Sealing device for high-temperature sensor lead to penetrate through pressure container
By using a segmented sealing block design and a multi-point sealing structure with a conical shape, the sealing problem of sensor leads under high temperature and high pressure environments is solved, achieving flexible and adjustable sealing of sensor leads, suitable for high temperature sensor leads penetrating pressure vessels.
Patent Information
- Application Number
- CN202511549456.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-28
- Publication Date
- 2026-01-13
AI Technical Summary
In existing high-temperature and high-pressure environments, the sealing device for sensor leads is complex to install, the sealing surface is easily damaged, and it is difficult to maintain an effective seal under high temperature and high pressure without damaging the overall structure of the sensor.
It adopts a segmented sealing block design, including a lower sealing block and an upper sealing block, combined with a conical structure and threaded connection. Through chamfering design and multi-point sealing, it achieves adjustable sealing of the sensor lead. Soft, high-temperature resistant materials such as graphite, lead or copper are used to ensure sealing effect.
It achieves flexible sealing of sensor leads under high temperature and high pressure environments. It has a simple structure, is easy to install, the sensor is reusable, the sealing effect is adjustable, and it is suitable for high-pressure containers.
Smart Images
Figure CN121322652A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of high-temperature mechanical seal technology, specifically to a sealing device for a high-temperature sensor lead penetrating a pressure vessel. Background Technology
[0002] The pressure vessel and steam generator of a nuclear reactor system are characterized by high temperature and high pressure. The internal components of the pressure vessel are susceptible to vibration fatigue under the influence of high-speed fluid. Nuclear safety laws and regulations require these components to be designed to withstand the loads induced by fluid flow. To assess the magnitude of the response to these loads, vibration measurements of these components are necessary, as exemplified by the field test of flow-induced vibration of the internal components of the Hualong One reactor.
[0003] When performing mechanical measurements inside a pressure vessel with high temperature and high pressure, the leads of the sensors installed inside the pressure vessel need to be led out from the vessel wall. A through-sealing device is required that can protect the sensor leads without damaging the pressure-bearing boundary of the pressure vessel.
[0004] The leads of high-temperature waterproof accelerometer sensors, pulsating pressure sensors, and high-temperature strain gauges are generally manufactured as a single unit by the sensor manufacturer, with BNC connectors at the ends of the leads. The outer diameter of the BNC connector is typically around 12-15mm. The practice of some sensor manufacturers pre-installing sealing heads on the leads limits the application of this type of sensor.
[0005] Traditional high-temperature, high-pressure sealing devices are complex to install, have a single sealing surface, and are difficult to achieve a seal if the sealing surface is damaged. Therefore, a sealing head device that can be flexibly applied to different environments is needed. This device should be able to seal without damaging the original integrity of the sensor while withstanding high temperatures and pressures. Summary of the Invention
[0006] The purpose of this invention is to provide a sealing device for a high-temperature sensor lead penetrating a pressure vessel. This device can both seal the pressure vessel and guide the sensor lead out of the vessel without damaging the structural integrity of the sensor lead.
[0007] The technical solution of the present invention is as follows: A sealing device for a high-temperature sensor lead wire passing through a pressure vessel includes a sealing mounting base and a clamping block. The upper part of the mounting base is connected to the inside of the clamping block by a thread. The mounting base is a hollow structure, and the wire passes through the mounting base. The mounting base has a flange on its side. The mounting base contains a lower sealing block, an upper sealing block, a lower cone, an upper cone, and a sealing cap.
[0008] The lower sealing block is located inside the lower part of the mounting base. A lower cone is installed on the lower sealing block, and the wire passes through the center of the lower cone. An upper cone is installed on the lower cone, and the upper sealing block is located between the sealing cap and the upper cone. The sealing cap presses down on the upper sealing block, thereby compressing the wire.
[0009] The lower sealing block has a tapered shape on both the top and bottom. The chamfer at the bottom of the mounting base matches the angle α, which matches the chamfer at the bottom of the lower sealing block. The upper part of the lower sealing block has a chamfer that matches the inner conical surface of the lower cone.
[0010] The upper part of the inner conical surface inside the lower cone has a space, which allows the deformation caused by the lower sealing block and the upper sealing block during the process of thermal expansion or compression to be released.
[0011] The inner wall of the upper cone is conical, and the angle of the cone is smaller than the angle of the lower half of the upper sealing block, so that the upper cone presses the lower half of the upper sealing block toward the center, thereby pressing the wire tightly.
[0012] The outer surface of the upper half of the upper sealing block is elliptical and hollow. The wire passes through the center of the upper sealing block. The lower half is conical and the angle is greater than the conical angle of the inner wall of the upper cone.
[0013] The upper sealing block is located in the mounting base, and there are gaps between its two sides and the mounting base, so that the deformation caused by the upper sealing block during the process of thermal expansion or pressure is released.
[0014] The clamping block has internal threads that match the threads on the upper part of the mounting base, providing sealing clamping force for the entire device.
[0015] The sealing pressure is adjusted by tightening the clamping block.
[0016] The lower and upper sealing blocks are divided into two halves, with a hole in the middle having a radius smaller than the outer diameter of the wire, which makes it easy to clamp the wire from the side.
[0017] The chamfer, lower cone, upper cone inner wall, and sealing cap inside the sealing mounting seat provide lateral restraint, allowing the lower sealing block and upper sealing block to close together.
[0018] The significant advantages of this invention are:
[0019] (1) The sealing pressure is adjustable. The pressure can be adjusted by increasing the thickness of the lead tube, nut, clamping plate and its gasket;
[0020] (2) The structure is simple and easy to install. It can be installed in any convenient place for wires to be led.
[0021] (3) The sensor’s lead wire structure is not damaged, and the sensor can be reused. Attached Figure Description
[0022] Figure 1It is a structural overall diagram;
[0023] Figure 2 This is a structural diagram of the sealing mounting block;
[0024] Figure 3 This is a structural diagram of the lower sealing block;
[0025] Figure 4 This is a diagram of the lower cone structure;
[0026] Figure 5 This is a diagram of the upper cone structure;
[0027] Figure 6 This is a structural diagram of the upper sealing block;
[0028] Figure 7 This is a structural diagram of the sealing cap;
[0029] Figure 8 This is a structural diagram of the clamping block;
[0030] Figure 9 This is an overall structural diagram;
[0031] In the diagram: 1-Wire; 2-Sealing mounting base; 3-Lower sealing block; 4-Flange; 5-Upper sealing block; 6-Lower cone; 7-Upper cone; 8-Sealing cap; 9-Pressure block; 10-Sealing device through which the high-temperature sensor lead penetrates the pressure vessel; 11-Vessel wall; 12-Sealing gasket. Detailed Implementation
[0032] Many specific details are set forth in the following description to provide a full understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of this application; therefore, this application is not limited to the specific embodiments disclosed below.
[0033] The terminology used in one or more embodiments of this application is for the purpose of describing particular embodiments only and is not intended to limit the scope of one or more embodiments of this application. The singular forms “a,” “the,” and “the” used in one or more embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and or” used in one or more embodiments of this application refers to and includes any or all possible combinations of one or more associated listed items.
[0034] It should be understood that although the terms first, second, etc., may be used to describe various information in one or more embodiments of this application, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, first may also be referred to as second without departing from the scope of one or more embodiments of this application, and similarly, second may also be referred to as first.
[0035] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0036] A sealing device for a high-temperature sensor lead penetrating a pressure vessel, such as... Figure 1 , 9 As shown, the purpose is to lead the wire 1 out of the pressure vessel without damaging the sealing effect of the pressure-bearing boundary of the pressure vessel or the integrity of the wire 1; the high-temperature sensor lead passes through the sealing device 10 of the pressure vessel and is installed on the container wall 11 of the pressure vessel through the sealing gasket 12, leading the wire 1 out of the pressure vessel.
[0037] Including sealing mounting base 2 and clamping block 9, such as Figure 2 As shown, the upper part of the mounting base 2 is connected to the inside of the clamping block 9 by a thread, and the mounting base 2 is a hollow structure. The wire 1 is located in the mounting base 2, and there is a flange 4 on the side of the mounting base 2.
[0038] The mounting base 2 contains a lower sealing block 3, an upper sealing block 5, a lower cone 6, an upper cone 7, and a sealing cap 8.
[0039] like Figure 2 As shown, the lower part of the mounting base 2 has a chamfer with an angle of α. The lower sealing block 3 is located inside the lower part of the mounting base 2, and the chamfer of the lower part of the lower sealing block 3 matches the chamfer of the lower part of the mounting base 2 with an angle of α. This causes the lower sealing block 3 to be squeezed from the bottom, causing the lower sealing block 3 to shrink towards the center, thereby pressing the wire 1 and initially achieving a sealing effect.
[0040] like Figure 3 As shown, the lower sealing block 3 is designed to be conical on both the upper and lower sides. The upper part of the lower sealing block 3 has a chamfer that matches the inner conical surface of the lower cone 6, so that the upper part of the lower sealing block 3 is squeezed by the lower cone 6, causing the lower sealing block 3 to shrink towards the center, thereby pressing the wire 1 and initially achieving a resealing effect.
[0041] like Figure 4 As shown, the wire 1 passes through the center of the lower cone 6, and there is a space at the upper part of the inner cone surface inside the lower cone 6, so that the deformation caused by the lower sealing block 3 and the upper sealing block 5 during the process of thermal expansion or pressure is released;
[0042] like Figure 5As shown, the inner wall of the upper cone 7 is conical, and the angle of the cone is smaller than the angle of the lower half of the upper sealing block 5, so that the upper cone 7 presses the lower half of the upper sealing block 5 towards the center, thereby pressing the wire 1 and achieving a sealing effect again.
[0043] like Figure 6 As shown, the outer surface of the upper half of the upper sealing block 5 is elliptical and hollow. The wire 1 passes through the center of the upper sealing block 5. The lower half is conical and the angle is greater than the conical angle of the inner wall of the upper cone 7. The upper sealing block 5 is located in the mounting base 2, and there is a gap between its two sides and the mounting base 2, so that the deformation caused by the upper sealing block 5 during the process of thermal expansion or pressure is released.
[0044] like Figure 7 As shown, the upper sealing block 5 is located between the sealing cap 8 and the upper cone 7. The interior of the sealing cap 8 is a hollow hemisphere, which causes the sealing cap 8 to press down on the upper sealing block 5, thereby pressing the wire 1 and achieving a sealing effect again.
[0045] like Figure 8 As shown, the clamping block 9 has internal threads that match the threads on the upper part of the mounting base 2, providing sealing clamping force for the entire device; and the sealing pressure can be adjusted by the tightness of the clamping block 9.
[0046] The lower sealing block 3 and the upper sealing block 5 are made of soft, high-temperature resistant materials such as graphite, lead, or copper.
[0047] The lower sealing block 3 and the upper sealing block 5 are divided into two halves with a hole in the middle with a radius slightly smaller than the outer diameter of the wire 1, which facilitates clamping the wire 1 from the side. The chamfer inside the sealing mounting base 2, the inner wall of the lower cone 6 and the upper cone 7, and the sealing cap 8 provide lateral restraint, making it less likely for the lower sealing block 5 and the upper sealing block 3 to crack.
[0048] In this invention, the sealing structure is divided into a lower sealing block 3 and an upper sealing block 5, which makes disassembly and assembly convenient and does not damage the overall structure of the wire 1.
[0049] With appropriate chamfering design, the sealing pressure generated by the clamping block 9 is reasonably transmitted to the sealing surface of the wire 1.
[0050] By sealing the conductor 1 at multiple locations, the sealing effect is improved, making the present invention suitable for high-pressure pressure vessels.
[0051] The above description is merely a preferred embodiment of this patent and is not intended to limit this patent. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this patent shall be included within the scope of protection of this patent.
[0052] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, as some steps may be performed in other orders or simultaneously according to this application. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions and modules involved are not necessarily essential to this application.
[0053] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.
[0054] The preferred embodiments disclosed above are merely illustrative of this application. The optional embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this application. These embodiments are selected and specifically described in this application to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to better understand and utilize this application.
Claims
1. A sealing device for a high-temperature sensor lead penetrating a pressure vessel, characterized in that: It includes a sealing mounting base (2) and a clamping block (9). The upper part of the mounting base (2) is connected to the inside of the clamping block (9) by a thread. The mounting base (2) is a hollow structure. The wire (1) passes through the mounting base (2). There is a flange (4) on the side of the mounting base (2). The mounting base (2) contains a lower sealing block (3), an upper sealing block (5), a lower cone (6), an upper cone (7), and a sealing cap (8). The lower sealing block (3) is located inside the lower part of the mounting base (2). The lower cone (6) is installed on the lower sealing block (3), and the wire (1) passes through the center of the lower cone (6). The upper cone (7) is installed on the lower cone (6), and the upper sealing block (5) is located between the sealing cap (8) and the upper cone (7). The sealing cap (8) presses down on the upper sealing block (5), thereby pressing the wire (1).
2. The sealing device for a high-temperature sensor lead penetrating a pressure vessel according to claim 1, characterized in that: The lower sealing block (3) has a tapered shape on both the top and bottom. The chamfer at the bottom of the mounting base (2) is α, which matches the chamfer at the bottom of the lower sealing block (3). The upper part of the lower sealing block (3) has a chamfer that matches the inner tapered surface of the lower cone (6).
3. The sealing device for a high-temperature sensor lead penetrating a pressure vessel according to claim 2, characterized in that: The upper part of the inner cone surface inside the lower cone (6) has space, so that the deformation caused by the lower sealing block (3) and the upper sealing block (5) during the process of thermal expansion or pressure is released.
4. The sealing device for a high-temperature sensor lead penetrating a pressure vessel according to claim 3, characterized in that: The inner wall of the upper cone (7) is conical, and the angle of the cone is smaller than the angle of the lower half of the upper sealing block (5), so that the upper cone 7 presses the lower half of the upper sealing block (5) towards the center, thereby pressing the wire (1).
5. A sealing device for a high-temperature sensor lead penetrating a pressure vessel according to claim 4, characterized in that: The outer surface of the upper half of the upper sealing block (5) is elliptical and hollow. The wire (1) passes through the center of the upper sealing block (5). The lower half is conical and the angle is greater than the conical angle of the inner wall of the upper cone (7).
6. A sealing device for a high-temperature sensor lead penetrating a pressure vessel according to claim 5, characterized in that: The upper sealing block (5) is located in the mounting base (2), and there is a gap between its two sides and the mounting base (2), so that the deformation caused by the upper sealing block (5) during the process of thermal expansion or pressure is released.
7. A sealing device for a high-temperature sensor lead penetrating a pressure vessel according to claim 5, characterized in that: The clamping block (9) has internal threads that match the threads on the upper part of the mounting base (2), providing sealing clamping force for the entire device.
8. A sealing device for a high-temperature sensor lead penetrating a pressure vessel according to claim 7, characterized in that: The sealing pressure is adjusted by the degree of tightening of the clamping block (9).
9. A sealing device for a high-temperature sensor lead penetrating a pressure vessel according to claim 6, characterized in that: The lower sealing block (3) and the upper sealing block (5) are divided into two halves, with a hole in the middle having a radius smaller than the outer diameter of the wire (1) to clamp the wire (1) from the side.
10. A sealing device for a high-temperature sensor lead penetrating a pressure vessel according to claim 9, characterized in that: The chamfer inside the sealing mounting base (2), the inner wall of the lower cone (6), the upper cone (7), and the sealing cap (8) provide lateral constraints so that the lower sealing block (5) and the upper sealing block (3) close together.