molding compound powder layer to form a second second molding compound layer 240, and so on. Figure 9 As shown, the encapsulation of the intermediate chip package 200 is completed until the height of the multi-layer second molding compound 240 formed by stacking reaches the preset height.

[0065] The encapsulation method of this disclosure has the following technical effects: 1) Separate the chip area and non-chip area for molding. This avoids direct contact between the powder dispensing device and the chip, and keeps the molding thickness on a flat plane, thus improving the reliability of the molding.

[0066] 2) Low operating temperature reduces warpage. In this molding method, the molding material curing process only involves heating at the extruder. After the material is placed, the high-temperature sintering time by the laser curing device is only about 30 seconds, after which it can return to room temperature. The entire process is carried out at room temperature, saving energy and providing a safe working environment. Taking nylon as the main component of the resin powder as an example, the extruder preheating temperature is ≤200℃, and the laser beam irradiation surface temperature is 220±5℃. Compared with current technologies, this method has two advantages: firstly, the high-temperature time is shorter and stress release is less; secondly, the stress release is not concentrated in the segmented molding process, resulting in a significant improvement in warpage.

[0067] 3) Reduced wire arcing. The molding process of this molding method is carried out at a slow pace, and each contact between the wire and the product is in a flowing state, which has very little impact on the wire arc.

[0068] 4) High precision of the encapsulated body. In traditional methods, the thickness of the encapsulated body depends on the height of the mold, while in this encapsulation method, the thickness of the encapsulated body depends on the number of encapsulation cycles, theoretically allowing for an infinitely large encapsulated body thickness.

[0069] 5) High UPH. All steps in this molding process are performed at room temperature, resulting in almost zero stress release. No further baking is required after molding, significantly saving time.

[0070] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the embodiments of this disclosure, and the embodiments of this disclosure are not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the embodiments of this disclosure, and these modifications and improvements are also considered to be within the protection scope of the embodiments of this disclosure.

Claims

1. A molding and sealing method, characterized in that, The method includes: An intermediate chip package is placed on a carrier platform, the intermediate chip package including a chip area and a non-chip area; Move the chip cover plate from its initial position and place it over the chip area; The molding compound powder is sprinkled onto the surface of the chip cover plate by a powder-sprinkling device, so that the molding compound powder forms a first molding compound powder layer in the non-chip area along the groove of the chip cover plate; The first molding powder layer is sintered by laser irradiation using a laser curing device to form the first molding layer; The first molding compound layer is formed repeatedly in the non-chip area until the height of the stacked multiple layers of the first molding compound layer is the same as the height of the chip. Move the chip cover back to its initial position; The molding compound powder is sprinkled onto the surface of the topmost first molding layer and the chip using a powder-sprinkling device to form a second molding powder layer; The second molding powder layer is formed by laser irradiation and sintering using a laser curing device to form the second molding layer. The second molding layer is formed repeatedly in the chip area until the height of the stacked multiple layers of the second molding layer reaches a preset height.

2. The sealing method according to claim 1, characterized in that, The chip cover includes a plurality of shielding covers that match the chip, and the slots are provided between adjacent shielding covers; wherein, the number of shielding covers is greater than the number of chips; The method further includes: When the chip cover is placed over the chip area, the shielding cover at the front end of the chip cover is placed over the chip corresponding to it. After each first molding layer is formed, the chip cover is moved forward so that the shielding cover located at the rear end of the chip cover is sequentially placed on the corresponding chip, and then powder is reapplied to form a new first molding layer.

3. The molding method according to claim 1, characterized in that, The method further includes: When the height of the first molding layer formed by stacking multiple layers is consistent with the height of the chip, the chip cover is automatically moved back to the initial position by an elastic element.

4. The molding method according to claim 3, characterized in that, The chip cover is driven to reciprocate by a driving device; wherein the driving device includes a drive motor, a single-sided gear that is driven to drive the drive motor, and a rack that is meshed with the single-sided gear and disposed on the chip cover. The method further includes: When the single-sided gear rotates from the toothed part to the toothless part, the chip cover is pulled back to the initial position under the action of the elastic element.

5. A molding compound system for molding an intermediate chip package, the intermediate chip package comprising a chip region and a non-chip region, characterized in that, The molding and encapsulation system includes a support platform, a powder dispensing device, a chip cover plate, and a laser curing device; The support platform is used to place the intermediate chip package; The powder-spraying device is movably disposed above the intermediate chip package and is used to repeatedly and evenly spray the molding compound powder contained therein onto the non-chip area and the chip area to form a corresponding molding compound powder layer. The chip cover plate is movably disposed on the support platform. When powder is applied to non-chip areas, the chip cover plate can move from its initial position to cover the chip, and when powder is applied to the chip area, the chip cover plate can move back to its initial position. After each powder application by the powder application device to form the encapsulated powder layer, the corresponding encapsulated powder layer is sintered by laser irradiation using the laser curing device.

6. The molding and sealing system according to claim 5, characterized in that, The chip cover includes a plurality of shielding covers that match the chip, and the number of shielding covers is greater than the number of chips; A slot is provided between adjacent shielding covers. When powder is applied to the non-chip area, the molding compound powder can be deposited along the slot in the non-chip area to form a molding compound powder layer.

7. The molding and sealing system according to claim 5, characterized in that, The system also includes a driving device and an elastic element. The driving device drives the chip cover to reciprocate, and the elastic element is elastically connected to the chip cover. The driving device includes a drive motor, a single-sided gear driven by the drive motor, and a rack meshing with the single-sided gear and disposed on the chip cover plate; wherein... When the single-sided gear rotates from the toothed part to the toothless part, the encapsulation in the non-chip area is completed, and the chip cover can be pulled back to the initial position under the action of the elastic member.

8. The molding and sealing system according to claim 7, characterized in that, The driving device also includes a slider disposed at the bottom of the chip cover plate and a guide rail disposed on the support platform; The slider is slidably mounted on the guide rail.

9. The molding and sealing system according to claim 5, characterized in that, The powder-spreading device includes a housing, a motor, and a rotating platform; The rotating platform is located at the bottom of the housing, and the motor is connected to the rotating platform to drive the rotating platform to rotate within the housing; The contents of the housing are filled with molding compound powder; The bottom of the housing is provided with a first through hole, and the rotating platform is provided with a second through hole penetrating its thickness; wherein, When the motor drives the rotating platform to rotate until the first through hole and the second through hole are aligned, the powder spreading device begins to spread powder.

10. The molding system according to claim 9, characterized in that, The powder-spreading device further includes a first translation mechanism and a second translation mechanism connected to the housing; The first translation mechanism is used to drive the housing to translate along a first direction, and the second translation mechanism is used to drive the housing to translate along a second direction.

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