Test circuit, test device and test method

Abstract

The invention provides a test circuit, a test device, and a test method, which can prevent a terminal of a relay as a capacitor for a high-speed signal from hindering transmission, and improve the precision of a function test. The test circuit includes: a voltage supply unit that generates an output voltage; a pulse generation unit that generates a pulse signal using the output voltage from the voltage supply unit and supplies the pulse signal to a device under test during a function test of the device under test; and a measurement circuit that adjusts the voltage or current supplied to the device under test to a test voltage or a test current during the voltage-applied current measurement test or the current-applied voltage measurement test of the device under test. And a measurement circuit that performs the voltage-applied current measurement test or the current-applied voltage measurement test using the test voltage or the test current, and that is connected at least between the voltage supply unit and the pulse generation unit.

Description

Technical Field

[0001] This invention relates to a test circuit, a test device, and a test method. Background Technology

[0002] In Patent Document 1, it is stated that "The ATE system 150 of this embodiment is connected to a device under test (DUT) 160 to be tested, and includes a DUT power supply (DPS) 170, pin electronics (PE) 180, a parametric measurement unit (PMU) 190, and a controller 200." (Column 6, lines 60-65 of cited document 1).

[0003] [Existing Technical Documents]

[0004] [Patent Literature]

[0005] [Patent Document 1] U.S. Patent No. 9,851,401

[0006] [Patent Document 2] U.S. Patent No. 7,480,583 Summary of the Invention

[0007] In a first embodiment of the present invention, a test circuit is provided, comprising: a voltage supply unit for generating an output voltage; a pulse generation unit for generating a pulse signal and supplying it to the device under test using the output voltage from the voltage supply unit during a functional test of the device under test; and a measurement circuit for adjusting the voltage or current supplied to the device under test to a test voltage or test current during a voltage-applied current measurement test or a current-applied voltage measurement test of the device under test, and performing the voltage-applied current measurement test or the current-applied voltage measurement test using the test voltage or the test current, wherein the measurement circuit is at least connected between the voltage supply unit and the pulse generation unit.

[0008] The test circuit may also include a connection terminal for the device under test, and the pulse generating unit is electrically and fixedly connected to the connection terminal.

[0009] The any test circuit can further include a first relay provided between the voltage supply section and the pulse generation section.

[0010] The any test circuit can further include a second relay provided between the pulse generation section and the voltage supply section, and the measurement circuit.

[0011] In the any test circuit, the measurement circuit can be connected between the voltage supply section and the pulse generation section, and between the pulse generation section and the device under test, via a first line for supplying voltage or current to the device under test, and a second line for measuring voltage of the device under test.

[0012] In the test circuit, the second line can be connected between the pulse generation section and the device under test, and the measurement circuit.

[0013] In the any test circuit, the voltage supply section and the pulse generation section can be connected in series.

[0014] In the any test circuit, the voltage supply section, the pulse generation section, and the measurement circuit can be provided on a common substrate.

[0015] In the any test circuit, the measurement circuit can adjust the test voltage or the test current using voltage supplied from the voltage supply section.

[0016] In a second embodiment of the invention, a test device is provided, which includes the any test circuit.

[0017] In a third embodiment of the invention, a test method is provided, which includes: a pulse generation circuit generating a pulse signal using output voltage from a voltage supply section and supplying to a device under test in a function test of the device under test; and a measurement circuit connected at least between the voltage supply section and the pulse generation circuit adjusting voltage or current supplied to the device under test to a test voltage or a test current in a voltage application current measurement test or a current application voltage measurement test of the device under test, and performing the voltage application current measurement test or the current application voltage measurement test using the test voltage or the test current.

[0018] Furthermore, the summary of the invention does not list all the essential features of the invention. In addition, sub-combinations of these groups of features can also be inventions. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 The structure of the test device 1 and the device under test 10 of the embodiment are shown together.

[0020] Figure 2Structure of a pin electronic device 200 representing a comparative example of the embodiment.

[0021] Figure 3 Structure of a pin electronic device 300 representing the embodiment.

[0022] Figure 4 Action of the pin electronic device 300 is focused on, and an action flow of a functional test of the device under test 10 performed by the test apparatus 1 of the embodiment is shown. Figure 3

[0023] Figure 5 Action of the pin electronic device 300 is focused on, and an action flow of a voltage application current measurement test of the device under test 10 performed by the test apparatus 1 of the embodiment is shown. Figure 3

[0024] Figure 6 Action of the pin electronic device 300 is focused on, and an action flow of a current application voltage measurement test of the device under test 10 performed by the test apparatus 1 of the embodiment is shown.

[0025] Figure 7 Structure of a pin electronic device 400 representing a modification example.

[0026] Explanation of Reference Numerals

[0027] 1: Test apparatus

[0028] 10: Device under test

[0029] 100: Test head

[0030] 110: Pin electronic device

[0031] 120: Connection apparatus

[0032] 150: Main rack

[0033] 160: Main power supply apparatus

[0034] 170: Control apparatus

[0035] 200: Pin electronic device

[0036] 205: Power supply unit

[0037] 210: Test control circuit

[0038] 220: Test circuit

[0039] 230: Test signal generator

[0040] 240: Voltage generation circuit

[0041] ​​245: Pattern Generator

[0042] 250: Timing Generator

[0043] 255: Pulse Generation Circuit

[0044] 260: Relay

[0045] 270: Measurement Circuit

[0046] 280: Relay

[0047] 290: Resistor

[0048] 300: Pin Electronics

[0049] 310: Test control circuit

[0050] 320: Test Circuit

[0051] 330: Test signal generator

[0052] 360: Relay / First Relay

[0053] 370: Measurement Circuit

[0054] 380: Relay / Second Relay

[0055] 400: Pin Electronics

[0056] 420: Test Circuit

[0057] 430: Test signal generator

[0058] 470: Measurement Circuit

[0059] L1: First line (force line)

[0060] L2: Second wire (sensor wire)

[0061] Px: Terminal

[0062] Py: Terminal / Connecting Terminal

[0063] S400, S410, S420, S430, S500, S520, S530, S600, S610, S620: Steps Detailed Implementation

[0064] The present invention will now be described through embodiments thereof, but these embodiments do not limit the scope of the invention as claimed. Furthermore, not all combinations of the features described in the embodiments are necessarily necessary for the solutions provided by the invention.

[0065] Figure 1The structure of the test apparatus 1 and the device under test (DUT) 10 of this embodiment are also shown. The device under test 10 is a device having a circuit formed thereon, which is the object of testing by the test apparatus 1. The device under test 10 may be a wafer with a circuit formed thereon, an integrated circuit / large scale integrated circuit (IC / LSI) chip obtained by monolithizing a wafer, or an IC / LSI package formed by packaging an IC / LSI chip, etc. In the example of this figure, the test apparatus 1 is equipped with one device under test 10, but it is also possible to use multiple devices under test 10 to perform tests simultaneously.

[0066] Test apparatus 1 performs electrical tests on device under test 10. Alternatively, or based on this, test apparatus 1 can also perform optical input / output tests on device under test 10. In this embodiment, the case where test apparatus 1 performs electrical tests on device under test 10 will be described as an example. When test apparatus 1 performs optical input / output tests on device under test 10, test apparatus 1 and device under test 10 can also be connected via optical connection on the basis of electrical connection.

[0067] The test apparatus 1 includes a test head 100, a plurality of pin electronics 110, a connection device 120, and a main frame 150. The test head 100 is a housing capable of housing the plurality of pin electronics 110. In the example shown in this figure, the test head 100 has a plurality of slots for inserting the plurality of pin electronics 110.

[0068] Multiple pin-mounted electronic devices 110 are inserted into slots in the test head 100, thereby being detachably connected to the backplane of the test head 100. The pin-mounted electronic devices 110 may also be referred to as "pin-mounted electronic cards," "test boards," or "test modules," etc. Each pin-mounted electronic device 110 is electrically connected to the device under test 10 via a connection device 120. Each pin-mounted electronic device 110 inputs / outputs signals to and from the device under test 10, and the device under test 10 is tested by checking the signals input from the device under test 10.

[0069] A connection device 120 is mounted on a test head 100 and electrically connected to a plurality of pin-mounted electronic devices 110. The connection device 120 also mounts a device under test (DUT) 10 and is electrically connected to a plurality of terminals of the DUT 10. The connection device 120 serves as an interface between the terminals of the plurality of pin-mounted electronic devices 110 and the DUT 10, electrically connecting the terminals of one or more DUTs to the corresponding terminals of the plurality of pin-mounted electronic devices 110 via signal cables or board wiring, etc.

[0070] The main frame 150 controls the various parts within the test apparatus 1 to perform tests on the device under test 10. In this embodiment, the main frame 150 is a frame independent of the frame on which the test head 100 is installed. Alternatively, the various structures within the main frame 150 may be installed in the same frame as the test head 100. The main frame 150 includes a main power supply 160 and a control device 170.

[0071] The main power supply unit 160 receives power from a commercial power source or similar source and supplies power to the various devices and circuits within the test apparatus 1. The control unit 170 is connected to the main power supply unit 160 and receives power from it. The control unit 170 controls the testing of the device under test 10. When implemented via a computer, the control unit 170 controls the testing of the device under test 10 by executing a test control program. The control unit 170 supplies test programs to each pin electronic device 110, causing each pin electronic device 110 to execute the supplied test programs, thereby testing the device under test 10. The control unit 170 collects and records the test results of the device under test 10 from each pin electronic device 110.

[0072] Figure 2 The structure of the pin electronics device 200 of the comparative example of this embodiment is shown. The pin electronics device 200 of the comparative example can be used as the pin electronics device 110 of the test device 1. The pin electronics device 200 includes a power supply unit 205, a test circuit 220, and a test control circuit 210.

[0073] The power supply unit 205 receives power from the main power supply device 160, generates power to supply to the circuits within the pin electronics device 200, and supplies power to the circuits within the pin electronics device 200. The power supply unit 205 has multiple power sources and can output various types of power with different rated voltages or rated currents.

[0074] The test circuit 220 is connected to the device under test 10 via the connection device 120 and receives power from the power supply unit 205 to test the device under test 10. This figure representatively shows the circuit portion of the test circuit 220 corresponding to one terminal of the device under test 10. The test circuit 220 can be connected to multiple terminals and has circuit portions corresponding to each terminal.

[0075] Test circuit 220 may have a connection terminal Py (also simply referred to as terminal Py) for the device under test 10, via which it can be connected to the device under test 10. Test circuit 220 has a test signal generator 230 for performing operational tests (also referred to as "functional tests") on the device under test 10. Test signal generator 230 receives power supply from power supply unit 205 and control from test control circuit 210, generates test signals to be supplied to the device under test 10 during functional tests, and supplies test signals to the terminals of the device under test 10. Here, the test signals generated by test signal generator 230 may be pulse signals with a desired signal pattern, such as digital signals or multi-valued signals, to be supplied to the device under test 10.

[0076] The test signal generator 230 includes a voltage generation circuit 240, a pattern generator 245, a timing generator 250, and a pulse generation circuit 255. The voltage generation circuit 240, an example of a voltage supply unit, generates an output voltage. The voltage generation circuit 240 accepts power supply from the power supply unit 205 and control from the test control circuit 210, generating the power supply voltage required by the pulse generation circuit 255 during functional testing as its output voltage. The voltage generation circuit 240 can supply a power supply voltage corresponding to a high-level voltage in a pulse signal supplied to the terminals of the device under test 10 as its output voltage to the pulse generation circuit 255.

[0077] The pattern generator 245 receives power supply from the power supply unit 205 and control from the test control circuit 210, generating a specified test pattern for the waveform of the pulse signal to be supplied to the terminals of the device under test 10 during functional testing. The pattern generator 245 can execute test commands for each test cycle with a predefined period and output a test pattern associated with the test command. The test pattern for each test cycle specifies the variation pattern of the test signal within the test cycle. Although varying depending on the model, the pattern generator 245 may also be able to specify pattern identifiers representing waveform shape, such as Return to Zero (RZ) or Non Return to Zero (NRZ), and the polarity of the waveform shape as the variation pattern of this test signal.

[0078] The timing generator 250 receives power supply from the power supply unit 205 and control from the test control circuit 210, generating a timing sequence of pulse signals to be supplied to the terminals of the device under test 10 during functional testing. The timing generator 250 assigns a real-time timing sequence to the changing pattern of the test signal in each test cycle, thereby generating the waveform of the pulse signal to be supplied to the device under test 10. Furthermore, depending on the type of test apparatus 1, the pattern generator 245 can generate the test pattern for each test cycle, the timing generator 250 can generate the timing sequence for each test cycle, and the waveform shaper can use the timing sequence generated by the timing generator 250 to shape the waveform of the pulse signal supplied to the device under test 10.

[0079] The pulse generation circuit 255 is an example of a pulse generation unit. During functional testing of the device under test (DUT) 10, it uses the output voltage from the voltage generation circuit 240 to generate pulse signals and supplies them to the DUT 10. The pulse generation circuit 255 can accept the output voltage from the voltage generation circuit 240 and uses it to generate pulse signals during functional testing, supplying them to the terminals of the DUT 10. The pulse generation circuit 255 can drive its output to a high level or a low level (in the case of two values), or to multiple levels respectively, based on the waveform of the test signal after real-time timing changes are applied to each test cycle. This outputs a pulse signal that changes the test pattern generated by the pattern generator 245 according to the timing generated by the timing generator 250.

[0080] The test signal generator 230 shown above can be implemented by a group of discrete ICs, LSIs, or application-specific integrated circuits (ASICs), or by a single test signal generating ASIC. The test signal generator 230 may also have the following functions: receiving the response signal output by the device under test 10 according to the test signal, and determining whether the device under test 10 is good or bad. In this case, the test signal generator 230 may have a comparator that compares the response signal from the device under test 10 with a target value, and a determiner that uses the comparison result obtained by the comparator to determine whether the device under test 10 is good or bad.

[0081] A relay 260 is disposed between terminal Py of the test circuit 220, which is connected to the terminals of the device under test 10, and the test signal generator 230. The relay 260 can be a mechanical relay or a semiconductor relay using a semiconductor switch or the like. When performing functional tests on the device under test 10, the relay 260 is turned on via the test control circuit 210, connecting the test signal generator 230 to the terminals of the device under test 10. Conversely, when the measurement circuit 270 performs parametric tests on the device under test 10 (such as voltage-applied current measurement tests or current-applied voltage measurement tests), the relay 260 is turned off via the test control circuit 210, disconnecting the test signal generator 230 from the terminals of the device under test 10.

[0082] Wiring connections are made between the terminals of the pulse signals output by the measuring circuit 270 and the test signal generator 230 and the terminals of the device under test 10. In the example shown in this figure, the measuring circuit 270 is connected via a relay 280 to a force line that applies voltage or current to the terminals of the device under test 10, and via a resistor 290 to a sensing line used to sense the voltage at the terminals of the device under test 10. Wiring connections are made between the force line, the sensing line, and the relay 260 to the terminal Py of the test circuit 220 connected to the terminals of the device under test 10.

[0083] The measurement circuit 270 receives power supply from the power supply unit 205 and control from the test control circuit 210 to perform parametric testing of the device under test 10. While the measurement circuit 270 varies depending on the model, it can include, for example, various circuits, including at least one of the following: a voltage generator that generates a voltage supplied to the terminals of the device under test 10; a current generator that generates a current supplied to the device under test 10; a voltage measuring device that measures the voltage output by the device under test 10; a current measuring device that measures the current output by the device under test 10; and a frequency measuring device that measures the frequency of the signal output by the device under test 10. In the example shown in this figure, the measurement circuit 270 is housed within the pin electronics 200. Alternatively, the measurement circuit 270 can be implemented by other pin electronics 110 within the test apparatus 1.

[0084] In the case of voltage application current measurement test, the measurement circuit 270 outputs a desired test voltage via a force line and measures the current flowing in the terminals of the device under test 10 that has received the test voltage. In the case of current application voltage measurement test, the measurement circuit 270 flows a desired test current between itself and the terminals of the device under test 10 via a force line and measures the voltage at the terminals of the device under test 10 via a sensing line.

[0085] Relay 280 is disposed in the wiring between terminal Py of test circuit 220 and test signal generator 230, at a connection point closer to terminal Py than relay 260, and between relay 280 and measurement circuit 270. Relay 280 can be a mechanical relay or a semiconductor relay using a semiconductor switch, etc. During functional testing of device under test 10, relay 280 is disconnected by test control circuit 210, etc., disconnecting measurement circuit 270 from terminals of device under test 10. During parametric testing of device under test 10, relay 280 is connected by test control circuit 210, etc., connecting measurement circuit 270 to terminals of device under test 10.

[0086] Resistor 290 is disposed in the wiring between terminal Py of test circuit 220 and test signal generator 230, on the connection point closer to terminal Py than relay 260, and in the sensing line between the connection point and the measuring circuit 270. Resistor 290 may be a relatively large resistor, such as 10KΩ, which can substantially isolate the terminals of device under test 10 from the measuring circuit 270, while simultaneously inputting the voltage of the terminals of device under test 10 to the measuring circuit 270.

[0087] Test control circuit 210 controls test circuit 220 to perform tests on device under test 10. Test control circuit 210 may also be referred to as "site controller". Test control circuit 210 executes the test program supplied from control device 170 and controls the various parts within test circuit 220, thereby enabling test circuit 220 to perform tests such as operation tests or parameterization tests on device under test 10.

[0088] In the pin electronics 200 shown above, a measurement circuit 270 is connected to the wiring between the terminal Px of the test signal generator 230 (outputting the pulse signal) and the terminal of the device under test 10. During the functional test of the device under test 10, the wiring between the terminal Px of the test signal generator 230 and the terminal of the device under test 10 transmits a high-speed pulse signal. Here, during the functional test of the device under test 10, relay 260 is turned on and relay 280 is turned off. However, relay 260 has parasitic capacitance even when it is turned on, and relay 280 has parasitic capacitance even when it is turned off. Therefore, the wiring between the terminal Px of the test signal generator 230 and the terminal of the device under test 10 experiences resistance-capacitance (RC) delay due to the parasitic capacitance of relays 260 and 280, hindering the transmission of the high-speed pulse signal.

[0089] Figure 3This diagram illustrates the structure of the pin electronics device 300 according to this embodiment. The pin electronics device 300 is a variation of the pin electronics device 200. The test apparatus 1 may include the pin electronics device 300 instead of the pin electronics device 200. The pin electronics device 300 includes a power supply unit 205, a test circuit 320, and a test control circuit 310. In this figure, symbols related to... Figure 2 The structural components of the same symbol have the same Figure 2 Since they have the same function and structure, the description is omitted except for the following differences.

[0090] The test circuit 320 is connected to the device under test 10 via the connection device 120 and receives power from the power supply unit 205 to test the device under test 10. This figure representatively shows the circuit portion of the test circuit 320 corresponding to one terminal of the device under test 10. The test circuit 320 can be connected to multiple terminals and has circuit portions corresponding to each terminal.

[0091] The test circuit 320 includes a test signal generator 330. In this embodiment, the test signal generator 330 receives power from the power supply unit 205 and control from the test control circuit 310, performing both functional and parametric tests on the device under test (DUT) 10. The test circuit 320 can perform both functional and parametric tests on the same DUT 10 depending on the user's method of use. The test circuit 320 can perform functional tests on one DUT 10 and parametric tests on another DUT 10. Alternatively, depending on the user's method of use, the test circuit 320 can perform only one of the functional or parametric tests, without using the function of performing the other test. The test signal generator 330 includes a measurement circuit 370, a pattern generator 245, a timing generator 250, a pulse generation circuit 255, and a resistor 290.

[0092] The measurement circuit 370 is at least connected between the voltage generation circuit 240 and the pulse generation circuit 255. "Connected between the voltage generation circuit 240 and the pulse generation circuit 255" can refer to wiring connecting the voltage generation circuit 240 and the pulse generation circuit 255. In this embodiment, the measurement circuit 370 is configured with the voltage generation circuit 240, and in addition to connecting from the voltage generation circuit 240 to the pulse generation circuit 255, it can also be connected to wiring connecting the voltage generation circuit 240 and the pulse generation circuit 255, and wiring connecting the pulse generation circuit 255 and the device under test 10. In this embodiment, as an example, the measurement circuit 370 is connected between the voltage generation circuit 240 and the pulse generation circuit 255, and between the pulse generation circuit 255 and the device under test 10, via a first line L1 (also called force line L1) for supplying voltage or current to the device under test 10, and a second line L2 (also called sensing line L2) for measuring the voltage of the device under test 10.

[0093] Force line L1 can be connected between voltage generation circuit 240 and pulse generation circuit 255, as well as the measurement circuit. Force line L1 functions as an input feedback line that feeds back the voltage from the input side of pulse generation circuit 255 to measurement circuit 370. In this case, measurement circuit 370 can use the voltage fed back from force line to adjust the output voltage during functional testing. Furthermore, force line L1 can also be configured with... Figure 2 The resistor shown is the same as the 290 resistor.

[0094] The sensing line L2 can be connected between the pulse generation circuit 255 and the device under test 10, as well as the measurement circuit 370. The sensing line L2 can have... Figure 2 The voltage sensing line shown has the same function as the connection point on the wiring between the output of the pulse generation circuit 255 and the terminal of the device under test 10, and feeds back the voltage at the connection point to the measuring circuit 370. The connection point can be located near the output of the pulse generation circuit 255 within the test signal generator 330. Alternatively, the connection point can be located outside the test signal generator 330 within the test circuit 320, for example, near the terminal of the device under test 10, or outside the test circuit 320. A voltage sensing line L1 with the same voltage as the pulse generation circuit 255 can also be provided. Figure 2 The resistor 290 shown has the same function and structure as the resistor 290 shown.

[0095] In the parametric testing (voltage applied current measurement test or current applied voltage measurement test, etc.) of the device under test 10, the measurement circuit 370 adjusts the voltage or current supplied to the device under test 10 to a test voltage or test current, and performs parametric testing using the test voltage or test current. Adjusting the voltage or current supplied to the device under test 10 to a test voltage or test current can mean adjusting the voltage or current supplied towards the device under test 10 to apply a test voltage or test current to the device under test 10.

[0096] In this embodiment, the measurement circuit 370 shares the voltage generation circuit 240 with the pulse generation circuit 255, and the test voltage or test current can be adjusted using the voltage supplied from the voltage generation circuit 240. In this embodiment, as an example, the measurement circuit 370 is configured to include the voltage generation circuit 240, and the output voltage generated from the voltage generation circuit 240 is adjusted to supply the test voltage or test current to the device under test 10.

[0097] The measurement circuit 370 can receive power from the power supply unit 205 and be controlled by the test control circuit 310. The measurement circuit 370 may vary depending on the type of parametric test it supports, but as an example, it may also include at least one of the following: a current generator that generates current supplied to the device under test 10; a voltage meter that measures the voltage output by the device under test 10; a current meter that measures the current output by the device under test 10; and a frequency meter that measures the frequency of the signal output by the device under test 10.

[0098] The measurement circuit 370 of this embodiment can also perform at least one of voltage applied current measurement test or current applied voltage measurement test as a parametric test. In the voltage applied current measurement test, the measurement circuit 370 generates an output voltage and uses the output voltage to perform a voltage applied current measurement test on the device under test 10. The output voltage of the measurement circuit 370 is supplied to the terminals of the device under test 10 as a test voltage via the pulse generation circuit 255. In the current applied voltage measurement test, the measurement circuit 370 generates an output current and uses the output current to perform a current applied voltage measurement test on the device under test 10. The output current of the measurement circuit 370 is supplied to the terminals of the device under test 10 as a test current via the pulse generation circuit 255. Here, the output current of the measurement circuit 370 can be a positive current, i.e., a current flowing from the measurement circuit 370 toward the terminals of the device under test 10 (source current), or it can be a negative current, i.e., a current flowing from the terminals of the device under test 10 toward the measurement circuit 370 (sink current).

[0099] During functional testing, the voltage generation circuit 240 of the measuring circuit 370 generates the power supply voltage required by the pulse generation circuit 255 as its output voltage. The voltage generation circuit 240 can supply the pulse generation circuit 255 with a power supply voltage corresponding to the high-level voltage in the pulse signal supplied to the terminals of the device under test 10 as its output voltage.

[0100] Here, the voltage generating circuit 240 of the measurement circuit 370 can be connected in series with the pulse generating circuit 255, and a first relay 360 can be provided between the voltage generating circuit 240 and the pulse generating circuit 255. The first relay 360 can be located closer to the voltage generating circuit 240 than the connection point of the wiring and force line L1 between the voltage generating circuit 240 and the pulse generating circuit 255. The first relay 360 can be a mechanical relay or a semiconductor relay using a semiconductor switch or the like. When performing functional tests on the device under test 10, the first relay 360 is turned on by the test control circuit 310 or the like, connecting the voltage generating circuit 240 and the pulse generating circuit 255. Furthermore, when the measurement circuit 370 performs parametric tests on the device under test 10 (such as voltage applied current measurement tests or current applied voltage measurement tests), the first relay 360 is turned off by the test control circuit 310 or the like, disconnecting the voltage generating circuit 240 and the pulse generating circuit 255.

[0101] Additionally, a second relay 380 can be provided between the pulse generation circuit 255 and the voltage generation circuit 240, and between the second relay 380 and the measurement circuit 370. The second relay 380 can be located at a connection point on the wiring between the pulse generation circuit 255 and the voltage generation circuit 240 that is closer to the pulse generation circuit 255 than the first relay 360, and at the force line L1 between the second relay 380 and the measurement circuit 370. The second relay 380 can be a mechanical relay or a semiconductor relay using a semiconductor switch, etc. During functional testing of the device under test 10, the second relay 380 is disconnected via the test control circuit 310, etc., cutting off the connection between the measurement circuit 370 and the pulse generation circuit 255. During parametric testing of the device under test 10, the second relay 380 is connected via the test control circuit 310, etc., connecting the measurement circuit 370 and the pulse generation circuit 255.

[0102] The pattern generator 245, timing generator 250, and pulse generation circuit 255 have the same characteristics as... Figure 2The pattern generator 245, timing generator 250, and pulse generation circuit 255 shown have the same function and structure. In the functional testing of the device under test 10, the pulse generation circuit 255 uses the output voltage of the measurement circuit 370 to generate a pulse signal and supplies the generated pulse signal to the terminals of the device under test 10. In the voltage-applied current measurement test, the pulse generation circuit 255 allows the output voltage of the measurement circuit 370 to pass through and supplies the passed output voltage as the test voltage to the terminals of the device under test 10. In the current-applied voltage measurement test, the pulse generation circuit 255 allows the output current of the measurement circuit 370 to pass through and supplies the passed output current as the test current to the terminals of the device under test 10. Furthermore, the test circuit 320 can also use any circuit other than the pattern generator 245 and timing generator 250 to cause the pulse generation circuit 255 to generate pulse signals.

[0103] The pulse generation circuit 255 has the function of outputting a digital signal or a multi-valued signal during functional testing. Therefore, in at least one signal value (e.g., a high level in a digital signal, or the maximum value in a multi-valued signal), the output voltage supplied from the measurement circuit 370 is passed through at least one of the resistors or switching elements within the pulse generation circuit 255, and the passed output voltage is output to the terminals of the device under test 10. The control device 170, the test control circuit 310, or the pattern generator 245 and the timing generator 250 are controlled such that the pulse generation circuit 255 continuously outputs this signal value during the parametric test. This allows the input and output terminals of the pulse generation circuit 255 to be connected via at least one of the resistors or switching elements, and the output voltage or output current of the measurement circuit 370 is supplied to the device under test 10 as a test voltage or test current via the pulse generation circuit 255.

[0104] Here, the pulse generation circuit 255 of this embodiment and the terminal Py for the device under test 10 can be electrically and fixedly connected. "Electrically and fixedly connected" means that the connection is maintained in a fixed state. Therefore, a relay for disconnecting the connection, such as a relay for switching between functional testing and voltage-current measurement testing or current-voltage measurement testing, can be present between the pulse generation circuit 255 and the terminal Py without obstruction (for example, a relay for switching between functional testing and voltage-current measurement testing). Figure 2 (e.g., relay 260).

[0105] The test circuit 320, including at least the measurement circuit 370 and the pulse generation circuit 255, can be mounted on a common substrate. In this embodiment, as an example, the various parts of the test signal generator 330 can be mounted on a common substrate and can be implemented by a single ASIC.

[0106] According to the pin electronics 300 shown above, a measurement circuit 370, which adjusts the voltage or current supplied to the device under test 10 to a test voltage or test current for parametric testing, is connected between a pulse generation circuit 255 and a voltage generation circuit 240. The pulse generation circuit 255 uses the output voltage from the voltage generation circuit 240 to generate a pulse signal and supply it to the device under test 10 during functional testing. Therefore, a switch located between the voltage generation circuit 240 and the pulse generation circuit 255—in the area where high-speed pulse signals do not pass—can be used to switch between functional testing and parametric testing of the device under test 10. Therefore, unlike the case where switching is performed using a switch in the area where pulse signals pass, the relay terminals acting as capacitors to obstruct transmission of high-speed signals can be prevented, thus improving the accuracy of functional testing.

[0107] Furthermore, the terminal Py of the device under test 10 is electrically and fixedly connected to the pulse generation circuit 255. Therefore, since there is no relay between the terminal Py and the pulse generation circuit 255, it is possible to reliably prevent the relay terminal from acting as a capacitor and hindering the transmission of the pulse signal in the case of high-speed signals.

[0108] In addition, since the first relay 360 is located between the voltage generation circuit 240 and the pulse generation circuit 255, the function test can be switched by switching the first relay 360 on and off.

[0109] Furthermore, since the second relay 380 is located between the pulse generation circuit 255 and the voltage generation circuit 240, and between the second relay 370 and the measurement circuit, the parameterization test can be switched by switching the second relay 380 on and off.

[0110] Furthermore, the measurement circuit 370 is connected between the voltage generation circuit 240 and the pulse generation circuit 255, and between the pulse generation circuit 255 and the device under test 10, via a force line L1 for applying voltage or current to the device under test 10 and a sensing line L2 for measuring the voltage of the device under test 10. Therefore, parametric testing can be performed by applying voltage or current to the device under test 10 from the force line L1 and measuring it using the sensing line L2.

[0111] Furthermore, the sensing line L2 used to measure the voltage of the device under test 10 is connected between the pulse generation circuit 255 and the device under test 10, as well as the measurement circuit 370. Therefore, unlike the case where the sensing line L2 is connected between the voltage generation circuit 240 and the pulse generation circuit 255, the measured voltage can be prevented from varying due to the resistive component of the pulse generation circuit 255. Therefore, the voltage of the device under test 10 can be accurately measured.

[0112] Furthermore, since the voltage generating circuit 240 and the pulse generating circuit 255 are connected in series, the structure can be simplified and the test circuit 320 can be miniaturized compared to the case where the voltage generating circuit 240 and the pulse generating circuit 255 are connected in parallel.

[0113] Furthermore, since the voltage generation circuit 240, the pulse generation circuit 255, and the measurement circuit 370 are mounted on a common substrate, the test circuit 320 can be miniaturized compared to the case where they are mounted on separate substrates.

[0114] Furthermore, since the measurement circuit 370 uses the voltage supplied from the voltage generation circuit 240 to adjust the test voltage or test current, the test circuit 320 can be miniaturized compared to the case where a power supply unit for the measurement circuit 370 is set up separately from the voltage generation circuit 240.

[0115] Figure 4 Focus on Figure 3 The operation of the pin electronics 300 is shown to illustrate the operation flow of the functional test of the device under test 10 performed by the test apparatus 1 of this embodiment. Before this operation flow begins, the test apparatus 1 electrically connects one or more pin electronics 300 to the device under test 10 via the connection device 120.

[0116] In step S400, the voltage generation circuit 240 of the measurement circuit 370 is controlled by the test control circuit 310 to generate the power supply voltage required for pulse generation by the pulse generation circuit 255 during functional testing, which serves as the output voltage. During functional testing, the measurement circuit 370 can adjust the output voltage using the voltage fed back from the force line L1. For example, the measurement circuit 370 compares the feedback voltage fed back from the force line L1 with the target output voltage, and increases the output voltage when the feedback voltage is lower than the target output voltage, and decreases the output voltage when the feedback voltage is higher than the target output voltage. Thus, the measurement circuit 370 can adjust the output voltage to approximate the target output voltage. Furthermore, the measurement circuit 370 can also perform output voltage feedback and adjustment internally.

[0117] In S410, the pattern generator 245, controlled by the test control circuit 310, generates a test pattern for each test cycle. In S420, the timing generator 250, controlled by the test control circuit 310, generates a timing sequence of pulse signals corresponding to the test pattern of each test cycle. In S430, the pulse generation circuit 255 uses the output voltage of the voltage generation circuit 240 of the measurement circuit 370 to generate a pulse signal corresponding to the timing sequence from the timing generator 250 for each test cycle, and supplies the generated pulse signal to the terminals of the device under test 10. The pin electronics 300 can also receive the response signal output by the device under test 10 according to the test signal to determine the good or bad condition of the device under test 10.

[0118] Based on the pin electronics 300 shown above, the voltage generation circuit 240 within the measurement circuit 370 used in the parametric testing of the device under test 10 can be used to supply the power supply voltage required by the pulse generation circuit 255 during functional testing. Furthermore, the measurement circuit 370 can use the feedback voltage from the force line L1 to adjust the output voltage, reducing the error with the target output voltage.

[0119] Figure 5 Focus on Figure 3 The operation of the pin electronics 300 is described to illustrate the operation flow of the voltage applied current measurement test of the device under test 10 performed by the test apparatus 1 of this embodiment. Before this operation flow begins, the test apparatus 1 electrically connects one or more pin electronics 300 to the device under test 10 via the connection device 120.

[0120] In S500, the voltage generation circuit 240 of the measurement circuit 370 adjusts the voltage supplied to the device under test 10 into a test voltage. For example, the voltage generation circuit 240 of the measurement circuit 370 can simultaneously consider the voltage drop caused by the pulse generation circuit 255, etc., to generate an output voltage for voltage application current measurement testing. Thus, the output voltage from the voltage generation circuit 240 becomes the test voltage via the pulse generation circuit 255 and is supplied to the device under test 10.

[0121] In S520, the measurement circuit 370 uses the test voltage fed back from the sensor line L2 to adjust the output voltage. For example, the measurement circuit 370 compares the test voltage fed back from the sensor line L2 with a target test voltage, and increases the output voltage when the fed-back test voltage is lower than the target test voltage, and decreases the output voltage when the fed-back test voltage is higher than the target test voltage. Thus, in the structure where the measurement circuit 370 supplies the test voltage to the terminals of the device under test 10 via the pulse generation circuit 255, even when there is resistance between the input and output terminals of the pulse generation circuit 255, the test voltage at the output terminal of the pulse generation circuit 255 can be adjusted to be close to the target value.

[0122] In S530, the measurement circuit 370 measures the current flowing through the terminals of the device under test 10 while a test voltage is supplied to the terminals of the device under test 10. In this embodiment, the measurement circuit 370 uses a resistor connected between the input and output terminals of the pulse generation circuit 255 as a sensing resistor to measure the current flowing through the terminals of the device under test 10. In this case, the measurement circuit 370 uses the potential difference between the force line L1 and the sensing line L2 to measure the current flowing through the terminals of the device under test 10. For example, assuming the internal resistance of the pulse generation circuit 255 when the output voltage of the measurement circuit 370 passes from the input terminal to the output terminal is R, the voltage at the input terminal of the pulse generation circuit 255 measured using the force line L1 is Vi, and the voltage at the output terminal of the pulse generation circuit 255 measured using the sensing line L2 is Vo. The current flowing through the terminals of the device under test 10 is essentially the same as the current flowing through the pulse generation circuit 255, and is the value obtained by dividing the potential difference (Vi-Vo) between the force line L1 and the sensing line L2 by the internal resistance R. Therefore, a voltage-applied current measurement test is performed using the test voltage.

[0123] According to the pin electronics 300 shown above, the voltage applied current measurement test of the device under test 10 can be performed via the pulse generation circuit 255 used in the functional test of the device under test 10. The measurement circuit 370 can measure the test voltage at the output terminal of the pulse generation circuit 255 and adjust the output voltage. In addition, the measurement circuit 370 can calculate the current flowing in the terminals of the device under test 10 using the internal resistance of the pulse generation circuit 255.

[0124] Figure 6 Focusing on the operation of the pin electronics 300, the operation flow of the current applied voltage measurement test of the device under test 10 performed by the test apparatus 1 of this embodiment is shown. Before this operation flow begins, the test apparatus 1 electrically connects one or more pin electronics 300 to the device under test 10 via the connection device 120.

[0125] In S600, the measurement circuit 370 adjusts the current supplied to the device under test 10 into a test current. For example, the measurement circuit 370 can generate a test current as an output current, or it can simultaneously consider the current flowing outside the device under test 10 due to shunting to generate an output current for voltage measurement testing. Thus, the output current from the measurement circuit 370 becomes the test current and is supplied to the terminals of the device under test 10. Depending on the test requirements, the test current can be either a positive or negative current. In S610, the pulse generation circuit 255 allows the output current of the measurement circuit input from the measurement circuit 370 to pass through, and supplies the passed output current as the test current to the terminals of the device under test 10.

[0126] In S620, the measurement circuit 370 measures the voltage fed back from the sensing line L2. The measurement circuit 370 can use the measured voltage to determine or calculate the voltage at the terminals of the device under test 10. For example, if the wiring resistance from the connection point of the sensing line L2 to the terminals of the device under test 10 in the wiring from the output terminal of the pulse generation circuit 255 to the terminals of the device under test 10 is negligible, the measurement circuit 370 can measure the voltage fed back from the sensing line L2 as the voltage at the terminals of the device under test 10. If the wiring resistance from the connection point of the sensing line L2 to the terminals of the device under test 10 in the wiring from the output terminal of the pulse generation circuit 255 to the terminals of the device under test 10 is taken into account, the measurement circuit 370 can add the voltage obtained by measuring the voltage drop (in the case of positive current) or voltage rise (in the case of negative current) caused by the test current flowing through the known wiring resistance, thereby calculating the voltage at the terminals of the device under test 10. Thus, a current-applied voltage measurement test is performed using the test current.

[0127] According to the pin electronics 300 shown above, the current applied voltage measurement test of the device under test 10 can be performed via the pulse generation circuit 255 used in the functional test of the device under test 10. The measurement circuit 370 can measure the voltage at the terminals of the device under test 10 at the output end of the pulse generation circuit 255.

[0128] Furthermore, in S600 and S610, the measuring circuit 370 can be used as follows: Figure 5S530 illustrates the use of the potential difference between the force line L1 and the sensing line L2 to measure the current flowing in the terminals of the device under test 10, and using the measured current to adjust the test current. For example, the measurement circuit 370 compares the measured current with a target test current, and increases the output current when the measured current is less than the target test current, and decreases the output current when the measured current is greater than the target test current. Thus, the measurement circuit 370 can adjust the test current to be close to the target value in a configuration where the test current is supplied to the terminals of the device under test 10 via the pulse generation circuit 255.

[0129] Figure 7 This diagram illustrates the structure of a modified pin electronics device 400. Pin electronics device 400 is a modification of pin electronics device 300. Test apparatus 1 may include pin electronics device 400 instead of pin electronics device 200. Pin electronics device 400 includes a power supply unit 205, a test circuit 420, and a test control circuit 310. In this figure, the symbols corresponding to... Figure 2 , Figure 3 The structural components of the same symbol have the same Figure 2 , Figure 3 Since they have the same function and structure, the description is omitted except for the following differences.

[0130] The test circuit 420 is connected to the device under test 10 via the connection device 120 and receives power from the power supply unit 205 to test the device under test 10. This figure representatively shows the circuit portion of the test circuit 420 corresponding to one terminal of the device under test 10. The test circuit 420 can be connected to multiple terminals and has circuit portions corresponding to each terminal.

[0131] The test circuit 420 includes a test signal generator 430 and a measurement circuit 470. In this variation, the test signal generator 430 receives power from the power supply unit 205 and is controlled by the test control circuit 310 to perform functional tests on the device under test 10. Figure 2 The test signal generator shown has the same voltage generation circuit 240, pattern generator 245, timing generator 250, and pulse generation circuit 255.

[0132] The measuring circuit 470 is connected at least between the voltage generating circuit 240 and the pulse generating circuit 255. The measuring circuit 470 can be connected between the voltage generating circuit 240 and the pulse generating circuit 255, and between the pulse generating circuit 255 and the device under test 10. In this modified example, the measuring circuit 470 is connected between the voltage generating circuit 240 and the pulse generating circuit 255, and between the pulse generating circuit 255 and the device under test 10, via a force line L1 for supplying voltage or current to the device under test 10 and a sensing line L2 for measuring the voltage of the device under test 10.

[0133] Force line L1 can be connected between voltage generation circuit 240 and pulse generation circuit 255, and also to measurement circuit 470. Force line L1 functions as an input feedback line that feeds back the voltage from the input side of pulse generation circuit 255 to measurement circuit 470. In this case, measurement circuit 470 can use the voltage fed back from force line to adjust the output voltage during functional testing. Furthermore, force line L1 can also be configured with... Figure 2 The resistor shown is the same as the 290 resistor.

[0134] The sensing line L2 can be connected between the pulse generation circuit 255 and the device under test 10, as well as the measurement circuit 470. The sensing line L2 can have... Figure 2 The voltage sensing line shown has the same function as the connection point on the wiring between the output of the pulse generation circuit 255 and the terminal of the device under test 10, and feeds back the voltage at the connection point to the measuring circuit 470. The connection point can be located near the output of the pulse generation circuit 255 within the test signal generator 330. Alternatively, the connection point can be located outside the test signal generator 330 within the test circuit 320, for example, near the terminal of the device under test 10, or outside the test circuit 320. A voltage sensing line L1 with the same voltage as the pulse generation circuit 255 can also be provided. Figure 2 The resistor 290 shown has the same function and structure as the resistor 290 shown.

[0135] In the parametric testing (voltage applied current measurement test or current applied voltage measurement test, etc.) of the device under test 10, the measurement circuit 470 adjusts the voltage or current supplied to the device under test 10 to a test voltage or test current, and performs parametric testing using the test voltage or test current.

[0136] The measurement circuit 470 of this variant may have a voltage supply section and a current supply section (not shown) for generating voltage and current supplied to the device under test 10, adjusting the output voltage and output current generated from these voltage supply sections and current supply sections, and supplying test voltage or test current to the device under test 10.

[0137] The measurement circuit 470 can receive power from the power supply unit 205 and be controlled by the test control circuit 310. The measurement circuit 470 may vary depending on the type of parametric test it supports, but as an example, it may also include at least one of the following: a voltage meter for measuring the voltage output by the device under test 10, a current meter for measuring the current output by the device under test 10, and a frequency meter for measuring the frequency of the signal output by the device under test 10.

[0138] The measurement circuit 470 of this variant can also perform at least one of a voltage-applied current measurement test or a current-applied voltage measurement test as a parametric test. In the voltage-applied current measurement test, the measurement circuit 470 generates an output voltage and uses the output voltage to perform a voltage-applied current measurement test on the device under test 10. The output voltage of the measurement circuit 470 is supplied to the terminals of the device under test 10 as a test voltage via the pulse generation circuit 255. In the current-applied voltage measurement test, the measurement circuit 470 generates an output current and uses the output current to perform a current-applied voltage measurement test on the device under test 10. The output current of the measurement circuit 470 is supplied to the terminals of the device under test 10 as a test current via the pulse generation circuit 255. Here, the output current of the measurement circuit 470 can be a positive current, i.e., a current flowing from the measurement circuit 470 toward the terminals of the device under test 10 (ejection current, pull current), or it can be a negative current, i.e., a current flowing from the terminals of the device under test 10 toward the measurement circuit 470 (sink current, drain current).

[0139] In this modified example, the voltage generating circuit 240 can be connected in series with the pulse generating circuit 255, and a first relay 360 can be provided between the voltage generating circuit 240 and the pulse generating circuit 255. The first relay 360 can be located closer to the voltage generating circuit 240 than the connection point of the wiring and force line L1 between the voltage generating circuit 240 and the pulse generating circuit 255. The first relay 360 can be a mechanical relay or a semiconductor relay using a semiconductor switch or the like. When performing functional tests on the device under test 10, the first relay 360 is turned on by the test control circuit 310 or the like, connecting the voltage generating circuit 240 and the pulse generating circuit 255. Furthermore, when the measurement circuit 470 performs parametric tests on the device under test 10 (such as voltage applied current measurement tests or current applied voltage measurement tests), the first relay 360 is turned off by the test control circuit 310 or the like, disconnecting the voltage generating circuit 240 and the pulse generating circuit 255.

[0140] Additionally, a second relay 380 can be provided between the pulse generation circuit 255 and the voltage generation circuit 240, and between the second relay 380 and the measurement circuit 470. The second relay 380 can be located at a connection point on the wiring between the pulse generation circuit 255 and the voltage generation circuit 240 that is closer to the pulse generation circuit 255 than the first relay 360, and at the force line L1 between the second relay 380 and the measurement circuit 470. The second relay 380 can be a mechanical relay or a semiconductor relay using a semiconductor switch, etc. During functional testing of the device under test 10, the second relay 380 is disconnected via the test control circuit 310, etc., disconnecting the measurement circuit 470 from the pulse generation circuit 255. During parametric testing of the device under test 10, the second relay 380 is connected via the test control circuit 310, etc., connecting the measurement circuit 470 to the pulse generation circuit 255.

[0141] The pulse generation circuit 255 and the terminal Py for the device under test 10 can be electrically and fixedly connected. Therefore, a relay for disconnecting the connection, such as a relay for switching between a functional test and a voltage-applied current measurement test or a current-applied voltage measurement test, can be present between the pulse generation circuit 255 and the terminal Py without any obstruction (for example, a relay for switching between functional tests and voltage-applied current measurement tests). Figure 2 (e.g., relay 260).

[0142] At least the measurement circuit 470 and pulse generation circuit 255 of the above-mentioned test circuit 420 can be mounted on a common substrate. In this modified example, as an example, the various parts of the test signal generator 330 and the measurement circuit 470 can be mounted on a common substrate and can be implemented by a single ASIC.

[0143] Furthermore, the test apparatus 1 of the above-described modified example is similar to the test apparatus 1 of the embodiment in that it can perform functional tests and parameterization tests.

[0144] The present invention has been described above using embodiments, but the technical scope of the present invention is not limited to the scope described in the embodiments. Those skilled in the art will understand that various modifications or improvements can be made to the embodiments. It is clear from the claims that such modified or improved forms can also be included within the technical scope of the present invention.

[0145] It should be noted that the execution order of actions, processes, steps, and stages in the apparatus, systems, programs, and methods shown in the claims, specification, and drawings can be implemented in any order unless specifically indicated by "before," "before," etc., or the output of the preprocessing is used in the post-processing. Even if the flow of actions in the claims, specification, and drawings is described using terms such as "firstly," "nextly," etc., for convenience, it does not mean that they must be implemented in this order.

Claims

1. A test circuit, comprising: The voltage supply unit generates the output voltage; The pulse generation unit uses the output voltage from the voltage supply unit to generate a pulse signal and supply it to the device under test during the functional test of the device under test. as well as The measurement circuit adjusts the voltage or current supplied to the device under test (DUT) to a test voltage or test current in a voltage-current measurement test or a current-voltage measurement test, and uses the test voltage or test current to perform the voltage-current measurement test or the current-voltage measurement test. The measuring circuit is connected at least between the voltage supply unit and the pulse generation unit.

2. The test circuit according to claim 1 further includes connection terminals for the device under test. The pulse generating unit is electrically connected to and fixedly connected to the connection terminal.

3. The test circuit according to claim 1 further includes a first relay disposed between the voltage supply unit and the pulse generation unit.

4. The test circuit according to claim 1 further includes a second relay disposed between the pulse generation unit and the voltage supply unit, and between the measurement circuit.

5. The test circuit according to claim 1, wherein, The measurement circuit is connected between the voltage supply unit and the pulse generation unit, and between the pulse generation unit and the device under test, via a first line for supplying voltage or current to the device under test and a second line for measuring the voltage of the device under test.

6. The test circuit according to claim 5, wherein, The second line is connected between the pulse generating unit and the device under test, and between the measuring circuit.

7. The test circuit according to claim 1, wherein, The voltage supply unit and the pulse generation unit are connected in series.

8. The test circuit according to claim 1, wherein, The voltage supply unit, the pulse generation unit, and the measurement circuit are mounted on a common substrate.

9. The test circuit according to claim 1, wherein, The measuring circuit uses the voltage supplied from the voltage supply unit to adjust the test voltage or the test current.

10. A testing apparatus comprising a testing circuit as described in any one of claims 1 to 9.

11. A testing method, comprising: In the functional testing of the device under test, the pulse generation circuit uses the output voltage from the voltage supply unit to generate pulse signals and supply them to the device under test. as well as At least the measurement circuit connected between the voltage supply section and the pulse generation circuit adjusts the voltage or current supplied to the device under test to a test voltage or test current in the voltage applied current measurement test or the current applied voltage measurement test of the device under test, and uses the test voltage or the test current to perform the voltage applied current measurement test or the current applied voltage measurement test.

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